QUALCOMM CHIPSET SOLUTIONS

CONVERGENCE
E N H A N C E D M U LT I M E D I A
M U LT I M E D I A

QSC6010 /QSC6020 /QSC6030™ ™ ™ VA L U E

Single-Chip Solutions
Affordable, accessible 3G wireless for all
The QUALCOMM® Value Platform has been designed to expand the market for voice and data services by offering
affordable chipsets that support third-generation (3G) CDMA2000® 1X with backward compatibility for 2G standards.
Basic color screens, camera functionality, music and ringtones will now be available to a much wider market.

The Value Platform can offer a vast audience of handset users — including those new to wireless — their first taste of
the power of 3G networks, creating lucrative opportunities for manufacturers and operators alike. The integrated
chipset design of the Value Platform allows manufacturers to quickly and cost-effectively bring handsets to market,
while the integrated selection of Launchpad™ suite of integrated technologies enables operators to provide entry-level
customers with exciting new services that encourage voice and data usage and ultimately increase average revenue
per user (ARPU).

The Value Platform creates a seamless path to move customers up to 3G networks. Using QUALCOMM’s proven,
reliable wireless technology, manufacturers and operators can offer a range of entry-level phones with more features,
at less cost than ever before.

NOW BASIC COLOR SCREENS, MUSIC AND RINGTONES WILL BE AVAILABLE TO A

MUCH WIDER MARKET.

PERFORMANCE
Maximize design and development potential • Support for low-cost 19.2 MHz XO
• Air interfaces supported: • High-performance ARM926EJ-S™
- CDMA2000 1X (Release 0) microprocessor core with memory
management unit (MMU)
• World’s only single-chip CDMA2000 1X
solution to integrate baseband modem, • Advanced 351-pin 0.65 mm pitch MSP
radio transceiver, power management and packaging technology (15 mm x 15 mm)
multimedia engines onto a single chip • Integrated secure boot for enhanced
• Enhanced memory support for page/burst security
mode NOR flash, NAND flash memory
interface and pseudo SRAM
• Two QDSP4000™ high-performance digital
signal processors (DSP)
 QUALCOMM CHIPSET SOLUTIONS

QSC6010™/QSC6020™/QSC6030™
Single-Chip Solutions
The QSC family of single-chip solutions for CDMA2000 1X networks are all
pin and software compatible that bring flexible 3G capabilities to cost-sensitive
markets. Depend on QSC chips to develop wireless devices that feature
entry-level data services and multimedia applications, and can be produced
at attractive price points to drive mass-market appeal.

CONNECTIVITY
Connection with indispensable consumer electronics
• Integrated WAP 2.0-compliant API
• Integrated universal serial bus (USB) functionality
• Removable User Identity Module (R-UIM) system solution to seamlessly
share user information and data features on a removable smart card
• SecureMSM™ security suite v2.0: integrated secure boot for enhanced security

IMAGING
Integrated digital-still camera interface
• Qcamera™ software with 15 frames per second (fps) QCIF viewfinder capture
and snapshot
• Support for up to 1.3 megapixel camera sensors
• Accelerated JPEG encoding and decoding engine for pictures and
camera-based applications

AUDIO
Exceptional voice quality
• MIDI Synthesizer (32 polyphony)
• CMX™ multimedia software for customized ringtones, screensavers and
greeting cards:
- MIDI-based voice (up to 64 polyphony)
- Playback support for compact MIDI, General MIDI, SMAF™
(audio only) and SP-MIDI
• Digital audio support for MP3
• Support for stereo output up to 48 kHz
• Fourth-Generation Vocoder™ (4GV™) voice codec to provide network operators
with the flexibility to prioritize voice quality and network capacity

VIDEO
Wireless video solutions for fast-action infotainment
Qtv™ Decoder
• High-performance video player powers video- and audio-on-demand plus
video messaging at 15 fps QCIF
• Supports MPEG-4, H.263 and QCELP®, AMR-NB, EVRC, AAC and aacPlus™
audio codecs

2 Please visit www.cdmatech.com/valueplatform to view the chipset comparison tool that details specific chipset features.
 QUALCOMM’s radioOne® zero-IF radio frequency and powerOne™ power management solutions are
optimized for our MSM chipsets for high-efficiency, price-competitive wireless devices. Expect a higher
return on investment with our integrated solution — fewer discrete parts means lower development
costs, lower BOM costs and ultimately lower handset costs. With our innovative RF CMOS processing
technology and lead-free packaging solutions, handset manufacturers can be confident that wireless
devices based on our complete solutions will be power efficient, dependable and cost competitive.

