AMBA DDR, LPDDR, and SDR

Dynamic Memory Controller

DMC-340
Revision: r4p0

Technical Reference Manual

Copyright © 2004-2007, 2009 ARM Limited. All rights reserved.

ARM DDI 0331G (ID111809)
 AMBA DDR, LPDDR, and SDR Dynamic Memory Controller
DMC-340
Technical Reference Manual

Copyright © 2004-2007, 2009 ARM Limited. All rights reserved.

Release Information

The Change history table lists the changes made to this book.

Change history

Date Issue Confidentiality Change

22 June 2004 A Non-Confidential First release for r0p0.

31 August 2004 B Non-Confidential Second release for r0p0.

25 August 2005 C Non-Confidential Incorporate erratum. Additional information to Exclusive access on page 2-14.

09 June 2006 D Non-Confidential First release for r1p0.

16 May 2007 E Non-Confidential First release for r2p0.

30 November 2007 F Non-Confidential First release for r3p0.

05 November 2009 G Non-Confidential First release for r4p0.

Proprietary Notice

Words and logos marked with ® or ™ are registered trademarks or trademarks of ARM® in the EU and other
countries, except as otherwise stated below in this proprietary notice. Other brands and names mentioned
herein may be the trademarks of their respective owners.

Neither the whole nor any part of the information contained in, or the product described in, this document
may be adapted or reproduced in any material form except with the prior written permission of the copyright
holder.

The product described in this document is subject to continuous developments and improvements. All
particulars of the product and its use contained in this document are given by ARM in good faith. However,
all warranties implied or expressed, including but not limited to implied warranties of merchantability, or
fitness for purpose, are excluded.

This document is intended only to assist the reader in the use of the product. ARM shall not be liable for any
loss or damage arising from the use of any information in this document, or any error or omission in such
information, or any incorrect use of the product.

Where the term ARM is used it means “ARM or any of its subsidiaries as appropriate”.

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This document is Non-Confidential. The right to use, copy and disclose this document may be subject to
license restrictions in accordance with the terms of the agreement entered into by ARM and the party that
ARM delivered this document to.

Unrestricted Access is an ARM internal classification.

Product Status

The information in this document is final, that is for a developed product.

Web Address

http://www.arm.com

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Contents
AMBA DDR, LPDDR, and SDR Dynamic Memory
Controller DMC-340 Technical Reference
Manual

Preface
About this book ............................................................................................ xvi
Feedback ...................................................................................................... xx

Chapter 1 Introduction
1.1 About the DMC ........................................................................................... 1-2
1.2 Product revisions ........................................................................................ 1-6

Chapter 2 Functional Description

2.1 Functional overview .................................................................................... 2-2
2.2 Functional operation ................................................................................. 2-10

Chapter 3 Programmers Model

3.1 About the programmers model .................................................................... 3-2
3.2 Register summary ....................................................................................... 3-6
3.3 Register descriptions .................................................................................. 3-9

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Contents

Chapter 4 Programmers Model for Test

4.1 Integration test registers ............................................................................. 4-2

Chapter 5 Device Driver

5.1 Sample device driver .................................................................................. 5-2

Appendix A Signal Descriptions

A.1 Clock and reset signals .............................................................................. A-2
A.2 Miscellaneous signals ................................................................................. A-3
A.3 AXI signals .................................................................................................. A-6
A.4 APB signals .............................................................................................. A-10
A.5 Pad interface signals ................................................................................ A-11
A.6 EBI signals ................................................................................................ A-14

Appendix B Revisions

Glossary

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List of Tables
AMBA DDR, LPDDR, and SDR Dynamic Memory
Controller DMC-340 Technical Reference
Manual

Change history .............................................................................................................. ii

Table 1-1 Supported memory device types for different DMC configurations ........................... 1-5
Table 2-1 AXI slave interface attributes .................................................................................. 2-12
Table 2-2 Address comparison steps example ....................................................................... 2-15
Table 2-3 Controller initialization example .............................................................................. 2-35
Table 2-4 LPDDR device initialization example ...................................................................... 2-36
Table 2-5 Valid system states for the FSMs ............................................................................ 2-38
Table 2-6 Recommended power states .................................................................................. 2-39
Table 2-7 Dynamic low-power modes operation ..................................................................... 2-43
Table 3-1 DMC register summary ............................................................................................. 3-6
Table 3-2 memc_status Register bit assignments .................................................................. 3-10
Table 3-3 Memory banks chip configuration ........................................................................... 3-11
Table 3-4 memc_cmd Register bit assignments ..................................................................... 3-12
Table 3-5 direct_cmd Register bit assignments ...................................................................... 3-14
Table 3-6 Memory command encoding ................................................................................... 3-14
Table 3-7 memory_cfg Register bit assignments .................................................................... 3-16
Table 3-8 refresh_prd Register bit assignments ..................................................................... 3-19
Table 3-9 cas_latency Register bit assignments ..................................................................... 3-20
Table 3-10 t_dqss Register bit assignments ............................................................................. 3-21

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List of Tables

Table 3-11 t_mrd Register bit assignments .............................................................................. 3-22

Table 3-12 t_ras Register bit assignments ............................................................................... 3-22
Table 3-13 t_rc Register bit assignments ................................................................................. 3-23
Table 3-14 t_rcd Register bit assignments ............................................................................... 3-24
Table 3-15 t_rfc Register bit assignments ................................................................................ 3-25
Table 3-16 t_rp Register bit assignments ................................................................................. 3-26
Table 3-17 t_rrd Register bit assignments ................................................................................ 3-26
Table 3-18 t_wr Register bit assignments ................................................................................. 3-27
Table 3-19 t_wtr Register bit assignments ................................................................................ 3-28
Table 3-20 t_xp Register bit assignments ................................................................................. 3-29
Table 3-21 t_xsr Register bit assignments ................................................................................ 3-29
Table 3-22 t_esr Register bit assignments ............................................................................... 3-30
Table 3-23 memory_cfg2 Register bit assignments .................................................................. 3-32
Table 3-24 memory_cfg3 Register bit assignments .................................................................. 3-35
Table 3-25 update_type Register bit assignments .................................................................... 3-36
Table 3-26 t_rddata_en Register bit assignments .................................................................... 3-37
Table 3-27 read_transfer_delay Register bit assignments ....................................................... 3-38
Table 3-28 id_<n>_cfg Register bit assignments ...................................................................... 3-39
Table 3-29 chip_cfg<n> registers bit assignments ................................................................... 3-40
Table 3-30 user_status Register bit assignments ..................................................................... 3-41
Table 3-31 user_config Register bit assignments ..................................................................... 3-42
Table 3-32 user_config1 Register bit assignments ................................................................... 3-42
Table 3-33 feature_ctrl Register bit assignments ..................................................................... 3-43
Table 3-34 Conceptual peripheral ID Register bit assignments ................................................ 3-44
Table 3-35 periph_id_0 Register bit assignments ..................................................................... 3-45
Table 3-36 periph_id_1 Register bit assignments ..................................................................... 3-45
Table 3-37 periph_id_2 Register bit assignments ..................................................................... 3-46
Table 3-38 periph_id_3 Register bit assignments ..................................................................... 3-46
Table 3-39 pcell_id Register bit assignments ........................................................................... 3-47
Table 4-1 DMC test Register summary ..................................................................................... 4-2
Table 4-2 int_cfg Register bit assignments ............................................................................... 4-3
Table 4-3 int_inputs Register bit assignments .......................................................................... 4-4
Table 4-4 int_outputs Register bit assignments ........................................................................ 4-6
Table A-1 Clock and reset signals ............................................................................................. A-2
Table A-2 QoS signal ................................................................................................................ A-3
Table A-3 Tie-off signals ........................................................................................................... A-3
Table A-4 User signals .............................................................................................................. A-5
Table A-5 Scan test signals ....................................................................................................... A-5
Table A-6 Write address channel signals .................................................................................. A-6
Table A-7 Write data channel signals ........................................................................................ A-7
Table A-8 Write response channel signals ................................................................................ A-7
Table A-9 Read address channel signals .................................................................................. A-8
Table A-10 Read data channel signals ....................................................................................... A-9
Table A-11 AXI low-power interface signals ................................................................................ A-9
Table A-12 APB interface signals .............................................................................................. A-10
Table A-13 Legacy pad interface signals .................................................................................. A-11
Table A-14 DFI pad interface signals ........................................................................................ A-13

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 List of Tables

Table A-15 EBI signals .............................................................................................................. A-14

Table B-1 Differences between issue F and issue G ................................................................. B-1

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List of Tables

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List of Figures
AMBA DDR, LPDDR, and SDR Dynamic Memory
Controller DMC-340 Technical Reference
Manual

Key to timing diagram conventions .......................................................................... xviii

Figure 1-1 Example system ........................................................................................................ 1-3
Figure 2-1 DMC block diagram ................................................................................................... 2-2
Figure 2-2 AXI slave interface connections ................................................................................ 2-4
Figure 2-3 AXI low-power interface channel signals .................................................................. 2-5
Figure 2-4 APB signals ............................................................................................................... 2-5
Figure 2-5 Tie-off signals ............................................................................................................ 2-6
Figure 2-6 User signals .............................................................................................................. 2-6
Figure 2-7 mclk domain FSM ..................................................................................................... 2-7
Figure 2-8 Legacy pad interface signals ..................................................................................... 2-8
Figure 2-9 DFI pad interface signals .......................................................................................... 2-8
Figure 2-10 QoS signal ................................................................................................................. 2-9
Figure 2-11 EBI signals ................................................................................................................ 2-9
Figure 2-12 aclk domain state diagram ...................................................................................... 2-19
Figure 2-13 Command control output timing .............................................................................. 2-29
Figure 2-14 ACTIVE command to Read or Write command timing, tRCD ................................. 2-29
Figure 2-15 Same bank ACTIVE to ACTIVE, and ACTIVE to AUTO REFRESH command timing, tRC
2-29
Figure 2-16 Different bank ACTIVE to ACTIVE command timing, tRRD .................................... 2-30

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List of Figures

Figure 2-17 PRECHARGE to command and AUTO REFRESH to command timing, tRP and tRFC .
2-30
Figure 2-18 ACTIVE to PRECHARGE, and PRECHARGE to PRECHARGE timing, tRAS and tRP .
2-30
Figure 2-19 MODEREG to command timing, tMRD ................................................................... 2-31
Figure 2-20 Self-refresh entry and exit timing, tESR and tXSR ................................................. 2-31
Figure 2-21 Power-down entry and exit timing, tXP ................................................................... 2-31
Figure 2-22 Data output timing, tWTR ....................................................................................... 2-32
Figure 2-23 Data output timing, tDQSS = 1 ............................................................................... 2-32
Figure 2-24 Data input timing ..................................................................................................... 2-33
Figure 2-25 System state transitions .......................................................................................... 2-39
Figure 2-26 Auto power-down .................................................................................................... 2-44
Figure 2-27 Force precharge with zero force precharge time .................................................... 2-44
Figure 2-28 Force precharge after power_dwn_prd time ........................................................... 2-45
Figure 2-29 Auto self-refresh entry ............................................................................................ 2-45
Figure 2-30 DMC in context ....................................................................................................... 2-48
Figure 3-1 Register map ............................................................................................................ 3-2
Figure 3-2 DMC configuration register map ............................................................................... 3-3
Figure 3-3 AXI ID configuration register map ............................................................................. 3-4
Figure 3-4 Chip configuration register map ................................................................................ 3-4
Figure 3-5 User configuration register map ................................................................................ 3-4
Figure 3-6 Component configuration register map ..................................................................... 3-5
Figure 3-7 memc_status Register bit assignments .................................................................... 3-9
Figure 3-8 memc_cmd Register bit assignments ..................................................................... 3-12
Figure 3-9 direct_cmd Register bit assignments ...................................................................... 3-14
Figure 3-10 memory_cfg Register bit assignments .................................................................... 3-16
Figure 3-11 refresh_prd Register bit assignments ..................................................................... 3-19
Figure 3-12 cas_latency Register bit assignments .................................................................... 3-20
Figure 3-13 t_dqss Register bit assignments ............................................................................. 3-21
Figure 3-14 t_mrd Register bit assignments .............................................................................. 3-21
Figure 3-15 t_ras Register bit assignments ............................................................................... 3-22
Figure 3-16 t_rc Register bit assignments ................................................................................. 3-23
Figure 3-17 t_rcd Register bit assignments ............................................................................... 3-24
Figure 3-18 t_rfc Register bit assignments ................................................................................ 3-24
Figure 3-19 t_rp Register bit assignments ................................................................................. 3-25
Figure 3-20 t_rrd Register bit assignments ................................................................................ 3-26
Figure 3-21 t_wr Register bit assignments ................................................................................. 3-27
Figure 3-22 t_wtr Register bit assignments ................................................................................ 3-28
Figure 3-23 t_xp Register bit assignments ................................................................................. 3-28
Figure 3-24 t_xsr Register bit assignments ................................................................................ 3-29
Figure 3-25 t_esr Register bit assignments ............................................................................... 3-30
Figure 3-26 memory_cfg2 Register bit assignments .................................................................. 3-31
Figure 3-27 memory_cfg3 Register bit assignments .................................................................. 3-34
Figure 3-28 update_type Register bit assignments .................................................................... 3-35
Figure 3-29 t_rddata_en Register bit assignments .................................................................... 3-37
Figure 3-30 read_transfer_delay Register bit assignments ....................................................... 3-37
Figure 3-31 id_<n>_cfg Register bit assignments ...................................................................... 3-39

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 List of Figures

Figure 3-32 chip_cfg<n> registers bit assignments .................................................................... 3-40

Figure 3-33 user_status Register bit assignments ..................................................................... 3-41
Figure 3-34 user_config Register bit assignments ..................................................................... 3-41
Figure 3-35 user_config1 Register bit assignments ................................................................... 3-42
Figure 3-36 feature_ctrl Register bit assignments ...................................................................... 3-43
Figure 3-37 periph_id_[3:0] Register bit assignments ................................................................ 3-44
Figure 3-38 pcell_id Register bit assignments ............................................................................ 3-47
Figure 4-1 Integration test register map ..................................................................................... 4-2
Figure 4-2 int_cfg Register bit assignments ............................................................................... 4-3
Figure 4-3 int_inputs Register bit assignments .......................................................................... 4-4
Figure 4-4 int_outputs Register bit assignments ........................................................................ 4-6

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List of Figures

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Preface

This preface introduces the AMBA DDR, LPDDR, and SDR Dynamic Memory
Controller DMC-340 Technical Reference Manual. It contains the following sections:
• About this book on page xvi
• Feedback on page xx.

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Preface

About this book

This is the Technical Reference Manual for the AMBA DDR, LPDDR, and SDR
Dynamic Memory Controller. The memory controller is highly configurable to support
multiple types and sizes of SDRAM.

Product revision status

The rnpn identifier indicates the revision status of the product described in this book,
where:
rn Identifies the major revision of the product.
pn Identifies the minor revision or modification status of the product.

Intended audience

This book is written for system designers, system integrators, and programmers who are
designing or programming a System-on-Chip (SoC) device that uses the DMC. The
DMC provides an interface between the Advanced eXtensible Interface (AXI™) system
bus and external, off-chip, memory devices.

Using this book

This book is organized into the following chapters:

Chapter 1 Introduction
Read this for an introduction to the DMC and its features.

Chapter 2 Functional Description

Read this for an overview of the major functional blocks and the
operation of the DMC.

Chapter 3 Programmers Model

Read this for a description of the memory map and registers.

Chapter 4 Programmers Model for Test

Read this for a description of the additional logic for integration testing.

Chapter 5 Device Driver

Read this for a description of the device driver functions.

Appendix A Signal Descriptions

Read this for a description of the input and output signals.

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 Preface

Appendix B Revisions
Read this for a description of the technical changes between released
issues of this book.

Glossary Read this for definitions of terms used in this book.

Conventions

Conventions that this book can use are described in:

• Typographical
• Timing diagrams
• Signals on page xviii.

Typographical

The typographical conventions are:

italic Highlights important notes, introduces special terminology,

denotes internal cross-references, and citations.

bold Highlights interface elements, such as menu names. Denotes

signal names. Also used for terms in descriptive lists, where
appropriate.

monospace Denotes text that you can enter at the keyboard, such as
commands, file and program names, and source code.

monospace Denotes a permitted abbreviation for a command or option. You

can enter the underlined text instead of the full command or option
name.

monospace italic Denotes arguments to monospace text where the argument is to be

replaced by a specific value.

monospace bold Denotes language keywords when used outside example code.

< and > Enclose replaceable terms for assembler syntax where they appear
in code or code fragments. For example:
MRC p15, 0 <Rd>, <CRn>, <CRm>, <Opcode_2>

Timing diagrams

The figure named Key to timing diagram conventions on page xviii explains the
components used in timing diagrams. Variations, when they occur, have clear labels.
You must not assume any timing information that is not explicit in the diagrams.

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Preface

Shaded bus and signal areas are undefined, so the bus or signal can assume any value
within the shaded area at that time. The actual level is unimportant and does not affect
normal operation.

Clock

HIGH to LOW

Transient

HIGH/LOW to HIGH

Bus stable

Bus to high impedance

Bus change

High impedance to stable bus

Key to timing diagram conventions

Signals

The signal conventions are:

Signal level The level of an asserted signal depends on whether the signal is
active-HIGH or active-LOW. Asserted means:
• HIGH for active-HIGH signals
• LOW for active-LOW signals.

Lower-case n At the start or end of a signal name denotes an active-LOW signal.

Additional reading

This section lists publications by ARM and by third parties.

See Infocenter, http://infocenter.arm.com, for access to ARM documentation.

ARM publications

This book contains information that is specific to the DMC. See the following
documents for other relevant information:
• AMBA DDR, LPDDR, and SDR Dynamic Memory Controller DMC-340
LPDDR-NVM Technical Reference Manual Supplement (ARM DSU 0004)

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 Preface

Note
This book is only delivered if you license the Low-Power Double Data
Rate-Non-Volatile Memory (LPDDR NVM) add-on.

• AMBA DDR, LPDDR, and SDR Dynamic Memory Controller DMC-340

Integration Manual (ARM DII 0105)
• AMBA DDR, LPDDR, and SDR Dynamic Memory Controller DMC-340
Implementation Guide (ARM DII 0106)
• AMBA DDR, LPDDR, and SDR Dynamic Memory Controller DMC-340
Supplement to AMBA Designer (ADR-301) User Guide (ARM DSU 0005)
• AMBA Designer (ADR-301) User Guide (ARM DUI 0333)
• ARM PrimeCell® External Bus Interface (PL220) Technical Reference Manual
(ARM DDI 0249)
• Integrating an External Bus Interface (PL220) with PL3xx Memory Controllers
Application Note (ARM DAI 0184)
• AMBA AXI Protocol Specification (ARM IHI 0022)
• AMBA 3 APB Protocol Specification (ARM IHI 0024)
• AMBA DDR, LPDDR, and SDR Dynamic Memory Controller DMC-340 Release
Note.

Other publications

This section lists relevant documents published by third parties:

• DDR PHY Interface (DFI) Specification, http://www.ddr-phy.org
• JEDEC STANDARD Double Data Rate (DDR) SDRAM Specification, JESD79,
http://www.jedec.org
• JEDEC STANDARD Low Power Double Data Rate (LPDDR) SDRAM
Specification, JESD209, http://www.jedec.org
• JEDEC STANDARD LPDDR-NVM Specification, http://www.jedec.org.

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Preface

Feedback
ARM welcomes feedback on this product and its documentation.

