Intel® Core™ X-Series Processor

Families
Datasheet – Volume 1

Supporting Intel® Core™ X-series Processor Family – i7-7800X, i7-7820X,

i9-7900X, i9-7920X, i9-7940X, i9-7960X, i9-7980XE, i7-9800X, i9-9820X,
i9-9900X, i9-9920X, i9-9940X, i9-9960X, i9-9980XE, i9-10980XE, i9-
10940X, i9-10920X, and i9-10900X
July 2020
Revision 005

Document Number: 335899-005

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2 Datasheet, Volume 1
Contents

1 Introduction .............................................................................................................. 7
1.1 Processor Feature Details ..................................................................................... 8
1.2 Supported Technologies ....................................................................................... 9
1.3 Interfaces .......................................................................................................... 9
1.3.1 System Memory Support ........................................................................... 9
1.3.2 PCI Express* ......................................................................................... 10
1.3.3 Direct Media Interface............................................................................. 12
1.3.4 Platform Environment Control Interface (PECI) ........................................... 13
1.4 Power Management Support ............................................................................... 13
1.4.1 Processor Package and Core States........................................................... 13
1.4.2 System States Support ........................................................................... 13
1.4.3 Memory Controller.................................................................................. 13
1.4.4 PCI Express* ......................................................................................... 13
1.5 Thermal Management Support ............................................................................ 13
1.6 Package Summary............................................................................................. 14
1.7 Operating System Support ................................................................................. 14
1.8 Terminology ..................................................................................................... 14
1.9 Related Documents ........................................................................................... 17
2 Interfaces................................................................................................................ 18
2.1 System Memory Interface .................................................................................. 18
2.1.1 System Memory Technology Support ........................................................ 18
2.1.2 System Memory Timing Support............................................................... 18
2.2 PCI Express* Interface....................................................................................... 18
2.2.1 PCI Express* Architecture ....................................................................... 18
2.2.1.1 Transaction Layer ..................................................................... 19
2.2.1.2 Data Link Layer ........................................................................ 19
2.2.1.3 Physical Layer .......................................................................... 20
2.2.2 PCI Express* Configuration Mechanism ..................................................... 20
2.3 Direct Media Interface 3 (DMI3) / PCI Express* Interface ....................................... 20
2.3.1 DMI3 Error Flow ..................................................................................... 21
2.3.2 Processor / PCH Compatibility Assumptions................................................ 21
2.3.3 DMI3 Link Down..................................................................................... 21
2.4 Platform Environment Control Interface (PECI) ...................................................... 21
3 Technologies ........................................................................................................... 22
3.1 Intel® Virtualization Technology (Intel® VT).......................................................... 22
3.1.1 Intel® VT-x Objectives ............................................................................ 22
3.1.2 Intel® VT-x Features .............................................................................. 23
3.1.3 Intel® VT-d Objectives ............................................................................ 23
3.1.3.1 Intel® VT-d Features Supported.................................................. 24
3.1.4 Intel® Virtualization Technology Processor Extensions ................................. 24
3.2 Security Technologies ........................................................................................ 25
3.2.1 Intel® Advanced Encryption Standard New Instructions
(Intel® AES-NI) Instructions .................................................................... 25
3.2.2 Execute Disable Bit................................................................................. 25
3.3 Intel® Hyper-Threading Technology (Intel® HT Technology).................................... 25
3.4 Intel® Turbo Boost Max Technology 3.0 ............................................................... 26
3.4.1 Intel® Turbo Boost Operating Frequency ................................................... 26
3.5 Enhanced Intel SpeedStep® Technology ............................................................... 26
3.6 Intel® Advanced Vector Extensions (Intel® AVX) ................................................... 27
4 Signal Descriptions.................................................................................................. 29
4.1 System Memory Interface .................................................................................. 29

Datasheet, Volume 1 3
 4.2 PCI Express* Based Interface Signals ...................................................................30
4.3 Direct Media Interface 3 (DMI3) Signals................................................................30
4.4 PECI Signal .......................................................................................................31
4.5 System Reference Clock Signals ..........................................................................31
4.6 JTAG and TAP Signals.........................................................................................31
4.7 Serial VID Interface (SVID) Signals ......................................................................32
4.8 Processor Asynchronous Sideband and Miscellaneous Signals...................................32
4.9 Processor Power and Ground Supplies ..................................................................35
5 Electrical Specifications ...........................................................................................36
5.1 Integrated Voltage Regulation .............................................................................36
5.2 Processor Signaling ............................................................................................36
5.2.1 System Memory Interface Signal Groups....................................................36
5.2.2 PCI Express* Signals...............................................................................36
5.2.3 DMI3/PCI Express* Signals ......................................................................36
5.2.4 Platform Environmental Control Interface (PECI) .........................................37
5.2.4.1 Input Device Hysteresis .............................................................37
5.2.5 System Reference Clocks (BCLK{0/1/2}_DP, BCLK{0/1/2}_DN) ...................37
5.2.6 JTAG and Test Access Port (TAP) Signals....................................................38
5.2.7 Processor Sideband Signals ......................................................................38
5.2.8 Power, Ground and Sense Signals .............................................................38
5.2.8.1 Power and Ground Lands............................................................38
5.2.8.2 Decoupling Guidelines ................................................................39
5.2.8.3 Voltage Identification (VID) ........................................................39
5.2.8.4 SVID Commands .......................................................................39
5.2.8.5 SetWP Working Point Command ..................................................40
5.2.8.6 SetVID Fast Command ...............................................................40
5.2.8.7 SetVID Slow .............................................................................41
5.2.8.8 SetVID Decay ...........................................................................41
5.2.8.9 SVID Voltage Rail Addressing ......................................................41
5.2.9 Reserved or Unused Signals .....................................................................43
5.3 Signal Group Summary.......................................................................................43
5.3.1 Power-On Configuration (POC) Options ......................................................46
5.4 Absolute Maximum and Minimum Ratings..............................................................47
5.4.1 Storage Conditions Specifications..............................................................47
5.5 DC Specifications ...............................................................................................48
5.5.1 Voltage and Current Specifications ............................................................48
5.5.2 Signal DC Specifications ..........................................................................51
5.5.2.1 DDR4 Signal DC Specifications ....................................................51
5.5.2.2 PECI DC Specifications ...............................................................52
5.5.2.3 System Reference Clock (BCLK{0/1/2}) DC Specifications ..............53
5.5.2.4 SMBus DC Specifications ............................................................55
5.5.2.5 JTAG and TAP Signals DC Specifications .......................................55
5.5.2.6 Serial VID Interface (SVID) DC Specifications................................56
5.5.2.7 Processor Asynchronous Sideband DC Specifications ......................56
5.5.2.8 Miscellaneous Signals DC Specifications .......................................57

4 Datasheet, Volume 1
Figures
1-1 Platform Block Diagram Example ........................................................................... 8
1-2 PCI Express* Lane Partitioning and Direct Media Interface Generation 3 (DMI3) with 44
PCIE lane ......................................................................................................... 11
1-3 PCI Express* Lane Partitioning and Direct Media Interface Generation 3 (DMI3) with 48
PCIE lane ......................................................................................................... 12
2-1 PCI Express* Layering Diagram........................................................................... 19
2-2 Packet Flow through the Layers........................................................................... 19
5-1 Input Device Hysteresis ..................................................................................... 37
5-2 VCCIN Static and Transient Tolerance Load Lines 1.0 mOHM ................................... 51
5-3 BCLK{0/1/2} Differential Clock Measurement Point for Ringback.............................. 54
5-4 BCLK{0/1/2} Differential Clock Crosspoint Specification ......................................... 54
5-5 BCLK{0/1/2} Single Ended Clock Measurement Points for Absolute
Cross Point and Swing ....................................................................................... 55
5-6 BCLK{0/1/2} Single Ended Clock Measure Points for Delta Cross Point ..................... 55

Tables
1-1 Terminology ..................................................................................................... 14
1-2 Related Documents ........................................................................................... 17
4-1 Memory Channel DDR0, DDR1, DDR2, DDR3, DDR4, DDR5 ..................................... 29
4-2 Memory Channel Miscellaneous ........................................................................... 30
4-3 PCI Express* Signals ......................................................................................... 30
4-4 PCI Express* Miscellaneous Signals ..................................................................... 30
4-5 DMI3 Signals .................................................................................................... 30
4-6 PECI Signal ...................................................................................................... 31
4-7 System Reference Clock (BCLK{0/1/2}) Signals .................................................... 31
4-8 JTAG and TAP Signals ........................................................................................ 31
4-9 SVID Signals .................................................................................................... 32
4-10 Processor Asynchronous Sideband Signals .......................................................... 32
4-11 Miscellaneous Signals......................................................................................... 33
4-12 Power and Ground Signals .................................................................................. 35
5-1 Power and Ground Lands.................................................................................... 38
5-2 SVID Address Usage Bus 1 ................................................................................. 41
5-3 SVID Address Usage Bus 2 ................................................................................. 42
5-4 VR13.0 Reference Code Voltage Identification (VID) Table ...................................... 42
5-5 Signal Description Buffer Types ........................................................................... 43
5-6 Signal Groups ................................................................................................... 44
5-7 Signals with On-Die Weak PU/PD......................................................................... 46
5-8 Power-On Configuration Option Lands .................................................................. 46
5-9 Processor Absolute Minimum and Maximum Ratings ............................................... 47
5-10 Storage Condition Ratings .................................................................................. 48
5-11 Voltage Specification.......................................................................................... 48
5-12 Current (ICCIN_MAX and ICCIN_TDC) Specification ............................................... 49
5-13 VCCIN Static and Transient Tolerance for 1.0LL ..................................................... 50

Datasheet, Volume 1 5
Revision History

Revision
Description Revision Date
Number

001 • Initial release May 2017

• Updated Section 1.3.1, “System Memory Support”
• Updated Section 1.3.2, “PCI Express*”
002 June 2017
• Updated Section 1.4.1, “Processor Package and Core States”
• Updated Section 1.4.2, “System States Support”

003 • Updated Section 1.1 “Processor Feature Details” June 2017

004 • Updated to include i9-99xxX and i9-99xxXE Intel® CoreTM X-series processors November 2018

005 • Updated to include i9-109xxX and i9-109xxXE Intel® CoreTM X-series processors July 2020

§§

6 Datasheet, Volume 1
Introduction

1 Introduction

The Intel® Core™ X-Series processor families are the next generation of 64-bit, multi-
core processors built on 14-nm process technology. Based on the low power / high
performance processor microarchitecture, the processor is designed for a platform
consisting of a processor and Platform Controller Hub (PCH). The X-Series processor is
used with the Intel® X299 Chipset PCH.

The processor supports up to 46 bits of physical address space and 48 bits of virtual
address space. The 78xx, 79xx, 98xx, and 99xx processor families feature up to 44
lanes of PCI Express* 3.0 links capable of 8.0 GT/s, and 4 lanes of DMI/PCI Express*
3.0. The 10xxx processor family features 48 lanes of PCI Express* 3.0 links. Both
families feature an Integrated Memory Controller (IMC) that supports four channels of
DDR4 memory.

The integrated memory controller (IMC) and integrated I/O (IIO) are on a single silicon
die. This single-die solution is known as a monolithic processor.

This document covers the following Intel® Core™ X-series processor families:
• i7-7800X, i7-7820X, i9-7900X, i9-7920X, i9-7940X, i9-7960X, i9-7980XE.
• i7-9800X, i9-9820X, i9-9900X, i9-9920X, i9-9940X, i9-9960X, i9-9980XE.
• i9-10980XE, i9-10940X, i9-10920X, i9-10900X.

Note: Throughout this document, the Intel® Core™ X-Series processor families may be
referred to as “processor”. The Intel® X299 Chipset PCH may be referred to as the
“PCH”.

Note: Some processor features are not available on all processor SKUs.

Datasheet, Volume 1 7
 Introduction

Figure 1-1. Platform Block Diagram Example

CH A
CH B
PCI Express* 3.0 Processor
CH C System Memory

CH D

Direct Media Interface 3.0

(DMI 3.0) (x4)

USB 3.0

USB 2.0 Integrated LAN

Platform Controller
Hub (PCH)
SATA, 6 GB/s PCI Express* 3.0

SPI Intel® High

SPI Flash
Definition Audio
(Intel® HD Audio)

LPC
SMBus 2.0
Super IO / EC
GPIOs

1.1 Processor Feature Details

• Up to 18 execution cores
• Each core supports two threads (Intel® Hyper-Threading Technology)
• 32 KB instruction and 32 KB data first-level cache (L1) for each core
• 1.0 MB private instruction/data mid-level cache (MLC) for each core
• 1.375 MB shared Low-Level Cache (LLC) per core (non-inclusive)

8 Datasheet, Volume 1
Introduction

1.2 Supported Technologies

• Intel® Virtualization Technology (Intel® VT)
• Intel® Virtualization Technology (Intel® VT) for Directed I/O (Intel® VT-d)
• Intel® Virtualization Technology (Intel® VT) Processor Extensions
• Intel® 64 Architecture
• Intel® Streaming SIMD Extensions 4.2 (Intel® SSE4.2)
• Intel® Advanced Vector Extensions 2.0 (Intel® AVX2)
• Intel® AVX Floating Point Bit Depth Conversion (Float 16)
• Intel® Hyper-Threading Technology (Intel® HT Technology)
• Execute Disable Bit
• Intel® Turbo Boost Technology
• Enhanced Intel® SpeedStep® Technology

1.3 Interfaces
1.3.1 System Memory Support
• Supports four DDR4 channels
• Unbuffered DDR4 DIMMs supported
• Independent channel mode or lockstep mode
• Data burst length of eight cycles for all memory organization modes
• Memory DDR4 data transfer rates of 1600 MT/s, 1866 MT/s, 2133 MT/s, 2400 MT/
s, and 2666 MT/s (1 DPC)
• 64-bit wide channels
• DDR4 standard I/O Voltage of 1.2 V
• 4Gb and 8Gb DDR4 DRAM technologies supported for these devices:
— UDIMM x8
• Up to two ranks supported per memory channel
• Open with adaptive idle page close timer or closed page policy
• Per channel memory test and initialization engine can initialize DRAM to all logical
zeros or a predefined test pattern
• Minimum memory configuration: independent channel support with one DIMM
populated
• Command launch modes of 1n/2n
• Improved Thermal Throttling
• Memory thermal monitoring support for DIMM temperature using two memory
signals, MEM_HOT_C{01/23}_N

Datasheet, Volume 1 9
 Introduction

1.3.2 PCI Express*

• The PCI Express* port(s) are fully-compliant with the PCI Express* Base
Specification, Revision 3.0 (PCIe* 3.0).
• Support for PCI Express* 3.0 (8.0 GT/s), 2.0 (5.0 GT/s), and 1.0 (2.5 GT/s).
• Up to 44 lanes of PCI Express* interconnect for general purpose PCI Express*
devices at PCIe* 3.0 speeds that are configurable for up to ten independent ports:
— Intel® Core™ i7-7820X, i9-7900X, i9-7920X, i9-7940X, i9-7960X, i9-7980XE
processor support 44 lanes
— Intel® Core™ i7-9800X, i9-9820X, i9-9900X, i9-9920X, i9-9940X, i9-9960X,
i9-9980XE processor support 44 lanes
— Intel® Core™ i7-7800X processor supports 28 lanes
— Intel® Core™ i9-10980XE, i9-10940X, i9-10920X, i9-10900X processors
support 48 lanes
• Negotiating down to narrower widths is supported. Refer Figure 1-2.
— x16 port (Port 1 and Port 2) may negotiate down to x8, x4, x2, or x1
— x12 port (Port 3) may negotiate down to x8, x4, x2, or x1
• Address Translation Services (ATS) 1.0 support.
• Hierarchical PCI-compliant configuration mechanism for downstream devices.
• Traditional PCI style traffic (asynchronous snooped, PCI ordering).
• PCI Express* extended configuration space. The first 256 bytes of configuration
space aliases directly to the PCI compatibility configuration space. The remaining
portion of the fixed 4-KB block of memory-mapped space above that (starting at
100h) is known as extended configuration space.
• PCI Express* Enhanced Access Mechanism – accessing the device configuration
space in a flat memory mapped fashion.
• Automatic discovery, negotiation, and training of link out of reset.
• Supports receiving and decoding 64 bits of address from PCI Express*:
— Memory transactions received from PCI Express* that go above the top of
physical address space (when Intel VT-d is enabled, the check would be against
the translated Host Physical Address (HPA)) are reported as errors by the
processor.
— Outbound access to PCI Express* will always have address bits 63:46 cleared
• Re-issues Configuration cycles that have been previously completed with the
Configuration Retry status.
• Power Management Event (PME) functions.
• Message Signaled Interrupt (MSI and MSI-X) messages.
• Degraded Mode support and Lane Reversal support.
• Static lane numbering reversal and polarity inversion support.
• Support for PCIe* 3.0 atomic operation, PCIe* 3.0 optional extension on atomic
read-modify-write mechanism.

