This document provides specifications for an N-channel enhancement mode MOSFET. Key specifications include a maximum drain-source voltage of 600V, on-resistance of 0.65 ohms at 10V gate-source voltage, and continuous drain current rating of 12A. The MOSFET packaging is TO-220F and absolute maximum ratings include drain-source voltage of 600V and gate-source voltage of ±30V. Electrical characteristics include a threshold voltage of 2.5-4.5V and input, output, and reverse transfer capacitances.
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P1260ATF: N-Channel Enhancement Mode MOSFET
This document provides specifications for an N-channel enhancement mode MOSFET. Key specifications include a maximum drain-source voltage of 600V, on-resistance of 0.65 ohms at 10V gate-source voltage, and continuous drain current rating of 12A. The MOSFET packaging is TO-220F and absolute maximum ratings include drain-source voltage of 600V and gate-source voltage of ±30V. Electrical characteristics include a threshold voltage of 2.5-4.5V and input, output, and reverse transfer capacitances.
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P1260ATF
N-Channel Enhancement Mode MOSFET
PRODUCT SUMMARY V(BR)DSS RDS(ON) ID
600V 0.65Ω @VGS = 10V 12A
TO-220F
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C Unless Otherwise Noted)
PARAMETERS/TEST CONDITIONS SYMBOL LIMITS UNITS Drain-Source Voltage VDS 600 V Gate-Source Voltage VGS ±30 TC = 25 °C 12 Continuous Drain Current2 ID TC = 100 °C 8.5 1, 2 A Pulsed Drain Current IDM 48 Avalanche Current3 IAS 7.4 3 EAS Avalanche Energy L = 10mH 277 mJ TC = 25 °C 50 Power DissipationA PD W TC = 100 °C 20 Operating Junction & Storage Temperature Range TJ, TSTG -55 to 150 °C
THERMAL RESISTANCE RATINGS
THERMAL RESISTANCE SYMBOL TYPICAL MAXIMUM UNITS Junction-to-Case RqJC 0.56 °C / W Junction-to-Ambient RqJA 62.5 1 Pulse width limited by maximum junction temperature. 2 Limited only by maximum temperature allowed. 3 VDD = 60V , Starting TJ = 25°C
Ver 1.0 1 2012/4/16
P1260ATF N-Channel Enhancement Mode MOSFET
ELECTRICAL CHARACTERISTICS (TJ = 25 °C, Unless Otherwise Noted)
LIMITS PARAMETER SYMBOL TEST CONDITIONS UNIT MIN TYP MAX STATIC Drain-Source Breakdown Voltage V(BR)DSS VGS = 0V, ID = 250mA 600 V Gate Threshold Voltage VGS(th) VDS = VGS, ID = 250mA 2.5 4.5 Gate-Body Leakage IGSS VDS = 0V, VGS = ±30V ±100 nA VDS = 600V, VGS = 0V, TC = 25 °C 25 Zero Gate Voltage Drain Current IDSS mA VDS = 600V, VGS = 0V , TC = 100 °C 250 Drain-Source On-State RDS(ON) VGS = 10V, ID = 6A 0.475 0.650 Ω Resistance1 Forward Transconductance1 gfs VDS = 40V, ID = 6A 16 S DYNAMIC Input Capacitance Ciss 2290 Output Capacitance Coss VGS = 0V, VDS = 25V, f = 1MHz 281 pF Reverse Transfer Capacitance Crss 46 2 Qg Total Gate Charge 46.5 2 Qgs VDS = 300V, VGS = 10V, ID = 6A Gate-Source Charge 10 nC 2 Qgd Gate-Drain Charge 16.1 2 td(on) Turn-On Delay Time 35 2 tr Rise Time 120 2 VDD = 300V, ID = 6A, RG = 25Ω nS Turn-Off Delay Time td(off) 115 Fall Time2 tf 90 SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS (TJ = 25 °C) Continuous Current3 IS 12 A 1 VSD IF = 8A, VGS = 0V Forward Voltage 1.4 V Reverse Recovery Time trr 420 nS IF = 12A, dlF/dt = 100A / μS, VGS = 0V Reverse Recovery Charge Qrr 4.7 nC 1 Pulse test : Pulse Width 300 msec, Duty Cycle 2%. 2 Independent of operating temperature. 3 Pulse width limited by maximum junction temperature.