Feedback on this product

If you have any comments or suggestions about this product, contact your supplier and
give:
• The product name.
• The product revision or version.
• An explanation with as much information as you can provide. Include symptoms
and diagnostic procedures if appropriate.

Feedback on content

If you have comments on content then send an e-mail to [email protected]. Give:

• the title
• the number, ARM DDI 0331G
• the page numbers to which your comments apply
• a concise explanation of your comments.

ARM also welcomes general suggestions for additions and improvements.

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Chapter 1
Introduction

This chapter introduces the DMC and contains the following sections:
• About the DMC on page 1-2
• Product revisions on page 1-6.

Note
The DMC product designator is either PL340 or DMC-340 and depends on the product
revision as follows:

r0p0 - r3p0 PL340.

r4p0 or later DMC-340.

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Introduction

1.1 About the DMC

The DMC is an Advanced Microcontroller Bus Architecture (AMBA) compliant that is
developed, tested, and licensed by ARM.

The DMC is a high-performance, area-optimized SDRAM or Mobile SDR memory

controller compatible with the AMBA AXI protocol.

You can configure the DMC with a number of options, for example:
• the SDRAM or Mobile SDR memory type
• the number of SDRAM or Mobile SDR memory devices
• the maximum SDRAM or Mobile SDR memory width
• the number of outstanding AXI addresses
• the pad interface type, for connection to the PHYsical (PHY) device.

For a complete list of the configurable options, see Features of the DMC on page 1-3.

Note
For differences between revisions, see Product revisions on page 1-6.

The DMC supports the PrimeCell (PL220) External Bus Interface (EBI). This ensures
that you can still use a shared external bus.

For more information about AMBA, see:

• AMBA AXI Protocol Specification
• AMBA 3 APB Protocol Specification.

Figure 1-1 on page 1-3 shows an example memory controller system.

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 Introduction

From Static Memory

Controller (SMC)
ARM SRAM
processor
AXI-APB
bridge EBI
DMA AXI
DMC
controller infrastructure

SDRAM
Processor Control bus
code in
ROM

Figure 1-1 Example system

1.1.1 Features of the DMC

The DMC has the following features:

• configurable, soft macrocell available in Verilog
• scalable pipeline
• interface between AMBA AXI bus fabric and DDR, LPDDR, SDR, Mobile SDR
and eDRAM memories
Note
LPDDR is also known as Mobile DDR.

• interfaces to a PHY device using either:

— legacy pad interface
— DDR PHY Interface (DFI) pad interface
• Quality of Service (QoS) and request arbitration features for low latency transfers
and optimal use of memory bandwidth
• packing and unpacking of memory data access for AXI transactions width less
than the memory width
• write data interleaving supported
• multiple outstanding addresses supported
• support for ARMv6 outstanding exclusive accesses
• supports synchronous and asynchronous operation between AXI bus fabric and
external memory bus

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Introduction

Note
Synchronous relates to rising edge-aligned clocks.

• programmable support for memory power saving modes including Deep

Power-Down (DPD), active power-down, precharge power-down and self-refresh
• programmable through the AMBA APB interface
• synchronous n:1 between AXI and APB when the clocks are rising edge-aligned
• area and performance optimization, trade-offs through configurable hardware
resources
• optimized utilization of external memory bus
• one to four external chip selects
• configurable for either a single cke signal for all chip selects or a separate cke
signal for each chip select
• configurable bus width for the arid, awid, bid, rid, and wid signals
• configurable bus width for the user_status, user_config, and user_config1
signals.

1.1.2 Supported memory widths

The DMC can support memory data bus widths of 16-bit, 32-bit, or 64-bit. However,
during configuration of the DMC then it might not permit all of these options depending
on the:
• Configured AXI data bus width.
• Type of memory device, SDR or DDR, that the DMC controls. When the DMC
controls:
SDR devices The memory data bus width must not be less than half of the
AXI data bus width.
DDR devices The memory data bus width must not be less than one
quarter of the AXI data bus width, and no greater than the
AXI data bus width.

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 Introduction

Table 1-1 shows the memory device widths that you can connect to a DMC depending
on the configured AXI bus width and configured memory data bus width,
MEMWIDTH.

Table 1-1 Supported memory device types for different DMC configurations

Memory interface
AXI data bus width data bus width, SDR device width DDR device width
MEMWIDTH

32-bit 16-bit 16-bit 16-bit

32-bit 32-bit 32-bit

16-bit a 16-bit a

64-bit - -

64-bit 16-bit - 16-bit

32-bit 32-bit 32-bit

- 16-bit a

64-bit - 64-bit
32-bit a

128-bit 16-bit - -

32-bit - 32-bit
-

64-bit - 64-bit
32-bit a
a. To use devices of this data width you must disable the DMC from using the upper half of the data bus
on the memory interface by setting the memory_width[1:0] tie-off or programming the
memory_width field in the Memory Configuration 2 Register on page 3-30.

1.1.3 Supported memory devices

For more information, see the AMBA DDR, LPDDR, and SDR Dynamic Memory
Controller DMC-340 Release Note.

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Introduction

1.2 Product revisions

This section summarizes the differences in functionality between the product revisions:

r0p0 - r1p0 This release includes a new configurable part.

r1p0 - r2p0 This release includes:

• New configurable options:
— configuration that is programmable to support SDR, Mobile
SDR, DDR, and LPDDR memory types
— eDRAM configuration
— a global cke signal or a local cke signal for each memory
device
— scalable pipeline
— low-power modes of operation.
• New programmable options:
— DPD support
— variable number of auto-refresh requests before priority
change.
• New functionality:
— improved write termination
— programmable read_delay.

r2p0 - r3p0 This release includes optional NVM functionality.

r3p0 - r4p0 This release includes:

• the option to configure the DMC to support a DFI pad interface, see
Pad interface on page 2-33
• the ability to move all memory devices to deep power-down mode,
see Deep Power-Down on page 2-46
• addition of user_config1 signals and User Config1 Register on
page 3-42
• addition of the read_transfer_delay Register which controls the
number of idle cycles for back to back reads, see Read Transfer
Delay Register on page 3-37
• addition of the feature_ctrl Register which controls the early write
response behavior, see Feature Control Register on page 3-43
• configurable bus width for the user_status, user_config, and
user_config1 signals, see User signals on page A-5

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 Introduction

• configurable bus width for the arid, awid, bid, rid, and wid
signals, see AXI signals on page A-6.

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Introduction

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Chapter 2
Functional Description

This chapter describes the DMC operation. It contains the following sections:
• Functional overview on page 2-2
• Functional operation on page 2-10.

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Functional Description

2.1 Functional overview

Figure 2-1 shows the interfaces of the DMC.

APB slave interface External Bus Interface (EBI)

AXI slave interface

AXI low-power External
interface channel Pad memory
DMC
interface interface to
QoS SDRAM

Tie-off signals

User signals User signals

Figure 2-1 DMC block diagram

Note
If the DMC is configured to support a DDR PHY Interface (DFI) pad interface, then the
EBI signals are not available.

The interfaces of the DMC are:

• AXI slave interface on page 2-3
• AXI low-power interface on page 2-5
• APB slave interface on page 2-5
• Tie-off signals on page 2-6
• User signals on page 2-6
• Memory interface on page 2-6
• Pad interface on page 2-8
• QoS signal on page 2-9
• EBI on page 2-9.

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2.1.1 AXI slave interface

The AXI slave interface comprises the following AXI channels:

Write address Enables the transfer of the address and all other control data
required for the DMC to carry out an AXI write transaction.

Write data Enables the transfer of write data and validating data byte strobes
to the DMC.

Write response Enables the transfer of response information associated with a

write transaction.

Read address Enables the transfer of the address and all other control data
required for the DMC to carry out an AXI read transaction.

Read data Enables the transfer of read data and response information
associated with a read transaction.

For more information about AMBA AXI, see the AMBA AXI Protocol Specification.

Figure 2-2 on page 2-4 shows the AXI slave interface external connections.

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Functional Description

aclk
Global signals
aresetn

awid[AID_WIDTH–1:0]
awaddr[31:0]
awlen[3:0]
awsize[2:0]
Write address
awburst[1:0] awready
channel
awlock[1:0]
awcache[3:0]
awprot[2:0]
awvalid

wid[AID_WIDTH–1:0]
wdata[AXI_DATA_MSB:0]
Write data
wstrb[AXI_STRB_MSB:0] wready
channel
wlast
wvalid

bid[AID_WIDTH–1:0]
Write response
bready bresp[1:0]
channel
bvalid

arid[AID_WIDTH–1:0]
araddr[31:0]
arlen[3:0]
arsize[2:0]
Read address
arburst[1:0] arready
channel
arlock[1:0]
arcache[3:0]
arprot[2:0]
arvalid

rid[AID_WIDTH–1:0]
rdata[AXI_DATA_MSB:0]
Read data
rready rresp[1:0]
channel
rlast
rvalid

Figure 2-2 AXI slave interface connections

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Note
The arcache and arprot signals are included in the AXI slave interface, only for
completeness. The DMC ignores any information that these signals provide.

For more information, see AXI slave interface on page 2-11.

2.1.2 AXI low-power interface

Figure 2-3 shows the AXI low-power interface channel signals.

cclken AXI low-power csysack

csysreq interface channel cactive

Figure 2-3 AXI low-power interface channel signals

For more information, see AXI low-power interface on page 2-16.

2.1.3 APB slave interface

The APB slave interface provides access to the internal registers of the DMC.
Figure 2-4 shows the APB interface external connections.

aclk
paddr[31:0]
pclken prdata[31:0]
penable APB pready
psel pslverr
pwdata[31:0]
pwrite

Figure 2-4 APB signals

Note
The pslverr output is included for completeness, and the DMC permanently drives it
LOW.

For more information, see APB slave interface on page 2-17.

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2.1.4 Tie-off signals

The tie-off signals initialize various operating parameters of the DMC when it exits the
reset state. Figure 2-5 shows the tie-off signals.

a_gt_m_sync
cke_init
dqm_init
memory_width[1:0] Tie-offs
memory_type[2:0]
read_delay[1:0]
sync

Figure 2-5 Tie-off signals

For more information, see Tie-off signals on page 2-18.

2.1.5 User signals

The user signals are general purpose input and output signals that you can control and
monitor by using the registers that the DMC provides. Figure 2-6 shows the user
signals.

user_config[USER_CONFIG_WIDTH–1:0]
user_status[USER_STATUS_WIDTH–1:0] DMC
user_config1[USER_CONFIG_WIDTH–1:0]

Figure 2-6 User signals

For more information, see Miscellaneous signals on page 2-18.

2.1.6 Memory interface

The memory interface provides a clean and defined interface between the arbiter and
the pad interface, ensuring that the external memory interface command protocols are
met in accordance with the programmed timings in the register block. See Chapter 3
Programmers Model.

The external inputs and outputs to this block are:

mclk Clock for mclk domain.

mresetn Reset for mclk domain. This signal is active LOW.

ebibackoff Tie this LOW to indicate that the DMC must not back off from the bus,
if you are not using an External Bus Interface (EBI).

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ebigrant Tie this HIGH to indicate that the bus is always granted, if you are not
using an EBI.

ebireq Leave this unconnected, if you are not using an EBI.

use_ebi Tie this LOW, if you are not using an EBI.

The memory interface tracks and controls the state of the external memories using either
an mclk Finite State Machine (FSM) per extended memory or one mclk FSM
depending on the configuration of the DMC. Figure 2-7 shows an mclk domain FSM.

start

POR Reset

Pwr_sref Pwr_up Pwr_down

Pwr_dpd

Figure 2-7 mclk domain FSM

See Table 2-5 on page 2-38 for valid system states and Deep Power-Down on
page 2-46.

For more information, see Memory interface on page 2-27.

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2.1.7 Pad interface

You can configure the DMC to provide either a:

• legacy pad interface, see Figure 2-8
• DFI pad interface, see Figure 2-9.

add[15:0]
ap
ba[1:0]
dqs_in_<n>
cas_n
dqs_in_n_<n>
cke[MEMORY_CHIPS–1:0]
dq_in[MEMWIDTH–1:0]
clk_out[MEMORY_CHIPS–1:0]
fbclk_in
Legacy pad interface cs_n[MEMORY_CHIPS–1:0]
mclk
data_en
mclkn
dqm[MEMORY_BYTES–1:0]
mclkx2
dqs_out_<n>
mclkx2n
dq_out[MEMWIDTH–1:0]
ras_n
we_n

Figure 2-8 Legacy pad interface signals

dfi_address[15:0]
dfi_bank[1:0]
dfi_cas_n
dfi_init_complete dfi_cke[MEMORY_CHIPS–1:0]
dfi_phyupd_req dfi_cs_n[MEMORY_CHIPS–1:0]
dfi_dram_clk_disable[MEMORY_CHIPS–1:0]
dfi_phyupd_type[1:0]
DFI pad interface dfi_phyupd_ack
dfi_rddata[2*MEMWIDTH–1:0] dfi_ras_n
dfi_rddata_valid dfi_rddata_en[MEMORY_BYTES–1:0]
mclk dfi_we_n
dfi_wrdata_en[MEMORY_BYTES–1:0]
dfi_wrdata[2*MEMWIDTH–1:0]
dfi_wrdata_mask[MEMORY_BYTES–1:0]

Figure 2-9 DFI pad interface signals

For more information, see Pad interface on page 2-33.

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 Functional Description

2.1.8 QoS signal

An AMBA master can use the QoS signal to request that the DMC assigns the minimum
latency to the current read transaction. Figure 2-10 shows the QoS signal.

qos_override[15:0] QoS

Figure 2-10 QoS signal

For more information, see Quality of Service on page 2-23.

2.1.9 EBI

The External Bus Interface (EBI) provides a mechanism for sharing the memory
address and data buses with another memory controller. For more information, see the:
• ARM PrimeCell External Bus Interface (PL220) Technical Reference Manual
• Integrating an External Bus Interface (PL220) with PL3xx Memory Controllers
Application Note.

Figure 2-11 shows the EBI signals.

ebibackoff
EBI ebireq
ebigrant

Figure 2-11 EBI signals

Note
If the DMC is configured to support a DFI pad interface then the EBI is not available.

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Functional Description

2.2 Functional operation

This section describes:
• Clocking and resets
• AXI slave interface on page 2-11
• AXI low-power interface on page 2-16
• APB slave interface on page 2-17
• Tie-off signals on page 2-18
• Miscellaneous signals on page 2-18
• Controller management operations on page 2-18
• Data operations on page 2-21
• Memory interface on page 2-27
• Pad interface on page 2-33
• Initialization on page 2-34
• Low-power operation on page 2-37
• TrustZone technology support on page 2-48.

2.2.1 Clocking and resets

This section describes:

• Clocking
• Reset on page 2-11.

Clocking

The DMC has the following functional clock inputs:

• aclk
• mclk
• mclkn
• mclkx2
• mclkx2n
• dqs_in_<n> where n is 0<n<bytes of external memory data bus
• dqs_in_n_<n> where n is 0<n<bytes of external memory data bus.

Note
mclkn, mclkx2, mclkx2n, dqs_in_<n>, and dqs_in_n_<n> are only available, if the
DMC is configured to contain a legacy pad interface.

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These clocks can be grouped into two clock domains:

aclk domain aclk is in this domain. The aclk domain signals can only be
stopped if the external memories are put in self-refresh mode.

mclk domain All clocks except aclk are in this domain. The mclk signal must
be clocked at the rate of the external memory clock speed. The
mclk domain signals can only be stopped if the external memories
are put in self-refresh mode.

Note
When configured with a legacy pad interface, the DMC provides a separate clock output
for each external memory device.

Reset

The DMC has two reset inputs:

aresetn This is the reset signal for the aclk domain.
mresetn This is the reset signal for the mclk domain.

You can change both reset signals asynchronously to their respective clock domain.
Internally to the DMC, the deassertion of the aresetn signal is synchronized to aclk, and
the deassertion of the mresetn signal is synchronized to:
• mclk for a DMC configured with DFI
• the mclk, mclkn, mclkx2, and mclkx2n clock signals for a DMC configured with
a legacy pad interface.

2.2.2 AXI slave interface

The AXI programmers view is of a flat area of memory. The full range of AXI
operations are supported, provided that the memory burst length selected is less than the
read data FIFO depth.

Note
• The read data FIFO depth and write data buffer depth are set during the
configuration process.
For more information, see the AMBA DDR, LPDDR, and SDR Dynamic Memory
Controller DMC-340 Supplement to AMBA Designer (ADR-301) User Guide.

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• Refreshes can be missed if rready is held LOW, or the External Bus Interface
(EBI) is not granted, for longer than one refresh period and the read data FIFO,
command FIFO, and the arbiter queue become full. An OVL error triggers if this
occurs in simulation. Ensure that the device has a sufficiently high system priority
to prevent this.

If the AXI write data channel width is less than the memory data bus transfer rate, then
to minimize memory accesses the DMC delays the memory access, when possible, until
it can transfer the maximum number of data bits to the memory device. If the AXI read
data channel width is less than the memory data bus transfer rate, then after the DMC
reads the memory device it buffers the data to minimize the number of memory
accesses. The memory data bus transfer rate is MEMWIDTH for SDR devices and
2×MEMWIDTH for DDR devices.

This section describes:

• AXI slave interface attributes
• Early BRESP on page 2-13
• Memory device base address on page 2-13
• Formatting from AXI address channels on page 2-14
• Exclusive access on page 2-14.

AXI slave interface attributes

Table 2-1 shows the AXI slave attributes and their values.

Table 2-1 AXI slave interface attributes

Attribute a Value

Combined acceptance capability

Read acceptance capability

Read data reorder depth

Arbiter queue depth
Read interleave depth

Write acceptance capability

Write interleave depth

a. See Glossary for a description of these AXI

attributes.

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If you connect the AXI slave interface of the DMC to the PrimeCell Interconnect
(PL301) then the following AXI attributes in the PrimeCell Interconnect master
interface require configuring:

Write issuing capability

Set this to the value of the arbiter queue depth, or less. This ensures that
the write acceptance capability of the DMC is not exceeded.

Write interleave capability

Set this to the value of the arbiter queue depth, or less. This ensures that
the write interleave depth of the DMC is not exceeded.

Note
• When using the AMBA Designer application to configure a master interface on
the PrimeCell Interconnect (PL301), because AMBA Designer refers to the
parameters of an attached slave then you set the write acceptance capability and
write interleave depth. AMBA Designer uses the value entered to set the write
issuing capability and write interleave capability of the PrimeCell Interconnect.
• The other attributes that Table 2-1 on page 2-12 shows are not applicable when
configuring a PrimeCell Interconnect (PL301).

Early BRESP

To enable early write response timing, the DMC employs write data buffering and can
issue the BRESP transfer before the data has been committed to the memory device.
The response is sent after the last data beat is accepted by the AXI slave interface and
stored in the write data buffer. You can enable this feature by programming the Feature
Control Register on page 3-43. The controller have to maintain the coherency for read
after write and write after write hazards to comply with the AXI ordering model.

Note
For exclusive write accesses, the controller only issues a BRESP transfer after the write
transaction is committed to a memory device.

Memory device base address

The base addresses of the external memory devices are programmable using the
chip_cfg<n> registers. See Chip Configuration Register on page 3-39.

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Formatting from AXI address channels

Formatting is as follows:

Chip select decoding

The DMC compares an incoming address on araddr[31:24], or
awaddr[31:24], with each address_match field programmed in the
chip_cfg<n> registers. When a match occurs the DMC asserts chip select
<n>. The address_mask field enables you to exclude some bits from the
address comparison. See Chip Configuration Register on page 3-39.
If no address match occurs then the DMC still performs the transfer but
the result is undefined.