The QSC family of chips includes integrated RF — the industry’s first CDMA2000 1X radio transceiver
for the 800 MHz CDMA cellular frequency. This radioOne solution combines radio receiver and
transmitter functionalities into a single design using RF CMOS process technology. The QSC chips also
integrate complete power management functionality, including better management, voltage regulation,
general housekeeping and user-interface components. This level of integration sets a new standard in
enabling handset manufacturers to realize significant Printed Circuit Board (PCB) area reduction to
enable lower cost and smaller handset form factors.

RF
• 800 MHz cellular band
• radioOne, RFCMOS

PMIC
• Speaker amplifier/driver
• Real-time clock
• USB transceiver
• Battery charging

Q S C 6 0 1 0 / Q S C 6 0 2 0 / Q S C 6 0 3 0 | F E AT U R E S

CHIP 1X Data 19.2 MHz XO Support Polyphonic Enhanced Audio Camera Qtv™ BREW Security

QSC6010 14.4k n 32 n/a n n

QSC6020 n n 64 MP3, AAC, AAC+ n n
QSC6030 n n 64 MP3, AAC, AAC+ 1.3 MP n n n

All three QSC solutions are pin- and software API-compatible, providing handset manufacturers with flexibility and ease
of design development to lower overall handset costs.

Please visit www.cdmatech.com/valueplatform to view the chipset comparison tool that details specific chipset features. 3
 QUALCOMM CHIPSET SOLUTIONS

QSC6010™/QSC6020™/QSC6030™
Single-Chip Solutions
BURST BURST
Vcc PSRAM NOR LCD NAND

BAT EBI 1 EBI 2

FET AUDIO Speaker High Quality Ringer
& SMPS DUAL MEMORY BUSES
Sense Battery QDSP4000 Driver
&
Control LDOs - EVRC, 4GV Vocoders
ARM926EJS
- MP3, AAC, AAC+
- CMX Wideband
Vbattery Mono
AGC
PA Codec
Tx DAC

Cell
Rx PLL CDMA
Single-Chip 1X Optional
Digital
Stereo
Stereo DAC
Tx PLL Processor
LO Gen Baseband Output Optional Stereo Audio
Integrated Radio Transciever
Power Management Ringer Low Quality Buzzer
Interface (Optional)

Rx Vibrate
ADC Driver
PC CONNECTIVITY
TEST/DEBUG SYSTEM
Sleep Ctrl 2 LED

UART2 / RUIM
Current Sinks
MODE Select
Interface

Interface

Temp Comp/
Keypad I/F

USB XCVR

RTC
JTAG

Buffer
CAMERA
UART1

Clock Gen
INTERFACE
HKADC
External Mode Selection

Digital Test Bus

1 2 3
4 5 6
19.2 MHz 7 8 9
XO * 0 #

I n f o r m a t i o n s h o w n i n t h i s d o c u m e n t i s o n l y e x e m p l a r y o f Q U A L C O M M p ro d u c t s .
QUALCOMM reserves the right to make changes, at any time and without notice, to its
products that may cause its products to differ from the information shown in this document.
NOTE: Alternative GPS antenna configurations are available.

Go Online CHIPSET COMPARISON ONLINE TOOL

Please visit www.cdmatech.com/valueplatform to view the chipset comparison tool that details specific chipset features.

© 2006 QUALCOMM Incorporated. All rights reserved. QUALCOMM, BREW and radioOne are registered trademarks of QUALCOMM Incorporated. QSC6010, QSC6020, QSC6030,
QDSP4000, 4GV, powerOne, Launchpad, SecureMSM, Q3Dimension, Qcamera and Qtv are trademarks of QUALCOMM Incorporated. ARM926EJ-S, Jazelle and the ARM logo are
trademarks or registered trademarks of ARM Limited. CDMA2000 is a registered trademark of the Telecommunications Industry Association (TIA USA). Java is a registered trademark
of Sun Microsystems, Inc. in the United States and other countries. The Open Mobile Alliance (OMA) name and logo are trademarks of Open Mobile Alliance Ltd. All other trademarks
and service marks are the property of their respective owners. Data subject to change without notice.
QSC60xx_6/2006 Rev. E (ACL1063)