Stpmic 1
Stpmic 1
Datasheet
Features
• Input voltage range from 2.8 V to 5.5 V
• 4 adjustable general purpose LDOs
• 1 LDO for DDR3 termination (sink-source), bypass mode for low power DDR or
as general purpose LDO
• 1 LDO for USB PHY supply with automatic power source detection
• 1 reference voltage LDO for DDR memory
• 4 adjustable adaptive constant on-time (COT) buck SMPS converters
• 5.2 V / 1.1 A boost SMPS with bypass mode for 5 V input or battery input
• 1 power switch 500 mA USB OTG compliant
• 1 power switch 500 mA/1000 mA general purpose
• User programmable non-volatile memory (NVM), enabling scalability to support
a wide range of applications
• I²C and digital IO control interface
• WFQFN 44L (5x6x0.8)
Applications
• Power management for embedded micro processor units
• Wearable and IoT
• Portable devices
• Man-machine interfaces
Product status link
• Smart home
STPMIC1 • Power management unit companion chip of the STM32MP1 MPU
Device summary
STPMIC1APQR
Description
The STPMIC1 is a fully integrated power management IC designed for products
STPMIC1BPQR
based on high integrated application processor designs requiring low power and high
Order code STPMIC1CPQR efficiency.
STPMIC1DPQR The device integrates advanced low power features controlled by a host processor
STPMIC1EPQR
via I²C and IO interface.
WFQFN 44L
The STPMIC1 regulators are designed to supply power to the application processor
Packing as well as to the external system peripherals such as: DDR, Flash memories and
(5x6x0.8) other system devices.
The boost converter can power up to 3 USB ports (two 500 mA host USB and one
100 mA USB OTG). Its advanced bypass architecture allows the smooth regulation
of VBUS for USB ports from a battery as well as low-cost consumer 5 V AC-DC
adapters.
4 buck SMPS are optimized to provide an excellent transient response and an output
voltage precision for a wide range of operating conditions, high full range efficiency (η
up to 90%) by implementing a low power mode with a smooth transition from PFM to
PWM and also an advanced PWM synchronization technique with an integrated PLL
for a better noise (EMI performance).
1 Device configuration
The STPMIC1 has a non-volatile memory (NVM) that enables scalability to support a wide range of applications:
• Default output voltage, POWER_UP/POWER_DOWN sequence, protection behavior, auto turn-on
functionality, I2C slave address
• The STPMIC1A, STPMIC1B, STPMIC1D and STPMIC1E are pre-programmed devices to support the
STM32MP1 series application processor versions
• The STPMIC1C is not a programmed device to support custom applications
• Straightforward NVM (re)programming via I2C to facilitate mass production directly in target applications
BUCK2IN LX2
VLX2 VDD_DDR
BUCK2
CBUCK2IN
(SMPS) VOUT2 CVOUT2
(DDR3, DDR3L,
PGND2 lpDDR2, lpDDR3,
DDR4)
BUCK3IN LX3
VLX3 VDD
BUCK3
CBUCK3IN (SMPS) VOUT3 CVOUT3
(VIO: 1V8 or 3V3)
PGND3
BUCK4IN LX4
VLX4 VDD_AUX
BUCK4
CBUCK4IN VOUT4 (to system devices
PGND4 (SMPS) CVOUT4 or CPU voltage)
LXB
VLXBST
BOOST
BSTOUT
CVLXBST VIN BYPASS
PGND5
CBSTOUT
VBUSOTG
PWR_USB_SW VBUS_OTG
CVBUSOTG
(close to USB
connector)
SWIN SWOUT
BSTOUT PWR_SW VBUS_HOST
CSWOUT
close to USB
connector)
BSTOUT SUPPLY LDO4OUT
VBUSOTG LDO4 VDD_USB
VIN MUX (fixed 3.3V to
CLDO4OUT AP USB PHY )
CVIN
INTLDO
INTLDO
LDO3IN AGND CINTLDO
VDD_DDR
CLDO3IN LDO3
(normal, LDO3OUT VTT_DDR3
VIO NVM bypass, (to DDR3/3L
VDD CLDO3OUTterminations or to
DDRVTT)
SCL BUCK2IN
lpDDR2/3 VDD1)
I2C
SDA DDR_REF VREFDDR
VIO domain
VREF_DDR
(VOUT2/2)
INTn CVREF
to / from REGISTER
host AP PWRCTRL
STATE LDO1OUT
LDO1 VOUT_LDO1
RSTn MACHINE
(to system device)
POWER
CLDO1OUT
WAKEUP SUPPLIES
CONTROL
user push button LDO6OUT
PONKEYn LDO6 VOUT_LDO6
LOGIC (to system device)
CLDO6OUT
SYSTEM
CONTROL
LDO16IN LDO2OUT VOUT_LDO2
VIN LDO2
(to Flash Memory
CLDO16IN CLDO2OUT or system device)
LDO25IN LDO5OUT
LDO5 VOUT_LDO5
(to SD-Card or
CLDO25IN GNDLDO EPGND CLDO5OUT system device)
christophe belet ST
Note: BUCK1IN and BUCK2IN must always be connected to VIN
Note: All the components above refer to a typical application. Operation of the device is not limited to the choice of
these external components.
44 PWRCTRL
35 VBUSOTG
39 LDO4OUT
38 SWOUT
40 INTLDO
41 AGND
37 SWIN
43 INTn
42 VIO
36 VIN
RSTn 1 34 BOUT
WAKEUP 2 33 VLXBST
SDA 3 32 PGBOOST
SCL 4 31 VOUT3
VOUT1 5 30 PGND3
PGND1 6 29 VLX3
EPGND
VLX1 7 28 BUCK3IN
BUCK1IN 8 27 VOUT4
VOUT2 9 26 PGND4
PGND2 10 25 VLX4
VLX2 11 24 BUCK4IN
BUCK2IN 12 23 LDO1OUT
LDO3IN 13
LDO3OUT 14
GNDLDO 15
VREFDDR 16
PONKEYn 17
LDO2OUT 18
LDO25IN 19
LDO5OUT 20
LDO6OUT 21
LDO16IN 22
1. A: analog; D: digital
Note: Once the normal operating conditions are exceeded, the performance of the device may suffer. Stresses beyond
those listed under absolute maximum ratings may cause permanent damage to the device.
Application
Application description Conditions Min. Typ. Max. Unit
mode
STPMIC1 VIN input current consumption (all supply pins connected to VIN, VIN = 3.6 V, VIO = 1.8 V(from VOUT3), TA=
+25 °C)
STPMIC1 in OFF-state
Turn-on from PONKEYn, WAKEUP and
Application is OFF, waiting VBUSOTG/SWOUT active
OFF 50 µA
for turn-on event to start
No activity on I2C
VIO=0 V (BUCK3 is OFF)
No activity on I2C
No activity on I2C
STPMIC1 in POWER_ON state
IRQ from PONKEYn WAKEUP and VBUSOTG/
SWOUT
BUCK1 active in HP mode, VOUT=1.2 V
BUCK2 active in HP mode, VOUT=1.2 V
No activity on I2C
General section
VIN = 3.6 V, VOUT1 = 1.2 V, VOUT2 = 1.2 V, VOUT3 = 1.8 V, VOUT4 = 3.3 V, VLDO1OUT/VLDO3OUT = 1.8 V, VLDO2OUT/VLDO5OUT/VLDO6OUT =
2.9 V, VIO = 1.8 V, recommended BOM, Tj = -40 °C to +125 °C, unless otherwise specified.
Input voltage
VIN 2.8 3.6 5.5 V
range
VIN POR rising
VIN_POR_Rise 2.2 2.3 2.4 V
threshold
VIN POR falling
VIN_POR_Fall 2 2.1 2.2 V
threshold
3 3.1 3.2
VINOK rising Programmable value, defined in NVM register 3.2 3.3 3.4
VINOK_Rise V
threshold Table 65. NVM_MAIN_CTRL_SHR 3.4 3.5 3.6
3.9 4 4.1
200
VINOK_Fall +50
VINLOW rising Programmable value, defined in register +30 +80
VINLOW_Rise to mV
threshold Table 30. SW_VIN_CR +300 +500
VINOK_Fall +400
90 100 110
Warning
TWRN_Rise temperature 115 125 140 °C
rising
Warning
TWRN_Fall temperature 95 105 120 °C
falling
Shutdown
TSHDN_Rise temperature 140 150 160 °C
rising
Shutdown
TSHDN_Fall temperature 115 125 135 °C
falling
LDO OCP turn-off
tOCPDB_LDO 30 ms
delay
Main input
VLDOIN 2.8 5.5 V
voltage range
VLDOIN >VLDOOUT+VLDODROP LDO1 LDO2 1.7 to 3.3 V
Programmable value. Refer to
VLDOOUT Output voltage Table 9. LDO output voltage LDO5 1.7 to 3.9 V
settings
Voltage programming step 100 mV
Load transient
VLDOOUT-LO ILDOOUT = 5 to 180 mA, ΔVLDOIN = 0, tR = tF ~1 µs 45 mV
regulation
Main input
VLDO3IN 2.8 5.5 V
voltage range
VLDO3IN >VLDO3OUT+VLDO3DROP programmable
value. Refer to Table 9. LDO output voltage 1.8 to 3.3 V
VLDO3OUT Output voltage settings
Voltage programming step 100 mV
Continuous
ILDO3OUT VLDO3IN = 2.8 V to 5.5 V 100 mA
output current
Load current
ILDO3LIM VLDO3IN = 2.8 V to 5.5 V 120 150 mA
limitation
Input voltage
VLDO3IN-BP 1.7 2 V
range
tSSLDO3-BP Soft-start duration 1.7 V < VLDO3IN < 2 V, 0 < ILDO3OUT < 1 mA 100 µs
Input voltage
VLDO4IN VLDO4IN = Max.(VIN; VBUSOTG; BSTOUT) 2.8(2) 5.5 V
range
Output voltage
VLDO4OUT-ACC 3.6 V<VLDO4IN<5.5 V, 1 mA<ILDO4OUT<30 mA 3.23 3.3 3.34 V
accuracy
Continuous
ILDO4OUT VLDO4IN = 3.6 V to 5.5 V 50 mA
output current
Load current
ILDO4LIM VLDO4IN = 3.6 V to 5.5 V 50 75 200 mA
limitation
ILDO4Q Quiescent current ILDO4OUT = 0 mA, TJ = +105 °C 20 25 µA
Dropout voltage
VLDO4DROP ILDO4OUT = 30 mA 45 90 mV
from VIN
LDO6
VLDO6IN =3.6 V, VLDO6OUT = 1.0 V, Tj = -40 °C to +125 °C, recommended BOM, unless otherwise specified
Main input
VIN VLDO6IN 2.8 5.5 V
voltage range
VLDO6IN >VLDO6OUT +VLDO6DROP Programmable
value. Refer to Table 9. LDO output voltage 0.9 to 3.3 V
VLDO6OUT Output voltage settings
Voltage programming step 100 mV
Continuous
ILDO6OUT 2.8 V<VLDO6IN<5.5 V 150 mA
output current
Load current
ILDO6LIM 2.8 V<VLDO6IN<5.5 V 160 200 350 mA
limitation
ILDO6Q Quiescent current ILDO6OUT = 0 mA, TJ = +105 °C 4 20 µA
Input leakage
ILDO6IN_LKG LDO OFF 0.5 1 µA
current
VLDO6DROP Dropout voltage VLDO6OUT = 2.9 V, ILDO6OUT=150 mA 160 300 mV
Load transient
VLDO6OUT-LO ΔILDO6OUT = 75 mA, ΔVLDO6IN = 0, tR = tF ~1 µs 30 mV
regulation
Line transient
VLDO6OUT-LI ΔVLDO6IN = 600 mV, ΔILDO6OUT = 0, tR = tF ~10 μs 5 mV
regulation
ΔVLDO6IN = 300 mVPP, f=[0.1:20] kHz 55
Power supply
PSRRLDO6 dB
rejection ratio ΔVLDO6IN = 300 mVPP, f=[20:100] kHz 40
REFDDR
VREFOUT= VOUT2/2= 0.675 V, Tj = -40 °C to +125 °C, recommended BOM, unless otherwise specified
Output voltage
VREF-ACC IREF = 0.1 mA -1 1 %
accuracy
Output current
IREFOUT 5 mARMS
capability
Load current
IREFLIM ±10 ±25 ±50 mA
limitation
IREFQ Quiescent current IREFOUT = 0 mA, TJ = +25 °C 30 µA
Buck converter 1
VBUCK1IN = 3.6 V, VOUT1 = 1.2 V, recommended BOM, Tj= -40 °C to +125 °C , unless otherwise specified
Main input
VBUCK1IN 2.8 5.5 V
voltage range
Programmable value, refer to Table 10. BUCK
0.725 to 1.5 V
VOUT1 Output voltage output settings
Voltage programming step 25 mV
VBUCK1IN= 2.8 V to 5.5 V, VOUT1 = 0.725 V to 1.5
V
Output voltage
VOUT1-ACC %
accuracy HP mode IBK1OUT = 0 to 1.5 A -2 2
LP mode IBK1OUT = 0 to 50 mA -4 4
Reference
fREFCLK switching 2 MHz
frequency
IBUCK1OUT = 0 mA, HP mode 220 300
Total quiescent
IQ_BK1 µA
current IBUCK1OUT = 0 mA, LP mode 50 80
Input leakage
IBUCK1IN_LKG BUCK OFF 1 µA
current
IBK1OUT=150 mA, TA = +25 °C 86
Recovery time
tLP-HP-BK1 from LP to HP VOUT1_LP = VOUT1_HP 20 µs
mode
Start-up delay
(delay before 2.8 V<VBUCK1IN<5.5 V, refer toFigure 46. BUCKx
tSU_BK1 0.05 0.5 1 ms
voltage starts to start-up/shutdown timings
rise)
2.8 V<VBUCK1IN<5.5 V, 1 mA<IBK1OUT<100 mA,
tSS_BK1 Soft-start duration VOUT1=1.2 V, refer to Figure 16. Buck4 load 235 400 µs
transient in LP mode.