10 Datasheet, Volume 1
Introduction

Figure 1-2. PCI Express* Lane Partitioning and Direct Media Interface Generation 3
(DMI3) with 44 PCIE lane

Port 1 Port 2 Port 3

Port 0 (PE1) (PE2) (PE3)
DMI / PCIe PCIe PCIe PCIe

Transaction Transaction Transaction Transaction

Link Link Link Link

Physical
Physical Physical Physical
0..3 0..3 4..7 8..11 12..15 0..3 4..7 8..11 12..15 0..3 4..7 12..15

x4 x4 x4 x4 x4 x4 x4 x4 x4 x4 x4 x4

DMI Port 1a Port 1b Port 1c Port 1d Port 2a Port 2b Port 2c Port 2d Port 3a Port 3b Port 3d

x8 x8 x8 x8 x8 x4

Port 1a Port 1c Port 2a Port 2c Port 3b Port 3d

x16 x16 x12

Port 1a Port 2a Port 3b

Datasheet, Volume 1 11
 Introduction

Figure 1-3. PCI Express* Lane Partitioning and Direct Media Interface Generation 3
(DMI3) with 48 PCIE lane

1.3.3 Direct Media Interface

• Chip-to-chip interface to the PCH.
• The DMI3 port supports x4 link width and only operates in a x4 mode when in
DMI3.
• Operates at PCI Express* 1.0, 2.0, 3.0 speeds.
• Transparent to software.
• Processor and peer-to-peer writes and reads with 64-bit address support.
• APIC and Message Signaled Interrupt (MSI) support. Will send Intel-defined “End of
Interrupt” broadcast message when initiated by the processor.
• System Management Interrupt (SMI), SCI, and SERR error indication.
• Static lane numbering reversal support.
• Supports DMI virtual channels VC0, VC1, VCm, and VCp.

12 Datasheet, Volume 1
Introduction

1.3.4 Platform Environment Control Interface (PECI)

The PECI is a one-wire interface that provides a communication channel between a
PECI client (the processor) and a PECI master (the PCH).
• Supports operation at up to two Mbps data transfers.
• Link layer improvements to support additional services and higher efficiency over
PECI 2.0 generation.
• Services include processor thermal and estimated power information, control
functions for power limiting, P-state and T-state control, and access for Machine
Check Architecture registers and PCI configuration space (both within the processor
package and downstream devices).
• Single domain (Domain 0) is supported.

1.4 Power Management Support

1.4.1 Processor Package and Core States
• Advance Configuration and Power Interface (ACPI) C-states as implemented by the
following processor C-states:
— Package: PC0, PC1/PC1E, PC2, PC3, PC6 (Package C7 is not supported)
— Core: CC0, CC1, CC1E, CC3, CC6
• Enhanced Intel SpeedStep® Technology.

1.4.2 System States Support

• S0, S3, S4, S5

1.4.3 Memory Controller

• Multiple CKE power-down modes
• Multiple self-refresh modes
• Memory thermal monitoring using MEM_HOT_C01_N and MEM_HOT_C23_N signals

1.4.4 PCI Express*

• L1 ASPM power management capability; L0s is not supported.

1.5 Thermal Management Support

• Digital Thermal Sensor with multiple on-die temperature zones
• Adaptive Thermal Monitor
• THERMTRIP_N and PROCHOT_N signal support
• On-Demand mode clock modulation
• Fan speed control with DTS
• Two integrated SMBus masters for accessing thermal data from DIMMs
• New Memory Thermal Throttling features using MEM_HOT_C{01/23}_N signals

Datasheet, Volume 1 13
 Introduction

1.6 Package Summary

The processor socket type is noted as LGA2066. The processor package is a
52.5 x 45 mm FC-LGA package.

1.7 Operating System Support

Processor Line Windows* 10 64-bit OS X Linux* OS Chrome*OS

X-Processor line Yes No No No

1.8 Terminology

Table 1-1. Terminology (Sheet 1 of 3)

Term Description

ASPM Active State Power Management

Caching Agent (also referred to as CA). It is a term used for the internal logic
Cbo providing ring interface to LLC and Core. The Cbo is a functional unit in the
processor.

DDR4 Fourth generation Double Data Rate SDRAM memory technology.

DMA Direct Memory Access

DMI3 Direct Media Interface Gen2 operating at PCI Express* 3.0 speed.

DSB Data Stream Buffer. Part of the processor core architecture.

DTLB Data Translation Look-aside Buffer. Part of the processor core architecture.

DTS Digital Thermal Sensor

Enhanced Intel Allows the operating system to reduce power consumption when performance is
SpeedStep® Technology not needed.

The Execute Disable bit allows memory to be marked as executable or non-

executable, when combined with a supporting operating system. If code
attempts to run in non-executable memory the processor raises an error to the
Execute Disable Bit operating system. This feature can prevent some classes of viruses or worms
that exploit buffer overrun vulnerabilities and can thus help improve the overall
security of the system. Refer the Intel® 64 and IA-32 Architectures Software
Developer's Manuals for more detailed information.

Refers to the normal operating conditions in which all processor specifications,

Functional Operation including DC, AC, system bus, signal quality, mechanical, and thermal, are
satisfied.

Extension of the SSE/SSE2 (Streaming SIMD Extensions) floating point

GSSE
instruction set to 256b operands.

HA Home Agent (HA)

ICU Instruction Cache Unit. Part of the processor core architecture.

IFU Instruction Fetch Unit. Part of the processor core.

The Integrated I/O Controller. An I/O controller that is integrated in the

IIO
processor die.

The Integrated Memory Controller. A Memory Controller that is integrated in the

IMC
processor die.

A component of the processor package used to enhance the thermal

Integrated Heat Spreader
performance of the package. Component thermal solutions interface with the
(IHS)
processor at the IHS surface.

14 Datasheet, Volume 1
Introduction

Table 1-1. Terminology (Sheet 2 of 3)

Term Description

64-bit memory extensions to the IA-32 architecture. Further details on Intel 64

Intel® 64 Technology architecture and programming model can be found at http://
developer.intel.com/technology/intel64/.

Intel® Core™ i7 processor Intel's 22-nm process based product. The processor supports Efficient
family for LGA2011-v3 Performance High-End Desktop platforms.
Socket processor

Intel® ME Intel® Management Engine

A feature that opportunistically enables the processor to run a faster frequency.

Intel® Turbo Boost
This results in increased performance of both single and multi-threaded
Technology
applications.

Intel® TXT Intel® Trusted Execution Technology

Processor Virtualization which when used in conjunction with Virtual Machine

Intel® Virtualization
Monitor software enables multiple, robust independent software environments
Technology (Intel® VT)
inside a single platform.
Intel® Virtualization Technology (Intel® VT) for Directed I/O. Intel® VT-d is a
hardware assist, under system software (Virtual Machine Manager or operating
Intel® VT-d system) control, for enabling I/O device Virtualization. Intel® VT-d also brings
robust security by providing protection from errant DMAs by using DMA
remapping, a key feature of Intel® VT-d.
IOV I/O Virtualization

IQ Instruction Queue. Part of the core architecture.

Integrated Voltage Regulation (IVR): The processor supports several integrated

IVR
voltage regulators.

Any timing variation of a transition edge or edges from the defined Unit Interval
Jitter
(UI).

The 2011-v3 land FC-LGA package mates with the system board through this
LGA2011-v3 Socket
surface mount, 2011-v3 contact socket.

LLC Last Level Cache

LRDIMM Load Reduced Dual In-line Memory Module

LRU Least Recently Used. A term used in conjunction with cache allocation policy.
Modified/Exclusive/Shared/Invalid/Forwarded. States used in conjunction with
MESIF
cache coherency

MLC Mid Level Cache

Non-Critical to Function: NCTF locations are typically redundant ground or non-

NCTF critical reserved, so the loss of the solder joint continuity at end of life conditions
will not affect the overall product functionality.

Platform Controller Hub. The next generation chipset with centralized platform
capabilities including the main I/O interfaces along with display connectivity,
PCH
audio features, power management, manageability, security and storage
features.

PCI Express* 2.0 PCI Express* Generation 2.0

The third generation PCI Express* specification that operates at twice the speed
PCI Express* 3.0 of PCI Express* 2.0 (8 Gb/s); PCI Express* 3.0 is completely backward
compatible with PCI Express* 1.0 and 2.0.

PECI Platform Environment Control Interface

Processor Includes the 64-bit cores, uncore, I/Os, and package

The term "processor core" refers to Si die itself which can contain multiple
Processor Core execution cores. Each execution core has an instruction cache, data cache, and
256-KB L2 cache. All execution cores share the L3 cache.

A unit of DRAM corresponding four to eight devices in parallel. These devices are
Rank
usually, but not always, mounted on a single side of a DDR4 DIMM.

RDIMM Registered Dual In-line Memory Module

Datasheet, Volume 1 15
 Introduction

Table 1-1. Terminology (Sheet 3 of 3)

Term Description

Request Transaction IDs are credits issued by the Cbo to track outstanding
RTID
transaction, and the RTIDs allocated to a Cbo are topology dependent.

SCI System Control Interrupt. Used in ACPI protocol.

Stock Keeping Unit (SKU) is a subset of a processor type with specific features,
SKU electrical, power and thermal specifications. Not all features are supported on all
SKUs. A SKU is based on specific use condition assumption.

System Management Bus. A two-wire interface through which simple system

SMBus and power management related devices can communicate with the rest of the
system.

SSE Intel® Streaming SIMD Extensions (Intel® SSE)

STD Suspend-to-Disk

A non-operational state. The processor may be installed in a platform, in a tray,

or loose. Processors may be sealed in packaging or exposed to free air. Under
these conditions, processor landings should not be connected to any supply
Storage Conditions voltages, have any I/Os biased or receive any clocks. Upon exposure to "free air"
(that is, unsealed packaging or a device removed from packaging material) the
processor must be handled in accordance with moisture sensitivity labeling
(MSL) as indicated on the packaging material.

STR Suspend-to-RAM

SVID Serial Voltage Identification

TAC Thermal Averaging Constant

TCC Thermal Control Circuit

TDP Thermal Design Power

TLP Transaction Layer Packet

TSOD Temperature Sensor On DIMM

UDIMM Unbuffered Dual In-line Memory Module

The portion of the processor comprising the shared LLC cache, IMC, HA, PCU,
Uncore
Ubox, and IIO link interface.

Signaling convention that is binary and unidirectional. In this binary signaling,

one bit is sent for every edge of the forwarded clock, whether it be a rising edge
Unit Interval
or a falling edge. If a number of edges are collected at instances t 1 , t 2 , t n ,....,
t k then the UI at instance "n" is defined as: UI n = t n - t n-1
VCCD DDR power rail

VCCIN Primary voltage input to the voltage regulators integrated into the processor.

VCCIO_IN IO voltage supply input.

VSS Processor ground.

x1 Refers to a Link or Port with one Physical Lane.

x16 Refers to a Link or Port with sixteen Physical Lanes.

x4 Refers to a Link or Port with four Physical Lanes.

x8 Refers to a Link or Port with eight Physical Lanes.

16 Datasheet, Volume 1
Introduction

1.9 Related Documents

Refer to the following documents for additional information.

Table 1-2. Related Documents

Document Number/
Document
Location

Intel® Core™ X-Series Processor Family Datasheet, Volume 2 336062

Intel® Core™ X-Series Processor Family Specification Update 335901

Advanced Configuration and Power Interface Specification 4.0 http://www.acpi.info/

PCI Local Bus Specification 3.0 http://www.pcisig.com/

PCI Express* Base Specification, Revision 3.0

PCI Express* Base Specification, Revision 2.1 http://www.pcisig.com/

PCI Express* Base Specification, Revision 1.1

PCIe* Gen 3 Connector High Speed Electrical Test Procedure 325028-001 /

http://www.intel.com/
content/www/us/en/io/pci-
express/pci-express-
architecture-devnet-
resources.html

Connector Model Quality Assessment Methodology 326123-002 /

http://www.intel.com/
content/www/us/en/
architecture-and-technology/
intel-connector-model-
paper.html

DDR4 SDRAM Specification and Register Specification http://www.jedec.org/

Intel® 64 and IA-32 Architectures Software Developer's Manuals 325462 /

• Volume 1: Basic Architecture http://www.intel.com/
• Volume 2A: Instruction Set Reference, A-M products/processor/manuals/
index.htm
• Volume 2B: Instruction Set Reference, N-Z
• Volume 3A: System Programming Guide
• Volume 3B: System Programming Guide
Intel® 64 and IA-32 Architectures Optimization Reference Manual
Intel® Virtualization Technology Specification for Directed I/O Architecture http://www.intel.com/
Specification content/www/us/en/
intelligent-systems/intel-
technology/vt-directed-io-
spec.html

§§

Datasheet, Volume 1 17
 Interfaces

2 Interfaces

This chapter describes the functional behaviors supported by the processor. Topics
covered include:
• System Memory Interface
• PCI Express* Interface
• Direct Media Interface 3 (DMI3) / PCI Express* Interface
• Platform Environment Control Interface (PECI)

2.1 System Memory Interface

2.1.1 System Memory Technology Support
The Integrated Memory Controller (IMC) supports DDR4 protocols with four
independent 64-bit memory channels and supports one unbuffered DIMM per channel.