Row select decoding

The AXI address determines the row address using bits [5:3] of the
memory_cfg Register, and also the address_fmt bit for the selected chip
defined in the chip_cfg<n> Register.

Column select decoding

The AXI address determines the column address using bits [2:0] of the
memory_cfg Register. See Memory Configuration Register on
page 3-15.

Bank select decoding

The AXI address determines the chip bank depending on the
configuration of the DMC in addition to the address_fmt bit for the
selected chip defined in the chip_cfg<n> Register.

Exclusive access

In addition to reads and writes, the DMC supports exclusive reads and writes in
accordance with the AMBA AXI Protocol Specification.

Successful exclusive accesses have an EXOKAY response. All other accesses,

including exclusive fail accesses, receive an OKAY response.

Exclusive access monitors implement the exclusive access functionality. Each monitor
can track a single exclusive access. The number of monitors is a configurable option.

If an exclusive write fails, the data mask for the write is forced LOW, so that the data is
not written.

When monitoring an exclusive access, the address of any write from another master is
compared with the monitored address to check that the location is not being updated.

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For the purposes of monitoring, address comparison is made using a bit mask derived
in the following fashion.

Consider the byte addresses accessed by a transaction. All the least significant bits, up
to and including, the most significant bit that vary between those addresses are set to
logic zero in the mask. All the stable address bits above this point are set to logic one.

Example 2-1 provides information about three transactions.

Example 2-1 Exclusive accesses

Exclusive Read Address = 0x100, size = WORD, length = 1, ID = 0.

Write Address = 0x104, size = WORD, length = 2, ID = 1.

Exclusive Write Address = 0x100, size = WORD, length = 1, ID = 0.

The write transaction accesses the address range 0x104-0x10B. Therefore, address bit 3
is the most significant bit that varies between byte addresses. The bit mask is therefore
formed so that address bits 3 down to 0 are not compared. This has the effect that the
masked write, as far as the monitoring logic has calculated, has accessed the monitored
address. Therefore the exclusive write is marked as having failed.

Table 2-2 shows the address comparison steps.

Table 2-2 Address comparison steps example

Step Binary Hex

1 Monitored address b000100000000 0x100

2 Write address b000100000100 0x104

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Table 2-2 Address comparison steps example (continued)

Step Binary Hex

3 Write accesses b000100000100 0x104

b000100000101 0x105

b000100000110 0x106

b000100000111 0x107

b000100001000 0x108

b000100001001 0x109

b000100001010 0x10A

b000100001011 0x10B

4 Generate a comparison mask b111111110000 0xFF0

5 Monitored address ANDed with mask b000100000000 0x100

6 Write address ANDed with mask b000100000000 0x100

7 Compare steps 5 and 6

8 Mark exclusive write as failed

This example shows how the logic can introduce false-negatives in exclusive access
monitoring, because in reality the write has not accessed the monitored address. The
implementation has been chosen to reduce design complexity but always provide safe
behavior.

When calculating the address region accessed by the write, the burst type is always
taken to be INCR. Therefore, a wrapped transaction in Example 2-1 on page 2-15 that
wraps down to 0x0 rather than cross the boundary, is treated in the same way. This is the
same for a fixed burst that does not cross the boundary or wrap down to 0x0.

2.2.3 AXI low-power interface

The low-power interface can move the DMC into its Low_power state without the
requirement for any register accesses, see aclk domain state diagram on page 2-19 and
Low-power operation on page 2-37.

For more information about the AXI low-power interface, see the AMBA DDR,
LPDDR, and SDR Dynamic Memory Controller DMC-340 Integration Manual.

If you do not require the low-power interface, tie it off.

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2.2.4 APB slave interface

The APB interface is a fully compliant APB slave.

For more information about the AMBA APB, see the AMBA 3 APB Protocol
Specification.

The APB interface enables you to access the operating state of the DMC and to program
it with the correct timings and settings for the connected memory type. See Chapter 3
Programmers Model for more information. The APB interface also initializes the
connected memory devices, see Initialization on page 2-34.

Note
• The APB interface only supports 32-bit data accesses. The DMC ignores the
paddr[1:0] bits and therefore byte or halfword accesses are treated as word
accesses.
• The pslverr output is included for completeness. The DMC ties it LOW.

The APB interface is clocked by the same clock as the AXI domain clock, aclk. The
DMC provides a clock enable, pclken, enabling the APB interface to be slowed down
and execute at an integer divisor of aclk.

To enable a clean registered interface to the external infrastructure, the APB interface
always adds a wait state for all reads and writes by driving pready LOW. In the
following instances, a delay of more than one wait state can be generated when a:
• direct command is received and there are outstanding commands that prevent a
new command being stored in the command FIFO
• memory command is received, and a previous memory command has not been
completed.

The only registers that can be accessed when the DMC is not in the Config or
Low_power state are:
• memc_status Register, to read the current state, see Memory Controller Status
Register on page 3-9
• memc_cmd Register, to change state, see Memory Controller Command Register
on page 3-12.

To guarantee no missed AUTO REFRESH commands, it is recommended that any change of

mclk period, and therefore update of the refresh period, is carried out when the DMC
is in the Low_power state. This is because the refresh rate depends on the mclk period.
You can only write direct commands to the external memories when the DMC is in the
Config state and not in the Low_power state.

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2.2.5 Tie-off signals

The DMC enables you to change some of its configuration settings by using the tie-off
signals.

At reset, the value of each tie-off signal controls the respective bits in the memory_cfg2
Register.

After reset you can program the memory_cfg2 Register to make additional changes to
these configuration settings. See Memory Configuration 2 Register on page 3-30.

2.2.6 Miscellaneous signals

You can use the following signals as general-purpose control signals for logic external
to the DMC:

user_status[USER_STATUS_WIDTH–1:0]
Use the user_status Register to read the status of these general
purpose inputs. You must tie any unused signals to either HIGH or
LOW. These signals are connected directly to the APB interface
block. Therefore, if they are driven from external logic that is not
clocked by the aclk signal, then external synchronization registers
are required. See User Status Register on page 3-40.

user_config[USER_CONFIG_WIDTH–1:0]
Use the user_config Register to control these general purpose
outputs. If you do not require these signals, leave them
unconnected. See User Config Register on page 3-41.

user_config1[USER_CONFIG_WIDTH–1:0]
Use the user_config1 Register to control these general purpose
outputs. If you do not require these signals, leave them
unconnected. See User Config1 Register on page 3-42.

You can use the following miscellaneous signals for automatic test pattern generator
testing of the DMC:
• rst_bypass
• dft_en_clk_out.

2.2.7 Controller management operations

The memory manager tracks and controls the current state of the DMC using the aclk
Finite State Machine (FSM). You can change the state of the controller by programming
the memc_cmd Register, see Memory Controller Command Register on page 3-12.

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You can also use the AXI low-power interface to move the controller between the
Ready and Low_power states, see System low-power control on page 2-37.

Figure 2-12 shows the aclk FSM.

start

POR Low_power
Reset
Reset Wakeup

Sleep

Reset
Reset Paused

Configure Configure Go
Reset Pause Pause Active_Pause
Reset
Config Go Ready

Figure 2-12 aclk domain state diagram

In Figure 2-12 non-state moving transitions are omitted for clarity.

Note
• If the DMC receives an APB command that is illegal to carry out from the current
state then the DMC ignores it and the aclk FSM stays in the same state.
• If the DMC moves to the Paused state using Active_Pause then it is not permitted
to enter the Config state.
• For the two cycles following Power-On-Reset (POR), do not consider the DMC
to be in the Config state. For this reason, register access restrictions apply.
• You can only use the AXI low-power interface to move in and out of the
Low_power state from the Ready state.
• If the DMC enters the Low_power state using the:
— APB interface then it must also exit the Low_power state using the APB
interface
— AXI low-power interface then it must also exit the Low_power state using
the AXI low-power interface.

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The current status of the aclk FSM controls the functionality of the DMC:
• All the registers are available for writes or reads when the aclk FSM is in the
Config or Low_power state.
• When in the Config state or Low_power state, no AUTO REFRESH commands are
generated. When the Low_power state is entered, the SDRAM memories are put
into self-refresh mode.
• When in the Ready state, not all registers are available, see Chapter 3
Programmers Model.
• Move the DMC to the Paused state by programming the memc_cmd Register and
selecting one of the following commands:
— Pause command.
When a Pause is requested, then the Paused state is only entered when the
DMC is idle.
— Active_Pause command.
When an Active_Pause is requested then the Paused state is entered when
the memory interface is idle but there might still be outstanding transactions
in the arbiter queue.

Note
No AUTO REFRESH commands are generated when in the Config state. If you are changing
register values, it is necessary to enter the Low_power state, because this removes the
risk of the memory maximum refresh time being exceeded.

The DMC management function can issue commands to the memory interface from one
of the following sources:
Direct commands
These are received over the APB interface as a result of a write to the
direct_cmd Register. See Direct Command Register on page 3-13. They
initialize the SDRAM.
The legal commands that the memory manager uses are:
• NOP
• PRECHARGEALL
• AUTO REFRESH
• MODEREG
• extended MODEREG
• Deep Power-Down (DPD).

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Commands from the aclk FSM

You can traverse the aclk FSM by writing to the memc_cmd Register.
See Memory Controller Command Register on page 3-12. You can only
traverse the aclk FSM states when the DMC is idle. For example, the
Ready state can only be entered from the Config state when all direct
commands have been completed. The exception to this is the
Active_Pause command. You can issue this command when the DMC is
active. When you issue the command, any memory accesses that have not
been arbitrated remain in the arbiter until the aclk FSM receives the Go
command.
Refresh commands
The refresh logic can issue commands to the arbiter to refresh the
SDRAM chips. The refresh counter is clocked by the memory clock to
enable the frequency of the DMC to be scaled without affecting the
refresh rate. The refresh rate period is programmable using the
refresh_prd Register. See Refresh Period Register on page 3-19. The
value of this register is the count value in mclk cycles.
When the refresh counter wraps around zero, an individual auto-refresh
sequence is requested for each external chip in turn.
You can prevent Refresh commands from being generated by using the
active_chips field in the memory_cfg Register. See Memory
Configuration Register on page 3-15.
Note
Refreshes are masked from the most significant chip number downwards.

These management commands are arbitrated with data commands.

2.2.8 Data operations

All data operations are carried out through the AXI slave interface.

The number of outstanding AXI transactions that can be processed is a configurable

option. Each outstanding transaction is referred to as:
• arbiter queue entries, or
• entries.

An entry can be created for one of two functions:

• data entries, as the result of AXI data transactions
• management entries, as a result of management functions.

If there is a coincident data entry and management entry request, the management entry
takes priority and delays the data entry by one clock cycle.

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Entries are arbitrated with an algorithm that optimizes the efficiency of the external data
bus. You can modify the algorithm to meet any programmed QoS requirement.

To achieve optimum memory bus efficiency entries might be arbitrated out of order
from their arrival time. Entries that cannot be arbitrated because of hazards are removed
from the algorithm until the hazard is cleared.

An arbiter queue entry might not be arbitrated continuously. If a QoS event occurs then
the highest priority entry changes.

The following subsections describe:

• Hazard detection
• Quality of Service on page 2-23
• Arbitration on page 2-25.

Hazard detection

The following types of hazard exist:

Read After Read (RAR)

There is a read already in the arbiter queue with the same ID as the
incoming entry, that is also a read.

Write After Write (WAW)

There is a write already in the arbiter queue with the same ID as the
incoming entry, that is also a write.
There is a write in the arbiter queue that has received an early write
response, accessing the same location as the incoming write.

Read After Write (RAW)

There is a write in the arbiter queue, that has received an early write
response, accessing the same location as the incoming read entry.

The arbiter entry is flagged as having a dependency if a hazard is detected. There might
be dependencies against a number of other arbiter entries. As the arbiter entries are
invalidated, so the dependencies are reduced until finally, there are no outstanding
dependencies, and the entry is free to start.

Note
There are no Write-After-Read (WAR) hazard checks in the DMC. If an AXI master
requires ordering between reads and writes to certain memory locations, it must wait for
read data before issuing a write to a location it has read from. Similarly, the only RAW

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hazard checking is that performed when the write response has been issued. If an AXI
master required ordering between writes and reads to certain memory locations, it must
wait for the write response before issuing the read to the same location.

Write transactions are also excluded from the arbitration algorithm until either:
• a full memory burst worth of data is received
• the write data burst completes
• the write data buffer becomes full
• write data with a different ID is received.

Quality of Service

QoS is defined for the DMC as a method of increasing the arbitration priority of a read
access that requires low-latency read data. See Arbitration on page 2-25 for more
information. The QoS for an AXI read access is determined when the arbiter receives
it. No QoS exists for write accesses.

The following sections describe:

• QoS selection
• QoS timeout on page 2-24
• QoS for AUTO REFRESH on page 2-24.

QoS selection

The allocation of QoS functionality is determined by the arid of the AXI transfer
compared with a 4-bit selection mask defined by the qos_master_bits in the
memory_cfg Register. You can program the 4-bit QoS mask to be either arid[3:0],
arid[4:1], arid[5:2], arid[6:3], arid[7:4] arid[8:5], arid[9:6], or arid[10:7]. After the
DMC applies the 4-bit QoS mask to the arid number, the resulting value <n> provides
the pointer to which id_<n>_cfg Register contains the QoS settings for the read transfer.

For more information, see Memory Configuration Register on page 3-15 and QoS
Configuration Register on page 3-38.

Example 2-2 on page 2-24 shows QoS selection and the impact of the qos_override
signal.

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Example 2-2 QoS selection and qos_override

If you program the qos_master_bits = b010 then this selects arid[5:2] to be the 4-bit
QoS mask. If the DMC receives an AXI transfer with an arid of 0x5A then it applies the
4-bit QoS mask, arid[5:2], giving a value of 0x6. Therefore, the controller uses the
id_6_cfg Register to control the QoS for the transfer.

The controller creates a new arbiter entry for the transfer and assigns it the qos_min and
qos_max values from the id_6_cfg Register. If the qos_enable bit=1 then the controller
applies the QoS settings to the transfer.

The qos_override[15:0] signal enables the controller to assign an arbiter entry with
minimum QoS latency, irrespective of the state of the qos_enable bit. For this example,
if qos_override[6] is HIGH when arvalid and arready are HIGH then the arbiter entry
is assigned minimum QoS latency, even if the qos_enable bit=0.

QoS timeout

If the qos_enable bit for the arid is set in the register bank, the QoS maximum latency
value is decremented every aclk cycle until it reaches zero.

If the entry is still in the queue when the QoS maximum latency value reaches zero, then
the entry becomes high priority. This is called a timeout. Also, any entry in the queue
with a minimum latency QoS also produces a timeout. Minimum latency timeouts have
priority over maximum latency timeouts.

When an entry times out in this way it forces a timeout onto any entries that it has
dependencies against. In normal operation, these entries have already timed out because
they have received the same initial QoS value, but been decrementing for longer. The
highest priority arbiter entry is serviced next.

One special case exists. This is when or if the assertion of the relevant qos_override
signal forces a minimum latency timeout. In this instance, any accesses that the new
entry has dependencies against might not have timed out and are forced to time out so
that the high-priority entry can start as soon as possible. This can include when there is
a read after write hazard, under which circumstance the writes ahead of the read must
also be prioritized.

QoS for AUTO REFRESH

The DMC provides QoS for the AUTO REFRESH commands by using a simple
increment-decrement counter to keep track of the number of AUTO REFRESH commands
in the arbiter queue.

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The arbiter compares the counter to the value of the max_outs_refs field in the
memory_cfg3 Register, see Memory Configuration 3 Register on page 3-34. When the
counter reaches the max_outs_refs value then a refresh timeout is signaled to the arbiter
queue.

A refresh timeout forces all of the AUTO REFRESH queue entries to timeout. This timeout
is sticky, and does not disappear when the number of timeouts drops back below the
max_outs_refs threshold. Instead, it remains asserted until the DMC services all of the
AUTO REFRESH entries. This provides a guaranteed refresh rate in the SDRAM.

Arbitration

The arbitration algorithm, without considering QoS issues, operates in the following
way:
• bank preparation, that is, any memory operations to a closed row
• read or write to open rows, that is, any memory operation to an open row
• manager operations, for example, refreshes.

A particular queue item, that contains either one AXI transaction or manager operation,
cannot appear in two groups. If a read transaction enters the queue to a closed row, it is
made available to the arbiter as a bank preparation operation, and not a read hit. When
the row has been opened, possibly after two bank preparation operations, it is flagged
as a read hit.

A read to a closed row is split into:

• a bank preparation
• an open row read.

These are stored in the same arbiter queue slot.

Example 2-3 shows an arbitration example.

Example 2-3 Arbitration example

Assume chip 0 has recently been refreshed, all rows are closed, and nothing can be
issued for t_rfc.

During t_rfc, the following transactions enter the queue, in the following order:
1. Read, row 1 chip 0 bank 0, transaction 1.
2. Read, row 1 chip 0 bank 0, transaction 2.
3. Read, row 4 chip 0 bank 1, transaction 3.
4. Write, row 1 chip 0 bank 0, transaction 4.

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Nothing is arbitrated until t_rfc has expired.

The cycle numbers in this example can change depending on factors such as schedule
delays, burst lengths, and the command FIFO depth. The following describes the
behavior during each cycle:

Cycle 1 No transactions are marked as either read hit or write hit because all rows
are closed. Instead, all transactions are marked as bank preparations. The
oldest transaction is selected, and transaction 1, row 1 chip 0, bank 0 is
marked as open in the row cache.

Cycle 2 Transactions 1, 2, and 4 are now open row reads or writes. However,
because the ACTIVE command has only recently been issued, they are not
available to the arbiter until schedule_rcd expires. The arbiter therefore
selects the next available bank preparation operation, because the refresh
is the lowest priority. This is transaction 3.

Cycle 3 Transactions 1, 2, and 4 are flagged as read hits, or write hits, because the
delay has now expired, assuming that schedule_rcd was set to 1. Because
a bank preparation operation was performed in the last cycle, the oldest
read hit now becomes the highest priority. Transaction 1 is therefore
arbitrated and removed from the queue.

Cycle 4 Transactions 2, 3, and 4 are now available as read or write hits. The last
cycle was a read operation so bank preparation operations are the highest
priority. However, because there are none to perform, transaction 2 is
arbitrated.
Transaction 5 now arrives, read, row 1 chip 0 bank 0. Because row 1
chip 0 bank 0 is already open, it is flagged as a read hit immediately.

Cycle 5 Transactions 3, 4, and 5 are available as a read hits, or write hits.

Transaction 3 is selected because it is the oldest transaction.
Transaction 6 arrives, read, row 3 chip 0 bank 1. Because bank 1 row 4 is
still open, this transaction is to a closed row.

Cycle 6 Transactions 4 and 5 are a write hit and read hit. Transaction 6 is a bank
preparation operation. The last transactions were reads, so the bank
preparation for transaction 6 is selected, and this issues a precharge
because another row in the same bank was open.

Cycle 7 Transaction 4 is a write hit, transaction 5 is a read hit, and transaction 6

is unavailable while schedule_rp expires. The arbiter tries to maintain the
data direction because this is more efficient on the memory bus.
Transaction 5, a read, is therefore arbitrated.