Slew rate during start-up 5.5 mV/µs
Output voltage
SRBK1 DVS slew rate of a voltage programmed change
slew rate 2.3 3.1 mV/µs
low to high or high to low, from 0.8 V to 1.2 V
From VOUT1=1.2 V to VOUT1<0.2 V, VIN=3.6 V,
COUT=22 µF
Shutdown
tSD_BK1 ms
duration Slow PD, IBK1OUT<1 mA 1.5
Buck converter 2
VBUCK2IN = 3.6 V, VOUT2 = 1.2 V, recommended BOM, Tj = -40 °C to +125 °C, unless otherwise specified
Main input
VBUCK2IN 2.8 5.5 V
voltage range
Programmable value, refer to Table 10. BUCK
1.0 to 1.5 V
VOUT2 Output voltage output settings
Voltage programming step 50 mV
VBUCK2IN = 2.8 V to 5.5 V, VOUT2 = 1.0 V to 1.5 V
Output voltage
VOUT2-ACC HP mode IBK2OUT = 0 to 1.0 A -2 2 %
accuracy
LP mode IBK2OUT = 0 to 50 mA -4 4
Input leakage
IBUCK2IN_LKG BUCK OFF 1 µA
current
IBK2OUT=150 mA, TA = +25 °C 87
Recovery time
tLP-HP-BK2 from LP to HP VOUT2_LP = VOUT2_HP 20 µs
mode
Start-up delay
(delay before 2.8 V<VBUCK2IN<5.5 V, refer to Figure 46. BUCKx
tSU_BK2 0.05 0.5 1 ms
voltage starts to start-up/shutdown timings.
rise)
2.8 V<VBUCK2IN<5.5 V, 1 mA<IBK2OUT<100 mA,
tSS_BK2 Soft-start duration VOUT2=1.2 V, refer to Figure 16. Buck4 load 235 400 µs
transient in LP mode
Slew rate during start-up 5.5 mV/µs
Output voltage
SRBK2 DVS slew rate of a voltage programmed change
slew rate 3.1 mV/µs
low to high or high to low
From VOUT2 = 1.2 V to VOUT2<0.2 V, VIN=3.6 V,
COUT=22 µF
Shutdown
tSD_BK2 ms
duration Slow PD, IBK2OUT<1 mA 1.5
Buck converter 3
VBUCK3IN = 3.6 V, VOUT3 = 1.8 V, recommended BOM, Tj = -40 °C to +125 °C, unless otherwise specified
Main input
VBUCK3IN 2.8(2) 5.5 V
voltage range
Input leakage
IBUCK3IN_LKG BUCK OFF 1 µA
current
IBK3OUT=150 mA, TA = +25 °C 90
Recovery time
tLP-HP-BK3 from LP to HP VOUT3_LP = VOUT3_HP 20 µs
mode
Start-up delay
(delay before 2.8 V<VBUCK3IN<5.5 V, refer to Figure 46. BUCKx
tSU_BK3 0.05 0.5 1 ms
voltage starts to start-up/shutdown timings.
rise)
2.8 V<VBUCK3IN<5.5 V, 1 mA<IBK3OUT<100 mA,
tSS_BK3 Soft-start duration VOUT3=1.2 V, refer to Figure 16. Buck4 load 235 400 µs
transient in LP mode
Buck converter 4
VBUCK4IN = 5.0 V, VOUT4 = 3.3 V, recommended BOM, Tj = -40 °C to +125 °C, unless otherwise specified
Main input
VBUCK4IN 2.8 (2) 5.5 V
voltage range
Programmable value, refer to Table 10. BUCK
0.6 to 3.9 V
output settings
Voltage programming step
VOUT4 Output voltage 0.6 V ≤ VBK4OUT<1.3 V 25
1.3 V≤ VBK4OUT<1.5 V 50 mV
Input leakage
IBUCK4IN_LKG BUCK OFF 1 µA
current
IBK4OUT=250 mA, TA = +25 °C 90
Recovery time
tLP-HP-BK4 from LP to HP VOUT4_LP = VOUT4_HP 20 µs
mode
Startup delay
(delay before 2.8 V<VBUCK4IN<5.5 V, refer to Figure 16. Buck4
tSU_BK4 0.05 0.5 1 ms
voltage starts to load transient in LP mode.
rise)
2.8 V<VBUCK4IN<5.5 V, 1 mA<IBK4OUT<100 mA,
tSS_BK4 Soft-start duration VOUT4 = 1.2 V, refer to Figure 46. BUCKx start-up/ 235 400 µs
shutdown timings
Slew rate during start-up 5.5 mV/µs
Output voltage
SRBK4 DVS slew rate of a voltage programmed change
slew rate 1.9 3.1 mV/µs
low to high or high to low, from 0.8 V to 1.2 V
From VOUT4 = 1.2 V to VOUT4<0.2 V, VIN=3.6 V,
COUT = 22 µF
Shutdown
tSD_BK4 ms
duration Slow PD, IBK4OUT<1 mA 1.5
Boost converter
VIN = 3.6 V, VBSTOUT = 5.2 V, TA = 25 °C, Tj = -40 °C to +125 °C, recommended BOM, unless otherwise specified
Main input
VIN 2.8 5.5 V
voltage range
2.8 V<VBSTOUT<5.2 V, boost mode 5.2
Output voltage
VOUT V
range 5.2 V<VBSTOUT<5.5 V, bypass mode ~VBOOSTIN
Overvoltage
VBSTOVP 5.5 5.7 5.85 V
threshold
Continuous
IBSTOUT_HI 3.3 V<VBSTIN<5.5 V 1.1 A
output current
Continuous
IBSTOUT_LO 2.8 V<VBSTIN<3.3 V 0.5 A
output current
Output leakage
IBSTOUT_LKG BSTOUT, boost OFF, pull-down disabled 1 µA
current
Inductor peak
IBSTLIM 3.3 A
current limit LS
Short-circuit
IBSTSH 4 A
threshold HS
IQ Quiescent current IBSTOUT=0 mA 600 900 µA
IBSTOUT=100 mA, TA = 25 °C 89
EFFBST Efficiency IBSTOUT=500 mA, TA = 25 °C 89 %
IBSTOUT=1100 mA, TA = 25 °C 82
Bypass switch
RDSON-BYP IBSTOUT=300 mA, VIN = 5.3 V 115 mΩ
ON-resistance
PWR_USB_SW switch
VBSTOUT=5.2 V, Tj = -40 °C to +125 °C, recommended BOM, unless otherwise specified
Switch ON-
RDSON-VBUSOTG IVBUSOTG=300 mA 145 250 mΩ
resistance
Continuous
IVBUSOTG 0.5 mA
output current
IVBUSOTGOCP Overcurrent limit 0.55 A
Short-circuit
IVBUSOTG_SH 1.1 A
threshold
Soft-on/off
tSS_VBUSOTG 3 ms
duration
VBUSOTG det.
tVBUSOTGDB 30 ms
debounce time
VBUSOTG rise
VVBUSOTG_Rise 3.6 3.8 4.0 V
threshold
VBUSOTG fall
VVBUSOTG_Fall 2.0 2.2 2.4 V
threshold
PWR_SW switch
VSWIN = 5.2 V, Tj = -40 °C to +125 °C, recommended BOM, unless otherwise specified
Switch ON-
RDSON-SWOUT ISWOUT=300 mA 100 200 mΩ
resistance
Continuous
ISWOUT 1 A
output current
OCP_SWOUT_LIM = 0 0.6 A
ISWOUTOCP Overcurrent limit
OCP_SWOUT_LIM = 1 1.1 A
Short-circuit
ISWOUT_SH 1.1 A
threshold
Soft-on/off
tSS_SWOUT 3 ms
duration
SWOUT rise
VSWOUT_Rise 40 50 60 % VIN
threshold
SWOUT fall
VSWOUT_Fall 30 40 50 % VIN
threshold
SWOUT det.
tSWOUTDB 30 ms
debounce time
SWIN rise
VSWIN_Rise 2.75 2.92 3.00 V
threshold
SWIN fall
VSWIN_Fall 2.5 2.65 2.8 V
threshold
SWIN det.
tSWINDB 30 ms
debounce time
SWIN OCP
tOCPDBSW 2 µs
debounce time
Digital interface
VIO input voltage
VIO 1.7 1.8 3.6 V
for IO signal
PONKEYn input 0.3x
internal VIN pull-up on pin 0
low voltage VIN
WAKEUP input
internal VIO pull-down on pin 0.3 0.8
low voltage
0.3x
internal VIO pull-up on pin 0
PWRCTRL input VIO
VIL V
low voltage 0.3x
internal VIO pull-down on pin 0
VIO
RSTn input low 0.3x
internal VIO pull-up on pin 0
voltage VIO
VOH SDA, SCL output I2C NXP UM10204 revision 5 compliant (October V
high voltage 2012)
WAKEUP pin
Internally connected to GND 45 60 80
pull-down resistor
RPD
PWRCTRL pin
Internally connected to GND 60 90 140
pull-down resistor
PONKEYn pin
Internally connected to VIN 90 120 140
pull-up resistor
kΩ
PWRCTRL pin
Internally connected to Vio 50 80 120
pull-up resistor
RPU
RSTn pin pull-up
Internally connected to Vio 50 80 120
resistor
INTn pin pull-up
Internally connected to Vio 50 80 120
resistor
PONKEYn
PONKEYnDB 30 ms
debounce time
WAKEUP
WAKEUPDB 2 µs
debounce time
RSTn assertion
RSTnDB 20 µs
time
1. Dropout is the smallest difference between a regulator’s input and its output voltage, which is required to
maintain regulation and enable the regulator to provide rated voltage and current
2. VIN is intended to be higher than VOUT
EFFICIENCY [%]
70
60
EFFICIENCY [%]
60
50
50
40
40
30
30
20
20
10 10
0 0
0.00001 0.0001 0.001 0.01 0.1 1 0.00001 0.0001 0.001 Load [A] 0.01 0.1 1
Load [A]
1.2Vout 5Vin LP 1.2Vout 3.6Vin LP 1.2Vout 3.6Vin HP 1.2Vout 5Vin HP 1.2Vout 5Vin LP 1.2Vout 3.6Vin LP 1.35Vout 5Vin LP 1.2Vout 3.6Vin HP 1.2Vout 5Vin HP 1.35Vout 5Vin HP
90 100
80 90
80
70
EFFICIENCY [%]
70
60
EFFICIENCY [%]
60
50
50
40 40
30 30
20 20
10
10
0
0 0.00001 0.0001 0.001 0.01 0.1 1
Load [A]
0.00001 0.0001 0.001 0.01 0.1 1
Load [A] 1.2Vout 5Vin LP 1.2Vout 3.6Vin LP 3.3Vout 5Vin LP 1.8Vout 3.6Vin LP 1.2Vout 3.6Vin HP 1.8Vout 3.6Vin HP 1.2Vout 5Vin HP 3.3V 5Vin HP
1.8Vout 5Vin LP 1.8Vout 3.6Vin LP 3.3Vout 5Vin LP 1.8Vout 5Vin HP 3.3Vout 5Vin HP 1.8Vout 3.6Vin HP
90%
80%
70%
Efficiency [%]
60%
VIN = 3V
50% VIN = 3.6V
VIN = 5V
40% VIN = 5.5V
30%
20%
10%
0%
1 10 Load [mA] 100 1000
Figure 9. BUCK1 load transient in HP mode Figure 10. Buck1 load transient in LP mode
Figure 11. BUCK2 load transient in HP mode Figure 12. Buck2 load transient in LP mode
Figure 13. Buck3 load transient in HP mode Figure 14. Buck3 load transient in LP mode
Figure 15. Buck4 load transient in HP mode Figure 16. Buck4 load transient in LP mode
Figure 17. LDO1 load transient Figure 18. LDO2 load transient
Figure 19. LDO3 load transient Figure 20. LDO4 load transient
Figure 21. LDO5 load transient Figure 22. LDO6 load transient
Figure 23. LDO4 line transient Figure 24. Boost output vs. input voltage
Figure 25. Boost load regulation 5 VIN Figure 26. Boost load regulation 3.6 VIN
Figure 27. LDO1 line transient, no load Figure 28. LDO2 line transient, no load
Figure 29. LDO3 line transient, no load Figure 30. LDO5 line transient, no load
Figure 33. Buck1 turn-ON waveform Figure 34. STPMIC1A POWER_UP sequencing
Figure 35. STPMIC1A POWER_UP sequencing PONKEYn Figure 36. STPMIC1A POWER_DOWN sequencing
4.1 Overview
The STPMIC1 has a large input voltage range from 2.8 V to 5.5 V to supply applications from typically 5 V DC
wall-adaptor or from 1-cell 3.6 V Li-Ion / Li-PO battery or from USB port (bus-powered).
The STPMIC1 provides all regulators needed to power supply a complete application:
• 6 LDOs + 1 reference voltage LDO for DDR memories
• 4 step-down (buck) converters
• 1 step-up (boost) converter with a bypass to supply USB sub-system
• 2 power switches to supply USB sub-system
Rated output
Regulator Output voltage (V) Programming step(mV) Application use (example)
current (mA)
LDO1, LDO2, LDO5, LDO6 are general purpose (GP) LDO (low-dropout) linear regulators and can be used to
supply application peripherals.