2.1.2 System Memory Timing Support

The IMC supports the following DDR4 Speed Bin, CAS Write Latency (CWL), and
command signal mode timings on the main memory interface:
• tCL = CAS Latency
• tRCD = Activate Command to READ or WRITE Command delay
• tRP = PRECHARGE Command Period
• CWL = CAS Write Latency
• Command Signal modes = 1n indicates a new command may be issued every clock
and 2n indicates a new command may be issued every two clocks. Command
launch mode programming depends on the transfer rate and memory
configuration.

2.2 PCI Express* Interface

This section describes the PCI Express* 3.0 interface capabilities of the processor. Refer
to the PCI Express* Base Specification for details of PCI Express* 3.0.

2.2.1 PCI Express* Architecture

Compatibility with the PCI addressing model is maintained to ensure that all existing
applications and drivers operate unchanged. The PCI Express* configuration uses
standard mechanisms as defined in the PCI Plug-and-Play specification.

The PCI Express* architecture is specified in three layers – Transaction Layer, Data Link
Layer, and Physical Layer. The partitioning in the component is not necessarily along
these same boundaries. Refer to the following figure for the PCI Express* Layering
Diagram.

18 Datasheet, Volume 1 of 2
Interfaces

Figure 2-1. PCI Express* Layering Diagram

Transaction Transaction

Data Link Data Link

Physical Physical
Logical Sub-Block Logical Sub-Block

Electrical Sub-Block Electrical Sub-Block

RX TX RX TX

PCI Express* uses packets to communicate information between components. Packets

are formed in the Transaction and Data Link Layers to carry the information from the
transmitting component to the receiving component. As the transmitted packets flow
through the other layers, the packets are extended with additional information
necessary to handle packets at those layers. At the receiving side, the reverse process
occurs and packets get transformed from their Physical Layer representation to the
Data Link Layer representation and finally (for Transaction Layer Packets) to the form
that can be processed by the Transaction Layer of the receiving device.

Figure 2-2. Packet Flow through the Layers

Sequence
Framing Header Date ECRC LCRC Framing
Number

Transaction Layer
Data Link Layer
Physical Layer

2.2.1.1 Transaction Layer

The upper layer of the PCI Express* architecture is the Transaction Layer. The
Transaction Layer's primary responsibility is the assembly and disassembly of
Transaction Layer Packets (TLPs). TLPs are used to communicate transactions, such as
read and write, as well as certain types of events. The Transaction Layer also manages
flow control of TLPs.

2.2.1.2 Data Link Layer

The middle layer in the PCI Express* stack, the Data Link Layer, serves as an
intermediate stage between the Transaction Layer and the Physical Layer.
Responsibilities of Data Link Layer include link management, error detection, and error
correction.

Datasheet, Volume 1 of 2 19
 Interfaces

The transmission side of the Data Link Layer accepts TLPs assembled by the
Transaction Layer, calculates and applies data protection code and TLP sequence
number, and submits them to Physical Layer for transmission across the Link. The
receiving Data Link Layer is responsible for checking the integrity of received TLPs and
for submitting them to the Transaction Layer for further processing. On detection of
TLP error(s), this layer is responsible for requesting retransmission of TLPs until
information is correctly received, or the Link is determined to have failed. The Data Link
Layer also generates and consumes packets that are used for Link management
functions.

2.2.1.3 Physical Layer

The Physical Layer includes all circuitry for interface operation, including driver and
input buffers, parallel-to-serial and serial-to-parallel conversion, PLL(s), and impedance
matching circuitry. It also includes logical functions related to interface initialization and
maintenance. The Physical Layer exchanges data with the Data Link Layer in an
implementation-specific format, and is responsible for converting this to an appropriate
serialized format and transmitting it across the PCI Express* Link at a frequency and
width compatible with the remote device.

2.2.2 PCI Express* Configuration Mechanism

The PCI Express* link is mapped through a PCI-to-PCI bridge structure.

PCI Express* extends the configuration space to 4096 bytes per-device/function, as

compared to 256 bytes allowed by the Conventional PCI Specification. PCI Express*
configuration space is divided into a PCI-compatible region (which consists of the first
256 bytes of a logical device's configuration space) and an extended PCI Express*
region (which consists of the remaining configuration space). The PCI-compatible
region can be accessed using either the mechanisms defined in the PCI specification or
using the enhanced PCI Express* configuration access mechanism described in the PCI
Express* Enhanced Configuration Mechanism section.

The PCI Express* Host Bridge is required to translate the memory-mapped PCI
Express* configuration space accesses from the host processor to PCI Express*
configuration cycles. To maintain compatibility with PCI configuration addressing
mechanisms, it is recommended that system software access the enhanced
configuration space using 32-bit operations (32-bit aligned) only.

Refer to the PCI Express* Base Specification for details of both the PCI-compatible and
PCI Express* Enhanced configuration mechanisms and transaction rules.

2.3 Direct Media Interface 3 (DMI3) / PCI Express*

Interface
Direct Media Interface 3 (DMI3) connects the processor to the Platform Controller Hub
(PCH). DMI3 is similar to a four-lane PCI Express* supporting a speed of eight GT/s per
lane.

Note: Only DMI3 x4 configuration is supported.

20 Datasheet, Volume 1 of 2
Interfaces

2.3.1 DMI3 Error Flow

DMI3 can only generate SERR in response to errors, never SCI, SMI, MSI, PCI INT, or
GPE. Any DMI3 related SERR activity is associated with Device 0.

2.3.2 Processor / PCH Compatibility Assumptions

The processor is compatible with the PCH and is not compatible with any previous
Intel® Memory Controller Hub (MCH) and Integrated Controller Hub (ICH) products.

2.3.3 DMI3 Link Down

The DMI3 link going down is a fatal, unrecoverable error. If the DMI3 data link goes to
data link down, after the link was up, then the DMI3 link hangs the system by not
allowing the link to retrain to prevent data corruption. This is controlled by the PCH.

Downstream transactions that had been successfully transmitted across the link prior
to the link going down may be processed as normal. No completions from downstream,
non-posted transactions are returned upstream over the DMI3 link after a link down
event.

2.4 Platform Environment Control Interface (PECI)

The Platform Environment Control Interface (PECI) uses a single wire for self-clocking
and data transfer. The bus requires no additional control lines. The physical layer is a
self-clocked one-wire bus that begins each bit with a driven, rising edge from an idle
level near zero volts. The duration of the signal driven high depends on whether the bit
value is a logic ‘0’ or logic ‘1’. PECI also includes variable data transfer rate established
with every message. In this way, it is highly flexible even though underlying logic is
simple.

The interface design was optimized for interfacing to Intel processor and chipset
components in both single processor and multiple processor environments. The single
wire interface provides low board routing overhead for the multiple load connections in
the congested routing area near the processor and chipset components. Bus speed,
error checking, and low protocol overhead provides adequate link bandwidth and
reliability to transfer critical device operating conditions and configuration information.

§§

Datasheet, Volume 1 of 2 21
 Technologies

3 Technologies

This chapter covers the following technologies:

• Intel® Virtualization Technology (Intel® VT)
• Security Technologies
• Intel® Hyper-Threading Technology (Intel® HT Technology)
• Intel® Turbo Boost Technology
• Enhanced Intel SpeedStep® Technology
• Intel® Advanced Vector Extensions (Intel® AVX)

3.1 Intel® Virtualization Technology (Intel® VT)

Intel® Virtualization Technology (Intel® VT) makes a single system appear as multiple
independent systems to software. This allows multiple, independent operating systems
to run simultaneously on a single system. Intel® VT comprises technology components
to support virtualization of platforms based on Intel architecture microprocessors and
chipsets.
• Intel® Virtualization Technology (Intel® VT) for Intel® 64 and IA-32 Intel®
Architecture (Intel® VT-x) adds hardware support in the processor to improve
the virtualization performance and robustness. Intel® VT-x specifications and
functional descriptions are included in the Intel® 64 and IA-32 Architectures
Software Developer’s Manual, Volume 3B and is available at
http://www.intel.com/products/processor/manuals/index.htm
• Intel® Virtualization Technology (Intel® VT) for Directed I/O
(Intel® VT-d) adds processor and uncore implementations to support and
improve I/O virtualization performance and robustness. The Intel® VT-d
specification and other Intel® VT documents can be referenced at
http://www.intel.com/technology/virtualization/index.htm

3.1.1 Intel® VT-x Objectives

Intel® VT-x provides hardware acceleration for virtualization of IA platforms. Virtual
Machine Monitor (VMM) can use Intel® VT-x features to provide improved reliable
virtualized platforms. By using Intel® VT-x, a VMM is:
• Robust: VMMs no longer need to use para-virtualization or binary translation. This
means that off-the-shelf operating systems and applications can be run without any
special steps.
• Enhanced: Intel® VT enables VMMs to run 64-bit guest operating systems on IA
x86 processors.
• More reliable: Due to the hardware support, VMMs can now be smaller, less
complex, and more efficient. This improves reliability and availability and reduces
the potential for software conflicts.
• More secure: The use of hardware transitions in the VMM strengthens the isolation
of VMs and further prevents corruption of one VM from affecting others on the
same system.

22 Datasheet, Volume 1 of 2
Technologies

3.1.2 Intel® VT-x Features

The processor core supports the following Intel® VT-x features:
• Extended Page Tables (EPT)
— hardware assisted page table virtualization.
— eliminates VM exits from guest operating system to the VMM for shadow page-
table maintenance.
• Virtual Processor IDs (VPID)
— Ability to assign a VM ID to tag processor core hardware structures (such as,
TLBs).
— This avoids flushes on VM transitions to give a lower-cost VM transition time
and an overall reduction in virtualization overhead.
• Guest Preemption Timer
— Mechanism for a VMM to preempt the execution of a guest operating system
after an amount of time specified by the VMM. The VMM sets a timer value
before entering a guest.
— The feature aids VMM developers in flexibility and Quality of Service (QoS)
guarantees.
• Descriptor-Table Exiting
— Descriptor-table exiting allows a VMM to protect a guest operating system from
internal (malicious software based) attack by preventing relocation of key
system data structures like IDT (interrupt descriptor table), GDT (global
descriptor table), LDT (local descriptor table), and TSS (task segment selector).
— A VMM using this feature can intercept (by a VM exit) attempts to relocate
these data structures and prevent them from being tampered by malicious
software.
• Pause Loop Exiting (PLE)
— PLE aims to improve virtualization performance and enhance the scaling of
virtual machines with multiple virtual processors
— PLE attempts to detect lock-holder preemption in a VM and helps the VMM to
make better scheduling decisions

3.1.3 Intel® VT-d Objectives

The key Intel® VT-d objectives are domain-based isolation and hardware-based
virtualization. A domain can be abstractly defined as an isolated environment in a
platform to which a subset of host physical memory is allocated. Virtualization allows
for the creation of one or more partitions on a single system. This could be multiple
partitions in the same operating system, or there can be multiple operating system
instances running on the same system – offering benefits such as system consolidation,
legacy migration, activity partitioning, or security.

Datasheet, Volume 1 of 2 23
 Technologies

3.1.3.1 Intel® VT-d Features Supported

The processor supports the following Intel® VT-d features:
• Root entry, context entry, and default context
• Support for 4-K page sizes only
• Support for register-based fault recording only (for single entry only) and support
for MSI interrupts for faults
— Support for fault collapsing based on Requester ID
• Support for both leaf and non-leaf caching
• Support for boot protection of default page table
— Support for non-caching of invalid page table entries
• Support for hardware based flushing of translated but pending writes and pending
reads upon IOTLB invalidation
• Support for page-selective IOTLB invalidation
• Support for ARI (Alternative Requester ID – a PCI SIG ECR for increasing the
function number count in a PCIe* device) to support I/O Virtualization (IOV)
devices
• Improved invalidation architecture
• End point caching support (ATS)
• Interrupt remapping

3.1.4 Intel® Virtualization Technology Processor Extensions

The processor supports the following Intel® VT processor extension features:
• Large Intel® VT-d Pages
— Adds 2MB and 1GB page sizes to Intel® VT-d implementations
— Matches current support for Extended Page Tables (EPT)
— Ability to share processor EPT page-table (with super-pages) with Intel® VT-d
— Benefits:
• Less memory foot-print for I/O page-tables when using super-pages
• Potential for improved performance – due to shorter page-walks, allows
hardware optimization for IOTLB
• Transition latency reductions expected to improve virtualization performance
without the need for VMM enabling. This reduces the VMM overheads further and
increase virtualization performance.

24 Datasheet, Volume 1 of 2
Technologies

3.2 Security Technologies

3.2.1 Intel® Advanced Encryption Standard New Instructions
(Intel® AES-NI) Instructions
These instructions enable fast and secure data encryption and decryption, using the
Advanced Encryption Standard (Intel® AES-NI) which is defined by FIPS Publication
number 197. Since Intel® AES-NI is the dominant block cipher, and it is deployed in
various protocols, the new instructions will be valuable for a wide range of applications.

The architecture consists of six instructions that offer full hardware support for Intel®
AES-NI. Four instructions support the Intel® AES-NI encryption and decryption, and
the other two instructions support the Intel® AES-NI key expansion. Together, they
offer a significant increase in performance compared to pure software implementations.

The Intel® AES-NI instructions have the flexibility to support all three standard Intel®
AES-NI key lengths, all standard modes of operation, and even some nonstandard or
future variants.

Beyond improving performance, the Intel® AES-NI instructions provide important

security benefits. Since the instructions run in data-independent time and do not use
lookup tables, the instructions help in eliminating the major timing and cache-based
attacks that threaten table-based software implementations of Intel® AES-NI. In
addition, these instructions make AES simple to implement, with reduced code size.
This helps reducing the risk of inadvertent introduction of security flaws, such as
difficult-to-detect side channel leaks.

3.2.2 Execute Disable Bit

The Intel Execute Disable Bit functionality can help prevent certain classes of malicious
buffer overflow attacks when combined with a supporting operating system.
• Allows the processor to classify areas in memory by where application code can
execute and where it cannot.
• When a malicious worm attempts to insert code in the buffer, the processor
disables code execution, preventing damage and worm propagation.

3.3 Intel® Hyper-Threading Technology (Intel® HT

Technology)
The processor supports Intel® Hyper-Threading Technology (Intel® HT Technology)
that allows an execution core to function as two logical processors. While some
execution resources such as caches, execution units, and buses are shared, each
logical processor has its own architectural state with its own set of general-purpose
registers and control registers. This feature must be enabled using the BIOS and
requires operating system support.

For more information on Intel Hyper-Threading Technology, refer to

http://www.intel.com/products/ht/hyperthreading_more.htm.

Datasheet, Volume 1 of 2 25
 Technologies

3.4 Intel® Turbo Boost Max Technology 3.0

Intel® Turbo Boost Technology is a feature that allows the processor to
opportunistically and automatically run faster than its rated operating frequency if it is
operating below power, temperature, and current limits. The result is increased
performance in multi-threaded and single threaded workloads. It should be enabled in
the BIOS for the processor to operate with maximum performance.

