E1219-16 Práctica Estándar para Pruebas de Penetrantes Líquidos Fluorescentes Utilizando El Proceso Solvente Extraíble
E1219-16 Práctica Estándar para Pruebas de Penetrantes Líquidos Fluorescentes Utilizando El Proceso Solvente Extraíble
E1219-16 Práctica Estándar para Pruebas de Penetrantes Líquidos Fluorescentes Utilizando El Proceso Solvente Extraíble
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2.3 ISO Standard:5 intended primarily for portability and for localized areas of
ISO 9712 Nondestructive Testing—Qualification and Certi- examination, utilizing minimal equipment, when a higher level
fication of NDT Personnel—General Principles of sensitivity than can be achieved using visible process is
2.4 AIA Standard: required. Surface roughness may be a limiting factor. If so, an
NAS 410 Certification and Qualification of Nondestructive alternative process such as post-emulsified penetrant should be
Test Personnel6 considered, when grinding or machining is not practical.
2.5 Department of Defense (DoD) Contracts—Unless oth-
erwise specified, the issue of the documents that are DoD 6. Reagents and Materials
adopted are those listed in the issue of the DoDISS (Depart- 6.1 Fluorescent Solvent-Removable Liquid Penetrant Test-
ment of Defense Index of Specifications and Standards) cited ing Materials, (see Note 3) consist of a family of applicable
in the solicitation. fluorescent penetrants, solvent removers, as recommended by
the manufacturer, and are classified as Type I Fluorescent,
2.6 Order of Precedence—In the event of conflict between Method C—Solvent-Removable. Intermixing of materials
the text of this practice and the references cited herein, the text from various manufacturers is not recommended. (Warning—
of this practice takes precedence. While approved penetrant materials will not adversely affect
common metallic materials, some plastics or rubbers may be
swollen or stained by certain penetrants.)
3. Terminology
3.1 Definitions—definitions relating to liquid penetrant NOTE 3—Refer to 8.1 for special requirements for sulfur, halogen, and
alkali metal content.
examination, which appear in Terminology E1316, shall apply
to the terms used in this practice. 6.2 Fluorescent Solvent-Removable Penetrants, are de-
signed so that excess surface penetrant can be removed by
NOTE 1—Throughout this practice, the term “blacklight” has been
changed to “UV-A” to conform with the latest terminology in E1316. wiping with clean, lint-free material, and repeating the opera-
“Blacklight” can mean a broad range of ultraviolet radiation; fluorescent tion until most traces of penetrant have been removed. The
penetrant inspection only uses the “UV-A” range. remaining traces shall be removed by wiping the surface with
clean, lint-free material lightly moistened with the solvent
4. Summary of Practice remover. To minimize removal of penetrant from
4.1 A liquid, fluorescent penetrant is applied evenly over the discontinuities, care shall be taken to avoid the use of excess
surface being tested and allowed to enter open discontinuities. solvent. Flushing the surface with solvent to remove the excess
After a suitable dwell time, the excess surface penetrant is penetrant is prohibited.
removed and the surface is dried prior to the application of a
6.3 Solvent Removers function by dissolving the penetrant,
dry, nonaqueous, wet, or liquid film developer. If an aqueous
making it possible to wipe the surface clean and free of residual
developer is to be employed, the developer is applied prior to
fluorescent penetrant as described in 7.1.5.
the drying step. The developer draws the entrapped penetrant
out of the discontinuity, staining the developer. The surface is 6.4 Developers—Development of penetrant indications is
then examined visually under black light to determine presence the process of bringing the penetrant out of discontinuities
or absence of indications. (Warning—Fluorescent penetrant through blotting action of the applied developer, thus increas-
examination shall not follow a visible penetrant examination ing the visibility of the penetrant indications. Nonaqueous, wet
unless the procedure has been qualified in accordance with 9.2, developers, and aqueous developers are most commonly used
because visible dyes may cause deterioration or quenching of in solvent-removable processes. Liquid film developers also
fluorescent dyes.) are used for special applications.
