NORMAL PCB FOOTPRINT CONVENTIONS

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1. Padstack conventions
- Unit used for creating padstack is in mil (mili-inch) with 3 "Decimal places”.
- Rounding all values of padstack sizes.
1.1 SMD padstacks linh kien dan

1.1.1 GENERIC CONVENTIONS

- Pad dimensions are based on the component pitch
- Pastemask is 1:1 to pad size
- Soldermask = pad size + 6 mils
- Antipad size = thermal relief size = pad size + 15 mils
- All dimensions are in mil
- Use the nominal component pin size to calculate padstack.
• The length of the padstack is equal to the nominal pin length +5 mils for heel; + 25 mils
for toe.
• The width of the padstack is equal to the nominal pin width +10 mils (i.e. 5 mils on
each side). This value can be smaller based on pin pitch to void solder bridge.

1.1.2 PADSTACK NAMING CONVENTIONS

Table 1 : SMD padstack naming conventions

Type Padstack Name Example

Rectangle wwwxhhhsm 023x040sm
Circle cxxxsm C020sm
Square sxxxsm S025sm
Oblong obwwwxhhhsm Ob025x050sm

*** Note:
i. www :width ; hhh : height
ii. We do not use flashes for SMD padstacks.
iii. For symbols having lead pitch pins such as: QFP, PLCC, ... we can reduce solder mask
sizes if the space is very close.
1.1.2.1 GENERIC SURFACE MOUNT COMPONENT PADSTACKS

Table 2 : SMD padstacks for standard ICs

Area Array SMT Pitch Pad Dimensions Padstack Name

Component Type
BGA 50.000 (1.27 mm) 22 diameter C022sm
BGA 39.370 (1.00 mm) 22 diameter C022sm
BGA 31.496 (0.80 mm) 16 diameter C016sm
BGA 25.591 (0.65 mm) 12 diameter C012sm
BGA 19.685 (0.5 mm) 10 diameter C010sm
BGA 15.748 (0.4 mm) 10 diameter C010sm
CBGA/CCGA 50.000 (1.27 mm) 28 diameter C028sm
CBGA/CCGA 39.370 (1.00 mm) 27 diameter C027sm

QFP, SOIC, SOP, 50.0 (1.27 mm) 25 x 80 025x080sm

TSOP, SSOP, TSSOP, 39.4 (1.00 mm) 22 x 75 022x075sm
QSOP, QVSOP, SOJ, 31.5 (0.80 mm) 22 x 70 022x070sm
PLCC etc. 25.6 (0.65 mm) 16 x 70 016x070sm
25.0 (0.635mm) 16 x 70 016x070sm
19.7 (0.50 mm) 12 x 70 012x070sm
15.7 (0.40 mm) 10 x 70 010x070sm

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*** Note: Using vias via_d008c019_a29ch or via_d010c019_a29ch to fan out for 1.00 mm & 0.8 mm
BGAs
1.1.2.2 SPECIAL PADSTACKS

Padstack name = Standard name_(Option1)(Size1)(Option2)(Size2)...(OptionN)(SizeN)

Where:
+ Option1, Option2, ... OptionN: we use these abbreviations for special cases below:
- Regular pad size :r
- Thermal relief :t
- Antipad :a
- Soldermask :m
- Pastemask : p ; use _np for padstacks with no pastemask
- Padstack with shape : s
+ Size1, Size2, ...SizeN: values added into the padsize corresponding to each Options
above.
Example:
030x040sm_m032x042: means the soldermask will be 2 mils larger than the pad.

Pastemask for thermal pins :

- Pastemask should be NULL ( no pastemask )

- Adding small shapes for pastemask . Air gaps between 2 shapes should be at least 12
mils.
- We offer a 12-mil air gap between pins and thermal pin . We can choose a less value in
some specific cases.
Please look at pictures below for example :
Figure 1 : Pastemask for thermal pins

Pads Pastemask

*** Note:
Because the name of padstacks in the package symbol design allows only a
maximum of 18 letters, "(Option)(Size)" for padstacks cannot follow the above
conventions if the name of a padstack has more than 18 letters.
***** Warning: Please check all special padstacks and correlative symbols before adding
them into the library to avoid coincident errors.

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2.1 Through Hole Padstacks

All dimensions are in mils. Use the nominal component pin size to calculate padstacks.

2.2.1 PLATED THROUGH HOLE PADSTACKS

Feature Guideline
Padstack name - Normal Padstack with circular hole
dyyyazzz.pad
Where a = Pad shape (Typically c = Circle, s = Square)
d = Drill
yyy = Finished hole size
zzz = Pad size
Examples:
D042C062
D042S062
- Oblong padstack:
DrrrxtttOBwwwxhhh oblong padstack with oblong hole
DyyyOBwwwxhhh oblong padstack with circular hole
- Rectangular padstack:
DrrrxtttREwwwxhhh rectangular padstack with rectangular hole
DyyyREwwwxhhh rectangular padstack with circular hole
Where d = Drill
rrr = width of finished hole size ; ttt = height of finished hole size
yyy = finished hole size (circle)
www = pad width ; hhh = pad height
ob = oblong ;
re = rectangle
Note: *Regular pad sizes for default inner layers should be circular.
*For padstacks having special drills which do not support from Pad
Designer of Cadence, we should declare for drill is 1 mil.
Nominal Hole
Size - Circular Pins:
X = Nominal lead diameter + 15 mils
- Rectangular/Square Pins:
X = [Sqrt (L2 + W2)] + 15 mils
(L= Length, W= Width of lead cross section)
- Press:
Per manufacturer specification
Drill Symbol Per Drill Table
* Note: - With drill size smaller than 50mils make the drill symbol with
Width - 50; Height - 50
- For oblong or retanglar drills : we should use two characters
according to width and height of drill (perDrill Table) . Ex : character of
padstack d100x065ob130x095 should be vM.
Pad Size X + 20 mils for Nominal Holes  (60 mils)
X + 30 mils for Nominal Holes > (60 mils)
Note: Pad sizes may be larger for specific applications like mounting holes.
Soldermask Pad size + 6 mils
Pastemask Pastemask should be NULL
Antipad + Pad size from 40 down : antipad = pad size + 15 mils.
+ Pad size from 41 to 80 : antipad = pad size + 20 mils.
+ Pad size from 81 to 150 : antipad = pad size + 30 mils.
+ Pad size from 150 up : antipad = pad size + 40 mils.
Thermal Relief - Circular flash for Thermal Relief:
Naming convention: TR_RRR_TTT_WW_N_AA