LDO3 is a multipurpose linear regulator that supports 3 modes:
• Normal mode: operates as standard LDO with 1.7 to 3.3 V output voltage range (for general purpose use)
• Sink/source mode: LDO3 operates in sink/source regulation mode to supply termination resistors of DDR3/
DDR3L memory interface (VTT voltage)
• Bypass mode: LDO3 operates as a simple power switch to supply lpDDR2/3 VDD1 (1.8 V) power domain.
In that case, LDO3IN is supplied by 1.8 V. This is a preferred mode versus normal mode in term of power
efficiency to power supply lpDDR2/3 VDD1
LDO4 is a fixed output voltage (3.3 V) LDO and it is dedicated to power supply host processor USB PHY. It is able
to automatically switch among 3 power inputs (VIN, VBUSOTG and BSTOUT) to provide a valid output voltage in
all application use cases, for example to support a discharged battery for Li-Ion/Li-PO battery-powered device.
DDR REF is sink/source reference voltage LDO dedicated to power VREF of lpDDR/DDR.
BUCK1 to BUCK4 are 2 MHz synchronous step-down converters optimized for high efficiency. To improve
transient response, converters use an adaptive constant on-time (COT) controller with a nominal switching
frequency of 2 MHz.
In low power (LP) mode, converters operate in hysteretic mode to minimize quiescent current and improve
efficiency while an excellent transient response is being kept.
Buck controller also supports a dynamic voltage scaling (DVS) capability with an active discharge (voltage
tracking) and a switching phase shifting pi/2 mutual synchronization between converters to reduce switching EMI
radiations.
BOOST is a fixed output voltage 5.2 V synchronous step-up converter dedicated to power supply USB ports
(PWR_USB_SW and/or PWR_SW power switches). In addition to support a step-up conversion for battery
applications (to convert VBAT=3.6 V to VBUS= 5.2 V), this boost converter has been enhanced with a special
bypass circuitry with smooth output voltage transitions to comply USB VBUS tolerance when the application is
powered by a 5 V wall adaptors. This is to compensate voltage tolerance of the voltage source (wall adaptor) and
voltage drop through the PCB from input supply of device to USB port.
PWR_USB_SW is a 500 mA power switch suitable for USB OTG port or USB Type-C DRD. Input is internally
connected to BOOST output. It supports VBUS detection, OCP and the reverse current protection.
PWR_SW is a 1000 mA power switch, that can supply max. 2 USB STD HOST port.
VOUT[4:0]
VOUT[V] VOUT[V] VOUT[V] VOUT[V] VOUT[V]
LDOx_MAIN/
LDO1 LDO2 LDO3 LDO5 LDO6
ALT_CR[6:2]
VOUT[4:0]
VOUT[V] VOUT[V] VOUT[V] VOUT[V] VOUT[V]
LDOx_MAIN/
LDO1 LDO2 LDO3 LDO5 LDO6
ALT_CR[6:2]
The example in Figure 39. Powering lpDDR2/lpDDR3 memory (LDO3 in bypass mode) shows how to use LDO3
in bypass mode to power supply lpDDR2/3 VDD1 (1.8 V) power domain. LDO3IN is supplied by 1.8 V power
source that is usually from BUCK3 output when BUCK3 is set at 1.8 V to power supply the application processor
VIO power domain. This topology reaches better power efficiency than next example in Figure 40. Powering
lpDDR2/lpDDR3 memory (LDO3 normal mode supplied from VIN).
Figure 40. Powering lpDDR2/lpDDR3 memory (LDO3 normal mode supplied from VIN)
The example in Figure 40. Powering lpDDR2/lpDDR3 memory (LDO3 normal mode supplied from VIN) shows
how to use LDO3 in normal mode to power supply lpDDR2/3 VDD1 (1.8V) power domain. LDO3IN is supplied by
a power source having higher voltage than LDO3OUT (VIN in this example). This topology is suitable for those
applications which do not have 1.8 V power source available from a buck converter.
The example in Figure 41. Powering DDR3/DDR3L memory (LDO3 in sink/source mode) shows how to use LDO3
in sink/source mode to power supply termination resistor network of DDR3/DDR3L memory (aka VTT). LDO3IN is
a power supply from BUCK2 output (VOUT2) and LDO3 output regulate at Vout2/2 voltage.
Clock synchronization (HP mode)– buck controller integrates phase locked loop (PLL) circuit, that maintains
steady-state frequency in CCM phase-locked to reference 2 MHz clock generated by internal oscillator. Each
buck has its own reference clock that is shifted from master clock by 90 degree, which minimizes the chance of
multiple controllers switching at the same time, and improving EMI performance. Refer to Figure 43. PWM clock
synchronisation .
Voltage accuracy (HP mode)- COT controllers are well-known for their excellent transient response but standard
implementations usually suffer from a high output load regulation error. To cope with this problem, the STPMIC1
adaptive COT controller also integrates an ACCU loop circuit that fixes the parameters of controller in order to
reach the maximum possible accuracy of output voltage for all operating conditions. Refer to Figure 44. Buck
block diagram.
Light low power consumption (HP mode)– To minimize power consumption in low load conditions PFM mode
is implemented. Switching between PFM and PWM mode is smooth, fully automatic, and requires no user
intervention.
Low power mode (LP mode) – If the application remains in low load conditions for longer time, the converter can
be switched to LP mode and minimize quiescent consumption to IQ_ BK_LP. In LP mode, the controller works in
hysteretic PFM mode, and has the following features:
1. Maximum DC current capability is lower, specified by IOUT. However, also in LP mode, converter is able to
handle peak current load of up to IOUT_LP_PEAK but transient response and accuracy are not guaranteed.
2. ACCU loop is disabled, which results in a lower VOUT accuracy specified by VOUT1-ACC
3. PLL is disabled. Converter is in PFM mode, which means pulses are not synced to reference clock
To guarantee the best performance, it is recommended LP mode to be entered only when output load is
below IOUTMAX_LP, LP mode can be entered by setting PREG_MODE bit Table 38. BUCKx_MAIN_CR or
Table 43. BUCKx_ALT_CR registers.
Exit from LP mode - It is recommended that application processor switches from LP mode to HP mode before
it applies full rated load exceeding maximum LP current IOUT_LP. This time is defined as minimum LP to HP
recovery time tLP-HP-BKIf load is increased before this time, buck converter stays in regulation but transient or
accuracy specification may not be guaranteed. Refer to Figure 45. BUCKx LP to HP mode recovery time.
Note: During POWER_UP sequence, buck is always started in HP mode, with default VOUT configuration defined in
NVM_BUCKx_VOUT[1:0] bits of Table 69. NVM_BUCKS_VOUT_SHR register.
Enable/disable - BUCK can be enabled or disabled:
1. Automatically during POWER_UP/POWER_DOWN state as described in Section 5.3 POWER_UP,
POWER_DOWN sequence
2. Manually by setting ENA bit in corresponding Table 38. BUCKx_MAIN_CR or Table 43. BUCKx_ALT_CR
registers
VOUT setting – BUCK output voltage can be set:
1. Automatically during POWER_UP/POWER_DOWN state as described in Section 5.3 POWER_UP,
POWER_DOWN sequence
Default voltage is selected in BUCKx_VOUT[1:0] bits of Table 69. NVM_BUCKS_VOUT_SHR register.
2. Automatically during MAIN/ALTERNATE mode change by toggling PWRCTRL pin as defined in VOUT[5:0]
field in corresponding Table 38. BUCKx_MAIN_CR or Table 43. BUCKx_ALT_CR registers.
3. Manually by setting VOUT[5:0] field of Table 38. BUCKx_MAIN_CR or Table 43. BUCKx_ALT_CR registers.
0 0.725 1 1 0.6(1)
1 0.725 1 1 0.625(1)
2 0.725 1 1 0.65(1)
3 0.725 1 1 0.675(1)
4 0.725 1 1 0.7(1)
5 0.725(1) 1 1 0.725(1)
6 0.75(1) 1 1 0.75(1)
7 0.775(1) 1 1 0.775(1)
8 0.8(1) 1 1 0.8(1)
9 0.825(1) 1 1 0.825(1)
10 0.85(1) 1 1 0.85(1)
11 0.875(1) 1 1 0.875(1)
12 0.9(1) 1 1 0.9(1)
13 0.925(1) 1 1 0.925(1)
14 0.95(1) 1 1 0.95(1)
15 0.975(1) 1 1 0.975(1)
16 1(1) 1 1 1(1)
1. Step 25 mV
2. Step 50 mV
3. Step 100 mV
Enable/disable – Boost can be enabled in POWER_ON state only by I2C setting of BST_ON bit in BST_SW_CR
register.
Boost can be disabled by I2C clearing BST_ON bit.
Boost is also disabled during POWER_DOWN sequence in RANK0 slot and when overcurrent or overvoltage
condition is present for defined time.
Output discharge – When boost is switched off (BST_ON bit = ‘0’), switching stops immediately and a passive
discharge, enabled on BSTOUT by default, occurs.
Output discharge can be disabled by setting BST_PDbit in Table 29. LDO56_VREF_PD_CR register.
Overvoltage protection – Boost converter has an overvoltage protection. If voltage on BSTOUT pin exceeds
VBSTOVP threshold, LXB pin stops switching immediately, and remains in high impedance state. If the overvoltage
condition lasts for more than tOVPDB_BST, boost is disabled, and BST_OVP interrupt is generated.
OVP event on BSTOUT also disables switches PWR_USB_SW and PWR_SW (if NVM_SWOUT_BOOST_OVP
is set in Table 70. NVM_LDOS_VOUT_SHR1).
Overcurrent protection – Boost implements low-side current sensor with peak current detector (IBSTLIM), and
high-side current sensor with short-circuit detector, (IBSTSH). If the overcurrent condition during HS phase lasts for
more than tOCPDB_BST, boost is disabled, and BST_OCP interrupt is generated.
Start-up sequence Boost start-up sequence consists of 2 phases:
• Precharge phase - in this phase, bypass switch operates in “constant current source” mode and charges
boost output capacitor with constant IPRECH_BST current for tPRECH_BST duration. After this time, boost
output voltage is checked. If VBSTOUT > VPRECH =~ (VIN – 0.7 V), boost starts switching and proceeds to
soft-start phase, besides boost is immediately turned off and BST_OCP interrupt is generated
Note: Boost load during precharge phase must be minimized, from this reason it is necessary to enable
PWR_USB_SW and PWR_SW after the boost soft-start is finished.
• Soft-start phase – in this phase boost switches, the inrush current minimizes. Soft-start duration is tSS_BST
Enable/disable – PWR_USB_SW can be enabled in POWER_ON state by I2C setting of VBUSOTG_ON bit
in Table 48. BST_SW_CR register. PWR_USB_SW switch cannot be enabled automatically during power-up
sequence. During power-down sequence, switch is turned OFF in RANK0 phase.
It is recommended that PWR_USB_SW is enabled only after boost converter works in steady-state (after boost
start-up sequence). This is typically ~2 ms after boost is enabled. Nevertheless, if PWR_USB_SW is enabled
earlier than Boost, it turns ON only when both boost is enabled by BST_ON bit and BSTOUT voltage is higher
than ~VIN.
Boost OVP – When boost OVP is detected PWR_USB_SW is disabled automatically.
VBUSOTG pin monitoring – When PWR_USB_SW is OFF, VBUSOTG voltage is monitored by VBUSOTG det.
to detect VBUS voltage rising/falling from USB OTG connector due to USB cable insertion/removal.
When voltage on VVBUSOTG pin goes higher than VVBUSOTG_Rise threshold, the interrupt and/or turn-ON condition
is generated. When voltage on VBUSOTG pin goes below than VVBUSOTG_Fall threshold, the interrupt is
generated. VBUSOTG pin monitoring is filtered by tVBUSOTGDB debounce timer for both rising and falling
voltage. VBUSOTG detector is enabled by default and can be disabled by setting VBUSOTG_DET_DIS bit
Table 48. BST_SW_CR register.
Soft-on/off –Switch implements soft-on, soft-off circuit. After the switch is enabled, switch starts operating in
“current limiting” mode, gradually increasing the output current limit until the switch is fully turned ON. This soft-on
phase has a duration defined by tSS_VBUSOTG.
The same mechanism is also applied during switch soft-off phase during turn-off to prevent quick unloading of
BSTOUT and excessive voltage overshoot.
Overcurrent limitation – Switch implements 2 levels of overcurrent protection:
1. When load on the output exceeds overcurrent limit threshold IVBUSOTGOCP, switch starts limiting the output
voltage to decrease output current. If the switch stays in this condition for more than tOCPDBSW, switch is
automatically turned OFF, and VBUSOTG_OCP interrupt generated.
2. In case the output load exceeds IVBUSOTG_SH threshold, switch turns OFF immediately to prevent
boost overload, and VBUSOTG_SH interrupt is generated. Shortly after this action, switch is re-enabled
automatically with standard soft-on current limiting procedure. In case the overload condition is still present,
the switch continues operation in current limiting mode, and is finally switched OFF after tOCPDBSW. In case
overload condition is removed before tOCPDBSW, switch continues its normal operation.
For detailed behavior of the device on OCP event refer to Section 5.4.7 Overcurrent protection (OCP).
Output discharge – Switch implements passive discharge circuit (by default disabled) that can be enabled by
setting VBUSOTG_PD bit in Table 48. BST_SW_CR.
