INTEGRATED CIRCUITS

DATA SHEET

TDA8395
SECAM decoder
Preliminary specification October 1991
File under Integrated Circuits, IC02
Philips Semiconductors Preliminary specification

SECAM decoder TDA8395

FEATURES
• Fully integrated filters
• Alignment free
• For use with baseband delay

GENERAL DESCRIPTION
The TDA8395 is a self-calibrating, fully integrated SECAM decoder. The IC should preferably be used in conjunction with
the PAL/NTSC decoder TDA8362 or TDA8366 and with the switched capacitor baseband delay circuit TDA4660. The IC
incorporates HF and LF filters, a demodulator and an identification circuit (luminance is not processed in this IC). The IC
needs no adjustments and very few external components are required. A highly stable reference frequency is required
for calibration and a two-level sandcastle pulse for blanking and burst gating.

QUICK REFERENCE DATA

SYMBOL PARAMETER MIN. TYP. MAX. UNIT

VP positive supply voltage; pin 3 7.2 − 8.8 V
Ptot total power dissipation − − 220 mW
V16(p-p) composite video input voltage − 1.0 1.5 V
(peak-to-peak value); pin 16
VO(p-p) −(R−Y) output voltage amplitude − 1.05 − V
(peak-to-peak value); pin 9
VO(p-p) −(B−Y) output voltage amplitude − 1.33 − V
(peak-to-peak value); pin 10

ORDERING INFORMATION

PACKAGE
EXTENDED TYPE NUMBER
PINS PIN POSITION MATERIAL CODE
TDA8395 16 DIL plastic SOT38GE1(1)
Note
1. SOT38-1; 1996 December 3.

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SECAM decoder TDA8395

Fig.1 Block diagram.

PINNING

SYMBOL PIN DESCRIPTION

fref/ IDENT 1 reference frequency
input/identification input
TEST 2 test output
VP 3 positive supply voltage
n.c. 4 not connected
n.c. 5 not connected
GND 6 ground
CLOCHEref 7 Cloche reference filter
PLLref 8 PLL reference
−(R−Y) 9 −(R−Y) output
−(B−Y) 10 −(B−Y) output
n.c. 11 not connected
n.c. 12 not connected
n.c. 13 not connected
n.c. 14 not connected
SAND 15 sandcastle pulse input
Fig.2 Pin configuration
CVBS 16 video (chrominance) input

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SECAM decoder TDA8395

FUNCTIONAL DESCRIPTION colour-on is transmitted to pin 1 (current is sunk). If the

signal request is granted (i.e. pin 1 is HIGH therefore no
The TDA8395 is a self-calibrating SECAM decoder
PAL) the colour difference outputs (−(B−Y) and −(R−Y))
designed for use with a baseband delay circuit.
from the TDA8362 are high impedance and the output
During frame retrace a 4.433619 MHz reference frequency signals from the TDA8395 are switched ON.
is used to calibrate the filters and the demodulator. The
If no SECAM signal is decoded during a two-frame period
reference frequency should be very stable during this
the demodulator will be initialized before another attempt
period.
is made also during a two-frame period. The CD outputs
The Cloche filter is a gyrator-capacitor type filter the will be blanked or high-impedance depending on the logic
resonance frequency of which is controlled during the level at pin 1.
calibration period and offset during scan; this ensures the
A two-level sandcastle pulse generates the required
correct frequency during calibration.
blanking periods and, also, clocks the digital identification
The demodulator is a Phase-Locked Loop (PLL) type pulse on the falling edge of the burst gate pulse. To enable
demodulator which uses the frequency reference and the the calibration period to be defined the vertical retrace is
bandgap reference to force the PLL to the required discriminated from the horizontal retrace, this is achieved
demodulation characteristic. by measuring the width of the blanking period.
The low frequency de-emphasis is matched to the PLL and
is controlled by the tuning voltage of the PLL.
A digital identification circuit scans the incoming signal for
SECAM (only line-identification is implemented). The
identification circuit needs to communicate with the
TDA8362 to guarantee that the output signal from the
decoder is only available when no PAL signal has been
identified. If a SECAM signal is decoded a request for

LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER MIN. MAX. UNIT
VP positive supply voltage − 8.8 V
Tstg storage temperature range −25 +150 °C
Tamb operating ambient temperature range −25 +70 °C