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 Where:
TR : Thermal Relief = Antipad
RRR : Regular pad size
TTT : thermal relief diameter size
WW : spoke width.
N : number of the spokes.
AA : angle of the spoke.
Example: TR_080_100_10_4_45
pad size = 80 mils; thermal relief = 100 mils; spoke width = 10 mils;
number of the spokes = 4; angle of the spoke = 45 degrees.
- Naming conventions for the special flashes:
+ Oblong : TRXXXYYYBZZ_WW_N_AA (see figure 2 for details)
+ Rectangle : TRXXXYYYRZZ_WW_N_AA (see figure 3 for details)
where B : Oblong
R : Rectangle or Square
TR : Thermal Relief
WW : spoke width.
N : number of the spokes.
AA : angle of the spoke.
* The size of the spokes should be set as the standard unless otherwise
specified:
PAD size From 25 to 99 = 10
From 100 to 199 = 15
From 200 up = 20
Note: * For “_press” padstacks, Thermal Relief _Geometry = NULL
* In padstack designer program, we should choose "null” for press
fit padstacks; choose "flash" for padstacks with flash except TOP and
BOTTOM layers, then Thermal Relief for the TOP and BOTTOM are
declared the same as the antipad.
* The flashes for Thermal Relief of the square holes is declared the
same as the rectangle holes, and then XXX = YYY

Figure 2 : Thermal flash for Oblong

YYY
ZZ ZZ
2 2

XXX

Figure 3 : Thermal flash for Rectangle

ZZ ZZ YYY
2 2

XXX

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 2.2.2 NON-PLATED THROUGH HOLE PADSTACKS
- Non-plated through hole padstacks without annular: Pad size = Drill size, select “Non-
Plated” in plating field of Pad_Designer.
- Non-plated through hole padstacks with annular ring should be created the same as plated
through hole padstacks, select “Non-Plated” in plating field of Pad_Designer.
- All dimensions are in mils. Use the nominal component pin size to calculate padstacks.

Feature Guideline
Padstack name - Normal Padstack with circular hole
dyyyazzzn.pad
Where a = Pad shape (Typically c = Circle, s = Square)
zzz = Pad size
+ zzz = yyy for padstacks without annular ring
+ zzz = yyy + 20 mils (for Nominal Holes  60mils)
or zzz = yyy + 30 mils (for Nominal Holes > 60mils) for
padstacks with annular ring
yyy = Finished hole size
d = Drill ; n = non-plated
Examples:
D042C042n Non-plated through hole padstack without annular ring
D042C062n Non-plated through hole padstack with annular ring
- Oblong padstack:
DyyyOBwwwxhhhN oblong padstack with circular non-plated hole
DrrrxtttOBwwwxhhhN oblong padstack with oblong non-plated hole
- Rectangular padstack:
DyyyREwwwxhhhN rectangular padstack with circular non-plated
hole
DrrrxtttREwwwxhhhN rectangular padstack with rectangular non-
plated hole
Where ob = oblong; re = rectangle
www = pad width ; hhh = pad height
rrr = width of finished hole size ; ttt = height of finished hole size
d = Drill ; n = non-plated
Note:
*For padstacks having special drills which do not support from
Pad Designer of Cadence, we should declare for drill is 1 mil.
Nominal Hole Per manufacturer specification
Size - Circular Pins:
X = Nominal lead diameter + 15 mils
- Rectangular/Square Pins:
X = [Sqrt (L2 + W2 )] + 15 mils
(L= Length, W= Width of lead cross section)

Drill Symbol Per Drill Table

* Note: - With drill size smaller than 50mils make the drill symbol with
Width - 50; Height - 50
- Also we want to use only CROSS figure for the drill symbol for
NON_PLATED PADSTACK.
- For oblong or retanglar drills : we should use two characters
according to width and height of drill (perDrill Table) . Ex : character of
padstack d100x065ob130x095 should be vM.
Pad Size + For padstacks without annular ring: Pad size = Drill size, add ROUTE
KEEPOUT/ALL the same size of Antipad in the package symbol.
+ For padstacks with annular ring:
Pad size = Nominal Hole Size + 20 mils (for Nominal Holes <= 60mils) or
Pad size = Nominal Hole Size + 30 mils (for Nominal Holes > 60mils).
Soldermask + For padstacks without annular ring: Drill Size + 10 mils

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 + For padstacks with annular ring: Pad Size + 6 mils
Pastemask Pastemask should be NULL
Antipad - For padstacks without annular ring:
+ Drill size from 40 down : antipad = drill size + 20 mils.
+ Drill size from 41 to 80 : antipad = drill size + 25 mils.
+ Drill size from 81 to 150 : antipad = drill size + 40 mils.
+ Drill size from 150 up : antipad = drill size + 50 mils.
- For padstacks with annular ring:
+ Pad size from 40 down : antipad = pad size + 15 mils.
+ Pad size from 41 to 80 : antipad = pad size + 20 mils.
+ Pad size from 81 to 150 : antipad = pad size + 30 mils.
+ Pad size from 150 up : antipad = pad size + 40 mils.
Thermal Relief NULL for all layers

2.2.3 SPECIAL PADSTACKS

Padstack name = Standard name_(Option1)(Size1)(Option2)(Size2)...(OptionN)(SizeN)

Where:
+ Option1, Option2, ... OptionN: we use these abbreviations for special cases below:
- Regular pad size :r
- Thermal relief :t
- Antipad :a
- Soldermask :m
- Pastemask : p p ; use _np for padstacks with no pastemask
- Padstack with shape :s
- Press fit padstack : press
+ Size1, Size2, ...SizeN: values added into the padsize corresponding to each Option above.
Example:
* d043c063_m69ap93 : means the soldermask will be 6 mils larger than the pad d043c063
and antipad will be 30 mils larger than the pad d043c063.
*** Note:
Because the name of pastacks in the package symbol design allows only a maximium of 18
letters, "(Option)(Size)" for padstacks cannot follow the above conventions if the name of a
padstack has more than 18 letters.
***** Warning: Please check all special padstacks and correlative symbols before adding them
into the library to avoid coincident errors.

2.2 Color

- Temporary and Permanent Highlight: Red

- Select: Red
- DRC: Red
- Silkscreen top: green
- Silkscreen bottom: yellow
- Other colors: please view sample symbol.
(we shall use a general script for colors)

2.3 Text conventions

- Use script for these conventions.