Processors with Intel® Turbo Boost Max Technology 3.0 feature contain at least one
processor core whose maximum turbo frequency is higher than the others. To realize
the higher performance benefit of such a core, targeted applications must run on that
core. The processor core with the higher frequency may vary from one processor to
another. BIOS calls to the mailbox interface is used to identify the core with the higher
performance.

3.4.1 Intel® Turbo Boost Operating Frequency

The processor’s rated frequency assumes that all execution cores are running an
application at the thermal design power (TDP). However, under typical operation, not
all cores are active. Therefore, most applications are consuming less than the TDP at
the rated frequency. To take advantage of the available TDP headroom, the active cores
can increase their operating frequency.

To determine the highest performance frequency amongst active cores, the processor
takes the following into consideration:
• Number of cores operating in the C0 state
• Estimated current consumption
• Estimated power consumption
• Die temperature

Any of these factors can affect the maximum frequency for a given workload. If the
power, current, or thermal limit is reached, the processor will automatically reduce the
frequency to stay with its TDP limit.

Note: Intel® Turbo Boost Technology is only active if the operating system is requesting the
P0 state.

3.5 Enhanced Intel SpeedStep® Technology

The processor supports Enhanced Intel SpeedStep® Technology as an advanced means
of enabling very high performance while also meeting the power-conservation needs of
the platform.

Enhanced Intel SpeedStep® Technology builds upon that architecture using design
strategies that include the following:
• Separation between Voltage and Frequency Changes. By stepping voltage up
and down in small increments separately from frequency changes, the processor is
able to reduce periods of system unavailability that occur during frequency change.
Thus, the system is able to transition between voltage and frequency states more
often, providing improved power/performance balance.
• Clock Partitioning and Recovery. The bus clock continues running during state
transition, even when the core clock and Phase-Locked Loop are stopped, which

26 Datasheet, Volume 1 of 2
Technologies

allows logic to remain active. The core clock can also restart more quickly under
Enhanced Intel SpeedStep Technology.

3.6 Intel® Advanced Vector Extensions (Intel® AVX)

Intel® Advanced Vector Extensions (Intel® AVX) is a new 256-bit vector SIMD
extension of Intel Architecture. The introduction of Intel AVX started with the Second
Generation Intel® Core™ processor family. Intel® AVX accelerates the trend of parallel
computation in general purpose applications like image, video and audio processing,
engineering applications (such as 3D modeling and analysis), scientific simulation, and
financial analysts.

Intel® AVX is a comprehensive ISA extension of the Intel® 64 Architecture. The main
elements of Intel® AVX are:
• Support for wider vector data (up to 256-bit) for floating-point computation.
• Efficient instruction encoding scheme that supports three operand syntax and
headroom for future extensions.
• Flexibility in programming environment, ranging from branch handling to relaxed
memory alignment requirements .
• New data manipulation and arithmetic compute primitives, including broadcast,
permute, fused-multiply-add, and so on.
• Floating point bit depth conversion (Float 16)
• A group of four instructions that accelerate data conversion between 16-
bit floating point format to 32-bit and vice versa.
• This benefits image processing and graphical applications allowing
compression of data so less memory and bandwidth is required.

The key advantages of Intel® AVX are:

• Performance – Intel® AVX can accelerate application performance using data
parallelism and scalable hardware infrastructure across existing and new
application domains:
— 256-bit vector data sets can be processed up to twice the throughput of 128-bit
data sets
— Application performance can scale up with the number of hardware threads and
number of cores
— Application domain can scale out with advanced platform interconnect fabrics
• Power Efficiency – Intel® AVX is extremely power efficient. Incremental power is
insignificant when the instructions are unused or scarcely used. Combined with the
high performance that it can deliver, applications that lend themselves heavily to
using Intel® AVX can be much more energy efficient and realize a higher
performance-per-watt.
• Extensibility – Intel® AVX has built-in extensibility for the future vector
extensions:
— Operating System context management for vector-widths beyond 256 bits is
streamlined
— Efficient instruction encoding allows unlimited functional enhancements:
• Vector width support beyond 256 bits
• 256-bit Vector Integer processing

Datasheet, Volume 1 of 2 27
 Technologies

• Additional computational and/or data manipulation primitives

• Compatibility – Intel® AVX is backward compatible with previous ISA extensions
including Intel® SSE4:
— Existing Intel® SSE applications/library can:
• Run unmodified and benefit from processor enhancements
• Recompile existing Intel® SSE intrinsic using compilers that generate
Intel® AVX code
• Inter-operate with library ported to Intel® AVX
— Applications compiled with Intel® AVX can inter-operate with existing Intel®
SSE libraries.

§§

28 Datasheet, Volume 1 of 2
Signal Descriptions

4 Signal Descriptions

This chapter describes the signals. They are arranged in functional groups according to
their associated interface or category.

4.1 System Memory Interface

Table 4-1. Memory Channel DDR0, DDR1, DDR2, DDR3, DDR4, DDR5
Signal Name Description

Activate. When asserted, indicates MA[16:14] are command signals

DDR{5:0}_ACT_N
(RAS_N, CAS_N, WE_N).
DDR{5:0}_ALERT_N Parity Error detected by the DIMM (one for each channel).

Bank Address. Defines which bank is the destination for the current
DDR{5:0}_BA[1:0]
Activate, Read, Write, or Precharge command.

Bank Group: Defines which bank group is the destination for the current
DDR{5:0}_BG[1:0] Active, Read, Write or Precharge command. BG0 also determines which
mode register is to be accessed during a MRS cycle.

DDR{5:0}_CID[2] 3DS DRAM Chip ID signal

DDR{5:0}_CKE[3:0] Clock Enable.

DDR{5:0}_CLK_DN[3:0] Differential clocks to the DIMM. All command and control signals are valid on
DDR{5:0}_CLK_DP[3:0] the rising edge of clock.

Chip Select. Each signal selects one rank as the target of the command and
address.
DDR{5:0}_CS_N[7:0]
CS_N[7:6] are multiplexed with CID[4:3], respectively. CS_N[3:2] are
multiplexed with CID[1:0], respectively.

DDR{5:0}_DQ[63:0] Data Bus. DDR4 Data bits.

Data strobes. Differential pair, Data Strobe. Differential strobes latch data
DDR{5:0}_DQS_DP[17:0] for each DRAM. Different numbers of strobes are used depending on
DDR{5:0}_DQS_DN[17:0] whether the connected DRAMs are x4,x8. Driven with edges in center of
data, receive edges are aligned with data edges.

Memory Address. Selects the Row address for Reads and writes, and the
column address for activates. Also used to set values for DRAM configuration
registers.
MA[16], MA[15], and MA[14] are multi-function and multiplexed with
DDR{5:0}_MA[17:0]
RAS_N, CAS_N, and WE_N, respectively.
Note: MA[17] is not used on X-Series Processor It is reserved for future
processor implementations. The pin still requires to be routed appropriately
on the board to support future drop-in compatibility.

DDR{5:0}_PAR Even parity across Address and Command.

On Die Termination. Enables DRAM on die termination during Data Write or

DDR{5:0}_ODT[3:0]
Data Read transactions.
®
Note: Channels DDR2 and DDR5 are reserved on the HEDT Intel X-Series processor.

Datasheet, Volume 1 of 2 29
 Signal Descriptions

Table 4-2. Memory Channel Miscellaneous

Signal Name Description

System memory reset: Reset signal from processor to DRAM devices on

DDR {012,345}_RESET_N the DIMMs. DDR012_RESET_N is used for memory channels 0, 1 and 2
while DDR345_RESET_N is used for memory channels 3, 4 and 5.

SMBus clock for the dedicated interface to the serial presence detect
(SPD) and thermal sensors (TSoD) on the DIMMs. DDR_SCL_C012 is used
DDR{012,345}_SPDSCL
for memory channels 0, 1 and 2 while DDR_SCL_C345 is used for memory
channels 3, 4 and 5.

SMBus data for the dedicated interface to the serial presence detect (SPD)
and thermal sensors (TSoD) on the DIMMs. DDR_SDA_C012 is used for
DDR{012,345}_SPDSDA
memory channels 0, 1 and 2 while DDR_SDA_C345 is used for memory
channels 3, 4 and 5.

DDR{5:0}_CAVREF DIMM Command address VREF signal.

Power good for VCCD rail used by the DRAM. This is an input signal used
DDR{012,345}_DRAM_PWR_OK to indicate the VCCD power supply is stable for memory channels 0, 1, 2
and channels 3, 4, 5.

DDR{012,345}_RCOMP[2:0] DDR Compensation resistance control.

4.2 PCI Express* Based Interface Signals

Note: PCI Express* Ports 1, 2 and 3 Signals are receive and transmit differential pairs.

Table 4-3. PCI Express* Signals

Signal Name Description

PE{3:1}_RX_DN/DP[15:0] PCIe* Receive Data Input

PE{3:1}_TX_DN/DP[15:0] PCIe* Transmit Data Output

Table 4-4. PCI Express* Miscellaneous Signals

Signal Name Description

PCI Express* Hot-Plug SMBus Clock: Provides PCI Express* hot-plug

PE_HP_SCL support via a dedicated SMBus interface. Requires an external general
purpose input/output (GPIO) expansion device on the platform.

PCI Express* Hot-Plug SMBus Data: Provides PCI Express* hot-plug support
PE_HP_SDA via a dedicated SMBus interface. Requires an external general purpose
input/output (GPIO) expansion device on the platform.

4.3 Direct Media Interface 3 (DMI3) Signals

Table 4-5. DMI3 Signals

Signal Name Description

DMI_RX_DN/DP[3:0] DMI3 Receive Data Input

DMI_TX_DN/DP[3:0] DMI3 Transmit Data Output

30 Datasheet, Volume 1 of 2
Signal Descriptions

4.4 PECI Signal

Table 4-6. PECI Signal

Signal Name Description

PECI (Platform Environment Control Interface) is the serial sideband

PECI interface to the processor and is used primarily for thermal, power and error
management.

4.5 System Reference Clock Signals

Table 4-7. System Reference Clock (BCLK{0/1/2}) Signals

Signal Name Description

Reference Clock Differential input.

BCLK{0,1,2}_DN/DP These pins provide the required reference inputs to various PLLs inside the
processor, such as PCIe*. BCLK0, BCLK1 and BCLK2 run at 100 MHz from
the same clock source.

4.6 JTAG and TAP Signals

Table 4-8. JTAG and TAP Signals

Signal Name Description

Breakpoint and Performance Monitor Signals: I/O signals from the processor
BPM_N[7:0] that indicate the status of breakpoints and programmable counters used for
monitoring processor performance. These are 100 MHz signals.

Probe Mode Ready is a processor output used by debug tools to determine

PRDY_N
processor debug readiness.

Probe Mode Request is used by debug tools to request debug operation of

PREQ_N
the processor.

TCK (Test Clock) provides the clock input for the processor Test Bus (also
TCK
known as the Test Access Port).
TDI (Test Data In) transfers serial test data into the processor. TDI provides
TDI
the serial input needed for JTAG specification support.
TDO (Test Data Out) transfers serial test data out of the processor. TDO
TDO
provides the serial output needed for JTAG specification support.

TMS (Test Mode Select) is a JTAG specification support signal used by debug
TMS
tools.

TRST_N (Test Reset) resets the Test Access Port (TAP) logic. TRST_N must
TRST_N
be driven low during power on Reset.

Datasheet, Volume 1 of 2 31
 Signal Descriptions

4.7 Serial VID Interface (SVID) Signals

Table 4-9. SVID Signals

Signal Name Description

SVIDALERT_N [1:0] Serial VID alert.

SVIDCLK [1:0] Serial VID clock.

SVIDDATA [1:0] Serial VID data out.

4.8 Processor Asynchronous Sideband and

Miscellaneous Signals

Table 4-10. Processor Asynchronous Sideband Signals (Sheet 1 of 2)

Signal Name Description

Indicates that the system has experienced a fatal or catastrophic error and
cannot continue to operate. The processor will assert CATERR_N for
unrecoverable machine check errors and other internal unrecoverable
errors. It is expected that every processor in the system will wire-OR
CATERR_N for all processors. Since this is an I/O land, external agents are
CATERR_N allowed to assert this land which will cause the processor to take a machine
check exception. The CATERR_N signal can be sampled any time after 1.5
ms after the assertion of PWRGOOD. CATERR_N is used for signaling the
following types of errors:
• Legacy MCERR's, CATERR_N is asserted for 16 BCLKs.

Error status signals for integrated I/O (IIO) unit:

0 = Hardware correctable error (no operating system or firmware action
necessary)
ERROR_N[2:0]
1 = Non-fatal error (operating system or firmware action required to contain
and recover)
2 = Fatal error (system reset likely required to recover)

Memory throttle control. Signals external BMC-less controller that DIMM is

exceeding temperature limit and needs to increase to maximum fan speed.
MEM_HOT_C012_N and MEM_HOT_C345_N signals have two modes of
operation - input and output mode.
Input mode is externally asserted and is used to detect external events such
as VR_HOT# from the memory voltage regulator and causes the processor
MEM_HOT_C{012/345}_N
to throttle the appropriate memory channels.
Output mode is asserted by the processor known as level mode. In level
mode, the output indicates that a particular branch of memory subsystem is
hot.
MEM_HOT_C012_N is used for memory channels 0,1 and 2 while
MEM_HOT_C345_N is used for memory channels 3, 4 and 5.

Machine Check Exception (MCE) is signaled using this pin when eMCA2 is
MSMI_N enabled. The MSMI_N signal can be sampled any time after 1.5 ms after the
assertion of PWRGOOD

Power Management Sync. A sideband signal to communicate power

PMSYNC management status from the Platform Controller Hub (PCH) to the
processor.

PMSYNC_CLK 24 MHz SE Clock used for PCH PMSYNC.

PROCHOT_N will go active when the processor temperature monitoring

sensor detects that the processor has reached its maximum safe operating
temperature. This indicates that the processor Thermal Control Circuit has
PROCHOT_N
been activated, if enabled. This signal can also be driven to the processor to
activate the Thermal Control Circuit. This signal is sampled after PWRGOOD
assertion.

32 Datasheet, Volume 1 of 2
Signal Descriptions

Table 4-10. Processor Asynchronous Sideband Signals (Sheet 2 of 2)

Signal Name Description

PWRGOOD is a processor input. The processor requires this signal to be a

clean indication that all processor clocks and power supplies are stable and
within their specifications.
“Clean” implies that the signal will remain low (capable of sinking leakage
current), without glitches, from the time that the power supplies are turned
on until they come within specification. The signal must then transition
PWRGOOD monotonically to a high state.
PWRGOOD can be driven inactive at any time, but clocks and power must
again be stable before a subsequent rising edge of PWRGOOD. PWRGOOD
transitions from inactive to active when all supplies except VCCIN are stable.
The signal must be supplied to the processor; it is used to protect internal
circuits against voltage sequencing issues. It should be driven high
throughout boundary scan operation.

Global reset signal. Asserting the RESET_N signal resets the processor to a
known state and invalidates its internal caches without writing back any of
RESET_N
their contents. Note that some PLL, error states are not affected by reset
and only PWRGOOD forces them to a known state.