NOTE 2—The developer may be omitted by agreement between 6.4.1 Aqueous Developers are normally supplied as dry
purchaser and supplier. powder particles to be either suspended or dissolved (soluble)
4.2 Processing parameters, such as precleaning, penetration in water. The concentration, use, and maintenance shall be in
time, etc., are determined by the specific materials used, the accordance with manufacturer’s recommendations (see
nature of the part under examination (that is, size, shape, 7.1.7.2).
surface condition, alloy), type of discontinuities expected, etc. 6.4.2 Nonaqueous, Wet Developers are supplied as suspen-
sions of developer particles in a nonaqueous solvent carrier and
5. Significance and Use are ready for use as supplied. They are applied to the surface by
5.1 Liquid penetrant examination methods indicate the spraying after the excess penetrant has been removed and the
presence, location, and, to a limited extent, the nature and surface has dried. Nonaqueous, wet developers form a trans-
magnitude of the detected discontinuities. This practice is lucent or white coating on the surface when dried, and serve as
a contrasting background for fluorescent penetrants (see
7.1.7.3). (Warning—This type of developer is intended for
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Available from International Organization for Standardization (ISO), ISO application by spray only.)
Central Secretariat, BIBC II, Chemin de Blandonnet 8, CP 401, 1214 Vernier,
6.4.3 Liquid Film Developers are solutions or colloidal
Geneva, Switzerland, http://www.iso.org.
6
Available from the Aerospace Industries Association of America, Inc., 1000 suspensions of resins/polymer in a suitable carrier. These
Wilson Blvd, Suite 1700, Arlington, VA 22209-3928. developers will form a transparent or translucent coating on the
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surface of the part. Certain types of film developer may be scale, insulating materials, coatings, and so forth, should be
stripped from the part and retained for record purposes (see done using cleaning solvents, vapor degreasing or chemical
7.1.7.4). removing processes. Surface conditioning by grinding,
6.4.4 Dry Developer—Dry developer shall be applied in machining, polishing or etching shall follow shot, sand, grit
such a manner as to allow contact of all surfaces to be and vapor blasting to remove the peened skin and when
inspected. Excess dry developer may be removed after the penetrant entrapment in surface irregularities might mask the
development time by light tapping or light air blow off not indications of unacceptable discontinuities or otherwise inter-
exceeding 5 psig. Minimum and maximum developer dwell fere with the effectiveness of the examination. For metals,
times shall be 10 min to 4 h respectively. unless otherwise specified, etching shall be performed when
evidence exists that previous cleaning, surface treatments or
7. Procedure service usage have produced a surface condition that degrades
7.1 The following general procedure (see Fig. 1) applies to the effectiveness of the examination. (See Annex on Cleaning
the solvent-removable fluorescent penetrant examination Parts and Materials in Practice E165/E165M for general
method. precautions relative to surface preparation.)
7.1.1 Temperature Limits—The temperature of the penetrant
NOTE 4—When agreed between purchaser and supplier, grit blasting
materials and the surface of the part to be processed should be without subsequent etching may be an acceptable cleaning method.
from 40 and 125°F (4 and 52°C). Where it is not practical to (Warning—Sand or shot blasting may possibly close indications and
comply with these temperature limitations, the procedure must extreme care should be used with grinding and machining operations.)
be qualified at the temperature of intended use as described in NOTE 5—For structural or electronic ceramics, surface preparation by
9.2. grinding, sand blasting and etching for penetrant examination is not
recommended because of the potential for damage.
7.1.2 Surface Conditioning Prior to Penetrant Inspection—
Satisfactory results can usually be obtained on surfaces in the 7.1.3 Removal of Surface Contamination:
as-welded, as-rolled, as-cast, or as-forged conditions or for 7.1.3.1 Precleaning—The success of any penetrant exami-
ceramics in the densified condition. When only loose surface nation procedure is greatly dependent upon the surface and
residuals are present, these may be removed by wiping the discontinuity being free of any contaminant (solid or liquid)
surface with clean lint-free cloths. However, precleaning of that might interfere with the penetrant process. All parts or
metals to remove processing residuals such as oil, graphite, areas of parts to be inspected must be clean and dry before the
Incoming Parts
PENETRANT Apply
APPLICATION Solvent-
(See 7.1.4) Removable
Fluorescent
Penetrant
REMOVE EXCESS
PENETRANT Solvent
(See 7.1.5) Wipe-Off
DRY
(See 7.1.6) Dry
DEVELOP Nonaqueous
Aqueous
(See 7.1.7) Wet, Liquid Film
Developer
Developer
DRY
(see 7.1.6) Dry
EXAMINE
(See 7.1.8) Examine
Mechanical
Water Rinse Detergent Wash
POST CLEAN
(See 7.1.10 and Prac-
tice E165/E165M, An-
nex on
Post Cleaning Dry
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penetrant is applied. If only a section of a part, such as a weld prevent pools of penetrant on the part), while allowing for
including the heat-affected zone, is to be examined, remove all proper penetrant dwell time (see Table 1). The length of time
contaminants from the area being examined as defined by the the penetrant must remain on the part to allow proper penetra-
contracting parties. “Clean” is intended to mean that the tion should be as recommended by the penetrant manufacturer.