- Text width: 0 mil
- Need to add the Company property as follows:
Create a sub-class called: PROP under PACKAGE GEOMETRY class
- Dimension text block = 3

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- Add the text “COMPANY NAME”
- Need to add dimensions as follows:
Create a sub-class called: COMP_DIM under PACKAGE GEOMETRY class
- Dimension text block = 3
- Dimension Line -> Head Length = 0.08”
- Dimension Line -> Head Width = 0.03”
- Extension Line -> Offset Distance from Element = 0.02”
- Extension Line -> Distance Beyond Dimension Line = 0.02”
- Need to add the Symbol properties as follows:
Create a sub-class called: COMP_DIM under PACKAGE GEOMETRY class
"SYMBOL: SYMBOL_NAME" with text block = 5
"PADSTACK(S): PADSTACK_NAME1,PADSTACK_NAME2,..." with text block = 3
"COMP HEIGHT: COMP_HEIGHT_MAX MIL [COMP_HEIGHT_MAX MM]" with
text block = 3
- Need to add the Symbol Revision as follows:
Create a sub-class called: REV under PACKAGE GEOMETRY class
“CREATED BY ___ - DDMMMYY “ with text block = 3
“MODIFIED BY ___ - DDMMMYY” with text block = 3 (if Applicable)
“CHECKED BY___ - DDMMMYY” with text block = 3 (if Applicable)
“MANUFACTURE: COMPANY_NAME” with text block = 3
“P/N: PART_NUMBER” with text block = 3
“SPEC: SPEC_file_name” with text block = 3

If we need to add text (Viettel standard) to customer parts just

ADDED TEXT BY ____ DDMMMYY
So that we know the original part came from the customer.
*** Note:
+ If we don't know component height, please add "COMP HEIGHT: N/A”.
+ If we don't know company name and part number, please add texts as follows:
"MANUFACTURE:"
"P/N:"

2.4 Origin (0, 0) of the symbols

- SMD symbol : Center of the component

- Through hole symbol : Pin 1
- Add text “center” on layer “Package geometry/ BODY_CENTER” on origin (0 , 0)
*** Note: Pin 1 of a through hole part must be a SQUARE (not circle) unless otherwise
specified.

2.5 Fiducials

- The size of fiducial is 40 inner and 120 outer diameters (I040O120) : regular pad size 40 mils,
soldermask 120 mils , no pastemask.
- Two fiducials are required for BGAs. These fiducials shall be placed on diagonally opposite
corners.
- One fiducial, preferably in the center, is required for fine pitch packages (such as QFP, SOP,
SOIC, SOJ, PLCC etc) with a pin count of 50-100.
- Two fiducials, shall be placed on diagonally opposite corners, is required for fine pitch packages
(such as QFP, SOP, SOIC, SOJ, PLCC etc) with a pin count over 100.

2.6 Package geometry Assembly Top

- Line width of Package geometry Assembly Top = 0 mil .

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 - Assembly must be equal to the body of the part. Use nominal dimension on the data sheet to
draw the outline.
- Do not use “rectanglar shape” to draw the outline.
- Add circle line for indicating pin 1 (inside of the body part).
- For polarized CAPACITORs, draw line “+” for positive pin.
- For DIODE, LEDS: see picture below to draw cathode mark.
CAPACITORs: using ARC for both end of the PADs
RESISTORs, INDUCTORs: using SQUARE for both the end of the PADs.

2.7 Package geometry Silkscreen

- Line width of Package geometry Silkscreen Top = 0 mils .

- Silkscreen top must be equal to the body of the part. Use nominal dimension on the data sheet
to draw the outline.
- Do not use “rectanglar shape” to draw the outline.
- Silkscreen must never be on any pads of any components.
- Add trianglar shape for indicating pin 1 (outside of the body part).
- Add texts indicating pin numbers for BGAs and CONNECTORs (both PACKAGE
GEOMETRY/SILKSCREEN_TOP and PACKAGE GEOMETRY/SILKSCREEN_BOTTOM). Use
TEXT_BLOCK #1.
- For the connector, will place by the edge of the board:
The silkscreen should equal to the body of the part.
Make two trianglar shapes to indicate the front of the part (at front corners).
- For polarized CAPACITORs, draw line “+” for positive pin., draw shape like for diode.
- For DIODE, LEDS: see picture below to draw cathode mark.
- For the discrete symbols (applied only for two pins) having real body of part less than 10 mils apart
from the pad edge, such as CAPACITORs, INDUCTORs, RESISTORs: Silkscreen are apart from
the pad edge 10 mils.
CAPACITORs: using ARC for both end of the PADs
RESISTORs, INDUCTORs: using SQUARE for both the end of the PADs.
- Mark pin 5, 10, 15, 20,…, 5n for SOIC, TSOP, QFPs… which have more than 15 pins in a pin
array.

Figure: LED, Diode, Polarized Capacitor assembly marking

Led assembly Diode assembly Polarized capacitor assembly

Figure: LED, Diode, Polarized Capacitor silkscreen marking

Silkscreen for Polarized capacitor

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10 mil width shape
Silkscreen for LED

10 mil width shape

Silkscreen for Diode

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 Table 5 : Types of DF
FA classes

FA
DF
Dev
vice Acrronym Name Desscription Im
mage
Cla
ass
axial AXIAL
L A
Axial Componnents Axiaal-leaded commponents are often
o
conssidered the moost common ty ype of
discrete componeent used in throough-hole
prinnted wiring asssembly. Leadss exit
fromm opposite endds or sides.

bga BGA B Grid Arraay

Ball Surfface mountingg type. Externaal
term
minals (soldereed balls) are laaid out in
a griid format on the
t back of thee package.
The BGA packagge can be madee with a
large number of high-density
h pins.
p
Commpared to packkages such as the QFP,
the BGA
B is unlikeely to have deefective
mouunting on printted circuit boaards. The
BGA A also has struuctural characcteristics
that enable efficieent mounting.
bga HBGA
A Hyper Ball Grrid
H HypperBGA is a reegistered tradeemark of
A
Array (Hyper--BGA) Enddicott Interconnnect Technolo ogies, Inc.
A fluuoropolymer based chip paackage
that combines low w loss, low dieelectric
consstant material and stripline cross
sectiion signal speeeds beyond 12Gb/s.
Boddy size JEDEC C, 33mm to 522.5mm
withh up to 2577 I//Os, and a bgaa pitch of
1.000mm and 1.27mm.
bga CBGA
A Ceramic Ball Grid
C G Ceraamic ball gridd array, with a square or
A
Array rectaangular array of solder balls on one
surfface, ball spaciing typically 1 mm.
The body of the ccomponent is ceramic.
c

bga FBGA
A/ Fine-Pitch Balll Grid
F Pitchh of the BGA is typically 1mm or
FPBGA
A A
Array less..

bga FCBG
GA Flip Chip Balll Grid
F Flip Chip Ball Grrid Array is a laminate-
l
A
Array baseed BGA packaaging solution n. The
FCPPBGA providees competitivee solutions
for higher
h perform
mance applicaations.

bga SIP MODULE

M System In Pacckage
S A fuully functionall system or suubsystem
M
Module in ann IC package format. A SiP P may
conttain one or moore IC chips, plus
p other
commponents tradittionally foundd on the
system board. Theese componennts may
incluude passive coomponents, RF
R shields,
SAW W/BAW filterrs, pre-packaged ICs,
connnectors, antennnas, camera leenses or
otheer mechanical parts requiredd to
achiieve full system
m functionalitty.