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SECAM decoder TDA8395

CHARACTERISTICS
VP = 8.0 V; Tamb = 25 °C; unless otherwise specified

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply (pin 3)
VP positive supply voltage 7.2 8.0 8.8 V
IP supply current − 18 25 mA
Ptot total power dissipation − 144 220 mW
CVBS input (pin 16)
V16(p-p) composite video input voltage − 1.0 1.5 V
(peak-to-peak value)
V16(p-p) chrominance input voltage note 1 15 − 300 mV
(peak-to-peak value)
ZI input impedance note 2 − 15 − kΩ
CLOCHE (pin 7)
Vtc tuning voltage 2.5 3.5 4.5 V
f0 resonance frequency note 3 4.266 4.286 4.306 MHz
B bandwidth 241 268 295 kHz
Demodulator
Vtd tuning voltage; pin 8 3.5 − 4.8 V
VO(p-p) output voltage amplitude 100/75 colour bar 0.97 1.05 1.13 V
(peak-to-peak value); pin 9
VO(p-p) output voltage amplitude 100/75 colour bar 1.23 1.33 1.43 V
(peak-to-peak value); pin 10
NLE non-linearity error 100/75 colour bar; − − 3 %
note 4
−(B−Y)/−(R−Y) ratio of −(B−Y) and −(R−Y) 1.23 1.27 1.32
fbe−(R−Y) black-level error −(R−Y) note 5 − − 5 kHz
fbe−(B−Y) black-level error −(B−Y) note 5 − − 7 kHz
VO output voltage level during − 2.8 − V
blanking
BO output bandwidth − 1.3 − MHz
S/N signal-to-noise ratio note 6 40 − − dB
fp pole-frequency LF 77 85 93 kHz
de-emphasis
fp/f0 ratio of pole and zero − 3 −
frequency
Vrh(p-p) residual harmonic voltage − − 10 mV
(peak-to-peak value)
ZO(e) output impedance SECAM pin 1 HIGH − − 600 Ω
enabled
ZO(d) output impedance SECAM pin 1 LOW 1 − − MΩ
disabled

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SECAM decoder TDA8395

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Sandcastle pulse
Vbl blanking detection level 1.0 1.25 1.5 V
Vbg burst gate detection level 3.5 3.85 4.2 V
tf falling edge of burst gate to 8.5 9.0 9.5 µs
start sync
Reference/communication
fref reference frequency note 7 − 4.4336 − MHz
Vref(p-p) reference voltage amplitude 0.20 − 0.50 V
(peak-to-peak value)
Ved SECAM enable detection − 2.8 3.3 V
level; pin 1
Vdd SECAM disabled detection note 8 1.5 2.0 − V
level; pin 1
Is sink current at SECAM note 9 − 150 − µA
identification; pin 1
Identification
ti identification time − 4 − frames
H colour on/off hysteresis 3 − − dB
Notes to the characteristics
1. If measured in the burst-period of a blue line.
2. The video input is AC-coupled.
3. During scan.
4. Measured as 100% x (IVuI - IVII) / (IVuI + IVlI); see Fig.3.
5. Converted to input frequency error.
6. Defined as the ratio between the peak-to-peak value of the B−Y component of the demodulated 100/75 colour bar
and the peak-to-peak value of the noise.
7. The reference should be stable during frame blanking.
8. The SECAM enable and disable timing should preferably be at the end of the frame blanking.
9. The externally supplied voltage should exceed 0.5 V.

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SECAM decoder TDA8395

Fig.3 Non-linearity definition.

TIMING

Fig.4 Timing waveforms.

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SECAM decoder TDA8395

APPLICATION INFORMATION
The leakage current at pin 8 should be well below 20 nA to meet the specification of the black levels (C8 = 220 nF).
The leakage current at pin 7 should be well below 60 nA to meet the specification of the Cloche resonance frequency
(C7 = 100 nF).
The capacitors C7 and C8 should be connected to the ground pin as close as possible to the package. If not, this can
result in a black level error for both channels.

TEST INFORMATION
The performance of the Cloche filter can be measured at pin 2. The use of a FET-probe is advised for low capacitive
loading.

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SECAM decoder TDA8395

PACKAGE OUTLINE

DIP16: plastic dual in-line package; 16 leads (300 mil); long body SOT38-1

D ME
seating plane

A2 A

A1
L

c
Z e w M
b1
(e 1)
b
16 9 MH

pin 1 index
E

1 8

0 5 10 mm
scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

UNIT
A A1 A2
b b1 c D (1) E (1) e e1 L ME MH w Z (1)
max. min. max. max.
1.40 0.53 0.32 21.8 6.48 3.9 8.25 9.5
mm 4.7 0.51 3.7 2.54 7.62 0.254 2.2
1.14 0.38 0.23 21.4 6.20 3.4 7.80 8.3
0.055 0.021 0.013 0.86 0.26 0.15 0.32 0.37
inches 0.19 0.020 0.15 0.10 0.30 0.01 0.087
0.045 0.015 0.009 0.84 0.24 0.13 0.31 0.33

Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE REFERENCES EUROPEAN

ISSUE DATE
VERSION IEC JEDEC EIAJ PROJECTION

92-10-02
SOT38-1 050G09 MO-001AE
95-01-19

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SECAM decoder TDA8395

SOLDERING
Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and
surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for
surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often
used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook” (order code 9398 652 90011).

Soldering by dipping or by wave

The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the
joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may
be necessary immediately after soldering to keep the temperature within the permissible limit.

Repairing soldered joints

Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more
than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

October 1991 10
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