surface must be free of any rust, scale, welding flux, spatter, Table 1, however, provides a guide for selection of penetrant
grease, paint, oily films, dirt, etc., that might interfere with dwell times for a variety of materials, forms, and types of
penetration. All of these contaminants can prevent the pen- discontinuity. Unless otherwise specified, however, the dwell
etrant from entering discontinuities. (Warning—Residues time shall not exceed the maximum recommended by the
from cleaning processes, such as strong alkalies, pickling manufacturer.
solutions and chromates in particular, may adversely react with
the penetrant and reduce its sensitivity and performance.) NOTE 6—For some specific applications in structural ceramics (for
example, detecting parting lines in slip-cast material), the required
7.1.3.2 Drying After Cleaning—It is essential that the sur-
penetrant dwell time should be determined experimentally and may be
faces be thoroughly dry after cleaning, since any liquid residue longer than that shown in Table 1 and its notes.
will hinder the entrance of the penetrant. Drying may be
accomplished by warming the parts in drying ovens, with 7.1.5 Removal of Excess Penetrant—After the required
infrared lamps, forced hot or cold air, or exposure to ambient penetration time, remove the excess penetrant insofar as
temperature. possible, by using wipers of a dry, clean, lint-free material,
7.1.4 Penetrant Application—After the part has been repeating the operation until most traces of penetrant have been
cleaned, dried, and is within the specified temperature range, removed. Then lightly moisten a lint-free material with solvent
apply the penetrant to the surface to be inspected so that the remover and wipe the remaining traces gently to avoid the
entire part or area under examination is completely covered removal of penetrant from discontinuities, taking care to avoid
with penetrant. the use of excess solvent. After the solvent wipe, perform a dry
7.1.4.1 Modes of Application—There are various modes of wipe to remove solvent residues. If over-removal is suspected,
effective application of penetrant such as dipping, brushing, dry (see 7.1.6) and reclean the part, and reapply the penetrant
flooding, or spraying. Small parts are quite often placed in for the prescribed dwell time. Flushing the surface with solvent
suitable baskets and dipped into a tank of penetrant. On larger following the application of the penetrant and prior to devel-
parts, and those with complex geometries, penetrant can be oping is prohibited.
applied effectively by brushing or spraying. Both conventional 7.1.6 Drying—Following the removal of excess surface
and electrostatic spray guns are effective means of applying penetrant by solvent wipe-off techniques, the part surface shall
liquid penetrants to the part surfaces. Electrostatic spray be dry and free of solvent residues before application of
application can eliminate excess liquid buildup of penetrant on developer.
the part, minimize overspray, and minimize the amount of
penetrant entering hollow-cored passages that might serve as NOTE 7—Local heating or cooling is permitted provided the tempera-
ture of the part remains in the range from 40 to 125°F (4 to 52°C), unless
penetrant reservoirs and can cause severe bleedout problems otherwise agreed to by the contracting parties.
during examination. Aerosol sprays are also very effective and
a convenient portable means of application. (Warning—Not 7.1.7 Developer Application:
all penetrant materials are suitable for electrostatic spray 7.1.7.1 Dry Developer—Immediately after the excess pen-
applications.) (Warning—With spray applications, it is impor- etrant has been removed from the part, and the surface has
tant that there be proper ventilation. This is generally accom- dried, the developer is applied in accordance with the manu-
plished through the use of a properly designed spray booth and facturer’s instructions to assure complete coverage with a thin,
exhaust system.) even film of developer. The application of excessive developer
7.1.4.2 Penetrant Dwell Time—After application, allow ex- should be avoided, since it is possible for a thick coating of
cess penetrant to drain from the part (care should be taken to developer to mask indications.