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ccgaa CCGA
A Ceramic Colum
C mn Ceraamic Column Grid Array, surface
s
G Array
Grid mouunt circuit package in whichh the input
and output points are high temp perature
soldder cylinders oor columns arrranged in
a griid pattern. The body of the
commponent is ceraamic.

chipp- CHIP--0201 SMT Discrete 0201

S 0201 - 0.02" × 0.001" (0.6 mm × 0.3
0201 1 s
size mm)), two terminaals

chipp- CHIP--0306 SMT Discrete 0306

S 03066 - 0.03” x 0.006” (0.8mm x 4.5mm),
0306 6 s
size two terminals on long edge.

chipp- CHIP--0402 SMT Discrete 0402

S 04022 - 0.04" × 0.002" (1.0 mm × 0.5
0402 2 s
size mm)), two terminaals

chipp- CHIP--0508 SMT Discrete 0508

S 05088 - 0.05" × 0.008" (1.3 mm × 2.0
0508 8 s
size mm)), two terminaals on long edge.

chipp- CHIP--0603 SMT Discrete 0603

S 06033 - 0.06" × 0.003" (1.5 mm × 0.8
0603 3 s
size mm)), two terminaals

chipp- CHIP--0612 SMT Discrete 0612

S 06122 - 0.06" × 0.112" (1.5 mm × 3.0
0612 2 s
size mm)), two terminaals two termin
nals on
longg edge.

chipp- CHIP--0805 SMT Discrete 0805

S 08055 - 0.08" × 0.005" (2.0 mm × 1.3
0805 5 s
size mm)), two terminaals

chipp- CHIP--1206 SMT Discrete 1206

S 12066 - 0.12" × 0.006" (3.0 mm × 1.5
1206 6 s
size mm)), two terminaals

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chipp-ge- CHIP--GE-1210 SMT Discrete
S Largge chips utilizze this classificcation for
1210 0 G
Greater or Equual to simpplification of spacing
s rules.
1
1210 size

chipp-ge- CHIP--1812 SMT Discrete 1812

S 18122 - 0.18" × 0.112" (4.6 mm × 3.0
1210 0 s
size mm)), two terminaals

chipp-ge- MELF
F Metal Electrodde
M Mettal Electrode Leadless
L Face (MELF)
1210 0 F
Face package Commponent Diodees have metallized
term
minals at each end of a cylinndrical
bodyy. MELF com mponents are designed
d
to fiit the same foootprints as flatt
commponents,

equaal to RN / C
CN Resistor Netw
R work / These are networkks or multiplee SM
chipp of C
Capacitor Netw
work ps linked togetther at the bod
chip dy. The
samee term
minals are pairred in symmettry where
overrall one discrete termiinal is oppositte the
body y otheer.
size

conn
n- CONN
N-BGA Connector Balll Grid
C BGA A connectors are high densiity surface
bga A
Array mouunt connectorss utilizing Solder Balls
for 2nd
2 level attacchment to PCB B.
Venndors in this caategory are NeexLev and
GigAArray.

conn
n- SM-BR
RICK Surface Mounnt
S Surfface mount veersions of deviices used
bga B
Brick for power
p converssion, typicallyy from one
DC voltage to anoother DC voltage or
fromm AC to DC. Pins
P are typicaally under
the part
p body andd require a hot air nozzle
to reemove, similaar connectors with
w ball
gridd arrays.

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conn
n-pf CONN
N-PF C
Connector Preess Fit Presss Fit Connecttors are conneectors that
do not
n require sollder to attach them
t to
the PCBA.
P The most
m common type t is a
VHD DM or Very High
H Density

conn
n-th CONN
N-TH Connector Thrrough
C Thro
ough hole connnector type. These
T
H
Hole conn
nectors are typpically wave soldered
s
and used as test hheaders and jum
mpers.

conn
n-th 1/16 B
BRICK S
Sixteenth Bricck Sixtteenth-brick 0.9” x 1.3” (22.9 mm x
33 mm).
m Devices used for power
convversion, typicaally from one DC
voltage to anotherr DC voltage or
o from
AC to DC.

conn
n-th 1/8 BR
RICK E
Eighth Brick Eighhth-brick 0.9”” x 2.3” (22.9 mm
m x
58.44 mm). Devicees used for power
convversion, typicaally from one DC
voltage to anotherr DC voltage oro from
AC to DC.

conn
n-th 1/4 BR
RICK Q
Quarter Brick Quaarter-brick 1.45” x 2.3” (36..8 mm x
58.44 mm). Devicees used for power
convversion, typicaally from one DC
voltage to anotherr DC voltage oro from
AC to DC.

conn
n-th 1/2 BR
RICK H Brick
Half Halff-brick 2.3” x 2.4” (58.4 mm
m x 61.0
mm)). Devices useed for power
version, typicaally from one DC
conv

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 voltage to anotherr DC voltage or
o from
AC to DC.

conn
n-th FULL BRICK F Brick
Full Fulll-brick 4.6”x2.4” (116.8 mmmx
61.00mm). Devices used for pow wer
convversion, typicaally from one DC
voltage to anotherr DC voltage or
o from
AC to DC.

conn
n- CONN
N-SM Connector Surrface
C Surfface mountingg type connecttor. This
sm M
Mount can take the form of gull wing, bga, J
leadd or a combinaation surface and
a
through hole techhnologies.

conn
n- SIMM
M Single in-line
S RAM M memory moodule, 72pin, 4.25-inch,
sm m
memory moduules 1.277mm pitch, MO - 116

conn
n- DIMM
M Dual in-line
D RAM M memory moodule, come inn 168pin,
sm m
memory moduule SDR RAM, MO-1661; 184 pin, 1.2 27mm
pitchh, DDR1, MO O-206; 240 pinn, 1.00mm
pitchh, DDR2, MO O-237. All modules are
5.2550-inch. Has nno logic and iss the
highhest mainstreaam solution ammong all
the DIMMs.
D
conn
n- FB-DIIMM Fully Bufferedd Dual
F DDR RII, A high peerformance DIIMM
sm I
Inline Memoryy whicch maintains the
t same form m factor as
M
Module Reggistered DIMM M. 240pin, 5.250-inch,
1.000mm pitch, MO-256.

conn
n- SO-DIIMM Small outline dual
S d SO-DIMM chips are smaller th han
sm inn-line memorry stanndard DIMMs,, 144pin, 2.66
61-inch,
m
module 0.8mmm pitch, MO O-190 or 200pin DDR1,
2.6661-inch, 0.6mmm pitch, MO-2
224.

conn
n- MINI R
R-DIMM Mini Registereed
M A smmall form facttor 244pin DIM MM,
sm D In line memory
Dual m L=33.228/H=1.1800inch (Std. height),
m
module 0.600mm pitch, 3/55 length of thee
unbuuff/reg DIMM M, MO-244. Available
A
in veery low profille (VLP), H=.7720-inch.
conn
n- SOCK
K S
Socket Usedd with PGA or o PLCC to insstall a
sm deviice without soolder. The sockket is used
for frequently
f remmoved or replaaced

