A Review On Preparation Methods of Nanocomposites
A Review On Preparation Methods of Nanocomposites
A Review On Preparation Methods of Nanocomposites
K. TAMIZH SELVI
Dept. of Physics, Vel Tech High Tech Engineering College, Chennai, India
*corresponding author [email protected]
ABSTRACT
Nanocomposites are the emerging material in the field of nanotechnology disciplines such as electrical engineering,
mechanical engineering, physics, chemistry, biology and material science. Nanocomposite is a multiphase solid
material, in which atleast one of the phases shows dimensions in the nanometer range (1 nm=10 -9 m).
Nanocomposites are multifunctional materials due to their high transparency, electrical conductivity, increased
environmental stability, diffusion constants, mechanical strength, optical quality, heat resistance and recyclability. In
this review Various methods of preparation of Nanocomposirtes will be discussed
I INTRODUCTION
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Chemical vapor deposition (CVD) process involves (Source: Marcio R. Loos 2017).
the deposition of solid thin-film to the target surfaces.
It is also used to synthesis high purity bulk powders, Fig.2 Schematic diagram of the CVD apparatus
bulk materials as well as fabricating nanocomposite
materials via infiltration techniques. The precursors
may be solid, liquid or a gaseous form at ambient IV Sputter Deposition
conditions but it is converted into vapor before it
transferred into the reactor. These vapour precursor is It involves the ejection of atoms from a target
delivered to the hot wall reactor under ambient material onto a substrate and they condensed to
temperature and it is allowed to deposit on the hot form a film. The sputtering atom should possess the
substrate. They react or decompose into solid phase higher kinetic energy (>>1eV). The sputtering gas is
which deposits on the substrate. CVD is a preferred often an inert gas such as Argon (Ar). For efficient
method to process any metallic or ceramic momentum transfer, the atomic weight of the
compounds such as borides, nitrides, metals, alloys, sputtering gas should be close to the atomic weight
Oxides and intermetallic compounds. of the target,
so far sputtering light elements Neon (Ne) is
preferable while for heavy elements Krypton (Kr) or
Since 1960, CVD has been used to produce carbon Xenon (Xe) are used. In sputtering process (shown
filaments and fibers. In this method, a carbon-
in Figure 1.6), the composition of final product is
containing gas is decomposed to a high temperature
the same as the composition of initial precursor
(600oC or higher) and deposits on a substrate in the material. This method is highly suitable for
presence of catalyst metal particles as shown in non-agglomerated and ultra pure metals.
Figure 1.5. The lower temperatures used in this
method reduce production costs. Carbon nanotubes
(CNTs) fabricated by this method have a large One of the most important applications of sputtering
number of defects. is the production of computer hard disks, CDs and
DVDs. This method is widely used in semiconductor
industry for thin film deposition of various materials
Chemical Vapour Deposition technique in integrated circuit (IC) processing. Sputtering
is mainly uses in coatings, corrosion resistance, wear process is also used in the manufacturing of thin film
resistance and erosion protection. It has an transistor and photovoltaic solar cells.
application for the synthesis of catalysts,
nanopowders and fibers. It is also used in the
fabrication of semiconductor devices such as
integrated circuits, optoelectronic devices and
sensors.
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International Journal of Trendy Research in Engineering and Technology
Volume 4 Issue 1 Feb’ 2020
ISSN NO 2582-0958
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V Co-precipitation
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replaced the alkoxide groups (OR). considered to be more suitable for the preparation of
Polycondensation reaction produces a gel, a three multicomponent materials
dimensional network. The structure of gel is purely
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