UM10395

UBA2014 evaluation board

Rev. 01 — 14 October 2009 User manual

Document information
Info Content
Keywords UBA2014, evaluation board, TL, CFL
Abstract This user manual describes the UBA2014 application board, which is
designed to be a flexible tool for demonstrating the many UBA2014
fluorescent tube driver applications.
NXP Semiconductors UM10395
UBA2014 evaluation board

Revision history
Rev Date Description
01 20091014 First issue

Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
UM10395_1 © NXP B.V. 2009. All rights reserved.

User manual Rev. 01 — 14 October 2009 2 of 24

NXP Semiconductors UM10395
UBA2014 evaluation board

1. Introduction
This document describes the UBA2014 application board. The board is designed to be a
flexible tool that demonstrates the many different applications that are possible with the
UBA2014 fluorescent tube driver. Please note that this board is not a complete ballast
design for fluorescent tubes. The default setup is made such that a T5 HE 35W
fluorescent lamp can be demonstrated.

2. Safety warnings
The board is intended as an evaluation board to build different TL and or CFL
applications. To be able to be as flexible as possible almost no protections are build in
(except for IC internal protections). The board does not confirm to any safety norm.

WARNINGS:

• Do not supply voltages to the board without a piggyback board correctly inserted.
Failing to do so may damage the board.
• Always operate with burner (lamp) connected to the board and connected to the
resonant circuit. Failing to do so may damage the board.
• Many parts contain dangerous high voltages. It is necessary to take relevant safety
precautions before using this board.
• Do not touch any part of the board during and shortly after operation of the board.

UM10395_1 © NXP B.V. 2009. All rights reserved.

User manual Rev. 01 — 14 October 2009 3 of 24

NXP Semiconductors UM10395
UBA2014 evaluation board

3. Board description
The board exists of two separate PCBs. The main board with the resonance circuit and a
small "piggyback" board with the UBA2014 IC.

3.1 Piggyback board

The piggyback board contains the UBA2014 IC with the preheat, sweep and oscillator
capacitor, the VDD generation and some other low voltage components.

The piggyback PCB can be easily replaced in case of damage. Care should be taken that
the board is inserted properly. Pin 11 has been removed from the piggyback board to
prevent the board being inserted incorrectly.

Fig 1. Piggyback board

UM10395_1 © NXP B.V. 2009. All rights reserved.

User manual Rev. 01 — 14 October 2009 4 of 24

NXP Semiconductors UM10395
UBA2014 evaluation board

3.2 Main board

The main board has all the other necessary circuit to make a TL or CFL application. The
board consists of the following:

• DC and AC input connector

• Dimming input
• 2 sockets for FETs
• 2 different transformers.
• Area for experiments
• Connectors for up to 4 burners

Fig 2. UBA2014 Main board with inserted piggyback board

UM10395_1 © NXP B.V. 2009. All rights reserved.

User manual Rev. 01 — 14 October 2009 5 of 24

NXP Semiconductors UM10395
UBA2014 evaluation board

4. Schematics
In Figure 3 the schematics of the piggyback board with the UBA2014 IC can be found.
The settings for the oscillator and sweep are R1 = 33 kΩ (to pin IREF), C3 = 100 pF (to
pin CF) and C1 = 330 nF (to pin CT). Which will give a minimum oscillator frequency of
39.5 kHz and a preheat time of 1.85 s.

(1) (R1B)
Fig 3. Piggyback board with UBA2014 circuit

UM10395_1 © NXP B.V. 2009. All rights reserved.

User manual Rev. 01 — 14 October 2009 6 of 24

NXP Semiconductors UM10395
UBA2014 evaluation board

(1) version R1B sch HB.png

Fig 4. Main board half bridge and resonance circuit

UM10395_1 © NXP B.V. 2009. All rights reserved.

User manual Rev. 01 — 14 October 2009 7 of 24

NXP Semiconductors UM10395
UBA2014 evaluation board

Fig 5. Main board input section

Fig 6. Main board dimming input

UM10395_1 © NXP B.V. 2009. All rights reserved.

User manual Rev. 01 — 14 October 2009 8 of 24

NXP Semiconductors UM10395
UBA2014 evaluation board

Fig 7. Main board transformer T2/T3

UM10395_1 © NXP B.V. 2009. All rights reserved.

User manual Rev. 01 — 14 October 2009 9 of 24

NXP Semiconductors UM10395
UBA2014 evaluation board

Fig 8. Main board lamp connectors and experimental area

UM10395_1 © NXP B.V. 2009. All rights reserved.