ThanhTuPhaam Prroprietary annd Confidenntial

 deviices. Often duuring prototypee stages.
The connector typpe applied willl typically
matcch the device inserted. LCCC: conn-
sm, PGA: conn-thh, etc.

csp CSP C
Chip Scale Pacckage An array
a packagee with ball pitcch < 1.0
mm. Chip sized package
p = pack kage ~1.2
x diee size.

dip DIP D Inline Paackage

Dual The most basic thhrough hole IC C package
typee, DIPs were used
u for manyy years.
Leadds extend direectly down froom the
longger edges of thhe package. Cuurrently,
use of this type off package is very
v
limited.

dip SIP Single Inline

S Leadds extending directly
d from one
P
Package longger edge of thee package are vertically
mouunted on the printed circuit board.
The consequent reeduction in mounting
m
areaa allows manyy devices to bee packed
into a small area (high-density
(
mouunting).
mlf DFN Dual Flat Nonn-
D A QFN
Q package with
w signal pin ns on only
L
Leaded Packagges 2 siddes instead off all 4.

mlf QFN Quad Flat Nonn-

Q Thiss is similar to the QFP packkage,
L
Leaded Packagge howwever without the leads. Terrminations
are located
l at fourr edges of the bottom
of thhe package. Thhe QFN packaage can
be made
m in thinneer and high-deensity
moddels. Also knoow as a Micro Lead
Framme (MLF) pacckage.
mlf MLF Micro Lead Frrame
M A leeadframe-baseed, near-chip scale
s
P
Package packkage with soldderable lands instead
i of
leadds or balls. Shoort lead lengthh and
expo osed die paddle offer impro oved
thermmal and electrrical performaance. Also
know wn as Quad Flat
F No-lead (Q QFN)
packkage.
pga PGA P Grid Arrayy
Pin Mulltiple leads exttend from the back of
the package,
p Thiss type of packaage is
usedd for PC CPUss, and was thee main
choiice of high-effficiency pin package
befoore the introduuction of BGA A. Both

ThanhTuPhaam Prroprietary annd Confidenntial

 plastic and ceram
mic PGAs are available.
a
Normmally used wiith sockets.

plcc QFJ Quad Flat J-Leeaded

Q Just like the QFP package, the leads of
P
Package the QFJ
Q package eextend from thhe four
edgees of the packkage. The tips of the
leadds are wound ini the same manner as
for the
t SOJ packaage.

plcc T4, T66 O

Oscillator LCCC packages forr Oscillators and
a
Crysstals. These coomponents typ pically
comme in 4 terminaal (T4) and 6 terminal
t
(T6)) leadless packkages with casstellated
term
minations.

plcc PLCC Plastic Leadedd Chip

P The PLCC is a foour-sided plasttic
C
Carrier packkage that has "J"
" leads. Leaad count
rangges from 18 too 84. PLCC paackages
can either be squaare or rectanglle. PLCC
bodyy widths range from.35"to 1.15".
PLCCCs have JEDEC-standard packagep
outliines. The stanndard lead pitcch of the
PLCCC is 1.27 mm m. The PLCC “J” “ Lead
conffiguration requuires less boarrd space
than
n equivalent guull wing-leadeed
com
mponents.
plcc LCCC
C Leadless Ceram
L mic Leaddless Ceramicc Chip Carrierr (or
C
Chip Carrier CLC CC for Ceramic Leadless Chhip
Carrrier). A hermeetically sealed
d ceramic
packkage that has castellations
c a
and/or
padss around its sides for solderr
connnection in a suurface mountinng
appllication.

plcc LLCC Leadless Chipp

L Leaddless Chip Caarriers (LLCC))
C
Carrier packkages are charracterized by external
e
connnections consiisting of metaallized
inset terminationss (a castellatio
on),
makking the packaage resemble a
miniiature castle.

qfp QFP Q
Quad Flat Package Thiss is the evolveed version of the
t SOP
packkage, with leads extending from
f four
edgees of the packkage. The tips of the
leadds stretch outw
ward as in the SOP
packkage. This is a popular surfa
face mount
typee package becaause the QFP package
allowws the numbeer of pins to bee
increased at low cost,
c
qfp TQFP Thin Quad Flaat
T A thhinner versionn of the QFP package.
p
P
Package

ThanhTuPhaam Prroprietary annd Confidenntial

qfp LQFP Low Profile Quad
L Q Low
wer profile verrsion of the QF
FP
F Package
Flat packkage

qfp PQFP Plastic Quad Flat

P F Fourr-sided plasticc package of thhe QFP
P
Package typee.

qfp VQFP Very Thin Quaad Flat

V Veryy Small or Veery Thin quad flat
P
Package packkage. These QQFP packages have low
proffiles and typiccally have finee pitch
withh a high numbber of I/O's.

qsop
p QSOP qquarter-size sm
mall- quarrter-size smalll-outline pack
kage, with
o
outline packagge pin spacing
s of 0.6635 mm

radiaal RADIA
AL RADIAL
R Raddial-leaded com mponents are often
C
COMPONENT
TS usedd in the packagging of capaciitors and
transistor TO cans. Radials difffer from
axiaals in that the leads
l exit from
ma
commmon side of thet componentt, rather
fromm opposite endds or sides. Thhis gives
the radial
r a vertical profile and a smaller
prinnted wiring foootprint.

radiaal TO TRANSISTOR
T R TO package
p is thrrough-hole moount
O
OUTLINE transistor outline package that is
i suitable
P
PACKAGE for high
h power, medium
m currennt, and

ThanhTuPhaam Prroprietary annd Confidenntial

 fast--switching pow wer devices. There
T are
man ny additional types
t of TO paackages.
The TO-220 Full Pack packagee variant,
incluudes a fully enncapsulated heat sink
that does not requuire extra harddware for
electrical isolationn. Often used in motor
drivve applicationss and power suupplies.
TO components come c packaged in
tubees, bulk, and taape and reel. Popular
P
sizes are TO92, TO5,
T TO39, TO O220.

radiaal TORO
OID T
Toroid Inductoor A tooroid is a coil of insulated or
o
enammeled wire woound on a donnut-shaped
form
m made of pow wdered iron. A toroid is
usedd as an inductoor in electroniic circuits,
espeecially at low frequencies where
w
com
mparatively larrge inductancees are
neceessary such ass power appliccations.

sc SC70 Shrink SOT

S A shhrunken versioon of the smalll outline
P
Package transistor packagee.

