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Introduction To Microprocessors Dual-Inline Pack

The document discusses different types of processor packaging technologies: - Land Grid Array (LGA) sockets have contact pins on the motherboard rather than the CPU, allowing for smaller pins and preventing damage to the CPU. Intel uses LGA for many of its processors. - Ball Grid Array (BGA) packages have solder balls on the bottom of the CPU that connect it to the motherboard, allowing for twice as many connections as PGA in the same space. BGA packages are robust and mainly used for embedded CPUs. - Pin Grid Array (PGA) packages come in several types, including Ceramic, Plastic, Staggered, and Flip-Chip PGA, each used in

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70 views12 pages

Introduction To Microprocessors Dual-Inline Pack

The document discusses different types of processor packaging technologies: - Land Grid Array (LGA) sockets have contact pins on the motherboard rather than the CPU, allowing for smaller pins and preventing damage to the CPU. Intel uses LGA for many of its processors. - Ball Grid Array (BGA) packages have solder balls on the bottom of the CPU that connect it to the motherboard, allowing for twice as many connections as PGA in the same space. BGA packages are robust and mainly used for embedded CPUs. - Pin Grid Array (PGA) packages come in several types, including Ceramic, Plastic, Staggered, and Flip-Chip PGA, each used in

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Introduction to Microprocessors

Dual-Inline Pack
Pin Grid Array (PGA)
Land Grid Array (LGA)
Land Grid Array (LGA)
The Land Grid Array (LGA) is the exact opposite of PGA. The
contact pins are on the base of the mainboard. The CPU has the
same number of contact points with which a connection is established.
Intel has been using LGA for the majority of its Celeron, Pentium,
Core and Xeon CPUs for many years.

The advantages of LGA are, on the one hand, the smaller size of the
pins, which enables a larger number of pins in the same area.
Secondly, they are not easily damaged because the socket has no
pins that can be crushed. Compared to LGA, PGA sockets have the
advantage that the mainboard cannot actually be damaged. In
addition, pins are easier to repair on a PGA processor than on a LGA
mainboard.
Ball Grid Array
Ball Grid Array (BGA)
The abbreviation BGA stands for "Ball Grid Array". In this package,
small solder balls form the connections, which are arranged in a
square grid made up of columns and rows on the bottom surface of
the chip. This design enables considerably more connections to be
accommodated, roughly twice as many as with PGA. The solder balls
provide short connections and therefore an enormous performance.

The advantages of BGA lie in the small space requirement, the good
heat dissipation and the low impedance due to short connection paths
to the circuit board. In addition, the chips can be unsoldered from the
circuit board without damaging them. This enables the removal of old
solder balls (deballing) and populating with new balls (reballing). The
chip can then be soldered to a new circuit board. Since soldered
processors are mechanically and thermally extremely robust, BGA is
mainly used for embedded CPUs.

There are different types of PGA:

• With the Ceramic Pin Grid Array (CPGA), the semiconductor


chip is fixed on a heat-conducting ceramic carrier. It is used in
the first-generation Intel Pentium, socket A variants of the AMD
Athlon and the Duron family.
• With the Plastic Pin Grid Array (PPGA), the carrier for the
semiconductor chip is made of plastic. This variant is a little
cheaper, has better thermal properties and also an improved
electrical performance than ceramics. PPGA is mainly used for
the Pentium MMX processors and Celeron.
• The Staggered Pin Grid Array (SPGA) is characterized by
staggered connection rows. This variant is required for CPUs that
have more than 200 connections, because the offset layout offers
more space. It is used on the Pentium and later central
processing units.
• With the Flip-Chip Pin Grid Array (FCPGA), the integrated
circuit is attached to the top of the carrier ("flip-chip" means
"inverted, turned chip"). This design is used for example in
Pentium III and some Celeron processors.

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