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Cycle 8 Transaction 4 is a write hit, and transaction 6 is available as a bank

preparation operation because all rows in the bank are closed. The last
operation was a read, so the bank preparation operation is selected,
transaction 6, and an ACTIVE command is issued.

Cycle 9 Transaction 4 is now a write hit and transaction 6 is unavailable while

schedule_rcd expires. The arbiter chooses the only available operation
and that is transaction 4. It is then removed from the queue.

Cycle 10 Transaction 6 is now a read hit, and is finally arbitrated as a read hit, and
removed from the queue.

2.2.9 Memory interface

The memory interface is separated from the arbiter using the following configurable
synchronous or asynchronous FIFOs and buffer:
• command FIFO
• read data FIFO
• write data buffer.

Note
Synchronous relates to rising edge-aligned clocks.

The memory interface reads commands from the arbiter using the command FIFO but
only when that command can be executed. The memory interface ensures a command
is only executed when all the inter-command delays, defined in this section, for that
bank or memory device are met.

The memory interface enables multiple banks to be active at any one time. However,
only one bank can be carrying out a data transfer at any one time. If the command at the
head of the command FIFO cannot be executed, then the command pipeline stalls until
it can be executed.

Scheduler

To reduce the occurrence of pipeline stalls, the DMC contains a scheduler that monitors
the activity of the mclk FSMs in the memory interface. The scheduler uses the
information in the schedule fields of the t_rcd, t_rfc and t_rp registers, to prevent the

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arbiter from issuing commands that can stall the command pipeline. Program the
schedule fields with the amount of delay you require, in aclk cycles. For synchronized
1:1 operation of aclk and mclk, program:
• schedule_rcd = t_rcd–3 in the ACTIVE to Read or Write Timing Register on
page 3-23
• schedule_rfc = t_rfc–3 in the AUTO REFRESH to Command Timing Register on
page 3-24
• schedule_rp = t_rp–3 in the PRECHARGE to Command Timing Register on
page 3-25.

For non-synchronized 1:1 operation, you must scale the schedule_rx fields accordingly.

Note
For the LPDDR NVM add-on, the nvm_schedule_rcd is applied when accessing NVM
chips.

Memory interface to pad interface timing

All command control outputs are clocked on the falling edge of the memory clock,
mclk. The relative times between control signals from the memory interface are
maintained when output from the pad interface to the actual SDRAM devices.
Therefore, the timing register values required for a particular SDRAM device can be
determined from that SDRAM device’s data sheet.

Figure 2-13 on page 2-29 to Figure 2-24 on page 2-33 show how the data sheet timings
map on to the DMC timing registers. Figure 3-2 on page 3-3 shows the timing registers.

Note
In Figure 2-13 on page 2-29 to Figure 2-24 on page 2-33:
• The following signals are internal to the DMC:
— command_en
— data_cntl_en
— memif_busy
— pwr_down
— read_en.
• The timings shown are not necessarily the default timing values but are values
that are small enough to show the entire delay in one figure.

Figure 2-13 on page 2-29 shows the command control output timing.

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mclk

command_en

Command

Control outputs
Command

Figure 2-13 Command control output timing

Figure 2-14 shows the ACTIVE command to Read or Write command timing, that you
program using the ACTIVE to Read or Write Timing Register on page 3-23.

mclk

command_en
tRCD=4
Command ACTIVE R/W

Control outputs Activate R/W

Figure 2-14 ACTIVE command to Read or Write command timing, tRCD

Figure 2-15 shows ACTIVE to ACTIVE on the same bank, and ACTIVE to AUTO REFRESH
command timing, that you program using the ACTIVE to ACTIVE Timing Register on
page 3-23.

mclk

command_en
tRC=4 tRC=4
Command ACTIVE ACTIVE

Control outputs

Activate A Activate A AUTO REFRESH

Figure 2-15 Same bank ACTIVE to ACTIVE, and ACTIVE to AUTO REFRESH command timing, tRC

Figure 2-16 on page 2-30 shows the ACTIVE to ACTIVE command timing to different
memory banks, that you program using the ACTIVE to ACTIVE Different Bank Timing
Register on page 3-26.

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mclk

command_en
tRRD=4
Command ACTIVE ACTIVE

Control outputs

Activate A Activate B

Figure 2-16 Different bank ACTIVE to ACTIVE command timing, tRRD

Figure 2-17 shows the PRECHARGE to command, and AUTO REFRESH timing, that you
program using the PRECHARGE to Command Timing Register on page 3-25 and
AUTO REFRESH to Command Timing Register on page 3-24.

mclk

command_en
tRP=3 tRFC=3 tRFC=3
Command ACTIVE

Control outputs

PRECHARGEALL AUTO REFRESH AUTO REFRESH

Figure 2-17 PRECHARGE to command and AUTO REFRESH to command timing, tRP and tRFC

Figure 2-18 shows ACTIVE to PRECHARGE, and PRECHARGE to PRECHARGE timing, that you
program using the ACTIVE to PRECHARGE Timing Register on page 3-22 and
PRECHARGE to Command Timing Register on page 3-25.

mclk

command_en
tRAS=4 tRP=4
Command ACTIVE

Control outputs Activate

PRECHARGE PRECHARGE

Figure 2-18 ACTIVE to PRECHARGE, and PRECHARGE to PRECHARGE timing, tRAS and tRP

Figure 2-19 on page 2-31 shows MODEREG to command timing, that you program using
the MODEREG to Command Timing Register on page 3-21.

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mclk

command_en
tMRD=4
Command

Control outputs

MODEREG Command

Figure 2-19 MODEREG to command timing, tMRD

Figure 2-20 shows self-refresh entry and exit timing, that you program using the
Self-refresh to Command Timing Register on page 3-30 and Exit Self-refresh Timing
Register on page 3-29.

mclk

command_en
tESR=3 tXSR=200 cycles
Command

Control outputs

SelfRefresh ExitSelfRefresh Command

Figure 2-20 Self-refresh entry and exit timing, tESR and tXSR

Figure 2-21 shows power-down entry and exit timing, that you program using the
Memory Configuration 3 Register on page 3-34 and Exit Power-down Timing Register
on page 3-28.

mclk

command_en
tXP=1
Command Command
Command
Control outputs
Command
memif_busy power_dwn_prd
pwr_down

cke

Figure 2-21 Power-down entry and exit timing, tXP

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The power_dwn_prd count is timed from the memory interface becoming idle, that is,
after a command delay has timed out or the read data FIFO is emptied. cke is asserted
when the command FIFO is not empty.

Figure 2-22 shows the turnaround time, tWTR, for the memory interface to output a
Write command followed immediately by a Read command. Program this value using
the Write to Read Timing Register on page 3-27.

mclk

command_en

Command Write Read

Control outputs Write Read

tDQSS=1 tWTR=1
data_cntl_en

Write data WDATA

Figure 2-22 Data output timing, tWTR

Figure 2-23 shows the relationship between the memory interface outputting a Write
command and the write data, when tDQSS is set to 1 using the Write to DQS Timing
Register on page 3-20. It also highlights the tWR minimum time between a Write and a
PRECHARGE command, that you program using the Write to PRECHARGE Timing
Register on page 3-27.

mclk

command_en

Command Write
PRECHARGE
Control outputs Write
tDQSS=1 tWR=3
data_cntl_en

Write data WDATA

Figure 2-23 Data output timing, tDQSS = 1

Figure 2-24 on page 2-33 shows the timing relationship between the Read command
being output from the memory interface and the read data being returned to the memory
interface from the pad interface. Program this timing using the CAS Latency Register
on page 3-19 and the read_delay field in the Memory Configuration 2 Register on
page 3-30.

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mclk

command_en

Command Read Write

Control outputs Read Write

read_en
cas_latency = 3
Read data read_delay = b00 RDATA
available for FIFO read_delay = b01 DATA

Figure 2-24 Data input timing

Note
The SDR configuration requires read_delay set to zero.

2.2.10 Pad interface

The DMC can be configured to contain one of the following pad interfaces:
• Legacy pad interface
• DFI pad interface on page 2-34.

Legacy pad interface

The legacy pad interface is a replaceable block depending on the type of memory you
are connecting. It provides a register for each external signal.

It is possible that you do not require all of the signals for the external memory devices.
This depends on the memory type that the legacy pad interface block supports.

The legacy pad interface block registers the command signals with clocks that enable
the external memory device timing to be met.

To support a PrimeCell EBI (PL220), the ap precharge bit signal is also an external
signal to the DMC. Having ap separate to the address bus means that PRECHARGEALL
commands to dynamic memory can be carried out when the EBI has granted the
external memory interface to another memory controller.

It is expected, for DDR memory devices, that a Delay-Locked Loop (DLL) is required
to delay the dqs signals coming back from the memories with respect to the dq data bus.
The standard delay for the DQS signals is a quarter clock period of mclk. A DLL is not
included in the DMC.

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If required, you can replace or modify the legacy pad interface for additional
optimization for a particular memory type or target library, or to use a hard macro.

If the legacy pad interface is modified or replaced, it is important that the relative
timings of the control output signals enabled by command_en and data_cntl_en
signals are maintained to ensure the timings carried out in the memory interface block
are still correct at the external memory bus interface. The read_en signal is always
asserted one mclk period before the expected read data. Therefore, the timing of
read_en changes as cas_latency is changed using the APB interface.

When the controller issues a Read command, after a delay of several mclk cycles it
registers the data into the read data FIFO, see Figure 2-24 on page 2-33. This delay is
dependent on the cas_latency and read_delay that are programmed in the CAS Latency
Register on page 3-19 and Memory Configuration 2 Register on page 3-30.

DFI pad interface

If the DMC is configured to support DFI then it implements a DFI pad interface that
complies with Version 2.1 of the DDR PHY Interface (DFI) Specification.

For the tphy_wrlat Register, the DMC supports only the value of 0, and it is not
programmable.

For more information about t_rddata_en Register, see Read Data Enable Timing
Register on page 3-36.

2.2.11 Initialization

Before you can use the DMC operationally to access external memory, you must move
it to the Config state and then:
• program the DMC configuration and timing registers
• initialize the external memory devices by programming the direct_cmd Register.

You might not have to configure all the DMC registers because some might power-up
to the correct value. See Chapter 3 Programmers Model. For completeness, Table 2-3
on page 2-35 includes all register values.

Note
You might create a deadlock situation if the DMC AXI slave interface is accessed by a
master before that master has configured the DMC using the APB interface. A master
that cannot access the APB interface but accesses the AXI slave interface before the
DMC has been configured is held off until another master configures the DMC.

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The following sections describe:

• Controller initialization
• LPDDR device initialization on page 2-36.

Controller initialization

Table 2-3 shows an example initialization programming sequence for the controller.

Table 2-3 Controller initialization example

Register Write data Description

cas_latency 0x00000006 Set CAS latency to 3

t_dqss 0x00000001 Set tDQSS to 1

t_mrd 0x00000002 Set tMRD to 2

t_ras 0x00000007 Set tRAS to 7

t_rc 0x0000000B Set tRC to 11

t_rcd 0x00000015 Set tRCD to 5 and schedule_rcd to 2

t_rfc 0x000001F2 Set tRFC to 18 and schedule_rfc to 15

t_rp 0x00000015 Set tRP to 5 and schedule_rp to 2

t_rrd 0x00000002 Set tRRD to 2

t_wr 0x00000003 Set tWR to 3

t_wtr 0x00000002 Set tWTR to 2

t_xp 0x00000001 Set tXP to 1

t_xsr 0x0000000A Set tXSR to 10

t_esr 0x00000014 Set tESR to 20

t_rddata_en 0x00000003 Set trddata_en to 3 if the DMC is configured with a DFI pad interface

refresh_prd 0x00000A60 Set auto refresh period to be every 2656 mclk periods

chip_cfg0 0x000000FF Set address for chip 0 to be 0x00XXXXXX, Row Bank Column (RBC) configuration

chip_cfg1 0x000022FF Set address for chip 1 to be 0x22XXXXXX, RBC configuration

chip_cfg2 0x000055FF Set address for chip 2 to be 0x55XXXXXX, RBC configuration

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Table 2-3 Controller initialization example (continued)

Register Write data Description

chip_cfg3 0x00007FFF Set address for chip 3 to be 0x7FXXXXXX, RBC configuration

memory_cfg 0x000D0020 Sets the following memory configuration:

• 8 column bits, 11 row bits
• precharge all bit is shared with A10
• power-down period of 0
• disable auto_power_down
• disable dynamic clock stopping
• memory burst size of 4
• use arid[5:2] bits for QoS
• disable force precharge
• disable auto self-refresh entry.

direct_cmd - Sequence of writes to initialize the memory devices, see Table 2-4

memc_cmd 0x00000000 Write the Go command to move the controller to the Ready state

memc_status - Poll the register until the memc_status field returns b01, signifying that the controller is
ready to accept AXI accesses to the memory devices

LPDDR device initialization

Table 2-4 shows an example programming sequence for LPDDR, or Mobile DDR,
device initialization.

Table 2-4 LPDDR device initialization example

Register Write data Description

direct_cmd 0x000C0000 NOP command to chip 0

direct_cmd 0x00000000 PRECHARGEALL command to chip 0

direct_cmd 0x00040000 AUTO REFRESH command to chip 0

direct_cmd 0x00040000 AUTO REFRESH command to chip 0

direct_cmd 0x00080032 MODEREG command, with low address bits = 0x32, to chip 0

If a configured DMC supports more than one memory chip then repeat the sequence in
Table 2-4 but update the chip_nmbr field to select each additional memory chip.

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2.2.12 Low-power operation

The DMC provides support for low-power operation by supporting the SDRAM
low-power modes of operation:
• automatic closing of rows
• active power-down
• precharge power-down
• automatic self-refresh entry
• self-refresh
• DPD.

Note
All functions have to be included in a configuration.

This section describes:

• System low-power control
• Dynamic low-power mode control on page 2-42
• Deep Power-Down on page 2-46.

System low-power control

The DMC provides support for low-power operation in the following ways:
• By using the memc_cmd and memc_status registers, the DMC can place the
memory device in to self-refresh mode under software control. See Memory
Controller Command Register on page 3-12 and Memory Controller Status
Register on page 3-9.
• By using the AXI low-power interface, the DMC can place the memory device in
to self-refresh mode under hardware control.

Additionally, the DMC provides additional power savings through extensive use of
clock gating. This includes clock gating of the external memory clocks by selecting the
stop_mem_clock bit in the memory_cfg Register. See Memory Configuration Register
on page 3-15.

You can also implement the DMC with two power domains:
• APB and AXI, aclk
• memory, mclk.

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Table 2-5 shows the valid system states of the aclk FSM and an mclk FSM. It also
shows the valid power, clock, and reset states in the aclk and mclk domains.
Figure 2-25 on page 2-39 shows the valid transitions, and the text following it explains
how to traverse the system states.

Table 2-5 Valid system states for the FSMs

Memory device DMC aclk FSM DMC mclk FSM

State
VDD State VDD Clock Reset State VDD Clock Reset State

1 0 Null 0 - - Null 0 - - Null

2 0 Null >0 Running No POR >0 Running No POR

3 0 Null >0 Running Yes Reset >0 Running Yes Reset

4 0 Null >0 Running No Config >0 Running No Pwr_up

5 >0 Accessible >0 Running No Config >0 Running No Pwr_up

6 >0 Accessible >0 Running No Ready >0 Running No Pwr_up

7 >0 Power-down >0 Running No Ready >0 Running No Pwr_down

8 >0 Self-refresh >0 Running No Low_power >0 Running No Pwr_sref

9 >0 Self-refresh >0 Running No Low_power >0 Stopped No Pwr_sref

10 >0 Self-refresh >0 Stopped No Low_power >0 Running No Pwr_sref

11 >0 Self-refresh >0 Stopped No Low_power >0 Stopped No Pwr_sref

12 >0 Self-refresh 0 - - Null >0 Stopped No Pwr_sref

13 >0 Self-refresh 0 - - Null >0 Running No Pwr_sref

14 >0 Self-refresh >0 Running No POR >0 Stopped No Pwr_sref

15 >0 Self-refresh >0 Running No POR >0 Running No Pwr_sref

16 >0 Self-refresh >0 Running Yes Reset >0 Stopped No Pwr_sref

17 >0 Self-refresh >0 Running Yes Reset >0 Running No Pwr_sref

18 >0 Self-refresh >0 Stopped No Ready >0 Stopped No Pwr_sref

The ranking of system power states, from highest power to lowest power, is as follows:

6, 7, 8, 10, 9, 11, 18, 13, 12.

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However, states 8-11 are similar and the recommendation is to use state 11 from this
group if clock-stopping techniques are available. Similarly, states 12 and 13 are similar
and the recommendation is to use state 12 from this pair. Table 2-6 shows a
recommended set of power states.

Table 2-6 Recommended power states

System state Power name

6 Running

7 Auto power-down

11 Shallow self-refresh

12 Deep self-refresh

18 Auto self-refresh entry

Figure 2-25 shows these system states and arcs.

18 1 2 3

7 6 5 4

13 12 11 10 9 8

15 14

17 16

Figure 2-25 System state transitions

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Note
States 1-5, 9, 14, and 16 are only used as transitional states.

State transitions are as follows:

Arc 1 to 2 Apply power to all DMC power domains and ensure that aclk and mclk
are running.

Arc 2 to 3 Assert reset in the aclk domain and the mclk domain.

Arc 3 to 4 Deassert reset in the aclk domain and the mclk domain.

Arc 4 to 5 Apply power to the SDRAM power domain.

Arc 5 to 6 You must:

1. Program the DMC timing registers with the timing parameters for
the SDRAM. Figure 3-2 on page 3-3 shows the timing registers.
2. Write to the memory_cfg and refresh_prd registers. See Memory
Configuration Register on page 3-15 and Refresh Period Register
on page 3-19.
3. Initialize the memory, using the direct_cmd Register, with the
sequence of commands specified by the memory vendor. See
Direct Command Register on page 3-13.
When you have sent these commands to the memory, you can write
to the memc_cmd Register with the Go command. See Memory
Controller Command Register on page 3-12.
4. Poll the memc_status Register until it returns 0x1, Ready,
signifying that the DMC is ready to accept AXI accesses to the
SDRAM.

Arc 6 to 5 If you want to reconfigure either the DMC or SDRAM, you must first
write to the memc_cmd Register with the Pause command, and poll the
memc_status Register until the memc_status field returns b10, Paused.
Then you can write to the memc_cmd Register with the Configure
command and poll the memc_status Register until the memc_status field
returns b00, Config. See Memory Controller Command Register on
page 3-12 and Memory Controller Status Register on page 3-9.

Arc 6 to 7 If auto_power_down is set in the memory_cfg Register then this arc is

automatically taken when the SDRAM has been idle for power_dwn_prd
mclk cycles. See Memory Configuration Register on page 3-15.

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Arc 7 to 6 When an SDRAM access command has been received in the mclk
domain, this arc is taken.

Arc 6 to 8 You can take this arc under either hardware or software control:
• To take this arc under software control:
1. Issue the Pause command, or archive the Pause command.
2. Poll for the Paused state.
3. Issue the Sleep command.
• To take this arc under hardware control, use the AXI low-power
interface to request the Low_power state.

Arc 6 to 9 The same as arc 6 to 8 but also stops the mclk domain clock.

Arc 6 to 10 The same as arc 6 to 8 but also stops the aclk domain clock.

Arc 6 to 11 The same as arc 6 to 8 but also stop the mclk and the aclk domain clocks.

