Data Sheet: PAL Decoder
Data Sheet: PAL Decoder
DATA SHEET
TDA4510
PAL decoder
Product specification March 1986
File under Integrated Circuits, IC02
Philips Semiconductors Product specification
GENERAL DESCRIPTION
The TDA4510 is a colour decoder for the PAL standard, which is pin sequent compatible with multistandard decoder
TDA4555 and also pin compatible with NTSC decoder TDA4570. It incorporates the following functions:
Chrominance part
• Gain controlled chrominance amplifier with operating point control stage
• Chrominance output stage for driving the 64 µs delay line
• Blanking circuit for the colour burst signal
• Automatic chrominance control (ACC) with sampled rectifier during burst-key
Demodulator part
• Two synchronous demodulators for the (B-Y) and (R-Y) signals
• PAL flip-flop and PAL switch
• Colour switching stages
• Separate colour switching output
• (B-Y) and (R-Y) signal output stages
• Internal filtering of residual carrier
PACKAGE OUTLINE
16-lead DIL; plastic (SOT38); SOT38-1; 1996 November 26.
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March 1986
PAL decoder
Philips Semiconductors
3
External capacitors in Fig.1
C1 filter capacitor for control voltage (pin 10)
C2 filter capacitor for identification signal (pin 14)
FUNCTIONAL DESCRIPTION
DIVIDER STAGES
The divider stages provide −(R-Y) and −(B-Y) reference signals with the correct 90 degrees relation for the demodulators.
PHASE COMPARATOR
The phase comparator compares the −(R-Y) reference signal with the burst pulse and controls the frequency and phase
of the reference oscillator.
IDENTIFICATION DEMODULATOR
The identification demodulator delivers a positive going identification signal for PAL-signals at pin 14, also used for the
automatic colour-killer.
SERVICE SWITCH
The service switch has two functions. The first position (V14-3 < 1 V) allows the adjustment of the reference oscillator.
Therefore the colour is switched on and the burst for the oscillator PLL is switched off. The second position (V14-3 > 5 V)
switches the colour on and the output signals can be observed.
SANDCASTLE PULSE DETECTOR
Sandcastle pulse detector for burst-gate, line and blanking (horizontal and vertical) pulse detection. The vertical part of
the sandcastle pulse is needed for the internal colour-on and colour-off delay.
PULSE PROCESSING PART
Pulse processing part which shall prevent a premature switching on of the colour. The colour-on delay, two or three field
periods after identification of the PAL signal, is achieved by a counter. The colour is switched off immediately or at the
latest one field period after disappearance of the identification voltage.
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
Supply voltage range VP = V7-3 10,8 to 13,2 V
Currents
at pins 1 and 2 −I1,2 max. 5 mA
at pin 6 −I6 max. 15 mA
at pin 16 −I16 max. 5 mA
Total power dissipation Ptot max. 800 mW
Storage temperature Tstg −25 to + 150 °C
Operating ambient temperature Tamb 0 to + 70 °C
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Philips Semiconductors Product specification
CHARACTERISTICS
VP = 12 V; Tamb = 25 °C; measured in Fig.2 unless otherwise specified
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Philips Semiconductors Product specification
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Philips Semiconductors Product specification
C4 = 5 to 27 pF, X = 8,8 MHz; nominal frequency 8,867 238 MHz; resonance resistance 60 Ω,
load capacitance 20 pF, dynamic capacitance 22 fF and static capacitance 5,5 pF.
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Philips Semiconductors Product specification
PACKAGE OUTLINE
DIP16: plastic dual in-line package; 16 leads (300 mil); long body SOT38-1
D ME
seating plane
A2 A
A1
L
c
Z e w M
b1
(e 1)
b
16 9 MH
pin 1 index
E
1 8
0 5 10 mm
scale
UNIT
A A1 A2
b b1 c D (1) E (1) e e1 L ME MH w Z (1)
max. min. max. max.
1.40 0.53 0.32 21.8 6.48 3.9 8.25 9.5
mm 4.7 0.51 3.7 2.54 7.62 0.254 2.2
1.14 0.38 0.23 21.4 6.20 3.4 7.80 8.3
0.055 0.021 0.013 0.86 0.26 0.15 0.32 0.37
inches 0.19 0.020 0.15 0.10 0.30 0.01 0.087
0.045 0.015 0.009 0.84 0.24 0.13 0.31 0.33
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
92-10-02
SOT38-1 050G09 MO-001AE
95-01-19
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Philips Semiconductors Product specification
SOLDERING with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
Introduction 5 seconds.
There is no soldering method that is ideal for all IC The device may be mounted up to the seating plane, but
packages. Wave soldering is often preferred when the temperature of the plastic body must not exceed the
through-hole and surface mounted components are mixed specified maximum storage temperature (Tstg max). If the
on one printed-circuit board. However, wave soldering is printed-circuit board has been pre-heated, forced cooling
not always suitable for surface mounted ICs, or for may be necessary immediately after soldering to keep the
printed-circuits with high population densities. In these temperature within the permissible limit.
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology. Repairing soldered joints
A more in-depth account of soldering ICs can be found in
Apply a low voltage soldering iron (less than 24 V) to the
our “IC Package Databook” (order code 9398 652 90011).
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
Soldering by dipping or by wave
soldering iron bit is less than 300 °C it may remain in
The maximum permissible temperature of the solder is contact for up to 10 seconds. If the bit temperature is
260 °C; solder at this temperature must not be in contact between 300 and 400 °C, contact may be up to 5 seconds.
DEFINITIONS
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