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7.1.7.2 Aqueous Developers—Apply by spraying, flowing, unacceptable amounts of visible light, which may cause
or immersing the area being examined prior to drying. Drain fluorescent indications to disappear. Care should be taken to
excess developer from the area to eliminate pooling of devel- use only bulbs certified by the supplier to be suitable for such
oper that can mask indications. Dry the developer using hot air examination purposes.)
blast, hot air recirculating oven, infrared heater, or by exposure NOTE 8—The recommended minimum in 7.1.8.1 is intended for general
to ambient temperature. The dried developer appears as a usage. For critical examinations, higher UV-A irradiance may be required.
translucent or white coating on the part. Prepare and maintain
7.1.8.2 LED UV-A Sources—LED UV-A sources shall meet
aqueous developer in accordance with the manufacturer’s
the requirements of E3022.
instructions and apply in such a manner as to assure complete,
(1) UV-A Source Warm-Up—For all UV-A sources except
even coverage. (Warning—Atomized spraying of aqueous
LED UV-A sources, allow source to warm up for a minimum
developers is not recommended, since a spotty film may
of 10 min prior to its use or the measurement of UV-A
result.)
irradiation.
7.1.7.3 Nonaqueous, Wet Developers—Apply to the area (2) LED UV-A sources are at full intensity at power-on and
being examined by spraying after the excess penetrant has been may decrease as the lamp warms up. If UV-A measurement is
removed and the part has been dried. Spray areas so as to made at power-on, then a minimum of 1500 µW/cm2 is
assure complete coverage with a thin, even film of developer. recommended.
This type of developer carrier fluid evaporates very rapidly at 7.1.8.3 Visible Ambient Light—Visible ambient light shall
normal room temperature and does not require the use of a not exceed 2 fc (21.5 lux). The measurement should be made
dryer. It should be used, however, with proper ventilation. with a visible light meter on the surface being examined.
(Warning—Proper ventilation should be provided in all cases, 7.1.8.4 Visual Adaption—The examiner should be in the
but especially when the surface to be examined is inside a darkened area for at least 1 min before examining parts. Longer
closed volume, such as a process drum or a small storage tank.) times may be necessary for more complete adaptation under
(Warning—Dipping or flooding parts being examined with some circumstances. (Warning—Photochromic or darkened
nonaqueous developers is prohibited, since it can flush (dis- lenses shall not be worn during examination.)
solve) the penetrant from within the discontinuities through its 7.1.8.5 Housekeeping—Keep the examination area free of
solvent action.) interfering debris or fluorescent objects. Practice good house-
7.1.7.4 Liquid Film Developers—Apply by spraying as keeping at all times.
recommended by the manufacturer. Spray parts in such a 7.1.9 Evaluation—Unless otherwise agreed upon, it is nor-
manner as to ensure complete part coverage with a thin, even mal practice to interpret and evaluate the discontinuity indica-
film of developer. tion based on the size of the penetrant indication created by the
7.1.7.5 No Developer—For certain applications, it is developer’s absorption of the penetrant (see Reference Photo-
permissible, and may be appropriate, to conduct this examina- graphs E433).
tion without the use of a developer. 7.1.10 Post Cleaning—Post cleaning is necessary in those
7.1.7.6 Developing Time—The minimum and maximum cases where residual penetrant or developer could interfere
penetrant bleedout time with no developer shall be 10 min and with subsequent processing or with service requirements. It is
2 h respectively. Developing time for dry developer begins particularly important where residual penetrant examination
immediately after the application of the dry developer and materials might combine with other factors in service to
begins when the developer coating has dried for wet developers produce corrosion. A suitable technique, such as a simple water
(aqueous and nonaqueous). The minimum developer dwell rinse, water spray, machine wash, vapor degreasing, solvent
time shall be 10 min for all types of developer. The maximum soak, or ultrasonic cleaning may be employed (see Practice
developer dwell time shall be 1 h for nonaqueous developer, 2 E165/E165M, Annex on Post Cleaning). It is recommended
h for aqueous developer and 4 h for dry developers. that if developer removal is necessary, it shall be carried out as
7.1.8 Examination—Perform examination of parts after the promptly as possible after examination so that it does not fix on
applicable development time as specified in 7.1.7.6 to allow for the part. Water spray rinsing is generally adequate.
bleedout of penetrant from discontinuities onto the developer (Warning—Developers should be removed prior to vapor
coating. It is good practice to observe the surface while degreasing. Vapor degreasing can bake developer on parts.)
applying the developer as an aid in evaluating indications.