Arc 6 to 12 The same as arc 6 to 8 but also stops the mclk domain clock and removes
power from the aclk power domain. This can only be done if the DMC
implementation has separate power domains for aclk and mclk.

Arc 6 to 13 The same as arc 6 to 8 but also removes power from the aclk power
domain. This can only be done if the DMC implementation has separate
power domains for aclk and mclk.

Arc 8 to 6 You can take this arc under either hardware or software control:
• To take this arc under software control:
1. Issue the Wakeup command using the memc_cmd Register.
2. Poll the memc_status Register for the Paused state.
3. Issue the Go command and poll for the Ready state.
• To take this arc under hardware control, use the AXI low-power
interface to bring the DMC out of the Low_power state.

Arc 9 to 6 The same as arc 8 to 6 but you must first start the mclk domain clock.

Arc 10 to 6 The same as arc 8 to 6 but you must first start the aclk domain clock.

Arc 11 to 6 The same as arc 8 to 6 but you must first start both the aclk and mclk
domain clocks.

Arc 12 to 14 Apply power to the aclk power domain.

Arc 14 to 16 Assert reset to the aclk reset domain.

Arc 16 to 9 Deassert reset to the aclk reset domain.

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Arc 13 to 15 Apply power to the aclk power domain.

Arc 15 to 17 Assert reset to the aclk reset domain.

Arc 17 to 8 Deassert reset to the aclk reset domain.

Arc 6 to 18 If auto_power_down is set in the memory_cfg Register then this arc is

automatically taken when the SDRAM has been idle for power_dwn_prd
mclk cycles. Also requires: fp_time << power_dwn_prd, fp_enable, and
sr_enable. See Memory Configuration Register on page 3-15.

Arc 18 to 6 When an SDRAM access command has been received in the mclk
domain, this arc is taken.

Note
When power is applied to the aclk domain, when leaving state 1, the aclk FSM moves
to the Config state. When power is applied to the aclk domain, when leaving states 12
or 13, the aclk FSM moves to the Low_power state.

Dynamic low-power mode control

Dynamic low-power mode control operates when the DMC is in the Ready state.

The functionality that Table 2-7 on page 2-43 shows is dependant on whether the DMC
is configured to have a single global cke or a cke per memory device. The functionality
works for each cke signal, when using a:
global cke All memory devices must be idle.
local cke A single memory device can enter a low-power mode of operation.

Note
• Prior to enabling any power-down functionality, such as force precharge, you
must ensure that the initialization process of the memory device is complete.

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Table 2-7 shows the dynamic low-power modes operation. The force precharge and
auto self-refresh entry functionality are configurable and programmable, therefore a
DMC configuration requires the functionality to be included before you can enable it,
by programming the memory_cfg Register. See Memory Configuration Register on
page 3-15.

Table 2-7 Dynamic low-power modes operation

memory_cfg Register bit settings a

Operation auto_power_down fp_enable b sr_enable c

Force precharge after fp_time. 0 1 0

Auto power-down after power_dwn_prd. 1 0 0

Force precharge after fp_time. 1 1 1

Auto self-refresh entry after power_dwn_prd.
a. Only shows the permitted combinations, all other bit settings are illegal.
b. This bit is only available if a DMC configuration includes the force precharge functionality.
c. This bit is only available if a DMC configuration includes the auto self-refresh entry functionality.

The following sections describe:

• Auto power-down
• Force precharge on page 2-44
• Auto self-refresh entry on page 2-45.

Auto power-down

This feature enables the controller to negate cke, or dfi_cke, if a memory device is idle
for a time period of power_dwn_prd mclk cycles. This puts the memory device into
either active power-down mode or precharge power-down mode, depending on whether
the device has any open rows.

You can enable this feature by programming the auto_power_down bit in the
memory_cfg Register, see Memory Configuration Register on page 3-15. Program the
power_dwn_prd field to set the idle time period, in mclk cycles.

Figure 2-26 on page 2-44 shows the time after completion of a command to a memory
chip until the controller puts that chip into power-down mode. Power-down affects all
the banks of a chip, therefore there might be cases whereby some banks of a chip enters
precharge power-down. However, it would normally be expected for at least one bank
to enter active power-down.

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Active
Open row power-down Open row

cas

cke
power_dwn_prd

Figure 2-26 Auto power-down

Force precharge

Force precharge logic automatically generates a PRECHARGE for an idle activated bank. If
a bank has been activated and has executed a data access then subsequently, if no more
data accesses are executed for fp_time, then a force precharge is generated to close that
idle bank. The aclk clock decrements the force precharge counters.

Figure 2-27 shows the time after completion of a command to a memory chip until the
DMC places that chip into active power-down or precharge power-down. When
fp_enable is set with fp_time set to zero then the equivalent functionality of
auto-precharge commands is achieved.

Precharge
Open row Access Closed row power-down Closed row Open row

cas

ras

we

cke
power_dwn_prd

Figure 2-27 Force precharge with zero force precharge time

Figure 2-28 on page 2-45 shows the time after completion of a command to a memory
chip until the DMC places that chip into precharge power-down mode. To ensure
precharge power-down mode for every bank, you must set fp_time to less than
power_dwn_prd – 3 for synchronous 1:1 clocking and scaled accordingly for different
clocking modes. For example if mclk is running 2 times slower than aclk then fp_time
must be:

((fp_time × 2) + 3) < power_dwn_prd

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When running asynchronously the fp_time must be scaled to ensure it must always be
less than power_dwn_prd – 3. This ensures that a PRECHARGE always occurs before the
cke signal is negated.

Precharge
Open row Access Closed row power-down Closed row Open row

cas

ras

we

cke
power_dwn_prd

fp_time

Figure 2-28 Force precharge after power_dwn_prd time

Auto self-refresh entry

Auto self-refresh entry operates in the same way as auto power-down but instead of
negating cke the DMC generates an auto self-refresh entry for a memory device
command.

Note
The DMC does not support auto self-refresh entry if it is configured for global cke.

Figure 2-29 shows the time after completion of a command to a memory chip, until the
DMC places that chip into self-refresh mode.

Open row Access Closed row Self-refresh Closed row Open row

cas

ras

we

cke fp_time power_dwn_ t_xsr

prd × prescale

Figure 2-29 Auto self-refresh entry

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Table 2-7 on page 2-43 shows the DMC can only put a chip into self-refresh mode if the
force precharge logic and auto self-refresh logic is configured and enabled. This
guarantees that if a self-refresh command is generated all the banks of a chip have been
previously precharged. When the auto self-refresh command logic is configured a
10-bit prescalar for each power_dwn_prd counter is generated. If the prescale field in
the memory_cfg3 Register is programmed to zero then the prescalar does not affect the
power-down counter. See Memory Configuration 3 Register on page 3-34.

A prescalar is auto-generated because for some memory types there is a relatively long
time for a memory chip to exit self-refresh mode and it stalls the command FIFO.
Therefore, because the penalty for exiting self-refresh mode is large, you can program
a chip select to be idle for a much longer time before entering self-refresh mode when
compared to the other power-down modes.

Even if auto self-refresh entry is disabled, if the prescalar is programmed, then the
power-down counter uses this value.

Deep Power-Down

Deep power-down puts one or more of the memory devices in to deep power-down
mode, if the DMC is configured with local cke. A DMC configuration with global cke
puts all of the memory devices into DPD simultaneously.

To ensure that no refreshes are generated for a memory device that is in deep
power-down mode, then after the controller issues a DPD command you must decrement
the active_chips field, in the memory_cfg Register. This means that DPD mode can only
be entered from the most significant chip select of a configuration downwards.

Note
The system architect must ensure that:
• No data transactions are sent to a memory device that is in deep power-down
mode.
• Software tracks which memory devices are in deep power-down mode. The
controller does not contain a register that provides the operating mode of an
SDRAM.

Deep power-down entry

With the controller in the Ready state, perform the following steps to move one or more
memory devices in to deep power-down mode:

1. Issue the Pause command using the memc_cmd Register.

2. Poll the memc_status Register for the Paused state.

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3. Issue the Config command using the memc_cmd Register.

4. Poll the memc_status Register for the Config state.

5. Write to the direct_cmd Register with the PRECHARGEALL command. Program the
chip_nmbr field to be the highest chip select that is active.

6. Write to the direct_cmd Register with the DPD command and set the chip_nmbr
field to the value from step 5. The chip_nmbr field selects which SDRAM enters
deep power-down mode.
Note
If the controller is configured with global cke then the controller moves all the
SDRAMs to deep power-down mode, irrespective of the chip_nmbr field value.
The controller must then remain in Config state until the memory devices are
removed from deep power-down mode.

7. If the controller is configured with local cke then repeat steps 5 and 6 if you
require other SDRAMs to enter deep power-down mode.

8. Write to the active_chips field of the memory_cfg Register to disable refreshes

for SDRAMs that are in deep power-down mode. See Memory Configuration
Register on page 3-15.

Note
If all the SDRAMs are in deep power-down mode then the controller must remain in
Config state until one of the memory devices is removed from deep power-down mode.

Deep power-down exit

With the controller in the Ready state, perform the following steps to remove one or
more memory devices from deep power-down mode:

Note
If all of the memory devices are in deep power-down mode then the controller must be
in the Config state and you can ignore steps 1-4.

1. Issue the Pause command using the memc_cmd Register.

2. Poll the memc_status Register for the Paused state.

3. Issue the Config command using the memc_cmd Register.

4. Poll the memc_status Register for the Config state.

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5. Write to the direct_cmd Register with the NOP command. Program the chip_nmbr
field to be the lowest chip select that is in deep power-down mode.
Note
• A chip select must have the active_chips field set before providing the NOP
command.
• If the controller is configured with global cke then the controller removes
all the SDRAMs from deep power-down mode, irrespective of the
chip_nmbr field.

6. If the controller is configured with local cke then repeat step 5 if you require other
SDRAMs to exit from deep power-down mode.

When a memory device exits from deep power-down mode, you must initialize the
device prior to it being accessible to the system software. For examples see LPDDR
device initialization on page 2-36.

2.2.13 TrustZone technology support

The DMC provides very minimal support related to the security goals as set out in the
TrustZone technology. This document outlines the limitations of the controller and the
support it requires from other peripherals to meet the security goals of TrustZone
technology.

Memory controller in context

AXI-APB DDR
ARM bridge SDR
processor DMC or
AXI LPDR
infrastructure
DMA
controller On-chip
ROM

Figure 2-30 DMC in context

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 Functional Description

The DMC has an AXI slave interface and an APB interface. The APB interface has to
be placed in a location which is only addressable by the Secure world. The AXI slave
interface can be addressed by both the Secure and Non-secure world.

The DMC does not distinguish between secure read or write data transactions and
non-secure access on its AXI or APB interfaces.

There are 3 possible security configurations that need to be considered.

Note
Secure memory and non-secure memory only refer to access control of memory
locations as set out in the TrustZone technology.

Non-secure memory
All memory locations addressed through the DMC are not
protected by TrustZone technology and they are accessible to
either the Secure or Non-secure worlds. The AXI and APB
interfaces of the DMC are mapped to be accessible by the Secure
and Non-secure worlds.

Dedicated secure memory

All memory locations addressed through the DMC are always
protected by TrustZone technology and are accessible only to the
Secure world. The AXI and APB regions that connect to the DMC
must be mapped as secure.

Shared secure and non-secure memory

Memory locations addressed through the DMC contains both
secure and non-secure memory regions. An AXI bridging device
is required to meet the security goals of TrustZone technology.

APB interface

When any of the regions addressed by an DMC are made secure on the AXI slave
interface, then the control of the mapping of the memories at the DMC has to be made
equally secure by ensuring that only the Secure world can access the APB interface.

AXI slave interface

The DMC does not distinguish between Secure and Non-secure world access to the AXI
slave interface. Memory transactions are not aborted. It does not make the read data as
null when a non-secure read request tries to access a secure memory region. Write

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strobes are not disabled when a non-secure write request tries to access a secure
memory region. Therefore the AXI slave interface has to be access controlled to meet
the security goals of TrustZone technology.

Memory regions

The DMC can support a maximum of four chip-selects (memory devices). It supports
32-bits of AXI address bus. Hence it can access up to 4 GBytes of data. This memory
range can be divided into multiple memory regions up to a maximum of four. This is
defined by individual chip_<n>_cfg registers that are programmable through the APB
interface. Each of the individual chip_<n>_cfg registers has an address match field and
an address mask field.

Chip configuration register map

Chip configuration Register can only be read or written in the Config or Low_power
states. See Chip Configuration Register on page 3-39.

It is possible to define overlapping memory regions. This can result in two different
AXI addresses mapping to the same memory region. Therefore overlapping memory
regions must not be defined and control of the mapping of the memories at the DMC
must be made secure by ensuring that only the Secure world can access the APB
interface.

If the DMC receives an AXI access that does not map to a chip select then the controller
performs the access to chip select 0. If the memory device that connects to chip select
0 contains secure data then it is possible for a master in Non-secure state to access that
data. To prevent this security violation from occurring, you must ensure that the
interconnect or system that connects to the controller, can only issue accesses that map
directly to a chip select.

Side-channel interface (clock, reset, and power)

The programmable voltage and frequency sources inside a system must stay within
specification, so the device that controls the voltage and frequency must be secured by
TrustZone access control techniques.

Caution

TrustZone security extensions enables a secure software environment. The technology

does not protect the processor, DMC, or other peripherals from hardware attacks and
the implementer must take appropriate steps to secure the hardware and protect the
trusted code.

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Programmers Model

This chapter describes the DMC registers and provides information for programming
the device. It contains the following sections:
• About the programmers model on page 3-2
• Register summary on page 3-6
• Register descriptions on page 3-9.

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3.1 About the programmers model

The following information applies to the DMC registers:
• The base address is not fixed, and can be different for any particular system
implementation. The offset of each register from the base address is fixed.
• Do not attempt to access reserved or unused address locations. Attempting to
access these location can result in Unpredictable behavior.
• Unless otherwise stated in the accompanying text:
— do not modify undefined register bits
— ignore undefined register bits on reads
— all register bits are reset to a logic 0 by a system or power-on reset.
• Access type in Register summary on page 3-6 is described as follows:
RW Read and write.
RO Read only.
WO Write only.

3.1.1 Register map

The register map of the DMC spans a 4KB region, see Figure 3-1.

0xFFC
Component configuration
0xFE0

Integration test
0xE00

User-defined signals
0x300

Chip configuration
0x200

AXI ID configuration
0x100

DMC configuration
0x000

Figure 3-1 Register map

In Figure 3-1 the register map consists of the following main blocks:
• DMC configuration on page 3-3
• AXI ID configuration on page 3-4

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• Chip configuration on page 3-4

• User configuration and Feature Control Register on page 3-4
• Integration test on page 3-5
• Component configuration on page 3-5.

DMC configuration

Figure 3-2 shows the DMC configuration register map.

read_transfer_delay
0x07C
Timing
registers
t_rddata_en
0x05C
update_type
0x058
Reserved
0x054
memory_cfg3
0x050
memory_cfg2
0x04C
t_esr
0x048
t_xsr
0x044
t_xp
0x040
t_wtr
0x03C
t_wr
0x038
t_rrd
0x034
Timing t_rp
0x030
registers t_rfc
0x02C
t_rcd
0x028
t_rc
0x024
t_ras
0x020
t_mrd
0x01C
t_dqss
0x018
cas_latency
0x014
refresh_prd
0x010
memory_cfg
0x00C
direct_cmd
0x008
memc_cmd
0x004
memc_status
0x000

Figure 3-2 DMC configuration register map

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AXI ID configuration

Figure 3-3 shows the AXI ID configuration register map.

id_15_cfg
0x13C
.
.
.
id_1_cfg
0x104
id_0_cfg
0x100

Figure 3-3 AXI ID configuration register map

Chip configuration

Figure 3-4 shows the chip configuration register map.

chip_cfg3
0x20C
chip_cfg2
0x208
chip_cfg1
0x204
chip_cfg0
0x200

Figure 3-4 Chip configuration register map

User configuration and Feature Control Register

Figure 3-5 shows the memory map for the Feature Control Register and the following
user signals:
• user_config1[]
• user_config0[]
• user_status[].

feature_ctrl
0x30C
user_config1
0x308
user_config
0x304
user_status
0x300

Figure 3-5 User configuration register map

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Integration test

Use these registers to verify correct integration of the DMC within a system, by
enabling non-AMBA signals to be set and read.

Component configuration

Figure 3-6 shows the Component configuration register map.

pcell_id_3
0xFFC
pcell_id_2
0xFF8
pcell_id_1
0xFF4
pcell_id_0
0xFF0
periph_id_3
0xFEC
periph_id_2
0xFE8
periph_id_1
0xFE4
periph_id_0
0xFE0

Figure 3-6 Component configuration register map

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3.2 Register summary

Table 3-1 shows the DMC registers in base offset order.

Table 3-1 DMC register summary

Offset Name Type Reset Description

0x000 memc_status RO -a Memory Controller Status Register on page 3-9

0x004 memc_cmd WO - Memory Controller Command Register on page 3-12

0x008 direct_cmd WO - Direct Command Register on page 3-13

0x00C memory_cfg RW 0x00010020 Memory Configuration Register on page 3-15

0x010 refresh_prd RW 0x00000A60 Refresh Period Register on page 3-19

0x014 cas_latency RW 0x00000006 CAS Latency Register on page 3-19

0x018 t_dqss RW 0x00000001 Write to DQS Timing Register on page 3-20

0x01C t_mrd RW 0x00000002 MODEREG to Command Timing Register on page 3-21

0x020 t_ras RW 0x00000007 ACTIVE to PRECHARGE Timing Register on page 3-22

0x024 t_rc RW 0x0000000B ACTIVE to ACTIVE Timing Register on page 3-23

0x028 t_rcd RW 0x0000001D ACTIVE to Read or Write Timing Register on page 3-23

0x02C t_rfc RW 0x00000212 AUTO REFRESH to Command Timing Register on

page 3-24

0x030 t_rp RW 0x0000001D PRECHARGE to Command Timing Register on page 3-25

0x034 t_rrd RW 0x00000002 ACTIVE to ACTIVE Different Bank Timing Register on

page 3-26

0x038 t_wr RW 0x00000003 Write to PRECHARGE Timing Register on page 3-27

0x03C t_wtr RW 0x00000002 Write to Read Timing Register on page 3-27

0x040 t_xp RW 0x00000001 Exit Power-down Timing Register on page 3-28

0x044 t_xsr RW 0x0000000A Exit Self-refresh Timing Register on page 3-29

0x048 t_esr RW 0x00000014 Self-refresh to Command Timing Register on page 3-30

0x04C memory_cfg2 RW -b Memory Configuration 2 Register on page 3-30

0x050 memory_cfg3 RW 0x00000007 Memory Configuration 3 Register on page 3-34

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Table 3-1 DMC register summary (continued)

Offset Name Type Reset Description

0x054 - - - Reserved, read undefined, write as zero

0x058 update_type c RW 0x00000000 Update Type Register on page 3-35

0x05C t_rddata_en c RW 0x00000000 Read Data Enable Timing Register on page 3-36

0x060-0x078 - - - Reserved, read undefined, write as zero

0x07C read_transfer_dela RW 0x00000001 Read Transfer Delay Register on page 3-37

y

0x080-0x0FC - - - Reserved, read undefined, write as zero

0x100 - 0x13C id_<n>_cfg RW 0x00000000 QoS Configuration Register on page 3-38

0x140 - 0x1FC - - - Reserved, read undefined, write as zero

0x200 chip_cfg0 RW 0x0000FF00 Chip Configuration Register on page 3-39

0x204 d chip_cfg1
0x208 d chip_cfg2
0x20C d chip_cfg3

0x210 - 0x2FC - - - Reserved, read undefined, write as zero

0x300 user_status RO - User Status Register on page 3-40

0x304 user_config WO - User Config Register on page 3-41

0x308 user_config1 WO - User Config1 Register on page 3-42

0x30C feature_ctrl RW 0x00000001 Feature Control Register on page 3-43

0x310 - 0xDFC - - - Reserved, read undefined, write as zero

0xE00 int_cfg For more information about these registers, see Chapter 4 Programmers Model for
0xE04 int_inputs Test.
0xE08 int_outputs

0xE0C - 0xFDC - - - Reserved, read undefined, write as zero

0xFE0 - 0xFEC periph_id_n RO 0x00_41340 e Peripheral Identification Register on page 3-44

0xFF0 - 0xFFC pcell_id_n RO 0xB105F00D Component identification registers on page 3-46

a. Dependent on configuration.
b. Dependent on tie-off signal values.

