Mamf-011015: X-Band Multifunction Mmic 8 - 11 GHZ
Mamf-011015: X-Band Multifunction Mmic 8 - 11 GHZ
Mamf-011015: X-Band Multifunction Mmic 8 - 11 GHZ
Description
The MAMF-011015 is an 8 - 11 GHz multifunction
GaAs MMIC designed for communication radar and
weather applications. It functions in combination with
an advanced Si serial-controller which addresses the
GaAs chip for the necessary R X/TX selection path
and the required signal controls, along with several
other functionalities.
Pin Configuration2
The MAMF-011015’s GaAs chip utilizes a 0.25 µm
pHEMT GaAs process which has been optimized for Pin Function Pin Function
RF power, low noise, and RF signal control 1-3 No Connection 25 VOPT2
applications which is ideal for high levels of 4 Ground 26 VG_LNA
integration on a single IC. This GaAs MMIC includes 5 Common 27 Ground
a “Common path” circuit where it incorporates a
6 Ground 28 Rₓ IN
4-BIT digital attenuator, a 6-BIT digital phase shifter,
and a T/R SPDT switch for R X/TX selection. The “RX 7 VEE 29 Ground
path” incorporates a low noise amplifier and 8 Ground 30 VCC1
2 additional higher attenuation bits. The “T X path” 9 - 11 No Connection 31 Ground
driver amplifier is designed to deliver sufficient RF 12 VCC2 32 Tₓ OUT
power and gain for an outside power amplifier.
13 SER IN 33 Ground
The MAMF-011015’s Si serial-controller chip is 14 CLK 34 DET
designed to address the GaAs chip’s common path 15 LE 35 REF
signal control components along with several other 16 RS 36 No Connection
functionalities such as external G/D control enabling 17 TR 37 VDD2
or disabling internal gate/drain switching of the LNA
18 EN 38 VDD1
or driver amplifier. When internal gate switching is
disabled, external drain switching may be used for 19 No Connection 39 No Connection
fast T/R switching (pulsing). 20 SWEN2 40 TEMP SENSE
21 SER OUT 41 VG_PA12
22 VEE 42 No Connection
Ordering Information1
23 SW2A50 43 G/D
Part Number Package 24 SW2B50 44 No Connection
MAMF-011015-TR0500 500 Piece Reel 453 Ground
2. MACOM recommends connecting unused (no connection) pins
MAMF-011015-001SMB Sample Board
to RF and DC ground.
3. The exposed pad centered on the package bottom must be
1. Reference Application Note M513 for reel size information.
connected to RF and DC ground.
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DPS Phase Shifter (6-Bit) LSB RX Amplifier OFF, (0 dB ATT) deg — 5.625 —
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VCC2 = VOPT2 = +5 V,
Output Pull-up FET On Resistance for
RPSW50 VEE = -5 V, Ω — 18 —
SWnA50 and SWnB50 Ports at 25°C
50 mA load
VCC2 = VOPT2 = +5 V,
Output Pull-down FET On Resistance for
RNSW50 VEE = -5 V, Ω — 15 —
SWnA50 and SWnB50 Ports at 25°C
50 mA load
4. VCC1, VDD1, and VDD2 should be turned on after VG_LNA and VG_PA12 have been turned on. When turning power off, turn off VCC1, VDD1,
and VDD2 prior to turning off VG_LNA and VG_PA12.
5. Unused logic inputs must be tied to either ground or VCC2.
6. All voltages are relative to ground.
7. 0.01 µF decoupling capacitors are required on the power supply lines.
8. VOPT2 determines the output high voltage for the external PIN driver output, and is usually tied to V CC2. When the PIN driver section is un-
used, VOPT2 should be grounded and SW2A50 and SW2B50 should be left open.
9. VEE is tied to the substrate of the die and should be the most negative voltage potential. V EE should never be biased higher than any other
power supplies.
10. IOPT2 and IEE are determined by the external PIN diode switches. They should not exceed 50 mA.
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11. When switching states, it is important to avoid having TX and RX on at the same time, which could potentially lead to undesired spurious
signals or a damaging oscillation.
12. When gate switching, we recommend lingering in the idle state for 20 ns when transitioning between T X and RX to ensure that the TX and
RX amplifiers are not both on at the same.