User manual Rev. 01 — 14 October 2009 10 of 24

NXP Semiconductors UM10395
UBA2014 evaluation board

5. Connectors

5.1 Power supply connectors

The board can be supplied by either high voltage DC or a mains AC input. For most
applications the high voltage DC input should be used. In the final product you can than
use a PFC of your choice to replace the high voltage DC supply.

For some applications the rectified mains is sufficient, like most CFL applications. In these
cases the mains (230 V AC) input could be used.

Table 1. DC high voltage input connector X1

Connector Signal Comment
X1-1 + plus VDC in, max 575 V
X1-2 GND ground

Table 2. AC input connector X3

Connector Signal Comment
X3-1 ~ mains (230 V AC)
X3-2 ~ mains (230 V AC)

5.2 Dimming input

The UBA2014 can also be dimmed. An input with a voltage divider has been provided so
that a 0 V to 10 V signal can be used.

Please note that there is no galvanic isolation between the dimming input and the rest of
the circuit.

A Zener diode (V15) can be placed as protection against too high input voltages if
required.

Table 3. Dimming input connector X68

Connector Signal Comment
X68-1 + 0 V to 10 V dimming input (max 10 V)
X68-2 GND ground

5.3 Lamp connectors

On the board there are connections for four lamps. In the following tables the connectors
are listed and the names of the test points connected to it.

Table 4. Lamp 1 (X56)

TP Comment
X55 connection for filament 1
X59 connection for filament 1
X62 connection for filament 2
X65 connection for filament 2

UM10395_1 © NXP B.V. 2009. All rights reserved.

User manual Rev. 01 — 14 October 2009 11 of 24

NXP Semiconductors UM10395
UBA2014 evaluation board

Table 5. Lamp 2 (X42)

TP Comment
X38 connection for filament 1
X41 connection for filament 1
X46 connection for filament 2
X49 connection for filament 2

Table 6. Lamp 3 (X21)

TP Comment
X20 connection for filament 1
X24 connection for filament 1
X27 connection for filament 2
X30 connection for filament 2

Table 7. Lamp 4 (X8)

TP Comment
X6 connection for filament 1
X9 connection for filament 1
X11 connection for filament 2
X13 connection for filament 2

5.4 Test points

Eight ground pins are distributed over the board so that (oscilloscope) probes can be
grounded without the need for long grounding wires.

Table 8. Ground test points

TP Color Signal
X102 black GND
X103 black GND
X104 black GND
X105 black GND
X106 black GND
X107 black GND
X108 black GND
X109 black GND

Remark: A test pin is available for each pin of the piggyback board.

Table 9. Connections of the piggyback board

TP Name Comment
X78 CSN negative input for the average current sensor
X79 CSP positive input for the average current sensor
X80 Vref reference voltage output
X81 LVS lamp voltage sensor input
X82 SH source for the high-side switch

UM10395_1 © NXP B.V. 2009. All rights reserved.

User manual Rev. 01 — 14 October 2009 12 of 24

NXP Semiconductors UM10395
UBA2014 evaluation board

Table 9. Connections of the piggyback board

TP Name Comment
X83 GH gate output for the high-side switch
X84 PCS preheat current sensor input
(also connected to LVS via V5, R7/C11, R5/C10)
X85 Vbrg connection to VDC via R20 (220 kΩ)
X86 GL gate output for the low-side switch
X87 GND ground
X88 VDD low-voltage supply

5.5 Transformer T1
In the default setup transformer T1 will be used and is connected with jumpers to
connector Lamp 4 (X8). The transform specifications are listed in Section 6.1.

Table 10. Default connection transformer T1

Header Comment
X110 insert to connect T1 to filament 1 lamp 4
X111 insert to connect T1 to filament 1 lamp 4
X112 insert to connect T1 to filament 2 lamp 4
X113 insert to connect T1 to filament 2 lamp 4
X114 insert to connect SH to transformer T1
X115 insert to connect T1 to resonant capacitor C6 (4.7 nF; 2000 V)

5.6 FET
Two NMOST FETs should be placed in X2 and X14. The supplied NMOSTs are type
FCP11N60 (600 V; 11 A). When using different NMOS types changing the gate resistors
R1 and R3 (default 33 Ω) maybe changed.

5.7 Current sense selection

There are 2 possibilities to use current sensing. Sensing of the half bridge current and
sensing of the lamp current.