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c. This register is only present when the DMC is configured to implement a DDR PHY Interface (DFI), otherwise reads are
undefined, write as zero.
d. The presence of this register depends on the number of chip selects that a configured controller supports. If a controller does
not implement the register then reads are undefined, write as zero.
e. Dependent on the revision of the DMC, see Peripheral Identification Register 2 on page 3-46.

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3.3 Register descriptions

This section describes the DMC registers.

3.3.1 Memory Controller Status Register

The memc_status Register characteristics are:

Purpose Provides information about the configuration and current state of

the DMC.

Usage constraints Not accessible in the Reset or Power-On Reset (POR) state.

Configurations Available in all configurations of the DMC.

Attributes See the register summary in Table 3-1 on page 3-6.

Figure 3-7 shows the memc_status Register bit assignments.

31 12 11 10 9 8 7 6 4 3 2 1 0

Undefined

banks_bit1
exclusive_monitors
banks_bit0
memory_chips
memory_support
max_memory_width
memc_status

Figure 3-7 memc_status Register bit assignments

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Table 3-2 shows the memc_status Register bit assignments.

Table 3-2 memc_status Register bit assignments

Bits Name Function

[31:13] - Read undefined.

[12] banks_bit1 Use with banks_bit0 bit, to identify the number of banks that the DMC supports on each
memory device. See Table 3-3 on page 3-11.

[11:10] exclusive_monitors Returns the number of exclusive access monitor resources implemented in the DMC:
b00 = 0 monitors
b01 = 1 monitor
b10 = 2 monitors
b11 = 4 monitors.

[9] banks_bit0 Use with banks_bit1 bit, to identify the number of banks that the DMC supports on each
memory device. See Table 3-3 on page 3-11.

[8:7] memory_chips Returns the number of chip selects that the DMC supports:
b00 = 1 chip
b01 = 2 chips
b10 = 3 chips
b11 = 4 chips.

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Table 3-2 memc_status Register bit assignments (continued)

Bits Name Function

[6:4] memory_support Returns the type of SDRAM that the DMC supports:
b000 = SDR SDRAM
b001 = DDR SDRAM
b010 = eDRAM
b011 = LPDDR SDRAM, also known as mobile DDR SDRAM
b100 = either:
• combined SDR-DDR-LPDDR SDRAM for legacy pad interface configurations
• combined DDR-LPDDR SDRAM for DFI pad interface configurations.
b101-b111 = reserved.
If SDR SDRAM, eDRAM, or LPDDR SDRAM is supported then the DMC ignores the
cas_half_cycle bit in the CAS Latency Register on page 3-19.

[3:2] max_memory_width Returns the value of MEMWIDTH, that is, the memory data bus width of the pad
interface that is set during configuration of the DMC:
b00 = 16-bit
b01 = 32-bit
b10 = 64-bit
b11 = reserved.

[1:0] memc_status Returns the state of the DMC:

b00 = Config
b01 = Ready
b10 = Paused
b11 = Low_power.

Table 3-3 shows the memory banks chip configurations.

Table 3-3 Memory banks chip configuration

banks_bit1 and banks_bit0 bits Banks per memory chip

b00 4

b01 2a

b10 Reserved

b11 Reserved

a. Two banks per memory chip is only applicable for eDRAM configurations.

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3.3.2 Memory Controller Command Register

The memc_cmd Register characteristics are:

Purpose Controls the operating state of the DMC.

Usage constraints Not accessible in the Reset or Power-On Reset (POR) state.

Configurations Available in all configurations of the DMC.

Attributes See the register summary in Table 3-1 on page 3-6.

Figure 3-8 shows the memc_cmd Register bit assignments.

31 3 2 0

Undefined

memc_cmd

Figure 3-8 memc_cmd Register bit assignments

Table 3-4 shows the memc_cmd Register bit assignments.

Table 3-4 memc_cmd Register bit assignments

Bits Name Function

[31:3] - Undefined, write as zero.

[2:0] memc_cmd Use the following commands to change the state of the DMC:
b000 = Go
b001 = Sleep
b010 = Wakeup
b011 = Pause
b100 = Configure
b111 = Active_Pause.
If the controller receives a command to change state and a previous command to change state has
not completed then it holds pready LOW until the new command can be carried out.
For more information about the state transitions, see aclk domain state diagram on page 2-19.

Note
• Active_Pause command puts the DMC into the Paused state without draining the
arbiter queue. This enables you to move the controller to the Low_power state, to
change configuration settings such as memory frequency or timing register
values, without requiring coordination between masters in a multi-master system.

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• If you use the Active_Pause command to put the DMC in the Low_power state
then you must not remove power from the DMC because this results in data loss
and violation of the AXI protocol.

• The DMC does not issue refreshes when in the Config state. Therefore, ARM
recommends that you make register updates with the controller in Low_power
state because this ensures that the memory is put into self-refresh mode, rather
than the Config state when the memory contains valid data.

3.3.3 Direct Command Register

The direct_cmd Register characteristics are:

Purpose Initializes and updates the external memory devices by sending

the following commands:
• NOP
• PRECHARGEALL
• AUTO REFRESH
• MODEREG
• DPD.

Usage constraints Only accessible in Config state.

Configurations Available in all configurations of the DMC.

Attributes See the register summary in Table 3-1 on page 3-6.

The direct_cmd Register therefore enables any initialization sequence that an external
memory device might require. The only timing information associated with the
direct_cmd Register are the command delays that are programmed in the timing
registers. Figure 3-2 on page 3-3 shows the timing registers. Therefore, if an
initialization sequence requires additional delays between commands, they must be
timed by the master driving the initialization sequence.

Figure 3-9 on page 3-14 shows the direct_cmd Register bit assignments.

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31 23 22 21 20 19 18 17 16 15 14 13 0

Undefined addr_13_to_0

ext_mem_cmd Undefined
chip_nmbr bank_addr
memory_cmd

Figure 3-9 direct_cmd Register bit assignments

Table 3-5 shows the direct_cmd Register bit assignments.

Table 3-5 direct_cmd Register bit assignments

Bits Name Function

[31:23] - Undefined, write as zero

[22] ext_mem_cmd Extended memory command, see Table 3-6

[21:20] chip_nmbr Bits mapped to external memory chip selects, cs_n[MEMORY_CHIPS–1:0] or

dfi_cs_n[MEMORY_CHIPS–1:0]

[19:18] memory_cmd Selects the command required, see Table 3-6

[17:16] bank_addr Bits mapped to external memory bank address bits, ba[1:0] or dfi_bank[1:0], when DMC
issues a MODEREG command

[15:14] - Undefined, write as zero

[13:0] addr_13_to_0 Bits mapped to external memory address bits, add[13:0] or dfi_address[13:0], when DMC
issues a MODEREG command

Table 3-6 shows the memory command encoding from the setting of the ext_mem_cmd
and memory_cmd bits.

Table 3-6 Memory command encoding

ext_mem_cmd memory_cmd Command

0 b00 PRECHARGEALL.

0 b01 AUTO REFRESH.

0 b10 MODEREG or Extended MODEREG access.

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Table 3-6 Memory command encoding (continued)

ext_mem_cmd memory_cmd Command

0 b11 NOP.
A NOP command asserts all chip selects that are set as active_chips when the
chip_nmbr is set to 0. The active_chips field is in the Memory Configuration
Register.
If chip_nmbr is set to:
• 1, only cs_n[1] is asserted
• 2, only cs_n[2] is asserted
• 3, only cs_n[3] is asserted.

1 b00 DPD.

1 b01 -a

1 b10 -a

1 b11 -a
a. Illegal combination that might cause undefined behavior.

3.3.4 Memory Configuration Register

The memory_cfg Register characteristics are:

Purpose Controls the operation of the DMC.

Usage constraints Only accessible in Config or Low_power state.

Configurations Available in all configurations of the DMC.

Attributes See the register summary in Table 3-1 on page 3-6.

Figure 3-10 on page 3-16 shows the memory_cfg Register bit assignments.

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31 30 24 23 22 21 20 19 18 17 15 14 13 12 7 6 5 3 2 0

fp_time power_dwn_prd row_bits

sr_enable fp_enable ap_bit

active_chips column_bits
qos_master_bits
memory_burst
stop_mem_clock
auto_power_down

Figure 3-10 memory_cfg Register bit assignments

Table 3-7 shows the memory_cfg Register bit assignments.

Table 3-7 memory_cfg Register bit assignments

Bits Name Function

[31] sr_enable If a DMC is configured to include auto self-refresh entry functionality then this bit
enables the function:
0 = auto self-refresh entry is disabled.
1 = auto self-refresh entry is enabled. See Low-power operation on page 2-37.
Note
Do not enable auto self-refresh entry if a DMC is configured to provide a global cke.

If a DMC configuration excludes auto self-refresh entry functionality then reads are
undefined, write as zero.

[30:24] fp_time This field is valid only when DMC is configured to include force precharge
functionality. The value programmed into this field must indicate the timeout after which
force precharge command is applied. See Low-power operation on page 2-37.
If a DMC configuration excludes force precharge functionality then reads are undefined,
write as zero.

[23] fp_enable If a DMC is configured to include force precharge functionality then this bit enables the
function:
0 = force precharge is disabled.
1 = force precharge is enabled. See Low-power operation on page 2-37.
If a DMC configuration excludes force precharge functionality then reads are undefined,
write as zero.

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Table 3-7 memory_cfg Register bit assignments (continued)

Bits Name Function

[22:21] active_chips Enables the DMC to generate refresh commands for the following number of memory
chips:
b00 = 1 chip
b01 = 2 chips
b10 = 3 chips
b11 = 4 chips.
It is only possible to generate commands up to and including the number of chips in the
configuration that the memc_status Register defines, see Memory Controller Status
Register on page 3-9.

[20:18] qos_master_bits Controls which bits of the arid bus are used by the DMC when it selects the QoS value
for the AXI read transfer:
b000 = arid[3:0]
b001 = arid[4:1]
b010 = arid[5:2]
b011 = arid[6:3]
b100 = arid[7:4]
b101-b111 = reserved.

[17:15] memory_burst Controls how many data accesses that the DMC performs to SDRAM, for each Read or
Write command:
b000 = Burst 1
b001 = Burst 2
b010 = Burst 4
b011 = Burst 8
b100 = Burst 16
b101-b111 = reserved.
The chosen burst value must also be programmed into the mode register of the SDRAM
using the direct_cmd Register. See Direct Command Register on page 3-13.

[14] stop_mem_clock When enabled, the memory clock is dynamically stopped when not performing an access
to the SDRAM.

[13] auto_power_down When this is set, the memory interface automatically places the SDRAM into
power-down state by deasserting cke when the command FIFO has been empty for
power_dwn_prd memory clock cycles.

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Table 3-7 memory_cfg Register bit assignments (continued)

Bits Name Function

[12:7] power_dwn_prd Number of memory clock cycles for auto power-down of the SDRAM.
You must only change this field when either:
• auto_power_down bit is 0
• DMC is in the Low_power state.
The value programmed in this field must be greater than the programmed cas_latency,
see CAS Latency Register on page 3-19.

[6] ap_bit Encodes the position of the auto-precharge bit in the memory address:
0 = address bit 10
1 = address bit 8.

[5:3] row_bits Encodes the number of bits of the AXI address that comprise the row address:
b000 = 11 bits
b001 = 12 bits
b010 = 13 bits
b011 = 14 bits
b100 = 15 bits
b101 = 16 bits
b110-b111 = reserved.
The combination of row size, column size, BRC or RBC, and memory width must ensure
that neither the MSB of the row address nor the MSB of the bank address exceed address
range [27:0].

[2:0] column_bits Encodes the number of bits of the AXI address that comprise the column address:
b000 = 8 bits
b001 = 9 bits
b010 = 10 bits
b011 = 11 bits
b100 = 12 bits
b101-b111 = reserved.

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3.3.5 Refresh Period Register

The refresh_prd Register characteristics are:

Purpose Controls the memory refresh period in memory clock cycles.

Usage constraints Only accessible in Config or Low_power state.

Configurations Available in all configurations of the DMC.

Attributes See the register summary in Table 3-1 on page 3-6.

Figure 3-11 shows the refresh_prd Register bit assignments.

31 15 14 0

Undefined refresh_prd

Figure 3-11 refresh_prd Register bit assignments

Table 3-8 shows the refresh_prd Register bit assignments.

Table 3-8 refresh_prd Register bit assignments

Bits Name Function

[31:15] - Read undefined, write as zero.

[14:0] refresh_prd Memory refresh period in memory clock cycles. Supported values are 0-32767.

3.3.6 CAS Latency Register

The cas_latency Register characteristics are:

Purpose Controls the CAS latency time in memory clock cycles, see
Figure 2-24 on page 2-33.

Usage constraints Only accessible in Config or Low_power state.

Configurations Available in all configurations of the DMC.

Attributes See the register summary in Table 3-1 on page 3-6.

Figure 3-12 on page 3-20 shows the cas_latency Register bit assignments.

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Note
The value of the CAS latency in the cas_latency Register must be identical to the CAS
latency that you write to the memory device, using the direct_cmd Register.

31 4 3 1 0
cas_
Undefined
latency

cas_half_cycle

Figure 3-12 cas_latency Register bit assignments

Table 3-9 shows the cas_latency Register bit assignments.

Table 3-9 cas_latency Register bit assignments

Bits Name Function

[31:4] - Read undefined, write as zero.

[3:1] cas_latency CAS latency in mclk cycles. Supported values are 2-3.

[0] cas_half_cycle If you require a CAS latency of 2.5 then set this bit to 1, provided that:
• the DMC accesses DDR devices
• cas_latency field =2.
Otherwise, you must set this bit to 0.

3.3.7 Write to DQS Timing Register

The t_dqss Register characteristics are:

Purpose Controls the Write command to DQS delay in memory clock

cycles, see Figure 2-22 on page 2-32 and Figure 2-23 on
page 2-32.

Usage constraints Only accessible in Config or Low_power state.

Configurations Available in all configurations of the DMC.

Attributes See the register summary in Table 3-1 on page 3-6.

Figure 3-13 on page 3-21 shows the t_dqss Register bit assignments.

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31 2 1 0

Undefined

t_dqss

Figure 3-13 t_dqss Register bit assignments

Table 3-10 shows the t_dqss Register bit assignments.

Table 3-10 t_dqss Register bit assignments

Bits Name Function

[31:1] - Read undefined, write as zero.

[0] t_dqss Sets tDQSS, the Write to DQS time delay in memory clock cycles. Supported values are 0-1.
Note
When tDQSS is set to 0, then the controller supports only SDR SDRAM.

3.3.8 MODEREG to Command Timing Register

The t_mrd Register characteristics are:

Purpose Controls the MODEREG to command delay in memory clock cycles,

see Figure 2-19 on page 2-31.

Usage constraints Only accessible in Config or Low_power state.

Configurations Available in all configurations of the DMC.

Attributes See the register summary in Table 3-1 on page 3-6.

Figure 3-14 shows the t_mrd Register bit assignments.

31 7 6 0

Undefined t_mrd

Figure 3-14 t_mrd Register bit assignments

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Table 3-11 shows the t_mrd Register bit assignments.

Table 3-11 t_mrd Register bit assignments

Bits Name Function

[31:7] - Read undefined, write as zero.

[6:0] t_mrd Sets tMRD, the time delay in mclk cycles, for the DMC to issue a command after it issues a MODEREG
command. Supported values are 0-127.

3.3.9 ACTIVE to PRECHARGE Timing Register

The t_ras Register characteristics are:

Purpose Controls the ACTIVE to PRECHARGE delay in memory clock cycles,

see Figure 2-18 on page 2-30.

Usage constraints Only accessible in Config or Low_power state.

Configurations Available in all configurations of the DMC.

Attributes See the register summary in Table 3-1 on page 3-6.

Figure 3-15 shows the t_ras Register bit assignments.

31 4 3 0

Undefined t_ras

Figure 3-15 t_ras Register bit assignments

Table 3-12 shows the t_ras Register bit assignments.

Table 3-12 t_ras Register bit assignments

Bits Name Function

[31:4] - Read undefined, write as zero.

[3:0] t_ras Sets tRAS, the ACTIVE to PRECHARGE delay in memory clock cycles. Supported values are 1-15.

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3.3.10 ACTIVE to ACTIVE Timing Register

The t_rc Register characteristics are:

Purpose Controls the ACTIVE bank x to ACTIVE bank x delay in memory

clock cycles, see Figure 2-15 on page 2-29.

Usage constraints Only accessible in Config or Low_power state.

Configurations Available in all configurations of the DMC.

Attributes See the register summary in Table 3-1 on page 3-6.

Figure 3-16 shows the t_rc Register bit assignments.

31 4 3 0

Undefined t_rc

Figure 3-16 t_rc Register bit assignments

Table 3-13 shows the t_rc Register bit assignments.

Table 3-13 t_rc Register bit assignments

Bits Name Function

[31:4] - Read undefined, write as zero.

[3:0] t_rc Sets tRC, the ACTIVE bank x to ACTIVE bank x delay in memory clock cycles. Supported values are 1-15.

3.3.11 ACTIVE to Read or Write Timing Register

The t_rcd Register characteristics are:

Purpose Controls the delay between an ACTIVE command and another

memory command, other than ACTIVE, to the same bank, see
Figure 2-14 on page 2-29.

Usage constraints Only accessible in Config or Low_power state.

Configurations Available in all configurations of the DMC.

Attributes See the register summary in Table 3-1 on page 3-6.

Figure 3-17 on page 3-24 shows the t_rcd Register bit assignments.

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31 6 5 3 2 0

Undefined t_rcd

schedule_rcd

Figure 3-17 t_rcd Register bit assignments

Table 3-14 shows the t_rcd Register bit assignments.

Table 3-14 t_rcd Register bit assignments

Bits Name Function

[31:6] - Read undefined, write as zero.

[5:3] schedule_rcd Sets the RAS to CAS delay in aclk cycles minus 3. For more information, see Scheduler on
page 2-27. Supported values are 0-7.

[2:0] t_rcd Sets tRCD, the RAS to CAS delay in memory clock cycles. Supported values are 1-7.

3.3.12 AUTO REFRESH to Command Timing Register

The t_rfc Register characteristics are:

Purpose Controls the AUTO REFRESH to command delay in memory clock

cycles, see Figure 2-17 on page 2-30.

Usage constraints Only accessible in Config or Low_power state.

Configurations Available in all configurations of the DMC.

Attributes See the register summary in Table 3-1 on page 3-6.

Figure 3-18 shows the t_rfc Register bit assignments.