Assertion of THERMTRIP_N (Thermal Trip) indicates one of two possible

critical over-temperature conditions: One, the processor junction
temperature has reached a level beyond which permanent silicon damage
may occur and Two, the system memory interface has exceeded a critical
temperature limit set by BIOS.
Measurement of the processor junction temperature is accomplished
through multiple internal thermal sensors that are monitored by the Digital
Thermal Sensor (DTS). Simultaneously, the Power Control Unit (PCU)
monitors external memory temperatures using the dedicated SMBus
interface to the DIMMs. If any of the DIMMs exceed the BIOS defined limits,
THERMTRIP_N the PCU will signal THERMTRIP_N to prevent damage to the DIMMs.
Once activated, the processor will stop all execution and shut down all PLLs.
To further protect the processor, its core voltage (VCCIN), VCCD, VCCIO, VCCIO
supplies must be removed following the assertion of THERMTRIP_N.
Once activated, THERMTRIP_N remains latched until RESET_N is asserted.
While the assertion of the RESET_N signal may de-assert THERMTRIP_N, if
the processor's junction temperature remains at or above the trip level,
THERMTRIP_N will again be asserted after RESET_N is de-asserted.
This signal can also be asserted if the system memory interface has
exceeded a critical temperature limit set by BIOS. The THERMTRIP_N signal
can be sampled any time after 1.5 ms after the assertion of PWRGOOD

Table 4-11. Miscellaneous Signals (Sheet 1 of 3)

Signal Name Description
BIST Enable Strap. Input which allows the platform to enable or disable
BIST_ENABLE built-in self test (BIST) on the processor. This signal is pulled up on the die.
Refer to Table 5-7, “Signals with On-Die Weak PU/PD” for details.

BMC Initialization Strap. Indicates whether Processor Boot Mode should be

used. Used in combination with FRMAGENT and SOCKET_ID inputs.
0 = Service Processor Boot Mode Disabled. Example boot modes: Local PCH
(this processor hosts a legacy PCH with firmware behind it)
1 = Service Processor Boot Mode Enabled. In this mode of operation, the
BMCINIT processor performs the absolute minimum internal configuration and
then waits for the Service Processor to complete its initialization. The
socket boots after receiving a “GO” handshake signal via a firmware
scratchpad register.
This signal is pulled down on the die. Refer to Table 5-7, “Signals with On-
Die Weak PU/PD” for details.

This pin is used to force debug to be enabled when the ITP is connected to
DEBUG_EN_N
the main board. This allows debug to occur beginning from cold boot.

BMCINIT, DMIMODE_OVERRIDE, FRMAGENT, and LEGACY_SKT, whether

DMIMODE_OVERRIDE local or remote, whether the boot PCH is attached, whether the socket is
legacy and whether port0 is DMI or PCIe*.

Datasheet, Volume 1 of 2 33
 Signal Descriptions

Table 4-11. Miscellaneous Signals (Sheet 2 of 3)

Signal Name Description
External Alignment of Reset, used to bring the processor up into a
EAR_N deterministic state. This signal is pulled up on the die, refer to Table 5-7,
“Signals with On-Die Weak PU/PD” for details.

Indicates an internal error has occurred with the integrated voltage

regulator. The FIVR_FAULT signal can be sampled any time after 1.5 ms
FIVR_FAULT
after the assertion of PWRGOOD. FIVR_FAULT must be qualified by
THERMTRIP_N assertion.

Bootable Firmware Agent Strap. This input configuration strap used in

combination with SOCKET_ID to determine whether the socket is a legacy
socket, bootable firmware agent is present, and DMI links are used in PCIe*
FRMAGENT mode (instead of DMI3 mode).
The firmware flash ROM is located behind the local PCH attached to the
processor via the DMI3 interface.This signal is pulled down on the die, refer
to Table 5-7, “Signals with On-Die Weak PU/PD” for details.

Power Management Fast Wake. Enables quick package C3 - C6 exits of all

sockets. Asserted if any socket detects a break from package C3 - C6 state
PM_FAST_WAKE_N requiring all sockets to exit the low power state to service a snoop, memory
access, or interrupt. Expected to be wired-OR among all processor sockets
within the platform.

This output can be used by the platform to determine if the installed

processor is an X-Series processor. There is no connection to the processor
silicon for this signal. The processor package grounds or floats the pin to set
‘0’ or ‘1’, respectively.
PROC_ID [1:0] 00: X-Series Processor
01: Future processor
10: Future processor
11: Future processor

RESERVED. All signals that are RSVD must be left unconnected on the
RSVD
board.

Safe Mode Boot Strap. SAFE_MODE_BOOT allows the processor to wake up

safely by disabling all clock gating. This allows BIOS to load registers or
SAFE_MODE_BOOT patches if required. This signal is sampled after PWRGOOD assertion. The
signal is pulled down on the die. Refer to Table 5-7, “Signals with On-Die
Weak PU/PD” for details.
SKTOCC_N (Socket Occupied) is used to indicate that a processor is present.
SKTOCC_N This is pulled to ground on the processor package; there is no connection to
the processor silicon for this signal.
SOCKET_IDStrap. Socket identification configuration straps for establishing
the PECI address. This signal is used in combination with FRMAGENT to
determine whether the socket is a legacy socket, bootable firmware agent is
SOCKET_ID[2:0] present, and DMI links are used in PCIe* mode (instead of DMI3 mode).
Each processor socket consumes one Node ID, and there are 128 Home
Agent tracker entries. This signal is pulled down on the die. Refer to
Table 5-7, “Signals with On-Die Weak PU/PD” for details.

TEST[14:13], TEST[2:1]] must be individually connected to an appropriate

TEST[15:1]
power source or ground through a resistor for proper processor operation.

Intel® Trusted Execution Technology (Intel® TXT) Agent Strap.

0 = Default. The socket is not the Intel® TXT Agent.
1 = The socket is the Intel® TXT Agent.
TXT_AGENT The legacy socket (identified by SOCKET_ID[1:0] = 00b) with Intel® TXT
Agent should always set the TXT_AGENT to 1b.
This signal is pulled down on the die. Refer to Table 5-7, “Signals with On-
Die Weak PU/PD” for details.

34 Datasheet, Volume 1 of 2
Signal Descriptions

Table 4-11. Miscellaneous Signals (Sheet 3 of 3)

Signal Name Description
Intel® Trusted Execution Technology (Intel® TXT) Platform Enable Strap.
0 = The platform is not Intel® TXT enabled. All sockets should be set to
zero. Scalable DP (sDP) platforms should choose this setting if the Node
Controller does not support Intel® TXT.
1 = Default. The platform is Intel® TXT enabled. All sockets should be set
TXT_PLTEN
to one. In a non-Scalable DP platform this is the default. When this is
set, Intel® TXT functionality requires the user to explicitly enable Intel®
TXT via BIOS setup.
This signal is pulled up on the die. Refer to Table 5-7, “Signals with On-Die
Weak PU/PD” for details.

PROCDIS_N PROCDIS_N assert initiates FRB and tri-states the processor.

PWR_DEBUG_N This is a debug signal for power debug using Intel® ITP on the processor.
SOCKET_ID2 Asynchronous to other clocks in the processor.

4.9 Processor Power and Ground Supplies

Table 4-12. Power and Ground Signals

Signal Name Description

1.8 V - 1.55 V input to the Integrated Voltage Regulator (IVR) for the
processor cores, lowest level caches (LLC), ring interface, PLL, IO, and home
VCCIN agent. It is provided by a VR 13.0 compliant motherboard voltage regulator
(MBVR) for each CPU socket. The output voltage of this MBVR is controlled
by the processor, using the serial voltage ID (SVID) bus.
VCCIN_SENSE and VSS_VCCIN_SENSE are remote sense signals for VCCIN
VCCIN_SENSE MBVR13.0 and are used by the voltage regulator to ensure accurate voltage
regulation. These signals must be connected to the voltage regulator
VSS_VCCIN_SENSE feedback circuit, which insures the output voltage remains within
specification.

VCCIO_SENSE and VSS_VCCIO_SENSE are remote sense signals for VCCIO

VCCIO_SENSE and are used by the voltage regulator to ensure accurate voltage regulation.
VSS_VCCIO_SENSE These signals must be connected to the voltage regulator feedback circuit,
which insures the output voltage remains within specification.

VCCSA_SENSE and VSS_VCCSA_SENSE are remote sense signals, and are

VCCSA_SENSE used by the voltage regulator to ensure accurate voltage regulation. These
VSS_VCCSA_SENSE signals must be connected to the voltage regulator feedback circuit, which
insures the output voltage remains within specification.

VCCIO 0.95 V - 1.0 V power supply for the processor IO.

Pmax detect VCCIN supply through board R2 thermistor for VCCIN loadline
VCCINPMAX
temperature compensation

VCCSA 1.05 V - 0.55 V supply for IIO

VSENSEPMAX Pmax detect circuit output voltage

VCCD_012 1.2 V - 1.05 V power supply for the processor system memory interface.
VCCD_345

VSS Processor ground return.

VCCIO IO voltage supply input.

§§

Datasheet, Volume 1 of 2 35
Electrical Specifications

5 Electrical Specifications

This chapter describes processor signaling and DC specifications. References to various

interfaces (memory, PCIe* PECI, and so forth) are also described.

5.1 Integrated Voltage Regulation

The platform voltage regulator is integrated into the processor. Due to this integration,
the processor has one main voltage rail (VCCIN) and a voltage rail for the memory
interface (VCCD012, VCCD345 - one for each memory channel pair). The VCCIN voltage rail
will supply the integrated voltage regulators which in turn will regulate to the
appropriate voltages for the cores, cache, and system agents. This integration allows
the processor to better control on-die voltages to optimize for both performance and
power savings. The processor VCCIN rail will remain a VID -based voltage with a loadline
similar to the core voltage rail (called VCC) in previous processors. In addition to the
above, the processor has voltage rails VCCIO for IO, VCCSA for the System Agent, and
VCC33 for PIROM.

5.2 Processor Signaling

The processor includes 2066 lands, which utilize various signaling technologies. Signals
are grouped by electrical characteristics and buffer type into various signal groups.
These include DDR4 (Reference Clock, Command, Control, and Data), PCI Express*,
DMI3, Platform Environmental Control Interface (PECI), System Reference Clock,
SMBus, JTAG and Test Access Port (TAP), SVID Interface, Processor Asynchronous
Sideband, Miscellaneous, and Power/ Other signals. Refer to Table 5-6 for details.

Intel strongly recommends performing analog simulations of all interfaces.

5.2.1 System Memory Interface Signal Groups

The system memory interface utilizes DDR4 technology, which consists of numerous
signal groups. These include: Reference Clocks, Command Signals, Control Signals,
and Data Signals. Each group consists of numerous signals, which may utilize various
signaling technologies. Refer to Table 5-6 for further details.

Throughout this chapter the system memory interface may be referred to as DDR4.

5.2.2 PCI Express* Signals

The PCI Express* Signal Group consists of PCI Express* ports 1, 2, and 3, and PCI
Express* miscellaneous signals. Refer to Table 5-6 for further details.

5.2.3 DMI3/PCI Express* Signals

The Direct Media Interface Gen 3(DMI3) sends and receives packets and/or commands
to the PCH. The DMI3 is an extension of the standard PCI Express* Specification. The
DMI3/PCI Express* Signals consist of DMI3 receive and transmit input/output signals
and a control signal to select DMI3 or PCIe* 3.0 operation for port 0. Refer to Table 5-6
for further details.

Datasheet, Volume 1 36
 Electrical Specifications

5.2.4 Platform Environmental Control Interface (PECI)

PECI is an Intel proprietary interface that provides a communication channel between
Intel processors and chipset components to external system management logic and
thermal monitoring devices. The processor contains a Digital Thermal Sensor (DTS)
that reports a relative die temperature as an offset from Thermal Control Circuit (TCC)
activation temperature. Temperature sensors located throughout the die are
implemented as analog-to-digital converters calibrated at the factory. PECI provides an
interface for external devices to read processor temperature, perform processor
manageability functions, and manage processor interface tuning and diagnostics.

The PECI interface operates at a nominal voltage. The set of DC electrical specifications
shown in Section 5.5.2.2 is used with devices normally operating from a PECI
interface supply.

5.2.4.1 Input Device Hysteresis

The PECI client and host input buffers must use a Schmitt-triggered input design for
improved noise immunity. Refer to the following image and Section 5.5.2.2.

Figure 5-1. Input Device Hysteresis

5.2.5 System Reference Clocks (BCLK{0/1/2}_DP, BCLK{0/1/

2}_DN)
The processor Core, processor Uncore, PCI Express*, and DDR4 memory interface
frequencies are generated from BCLK{0/1/2}_DP and BCLK{0/1/2}_DN signals. The
processor maximum core frequency and DDR memory frequency are set during
manufacturing. It is possible to override the processor core frequency setting using
software. This permits operation at lower core frequencies than the factory set
maximum core frequency.

The processor core frequency is configured during reset by using values stored within
the device during manufacturing. The stored value sets the lowest core multiplier at
which the particular processor can operate. If higher speeds are desired, the
appropriate ratio can be configured using the IA32_PERF_CTL MSR (MSR 199h); Bits
[14:0].

37 Datasheet, Volume 1
Electrical Specifications

Clock multiplying within the processor is provided by the internal phase locked loop
(PLL), which requires a constant frequency BCLK{0/1/2}_DP, BCLK{0/1/2}_DN input,
with exceptions for spread spectrum clocking. DC specifications for the BCLK{0/1/
2}_DP, BCLK{0/1/2}_DN inputs are provided in Section 5.5.2.7.

5.2.6 JTAG and Test Access Port (TAP) Signals

Due to the voltage levels supported by other components in the JTAG and Test Access
Port (TAP) logic, Intel recommends the processor be first in the TAP chain, followed by
any other components within the system. A translation buffer should be used to
connect to the rest of the chain unless one of the other components is capable of
accepting an input of the appropriate voltage. Two copies of each signal may be
required with each driving a different voltage level.

5.2.7 Processor Sideband Signals

The processor includes asynchronous sideband signals that provide asynchronous
input, output or I/O signals between the processor and the platform or Platform
Controller Hub. Details can be found in Table 5-6, “Signal Groups”.

All Processor Asynchronous Sideband input signals are required to be asserted/ de-
asserted for a defined number of BCLKs in order for the processor to recognize the
proper signal state, these are outlined in Section 5.5.2.7, “Processor Asynchronous
Sideband DC Specifications”.

5.2.8 Power, Ground and Sense Signals

Processors also include various other signals including power/ground and sense points.
Details can be found in Table 5-6, “Signal Groups”.

5.2.8.1 Power and Ground Lands

All VCCD, VCCIN, and VCCSA, and VCC33 lands must be connected to their respective
processor power planes, while all VSS lands must be connected to the system ground
plane.

For clean on-chip power distribution, processors include lands for all required voltage
supplies. These are listed in the following table.