PWR_SW is a configurable 500 mA/1000 mA power switch that can be used to power supply one or two USB
host ports or for general purpose.
It has dedicated the input SWIN and the output SWOUT pin.
Minimum SWIN voltage to enable the switch is VSWIN_Rise.
PWR_SW pin is a switch without reverse current protection. If voltage on SWOUT is higher than SWIN-0.7 V, a
leakage from SWOUT to SWIN occurs even if the switch is OFF.
Enable/disable – PWR_SW can be enabled in POWER_ON state by I2C setting of SWOUT_ON bit in
Table 48. BST_SW_CR. PWR_SW switch cannot be enabled automatically during power-up sequence. During
power-down sequence, switch is automatically turned OFF in RANK0 phase.
PWR_SW turns ON only when SWIN voltage is higher than VSWIN_Rise threshold.
If the switch is supplied by boost, it is recommended to enable the switch after boost is already in steady-state
with 5.2 V output. This is typically ~2 ms after boost is enabled.
Boost OVP – When boost OVP is detected, switch is ON by default. It is disabled automatically only if
NVM_SWOUT_BOOST_OVP bit is set.
SWOUT pin monitoring – When PWR_SW is OFF, SWOUT voltage is monitored by SWOUT detector.
When VSWOUT > VSWOUT_Rise, interrupt and turn-ON condition is generated. SWOUT detector is enabled by
default and can be disabled by setting SWOUT_DET_DIS bit in Table 30. SW_VIN_CR.
tSWOUTDB debounce timer is on SWOUT detector output.
SWIN pin monitoring – SWIN detector is disabled by default and can be enabled to monitor the voltage on SWIN
pin by setting SWIN_DET_EN bit in Table 48. BST_SW_CR.
When VSWIN > VSWIN_Rise, interrupt is generated.
Figure 50. Battery powered application with a USB OTG port and a USB host port
On this example, a battery supplies the boost converter. When enabled, the boost converter generates a 5.2 V on
BSTOUT.
PWR_USB_SW output (VBUSOTG) is connected, in this example, to a USB Type-μAB connector (OTG). It can
alternatively be connected to a USB Type-C connector.
PWR_SW output (SWOUT) is connected, in this example, to a USB Type-A connector (USB host only). PWR_SW
input (SWIN) is connected to the output of boost converter (BSTOUT).
Figure 51. Battery powered application with a single USB OTG port
On this example, a battery supplies a boost converter. When enabled, the boost converter generates a 5.2 V on
BSTOUT.
PWR_USB_SW output (VBUSOTG) is connected, in this example, to a USB Type-μAB connector (OTG). It can
alternatively be connected to a USB Type-C connector.
PWR_SW can be used as general purpose power switch in the application. Note that PWR_SW is functional
when SWIN is powered by VSWIN_Rise to 5.5 V.
Figure 52. 5 V DC powered application with a USB OTG port and two USB host ports
In this example, the application is powered by a 5 V DC power source (eg: from 5 V AC/DC wall adaptor) and it
supplies a boost converter. When enabled, the boost converter generates a 5.2 V on BSTOUT.
PWR_USB_SW output (VBUSOTG) is connected, in this example, to a USB Type-μAB connector (OTG). It can
alternatively be connected to a USB Type-C connector.
PWR_SW output (SWOUT) is connected, in this example, to one or two USB Type-A connectors (USB host only).
PWR_SW input (SWIN) is connected to the output of the boost converter (BSTOUT).
In this example, the boost is used to regulate VBUS voltage at 5.2 V (to be compatible with USB specification
voltage range [4.75 V;5.5 V]) to compensate the power supply voltage losses (power supply voltage tolerance and
load regulation lose on the printed circuit board).
5 Functional description
5.1 Overview
The STPMIC1 integrates advanced low power features controlled by the application processor through I²C, 4
digital control pins (PONKEYn, WAKEUP, PWRCTRL and RSTn) and one interrupt output line (INTn).
The main parameter settings can be programmed in a non-volatile memory (NVM) as default values at start-up
time.
See Section 5.5.2 Non-volatile memory (NVM)
The STPMIC1 offers 2 independent POWER_ON modes called MAIN and ALTERNATE. Switching between these
modes is driven by the application processor through PWRCTRL pin.
This allow a flexible configuration and fast transition between two different power strategies at application level,
typically RUN and STANDBY (LowPower).
Other features are provided to fulfill high-end application processors and advanced operating system needs:
• Multiple turn-on/turn-off conditions
• mask_default and restart_request options
• Overcurrent and overvoltage protection
• Thermal protection
• Watchdog
• Interrupt controller
Enable Buck2
Turn_ON condition Turn_OFF condition
by I²C
6.7ms 3 ms 3 ms 3 ms 100 µs 3 ms 3 ms 3 ms 3 ms
RSTn
BUCK3 (Rank1)
ENA bit
BUCK1 (Rank2)
ENA bit
LDO4 (Rank3)
ENA bit
BUCK2 (Rank0)
ENA bit
POWER_UP
The STPMIC1 enables regulators sequentially by 3 ms slots:
RANK1 (BUCK3) -> RANK2 (BUCK1) -> RANK3 (LDO4) regulators, this sequence example is related to the
STPMIC1.
RANK0 regulators (eg BUCK2) are not started.
RSTn is asserted by the STPMIC1 until all regulators on. Then it deasserts RSTn and switches to POWER_ON
as soon as RSTn is deasserted by the application processor (RSTn signal goes high).
POWER_ON:
Regulator state and output voltage are driven by settings to registers MAIN or ALTERNATE control registers.
Those registers are by default initialized with values programmed in NVM and can then be changed through I²C.
In the example, BUCK2 (RANK0) is enabled by I²C.
POWER_DOWN:
The STPMIC1 asserts RSTn and immediately shutdowns RANK0 regulators which may have been started by
software. (BUCK2 in upon example).
Then it disables regulators sequentially in rank reverse order by 3 ms slots:
RANK3 (LDO4) -> RANK2 (BUCK1) -> RANK1 (BUCK3)
The example above shows POWER_UP and POWER_DOWN procedure from digital point of view (ENA bit of
each regulators); but not their respective output voltage (analog).
Regarding to analog behavior of each regulator, please refer to Section 4 Power regulators and switch
description.
VINLOW_Fall
VINLOW_HYST
VINLOW_Rise
VINOK_Rise (NVM)
VINOK_HYST(NVM) VINLOW_TRESH
VINOK_Fall
VIN_POR_Rise
200mv
VIN_POR_Fall
VIN
POR_VIN
POR_VIN is the minimum voltage required to supply the STPMIC1 internal circuitry. It is specified by two
hardcoded thresholds with 200 mv hysteresis:
• Below VIN_POR_Fall STPMIC1 is considered as not supplied
• Above VIN_POR_Rise STPMIC1 internal circuitry is functional
Refer to Section 3.4 Electrical and timing parameters for threshold value.
VIN_OK
VIN_OK is the minimal voltage required to allow the STPMIC1 to work in POWER_ON state.
It is specified by VINOK_Rise threshold and VINOK_HYST hysteresis values that can be adjusted in NVM,
respectively by VINOK_TRESH[1:0] and VINOK_HYS[1:0] bits in Table 65. NVM_MAIN_CTRL_SHR.
• If VIN falls below VINOK_Fall (VINOK_Fall = VINOK_Rise – VINOK_HYST) then it is considered as a turn-OFF
condition and the STPMIC1 immediately starts POWER_DOWN sequence. Refer to Section 5.4.3 Turn-
OFF conditions and restart_request.
• If VIN rises above VINOK_Rise then the STPMIC1 is allowed to go to POWER_ON state after a turn-ON
condition has occurred. Refer to Section 5.4.2 Turn-ON conditions
VINLOW
VINLOW is an optional and configurable software threshold that can be setup to notify the application processor
through interrupt, that a power shutdown, due to VIN going low, is a possible risk.
VINLOW can be enabled and configured by programming register Section 6.3.6 PWR_SWOUT and VIN control
register (SW_VIN_CR).
VINLOW rising and falling thresholds are defined by a logical signal point of view. VINLOW signal goes to ‘1’
(rising edge) when VIN decreases VINLOW_Rise threshold. VINLOW falling edge occurs when VIN goes above
VINLOW_Fall threshold.
VINLOW_Rise and VINLOW_Fall detection generate respectively VINLOW_RI and VINLOW_FA interrupt in
INT_PENDING_R4, allowing application processor to take relevant actions. They can be unmasked
independently.
Refer to Section 6.5 Interrupt registers.
VINOK_Rise
VIN_POR_Rise
PRE CHECK&
NO_SUPPLY POWER_UP POWER_ON
LOAD LOAD
>7 ms
RSTn
AUTO_TURN_ON=1
PONKEY/VBUS/WAKEUP detection
Those 3 conditions depend on stimulation on the specific STPMIC1 pins. The source and electrical characteristics
of each condition are described in Table 11. Turn-on description.
Turn-ON
Active condition
Name condition Configuration Debounce Interrupt
description
source
PONKEYn PKEY_RI/PKEY_FA in
PONKEY N/A Active low 30 ms
pin INT_PENDING_R1
Can be disable by VBUSOTG_RI/
VBUS VBUSOTG VBUSOTG >
settingVBUSOTG_DET_DIS bit 30 ms VBUSOTG_FA in
(VBUSOTG) pin VBUSOTG_Rise
in Table 48. BST_SW_CR INT_PENDING_R1
Can be disable by setting SWOUT_RI/
VBUS SWOUT >
SWOUT pin SWOUT_DET_DIS bit in 30 ms SWOUT_FA in
(SWOUT) SWOUT_Rise
Table 30. SW_VIN_CR INT_PENDING_R1
WKP_RI/WKP_FA
No
WAKEUP WAKEUP pin N/A Active high in
debounce
INT_PENDING_R1
The STPMIC1 manages 2 different scenarios depending if the turn-ON condition is active before or after VIN rises
above VIN_POR_Rise.
Active Turn-ON condition after VIN rises above VIN_POR_Rise sequence is presented in Figure 57. Turn-on
condition after VIN_POR_RISE.
t1: VIN rises above VIN_POR_Rise while no turn-ON condition is detected active. The STPMIC1 performs the
PRELOAD_NVM and swiches to OFF-state.
t2: the STPMIC1 starts detecting the activity on turn-ON condition but the detection threshold above is not stable.
t3: turn-ON signal has been detected stable longer than debounce time. Turn-ON event triggered. Switch to
CHECK&LOAD then POWER_UP as VIN > VINOK_Rise.
t3 to t4: turn-ON conditions are ignored from CHECK&LOAD to POWER_ON.
t4: turn-ON condition is ignored and does not affect the usual STPMIC1 behavior in POWER_ON. (Except
PONKEY long key press. See Section 5.4.3 Turn-OFF conditions and restart_request). Active turn-ON signal
does not prevent from POWER_DOWN.
t5: active turn-OFF condition event occurs from a valid source. Switch to POWER_DOWN.
t5 to t6: active turn-ON during POWER_DOWN is ignored.
t7: New turn-ON signal rising edge has been detected after debounce time. A valid turn-ON condition is detected.
The STPMIC1 switches to POWER_UP.
Active turn-ON condition before VIN rises above VIN_POR_Rise sequence is presented in Figure 58. Turn-on
condition before VIN_POR_Rise .
t1: VIN rises above VIN_POR_RISE while a turn-ON condition is detected active. The STPMIC1 performs the
PRELOAD_NVM and swiches to OFF-state.
t2: the STPMIC1 starts debounce as soon as it is entered OFF-state.
t3: turn-ON condition is confirmed after debounce time. Switch to CHECK&LOAD then POWER_UP as VIN >
VINOK_Rise.
t3 to t4: turn-ON conditions are ignored from CHECK&LOAD to POWER_ON.
t4: turn-ON condition is ignored and does not affect usual STPMIC1 behavior in POWER_ON. (Except PONKEY
long key press. See Section 5.4.3 Turn-OFF conditions and restart_request)
Active turn-ON signal does not prevent from POWER_DOWN.
t5: active turn-OFF condition event occurs from a valid source. Switch to POWER_DOWN.
t5 to t6: Active turn-ON during POWER_DOWN is ignored.
t7: New turn-ON signal rising edge has been detected after debounce time. Valid turn-ON condition detected. The
STPMIC1 switches to POWER_UP.
Power cycle if
Name Conditions
RREQ_EN=1
Software switch-
Writing 1 to SWOFF bit in Table 25. MAIN_CR register YES
OFF
PONKEYn long
PKEYLKP bit set in Table 31. PKEY_TURNOFF_CR YES
key press
Power cycle if
Name Conditions
RREQ_EN=1
Default value loaded by PKEYLKP_OFF bit in
Table 65. NVM_MAIN_CTRL_SHR
Request duration for the long key press defined in PKEY_LKP_TMR[3:0] in
Table 31. PKEY_TURNOFF_CR
PONKEYn signal is asserted for a duration > PKEY_LKP_TMR[3:0]
STPMIC1 always restart
STPMIC1 functional temperature is exceeded. Refer to
Thermal shutdown automatically whatever
Section 5.4.6 Thermal protection
restart_request option.
Overcurrent STPMIC1 detects overcurrent on a regulator. Refer to
NO
protection Section 5.4.7 Overcurrent protection (OCP)
Watchdog feature active and downcounter reach 0. Refer to
Watchdog YES
Section 5.4.9 Watchdog feature
VIN falls down under VIN_OK_Fall threshold.
