TDA7263L

6 + 6W STEREO AMPLIFIER WITH MUTING

PRODUCT PREVIEW

■ WIDE SUPPLY VOLTAGE RANGE

■ HIGH OUTPUT POWER
6+6W @ VS=20V, RL = 8Ω, THD=10%
■ MUTE FACILITY (POP FREE) WITH LOW
CONSUMPTION
■ AC SHORT CIRCUIT PROTECTION
■ THERMAL OVERLOAD PROTECTION

DESCRIPTION
SIP10
The TDA7263L is class AB dual audio power ampli- ORDERING NUMBER: TDA7263L
fier assembled in Single IN Line 10 pins package,
specially designed for high quality sound application
as HI-FI music centers and stereo TV sets.

TEST AND APPLICATION DIAGRAM

R7 1K
+VS
= C3 C4 C5
MUTE 47µF 0.1µF 1000µF
SW
3 9
1 C10 1000µF
IN (R) + 10
C1 100nF -
27K R1
C6 C8
2 1.5K RL
0.1µF
(R)
47µF R2 R5
TDA7263L 47 4.7
C2 100nF
5 C11 1000µF
IN (L) + 7
-
27K R3
C7 C9
4 1.5K RL
0.1µF
(L)
6 47µF R4 R6
47 4.7
D02AU1426

June 2003 1/9

This datasheet has been downloaded from http://www.digchip.com at this page

TDA7263L

ABSOLUTE MAXIMUM RATINGS

Symbol Parameter Value Unit
VS Supply Voltage without Load 30 V
IO Output Peak Current (repetitive f >20Hz) 1.7 A
IO Output Peak Current (non repetitive, t = 100µs) 2 A
Ptot Total Power Dissipation (Tcase = 70°C) 8 W
Top Operating Temperature Range 0 to 70 °C
Tstg,Tj Storage & Junction Temperature -40 to 150 °C

PIN CONNECTION (Top view)

10 OUTPUT(1)
9 +VS
8 N.C.
7 OUTPUT(2)
6 GND
5 NON INVERTING INPUT(2)
4 INVERTING INPUT(2)
3 SVR/MUTING
2 INVERTING INPUT(1)
1 NON INVERTING INPUT(1)

D02AU1427

BLOCK DIAGRAM

CFCOUP1

RFI 27K
2
IN- L + 10
1 L OUT L
IN+ L -
RF1
3 SC
SVR MUTE
PROTECTION
RF2

REFERENCES Tj

TURN-ON TH
+VS
9 AND OFF PROTECTION

5
IN+ R + 7
4 R OUT R
IN- R -
RF3
RFI 27K
6
GND RF4
CFCOUP1

D02AU1428

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 TDA7263L

THERMAL DATA
Symbol Parameter Value Unit
Rth j-case Thermal resistance junction to case Max 9 °C/W

ELECTRICAL CHARACTERISTCS (Refer to the stereo test and application circuit, VS = 20V; RL = 8Ω;
Gv = 30dB; f = 1KHz; Tamb = 25°C unless otherwise specified.)
Symbol Parameter Test Condition Min. Typ. Max. Unit
VS Supply Voltage 10 24 V
VO Quiescent Output Voltage 11.5 V
I Total Quiescent Current 64 80 mA
q
PO Output Power (RMS) d = 10%; Tamb = 85°C 6 W
d = 1% 5 W
d Total Harmonic Distortion PO = 1W, f = 1kHz 0.02 0.2 %
f = 100Hz to 10KHz; PO = 0.1 to 4W 0.5
CT Cross Talk RS = 10K&; f = 1KHz 70 dB
RS = 10K&; f = 10KHz 60 dB
RI Input Resistance 100 200 KΩ
fL Low Frequency Roll-off (-3dB) 40 Hz
fH High Frequency Roll-off (-3dB) 80 KHz
eN Total Input Noise Voltage A Curve; RS = 10KΩ 1.5 mV
f = 22Hz to 22KHz; RS = 10KΩ 3 10 V
SVR Supply Voltage Rejection RS = 10KΩ; f = 100Hz; Vr = 0.5V 45 60 dB
(each channel)
Tj Thermal Shutdown Junction 145 °C
Temperature
MUTE FUNCTION
VTMUTE Mute Threshold 1 1.6 V
VTPLAY Play Threshold 4.5 V
ATTAM Mute Attenuation 70 100 dB
IqMUTE Quiescent Current @ Mute 7 10 mA

TYPICAL CHARACTERISTICS (referred to the typical Application Circuit, VS = 20V, RL = 8Ω, unless oth-
erwise specified)
Figure 1. Output Power vs. Supply Voltage Figure 2. Distortion vs. Output Power
d% 10