Table 5-1. Power and Ground Lands

Power and Ground
Comments
Lands

VCCIN Each VCCIN land must be supplied with the voltage determined by the SVID Bus
signals. VR 13.0 defines the voltage level associated with each core SVID pattern.
VCCD012 VCCD345 Each VCCD land is connected to a switchable 1.20 V supply, provide power to the
processor DDR4 interface.
VCCD is also controlled by the SVID Bus. VCCD is the generic term for VCCD012 and
VCCD345..
VCCSA IO voltage supply input
VCC33 Power supply for PIROM.
VSS Ground
VCCIO IO voltage supply input

Datasheet, Volume 1 38
 Electrical Specifications

5.2.8.2 Decoupling Guidelines

Due to its large number of transistors and high internal clock speeds, the processor is
capable of generating large current swings between low and full power states. This may
cause voltages on power planes to sag below their minimum values if bulk decoupling is
not adequate. Large electrolytic bulk capacitors (CBULK), help maintain the output
voltage during current transients, for example coming out of an idle condition. Care
must be taken in the baseboard design to ensure that the voltages provided to the
processor remain within the specifications listed in Table 5-11, “Voltage Specification”.
Failure to do so can result in timing violations or reduced lifetime of the processor.

5.2.8.3 Voltage Identification (VID)

The Voltage Identification (VID) specification for the VCCIN, VSA, voltage is defined by
the VR13.0 PWM. The reference voltage or the VID setting is set using the SVID
communication bus between the processor and the voltage regulator controller chip.
The VID settings are the nominal voltages to be delivered to the processor's lands. The
VR 13.0 Reference Code Voltage Identification Table specifies the reference voltage
level corresponding to the VID value transmitted over serial VID. The VID codes will
change due to temperature and/or current load changes in order to minimize the power
and to maximize the performance of the part. The specifications are set so that a
voltage regulator can operate with all supported frequencies.

Individual processor VID values may be calibrated during manufacturing such that two
processor units with the same core frequency may have different default VID settings.

The processor uses voltage identification signals to support automatic selection of a

power supply voltage. If the processor socket is empty (SKTOCC_N high), or a “not
supported” response is received from the SVID bus, then the voltage regulation circuit
cannot supply the voltage that is requested, the voltage regulator must disable itself or
not power on. Vout MAX register (30h) is programmed by the processor to set the
maximum supported VID code and if the programmed VID code is higher than the VID
supported by the VR, then VR will respond with a “not supported” acknowledgment.

5.2.8.4 SVID Commands

The processor provides the ability to operate while transitioning to a new VID setting
and its associated processor voltage rail. This is represented by a DC shift. It should be
noted that a low-to-high or high-to-low voltage state change may result in as many
VID transitions as necessary to reach the target voltage. Transitions above the
maximum specified VID are not supported. The processor supports the following VR
commands:
• SetVID_Fast (25 mV/µs for VCCIN, 10mV for VSA,VCCIO)
• SetVID_Slow is 1/4 of SetVID_Fast
• SetVID_Decay (downward voltage only and it's a function of the output
capacitance's time constant) commands. The VR 13.0 Reference Code Voltage
Identification Table includes SVID step sizes and DC shift ranges. Minimum and
maximum voltages must be maintained as shown in Table 5-11. This is a CSR
configuration option.

The VRM or EVRD utilized must be capable of regulating its output to the value defined
by the new VID.

39 Datasheet, Volume 1
Electrical Specifications

Power source characteristics must be guaranteed to be stable whenever the supply to

the voltage regulator is stable.

5.2.8.5 SetWP Working Point Command

The SetWP is a command that invokes a look up table for VID set points. During the
initial power on phase the CPU will program the WPx registers (WP0=3Ah..WP7=41h)
on a per rail address basis. When use with the AllCall address, SetWP acts as a group
command that moves all voltage rails on the bus to new voltages in the look up table
index. The SetWP command can also be used with an individual VR rail address and
that rail moves to the voltage in the loop up table index. Each VR domain address has
registers WP0-WPx (3Ah..41h) which stores the VID code for that domain's work
points.

The Work Point command is encoded to support up to 8 VID targets, slew rate for the
command, and alert function. The PWM should use its auto power state or auto-phase
shedding functions to select appropriate # phases, CCM/DCM operation, and so forth.
based on output load current after the SetWP command target has been reached.

Typical SetWP usage will be:

1. Processor writes VID codes to WP registers WP0 (3Ah) -WP4 (3Dh) in each VR
domain. Normally done during SVID enumeration phase of system boot.
2. If a WP0-7 register is not programmed by the CPU, the VR stays at its present VID
setting when it receives a SetWP (WPn) command.
3. Processor sends SetWP (WPn) command to one of the AllCall addresses 0Eh or 0Fh.
Refer PWM guideline for more information on AllCall address mapping.
4. Voltage rails change VID to their corresponding VID code stored in their WPx
register
5. CPU polls each VR addresses reading stutus1 to clear the alerts from the VRs
6. SVID error handling

WP0 = State 0, programed by master

WP1 = State 1, programmed by master

WP2 = State 2, programmed by master

WP3 = State 3, programmed by master

WP4 = State 4, programmed by master

WP7 = State 7

5.2.8.6 SetVID Fast Command

The SetVID_Fast command contains the target VID in the payload byte. The range of
voltage is defined in the VID table. The VR should ramp to the new VID setting with a
fast slew rate as defined in the slew rate data register. It is minimum of 25 mV/µs for
VCCIN and 10 mV/µs for other rails, depending on the amount of decoupling
capacitance.

Datasheet, Volume 1 40
 Electrical Specifications

The SetVID_Fast command is preemptive. The VR interrupts its current processes and
moves to the new VID. The SetVID_Fast command operates on 1 VR address at a time.
This command is used in the processor for package C6 fast exit.

5.2.8.7 SetVID Slow

The SetVID_Slow command contains the target VID in the payload byte. The range of
voltage is defined in the VID table. The VR should ramp to the new VID setting with a
“slow” slew rate as defined in the slow slew rate data register. The SetVID_Slow is
nominally 4x slower than the SetVID_Fast slew rate.

The SetVID_Slow command is preemptive, the VR interrupts its current processes and
moves to the new VID. This is the instruction used for normal P-state voltage change.
This command is used in the processor for the Intel Enhanced SpeedStep® Technology
transitions.

5.2.8.8 SetVID Decay

The SetVID_Decay command is the slowest of the DVID transitions. It is only used for
VID down transitions. The VR does not control the slew rate, the output voltage
declines with the output load current only.

The SetVID_Decay command is preemptive, the VR interrupts its current processes and
moves to the new VID. This command is used in the processor for package C6 entry,
allowing capacitor discharge by the leakage, thus saving energy.This command is only
used in VID down direction in the processor package C6 entry.

5.2.8.9 SVID Voltage Rail Addressing

The processor addresses 4 different voltage rail control segments within VR13.0 (VCCIN,
VCCD, VCCSA, and VCCIO). The SVID data packet contains a 4-bit addressing code.

Table 5-2. SVID Address Usage Bus 1

PWM Address (HEX) Protocol ID Processor
00 04H(10 mV VID) VCCIN

01 07H(5 mV VID) VCCSA

02 07H(5 mV VID) VCCIO

03 N/A Reserved for optional rail

04 Reserved for optional rail

05 Reserved for optional rail

Notes:
1. Check with VR vendors for determining the physical address assignment method for their controllers.
2. VR addressing is assigned on a per voltage rail basis.
3. Dual VR controllers will have two addresses with the lowest order address, always being the higher
phase count.
4. For future platform flexibility, the VR controller should include an address offset, as shown with +1
not used.

41 Datasheet, Volume 1
 Electrical Specifications

Table 5-3. SVID Address Usage Bus 2

PWM Address (HEX) Protocol ID Processor
00 04H(10mV VID) VCCD012
or 07H(5mV VID)

01 NA

02 04H(10mV VID) VCCD345

or 07H(5mV VID)

03 NA

Notes:
1. Check with VR vendors for determining the physical address assignment method for their controllers.
2. VR addressing is assigned on a per voltage rail basis.
3. Dual VR controllers will have two addresses with the lowest order address, always being the higher
phase count.

Table 5-4. VR13.0 Reference Code Voltage Identification (VID) Table (Sheet 1 of 2)

HEX VCCIN HEX VCCIN HEX VCCIN HEX VCCIN HEX VCCIN HEX VCCIN HEX VCCIN HEX VCCIN

00 0.00 20 0.81 40 1.13 60 1.45 80 1.77 A0 2.09 C0 2.41 E0 2.73

01 0.50 21 0.82 41 1.14 61 1.46 81 1.78 A1 2.10 C1 2.42 E1 2.74
02 0.51 22 0.83 42 1.15 62 1.47 82 1.79 A2 2.11 C2 2.43 E2 2.75
03 0.52 23 0.84 43 1.16 63 1.48 83 1.80 A3 2.12 C3 2.44 E3 2.76
04 0.53 24 0.85 44 1.17 64 1.49 84 1.81 A4 2.13 C4 2.45 E4 2.77
05 0.54 25 0.86 45 1.18 65 1.50 85 1.82 A5 2.14 C5 2.46 E5 2.78
06 0.55 26 0.87 46 1.19 66 1.51 86 1.83 A6 2.15 C6 2.47 E6 2.79
07 0.56 27 0.88 47 1.20 67 1.52 87 1.84 A7 2.16 C7 2.48 E7 2.80
08 0.57 28 0.89 48 1.21 68 1.53 88 1.85 A8 2.17 C8 2.49 E8 2.81
09 0.58 29 0.90 49 1.22 69 1.54 89 1.86 A9 2.18 C9 2.50 E9 2.82
0A 0.59 2A 0.91 4A 1.23 6A 1.55 8A 1.87 AA 2.19 CA 2.51 EA 2.83
0B 0.60 2B 0.92 4B 1.24 6B 1.56 8B 1.88 AB 2.20 CB 2.52 EB 2.84
0C 0.61 2C 0.93 4C 1.25 6C 1.57 8C 1.89 AC 2.21 CC 2.53 EC 2.85
0D 0.62 2D 0.94 4D 1.26 6D 1.58 8D 1.90 AD 2.22 CD 2.54 ED 2.86
0E 0.63 2E 0.95 4E 1.27 6E 1.59 8E 1.91 AE 2.23 CE 2.55 EE 2.87
0F 0.64 2F 0.96 4F 1.28 6F 1.60 8F 1.92 AF 2.24 CF 2.56 EF 2.88
10 0.65 30 0.97 50 1.29 70 1.61 90 1.93 B0 2.25 D0 2.57 F0 2.89
11 0.66 31 0.98 51 1.30 71 1.62 91 1.94 B1 2.26 D1 2.58 F1 2.90
12 0.67 32 0.98 52 1.31 72 1.63 92 1.95 B2 2.27 D2 2.59 F2 2.91
13 0.68 33 1.00 53 1.32 73 1.64 93 1.96 B3 2.28 D3 2.60 F3 2.92
14 0.69 34 1.01 54 1.33 74 1.65 94 1.97 B4 2.29 D4 2.61 F4 2.93
15 0.70 35 1.02 55 1.34 75 1.66 95 1.98 B5 2.30 D5 2.62 F5 2.94
16 0.71 36 1.03 56 1.35 76 1.67 96 1.99 B6 2.31 D6 2.63 F6 2.95
17 0.72 37 1.04 57 1.36 77 1.68 97 2.00 B7 2.32 D7 2.64 F7 2.96
18 0.73 38 1.05 58 1.37 78 1.69 98 2.01 B8 2.33 D8 2.65 F8 2.97
19 0.74 39 1.06 59 1.38 79 1.70 99 2.02 B9 2.34 D9 2.66 F9 2.98
1A 0.75 3A 1.07 5A 1.39 7A 1.71 9A 2.03 BA 2.35 DA 2.67 FA 2.99
1B 0.76 3B 1.08 5B 1.40 7B 1.72 9B 2.04 BB 2.36 DB 2.68 FB 3.00
1C 0.77 3C 1.09 5C 1.41 7C 1.73 9C 2.05 BC 2.37 DC 2.69 FC 3.01
1D 0.78 3D 1.10 5D 1.42 7D 1.74 9D 2.06 BD 2.38 DD 2.70 FD 3.02

Datasheet, Volume 1 42
 Electrical Specifications

Table 5-4. VR13.0 Reference Code Voltage Identification (VID) Table (Sheet 2 of 2)

HEX VCCIN HEX VCCIN HEX VCCIN HEX VCCIN HEX VCCIN HEX VCCIN HEX VCCIN HEX VCCIN

1E 0.79 3E 1.11 5E 1.43 7E 1.75 9E 2.07 BE 2.39 DE 2.71 FE 3.03

1F 0.80 3F 1.12 5F 1.44 7F 1.76 9F 2.08 BF 2.40 DF 2.72 FF 3.04
Notes:
1. 00h = Off State
2. VID Range HEX 65-97 are not used by the processor
3. VCCD can use Protocol ID of 10 mV or 5 mV.
4. VCCD can use VID Table 5-4.

5.2.9 Reserved or Unused Signals

All Reserved (RSVD) signals must not be connected. Connection of these signals to
VCCIN, VCCD, VSS, or to any other signal (including each other) can result in component
malfunction or incompatibility with future processors.

For reliable operation, always connect unused inputs or bi-directional signals to an

appropriate signal level. Unused active high inputs should be connected through a
resistor to ground (VSS). Unused outputs maybe left unconnected; however, this may
interfere with some Test Access Port (TAP) functions, complicate debug probing, and
prevent boundary scan testing. A resistor must be used when tying bi-directional
signals to power or ground. When tying any signal to power or ground, a resistor will
also allow for system testability.

5.3 Signal Group Summary

Signals are grouped by buffer type and similar characteristics as listed in the following
table. The buffer type indicates which signaling technology and specifications apply to
the signals.

Table 5-5. Signal Description Buffer Types

Signal Description

Analog Analog reference or output. May be used as a threshold voltage or for buffer
compensation

Asynchronous Signal has no timing relationship with any system reference clock.
CMOS CMOS Output buffers: 1.05 V tolerant / CMOS Input buffers

DDR4 CMOS Output buffers 1.2 V tolerant

DMI3 Direct Media Interface Gen 3 signals. These signals are compatible with PCI Express* 3.0
Signaling Environment AC Specifications.

Open Drain Open Drain buffers: 1.05 V tolerant

PCI Express* PCI Express* interface signals. These signals are compatible with PCI Express* 3.0
Signaling Environment AC Specifications and are AC coupled. The buffers are not 3.3-V
tolerant. Refer to the PCIe* specification.

Reference Voltage reference signal.

SSTL Source Series Terminated Logic (JEDEC SSTL_15)

Note: Qualifier for a buffer type.