Table 11. Current sensing selection

X33 pin 1 to 2 pin 2 to 3
half bridge shorted open
lamp current open shorted

5.7.1 Half bridge current sensing

Pin 1 to 2 of Jumper X33 should be shorted to connect the sense resistor network in the
half bridge to the CSN pin of the UBA2014. With jumper X32 and X34 different values of
the sense resistor can be selected. X39 should be shorted between pin 2 and 3 to connect
the lamp to ground.

UM10395_1 © NXP B.V. 2009. All rights reserved.

User manual Rev. 01 — 14 October 2009 13 of 24

NXP Semiconductors UM10395
UBA2014 evaluation board

Table 12. Current sensing selection

X32 X34 Resistance
short short 0.5 Ù
short open 1.0 Ù
open short 1.5 Ù
open open 2.0 Ù

5.7.2 Lamp current sensing

Pin 2 to 3 of Jumper X33 should be shorted to connect the lamp current sense network to
the CSN pin. X39 should be shorted between pin 1 and 2 to connect the lamp to the
sensing circuit.

5.8 Using transformer T3

Transformer T2/T3 is a double footprint to enable the use of different types of
transformers. In the default setup, T3 is placed on the board. Pin 1 of the transformer is
connected to SH by means of inserting jumper X117. Table 13 shows the different
inductance values that can be made with this transformer. The specifications of the
transformer are listed in Section 6.2.

Table 13. Transformer T3 primary connections

Connection Inductance
X69 2.0 mH
X73 2.5 mH
X75 3.0 mH
X77 3.5 mH
X91 4.0 mH

Table 14. Transformer T3 secondary connections

Connection Inductance
X70-X72 15 μH
X74-X76 15 μH

UM10395_1 © NXP B.V. 2009. All rights reserved.

User manual Rev. 01 — 14 October 2009 14 of 24

NXP Semiconductors UM10395
UBA2014 evaluation board

6. Transformer specifications

6.1 Transformer T1

6.1.1 Schematic diagram

Primary Secondary

12

N2
6 10
9 N3
N1 N3 N2
1 N1
7

Fig 9. Transformer schematic diagram

6.1.2 Winding specification

Table 15. Winding specifications transformer T1
No Pin Turns Winding Insulation
Start Finish Wire method Turns Width
N1 1 6 0.23 mm 212 center - -
I1 - - 1 10 mm
N2 7 9 0.23 mm 7 center - -
I2 - - 1 10 mm
N3 10 12 0.23 mm 7 center - -
I3 - - - - - 1 10 mm

Table 16. Electrical characteristics transformer T1

Pin Specification Remark
Inductance 1–6 3.9 mH ± 10 % 60 kHz, 1 V

6.1.3 Core and bobbin

Core: RM-8 (Ferroxcube RM/I or equivalent)

Core material: 3F3, N87 or equivalent

Bobbin: RM-8 (12 pin, vertical type)

UM10395_1 © NXP B.V. 2009. All rights reserved.

User manual Rev. 01 — 14 October 2009 15 of 24

NXP Semiconductors UM10395
UBA2014 evaluation board

(1) Bottom view

Fig 10. Bobbin RM-8 (12 pin, vertical type)

6.2 Transformer T3

6.2.1 Schematic diagram

1 7
N1 N6
2 8

N2
3
N3
4

N4
5 9

N5 N7
6 10

Fig 11. Bobbin RM-8 (12 pin, vertical type)

Table 17. Winding specifications transformer T1

No Pin Wire Turns Insulation
Start Finish
N1 1 2 40 × 0.04 mm 144 -
N2 2 3 40 × 0.04 mm 16 -
ISO - - - - 0.2 mm
N3 3 4 4 × 0.04 mm 15 -
N4 4 5 40 × 0.04 mm 14 -
N5 5 6 40 × 0.04 mm 14 -
ISO - - - - 0.2 mm

UM10395_1 © NXP B.V. 2009. All rights reserved.

User manual Rev. 01 — 14 October 2009 16 of 24

NXP Semiconductors UM10395
UBA2014 evaluation board

Table 17. Winding specifications transformer T1 …continued

No Pin Wire Turns Insulation
Start Finish
N6 7 8 40 × 0.04 mm 12 -
N7 9 10 40 × 0.04 mm 12
ISO - - - - 0.2 mm

Table 18. Electrical characteristics transformer T1

Pin Specification Remark
N1 1–2 2 mH 2A
N1 + N2 1–3 2.5 mH 1.8 A
N1 + N2 + N3 1–4 3 mH 1.7 A
N1 + N2 + N3 + N4 1–5 3.5 mH 1.5 A
N1 + N2 + N3 + N4 + N5 1–6 4 mH 1.4 A
N6 7-8 15 μH -
N7 8-9 15 μH -

6.2.2 Core and bobbin

Core: E30/15/7

Core material: 3F3

Air gap in center leg: 1100 μm

Bobbin: CSH-E30/7-1S-10P

(1) Bottom view

Fig 12. Bobbin CSH-E30/7-1S-10P

UM10395_1 © NXP B.V. 2009. All rights reserved.