13. Typical drain switching times are with the control applied to the gate of the recommended external MOSFETS, including the recommended
bypass capacitors.
RX_ON 0V
+3.3 V VCC1
RX_OFF +3.3 V
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14. Exceeding any one or combination of these limits may cause permanent damage to this device.
15. MACOM does not recommend sustained operation near these survivability limits.
16. The absolute maximum rating for VEE is the minimum of “VOPT2 + 0.5 V”, “VCC2 +0.5 V”, and “+0.5 V”.
17. If VCC2 ≥ 6.5 V, then the minimum for VIN is VCC2 - 7.0 V.
18. Operating at nominal conditions with TJ ≤ +150°C will ensure MTTF > 1 x 106 hours.
19. Junction Temperature (TJ) = TC + ӨJC * ((PDC) - (POUT - PIN))
Typical Thermal Resistance in TX mode (ӨJC) = 67.0°C/W
Typical Power Dissipation in the TX state at 25°C is 0.6 W
Typical Power Dissipation in the RX state at 25°C is 0.27 W
Typical Power Dissipation in the idle state at 25°C is 0.01 W
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12-bit Serial to Parallel Driver Serial Input Bits Order & Function Table
The phase shifting and attenuation settings are
controlled by a serial data stream. Two states are RS = 0 RS = 1
Function Bit
entered in a single 24-bit data stream, 12-bit for State A State B
each complete set of phase and attenuation C12B
-- State B
settings. -180° (MSB)
Phase Shift
C12A State A --
The 24-bit serial interface (SERIN, CLK, LE,
SER-OUT) is compatible with SPI protocol. The two C11B -- State B
12-bit control words are loaded with MSB first. Note -90°
that the bits for the two states are interlaced, as Phase Shift
C11A State A --
shown in the “serial Input Bits Order and Function
Table”. When LE is high, the 24-bit data in the serial C10B -- State B
-45°
input register will be transferred to a 24-bit latch, and Phase Shift
one of the two control words will be loaded to the C10A State A --
complementary An and Bn outputs based on the
C9B -- State B
logic state of RS control. “State A” uses the “A” bits -22.5°
while “State B” uses the “B” bits from the 24-bit Phase Shift
C9A State A --
stream. The RS control line allows fast toggling
between the two states settings. C8B -- State B
-11.25°
Phase Shift
CLK will be masked to prevent data transition when C8A State A --
LE is high. SEROUT is the SERIN delayed by 24
clock cycles. C7B -- State B
-5.6°
Phase Shift
Please refer to application note AN-0004028 for C7A State A --
more detailed instructions on the driver operation.
C6B -- State B
AN-0004028 also includes instructions to interface 16 dB
with USB-910H [USB-to-SPI/I2C embedded system Attenuator
C6A State A --
interface] for quick operation of the device.
C5B -- State B
8 dB
Attenuator
Register Select Truth Table 20 C5A State A --
C2B -- State B
1 dB
Attenuator
Attenuator and Phase Shifter Control C2A State A --
The 6-bit attenuator and 6-bit phase shifter are
C1B -- State B
controlled by serial input bits C1 ~ C12. The serial 0.5 dB
input bits order and control function are listed in Attenuator C1A
State A --
following tables. (LSB)
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For applications where an external PIN switch is VEE 0 1 Transmit OFF OFF
used, SWEN2 is set to 0 V. In most cases, VOPT2 VEE 1 0 Receive OFF ON
would be set to 0 V if an external GaAs switch is
VEE 1 1 Transmit ON OFF
used.
0V N/A 0 Receive Note 25 Note 25
0V N/A 1 Transmit Note 25 Note 25
24. In this table, the transmit or receive state signifies the how the
T/R Switches Control Truth Table21 switches are set. It does not mean that the amplifiers are
enabled (ON).
INPUTS OUTPUTS 25. The PA and LNA are enable/disabled depending on if
external MOSFETs are “ON” or “OFF”. See the suggested TX
SWEN2 TR SW2A50 SW2B50 Rₓ Path Tₓ Path and RX drain switching circuits.