YES only if VIN remains
VIN_OK_Fall Depending on VIN decrease speed, proper execution of POWER_DOWN above POR_VIN_Fall
operation is not guaranteed
In case reset happens in ALTERNATE mode, VOUT, ENA and PREG_MODE switch to content of the
[regulator]_MAIN_CR register values.
Figure 59. Reset power-cycle sequence below shows an example of a reset power-cycle on the STPMIC1.
RSTn
BUCK3 (Rank1)
mask_reset
BUCK1 (Rank2)
LDO4 (Rank3)
BUCK2 (Rank0)
27,8ms
ENA=1 ENA=1
BUCKx_MAIN_CR=0x61
BUCKz(z=1..4) VOUT=1.2 V, VOUT=0.9 V
BUCKx_ALT_CR=0x33
PREG_MODE=HP PREG_MODE=LP
ENA=1 ENA=0,
BUCKy_MAIN_CR=0xD9
BUCKy(y=1..4) VOUT=3.3 V VOUT=3.3 V
BUCKy_ALT_CR=0xD8(or 0x00)
PREG_MODE=HP PREG_MODE=HP
ENA=1 ENA=0 LDOx_MAIN_CR=0x27
LDOx(x=1,2,5,6)
VOUT=1.8 VOUT=1.8 LDOx_ALT_CR=0x26 (or 0x00)
POWER_ON
MAIN MODE ALTERNATE MODE MAIN MODE
PWRCTRL
VOUTy (Buck y)
0.2 V
0V
tSD (LDO x) tSS = ΔVLDOxOUT x SR(LDO X)
1.8 V
Figure 61. Thermal protection thresholds represents the distribution of those thresholds along the temperature
curve.
When the temperature rises above TSHDN_Rise, the STPMIC1 starts a rank down and goes to CHECK&LOAD
state.
If temperature decreases and comes back lower than TSHDN_Fall, the STPMIC1 restarts automatically with
POWER_UP sequence.
In order to allow the application processor to anticipate TSHDN_Rise shutdown and take relevant actions, interrupts
THW_RI and THW_FA are generated when the temperature rises above TWRN_Rise and falls down TWRN_Fall.
Refer to Section 6.5 Interrupt registers about the interruption management.
TSHDN_Rise
TWRN_Rise TSHDN_Fall
TWRN_Fall
T°
THW_RI Interrupt THW_FA Interrupt
5.5 Programming
b7 b6 b5 b4 b3 b2 b1 b0
Read/write operation
Each transaction is composed of a start condition followed by a number of packet number (8-bit long)
representing either a device ID plus R/W command or register address or register data coming to/from slave
Table 15. Device ID format. An acknowledgment is needed after each packet. This acknowledgment is given
by the receiver of the packet. Transaction examples are given in Table 16. Register address format and
Table 17. Register data format. Multi read and multi write operations are supported.
b7 b6 b5 b4 b3 b2 b1 b0
b7 b6 b5 b4 b3 b2 b1 b0
6 Register description
@HE BITS[7:0]
Register name R/W Default
X 7 6 5 4 3 2 1 0
DS12792 - Rev 7
- - - AUTO SWOUT VBUS WKUP PKEY
01 TURN_ON_SR R 8’b000x_xxxx
0 0 0 x x x x x
- - PKEYLKP WDG OCP THSD VINOK_FA SWOFF
02 TURN_OFF_SR R 8’b000x_xxxx
0 0 x x x x x x
- - OCP_LDO6 OCP_LDO5 OCP_LDO4 OCP_LDO3 OCP_LDO2 OCP_LDO1
03 OCP_LDOS_SR R 8’b00xx_xxxx
0 0 x x x x x x
OCP_BOO OCP_BUCK OCP_BUCK OCP_BUCK OCP_BUCK
OCP_BUCKS_BS - OCP_SWOUT OCP_VBUSOTG
04 R 8’b00xx_xxxx ST 4 3 2 1
W_SR
0 0 x x x x x x
OP_MODE LDO4_IS[1:0] VINOK_FA PKEYLKP WDG SWOFF RST
05 RESTART_SR R 8’b000x_xxxx
0 0 0 x x x x x
MAJOR_VERSION[3:0] MINOR_VERSION[3:0]
06 VERSION_SR R 8’b0010_0000
0 0 1 0 0 0 0 1
PWRCTRL_ PWRCTRL_
- - - OCP_OFF_DBG RREQ_EN SWOFF
10 MAIN_CR R/W 8’b0000_0000 POL EN
0 0 0 0 0 0 0 0
PWRCTRL_ PWRCTRL_
- - - WKUP_EN WKUP_PD PKEY_PU
11 PADS_PULL_CR R/W 8’b0000_0000 PD PU
0 0 0 0 0 0 0 0
BUCK4_PD[1:0] BUCK3_PD[1:0] BUCK2_PD[1:0] BUCK1_PD[1:0]
12 BUCKS_PD_CR R/W 8’b0000_0000
0 0 0 0 0 0 0 0
LDO4_PD[1:0] LDO3_PD[1:0] LDO2_PD[1:0] LDO1_PD[1:0]
13 LDO14_PD_CR R/W 8’b0000_0000
0 0 0 0 0 0 0 0
page 63/140
User register map
STPMIC1
@HE BITS[7:0]
Register name R/W Default
X 7 6 5 4 3 2 1 0
DS12792 - Rev 7
18 R/W 8’b0000_0000
R
0 0 0 0 0 0 0 0
MRST_REF MRST_LDO MRST_LDO MRST_LDO MRST_LDO
- MRST_LDO6 MRST_LDO5
1A LDOS_MRST_CR R/W 8’b0000_0000 DDR 4 3 2 1
0 0 0 0 0 0 0 0
- - - - - - WDG_RST WDG_ENA
1B WDG_CR R/W 8’b0000_0000
0 0 0 0 0 0 0 0
WDG_TMR[7:0]
1C WDG_TMR_CR R/W 8’b0000_0000
0 0 0 0 0 0 0 0
OCPOFFB OCPOFFVBUSOT OCPOFFBU OCPOFFBU OCPOFFBU OCPOFFBU
BUCKS_OCPOFF_ - OCPOFFSWOUT
1D R/W 8’b0000_0000 OOST G CK4 CK3 CK2 CK1
CR
0 0 0 0 0 0 0 0
OCPOFFLD OCPOFFLD OCPOFFLD OCPOFFLD
LDOS_OCPOFF_C - - OCPOFFLDO6 OCPOFFLDO5
1E R/W 8’b0000_0000 O4 O3 O2 O1
R
0 0 0 0 0 0 0 0
PREG_MO
VOUT[5:0] ENA
20 BUCK1_MAIN_CR R/W 8’bxxxx_xx0x DE
x x x x x x 0 x
PREG_MO
VOUT[5:0] ENA
21 BUCK2_MAIN_CR R/W 8’bxxxx_xx0x DE
x x x x x x 0 x
PREG_MO
VOUT[5:0] ENA
22 BUCK3_MAIN_CR DE
R/W 8’bxxxx_xx0x
x x x x x x 0 x
PREG_MO
VOUT[5:0] ENA
23 BUCK4_MAIN_CR R/W 8’bxxxx_xx0x DE
x x x x x x 0 x
REFDDR_MAIN_C - - - - - - - ENA
24 R/W 8’b0000_000x
R 0 0 0 0 0 0 0 x
- VOUT[4:0] - ENA
25 LDO1_MAIN_CR R/W 8’b0xxx_xx0x
0 x x x x x 0 x
page 64/140
User register map
STPMIC1
@HE BITS[7:0]
Register name R/W Default
X 7 6 5 4 3 2 1 0
26 LDO2_MAIN_CR R/W 8’b0xxx_xx0x 0 0 0 0 0 0 0 x
DS12792 - Rev 7
BYPASS VOUT[4:0] - ENA
27 LDO3_MAIN_CR R/W 8’b0xxx_xx0x
0 0 0 0 0 0 0 x
SRC_BOOS
- - - SRC_VBUSOTG SRC_VIN - ENA
28 LDO4_MAIN_CR R/W 8’b0000_000x T
0 0 0 0 0 0 0 x
- VOUT[4:0] - ENA
29 LDO5_MAIN_CR R/W 8’b0xxx_xx0x
0 x x x x x 0 x
- VOUT[4:0] - ENA
2A LDO6_MAIN_CR R/W 8’b0xxx_xx0x
0 x x x x x 0 x
PREG_MO
VOUT[5:0] ENA
30 BUCK1_ALT_CR R/W 8’bxxxx_xx0x DE
x x x x x x 0 x
PREG_MO
VOUT[5:0] ENA
31 BUCK2_ALT_CR R/W 8’bxxxx_xx0x DE
x x x x x x 0 x
PREG_MO
VOUT[5:0] ENA
32 BUCK3_ALT_CR R/W 8’bxxxx_xx0x DE
x x x x x x 0 x
PREG_MO
VOUT[5:0] ENA
33 BUCK4_ALT_CR R/W 8’bxxxx_xx0x DE
x x x x x x 0 x
- - - - - - - ENA
34 REFDDR_ALT_CR R/W 8’b0000_000x
0 0 0 0 0 0 0 x
- VOUT[4:0] - ENA
35 LDO1_ALT_CR R/W 8’b0xxx_xx0x
0 x x x x x 0 x
- VOUT[4:0] - ENA
36 LDO2_ALT_CR R/W 8’b0xxx_xx0x
0 x x x x x 0 x
BYPASS VOUT[4:0] - ENA
37 LDO3_ALT_CR R/W 8’b0xxx_xx0x
0 x x x x x 0 x
SRC_BOOS
38 LDO4_ALT_CR R/W 8’b0000_000x - - - SRC_VBUSOTG SRC_VIN - ENA
T
page 65/140
User register map
STPMIC1
@HE BITS[7:0]
Register name R/W Default
X 7 6 5 4 3 2 1 0
38 LDO4_ALT_CR R/W 8’b0000_000x 0 0 0 0 0 0 0 x
DS12792 - Rev 7
- VOUT[4:0] - ENA
39 LDO5_MAIN_CR R/W 8’b0xxx_xx0x
0 x x x x x 0 x
- VOUT[4:0] - ENA
3A LDO6_MAIN_CR R/W 8’b0xxx_xx0x
0 x x x x x 0 x
BST_OVP_ VBUSOTG_ OCP_SWO SWOUT_O VBUSOTG_
SWOUT_PD VBUSOTG_PD BST_ON
40 BST_SW_CR R/W 8’b0000_000x DIS DET_DIS UT_LIM N ON
0 0 0 0 0 0 0 0
SWOUT_RI SWOUT_FA VBUSOTG_RI VBUSOTG_FA WKP_RI WKP_FA PKEY_RI PKEY_FA
50 INT_PENDING_R1 R 8’b0000_0000
0 0 0 0 0 0 0 0
BUCK4_OC BUCK3_OC BUCK2_OC BUCK1_OC
BST_OVP BST_OCP SWOUT_OCP VBUSOTG_OCP
51 INT_PENDING_R2 R 8’b0000_0000 P P P P
0 0 0 0 0 0 0 0
SWOUT_S VBUSOTG_
LDO6_OCP LDO5_OCP LDO4_OCP LDO3_OCP LDO2_OCP LDO1_OCP
R 8’b0000_0000 H SH
52 INT_PENDING_R3
0 0 0 0 0 0 0 0
VINLOW_F
SWIN_RI SWIN_FA - - VINLOW_RI THW_RI THW_FA
53 INT_PENDING_R4 R 8’b0000_0000 A
0 0 0 0 0 0 0 0
INT_DBG_LATCH_ W/R SWOUT_RI SWOUT_FA VBUSOTG_RI VBUSOTG_FA WKP_RI WKP_FA PKEY_RI PKEY_FA
60 8’b0000_0000
R1 0 0 0 0 0 0 0 0 0
BUCK4_OC BUCK3_OC BUCK2_OC BUCK1_OC
INT_DBG_LATCH W/R BST_OVP BST_OCP SWOUT_OCP VBUSOTG_OCP
61 8’b0000_0000 P P P P
_R2 0
0 0 0 0 0 0 0 0
SWOUT_S VBUSOTG_
INT_DBG_LATCH W/R LDO6_OCP LDO5_OCP LDO4_OCP LDO3_OCP LDO2_OCP LDO1_OCP
62 8’b0000_0000 H SH
_R3 0
0 0 0 0 0 0 0 0
VINLOW_F
INT_DBG_LATCH W/R SWIN_RI SWIN_FA - - VINLOW_RI THW_RI THW_FA
63 8’b0000_0000 A
_R4 0
0 0 0 0 0 0 0 0
page 66/140
User register map
STPMIC1
@HE BITS[7:0]
Register name R/W Default
X 7 6 5 4 3 2 1 0
DS12792 - Rev 7
71 INT_ CLEAR _R2 8’b0000_0000
0
0 0 0 0 0 0 0 0
SWOUT_S VBUSOTG_
LDO6_OCP LDO5_OCP LDO4_OCP LDO3_OCP LDO2_OCP LDO1_OCP
72 INT_ CLEAR _R3 W/R H SH
8’b0000_0000
0
0 0 0 0 0 0 0 0
VINLOW_F
W/R SWIN_RI SWIN_FA - - VINLOW_RI THW_RI THW_FA
73 INT_ CLEAR _R4 8’b0000_0000 A
0
0 0 0 0 0 0 0 0
INT_SET_MASK_ W/R SWOUT_RI SWOUT_FA VBUSOTG_RI VBUSOTG_FA WKP_RI WKP_FA PKEY_RI PKEY_FA
90 8’b0000_0000
R1 0 0 0 0 0 0 0 0 0
BUCK4_OC BUCK3_OC BUCK2_OC BUCK1_OC
INT_SET_MASK W/R BST_OVP BST_OCP SWOUT_OCP VBUSOTG_OCP
91 8’b0000_0000 P P P P
_R2 0
0 0 0 0 0 0 0 0
SWOUT_S VBUSOTG_
INT_SET_MASK W/R LDO6_OCP LDO5_OCP LDO4_OCP LDO3_OCP LDO2_OCP LDO1_OCP
92 8’b0000_0000 H SH
_R3 0
0 0 0 0 0 0 0 0
VINLOW_F
INT_SET_MASK W/R SWIN_RI SWIN_FA - - VINLOW_RI THW_RI THW_FA
93 8’b0000_0000 A
_R4 0
0 0 0 0 0 0 0 0
INT_CLEAR_MAS W/R SWOUT_RI SWOUT_FA VBUSOTG_RI VBUSOTG_FA WKP_RI WKP_FA PKEY_RI PKEY_FA
A0 8’b0000_0000
K_R1 0 0 0 0 0 0 0 0 0
page 67/140
User register map
STPMIC1
@HE BITS[7:0]
Register name R/W Default
X 7 6 5 4 3 2 1 0
DS12792 - Rev 7
A1 8’b0000_0000
K _R2 0
0 0 0 0 0 0 0 0
SWOUT_S VBUSOTG_
INT_CLEAR_MAS W/R LDO6_OCP LDO5_OCP LDO4_OCP LDO3_OCP LDO2_OCP LDO1_OCP
A2 8’b0000_0000 H SH
K _R3 0
0 0 0 0 0 0 0 0
VINLOW_F
INT_CLEAR_MAS W/R SWIN_RI SWIN_FA - - VINLOW_RI THW_RI THW_FA
A3 8’b0000_0000 A
K _R4 0
0 0 0 0 0 0 0 0
SWOUT - VBUSOTG - WKP - PKEY -
B0 INT_SRC_R1 R 8’b0000_0000
0 0 0 0 0 0 0 0
BUCK4_OC BUCK3_OC BUCK2_OC BUCK1_OC
BST_OVP BST_OCP SWOUT_OCP VBUSOTG_OCP
B1 INT_SRC_R2 R 8’b0000_0000 P P P P
0 0 0 0 0 0 0 0
SWOUT_S VBUSOTG_
LDO6_OCP LDO5_OCP LDO4_OCP LDO3_OCP LDO2_OCP LDO1_OCP
B2 INT_SRC_R3 R 8’b0000_0000 H SH
0 0 0 0 0 0 0 0
SWIN - - - VINLOW - THW -
B3 INT_SRC_R4 R 8’b0000_0000
0 0 0 0 0 0 0 0
- - - - - - - NVM_BUSY
B8 NVM_SR R 8’b0000_0000
0 0 0 0 0 0 0 0
- - - - - - NVM_CMD[1:0]
B9 NVM_CR R/W 8’b0000_0000
0 0 0 0 0 0 0 0
page 68/140
User register map
STPMIC1
STPMIC1
Status registers
7 6 5 4 3 2 1 0
Address: 0x01
Type: read register only
Default: b000x_xxxx where x depends on turn-ON condition
Description: turn-ON status register. This register stores last condition, which has turned ON the STPMIC1.