User manual Rev. 01 — 14 October 2009 17 of 24

NXP Semiconductors UM10395
UBA2014 evaluation board

7. Application example

7.1 Default application T5 HE 35 W

The default settings of the board are for a T5 HE 35 W burner.

Table 19. Default settings

Jumper Position Comment
X32 short half bridge sense resistor 1 Ω (used for PCS)
X34 open
X33 1-2 open, 2-3 short use lamp current sensing
X114 short connect transformer T1
X115 short
X39 1-2 shorted, 2-3 open connect Lamp to lamp current sense circuit
X110, X111, X112, short connect to lamp-4
X113
X117 open do not connect transformer T3

Table 20. Default settings

Jumper Position Comment
X32 short half bridge sense resistor 1 Ω (used for PCS)
X34 open
X33 1-2 open, 2-3 Short use lamp current sensing
X114 short connect transformer T1
X115 short
X39 1-2 shorted, 2-3 open connect Lamp to lamp current sense circuit
X110, X111, X112, short connect to lamp-4
X113
X117 open do not connect transformer T3

Table 21. External connections for T5 HE 35W

Jumper Position Comment
X1 VDC 400 V (DC)
X68 external dimming 10 V for full power
X8 burner H5 TE 35 W burner

7.2 Tolerances
Due to tolerance, the resonance inductor has a value of 3.9 mH ± 10 % and
CF = 100 pF ± 5 % the output current sometimes does not match the required current.

In general it is important to choose the minimum operating frequency low enough too
guarantee correct operation for all possible tolerance variations. As shown in Table 21
there are certain conditions in which the required lamp power can not be reached on this
board due to the fact that the oscillator frequency can not go below the minimum oscillator
frequency determined by the IREF and CF.

UM10395_1 © NXP B.V. 2009. All rights reserved.

User manual Rev. 01 — 14 October 2009 18 of 24

NXP Semiconductors UM10395
UBA2014 evaluation board

Table 22. Effect of tolerances on burner power

Example for 35 W burner and 5 % tolerance on CF and 10 % on Lres.
CF (100 pF) Min oscillator Inductance (3.9 mH) P burner operating
frequency point at 380 V (DC)
0% 39.5 kHz 0% 35 W at 40.5 kHz
-5% 37.5 kHz - 10 % 35 W at 42.5 kHz
-5% 37.5 kHz + 10 % 35 W at 37.5 kHz
+5% 41.5 kHz - 10 % 35 W at 42.5 kHz
+5% 41.5 kHz + 10 % 29 W at 41.5 kHz

8. Bill of Materials (BOM)

Table 23. BOM piggyback board
Reference Value Component
A1 UBA2014T NXP driver IC for HF fluorescent lamps
C1 330 nF; 16 V capacitor ceramic; X7R; 16 V, 10 %
C2 220 nF; 16 V capacitor ceramic; X7R; 16 V, 10 %
C3 100 pF capacitor ceramic; C0G; 50V, 5%
C4, C11 100 nF capacitor ceramic; X7R; 50V, 10%
C5 DNP -
C6 1 nF; 500 V capacitor ceramic; 500 V NP0 5 %
C7 5.6 nF; 50 V capacitor ceramic; 50 V X7R 10 %
C8 1 uF; 25 V capacitor ceramic; X7R 25 V 10 %
C9 10 nF capacitor ceramic; X7R, 50 V, 10 %
C10 56 nF; 50 V capacitor ceramic; 50 V X7R 10 %
R1, R7 33 kΩ resistor 1 %; 0.125 W; 100 ppm RC12H
R2, R3 240 kΩ resistor 1 %; 0.125 W; 100 ppm RC12H
R4 2.2 Ω resistor 1%; 0.125 W; 0..+ 500 ppm RC12H
R5 10 k Ω resistor 1 %; 0.125 W; 100 ppm RC12H
R6 1KΩ resistor 1 %; 0.125 W; 100 ppm RC12H
V1, V5 BAS29 NXP; Diode; 50 ns; 90 V; 250 mA
V3 BZX84C12V NXP; Zener; 250 mW; 5 %; [Y2t/Y2p/Y2W]
V2, V4 BZX84-B6V8 NXP; Zener; 250 mW, 2 %; [Z61 or *R6]
C1 68 nF; 1000 V capacitor; MKP Class X2; 20 %
C2, C3, C4, C5 47 nF; 305 V (AC) capacitor; MKP Class X2; 20 %
C6 4.7 nF; 2000 V capacitor; MKP radial potted; 5 %
C11, C14 10 nF; 100 V capacitor ceramic disc; X7R; 10 %
C12 1 nF; 100 V capacitor ceramic disc; X7R; 10 %
C15, C16 4.7 μF; 450 V capacitor electrolytic radial; 450 V 105C 20 %
C17 680 nF /50 V capacitor ceramic disc; X7R; 10 %
C18 2.2 nF / 100 V capacitor ceramic disc; X7R; 10 %
F1 fuse holder fuse holder for 5 mm × 20 mm
5 mm × 20 mm

