Application Report
SLVA800 – July 2016
Effective System ESD Protection Guidelines
TPS251x USB Charging Port Controllers
Eric Wright ............................................................................................... Linear Power/Power Interface
ABSTRACT
IEC 61000-4-2 electro-static discharge (ESD) protection of USB charging ports is a necessary system
requirement for most products. The USB D+ and D– signals from the charging port controller make direct
contact with a potentially charged USB cable and the discharge of energy from the cable to the product
can damage the controller. The controller D+, D–, and even VBUS signals must have some form of ESD
protection added to the application circuit. This document discusses the design and printed circuit board
(PCB) layout of the ESD protection circuitry.
1 Description
The TPS251x family (TPS2511/11Q1, TPS2513/13A/13AQ1, TPS2514/14A/14AQ1) of USB charging port
controllers do not incorporate internal IEC 61000-4-2 ESD protection. In order to meet IEC 61000-4-2,
level 4, external circuitry must be used. In some cases, protection of the D+ and D– signals starts with a
transient voltage suppressor (TVS) and may include a choke. Protection of VBUS can usually be
accomplished through the use of the USB-required VBUS capacitor, CPORT. The basic protection scheme is
shown in Figure 1.
USB
Power
TPS2511Q1 Connector
Supply TVS
OUT VBUS
IN
Choke
DM D>
CS DP D+
CPORT
GND
Figure 1. Basic USB ESD Protection Circuit
All trademarks are the property of their respective owners.
SLVA800 – July 2016 Effective System ESD Protection Guidelines for TPS251x USB Charging Port 1
Submit Documentation Feedback Controllers
Copyright © 2016, Texas Instruments Incorporated
Choosing the TVS www.ti.com
2 Choosing the TVS
The absolute maximum voltage rating of the TPS251x DP_IN and DM_IN pins with respect to GND
ranges from –0.3 V to the lower of VIN + 0.3 V or 5.7 V. For example, if VIN = 5 V, then the maximum rating
is 5.3 V. The TVS should clamp the voltage on DP_IN and DM_IN within this voltage range for reliable
operation in the presence of ESD surges.
The TVS configuration shown in Figure 1 is one example of an ESD diode array which can clamp D+ and
D– between GND and VBUS. The TPD2E001 is used on TPS2513EVM-527 and benefits from the
connection of the TPD2E001 VCC pin to VBUS (and CPORT). For this case, the clamping voltage between
GND and VBUS depends on the forward voltage drop of the clamping diodes at peak surge current.
There are alternative options such as the TPD2E2U06 which rely on the clamping voltage of the internal
clamp only and do not benefit from a connection to VBUS (and CPORT). An example is shown in Figure 2.
The internal clamping voltage of this configuration may not protect the TPS251x as the clamping voltage is
above the absolute maximum voltage rating of the TPS251x DP_IN and DM_IN pins.
USB
Connector
TVS
VBUS
D-
D+
CPORT
GND
Copyright © 2016, Texas Instruments Incorporated
Figure 2. Clamp Type USB ESD Protection Circuit
3 Data Line Choke
In some cases where the signal trace length is far away from the USB connector and TVS, a data line
choke such as Coilcraft 0805USB-372ML or Wurth 744231371 may be used. This can provide additional
ESD margin above IEC 61000-4-2, level 4 (±8-kV contact and ±15-kV air discharge). The data line choke
also helps suppress EMI generated by the local dc/dc converter.
2 Effective System ESD Protection Guidelines for TPS251x USB Charging Port SLVA800 – July 2016
Controllers Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
www.ti.com PCB Layout and Routing
4 PCB Layout and Routing
4.1 TVS Placement and Hookup
The TVS should be placed close to the downstream USB connector so that ESD energy is shunted back
to chassis ground before it can find a discharge path within the internal circuitry of the end product. The
TVS should be directly connected to the TPS251x DP_IN/DM_IN pins without any vias. Placing the TVS
on the same side of the PCB as the TPS251x can help minimize any impedance between the TVS pin and
TPS251x pin. Figure 3 shows a poor, good, and best method for connecting the TPS251x, TVS, and USB
connector.
Poor
Trace
USB
TVS Pin
Connector Pin
V V
PCB I I
A A
TPS251x Pin
Good
Trace
USB
TVS Pin
Connector Pin
V
PCB I
A
TPS251x Pin
Best
Trace
USB
Connector Pin
V
PCB I
A
TVS Pin TPS251x Pin
Figure 3. Examples of TVS Placement and Connectivity
Use a heavy connection from TVS, VCC, and GND pins to VBUS and ground plane, respectively. Use
multiple vias to make the connection when VBUS and ground are on internal layers.
SLVA800 – July 2016 Effective System ESD Protection Guidelines for TPS251x USB Charging Port 3
Submit Documentation Feedback Controllers
Copyright © 2016, Texas Instruments Incorporated
Extended ESD Performance www.ti.com
5 Extended ESD Performance
For a dedicated charging port, ESD performance can be extended beyond level 4 because there are no
high-speed USB signal integrity concerns. The configurations shown in Figure 4 have been tested
successfully up to ±12-kV contact and ±20-kV air discharge.
USB USB
Connector TPS2511Q1 Ferrite Bead (2x) Connector
TPS2511Q1
UPB201209T
OUT VBUS OUT TVS VBUS
Choke TVS 25 :
25 : 0805USB-372ML 2x TPD1E10B06
2x TPD1E10B06
DM D> DM D>
DP D+ DP D+
25 : CPORT
25 : CPORT
GND GND
1000 pF 1000 pF
1000 pF 1000 pF
Figure 4. Extended ESD Protection Circuit Examples
6 Conclusion
The guidelines in this application report provide a robust solution for ESD suppression in USB charging
based devices. Protection up to and above ±8-kV contact and ±15-kV air discharge are achieved by
proper PCB layout and choice of the TVS. Additionally, two examples are shown which can extend ESD
performance beyond level 4.
7 References
1. Data Sheet: TPS2513 USB Dedicated Charging Port Controller (SLVSBY8)
2. Application Report: ESD Protection Layout Guide (SLVA680)
3. Application Report: Design Considerations for System-Level ESD Circuit Protection (SLYT492)
4. User Guide: TPS2513EVM-527 (SLVU910)
4 Effective System ESD Protection Guidelines for TPS251x USB Charging Port SLVA800 – July 2016
Controllers Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2016, Texas Instruments Incorporated