31 10 9 5 4 0

Undefined schedule_rfc t_rfc

Figure 3-18 t_rfc Register bit assignments

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Table 3-15 shows the t_rfc Register bit assignments.

Table 3-15 t_rfc Register bit assignments

Bits Name Function

[31:10] - Read undefined, write as zero.

[9:5] schedule_rfc Sets the AUTO REFRESH to command delay in aclk cycles minus 3. Supported values are 0-31. For
more information, see Scheduler on page 2-27.

[4:0] t_rfc Sets tRFC, the AUTO REFRESH to command delay in memory clock cycles. Supported values are
1-31.

3.3.13 PRECHARGE to Command Timing Register

The t_rp Register characteristics are:

Purpose Controls the PRECHARGE to RAS delay in memory clock cycles, see
Figure 2-17 on page 2-30 and Figure 2-18 on page 2-30.

Usage constraints Only accessible in Config or Low_power state.

Configurations Available in all configurations of the DMC.

Attributes See the register summary in Table 3-1 on page 3-6.

Figure 3-19 shows the t_rp Register bit assignments.

31 6 5 3 2 0

Undefined t_rp

schedule_rp

Figure 3-19 t_rp Register bit assignments

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Table 3-16 shows the t_rp Register bit assignments.

Table 3-16 t_rp Register bit assignments

Bits Name Function

[31:6] - Read undefined, write as zero.

[5:3] schedule_rp Sets the PRECHARGE to RAS delay in aclk cycles minus 3. Supported values are 0-7. For more
information, see Scheduler on page 2-27.

[2:0] t_rp Sets tRP, the PRECHARGE to RAS delay in memory clock cycles. Supported values are 1-7.

3.3.14 ACTIVE to ACTIVE Different Bank Timing Register

The t_rrd Register characteristics are:

Purpose Controls the ACTIVE bank x to ACTIVE bank y delay in memory

clock cycles, see Figure 2-16 on page 2-30.

Usage constraints Only accessible in Config or Low_power state.

Configurations Available in all configurations of the DMC.

Attributes See the register summary in Table 3-1 on page 3-6.

Figure 3-20 shows the t_rrd Register bit assignments.

31 4 3 0

Undefined t_rrd

Figure 3-20 t_rrd Register bit assignments

Table 3-17 shows the t_rrd Register bit assignments.

Table 3-17 t_rrd Register bit assignments

Bits Name Function

[31:4] - Read undefined, write as zero.

[3:0] t_rrd Sets tRRD, the ACTIVE bank x to ACTIVE bank y delay in memory clock cycles. Supported values are 1-15.

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3.3.15 Write to PRECHARGE Timing Register

The t_wr Register characteristics are:

Purpose Controls the Write to PRECHARGE delay in memory clock cycles, see
Figure 2-23 on page 2-32.

Usage constraints Only accessible in Config or Low_power state.

Configurations Available in all configurations of the DMC.

Attributes See the register summary in Table 3-1 on page 3-6.

Figure 3-21 shows the t_wr Register bit assignments.

31 3 2 0

Undefined t_wr

Figure 3-21 t_wr Register bit assignments

Table 3-18 shows the t_wr Register bit assignments.

Table 3-18 t_wr Register bit assignments

Bits Name Function

[31:3] - Read undefined, write as zero.

[2:0] t_wr Sets tWR, the Write to PRECHARGE delay in memory clock cycles. Supported values are 1-7.

3.3.16 Write to Read Timing Register

The t_wtr Register characteristics are:

Purpose Controls the Write to Read delay in memory clock cycles, see
Figure 2-22 on page 2-32.

Usage constraints Only accessible in Config or Low_power state.

Configurations Available in all configurations of the DMC.

Attributes See the register summary in Table 3-1 on page 3-6.

Figure 3-22 on page 3-28 shows the t_wtr Register bit assignments.

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31 3 2 0

Undefined t_wtr

Figure 3-22 t_wtr Register bit assignments

Table 3-19 shows the t_wtr Register bit assignments.

Table 3-19 t_wtr Register bit assignments

Bits Name Function

[31:3] - Read undefined, write as zero.

[2:0] t_wtr Sets tWTR, the Write to Read command delay in memory clock cycles. Supported values are 1-7.

3.3.17 Exit Power-down Timing Register

The t_xp Register characteristics are:

Purpose Controls the exit power-down to command delay in memory clock

cycles, see Figure 2-21 on page 2-31.

Usage constraints Only accessible in Config or Low_power state.

You must only write when either:
• auto_power_down bit is 0, see Table 3-7 on page 3-16
• DMC is in the Low_power state.

Configurations Available in all configurations of the DMC.

Attributes See the register summary in Table 3-1 on page 3-6.

Figure 3-23 shows the t_xp Register bit assignments.

31 8 7 0

Undefined t_xp

Figure 3-23 t_xp Register bit assignments

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Table 3-20 shows the t_xp Register bit assignments.

Table 3-20 t_xp Register bit assignments

Bits Name Function

[31:8] - Read undefined, write as zero.

[7:0] t_xp Sets tXP, the exit power-down to command delay in memory clock cycles. Supported values are 1-255.

3.3.18 Exit Self-refresh Timing Register

The t_xsr Register characteristics are:

Purpose Controls the exit self-refresh to command delay in memory clock

cycles, see Figure 2-20 on page 2-31.

Usage constraints Only accessible in Config or Low_power state.

Configurations Available in all configurations of the DMC.

Attributes See the register summary in Table 3-1 on page 3-6.

Figure 3-24 shows the t_xsr Register bit assignments.

31 8 7 0

Undefined t_xsr

Figure 3-24 t_xsr Register bit assignments

Table 3-21 shows the t_xsr Register bit assignments.

Table 3-21 t_xsr Register bit assignments

Bits Name Function

[31:8] - Read undefined, write as zero.

[7:0] t_xsr Sets tXSR, the exit self-refresh to command delay in memory clock cycles. Supported values are 1-255.

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3.3.19 Self-refresh to Command Timing Register

The t_esr Register characteristics are:

Purpose Controls the self-refresh to command delay in memory clock

cycles, see Figure 2-20 on page 2-31.

Usage constraints Only accessible in Config or Low_power state.

Configurations Available in all configurations of the DMC.

Attributes See the register summary in Table 3-1 on page 3-6.

Figure 3-25 shows the t_esr Register bit assignments.

31 8 7 0

Undefined t_esr

Figure 3-25 t_esr Register bit assignments

Table 3-22 shows the t_esr Register bit assignments.

Table 3-22 t_esr Register bit assignments

Bits Name Function

[31:8] - Read undefined, write as zero.

[7:0] t_esr Sets the self-refresh to command delay in memory clock cycles. Supported values are 1-255.

3.3.20 Memory Configuration 2 Register

The memory_cfg2 Register characteristics are:

Purpose Controls the operation of the DMC. Enables you to override the
configuration set by the tie-off signals, see Tie-offs on page A-3.

Usage constraints • Only accessible in Config or Low_power state.

• Some bits are only available when a DMC is configured to
provide a legacy pad interface.

Configurations Available in all configurations of the DMC.

Attributes See the register summary in Table 3-1 on page 3-6.

Figure 3-26 on page 3-31 shows the memory_cfg2 Register bit assignments.

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31 11 10 9 8 6 5 4 3 2 1 0

Undefined

read_delay
memory_protocol
memory_width
cke_init
dqm_init
clock_cfg

Figure 3-26 memory_cfg2 Register bit assignments

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Table 3-23 shows the memory_cfg2 Register bit assignments.

Table 3-23 memory_cfg2 Register bit assignments

Bits Name Function

[31:11] - Read undefined, write as zero.

[10:9] read_delay This field varies the number of mclk cycles before the controller captures the read data,
from the memory device, into the memory clock domain. Supported values are 0-2.
The default value is set by the state of read_delay[1:0], when aresetn goes HIGH.

[8:6] memory_protocol If a configured DMC supports combined SDR-DDR-LPDDR SDRAM or combined

DDR-LPDDR SDRAM then you can use this field to modify the memory protocol that it
supports.
The memory protocol encodings are:
• b000 = SDR
• b001 = DDR
• b010 = eDRAM
• b011 = LPDDR, also known as mobile DDR
• b100 = either:
— combined SDR-DDR-LPDDR SDRAM for legacy pad interface
configurations
— combined DDR-LPDDR SDRAM for DFI pad interface configurations.
• b101-b111 = reserved.
The default value is set by the state of memory_type[2:0], when aresetn goes HIGH.
Note
• You can use the memory_support field to determine what memory protocols a
configured controller supports, see Memory Controller Status Register on page 3-9.
• Selecting a memory protocol that the configured DMC does not support can result
in Unpredictable behavior.

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Table 3-23 memory_cfg2 Register bit assignments (continued)

Bits Name Function

[5:4] memory_width This field controls if the DMC uses the configured memory data bus width,
MEMWIDTH, or only the lower half of the configured memory data bus width. The DMC
permits the following bit settings depending on the value of configured memory data bus
width, MEMWIDTH:
MEMWIDTH=16
Set this field to b00. The memory data bus width remains unaltered at 16
bits.
MEMWIDTH=32
Set this field to either:
• b00. After deassertion of mresetn, the controller uses the lower 16
bits of the pad interface.
• b01. After deassertion of mresetn, the controller uses the entire 32
bits of the pad interface.
MEMWIDTH=64
Set this field to either:
• b01. After deassertion of mresetn, the controller uses the lower 32
bits of the pad interface.
• b10. After deassertion of mresetn, the controller uses the entire 64
bits of the pad interface.
The default value is set by the state of memory_width[1:0], when aresetn goes HIGH.
Note
Selecting a memory width that the configured DMC does not support can result in
Unpredictable behavior. For more information, see Supported memory widths on
page 1-4.

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Table 3-23 memory_cfg2 Register bit assignments (continued)

Bits Name Function

[3] cke_init If the DMC contains a DFI pad interface then this bit is reserved. Otherwise, for a legacy
pad interface, it sets the state of cke[MEMORY_CHIPS–1:0] when mresetn is
deasserted.
The default value is set by the state of cke_init, when aresetn goes HIGH.

[2] dqm_init If the DMC contains a DFI pad interface then this bit is reserved. Otherwise, for a legacy
pad interface, it sets the state of the dqm[MEMORY_BYTES–1:0] outputs when
mresetn is deasserted.
The default value is set by the state of dqm_init, when aresetn goes HIGH.

[1:0] clock_cfg Encodes the clocking scheme:

b00 = aclk and mclk are asynchronous
b01 = aclk and mclk are synchronous, and aclk is the same frequency or slower than mclk
b10 = reserved
b11 = aclk and mclk are synchronous, and aclk is greater than mclk.
The default value is set by the state of sync and a_gt_m_sync, when aresetn goes HIGH.

3.3.21 Memory Configuration 3 Register

The memory_cfg3 Register characteristics are:

Purpose Controls the:

• power_dwn_prd prescalar value
• number of outstanding AUTO REFRESH commands.

Usage constraints Only accessible in Config or Low_power state.

Configurations Available in all configurations of the DMC.

Attributes See the register summary in Table 3-1 on page 3-6.

Figure 3-27 shows the memory_cfg3 Register bit assignments.

31 13 12 3 2 0

Undefined prescale

max_outs_refs

Figure 3-27 memory_cfg3 Register bit assignments

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Table 3-24 shows the memory_cfg3 Register bit assignments.

Table 3-24 memory_cfg3 Register bit assignments

Bits Name Function

[31:13] - Read undefined, write as zero.

[12:3] prescale Prescalar counter value. Supported values are 0-1023. See Auto self-refresh entry on
page 2-45.

[2:0] max_outs_refs Maximum number of outstanding refresh commands. Supported values are 1-7. See QoS for
AUTO REFRESH on page 2-24.

3.3.22 Update Type Register

The update_type Register characteristics are:

Purpose Controls how the DMC responds when it receives any of the four
possible update type requests from a PHY device.

Usage constraints Only accessible in Config or Low_power state.

Configurations Available when the DMC is configured to support a DFI pad

interface.

Attributes See the register summary in Table 3-1 on page 3-6.

Figure 3-28 shows the update_type Register bit assignments.

31 8 7 6 5 4 3 2 1 0

Undefined

phyupd_type_11
phyupd_type_10
phyupd_type_01
phyupd_type_00

Figure 3-28 update_type Register bit assignments

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Table 3-25 shows the update_type Register bit assignments.

Table 3-25 update_type Register bit assignments

Bits Name Function

[31:8] - Read undefined, write as zero.

[7:6] phyupd_type_11 Controls how the DMC responds to a DFI update request type 3, that is, when the PHY sets
dfi_phyupd_type[1:0] to b11:
b00 = Put the memory devices in self-refresh mode then stall the DFI
b01 = Stall the DFI
b10-b11 = Reserved.

[5:4] phyupd_type_10 Controls how the DMC responds to a DFI update request type 2, that is, when the PHY sets
dfi_phyupd_type[1:0] to b10:
b00 = Put the memory devices in self-refresh mode then stall the DFI
b01 = Stall the DFI
b10-b11 = Reserved.

[3:2] phyupd_type_01 Controls how the DMC responds to a DFI update request type 1, that is, when the PHY sets
dfi_phyupd_type[1:0] to b01:
b00 = Put the memory devices in self-refresh mode then stall the DFI
b01 = Stall the DFI
b10-b11 = Reserved.

[1:0] phyupd_type_00 Controls how the DMC responds to a DFI update request type 0, that is, when the PHY sets
dfi_phyupd_type[1:0] to b00:
b00 = Put the memory devices in self-refresh mode then stall the DFI
b01 = Stall the DFI
b10-b11 = Reserved.

3.3.23 Read Data Enable Timing Register

The t_rddata_en Register characteristics are:

Purpose Controls the trddata_en timing parameter on the DFI pad interface.

Usage constraints Only accessible in Config or Low_power state.

Configurations Available when the DMC is configured to support a DFI pad

interface.

Attributes See the register summary in Table 3-1 on page 3-6.

Figure 3-29 on page 3-37 shows the t_rddata_en Register bit assignments.

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31 4 3 0

Undefined t_rddata_en

Figure 3-29 t_rddata_en Register bit assignments

Table 3-26 shows the t_rddata_en Register bit assignments.

Table 3-26 t_rddata_en Register bit assignments

Bits Name Function

[31:4] - Read undefined, write as zero.

[3:0] t_rddata_en After a DMC issues a Read command from the DFI pad interface then this field sets the number
of mclk cycles before dfi_rddata_en[MEMORY_BYTES–1:0] goes HIGH.
The valid values for this field depend on the cas_latency setting and the limits are:
Minimum cas_latency–1
Maximum cas_latency+6
For example, if cas_latency = 3, then set this field to any value between b0010 and b1001.

3.3.24 Read Transfer Delay Register

The read_transfer_delay Register characteristics are:

Purpose Controls the number of idle cycles between back-to-back reads to

different memory devices.

Usage constraints Only accessible in Config or Low_power state.

Configurations Available in all configurations of the DMC.

Attributes See the register summary in Table 3-1 on page 3-6.

Figure 3-30 shows the read_transfer_delay Register bit assignments.

31 2 1 0

Undefined

read_transfer_delay

Figure 3-30 read_transfer_delay Register bit assignments

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Table 3-27 shows the read_transfer_delay Register bit assignments.

Table 3-27 read_transfer_delay Register bit assignments

Bits Name Function

[31:2] - Read undefined, write as zero.

[1:0] read_transfer_delay When the controller performs back-to-back reads to different memory devices then this
field controls the number of idle mclk cycles that the controller inserts between the reads:
b00 = reserved
b01 = one idle cycle, this is the default
b10 = two idle cycles
b11 = reserved.
Note
• The controller inserts idle cycles to prevent bus contention from occurring,
otherwise the second memory device can start driving the DQS bus prior to the first
memory device releasing control of the DQS bus.
• One idle cycle is sufficient for most memory types. However, for some of the
recently introduced LPDDR devices, for example LPDDR-400, then two idle
cycles are usually required.

3.3.25 QoS Configuration Register

The id_<n>_cfg Register characteristics are:

Purpose Sets the parameters for QoS <n>. Where <n> is a value from 0 to
15 and is the result of applying the 4-bit QoS mask to the arid[]
bus.

Usage constraints Only accessible in Config or Low_power state.

Configurations Available in all configurations of the DMC.

Attributes See the register summary in Table 3-1 on page 3-6.

Figure 3-31 on page 3-39 shows the id_<n>_cfg Register bit assignments.

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31 10 9 2 1 0

Undefined qos_max<n>

qos_min<n>
qos_enable<n>

Figure 3-31 id_<n>_cfg Register bit assignments

Table 3-28 shows the id_<n>_cfg Register bit assignments.

Table 3-28 id_<n>_cfg Register bit assignments

Bits Name Function

[31:10] - Read undefined, write as zero.

[9:2] qos_max<n> Sets the maximum QoS value. Supported values are 0-255.

[1] qos_min<n> Enables the minimum QoS functionality:

0 = disabled, so the arbiter entry uses the qos_max<n> value
1 = enabled. the arbiter entry uses minimum latency.

[0] qos_enable<n> When set, the DMC can apply QoS to a read transfer if the masking of the arid[] bits with
the programmed QoS mask produces a value of <n>. For more information, see Quality of
Service on page 2-23.

3.3.26 Chip Configuration Register

The chip_cfg<n> Register characteristics are:

Purpose Each register sets the:

• address decode for chip select <n>
• bank, row, column organization of the memory device that
connects to chip select <n>.

Usage constraints • Only accessible in Config or Low_power state.

• The number of registers implemented is equal to the number
of chip selects that a configured controller supports.

Configurations Available in all configurations of the DMC.

Attributes See the register summary in Table 3-1 on page 3-6.

Figure 3-32 on page 3-40 shows the chip_cfg<n> Register bit assignments.

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31 17 16 15 8 7 0

Undefined address_match<n> address_mask<n>

address_fmt<n>

Figure 3-32 chip_cfg<n> registers bit assignments

Table 3-29 shows the chip_cfg<n> Register bit assignments.

Table 3-29 chip_cfg<n> registers bit assignments

Bits Name Function

[31:17] - Read undefined, write as zero.

[16] address_fmt<n> Selects the memory organization as decoded from the AXI address:
0 = Row, Bank, Column (RBC) organization
1 = Bank, Row, Column (BRC) organization.

[15:8] address_match<n> The controller applies the address_mask<n> field to the AXI address bits, [31:24], that
is awaddr[31:24] or araddr[31:24]. The controller compares the result against this field
and if a match occurs then it selects memory device <n>. See Formatting from AXI
address channels on page 2-14.

[7:0] address_mask<n> Controls which AXI address bits, [31:24], the DMC compares when it receives an AXI
transfer:
Bit [x] = 0 DMC excludes AXI address bit [24+x] from the comparison
Bit [x] = 1 DMC includes AXI address bit [24+x] in the comparison.

Note
If a configured controller supports two or more memory devices then you must take care
to ensure that for all AXI addresses, you program the various address_match and
address_mask fields so that the controller can only assert a single memory chip select.
Otherwise, Unpredictable behavior might occur.

3.3.27 User Status Register

The user_status Register characteristics are:

Purpose Provides the status of the user_status inputs.

Usage constraints No usage constraints.

Configurations Available in all configurations of the DMC.

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Attributes See the register summary in Table 3-1 on page 3-6.

Figure 3-33 shows the user_status Register bit assignments.