UM10395_1 © NXP B.V. 2009. All rights reserved.

User manual Rev. 01 — 14 October 2009 19 of 24

NXP Semiconductors UM10395
UBA2014 evaluation board

Table 23. BOM piggyback board

Reference Value Component
F2 2A fuse; 5 mm × 20 mm; time lag
L1 1.5 mH inductor choke; Ir = 850 mA; R = 580 mΩ
R1, R3 33 Ω resistor; 1 %; 0.6 W; 50 ppm MRS25
R2, R4 0Ω zero ohm link; Im= 25 A at 25 °C
R5 8.2 kΩ resistor; 1 %; 0.6 W; 50 ppm MRS25
R6, R8, R9 1 Ω; 2 W resistor power; 5 %; 2 W; 100 ppm/C MFP
R11, R12 56 kΩ resistor; 1 %; 0.6 W; 50 ppm MRS25
R7 1 kΩ resistor; 1 %; 0.6 W; 50 ppm MRS25
R10 47 Ω; 2 W resistor power; 5 %; 2 W; 450 ppm/C; carbon film
R18 33 kΩ resistor; 1 %; 0.6 W; 50 ppm MRS25
R19 11 kΩ resistor; 1 %; 0.6 W; 50 ppm MRS25
R20 220 kΩ resistor; 1 %; 0.6 W; 50 ppm MRS25
R22, R23 43 kΩ resistor; 1 %; 0.6 W; 50 ppm MRS25
R24, R25 47 kΩ resistor; 1 %; 0.6 W; 50ppm MRS25
R27, R29, R33, 75 kΩ resistor; 1 %; 0.6 W; 50 ppm MRS25
R34
R31 1 kΩ resistor; 1 %; 0.6 W; 50 ppm MRS25
R32 100 kΩ resistor; 1 %; 0.6 W; 50 ppm MRS25
T1 ISE900019640 transformer; HF-TL custom-made
T3 UBA2014EB_TRAFO2 transformer; HF-TL custom Made NXP
V1, V11, V12 1N4937 diode; fast-recovery; 600 V; 1 A
V2 GBU8K bridge; 800 V; 8 A; TH
V3, V6 FCP11N60 FET MOS N-ch 650 V 11 A 0,32 E
V15 DNP -
X1, X3, X68 MKDS 2,5/ 2-5,08 terminal block (screw); 2-p; p=2e; 2.5 mm2
X2, X14 socket 3 socket straight; p = 2.54; h=7 mm
X8, X21, X42, MKDS 2,5/ 4-5,08 terminal block (screw); 4-p; p = 2e; 2.5 mm2
X56

9. Layout

Fig 13. Piggyback PCB layout front

UM10395_1 © NXP B.V. 2009. All rights reserved.

User manual Rev. 01 — 14 October 2009 20 of 24

NXP Semiconductors UM10395
UBA2014 evaluation board

Fig 14. Piggyback PCB layout bottom

Fig 15. Main board PCB layout Front

UM10395_1 © NXP B.V. 2009. All rights reserved.

User manual Rev. 01 — 14 October 2009 21 of 24

NXP Semiconductors UM10395
UBA2014 evaluation board

Fig 16. Main board PCB layout bottom

10. Glossary
CFL — Compact Fluorescent Lamp
FET — Field-Effect Transistor
NMOST — Negative channel Metal–Oxide–Semiconductor Transistor
TL — Tungsten Lamp

UM10395_1 © NXP B.V. 2009. All rights reserved.