Register is set during CHECK&LOAD state following the turn-ON condition.
It is not refreshed or default by restart and default power cycle.
[7 :5] Reserved
AUTO: STPMIC1 has automatically turned ON on VIN rising.
[4] 0: False
1: True
SWOUT: last Turn-ON condition was VBUS detection on SWOUT pin.
[3] 0: False
1: True
VBUS: last Turn-ON condition was VBUS detection on VBUSOTG pin
[2] 0: False
1: True
WKUP: last Turn-ON condition was WAKEUP pin detection
[1] 0: False
1: True
PKEY: last Turn-ON condition was PONKEYn detection
[0] 0: False
1: True
7 6 5 4 3 2 1 0
Address: 0x02
Type: read register only
Default : b000x_xxxx where x depends on previous turn-OFF condition
Description: Turn-OFF status register. This register stores the last condition, which turns OFF the STPMIC1.
It is set during POWER_DOWN state following turn-OFF condition.
[7 :6] Reserved
PKEYLKP: Last turn-OFF condition was due to PONKEYn long key
[5] 0: False
1: True
WDG: Last turn-OFF condition was due to watchdog
[4] 0: False
1: True
OCP: Last turn-ON condition was due to overcurrent protection
[3] 0: False
1: True
THSD: Last turn-OFF condition was due to thermal shutdown
[2] 0: False
1: True
VINOK_FA: Last turn-OFF condition was due to VIN below VINOK_Fall
(when VIN is crossing VIN_POR_Rise threshold, this bit value is not valid)
[1]
0: False
1: True
SWOFF: Last turn-OFF condition was due to software switch OFF
[0] 0: False
1: True
7 6 5 4 3 2 1 0
Address: 0x03
Type: read register only
Default: b00xx_xxxx where x depends on possible OCP event during previous POWER_ON
Description: OCP LDO turn-OFF status register. This register stores the identification of the LDO source of the
last OCP turn-OFF.
It is set during POWER_DOWN state.
[7 :6] Reserved
OCP_LDO6: Last turn-OFF was due to overcurrent protection on LDO6
[5] 0: False
1: True
OCP_LDO5: Last turn-OFF was due to overcurrent protection on LDO5
[4] 0: False
1: True
OCP_LDO4: Last turn-OFF was due to overcurrent protection on LDO4
[3] 0: False
1: True
OCP_LDO3: Last turn-OFF was due to overcurrent protection on LDO3
[2] 0: False
1: True
OCP_LDO2: Last turn-OFF was due to overcurrent protection on LDO2
[1] 0: False
1: True
OCP_LDO1: Last turn-OFF was due to overcurrent protection on LDO1
[0] 0: False
1: True
7 6 5 4 3 2 1 0
Address: 0x04
Type: read register only
Default: b00xx_xxxx where x depends on possible OCP event during previous POWER_ON
Description: OCP buck turn-OFF status register. This register stores the identification of the BUCK, BOOST or
power switch source of the last OCP turn-OFF.
It is set during POWER_DOWN state.
[7] Reserved
OCP_BOOST: Last turn-OFF was due to overcurrent protection on BOOST
[6] 0: False
1: True
OCP_SWOUT: Last turn-OFF was due to overcurrent protection on SWOUT pin (PWR_SW out)
[5] 0: False
1: True
OCP_VBUSOTG: Last turn-OFF was due to overcurrent protection on VBUSTOTG pin (PWR_USB_SW out)
[4] 0: False
1: True
OCP_BUCK4: Last turn-OFF was due to overcurrent protection on BUCK4
[3] 0: False
1: True
OCP_BUCK3: Last turn-OFF was due to overcurrent protection on BUCK3
[2] 0: False
1: True
OCP_BUCK2: Last turn-OFF was due to overcurrent protection on BUCK2
[1] 0: False
1: True
OCP_BUCK1: Last turn-OFF was due to overcurrent protection on BUCK1
[0] 0: False
1: True
7 6 5 4 3 2 1 0
Address: 0x05
Type: read register only
Default: b000x_xxxx where x depends on last restart condition
Description: Restart status register. This register mainly contains identification of the last restart condition. Either
turn-OFF condition with restart_request option set, or from RSTn assertion from application processor. (Refer to
Section 5.4.3 Turn-OFF conditions and restart_request) and Section 5.4.4 Reset and mask_reset option.
Bits prefixed with R_ are set during transition from POWER_DOWN to CHECK&LOAD.
This register also contains active operating mode (MAIN or ALTERNATE) and current LDO4 input source. (Refer
to Section 4.2.2 LDO regulators - special features).
OP_MODE: Operating mode. Signal if the STPMIC1 is in MAIN mode or ALTERNATE mode.
[7] 0: STPMIC1 is in MAIN mode
1: STPMIC1 is in ALTERNATE mode
LDO4_SRC[1:0]: LDO4 input source. Provides status of LDO4 input switch selection.
00: LDO4 is OFF
[6 :5] 01: VIN supply selected
10: VBUSOTG supply selected
11: BSTOUT supply selected
R_VINOK_FA: Restart is due to VINOK_Fall turn-OFF condition while RREQ_EN bit is set
[4] 0: False
1: True
R_PKEYLKP: Restart is due to PONKEYn long key press turn- OFF condition while RREQ_EN bit is set
[3] 0: False
1: True
R_WDG: Restart is due to watchdog turn-OFF condition while RREQ_EN bit is set
[2] 0: False
1: True
R_SWOFF: Restart is due to SWOFF turn-OFF condition while RREQ_EN bit is set
[1] 0: False
1: True
R_RST: Restart is due to RSTn signal asserted by application processor
[0] 0: False
1: True
7 6 5 4 3 2 1 0
MAJOR_VERSION[3:0] MINOR_VERSION[3:0]
R R R R R R R R
Address: 0x06
Type: read register only
Default: 0x21
Description: version status register. Chip ID version.
[7 :4] MAJOR_VERSION[3:0]
[3 :0] MINOR_VERSION[3:0]
Reading x21 means that the STPMIC1 has a silicon version 2.1; regardless the STPMIC1A, STPMIC1B,
STPMIC1C, STPMIC1D and STPMIC1E.
7 6 5 4 3 2 1 0
Address: 0x10
Type: read/write register
Default: 0x00
Description: main control register. This register is initialized to default values during CHECK&LOAD state.
[7 :5] Reserved
OCP_OFF_DBG: Used as software debug bit to emulate OCP turn-OFF event generation. OCP flags coming from any
regulators are bypassed when this bit is set.
[4]
0: OCP event is generated based on flags from regulators.
1: OCP turn-OFF event is generated.
PWRCTRL_POL: specifies PWRCTRL pin polarity
[3] 0: PWRCTRL active low
1: PWRCTRL active high
PWRCTRL_EN: enable PWRCTRL functionality
[2] 0: PWRCTRL enable
1: PWRCTRL disable
RREQ_EN: allows power cycling on turn-OFF condition
[1] 0: power cycling is performed only on RSTn assertion by the application processor
1: Power cycling is performed on turn-OFF condition and on RSTn assertion by the application processor
SWOFF: Software switch OFF bit
[0] 0: no effect
1: switch-OFF requested (POWER_DOWN starts immediately)
7 6 5 4 3 2 1 0
Address: 0x11
Type: read/write register
Default: 0x00
Description: pads pull control register. This register is initialized to default values upon entering CHECK&LOAD
state.
[7 :5] Reserved
WKUP_EN: Enable WAKEUP detector
[4] 0: WAKEUP detector is enabled
1: WAKEUP detector is disabled
PWRCTRL_PD: PWRCTRL pull-down control
0: PD inactive
[3]
1: PD active
Note: this bit has higher priority than PWRCTRL_PU.
PWRCTRL_PU: PWRCTRL pull-up control
[2] 0: PU inactive
1: PU active
WKUP_PD: WAKEUP pull-down control (reverse logic)
[1] 0: PD active
1: PD not active
PKEY_PU: PONKEY pull-up control (reverse logic)
[0] 0: PU active
1: PU not active
7 6 5 4 3 2 1 0
Address: 0x12
Type: read/write register
Default: 0x00
Description: Bucks pull-down control register. This register is initialized to default values upon entering to
CHECK&LOAD state
BUCK4_PD[1:0]:
00: light PD active when ENA of Buck4 = 0
[7:6] 01: high PD active when ENA of Buck4 = 0
10: light and high PD forced inactive
11: light PD forced active
BUCK3_PD[1:0]:
00: light PD active when ENA of Buck3 = 0
[5:4] 01: high PD active when ENA of Buck3 = 0
10: light and high PD forced inactive
11: light PD forced active
BUCK2_PD[1:0]:
00: light PD active when ENA of Buck2 = 0
[3:2] 01: high PD active when ENA of Buck2 = 0
10: light and high PD forced inactive
11: light PD forced active
BUCK1_PD[1:0]:
00: light PD active when ENA of Buck1 = 0
[1:0] 01: high PD active when ENA of Buck1 = 0
10: light and high PD forced inactive
11: light PD forced active
7 6 5 4 3 2 1 0
Address: 0x13
Type: read/write register
Default: 0x00
Description: LDO1-4 pull-down control register. This register is initialized to default values upon entering to
CHECK&LOAD state.
LDO4_PD[1:0]:
00: PD active when ENA of LDO4 = 0
[7:6] 01: PD forced inactive
10: PD forced inactive
11: PD forced active
LDO3_PD[1:0]:
00: PD active when ENA of LDO3 = 0
[5:4] 01: PD forced inactive
10: PD forced inactive
11: PD forced active
LDO2_PD[1:0]:
00: PD active when ENA of LDO2 = 0
[3:2] 01: PD forced inactive
10: PD forced inactive
11: PD forced active
LDO1_PD[1:0]:
00: PD active when ENA of LDO1 = 0
[1:0] 01: PD forced inactive
10: PD forced inactive
11: PD forced active
7 6 5 4 3 2 1 0
Address: 0x14
Type: read/write register
Default: 0x00
Description: LDO5 and LDO6 pull-down control register. This register is initialized to default values upon entering
to CHECK&LOAD state.
[7] Reserved
BST_PD: Boost pull-down activation (reverse logic)
[6] 0: PD active when BST_ON = 0
1: PD inactive when BST_ON = 0
REFDDR_PD[1:0]:
00: PD active only when REFDDR disabled
[5:4] 01: PD forced inactive
10: PD forced inactive
11: PD forced active
LDO6_PD[1:0]:
00: PD active only when LDO6 disabled
[3:2] 01: PD forced inactive
10: PD forced inactive
11: PD forced active
LDO5_PD[1:0]:
00: PD active only when LDO5 disabled
[1:0] 01: PD forced inactive
10: PD forced inactive
11: PD forced active
7 6 5 4 3 2 1 0
Address: 0x15
Type: read/write register
Default: 0x00
Description: switch and VIN control register. This register is initialized to default values upon entering to
CHECK&LOAD state.