7.1.8.1 UV-A Irradiation—Examine fluorescent penetrant 8. Special Requirements
indications under UV-A radiation in a darkened area. UV-A 8.1 Impurities:
irradiance shall be measured with a UV-A radiometer on the 8.1.1 When using penetrant materials on austenitic stainless
surface to be examined. A minimum of 1000 µW/cm2 is steels, titanium, nickel-base, or other high-temperature alloys,
recommended. The UV-A source shall have a peak wavelength the need to restrict impurities such as sulfur, halogens, and
in the range of 360 to 370 nm. The UV-A irradiance shall be alkali metals must be considered. These impurities may cause
checked daily to assure the required output. Since a drop in line embrittlement or corrosion, particularly at elevated tempera-
voltage can cause decreased UV-A irradiation with consequent tures. Any such evaluation should also include consideration of
inconsistent performance, a constant voltage transformer shall the form in which the impurities are present. Some penetrant
be used when there is evidence of voltage fluctuation. materials contain significant amounts of these impurities in the
(Warning—Certain high-intensity UV-A sources may emit form of volatile organic solvents. These normally evaporate
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quickly and usually do not cause problems. Other materials reduced temperature during examination, special materials and
may contain impurities that are not volatile and may react with processing techniques may be required. Such examination
the part, particularly in the presence of moisture or elevated requires qualification in accordance with 9.2. Manufacturer’s
temperatures. recommendations should be observed.
8.1.2 Because volatile solvents leave the tested surface 9. Qualification and Requalification
quickly without reaction under normal inspection procedures,
penetrant materials are normally subjected to an evaporation 9.1 Personnel Qualification—Personnel performing exami-
procedure to remove the solvents before the materials are nations to this standard shall be qualified in accordance with a
analyzed for impurities. The residue from this procedure is nationally or internationally recognized NDT personnel quali-
then analyzed in accordance with Test Method D129, Test fication practice or standard such as ANSI/ASNT-CP-189,
Method D1552, or Test Method D129 decomposition followed SNT-TC-1A, NAS-410, ISO 9712, or a similar document and
by Test Methods D516, Method B (Turbidimetric Method) for certified by the employer or certifying agency, as applicable.
sulfur. The residue may also be analyzed in accordance with The practice or standard used and its applicable revision shall
Test Method D808, Annex on Methods for Measuring Total be identified in the contractual agreement between the using
Chlorine Content in Combustible Liquid Penetrant (for halo- parties.
gens other than fluorine) and Practice E165/E165M, Annex on 9.2 Procedure Qualification—Qualification of procedure us-
Method for Measuring Total Fluorine Content in Combustible ing conditions or times differing from those specified or for
Liquid Penetrant Materials (for fluorine). The Annex on new materials may be performed by any of several methods
Determination of Anions and Cations by Ion Chromatography and should be agreed upon by the contracting parties. A test
in Practice E165/E165M can be used as an alternate procedure. piece containing one or more discontinuities of the smallest
Alkali metals in the residue are determined by flame photom- relevant size is used. The test piece may contain real or
etry or atomic absorption spectrophotometry. simulated discontinuities, providing it displays the character-
NOTE 9—Some current standards indicate that impurity levels of sulfur
istics of the discontinuities encountered in production exami-
and halogens exceeding 1 % of any one suspect element may be nations.
considered excessive. However, this high a level may be unacceptable in 9.3 Nondestructive Testing Agency Qualification—If a non-
some cases, so the actual maximum acceptable impurity level must be
decided between the supplier and the user on a case by case basis.
destructive testing agency as described in Practice E543 is used
to perform the examination, the agency shall meet the require-
8.2 Elevated Temperature Examination—Where penetrant ments of Practice E543.
examination is performed on parts that must be maintained at
elevated temperature during examination, special materials and 9.4 Requalification—may be required when a change or
processing techniques may be required. Such examination substitution is made in the type of penetrant materials or in the
requires qualification in accordance with 9.2. Manufacturer’s procedure (see 9.2).
recommendations should be observed. 10. Keywords
8.3 Reduced Temperature Examination—Where penetrant 10.1 fluorescent liquid penetrant testing; nondestructive
examination is performed on parts that must be maintained at testing; solvent-removable process
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