0 0 VEE VOPT2 ON OFF
0 1 VOPT2 VEE OFF ON
1 X VOPT2 VEE N/A N/A
Handling Procedures
Please observe the following precautions to avoid
Gate/Drain Switching Truth Table damage:
G/D Function
Static Sensitivity
22
0V Drain Switching Integrated Circuits are sensitive to electrostatic
23
discharge (ESD) and can be damaged by static
VEE Gate Switching electricity. Proper ESD control techniques should be
22. When set in the drain switching mode, external MOSFETs will used when handling these devices.
be needed to supply the bias voltage.
23. When gate switching, the internal driver will enable/disable
the LNA (Receive amplifier) and Driver Amplifier (Transmit
amplifier).
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fdata Max. Clock Rate for Shifting Serial Data >80 MHz
CLK
LE
C12B C1A
SERIN C12A C1B
MSB LSB
tCS tCH
C12B C1A
SEROUT C12A C1B
(SERIN delayed by MSB LSB
24 clock cycles)
RS
tLS tLH
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26. VCC2 = Vopt2 = 3.0 V, VEE = -5.0 V, CL = 24 pF, input LOGIC1 = 3 V, LOGIC0 = 0 V, TRISE, TFALL = 6 ns.
Switching Waveforms
Tr Tf
LOGIC 1
90% 90%
1.3V 1.3V
INPUT C
VIN 10% 10%
LOGIC 0
TPLH TPHL
TTLH TTHL OUTPUT
OUTPUT B
90% 90% HIGH
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-2
15
TX Attenuation (dB)
-4
S21 (dB)
10
-6
5
-8
0 -10
7 8 9 10 11 7 8 9 10 11
Frequency (GHz) Frequency (GHz)
-5
0.8
-10
0.6
S11 (dB)
-15
0.4
-20
0.2
-25
-30 0.0
7 8 9 10 11 7 8 9 10 11
Frequency (GHz) Frequency (GHz)
14
-5
12
-10
TX Gain (dB)
10
S22 (dB)
-15 8
6
-20
8 GHz
4 9 GHz
-25 10 GHz
2 11 GHz
-30 0
7 8 9 10 11 -10 0 10 20 30
Frequency (GHz) TX Output Power (dBm)
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25
-8
RX Attenuation (dB)
20
-16
S21 (dB)
15
-24
10
-32
5
0 -40
7 8 9 10 11 7 8 9 10 11
Frequency (GHz) Frequency (GHz)
-10
4
-15
3
S11 (dB)
-20
2
-25
1
-30
-35 0
7 8 9 10 11 7 8 9 10 11
Frequency (GHz) Frequency (GHz)
-10
4
RX Noise Figure (dB)
-15
3
S22 (dB)
-20
2
-25
1
-30
-35 0
7 8 9 10 11 7 8 9 10 11
Frequency (GHz) Frequency (GHz)
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-45 -45
-90 -90
-135 -135
-180 -180
-225 -225
-270 -270
-315 -315
-360 -360
7 8 9 10 11 7 8 9 10 11
Frequency (GHz) Frequency (GHz)
8 8
RX PS RMS Error (deg.)
TX PS RMS Error (deg.)
6 6
4 4
2 2
0 0
7 8 9 10 11 7 8 9 10 11
Frequency (GHz) Frequency (GHz)
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†
Reference Application Note S2083 for lead-free solder reflow recommendations.
JEDEC moisture sensitivity levels MSL 3.
Plating is NiPdAu.
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THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR
IMPLIED, RELATING TO SALE AND/OR USE OF MACOM PRODUCTS INCLUDING LIABILITY OR
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, CONSEQUENTIAL OR
INCIDENTAL DAMAGES, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR
OTHER INTELLECTUAL PROPERTY RIGHT. MACOM FURTHER DOES NOT WARRANT THE ACCURACY
OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN
THESE MATERIALS. MACOM SHALL NOT BE LIABLE FOR ANY SPECIAL, INDIRECT, INCIDENTAL, OR
CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS,
WHICH MAY RESULT FROM THE USE OF THESE MATERIALS.
MACOM products are not intended for use in medical, lifesaving or life sustaining applications. MACOM
customers using or selling MACOM products for use in such applications do so at their own risk and agree to
fully indemnify MACOM for any damages resulting from such improper use or sale.
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MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
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Authorized Distributor
MACOM:
MAMF-011015-TR0500 MAMF-011015