7 6 5 4 3 2 1 0
Address: 0x16
Type: read/write register
Default: 0bX0000000 where X depends on the value programmed in NVM
Description: PONKEYn turn-OFF control register. This register is initialized to default values during
CHECK&LOAD state.
PKEY_LKP_OFF:
0: Turn OFF on long key press inactive
[7]
1: Turn OFF on long key press active
Default value is defined by PKEYLKP_OFF bit in Table 65. NVM_MAIN_CTRL_SHR
PKEY_CLEAR_OCP_FLAG:
0: only VIN_POR_Fall can reset LOCK_OCP_FLAG internal signal
[6]
1: if PONKEYn pin is pressed for more than PKEY_LKP_TMR[3:0] then LOCK_OCP_FLAG is cleared. This also results
as turn-ON condition for the STPMIC1
[5 :4] reserved
PKEY_LKP_TMR[3:0]: PONKEYn long key press duration
0000 : 16 s
0001 : 15 s
0010 : 14 s
0011 : 13 s
0100 : 12 s
0101 : 11 s
0110 : 10 s
[3 :0] 0111 : 9 s
1000 : 8 s
1001 : 7 s
1010: 6 s
1011 : 5 s
1100 : 4 s
1101 : 3 s
1110 : 2 s
1111 : 1 s
7 6 5 4 3 2 1 0
Address: 0x18
Type: read/write register
Default: 0x00
Description: mask reset Buck control register. Set bit to 1 active Mask reset option for selected Bucks for the next
NRST power cycle. It is a single shot option. Register is reset to default in CHECK&LOAD state.
Refer to Section 5.4.4 Reset and mask_reset option.
[7 :4] Reserved
MRST_BUCK4: Buck 4 mask reset option
[3] 0: inactive
1: Mask default active for Buck4
MRST_BUCK3: Buck3 mask reset option
[2] 0: inactive
1: Mask default active for Buck3
MRST_BUCK2: Buck2 mask reset option
[1] 0: inactive
1: Mask default active for Buck2
MRST_BUCK1: Buck1 mask reset option
[0] 0: inactive
1: Mask default active for Buck1
7 6 5 4 3 2 1 0
Address: 0x1A
Type: read/write register
Default: 0x00
Description: mask reset LDO control register. Set bit to 1 active mask reset option for selected LDO for next
reset power-cycle. It is a single shot option. Register is reset to default in CHECK&LOAD state. Refer to
Section 5.4.4 Reset and mask_reset option.
[7] Reserved
MRST_REFDDR: REFDDR LDO mask reset option
[6] 0: inactive
1: Mask reset active for REFDDR
MRST_LDO6: LDO6 mask default option
[5] 0: inactive
1: mask reset active for LDO6
MRST_LDO5: LDO5 mask default option
[4] 0: inactive
1: mask reset active for LDO5
MRST_LDO4: LDO4 mask default option
[3] 0: inactive
1: mask reset active for LDO4
MRST_LDO3: LDO3 mask default option
[2] 0: inactive
1: mask reset active for LDO3
MRST_LDO2: LDO2 mask default option
[1] 0: inactive
1: mask default active for LDO2
MRST_LDO1: LDO1 mask default option
[0] 0: inactive
1: mask default active for LDO1
7 6 5 4 3 2 1 0
Address: 0x1B
Type: read/write register
Default: 0x00
Description: watchdog control register
[7 :2] Reserved
WDG_RST: watchdog counter reset
[1] 0: NA
1: Watchdog downcounter is reloaded with a value in WDG_TIMER_CR (self-cleared bit)
WDG_ENA: watchdog enable bit
[0] 0: watchdog is disabled
1: watchdog is enabled
7 6 5 4 3 2 1 0
WDG_TMR [7:0]
R/W R/W R/W R/W R/W R/W R/W R/W
Address: 0x1C
Type: read/write register
Default: 0x00
Description: watchdog timer control register. This register is initialized to default value upon entering
CHECK&LOAD state.
7 6 5 4 3 2 1 0
Address: 0x1D
Type: read/write register
Default: 0x00
Description: Buck OCP turn-OFF control register. This register is initialized to default value during CHECK&LOAD
state.
[7] reserved
OCPOFFBOOST: STPMIC1 turn-OFF in case OCP on BOOST
[6] 0: False
1: True
OCPOFFSWOUT: STPMIC1 turn-OFF in case OCP on SWOUT
[5] 0: False
1: True
OCPOFFVBUSOTG: STPMIC1 turn-OFF in case OCP on VBUSOTG
[4] 0: False
1: True
OCPOFFBUCK4: STPMIC1 turn-OFF in case OCP on BUCK4
[3] 0: False
1: True
OCPOFFBUCK3: STPMIC1 turn-OFF in case OCP on BUCK3
[2] 0: False
1: True
OCPOFFBUCK2: STPMIC1 turn-OFF in case OCP on BUCK2
[1] 0: False
1: True
OCPOFFBUCK1: STPMIC1 turn-OFF in case OCP on BUCK1
[0] 0: False
1: True
7 6 5 4 3 2 1 0
Address: 0x1E
Type: read/write register
Default: 0x00
Description: LDO OCP turn-OFF control register. This register is initialized to default value upon entering
CHECK&LOAD state.
[7 :6] Reserved
OCPOFFLDO6: STPMIC1 Turn-OFF in case OCP on LDO6
[5] 0: False
1: True
OCPOFFLDO5: STPMIC1 Turn-OFF in case OCP on LDO5
[4] 0: False
1: True
OCPOFFLDO4: STPMIC1 Turn OFF in case OCP on LDO4
[3] 0: False
1: True
OCPOFFLDO3: STPMIC1 Turn-OFF in case OCP on LDO3
[2] 0: False
1: True
OCPOFFLDO2: STPMIC1 Turn-OFF in case OCP on LDO2
[1] 0: False
1: True
OCPOFFLDO1: STPMIC1 Turn-OFF in case OCP on LDO1
[0] 0: False
1: True
7 6 5 4 3 2 1 0
[7:2] VOUT[5:0]: Buck output voltage setting. Refer to Table 10. BUCK output settings
PREG_MODE: select high power or low power regulation mode
[1] 0: High power mode (HP)
1: Low power mode (LP)
ENA: Buck enable bit
[0] 0: Buck is disabled
1: Buck is enabled
7 6 5 4 3 2 1 0
Address: 0x24
Type: read/write register
Default: 0x0000000X where X depends on NVM settings
Description: REFDDR, MAIN mode control register. Register is initialized in CHECK&LOAD mode.
User can write to this register to control the enable of REFDDR applied to MAIN mode.
[7 :1] Reserved
ENA: VREF_DDR enable bit
[0] 0: VREF_DDR is disabled
1: VREF_DDR is enabled
7 6 5 4 3 2 1 0
[7] Reserved
[1] reserved
ENA: LDOx enable bit
[0] 0: LDOx is disabled
1: LDOx is enabled
7 6 5 4 3 2 1 0
Address: 0x27
Type: read/write register
Default: 0bXXXXXX00 where X depends on the value programmed in NVM
Description: LDO3 MAIN mode control register. The register is set to a default value in CHECK&LOAD.
User can write to this register to control bypass, enable and voltage settings of LDO3 that is applied to MAIN
mode.
7 6 5 4 3 2 1 0
Address: 0x28
Type: read/write register
Default: 0x0000000X
Description: LDO4 MAIN mode control register. Register is set to a default value in CHECK&LOAD. User can
write to this register to enable and force the input source of LDO4 that is applied to MAIN mode. If more than one
SRC_ bit is set, it is taken into account following this priority order: VIN, VBUSOTG, BSTOUT.
[7 :5] reserved
SRC_VBUSOTG: Force VBUSOTG as input source.
[4] 0: automatic
1: supply switch is set to VBUSOTG
SRC_BSTOUT: Force BSTOUT has input source.
[3] 0: automatic
1: supply switch is set to BSTOUT
SRC_VIN: Force VIN has an input source.
[2] 0: automatic
1: supply switch is set to VIN
[1] reserved
ENA: LDO4 enable bit
[0] 0: LDO4 is disabled
1: LDO4 is enabled
7 6 5 4 3 2 1 0
7 6 5 4 3 2 1 0
Address: 0x34
Type: read/write register
Default: 0x00
Description: REFDDR ALTERNATE mode control register. The register is initialized in CHECK&LOAD mode. User
can write to this register to control enable of REFDDR that is applied to ALTERNATE mode.
[7 :1] Reserved
ENA: REFDDR enable bit
[0] 0: REFDDR is disabled
1: REFDDR is enabled
7 6 5 4 3 2 1 0
[7] Reserved
[6 :2] VOUT[4:0]: refer to Table 9. LDO output voltage settings
[1] reserved
ENA: LDOx enable bit
[0] 0: LDOx is disabled
1: LDOx is enabled
7 6 5 4 3 2 1 0
Address: 0x37
Type: read/write register
Default: 0bXXXXXX00 where X depends on the value programmed in NVM
Description: LDO3 ALTERNATE mode control register. Register is set to a default value in CHECK&LOAD.
User can write to this register to control bypass, enable and voltage settings of LDO3 that is applied to
ALTERNATE mode.
7 6 5 4 3 2 1 0
Address: 0x38
Type: read/write register
Default: 0x00
Description: LDO4 ALTERNATE mode control register. Register is set to a default value in CHECK&LOAD.
User can write to this register to control enable LDO4 that is applied to ALTERNATE mode.
[7 :1] Reserved
ENA: LDO4 enable bit
[0] 0: LDO4 is disabled
1: LDO4 is enabled
7 6 5 4 3 2 1 0
Address: 0x40
Type: read/write register
Default: 0x00
Description: boost and power switch control register. Register is set to a default value in CHECK&LOAD.
[7] RESERVED
VBUSOTG_DET_DIS: PWR_USB_SW detection circuit disable
[6] 0: detection circuit is enabled
1: detection circuit is disabled
SWOUT_PD: SWOUT (PWR_SW) pull-down activation
[5] 0: PD inactive
1: PD active when PWR_SW is disabled (SW_ON bit = 0)
VBUSOTG_PD: PWR_USB_SW pull-down activation
[4] 0: PD inactive
1: PD active when PWR_USB_SW is disabled (VBUSOTG_ON bit = 0)
OCP_SWOUT_LIM: Overcurrent limit protection of PWR_SW switch
[3] 0: limit max. output current to 600 mA
1: limit max. output current to 1.1 A
SWOUT_ON: PWR_SW switch enable bit
[2] 0: PWR_SW disabled
1: PWR_SW enabled
VBUSOTG_ON: PWR_USB_SW switch enable
[1] 0: PWR_USB_SW disabled
1: PWR_USB_SW enabled
BST_ON: BOOST enable bit
[0] 0: BOOST disabled
1: BOOST enabled
7 6 5 4 3 2 1 0
Address: 0x50
Type: read register only
Default: 0x00
Description: interrupt pending register 1. Register is set to default on RSTn assertion.
For all bits:
0: IT not pending
1: IT pending
[7] SWOUT_RI: VBUS on SWOUT pin (PWR_SW out) rises above SWOUT_Rise treshold
[6] SWOUT_FA: VBUS on SWOUT pin (PWR_SW out) falls below above SWOUT_Fall treshold
[5] VBUSOTG_RI: VBUS on VBUSOTG pin (PWR_USB_SW out) rises above VBUSOTG_Rise threshold
[4] VBUSOTG_FA: VBUS on VBUSOTG pin (PWR_USB_SW out) falls below VBUSOTG_Fall threshold
[3] WKP_RI: WAKEUP rising edge
[2] WKP_FA: WAKEUP falling edge
[1] PKEY_RI: PONKEYn rising edge
[0] PKEY_FA: PONKEYn falling edge detected
7 6 5 4 3 2 1 0
Address: 0x51
Type: read register only
Default: 0x00
Description: interrupt pending register 2. Register is set to default on RSTn assertion
For all bits:
0: IT not pending
1: IT pending
7 6 5 4 3 2 1 0
Address: 0x52
Type: read register only
Default: 0x00
Description: interrupt pending register 3. Register is set to default on RSTn assertion
For all bits:
0: IT not pending
1: IT pending
7 6 5 4 3 2 1 0
Address: 0x53
Type: read register only
Default: 0x00
Description: interrupt pending register 4. Register is set to default on RSTn assertion
For all bits:
0: IT not pending
1: IT pending
[7] SWIN_RI: Voltage on SWIN pin (PWR_SW input) rises above SWIN_Rise threshold
[6] SWIN_FA: Voltage on SWIN pin (PWR_SW input) falls below SWIN_Fall threshold
[5 :4] reserved
[3] VINLOW_RI: VIN drops below VINLOW_Rise threshold
[2] VINLOW_FA: VIN rises above VINLOW_Fall threshold
[1] THW_RI: Temperature rises above Twrn_Rise threshold
[0] THW_FA: Temperature drops below Twrn_Fall threshold
Name Address 7 6 5 4 3 2 1 0
Address: 0x60-0x63
Type: write register - read x00
Default: 0x00
Description: interrupt debug latch registers. Write registers only. Read always return 0x00.