sc SC Shrink SOT
S SC is
i a plastic, suurface mounted package
P
Package withh three leads

sm-ccan SM-CA
AN S
Surface Mounnt Can Verttical cylindriccal cases whichh are
simiilar in size andd shape to elecctrolytic
radial capacitors. However, witth surface
mouunt terminals that
t facilitate automatic
a
mouunting and reflflow soldering

sod SOD S
Small Outline Diode SOD D is a plastic, surface moun
nted, small
outliine diode (SOOD) package with
w two
leadds

soic SOIC Small Outline

S The SOIC is a recctangular surfaface-mount
I
Integrated Circcuit integgrated circuit package withh eight or
morre gull wing leeads. The leadds protrude
from
m the longer eddge of the pacckage.
SOIC packages arre JEDEC com mpliant,
and come in a varriety of body
widtths.The SOIC may be shipp ped in
tubees or tape and reel.

soj SOJ S
Small Outline J- The tips of the leaads extending from the

ThanhTuPhaam Prroprietary annd Confidenntial

 L
Leaded Packagge two longer edges of the packag ge are
wou und inward as if cradling thee package
itsellf. The SOJ paackage is so naamed
becaause the leads look like the letter "J"
wheen viewed from m the side. Thhey are
surfface mounted after
a soldering
g the
wou und portions. SOJ
S packages were
form
merly used forr SIMM (mem mory
moddules).
sop SOP Small Outline
S Leadds stretch from m the two longger edges
P
Package of thhe package, thhen the lead tipps
exteended outwardd in a gull winng
form
mation. This iss the main typ pe surface
mouunting and is very
v widely ussed,
partiicularly in thee areas of
micrrocomputers, memory and analog a IC,
whicch use a relatiively small nuumber of
pinss.
sop TSOP Thin Small Ouutline
T A thhinner versionn of the SOP package.
p
P
Package

sop SSOP Shrink Small

S The SSOP packagge is a smallerr or
O
Outline Package 'shruunk' version of
o the SOIC paackage,
haviing a compresssed body and a
tighttened lead pitch. Lead coun nt ranges
fromm 8 to 64. SSOOP body sizes come in
150,, 209 and 300 mils. The SSOP
packkage is JEDEC C- and EIAJ-ccompliant.
The package leadds are solder pllated.
sop TSSOP
P Thin Shrink Sm
T mall The TSSOP package has a smaaller body
O
Outline Package and smaller lead ppitch than the standard
SOIC package. Thhe TSSOP com me in
bodyy sizes of 3.0mmm, 4.4mm annd 6.1mm
withh a thickness of
o 0.85 mm foor the 3.0-
mm body and a thhickness of 9m mm for the
4.4 mm-
m and 6.1-m mm bodies. Lead
L count
rangges from 8 to 56.
5 Its standarrd lead
pitchh is 0.65mm. This package type is
JEDDEC-compliannt.
sot SOT-223 / SC70 SMALL OUTLINE
S SMA ALL OUTLIN NE TRANSISTOR
T
TRANSISTOR
R SOT T package is a rectangular surface
s
mouunt transistor or
o diode with three or
morre gull wings leads.
l The leadds are on
two length sides ofo the packagee. SOT
packkage are JEDE EC compliant.. Popular
sizes are the SOT T23, SOT143, SOT223
and SOT89. SOT components are a
avaiilable on plasttic tape and reel.
tant TANT
T T
Tantalum Cappacitor Capacitors with a tantalum oxid de film
dieleectric are knowwn as tantalumm
capaacitors. The caathode materiaal in
stanndard tantalumm capacitors is
man nganese dioxidde. They are known
k for
smaall size and cappacitance exteension
(Lesss than 1/4 thee size of equiv
valent
alumminum electroolytic capacito ors), good
freqquency charactteristics, and long
l life.
tant A-CAP
P T
Tantalum Cappacitor Sizee A (EIA 32166-18) 3.2 mm × 1.6 mm
× 1.6 mm
tant B-CAP
P T
Tantalum Cappacitor Sizee B (EIA 35288-21) 3.5 mm × 2.8 mm
× 1.9 mm
tant C-CAP
P T
Tantalum Cappacitor Sizee C (EIA 60322-28) 6.0 mm × 3.2 mm
× 2.22 mm

ThanhTuPhaam Prroprietary annd Confidenntial

tant D-CAP
P T
Tantalum Cappacitor Sizee D (EIA 73433-31) 7.3 mm × 4.3 mm
× 2.44 mm
tant E-CAP
P T
Tantalum Cappacitor Sizee E (EIA 73433-43) 7.3 mm × 4.3 mm
× 4.1 mm
tant F-CAP
P T
Tantalum Cappacitor Sizee F (EIA 60322-20) 6.0 mm x 3.2 mm
x 2 mm
m
tant K-CAP
P T
Tantalum Cappacitor Sizee K (EIA 32166-10) 3.2 mm x 1.6 mm
x 1 mm
m
tant P-CAP
P T
Tantalum Cappacitor Sizee P (EIA 20122-15) 2.05 mm m x 1.35
mm x 1.5 mm
tant R-CAP
P T
Tantalum Cappacitor Sizee R (EIA 20122-12) 2.05 mm m x 1.3
mm x 1.2 mm
tant S-CAP
P T
Tantalum Cappacitor Sizee S (EIA 32166-12) 3.2 mm x 1.6 mm
x 1.22 mm
tant T-CAP
P T
Tantalum Cappacitor Sizee T (EIA 35288-12) 3.5 mm x 2.8 mm
x 1.22 mm
tant V-CAP
P T
Tantalum Cappacitor Sizee V (EIA 73611-38) 7.3 mm x 6.1mm
x 3.445 mm
tant W-CA
AP T
Tantalum Cappacitor Sizee W (EIA 60322-15) 6.0 mm m x 3.2 mm
x 1.55 mm
tant X-CAP
P T
Tantalum Cappacitor Sizee X (EIA 73433-15) 7.3 mm x 4.3 mm
x 1.55 mm
tant Y-CAP
P T
Tantalum Cappacitor Sizee Y (EIA 73433-20) 7.3 mm x 4.3 mm
x 2 mm
m
to DPAK
K Discrete packaage or
D The D2PAK and DPAK are dirrect
d
deca-watt (DP
PAK). surfface mount derrivatives of thhe TO-220
powwer package

to D2PAK
K Discrete packaage or
D Speccific type of Footprint
F Family
d
deca-watt (DP
PAK) usuaally for pwr Transistors / Diiodes.
D2PPAK is large surface
s mounted
packkage that incluude a heat sinkk