User manual Rev. 01 — 14 October 2009 22 of 24

NXP Semiconductors UM10395
UBA2014 evaluation board

11. Legal information

11.1 Definitions NXP Semiconductors accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or applications and therefore
such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in Applications — Applications that are described herein for any of these
modifications or additions. NXP Semiconductors does not give any products are for illustrative purposes only. NXP Semiconductors makes no
representations or warranties as to the accuracy or completeness of representation or warranty that such applications will be suitable for the
information included herein and shall have no liability for the consequences of specified use without further testing or modification.
use of such information. Hazardous voltage — Although basic supply voltages of the product may be
much lower, circuit voltages up to 60 V may appear when operating this
product, depending on settings and application. Customers incorporating or
11.2 Disclaimers otherwise using these products in applications where such high voltages may
appear during operation, assembly, test etc. of such application, do so at their
General — Information in this document is believed to be accurate and own risk. Customers agree to fully indemnify NXP Semiconductors for any
reliable. However, NXP Semiconductors does not give any representations or damages resulting from or in connection with such high voltages.
warranties, expressed or implied, as to the accuracy or completeness of such Furthermore, customers are drawn to safety standards (IEC 950, EN 60 950,
information and shall have no liability for the consequences of use of such CENELEC, ISO, etc.) and other (legal) requirements applying to such high
information. voltages.
Right to make changes — NXP Semiconductors reserves the right to make Export control — This document as well as the item(s) described herein
changes to information published in this document, including without may be subject to export control regulations. Export might require a prior
limitation specifications and product descriptions, at any time and without authorization from national authorities.
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed, 11.3 Trademarks
authorized or warranted to be suitable for use in medical, military, aircraft,
Notice: All referenced brands, product names, service names and trademarks
space or life support equipment, nor in applications where failure or
are the property of their respective owners.
malfunction of a NXP Semiconductors product can reasonably be expected to
result in personal injury, death or severe property or environmental damage.

UM10395_1 © NXP B.V. 2009. All rights reserved.

User manual Rev. 01 — 14 October 2009 23 of 24

NXP Semiconductors UM10395
UBA2014 evaluation board

12. Contents
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Safety warnings . . . . . . . . . . . . . . . . . . . . . . . . . 3
3 Board description . . . . . . . . . . . . . . . . . . . . . . . 4
3.1 Piggyback board . . . . . . . . . . . . . . . . . . . . . . . . 4
3.2 Main board . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4 Schematics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5 Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.1 Power supply connectors . . . . . . . . . . . . . . . . 11
5.2 Dimming input. . . . . . . . . . . . . . . . . . . . . . . . . 11
5.3 Lamp connectors . . . . . . . . . . . . . . . . . . . . . . 11
5.4 Test points. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.5 Transformer T1 . . . . . . . . . . . . . . . . . . . . . . . . 13
5.6 FET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5.7 Current sense selection . . . . . . . . . . . . . . . . . 13
5.7.1 Half bridge current sensing. . . . . . . . . . . . . . . 13
5.7.2 Lamp current sensing . . . . . . . . . . . . . . . . . . . 14
5.8 Using transformer T3 . . . . . . . . . . . . . . . . . . . 14
6 Transformer specifications . . . . . . . . . . . . . . . 15
6.1 Transformer T1 . . . . . . . . . . . . . . . . . . . . . . . . 15
6.1.1 Schematic diagram . . . . . . . . . . . . . . . . . . . . . 15
6.1.2 Winding specification . . . . . . . . . . . . . . . . . . . 15
6.1.3 Core and bobbin . . . . . . . . . . . . . . . . . . . . . . . 15
6.2 Transformer T3 . . . . . . . . . . . . . . . . . . . . . . . . 16
6.2.1 Schematic diagram . . . . . . . . . . . . . . . . . . . . . 16
6.2.2 Core and bobbin . . . . . . . . . . . . . . . . . . . . . . . 17
7 Application example . . . . . . . . . . . . . . . . . . . . 18
7.1 Default application T5 HE 35 W . . . . . . . . . . . 18
7.2 Tolerances . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
8 Bill of Materials (BOM). . . . . . . . . . . . . . . . . . . 19
9 Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
10 Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
11 Legal information. . . . . . . . . . . . . . . . . . . . . . . 23
11.1 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
11.2 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
11.3 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 23
12 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.

© NXP B.V. 2009. All rights reserved.

For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 14 October 2009
Document identifier: UM10395_1