0.5

f =15KHz
0.2

0.1

0.05
f =1KHz

0.02

0.01
100m 200m 300m 500m 700m 1 2 3 4 5 6 78
Pout (W)

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TDA7263L

Figure 3. Quiescent Current vs. Supply Voltage Figure 6. Output Attenuation & Quiescent
Current vs. Vpin3

Figure 4. Supply Voltage Rejection vs. Freq. Figure 7. Total Power Dissipation vs. Output
Power

Figure 5. Crosstalk vs. Frequency

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 TDA7263L

Figure 8. PC Board Component Layout

Figure 9. Evaluation Board Top Layer Layout

Figure 10. Evaluation Board Bottom Layer Layout

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TDA7263L

APPLICATION SUGGESTION
The recommended values of the components are those shown on the typical application circuit. Different
values can be used; the following table can help the designer.
Recomm.
Component Purpose Larger Than Smaller Than
Value

R1 and R3 1.5KΩ Close loop gain setting (*) Increase of gain Decrease of gain

R2 and R4 47Ω Close loop gain setting (*) Decrease of gain Increase of gain

R5 and R6 4.7Ω Frequency stability Danger of oscillations

C1 and C2 100nF Input DC decoupling Higher SVR Higher low frequency cutoff

C3 47µF - Ripple Rejection Increase of the Switch-on - Degradation of SVR

- Mute time constant time - Worse turn-off pop by muting

C4 100nF Supply Voltage Bypass Danger of oscillations

C5 1000µF Supply Voltage Bypass

C6 and C7 47µF Feedback input DC Increase of the Switch-on Danger of Switch-on time
decoupling time

C8 and C9 0.1µF Frequency stability Danger of oscillations

C10 and C11 1000µF Output DC decoupling Higher low-frequency cut-off

(*) Closed loop gain must be higher than 26dB

BUILT-IN PROTECTION SYSTEMS

Thermal Shut-down
The presence of a thermal limiting circuit offers the following advantages:
1 an overload on the output (even if it is permanent), or an excessive ambient temperature can be easily
withstood.
2 the heatsink can have a smaller factor of safety compared with that of a conventional circuit. There is no
device damage in the case of excessive junction temperature; if for any reason the junction temperature
increases up to 145°C. the thermal shutdown simply reduces the output power and therefore the power
dissipation.
The maximum allowable power dissipation depends upon the thermal resistance junction-ambient. Figure
8 shows the dissipable power as a function of ambient temperature for different heatsink thermal resis-
tance.

Short Circuit (AC Conditions)

The TDA7263L can withstand accidental short circuits across the speaker made by a wrong connection
during normal play operation.

HEAT SINK DIMENSIONING:

In order to avoid the thermal protection intervention, that is placed approximatively at Tj = 150°C, it is important
the dimensioning of the Heat Sinker RTh (°C/W).
The parameters that influence the dimensioning are:
– Maximum dissipated power for the device (Pdmax)
– Max thermal resistance Junction to case (RTh j-c)

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 TDA7263L

– Max. ambient temperature Tamb max

– Quiescent current Iq (mA)

Example:
VCC = 20V, Rload = 8ohm, RTh j-c = 9 °C/W , Tamb max = 50°C
2
2 Vcc
Pdmax = (N° channels) · -------------------------- + I q ⋅ V cc
2
Π ⋅ R lo ad
Pdmax = 2 · ( 2.5 ) + 0.5 = 5.5W

150 – T am b max 150 – 50

- – R T h j-c = ---------------------- – 9 = 9.0°C /W
(Heat Sinker) R Th c-a = ----------------------------------------
P d max 5.5

In figure 11 is shown the Power derating curve for the device.

Figure 11. Power derating curve

10

a) Infinite Heatsink
(b) (a)
6 b) 5.0 °C/ W
Pd (W)

(c) c) 7.0 °C/ W

4

0
0 40 80 120 160
Tamb (°C)

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TDA7263L

mm inch
DIM. OUTLINE AND
MIN. TYP. MAX. MIN. TYP. MAX.
MECHANICAL DATA
A 7.1 0.280
a1 2.7 3 0.106 0.118
B 24.8 0.976
b1 0.5 0.020
b3 0.85 1.6 0.033 0.063
C 3.3 0.130
c1 0.43 0.017
c2 1.32 0.052
D 23.7 0.933
d1 14.5 0.571
e 2.54 0.100
e3 22.86 0.900
L 3.1 0.122
L1 3 0.118
L2 17.6 0.693
L3 0.25 0.010
L4 0.254 0.010
M 3.2 0.126
N 1 0.039 SIP10
P 0.15 0.006

D C
c2
L3
L1

P
M
d1

A
L2

a1

1 0
1
L
L4

b3 b1
e c1
e3
B
SIP10

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 TDA7263L

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of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.

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