43 Datasheet, Volume 1
Electrical Specifications

Table 5-6. Signal Groups (Sheet 1 of 2)

Differential/Single Ended Buffer Type Signal

DDR4 Reference Clocks

Differential SSTL Output DDR{0/1/2/3/4/5}_CLK_D[N/P] [3:0]

DDR4 Command Signals

Single-ended SSTL Output DDR{0/1/2/3/4/5}_ACT_N DDR{0/1/2/

3/4/5}_BA[1:0] DDR{0/1/2/3/4/
5}_BG[1:0] DDR{0/1/2/3/4/
5}_MA[17:0] DDR{0/1/2/3/4/5}_PAR

DDR4 Control Signals

Single-ended SSTL Output DDR{0/1/2/3/4/5}_CS_N[7:0] DDR{0/

1/2/3/4/5}_CID[2] DDR{0/1/2/3/4/
5}_ODT[3:0] DDR{0/1/2/3/4/
5}_CKE[3:0]

DDR4 Data Signals

Differential SSTL Input/Output DDR{0/1/2/3/4/5}_DQS_D[N/P] [17:0]

Single-ended SSTL Input/Output DDR{0/1/2/3/4/5}_DQ[63:0] DDR{0/

1/2/3/4/5}_ECC[7:0]

DDR4 Miscellaneous Signals

Single-ended SSTL Input DDR{0/1/2/3/4/5}_ALERT_N

CMOS Input DDR{012,345}_DRAM_PWR_OK

Note: Input voltage from
platform cannot exceed 1.2 V
max.

CMOS 1.2 V Output DDR{012,345}_RESET_N

Open Drain Output / CMOS DDR[012,345]_SPDSCL

Input DDR[012,345]_SPDSDA

DC Output DDR{5:0}_CAVREF

DDR Compensation resistance DDR{012,345}_RCOMP[2:0]

control

PCI Express* Port 1, 2, and 3 Signals

Differential PCI Express* Input PE{3:1}_RX_DN/DP[15:0]

Differential PCI Express* Output PE{3:1}_TX_DN/DP[15:0]

PCI Express* Miscellaneous Signals

Single-ended Open Drain Output PE_HP_SCL

Open Drain Output /CMOS PE_HP_SDA

Input

DMI3/PCI Express* Signals

Differential DMI3 Input DMI3_RX_D[N/P][3:0]

DMI3 Output DMI3_TX_D[N/P][3:0]

Single-ended DMI Miscellaneous DMIMODE_OVERRIDE

Platform Environmental Control Interface (PECI)

Single-ended PECI Input/Output PECI

Datasheet, Volume 1 44
 Electrical Specifications

Table 5-6. Signal Groups (Sheet 2 of 2)

Differential/Single Ended Buffer Type Signal

System Reference Clock (BCLK{0/1/2})

Differential CMOS 1.05 V Input BCLK{0/1/2}_D[N/P]

JTAG and TAP Signals

Single ended CMOS Input TCK,TDI,TMS,TRST_N,PREQ_N

Open Drain Output /CMOS BPM_N[7:0]

Input

Open Drain Output TDO, PRDY_N

Serial VID Interface (SVID) Signals

Single ended CMOS Input SVIDALERT_N[1:0]

Open Drain Output / CMOS SVIDDATA [1:0]

Input

Open Drain Output SVIDCLK [1:0]

Processor Asynchronous Sideband Signals

Single ended CMOS Input BIST_ENABLE, BMCINIT, DEBUG_EN_N

FRMAGENT, PWRGOOD, PMSYNC

RESET_N, SAFE_MODE_BOOT,
SOCKET_ID[1:0], TXT_AGENT
TXT_PLTEN

CMOS Output FIVR_FAULT

Open Drain Output / CMOS CATERR_N, MEM_HOT_C01_N,

Input MEM_HOT_C23_N, MSMI_N,
PM_FAST_WAKE_N, PROCHOT_N

Open Drain Output ERROR_N[2:0], THERMTRIP_N

Miscellaneous Signals

CMOS Input EAR_N,LEGACY_SKT,NMI,PMSYNCPMSY

NC_CLK,PROCDIS_N,
PWR_DEBUG_N,SOCKET_ID2

Open Drain Output / CMOS TSC_SYNC

Input

Not connected to Silicon SKTOCC_N,PKGID[2:0], PROC_ID[1:0]

Power/Other Signals

Power / Ground VCCIN, VCCD_012, VCCD_345, VCCIO,

VCC33, VCC33, VSS

Sense Points VCCIN_SENSE, VCCIO_SENSE,

VCCSA_SENSE,
VSS_VCCIN_SENSE,
VSS_VCCIO_SENSE,
VSS_VCCSA_SENSE,
VCCIN_PMAX, VSENSEPMAX
Notes:
1. Refer to Chapter 4, “Signal Descriptions” for signal description details.
2. DDR{0/1/2/3/4/5} refers to DDR4 Channel 0, DDR4 Channel 1, DDR4 Channel 2, DDR4 Channel 3, DDR4
Channel 4 and DDR4 Channel 5.

45 Datasheet, Volume 1
Electrical Specifications

Table 5-7. Signals with On-Die Weak PU/PD

Signal Name Pull Up/Pull Down Rail Value Units Notes
BIST_ENABLE Pull Up VCCIO 3K-8K 

BMCINIT Pull Down VSS 3K-8K 

DEBUG_EN_N Pull Up VCCIO 3K-8K 

DMIMODE_OVERRIDE Pull Up VCCIO 3K-8K 

EAR_N Pull Up VCCIO 3K-8K 

FRMAGENT Pull Down VSS 3K-8K 

LEGACY_SKT Pull Down VSS 3K-8K 

MSMI_N Pull Up VCCIO 3K-8K 

NMI Pull Down VSS 3K-8K 

PM_FAST_WAKE_N Pull Up VCCIO 3K-8K 

PROCDIS_N Pull Up VCCIO 3K-8K 

SAFE_MODE_BOOT Pull Down VSS 3K-8K 

SOCKET_ID[2:0] Pull Down VSS 3K-8K 

TCK Pull Down VSS 3K-8K 

TDI Pull Up VCCIO 3K-8K 

TMS Pull Up VCCIO 3K-8K 

TRST_N Pull Up VCCIO 3K-8K 

TXT_AGENT Pull Down VSS 3K-8K 

TXT_PLTEN Pull Up VCCIO 3K-8K 

5.3.1 Power-On Configuration (POC) Options

Several configuration options can be configured by hardware. The processor samples
its hardware configuration at reset, on the active-to-inactive transition of RESET_N, or
upon assertion of PWRGOOD (inactive-to-active transition). For specifics on these
options, refer to the following table.

The sampled information configures the processor for subsequent operation. These
configuration options cannot be changed except by another reset transition of the
latching signal (RESET_N or PWRGOOD).

Table 5-8. Power-On Configuration Option Lands (Sheet 1 of 2)

Configuration Option Land Name Notes

Output tri state PROCDIS_N 1

Execute BIST (Built-In Self Test) BIST_ENABLE 2

Enable Service Processor Boot Mode BMCINIT 3

Power-up Sequence Halt EAR_N 3

Enable Intel® Trusted Execution Technology (Intel ®

TXT) TXT_PLTEN 3
Platform

Enable Bootable Firmware Agent FRMAGENT 3

® (Intel®
Enable Intel Trusted Execution Technology TXT) Agent TXT_AGENT 3

Datasheet, Volume 1 46
 Electrical Specifications

Table 5-8. Power-On Configuration Option Lands (Sheet 2 of 2)

Configuration Option Land Name Notes

Enable Safe Mode Boot SAFE_MODE_BOOT 3

Configure Socket ID SOCKET_ID[1:0] 3

Enable legacy socket boot LEGACY_SKT 3

Notes:
1. Output tri-state option enables Fault Resilient Booting (FRB), for FRB details, refer to the Fault Resilient
Booting (FRB) Section. The signal used to latch PROCDIS_N for enabling FRB mode is RESET_N.
2. BIST_ENABLE is sampled at RESET_N de-assertion
3. This signal is sampled after PWRGOOD assertion.

5.4 Absolute Maximum and Minimum Ratings

The following table specifies absolute maximum and minimum ratings. At conditions
outside functional operation condition limits, but within absolute maximum and
minimum ratings, neither functionality nor long-term reliability can be expected. If a
device is returned to conditions within functional operation limits after having been
subjected to conditions outside these limits, but within the absolute maximum and
minimum ratings, the device may be functional, but with its lifetime degraded
depending on exposure to conditions exceeding the functional operation condition
limits.

Although the processor contains protective circuitry to resist damage from Electro-
Static Discharge (ESD), precautions should always be taken to avoid high static
voltages or electric fields.

Table 5-9. Processor Absolute Minimum and Maximum Ratings

Symbol Parameter Min Max Unit

VCCIN Processor input voltage with respect to Vss -0.3 2.15 V

VCCD Processor IO supply voltage for DDR4
-0.3 1.35 V
(standard voltage) with respect to VSS
VCCIO IO voltage supply input with respect to VSS -0.3 1.35 V
VCCSA IO voltage supply input with respect to VSS -0.3 1.35 V

Notes:
1. For functional operation, all processor electrical, signal quality, mechanical, and thermal specifications
must be satisfied.
2. Excessive Overshoot or undershoot on any signal will likely result in permanent damage to the processor.

5.4.1 Storage Conditions Specifications

Environmental storage condition limits define the temperature and relative humidity
limits to which the device is exposed to while being stored in a Moisture Barrier Bag.
The specified storage conditions are for component level prior to board attach (Refer to
notes in the following table for post board attach limits).

The following table specifies absolute maximum and minimum storage temperature
limits which represent the maximum or minimum device condition beyond which
damage, latent or otherwise, may occur. The table also specifies sustained storage
temperature, relative humidity, and time-duration limits. These limits specify the
maximum or minimum device storage conditions for a sustained period of time. At
conditions outside sustained limits, but within absolute maximum and minimum
ratings, quality and reliability may be affected.

47 Datasheet, Volume 1
Electrical Specifications

Table 5-10. Storage Condition Ratings

Symbol Parameter Min Max Unit

Tabsolute storage The minimum/maximum device storage

temperature beyond which damage (latent or
-25 125 °C
otherwise) may occur when subjected to for
any length of time.
Tsustained storage The minimum/maximum device storage
-5 40 °C
temperature for a sustained period of time.
Tshort term storage The ambient storage temperature (in shipping
-20 85 °C
media) for a short period of time.
RHsustained storage The maximum device storage relative humidity
for a sustained period of time.Unopened bag, 60% @ 24 °C
includes 6 months storage time by customer.

Timeshort term storage A short period of time (in shipping media). 0 72 hours

Notes:
1. Storage conditions are applicable to storage environments only. In this scenario, the processor must not
receive a clock, and no lands can be connected to a voltage bias. Storage within these limits will not
affect the long-term reliability of the device. For functional operation, refer to the processor case
temperature specifications.
2. These ratings apply to the Intel component and do not include the tray or packaging.
3. Failure to adhere to this specification can affect the long-term reliability of the processor.
4. Non-operating storage limits post board attach: Storage condition limits for the component once
attached to the application board are not specified. Intel does not conduct component level certification
assessments post board attach given the multitude of attach methods, socket types and board types
used by customers. Provided as general guidance only, Intel board products are specified and certified to
meet the following temperature and humidity limits (Non-Operating Temperature Limit: -40 °C to 70 °C
and Humidity: 50% to 90%, non condensing with a maximum wet bulb of 28 °C).
5. Device storage temperature qualification methods follow JEDEC High and Low Temperature Storage Life
Standards: JESD22-A119 (low temperature) and JESD22-A103 (high temperature).

5.5 DC Specifications
DC specifications are defined at the processor pads, unless otherwise noted.
DC specifications are only valid while meeting specifications for case temperature, clock
frequency, and input voltages. Care should be taken to read all notes associated with
each specification.

5.5.1 Voltage and Current Specifications

Table 5-11. Voltage Specification (Sheet 1 of 2)

Voltage
Symbols Parameter Min Nom Max Unit Notes1
Plane

VCCIN Input to Integrated = VID - = VID - = VID - 2, 3, 4, 5,

VCCIN V
Voltage Regulator Rll*Iout-0.022V Rll*Iout Rll*Iout+0.022V 8, 12
VCCIN VID Range 2, 3, 4, 5,
VCCIN 1.60 1.80 1.83 V
8, 12
VVID_STEP VID step size during a 6
VCCIN — 10.0 — mV
(VCCIN) transition
VVID_STEP (VCCD) VID step size during a
— 5 — 10 mV
transition
V CCD (V CCD_012, I/O Voltage for DDR4 7, 9,
V CCD_345) (Standard Voltage) VCCD 1.17 1.2 1.26 V
10, 11

Datasheet, Volume 1 48
 Electrical Specifications

Table 5-11. Voltage Specification (Sheet 2 of 2)

Voltage
Symbols Parameter Min Nom Max Unit Notes1
Plane

VCCSA Power supply for IIO 0.5 — 1.1 V

VCCIO IO voltage supply input — 0.937 1.00 1.057 V
VCC33 Power supply for PIROM 3.14 3.3 3.47 V

Notes:
1. Unless otherwise noted, all specifications in this table apply to all processors.
2. These voltages are targets only. A variable voltage source should exist on systems in the event that a different voltage is
required.
3. The VCCIN voltage specification requirements are measured across the remote sense pin pairs (VCCIN_SENSE and
VSS_VCCIN_SENSE) on the processor package. Voltage measurement should be taken with a DC to 100 MHz bandwidth
oscilloscope limit (or DC to 20 MHz for older model oscilloscopes), using a 1.5 pF maximum probe capacitance, and 1 Mohm
minimum impedance. The maximum length of the ground wire on the probe should be less than 5 mm to ensure external
noise from the system is not coupled in the scope probe.
4. Refer to VCCIN Static and Transient Tolerance Processor and corresponding Figure 5-2, “VCCIN Static and Transient
Tolerance Load Lines 1.0 mOHM” on page 51. The processor should not be subjected to any static VCCIN level that exceeds
the VCCIN_MAX associated with any particular current. Failure to adhere to this specification can shorten processor lifetime.
5. ICCIN_MAX is specified at the relative VCC_MAX point on the VCCIN load line. The processor is capable of drawing
ICCIN_MAX for up to 2 ms.
6. This specification represents the VCCIN reduction or VCCIN increase due to each VID transition. For Voltage Identification
(VID), refer Table 5-4, “VR13.0 Reference Code Voltage Identification (VID) Table”.
7. Baseboard bandwidth is limited to 20 MHz.
8. N/A
9. DC + AC + Ripple = Tolerance
10. VCCD tolerance at processor pins. Required in order to meet +/-5% tolerance at processor die.
11. The VCCD012, VCCD345 voltage specification requirements are measured across vias on the platform. Choose VCCD012 or
VCCD345 vias close to the socket and measure with a DC to 100 MHz bandwidth oscilloscope limit (or DC to 20 MHz for
older model oscilloscopes), using 1.5 pF maximum probe capacitance, and 1M ohm minimum impedance. The maximum
length of the ground wire on the probe should be less than 5 mm to ensure external noise from the system is not coupled in
the scope probe.
12. VCCIN has a Vboot setting of 1.7 V and is not included in the PWRGOOD indication.