Writing 1 in the bit forces the corresponding interrupt event in INT_PENDING_Rx
Refer to Section 6.5.2 Interrupt pending register 1 (INT_PENDING_R1), Section 6.5.3 Interrupt
pending register 2 (INT_PENDING_R2), Section 6.5.4 Interrupt pending register 3 (INT_PENDING_R3) and
Section 6.5.5 Interrupt pending register 4 (INT_PENDING_R4) about the interrupt description.
Name Address 7 6 5 4 3 2 1 0
Address: 0x70-0x73
Type: write register - read x00
Default: 0x00
Description: Interrupt clear registers. Write registers only. Read always return 0x00.
Writing 1 clears the corresponding interrupt event in INT_PENDING_Rx
Refer to Section 6.5.2 Interrupt pending register 1 (INT_PENDING_R1), Section 6.5.3 Interrupt
pending register 2 (INT_PENDING_R2), Section 6.5.4 Interrupt pending register 3 (INT_PENDING_R3) and
Section 6.5.5 Interrupt pending register 4 (INT_PENDING_R4) about the interrupt description.
Name Address 7 6 5 4 3 2 1 0
INT
SWOUT SWOUT_ VBUS VBUS WKP WKP PKEY PKEY
_MASK 0x80
_RI FA OTG_RI OTG_FA _RI _FA _RI _FA
_R1
INT
BST SWOUT_ VBUS BUCK4_ BUCK3_ BUCK2_ BUCK1_
_MASK 0x81 BST_OCP
_OVP OCP OTG_OCP OCP OCP OCP OCP
_R2
INT
SWOUT VBUS LDO6_ LDO5 LDO4_ LDO3_ LDO2_ LDO1_
_MASK 0x82
_SH OTG_SH OCP _OCP OCP OCP OCP OCP
_R3
INT
SWIN SWIN VINLOW_ VINLOW_ THW THW
_MASK 0x83 reserved reserved
_RI _FA RI FA _RI _FA
_R4
Name Address 7 6 5 4 3 2 1 0
Name Address 7 6 5 4 3 2 1 0
7 6 5 4 3 2 1 0
Address: 0xB0
Type: read register
Default: 0x00
Description: interrupt source register 1. Register is reset on RSTn assertion.
State bit is 1 as long as event source is active.
7 6 5 4 3 2 1 0
Address: 0xB1
Type: read register
Default: 0x00
Description: interrupt source register 2. Register is set to default on RSTn assertion. State bit is 1 as long as
event source is active.
7 6 5 4 3 2 1 0
Address: 0xB2
Type: read register
Default: 0x00
Description: interrupt source register 3. Register is default on RSTn assertion. State bit is 1 as long as event
source is active.
7 6 5 4 3 2 1 0
Address: 0xB3
Type: read register
Default: 0x00
Description: interrupt source register 4. Register is default on RSTn assertion. State bit is 1 as long as event
source is active.
7 6 5 4 3 2 1 0
Address: 0xB8
Type: read only register
Default: 0x00
Description: NVM status register.
[7 :1] reserved
NVM_BUSY: NVM controller status
0: NVM controller is in idle state
[0]
1: NVM controller is in busy state
Self-cleared when the operation is completed
7 6 5 4 3 2 1 0
Address: 0xB9
Type: read/write register
Default: 0x00
Description: NVM control register
[7 :2] reserved
NVM_CMD[1:0]: NVM controller command bits to control NVM operation on NVM shadow register bits.
00: No operation
[1:0] 01: Program (write shadow register to NVM)
10: Read (load NVM content into shadow registers)
11: No operation
BITS[7:0]
R/
@HEX Register name Default 7 6 5 4 3 2 1 0
DS12792 - Rev 7
W
page 116/140
NVM shadow registers
STPMIC1
BITS[7:0]
Register
@HEX R/W Default 7 6 5 4 3 2 1 0
Name
DS12792 - Rev 7
SWOUT_BOOST_OVP - LDO3_VOUT[1:0] LDO2_VOUT[1:0] LDO1_VOUT[1:0]
A:8’b1000_0000
1 0 0 0 0 0 0 0
FD NVM_LDOS_VOUT_SHR1 R/W
B:8’b1000_1000 1 0 0 0 1 0 0 0
C:8’b1000 0000 1 0 0 1 1 0 1 0
- - - - LDO6_VOUT[1:0] LDO5_VOUT[1:0]
A:8’b0000_0010
0 0 0 0 0 0 1 0
FE NVM_LDOS_VOUT_SHR2 R/W
B:8’b0000_0010 0 0 0 0 0 0 1 0
C:8’b0000 0000 0 0 0 0 0 0 0 0
- I2C_ADDR[6:0
A:8’b0011_0011
0 0 1 1 0 0 1 1
FF NVM_I2C_ADDR_SHR R/W
B:8’b0011_0011 0 0 1 1 0 0 1 1
C:8’b0011_0011 0 0 1 1 0 0 1 1
page 117/140
NVM shadow registers
STPMIC1
STPMIC1
NVM shadow registers
7 6 5 4 3 2 1 0
Address: 0xF8
Type: read write register
Default: depends on the part number, refer to Table 64. NVM shadow register map
Description: NVM main control shadow register.
7 6 5 4 3 2 1 0
Address: 0xF9
Type: read write register
Default: Depends on part number refer to Table 64. NVM shadow register map
Description: NVM buck rank shadow register.
BUCK4_RANK[1:0]:
00: rank0
[7:6] 01: rank1
10: rank2
11: rank3
BUCK3_RANK[1:0]:
00: rank0
[5:4] 01: rank1
10: rank2
11: rank3
BUCK2_RANK[1:0]:
00: rank0
[3:2] 01: rank1
10: rank2
11: rank3
BUCK1_RANK[1:0]:
00: rank0
[1:0] 01: rank1
10: rank2
11: rank3
7 6 5 4 3 2 1 0
Address: 0xFA
Type: read write register
Default: Depends on part number refer to Table 64. NVM shadow register map
Description: NVM LDOs rank shadow register 1.
LDO4_RANK[1:0]:
00: rank0
[7:6] 01: rank1
10: rank2
11: rank3
LDO3_RANK[1:0]:
00: rank0
[5:4] 01: rank1
10: rank2
11: rank3
LDO2_RANK[1:0]:
00: rank0
[3:2] 01: rank1
10: rank2
11: rank3
LDO1_RANK[1:0]:
00: rank0
[1:0] 01: rank1
10: rank2
11: rank3
7 6 5 4 3 2 1 0
Address: 0xFB
Type: read write register
Default: depends on part number refer to Table 64. NVM shadow register map
Description: NVM LDOs rank shadow register 2
7 6 5 4 3 2 1 0
Address: 0xFC
Type: read write register
Default: depends on part number refer to Table 64. NVM shadow register map
Description: NVM Bucks VOUT register.
7 6 5 4 3 2 1 0
Address: 0xFD
Type: read write register
Default: depends on part number refer to Table 64. NVM shadow register map
Description: NVM LDO1 to LDO3 default voltage output setting shadow register.
SWOUT_BOOST_OVP:
[7] 0: PWR_SW does not turn OFF if boost OVP occurs
1: PWR_SW is turned OFF automatically if Boost OVP occurs
[6] reserved
LDO3_VOUT[1:0]: LDO3 default output selection
00: 1.8 V
[5:4] 01: 2.5 V
10: 3.3 V
11: VOUT[5:0] of Buck2 divided by 2
LDO2_VOUT[1:0]: LDO2 default output selection
00: 1.8 V
[3:2] 01: 2.5 V
10: 2.9 V
11: 3.3 V
LDO1_VOUT[1:0]: LDO1 default output selection
00: 1.8 V
[1:0] 01: 2.5 V
10: 2.9 V
11: 3.3 V
7 6 5 4 3 2 1 0
Address: 0xFE
Type: read write register
Default: depends on part number refer to Table 64. NVM shadow register map
Description: NVM LDO5-6 voltage output shadow register.
[7:4] reserved
LDO6_VOUT[1:0]: LDO6 default output selection
00: 1.0 V
[3:2] 01: 1.2 V
10: 1.8 V
11: 3.3 V
LDO5_VOUT[1:0]: LDO5 default output selection
00: 1.8 V
[1:0] 01: 2.5 V
10: 2.9 V
11 : 3.3 V
7 6 5 4 3 2 1 0
reserved I2C_ADDR[6:0]
R/W R/W R/W R/W R/W R/W R/W R/W
Address: 0xFF
Type: read write register
Default: depends on part number refer to Table 64. NVM shadow register map
Description: NVM device address shadow register.
[7] Reserved
7 Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.
mm
Symbol
Min. Typ. Max.
8 Marking composition
Unmarkable surface
A
F G H D - 85262 - BE Sequence
(LLL)
E - 85261 - Diffusion
J Traceability Plant
I K
(WX)
I - 85265 - Second_lvl_intct
J - 85255 - MARKING AREA
K - 85257 - ADDITIONAL
INFORMATION
(MAX CHAR ALLOWED = 2)
9 Ordering information
Revision history
Contents
1 Device configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2 Typical application schematic. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2.1 Recommended external components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.2 Pinout and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
5.5 Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
List of tables
Table 1. Default NVM configuration vs part number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 2
Table 2. Passive components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 4
Table 3. Pin description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 5
Table 4. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 7
Table 5. Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 7
Table 6. Consumption in typical application scenarios . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 8
Table 7. Electrical and timing parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 9
Table 8. General description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Table 9. LDO output voltage settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Table 10. BUCK output settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Table 11. Turn-on description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Table 12. Turn-off conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Table 13. MAIN/ALTERNATE switch example configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Table 14. OCP levels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Table 15. Device ID format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Table 16. Register address format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Table 17. Register data format. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Table 18. Register map. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Table 19. TURN_ON_SR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
Table 20. TURN_OFF_SR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
Table 21. OCP_LDOS_SR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
Table 22. OCP_BUCKS_BSW_SR. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
Table 23. RESTART_SR. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
Table 24. VERSION_SR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
Table 25. MAIN_CR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
Table 26. PADS_PULL_CR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
Table 27. BUCKS_PD_CR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Table 28. LDO14_PD_CR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
Table 29. LDO56_VREF_PD_CR. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
Table 30. SW_VIN_CR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
Table 31. PKEY_TURNOFF_CR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Table 32. BUCKS_MRST_CR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
Table 33. LDOS_MRST_CR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
Table 34. WDG_CR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Table 35. WDG_TMR_CR. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
Table 36. BUCKS_OCPOFF_CR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
Table 37. LDOS_OCPOFF_CR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
Table 38. BUCKx_MAIN_CR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
Table 39. REFDDR_MAIN_CR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
Table 40. LDOx_MAIN_CR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
Table 41. LDO3_MAIN_CR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
Table 42. LDO4_MAIN_CR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
Table 43. BUCKx_ALT_CR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
Table 44. REFDDR_ALT_CR. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
Table 45. LDOx_ALT_CR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
Table 46. LDO3_ALT_CR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
Table 47. LDO4_ALT_CR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
Table 48. BST_SW_CR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
Table 49. INT_PENDING_R1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
Table 50. INT_PENDING_R2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
Table 51. INT_PENDING_R3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
Table 52. INT_PENDING_R4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
List of figures
Figure 1. Typical application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Figure 2. Pin configuration WFQFN 44L top view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 3. BUCK1 efficiency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 4. BUCK2 efficiency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 5. BUCK3 efficiency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 6. BUCK4 efficiency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 7. Boost efficiency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 8. Boost powered by 5 V supply having poor performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 9. BUCK1 load transient in HP mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 10. Buck1 load transient in LP mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 11. BUCK2 load transient in HP mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 12. Buck2 load transient in LP mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 13. Buck3 load transient in HP mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 14. Buck3 load transient in LP mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 15. Buck4 load transient in HP mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 16. Buck4 load transient in LP mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 17. LDO1 load transient . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 18. LDO2 load transient . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 19. LDO3 load transient . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 20. LDO4 load transient . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 21. LDO5 load transient . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 22. LDO6 load transient . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 23. LDO4 line transient . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 24. Boost output vs. input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 25. Boost load regulation 5 VIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 26. Boost load regulation 3.6 VIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 27. LDO1 line transient, no load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 28. LDO2 line transient, no load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 29. LDO3 line transient, no load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 30. LDO5 line transient, no load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 31. LDO6 line transient, no load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 32. LDO3 sink/source mode load transient response. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 33. Buck1 turn-ON waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Figure 34. STPMIC1A POWER_UP sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Figure 35. STPMIC1A POWER_UP sequencing PONKEYn. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Figure 36. STPMIC1A POWER_DOWN sequencing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Figure 37. STPMIC1A reset sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Figure 38. LDO start-up/shutdown timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Figure 39. Powering lpDDR2/lpDDR3 memory (LDO3 in bypass mode). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Figure 40. Powering lpDDR2/lpDDR3 memory (LDO3 normal mode supplied from VIN) . . . . . . . . . . . . . . . . . . . . . . . . 32
Figure 41. Powering DDR3/DDR3L memory (LDO3 in sink/source mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Figure 42. PWM clock generation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Figure 43. PWM clock synchronisation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Figure 44. Buck block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Figure 45. BUCKx LP to HP mode recovery time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Figure 46. BUCKx start-up/shutdown timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Figure 47. BUCKx dynamic voltage scaling (DVS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Figure 48. Boost and switch block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Figure 49. Boost start-up sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Figure 50. Battery powered application with a USB OTG port and a USB host port . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Figure 51. Battery powered application with a single USB OTG port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Figure 52. 5 V DC powered application with a USB OTG port and two USB host ports . . . . . . . . . . . . . . . . . . . . . . . . . 46