ThanhTuPhaam Prroprietary annd Confidenntial

 Table 6 : DFA Minimum Spacing Guidelines

chip-ge-1210
chip-0201

chip-0306

chip-0402

chip-0508

chip-0603

chip-0805

chip-1206

conn-bga

conn-sm

conn-th
conn-pf

sm-can
radial
axial

qsop
ccga

tant
plcc

soic
bga

pga

qfp

sod

sop
mlf
csp

dip

soj

sot
sc

to
axial 50
bga 125 125
ccga 125 125 200
chip-0201 50 100 100 12
chip-0306 50 100 100 15 20
chip-0402 50 100 100 15 20 15
chip-0508 50 100 100 15 20 20 20
chip-0603 50 100 100 18 18 18 20 18
chip-0805 50 100 100 20 20 20 20 18 20
chip-1206 50 100 100 25 25 25 25 25 25 35
chip-ge-1210 50 100 100 40 40 40 40 40 40 40 40
conn-bga 50 110 110 110 110 110 110 110 110 110 110 110
conn-pf 200 200 200 200 200 200 200 200 200 200 200 200 200
conn-sm 125 125 200 75 110 75 110 75 75 75 75 110 200 125
conn-th 100 125 200 100 100 100 100 100 100 100 100 110 200 200 100
csp 125 125 125 100 100 100 100 100 100 100 100 110 200 125 125 125
dip 50 125 125 50 50 50 50 50 50 50 50 110 200 125 100 125 50
mlf 125 125 125 100 110 100 110 100 100 100 100 110 200 125 125 125 125 125
pga 50 125 125 50 50 50 50 50 50 50 50 110 200 125 100 125 50 125 50
plcc 100 125 125 40 50 40 50 40 40 40 40 125 200 125 100 125 100 125 100 50
qfp 125 125 125 50 50 50 50 50 50 50 50 110 200 125 100 125 125 125 125 125 125
qsop 100 125 125 40 50 40 50 40 40 40 40 110 200 125 100 125 100 125 100 50 125 50
radial 50 125 125 50 50 50 50 50 50 50 50 110 200 125 100 125 50 125 50 100 125 100 50
sc 50 100 100 20 50 20 50 20 20 20 20 110 200 75 100 100 50 100 50 40 50 40 50 20
sm-can 50 200 110 50 50 50 50 50 50 50 50 110 100 110 50 200 50 110 50 100 50 50 50 50 75
sod 50 100 100 20 50 20 50 20 20 20 20 110 200 75 100 100 50 100 50 40 50 40 50 20 50 20
soic 75 125 125 25 50 25 50 25 25 25 25 110 200 125 100 125 75 125 75 50 75 50 75 25 50 25 25
soj 100 125 125 40 50 40 50 40 40 40 40 125 200 125 100 125 100 125 100 50 125 50 100 40 100 40 50 50
sop 100 125 125 40 50 40 50 40 40 40 40 110 200 125 100 125 100 125 100 50 125 50 100 40 50 40 50 50 50
sot 50 100 100 20 50 20 50 20 20 20 20 110 200 75 100 100 50 100 50 40 50 40 50 20 50 20 25 40 40 20
tant 50 100 100 40 50 40 50 40 40 40 40 110 200 75 100 100 50 100 50 40 50 40 50 20 50 20 25 40 40 20 40
to 100 125 125 40 50 40 50 40 40 40 40 110 200 125 100 125 100 125 100 50 125 50 100 40 50 40 50 50 50 40 40 50

ThanhTuPham Proprietary and Confidential

 Table 7 : Manufacturing Ultimate Physical Spacing Limits

chip-ge-1210
chip-0201

chip-0306

chip-0402

chip-0508

chip-0603

chip-0805

chip-1206

conn-bga

conn-sm

conn-th
conn-pf

sm-can
radial
axial

qsop
ccga

tant
plcc

soic
bga

pga

qfp

sod

sop
mlf
csp

dip

soj

sot
sc

to
axial 50
bga 30 30
ccga 30 30 30
chip-0201 50 10 10 10
chip-0306 30 20 20 10 10
chip-0402 50 10 10 10 10 10
chip-0508 30 20 20 10 10 10 10
chip-0603 50 10 10 10 10 10 10 10
chip-0805 50 10 10 10 10 10 10 10 10
chip-1206 50 10 10 10 10 10 10 10 10 10
chip-ge-1210 50 10 10 25 25 25 25 25 25 25 25
conn-bga 30 20 20 10 20 20 20 20 20 20 20 50
conn-pf 100 200 200 100 100 100 100 100 100 100 100 75 50
conn-sm 100 100 100 20 20 20 20 20 20 25 25 50 100 100
conn-th 50 30 30 50 50 50 50 50 50 50 50 50 100 50 50
csp 30 30 30 10 20 10 20 10 10 10 10 110 200 100 30 30
dip 30 30 30 30 30 30 30 30 30 30 30 50 100 100 50 30 30
mlf 30 30 30 10 20 10 20 10 10 10 10 50 200 100 30 30 30 30
pga 30 30 30 30 30 30 30 30 30 30 30 50 100 100 50 30 30 30 30
plcc 100 30 30 25 25 25 25 25 25 25 25 100 100 100 50 30 50 30 50 30
qfp 30 30 30 10 20 10 20 10 10 20 20 20 100 100 50 30 30 30 30 20 30
qsop 100 30 30 25 25 25 25 25 25 25 25 20 100 100 50 30 50 30 50 30 20 30
radial 50 30 30 50 50 50 50 50 50 50 50 50 100 100 50 30 30 30 30 100 30 100 50
sc 50 10 10 10 20 10 20 10 10 10 10 20 100 25 50 10 30 10 30 25 20 25 50 10
sm-can 30 150 30 20 20 20 20 20 20 20 20 20 75 30 30 150 30 50 30 75 30 30 30 30 50
sod 50 10 10 10 20 10 20 10 10 10 10 20 100 25 50 10 30 10 30 25 20 25 50 10 30 10
soic 75 30 30 10 20 10 20 10 10 10 10 20 100 100 50 30 30 30 30 30 20 30 75 10 30 10 10
soj 100 30 30 25 25 25 25 25 25 25 25 100 100 100 50 30 50 30 50 30 20 30 100 25 75 25 30 30
sop 100 30 30 25 25 25 25 25 25 25 25 20 100 100 50 30 50 30 50 30 20 30 100 25 30 25 30 30 30
sot 50 10 10 10 20 10 20 10 10 10 10 20 100 25 50 10 30 10 30 25 20 25 50 10 30 10 10 25 25 10
tant 50 10 10 10 25 25 25 25 25 25 25 20 100 25 50 10 30 10 30 25 20 25 50 10 30 10 10 25 25 10 25
to 100 30 30 25 25 25 25 25 25 25 25 50 100 100 50 30 50 30 50 30 20 30 100 25 30 25 30 30 30 25 25 30

ThanhTuPham Proprietary and Confidential

 Package Orientation
SOIC

0 90 180 270

SOT-REGULATOR

0 90 180 270

SOT143

0 90 180 270

QFP

0 90 180 270
SOT23 ( MINL___C )

0 90 180 270
ThanhTuPham Proprietary and Confidential
SOT5

0 90 180 270

SOT6

0 90 180 270

SOP

0 90 180 270
BGA

0 90 180 270

OSCILLATOR_XTAL

0 90 180 270

ThanhTuPham Proprietary and Confidential

PLCC

00 900 1800 2700

RN8

00 900 1800 2700

RN4

00 900 1800 2700

LED

00 900 1800 2700

DIODE

00 900 1800 2700

TANT CAP

00 900 1800 2700

ThanhTuPham Proprietary and Confidential

 Drill table
Example: d060c080.pad: Drill size 60, the drill symbol: Figure : Square; Character : H; Width : 60;
Height : 60
* For drill size smaller than 50mils, make the drill symbol with Width : 50; Height : 50
* Also we want to use only CROSS figure for the drill symbol for all NON_PLATED
PADSTACKS.
* For rectangular and oblong drill holes, we use 2 characters for Drill/Slot symbol. Example :
Characters in Drill/Slot symbol of padstack D059X024REC079X044 should be “GX” .