Table 5-12. Current (ICCIN_MAX and ICCIN_TDC) Specification

TDP (W) 140 165

VCCIN ICCMAX (A) 190 228

VCCSA ICCMAX (A) 16 16

VCCIO ICCMAX (A) 21 21

VCCD ICCMAX (A) 8 8

VCC33 ICCMAX(A) .075 .075

VCCIN TDC (A) 73 89

VCCSA TDC (A) 15 15

VCCIO TDC (A) 14 14

VCCD TDC (A) 6 6

VCC33 TDC (A) .075 .075

Pmax Package (W) 297 363

Notes:
1. Unless otherwise noted, all specifications in this table apply to all processors.
2. N/A
3. ICCIN_TDC (Thermal Design Current) is the sustained (DC equivalent) current that the
processor is capable of drawing indefinitely and should be used for the voltage regulator
thermal assessment. The voltage regulator is responsible for monitoring its temperature
and asserting the necessary signal to inform the processor of a thermal excursion.
4. Minimum VCCIN and maximum ICCIN are specified at the maximum processor case
temperature (TCASE). ICCIN_MAX is specified at the relative VCCIN_MAX point on the
VCCIN load line. The processor is capable of drawing ICCIN_MAX for up to 2 ms.

49 Datasheet, Volume 1
Electrical Specifications

Table 5-13. VCCIN Static and Transient Tolerance for 1.0LL

ICCIN (A) VCCIN_Max (V) VCCIN_Nom (V) VCCIN_Min (V) Notes

0 VID +0.022 VID -0.000 VID -0.022

10 VID +0.012 VID -0.010 VID -0.032

20 VID +0.002 VID -0.020 VID -0.042

30 VID -0.008 VID -0.030 VID -0.052

40 VID -0.018 VID -0.040 VID -0.062

50 VID -0.028 VID -0.050 VID -0.072

60 VID -0.038 VID -0.060 VID -0.082

70 VID -0.048 VID -0.070 VID -0.092

80 VID -0.058 VID -0.080 VID -0.102

90 VID -0.068 VID -0.090 VID -0.112

100 VID -0.078 VID -0.100 VID -0.122

110 VID -0.088 VID -0.110 VID -0.132

120 VID -0.098 VID -0.120 VID -0.142

130 VID -0.108 VID -0.130 VID -0.152

140 VID -0.118 VID -0.140 VID -0.162

150 VID -0.128 VID -0.150 VID -0.172

160 VID -0.138 VID -0.160 VID -0.182

170 VID -0.148 VID -0.170 VID -0.192

180 VID -0.158 VID -0.180 VID -0.202

190 VID -0.168 VID -0.190 VID -0.212

200 VID -0.178 VID -0.200 VID -0.222

210 VID -0.188 VID -0.210 VID -0.232

220 VID -0.198 VID -0.220 VID -0.242

230 VID - 0.208 VID - 0.230 VID - 0.252

Notes:
1. The VCCIN_MIN and VCCIN_MAX loadlines represent static and transient limits.
2. This table is intended to aid in reading discrete points on graph in Figure 5-2, “VCCIN Static and
Transient Tolerance Load Lines 1.0 mOHM” on page 51.
3. The loadlines specify voltage limits at the die measured at the VCCIN_SENSE and VSS_VCCIN_SENSE lands.
Voltage regulation feedback for voltage regulator circuits must also be taken from processor VCCIN_SENSE
and VSS_VCCIN_SENSE lands.
4. The Adaptive Loadline Positioning slope is 1.00 m (mohm) with ±22mV TOB (Tolerance of Band).

Datasheet, Volume 1 50
 Electrical Specifications

Figure 5-2. VCCIN Static and Transient Tolerance Load Lines 1.0 mOHM

5.5.2 Signal DC Specifications

For additional specifications, refer to Section 1.9, “Related Documents.”

5.5.2.1 DDR4 Signal DC Specifications

For the next table, use Signal Group Table 5-6, “Signal Groups” to identify which
signals belong to each group.

Symbol Parameter Min Nom Max Units Notes1

IIL Input Leakage Current -1.4 — +1.4 mA 9

Data Signals

R ON DDR4 Data Buffer On Resistance 25.5 30 34.5 ohm 6

Data ODT On-Die Termination for Data 8

42.5 50 57.5 ohm
Signals

Reference Clock and Command Signals

VOL Output Low Voltage (V CCD / 2)* (R ON / 2, 7

— — V
(R ON +R VTT_TERM ))
VOH Output High Voltage V - ((V CCD / 2)*
CCD 2, 5, 7
— (R ON /(R ON — V
+R VTT_TERM )))

Data Signals

VOL Output Low Voltage Vol=(Ron / (Ron + 10

— RVDD_TERM)) — V
*VCCD
VOH Output High Voltage — VCCD — V

Reference Clock Signal

R ON DDR4 Clock Buffer On Resistance 25.5 30 34.5 ohm 6

51 Datasheet, Volume 1
Electrical Specifications

Symbol Parameter Min Nom Max Units Notes1

Command Signals

R ON DDR4 Command Buffer On 6, 11

15.3 18 20.7 ohm
Resistance
R ON DDR4 Reset Buffer On Resistance 76.5 90 103.5 ohm 6
VOL_CMOS1.2V Output Low Voltage, Signals 1, 2
— — 0.2*VCCD V
DDR_RESET_C{01/23}_N
V OH_CMOS1.2V Output High Voltage, Signals 1, 2
0.9*VCCD — — V
DDR_RESET_C{01/23}_N

Control Signals

R ON DDR4 Control Buffer On 6

25.5 30 34.5 ohm
Resistance

DDR4 Miscellaneous Signals

DRAM_PWR_OK_C{01/23}
VIL Input Low Voltage — 0.3*VCCD — mV 2, 3
VIH Input High Voltage — 0.7*VCCD — mV 2, 4, 5

ALERT_N
VIL Input Low Voltage Vref-90 — Vref - 70 mV 3
VIH Input High Voltage Vref+70 — Vref+90 mV 4

ODT On Die Termination 36 45 54 ohms

Notes:
1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2. The voltage rail VCCD which will be set to 1.2 V nominal depending on the voltage of all DIMMs connected to the processor.
3. VIL is the maximum voltage level at a receiving agent that will be interpreted as a logical low value.
4. VIH is the minimum voltage level at a receiving agent that will be interpreted as a logical high value.
5. VIH and VOH may experience excursions above VCCD. However, input signal drivers must comply with the signal quality
specifications.
6. This is the pull down driver resistance. Reset drive does not have a termination.
7. RVTT_TERM is the termination on the DIMM and not controlled by the processor. Refer to the applicable DIMM datasheet.
8. The minimum and maximum values for these signals are programmable by BIOS to one of the pairs.
9. Input leakage current is specified for all DDR4 signals.
10. Vol = Ron * [VCCD/(Ron + Rtt_Eff)], where Rtt_Eff is the effective pull-up resistance of all DIMMs in the system, including
ODTs and series resistors on the DIMMs.
11. This Ron value is only for UDIMM, otherwise the Ron Value is 30 ohm.

5.5.2.2 PECI DC Specifications

Symbol Definition and Conditions Min Max Units Figure Notes1

VIn Input Voltage Range -0.15 0.15 + VCCIO V 1

VHysteresis Hysteresis 0.1*VCCIO — V

VN Negative-edge threshold voltage 0.275*VCCIO 0.500*VCCIO V Figure 5-1 2

VP Positive-edge threshold voltage 0.550*VCCIO 0.725*VCCIO V Figure 5-1 2

I Source Pullup Resistance (VOH = 0.75*VCCIO) -6.00 — mA
ILeak+ High impedance state leakage to 3, 4
±50 ±200 µA
VCCIO (Vleak = VOL)
RON High impedance leakage to GND (Vleak
41 11 
= VOH)
CBus Bus capacitance per node — 10 pF 5

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 Electrical Specifications

Symbol Definition and Conditions Min Max Units Figure Notes1

VNoise Signal noise immunity above 300 MHz 0.100*VCCIO — Vp-p

Output Edge Rate (50 ohm to VSS,

5 15 V/ns
between VIL and VIH)
Notes:
1. The input voltage range specifies an overshoot/undershoot that applies only to the PECI data signal and not to the VTT
reference itself.
2. It is expected that the PECI driver will take into account, the variance in the receiver input thresholds and consequently, be
able to drive its output within safe limits (-0.150 V to 0.275*VCCIO for the low level and 0.725*VCCIO to VCCIO+0.150 V for
the high level).
3. VCCIO nominal levels will vary between processor families. All PECI devices will operate at the VCCIO level determined by the
processor installed in the system.
4. The leakage specification applies to powered devices on the PECI bus.
5. Excessive capacitive loading on the PECI line may slow down the signal rise/fall times and consequently limit the maximum
bit rate at which the interface can operate.

5.5.2.3 System Reference Clock (BCLK{0/1/2}) DC Specifications

Symbol Parameter Signal Min Max Unit Figure Notes1

VBCLK_diff_ih Differential Input High Differential Figure 5-3 9

0.150 N/A V
Voltage
VBCLK_diff_il Differential Input Low Differential Figure 5-3 9
— -0.150 V
Voltage

Vcross (abs) Absolute Crossing Point Single Ended Figure 5-4 and 2, 4, 7,
0.250 0.550 V
Figure 5-5 9

Vcross (rel) Relative Crossing Point Single Ended 0.250 + 0.550 + Figure 5-4 3, 4, 5,
0.5*(VHavg - 0.5*(VHavg - V 9
0.700) 0.700)

ΔVcross Range of Crossing Points Single Ended N/A 0.140 V Figure 5-6 6, 9
VTH Threshold Voltage Single Ended Vcross - 0.1 Vcross + 0.1 V 9
IIL Input Leakage Current N/A — 1.50 mA 8, 9
Cpad Pad Capacitance N/A 1.90 1.72 pF 9

Notes:
1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2. Crossing Voltage is defined as the instantaneous voltage value when the rising edge of BCLK{0/1}_DN is equal to the falling
edge of BCLK{0/1}_DP.
3. VHavg is the statistical average of the VH measured by the oscilloscope.
4. The crossing point must meet the absolute and relative crossing point specifications simultaneously.
5. VHavg can be measured directly using “Vtop” on Agilent* and “High” on Tektronix oscilloscopes.
6. VCROSS is defined as the total variation of all crossing voltages as defined in Note 3.
7. The rising edge of BCLK{0/1}_DN is equal to the falling edge of BCLK{0/1}_DP.
8. For Vin between 0 and Vih.
9. Specifications can be validated at the pin.

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Figure 5-3. BCLK{0/1/2} Differential Clock Measurement Point for Ringback

Figure 5-4. BCLK{0/1/2} Differential Clock Crosspoint Specification

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 Electrical Specifications

Figure 5-5. BCLK{0/1/2} Single Ended Clock Measurement Points for Absolute
Cross Point and Swing

Figure 5-6. BCLK{0/1/2} Single Ended Clock Measure Points for Delta Cross Point

5.5.2.4 SMBus DC Specifications

Symbol Parameter Min Max Units Notes

VIL Input Low Voltage — 0.3*VCCIO V
V IH Input High Voltage 0.7*VCCIO — V
VHysteresis Hysteresis 0.1*VCCIO — V
V OL Output Low Voltage — 0.2*VCCIO V 1
R ON Buffer On Resistance 14 4 

IL Leakage Current Signals ±50 ±200 µA

Output Edge Rate (50 ohm to VCCIO, between VIL and VIH) 1.13 5 V/ns 1
Note:
1. Value obtained through test bench with 50 ohm pull up to VCCIO.

5.5.2.5 JTAG and TAP Signals DC Specifications

Symbol Parameter Min Max Units Notes

VIL Input Low Voltage — 0.3*VCCIO V

VIH Input High Voltage 0.7*VCCIO — V
VOL Output Low Voltage — 0.2*VCCIO V
VHysteresis Hysteresis 0.1*VCCIO —

SR Input Slew Rate: TCK0, TCK1, BPM_N[7:0],TDI 0.05 — V/ns 2

RON Buffer On Resistance Signals BPM_N[7:0], TDO 14 4 

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Symbol Parameter Min Max Units Notes

IIL Input Leakage Current Signals ±50 ±200 µA

SR Output Edge Rate (50 ohm to VCCIO) Signal: 1

1.13 5 V/ns
BPM_N[7:0], PRDY_N, TDO

Notes:
1. These are measured between VIL and VIH.
2. The signal edge rate must be met or the signal must transition monotonically to the asserted state.

5.5.2.6 Serial VID Interface (SVID) DC Specifications

Symbol Parameter Min Nom Max Units Notes

VCCIO CPU I/O Voltage VCCIO - 5% 1.0 VCCIO + 5% V 1

V IL Input Low Voltage Signals SVIDDATA, 1
— — 0.3*VCCIO V
SVIDALERT_N
VIH Input High Voltage Signals SVIDDATA, 1
0.7*VCCIO — — V
SVIDALERT_N
VOL Output Low Voltage Signals: SVIDCLK, 1, 6
— — 0.2*VCCIO V
SVIDDATA
VHysteresis Hysteresis 0.1*VCCIO — — V 1
RON Buffer On Resistance Signals SVIDCLK, 2
14 — 4 
SVIDDATA
I IL Input Leakage Current ±50 — ±200 µA 3, 4

Input Edge Rate Signal: SVIDALERT_N 0.05 — — V/ns 5

Output Edge Rate 1.13 — 5 V/ns 5, 6

Notes:
1. VCCIO refers to instantaneous VCCIO.
2. Measured at 0.31*VCCIO.
3. Vin between 0V and VCCIO (applies to SVIDDATA and SVIDALERT_N only).
4. N/A
5. These are measured between VIL and VIH.
6. Value obtained through test bench with 50 ohms pull-up to VCCIO.

5.5.2.7 Processor Asynchronous Sideband DC Specifications

Symbol Parameter Min Max Units Notes

CMOS input buffers

VIL Input Low Voltage — 0.3*VCCIO V 1, 2, 4

VIH Input High Voltage 0.7*VCCIO — V 1, 2, 4
VHysteresis Hysteresis Signals 0.1*VCCIO — V 1,2, 4

SRI Input Slew Rate 0.005 — V/ns

SR2 Input Slew Rate: PMSYNC 0.05 — V/ns

Open Drain Output buffers

IL Input Leakage Current ±50 ±200 µA 1, 2, 4

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 Electrical Specifications

Symbol Parameter Min Max Units Notes

RON Buffer On Resistance 14 4  1, 2, 4

SR Output Edge Rate 1.13 5 V/ns 3, 5

Notes:
1. This table applies to the processor sideband and miscellaneous signals specified in Table 5-6, “Signal
Groups”.
2. Unless otherwise noted, all specifications in this table apply to all processor frequencies.
3. These are measured between VIL and VIH.
4. In the case of bidirectional signals they use either a CMOS output /CMOS input buffer or they use Open
Drain / CMOS input buffer.
5. VOL level for open drain buffers may be obtained with the Buffer ON Resistance and the external
50 ohm pull-up to VCCIO.

5.5.2.8 Miscellaneous Signals DC Specifications

Symbol Parameter Min Nominal Max Units Notes

SKTOCC_N Signal
VO_ABS_MAX Output Absolute Max Voltage — 3.30 3.50 V

IOMAX Output Max Current — — 1 mA

§§

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