Table 8 : Drill table

Circle Square Hexagon Octagon

Cir 1* A a 27 Sqr 53 A a 79 Hex 105 A a 131 Octa 157 A a 183
Cir 2* B b 28 Sqr 54 B b 80 Hex 106 B b 132 Octa 158 B b 184
Cir 3* C c 29 Sqr 55 C c 81 Hex 107 C c 133 Octa 159 C c 185
Cir 4* D d 30 Sqr 56 D d 82 Hex 108 D d 134 Octa 160 D d 186
Cir 5* E e 31 Sqr 57 E e 83 Hex 109 E e 135 Octa 161 E e 187
Cir 6* F f 32 Sqr 58 F f 84 Hex 110 F f 136 Octa 162 F f 188
Cir 7* G g 33 Sqr 59 G g 85 Hex 111 G g 137 Octa 163 G g 189
Cir 8* H h 34 Sqr 60 H h 86 Hex 112 H h 138 Octa 164 H h 190
Cir 9* I i 35 Sqr 61 I i 87 Hex 113 I i 139 Octa 165 I i 191
Cir 10* J j 36 Sqr 62 J j 88 Hex 114 J j 140 Octa 166 J j 192
Cir 11* K k 37 Sqr 63 K k 89 Hex 115 K k 141 Octa 167 K k 193
Cir 12* L l 38 Sqr 64 L l 90 Hex 116 L l 142 Octa 168 L l 194
Cir 13* M m 39 Sqr 65 M m 91 Hex 117 M m 143 Octa 169 M m 195
Cir 14* N n 40 Sqr 66 N n 92 Hex 118 N n 144 Octa 170 N n 196
Cir 15* O o 41 Sqr 67 O o 93 Hex 119 O o 145 Octa 171 O o 197
Cir 16* P p 42 Sqr 68 P p 94 Hex 120 P p 146 Octa 172 P p 198
Cir 17* Q q 43 Sqr 69 Q q 95 Hex 121 Q q 147 Octa 173 Q q 199
Cir 18* R r 44 Sqr 70 R r 96 Hex 122 R r 148 Octa 174 R r 200
Cir 19* S s 45 Sqr 71 S s 97 Hex 123 S s 149 Octa 175 S s 201
Cir 20* T t 46 Sqr 72 T t 98 Hex 124 T t 150 Octa 176 T t 202
Cir 21* U u 47 Sqr 73 U u 99 Hex 125 U u 151 Octa 177 U u 203
Cir 22* V v 48 Sqr 74 V v 100 Hex 126 V v 152 Octa 178 V v 204
Cir 23* W w 49 Sqr 75 W w 101 Hex 127 W w 153 Octa 179 W w 205
Cir 24* X x 50 Sqr 76 X x 102 Hex 128 X x 154 Octa 180 X x 206
Cir 25 Y y 51 Sqr 77 Y y 103 Hex 129 Y y 155 Octa 181 Y y 207
Cir 26 Z z 52 Sqr 78 Z z 104 Hex 130 Z z 156 Octa 182 Z z 208

Diamond Triangle Oblong Cross

Dia 209 A a 235 Tri 261 A a 287 Obl 313 A a 339 Cro 365 A a 391
Dia 210 B b 236 Tri 262 B b 288 Obl 314 B b 340 Cro 366 B b 392
Dia 211 C c 237 Tri 263 C c 289 Obl 315 C c 341 Cro 367 C c 393
Dia 212 D d 238 Tri 264 D d 290 Obl 316 D d 342 Cro 368 D d 394
Dia 213 E e 239 Tri 265 E e 291 Obl 317 E e 343 Cro 369 E e 395
Dia 214 F f 240 Tri 266 F f 292 Obl 318 F f 344 Cro 370 F f 396
Dia 215 G g 241 Tri 267 G g 293 Obl 319 G g 345 Cro 371 G g 397
Dia 216 H h 242 Tri 268 H h 294 Obl 320 H h 346 Cro 372 H h 398
Dia 217 I i 243 Tri 269 I i 295 Obl 321 I i 347 Cro 373 I i 399
Dia 218 J j 244 Tri 270 J j 296 Obl 322 J j 348 Cro 374 J j 400

ThanhTuPham Proprietary and Confidential

Dia 219 K k 245 Tri 271 K k 297 Obl 323 K k 349 Cro 375 K k 401
Dia 220 L l 246 Tri 272 L l 298 Obl 324 L l 350 Cro 376 L l 402
Dia 221 M m 247 Tri 273 M m 299 Obl 325 M m 351 Cro 377 M m 403
Dia 222 N n 248 Tri 274 N n 300 Obl 326 N n 352 Cro 378 N n 404
Dia 223 O o 249 Tri 275 O o 301 Obl 327 O o 353 Cro 379 O o 405
Dia 224 P p 250 Tri 276 P p 302 Obl 328 P p 354 Cro 380 P p 406
Dia 225 Q q 251 Tri 277 Q q 303 Obl 329 Q q 355 Cro 381 Q q 407
Dia 226 R r 252 Tri 278 R r 304 Obl 330 R r 356 Cro 382 R r 408
Dia 227 S s 253 Tri 279 S s 305 Obl 331 S s 357 Cro 383 S s 409
Dia 228 T t 254 Tri 280 T t 306 Obl 332 T t 358 Cro 384 T t 410
Dia 229 U u 255 Tri 281 U u 307 Obl 333 U u 359 Cro 385 U u 411
Dia 230 V v 256 Tri 282 V v 308 Obl 334 V v 360 Cro 386 V v 412
Dia 231 W w 257 Tri 283 W w 309 Obl 335 W w 361 Cro 387 W w 413
Dia 232 X x 258 Tri 284 X x 310 Obl 336 X x 362 Cro 388 X x 414
Dia 233 Y y 259 Tri 285 Y y 311 Obl 337 Y y 363 Cro 389 Y y 415
Dia 234 Z z 260 Tri 286 Z z 312 Obl 338 Z z 364 Cro 390 Z z 416

ThanhTuPham Proprietary and Confidential