USER_STATUS_WIDTH USER_STATUS_WIDTH–1
31 0

Undefined user_status

Figure 3-33 user_status Register bit assignments

Table 3-30 shows the user_status Register bit assignments.

Table 3-30 user_status Register bit assignments

Bits Name Function

[31:USER_STATUS_WIDTHa] - Read undefined

[USER_STATUS_WIDTH–1:0] user_status The state of the user_status[USER_STATUS_WIDTH–1:0] inputs

a. If USER_STATUS_WIDTH is configured to be 32 then none of the bits in this register are undefined.

3.3.28 User Config Register

The user_config Register characteristics are:

Purpose Controls the state of the user_config outputs.

Usage constraints No usage constraints.

Configurations Available in all configurations of the DMC.

Attributes See the register summary in Table 3-1 on page 3-6.

Figure 3-34 shows the user_config Register bit assignments.

USER_CONFIG_WIDTH USER_CONFIG_WIDTH–1
31 0

Undefined user_config

Figure 3-34 user_config Register bit assignments

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Table 3-31 shows the user_config Register bit assignments.

Table 3-31 user_config Register bit assignments

Bits Name Function

[31:USER_CONFIG_WIDTHa] - Undefined, write as zero

[USER_CONFIG_WIDTH–1:0] user_config Sets the state of the user_config[USER_CONFIG_WIDTH–1:0]

outputs

a. If USER_CONFIG_WIDTH is configured to be 32 then none of the bits in this register are undefined.

3.3.29 User Config1 Register

The user_config1 Register characteristics are:

Purpose Controls the state of the user_config1 outputs.

Usage constraints No usage constraints.

Configurations Available in all configurations of the DMC.

Attributes See the register summary in Table 3-1 on page 3-6.

Figure 3-35 shows the user_config1 Register bit assignments.

USER_CONFIG_WIDTH USER_CONFIG_WIDTH–1
31 0

Undefined user_config1

Figure 3-35 user_config1 Register bit assignments

Table 3-32 shows the user_config1 Register bit assignments.

Table 3-32 user_config1 Register bit assignments

Bits Name Function

[31:USER_CONFIG_WIDTHa] - Undefined, write as zero

[USER_CONFIG_WIDTH–1:0] user_config1 Sets the state of the user_config1[USER_CONFIG_WIDTH–1:0]

outputs

a. If USER_CONFIG_WIDTH is configured to be 32 then none of the bits in this register are undefined.

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3.3.30 Feature Control Register

The feature_ctrl Register characteristics are:

Purpose Controls the early write response behavior.

Usage constraints Only accessible in Config or Low_power state.

Configurations Available in all configurations of the DMC.

Attributes See the register summary in Table 3-1 on page 3-6.

Figure 3-36 shows the feature_ctrl Register bit assignments.

31 1 0

Undefined

stop_early_bresp

Figure 3-36 feature_ctrl Register bit assignments

Table 3-33 shows the feature_ctrl Register bit assignments.

Table 3-33 feature_ctrl Register bit assignments

Bits Name Function

[31:1] - Read undefined, write as zero

[0] stop_early_bresp Controls the early write response feature:

0 = early write response enabled
1 = early write response disabled.

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3.3.31 Peripheral Identification Register

The periph_id_[3:0] Register characteristics are:

Purpose Provide information about the configuration and version of the

peripheral.

Usage constraints No usage constraints.

Configurations Available in all configurations of the DMC.

Attributes See the register summary in Table 3-1 on page 3-6.

These registers can conceptually be treated as a single register that holds a 32-bit
peripheral ID value. Figure 3-37 shows the correspondence between bits [7:0] of the
periph_id registers and the conceptual 32-bit Peripheral ID Register.

Conceptual 32-bit Peripheral ID register

31 24 23 16 15 8 7 0
periph_id_3 periph_id_2 periph_id_1 periph_id_0

7 4 3 0 7 4 3 0 7 4 3 0 7 0

customer part_
Reserved revision designer_1 designer_0 part_ number_0
modified number_1
designer part number

Figure 3-37 periph_id_[3:0] Register bit assignments

Table 3-34 shows the register bit assignments for the conceptual 32-bit peripheral ID
Register.

Table 3-34 Conceptual peripheral ID Register bit assignments

Bits Name Function

[31:28] - Reserved.

[27:24] customer modified Identifies data that is relevant to an ARM partner.

[23:20] revision Identifies the RTL revision of the peripheral.

[19:12] designer Identifies the designer. This is 0x41 for ARM.

[11:0] part_number Identifies the peripheral. The part number for the DMC is 0x340.

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The periph_id registers are described in:

• Peripheral Identification Register 0
• Peripheral Identification Register 1
• Peripheral Identification Register 2 on page 3-46
• Peripheral identification Register 3 on page 3-46.

Peripheral Identification Register 0

The periph_id_0 Register is hard-coded and the fields in the register control the reset
value. Table 3-35 shows the register bit assignments.

Table 3-35 periph_id_0 Register bit assignments

Bits Name Function

[31:8] - Read undefined

[7:0] part_number_0 Returns 0x40

Peripheral Identification Register 1

The periph_id_1 Register is hard-coded and the fields in the register control the reset
value. Table 3-36 shows the register bit assignments.

Table 3-36 periph_id_1 Register bit assignments

Bits Name Function

[31:8] - Read undefined

[7:4] designer_0 Returns 0x1

[3:0] part_number_1 Returns 0x3

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Peripheral Identification Register 2

The periph_id_2 Register is hard-coded and the fields in the register control the reset
value. Table 3-37 shows the register bit assignments.

Table 3-37 periph_id_2 Register bit assignments

Bits Name Function

[31:8] - Read undefined

[7:4] revision These bits return the revision number:

• 0x0 is r0p0
• 0x1 is r1p0
• 0x2 is r2p0
• 0x3 is r3p0
• 0x4 is r4p0

[3:0] designer_1 Returns 0x4

Peripheral identification Register 3

The periph_id_3 Register is hard-coded and the fields in the register control the reset
value. Table 3-38 shows the register bit assignments.

Table 3-38 periph_id_3 Register bit assignments

Bits Name Function

[31:8] - Read undefined

[7:4] - Reserved for future use, read undefined

[3:0] customer modified Customer modified number, 0x0 from ARM

3.3.32 Component identification registers

The pcell_id_[3:0] Register characteristics are:

Purpose When concatenated, these four registers return 0xB105F00D

Usage constraints No usage constraints.

Configurations Available in all configurations of the DMC.

Attributes See the register summary in Table 3-1 on page 3-6.

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These registers can be treated conceptually as a single register that holds a 32-bit
Component identification value. You can use the register for automatic BIOS
configuration.

Figure 3-38 shows the register bit assignments.

Conceptual 32-bit Component ID register

31 24 23 16 15 8 7 0

0xB1 0x05 0xF0 0x0D

7 0 7 0 7 0 7 0
pcell_id_3 pcell_id_2 pcell_id_1 pcell_id_0

Figure 3-38 pcell_id Register bit assignments

Table 3-39 shows the register bit assignments.

Table 3-39 pcell_id Register bit assignments

pcell_id Register pcell_id_[3:0] registers

Bits Reset value Register Bits Description

pcell_id_3 [31:8] Read undefined

[31:24] 0xB1
[7:0] Returns 0xB1

pcell_id_2 [31:8] Read undefined

[23:16] 0x05
[7:0] Returns 0x05

pcell_id_1 [31:8] Read undefined

[15:8] 0xF0
[7:0] Returns 0xF0

pcell_id_0 [31:8] Read undefined

[7:0] 0x0D
[7:0] Returns 0x0D

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Programmers Model for Test

This chapter describes the additional logic for functional verification and production
testing. It contains the following section:
• Integration test registers on page 4-2.

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4.1 Integration test registers

Test registers are provided for integration testing.

Figure 4-1 shows the integration test register map.

int_outputs
0xE08
int_inputs
0xE04
int_cfg
0xE00

Figure 4-1 Integration test register map

Table 4-1 shows the integration test registers in base offset order.

Table 4-1 DMC test Register summary

Offset Name Type Reset Description

0xE00 int_cfg RW 0x0 Integration Configuration Register on page 4-3

0xE04 int_inputs RO -a Integration Inputs Register on page 4-4

0xE08 int_outputs WO - Integration Outputs Register on page 4-6

a. Dependent on the tie-off signals.

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4.1.1 Integration Configuration Register

The int_cfg Register characteristics are:

Purpose Controls the enabling of the integration test logic.

Usage constraints Only accessible in Config state. ARM recommends that it is only
accessed for integration testing or production testing.

Configurations Available in all configurations of the DMC.

Attributes See the register summary in Table 4-1 on page 4-2.

Figure 4-2 shows the int_cfg Register bit assignments.

31 1 0

Undefined

int_test_en

Figure 4-2 int_cfg Register bit assignments

Table 4-2 shows the int_cfg Register bit assignments.

Table 4-2 int_cfg Register bit assignments

Bits Name Function

[31:1] - Read undefined, write as zero.

[0] int_test_en Enables the integration test logic:

0 = disables the integration test logic
1 = enables the integration test logic.
Note
When the controller exits integration test mode, the cactive and csysack signals must be HIGH,
even if the SoC does not use these signals. To satisfy this requirement you must program the
int_outputs Register, see Integration Outputs Register on page 4-6.

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4.1.2 Integration Inputs Register

The int_inputs Register characteristics are:

Purpose Provides the status of the following inputs:

• csysreq
• qos_override[15:0]
• use_ebi, ebibackoff, and ebigrant.

Usage constraints • Only accessible in Config state.

• Some bits are only available when the DMC is configured
to provide an External Bus Interface (EBI).
• Integration test logic must be enabled otherwise it ignores
writes and reads return 0x0. To enable the integration test
logic, see Integration Configuration Register on page 4-3.

Configurations Available in all configurations of the DMC.

Attributes See the register summary in Table 4-1 on page 4-2.

Figure 4-3 shows the int_inputs Register bit assignments.

31 24 23 8 7 4 3 2 1 0

Undefined qos_override Undefined

use_ebi
ebibackoff
ebigrant
csysreq

Figure 4-3 int_inputs Register bit assignments

Table 4-3 shows the int_inputs Register bit assignments.

Table 4-3 int_inputs Register bit assignments

Bits Name Function

[31:24] - Read undefined

[23:8] qos_override Returns the status of the qos_override[15:0] inputs

[7:4] - Read undefined

[3] use_ebi Returns the status of the use_ebi input if the DMC supports an EBI

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Table 4-3 int_inputs Register bit assignments (continued)

Bits Name Function

[2] ebibackoff Returns the status of the ebibackoff input if the DMC supports an EBI

[1] ebigrant Returns the status of the ebigrant input if the DMC supports an EBI

[0] csysreq Returns the status of the csysreq input

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4.1.3 Integration Outputs Register

The int_outputs Register characteristics are:

Purpose Enables an external master to control the state of the following

outputs:
• cactive
• csysack
• ebireq.

Usage constraints • Only accessible in Config state.

• The ebireq_int bit is only available when the DMC is
configured to provide an External Bus Interface (EBI).
• Integration test logic must be enabled otherwise it ignores
writes and reads return 0x0. To enable the integration test
logic, see Integration Configuration Register on page 4-3.

Configurations Available in all configurations of the DMC.

Attributes See the register summary in Table 4-1 on page 4-2.

Figure 4-4 shows the int_outputs Register bit assignments.

31 3 2 1 0

Undefined

ebireq_int
csysack_int
cactive_int

Figure 4-4 int_outputs Register bit assignments

Table 4-4 shows the int_outputs Register bit assignments.

Table 4-4 int_outputs Register bit assignments

Bits Name Function

[31:3] - Write as zero

[2] ebireq_int Controls the state of the ebireq output if the DMC supports an EBI

[1] csysack_int Controls the state of the csysack output

[0] cactive_int Controls the state of the cactive output

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Chapter 5
Device Driver

This chapter introduces the device driver operation. It contains the following section:
• Sample device driver on page 5-2

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Device Driver

5.1 Sample device driver

The following sections describe about the operation sequence of the device driver:
• Memory controller initialization
• Memory device initialization on page 5-3
• Memory state control and status on page 5-4.

5.1.1 Memory controller initialization

Initialization involves the following steps:

1. Initialization of the timing control registers. See DMC configuration register map
on page 3-3. Depending on the configuration of the controller then you might
need to initialize the following register fields:
• cas latency
• cas_half_cycle
• t_dqss
• t_mrd
• t_ras
• t_rc
• t_rcd
• schedule_rcd
• t_rfc
• schedule_rfc
• t_rp
• schedule_rp
• t_rrd
• t_wr
• t_wtr
• t_xp
• t_xsr
• t_esr
• read_transfer_delay
• update_type and t_rddata_en for DFI configurations.

2. Initialization of memory configuration. See Memory Configuration Register on

page 3-15. Example of Register fields that needs to be initialized are:
• column_bits
• row_bits
• ap_bit

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 Device Driver

• power_dwn_prd
• auto_power_down
• stop_mem_clock
• memory_burst
• qos_master_bits.

3. Program the refresh period in the refresh_prd Register. See Refresh Period
Register on page 3-19.

4. Program the configuration of the external memory devices in to the chip_cfg<n>

registers. See Chip Configuration Register on page 3-39.

5. Program the QoS settings you require in to the id_<n>_cfg registers. See QoS
Configuration Register on page 3-38.

Controller initialization on page 2-35 shows a DMC initialization example.

5.1.2 Memory device initialization

Memory initialization involves writing to the direct_cmd Register. See Direct

Command Register on page 3-13. To initialize the mode registers in a memory device
you must perform multiple writes to the direct_cmd Register, so that the controller
generates the necessary sequence of commands that your specified memory requires.

A typical memory initialization sequence for each memory device is:

1. Program the direct_cmd Register so that the DMC issues a PRECHARGEALL

command.

2. Set Extended Mode Register.

3. Set Mode Register.

4. Program the direct_cmd Register so that the DMC issues a PRECHARGEALL

command.

5. Program the direct_cmd Register so that the DMC issues two AUTO REFRESH
commands.

LPDDR device initialization on page 2-36 shows a memory initialization example.

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5.1.3 Memory state control and status

You can change the state of the controller by programming the memc_cmd Register. See
memc_cmd Register bit assignments on page 3-12. A typical sequence is:

1. Read the memc_status Register to check the status of the controller. See Memory
Controller Status Register on page 3-9.

2. When the controller is in the Config state you can initialize the controller as
Memory controller initialization on page 5-2 describes.

3. Program the memc_cmd Register with the Go command to move the controller to
the Ready state.

Initialize memory as described in Memory device initialization on page 5-3.

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Appendix A
Signal Descriptions

This chapter describes the AMBA AXI, AMBA APB, and module-specific non-AMBA
signals that the DMC provides. It contains the following sections:
• Clock and reset signals on page A-2
• Miscellaneous signals on page A-3
• AXI signals on page A-6
• APB signals on page A-10
• Pad interface signals on page A-11
• EBI signals on page A-14.

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A.1 Clock and reset signals

Table A-1 shows the clock and reset signals.

Table A-1 Clock and reset signals

Signal Type Source Description

aclk Input Clock source Clock for the aclk domain.

aresetn Input Reset source aclk domain reset signal. This signal is active LOW.

cclken Input Bus clock Clock enable for the AXI low-power interface.

mclk Input Clock source Clock for mclk domain.

mclkn a Input Clock source Mandatory clock for pad interface block.

mclkx2 a Input Clock source Optional clock for pad interface block.

mclkx2n a Input Clock source Optional clock for pad interface block.

mresetn Input Reset source Reset for mclk domain. This signal is active LOW.

pclken Input Bus clock Clock enable for the APB interface.

a. This signal is not available when the DMC is configured to implement a DDR PHY Interface
(DFI) pad interface.

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A.2 Miscellaneous signals

This section describes the following miscellaneous signals:
• QoS
• Tie-offs
• User signals on page A-5
• Scan test on page A-5.

A.2.1 QoS

Table A-2 shows the QoS signal.

Table A-2 QoS signal

Signal Type Source Description

qos_override[15:0] Input External When one or more bits are HIGH, coincident with arvalid and arready,
control logic and when the arid match bits are equivalent to the qos_override bit(s),
then the QoS for the read access is forced to minimum latency. For more
information, see Quality of Service on page 2-23.

A.2.2 Tie-offs

Table A-3 shows the tie-off signals.

Table A-3 Tie-off signals

Signal Type Source Description

a_gt_m_sync Input Tie-off When aresetn is deasserted, the state of this signal sets the value of the
clock_cfg [1] bit in the memory_cfg2 Register. See Memory
Configuration 2 Register on page 3-30.
Set this signal HIGH if aclk is greater than mclk and is synchronous.

cke_init Input Tie-off When aresetn is deasserted, the state of this signal sets the value of the
cke_init bit in the memory_cfg2 Register. See Memory Configuration 2
Register on page 3-30.
This signal is only available when the DMC is configured to provide a
legacy pad interface.

dqm_init Input Tie-off When aresetn is deasserted, the state of this signal sets the value of the
dqm_init bit in the memory_cfg2 Register. See Memory Configuration 2
Register on page 3-30.
This signal is only available when the DMC is configured to provide a
legacy pad interface.

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Table A-3 Tie-off signals (continued)

Signal Type Source Description

memory_width[1:0] Input Tie-off When aresetn is deasserted, the state of this signal sets the value of the
memory_width field in the memory_cfg2 Register. See Memory
Configuration 2 Register on page 3-30.

memory_type[2:0] Input Tie-off When aresetn is deasserted, the state of this signal sets the value of the
memory_protocol field in the memory_cfg2 Register. See Memory
Configuration 2 Register on page 3-30.
You must set this signal to select a memory protocol that the configured
DMC supports. The memory_protocol field shows the possible bit
encodings, see Memory Configuration 2 Register on page 3-30.

read_delay[1:0] Input Tie-off When aresetn is deasserted, the state of this signal sets the value of the
read_delay field in the memory_cfg2 Register. See Memory
Configuration 2 Register on page 3-30.

sync Input Tie-off When aresetn is deasserted, the state of this signal sets the value of the
clock_cfg [0] bit in the memory_cfg2 Register. See Memory
Configuration 2 Register on page 3-30.
Set this signal HIGH if aclk is synchronous to mclk.
Set this signal LOW if aclk is asynchronous to mclk.

use_ebi a Input Tie-off Set this signal HIGH if the memory interface of the DMC connects to a
PrimeCell External Bus Interface (PL220).
a. This signal is not present when the DMC is configured to implement a DFI pad interface.

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A.2.3 User signals

These are general purpose I/O signals that you can use to control external devices, such
as a Delay-Locked Loop (DLL). Table A-4 shows the user signals.

Table A-4 User signals

Source or
Signal Type Description
destination

user_config[USER_CONFIG_WIDTH–1:0] Output External General purpose control signals that you

control logic program using the User Config Register on
page 3-41

user_config1[USER_CONFIG_WIDTH–1:0] Output External General purpose control signals that you

control logic program using the User Config1 Register
on page 3-42

user_status[USER_STATUS_WIDTH–1:0] Input External General purpose input signals that are read
control logic using the User Status Register on
page 3-40

A.2.4 Scan test

Table A-5 shows the scan test signals.

Table A-5 Scan test signals

Signal Type Source Description

dft_en_clk_out Input Tie-off This signal is used for Automatic Test Pattern Generator (ATPG) testing only

rst_bypass Input Tie-off This signal is used for ATPG testing only

se Input Tie-off This signal enables scan mode

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A.3 AXI signals

The following sections list the AXI signals:
• Write address channel signals
• Write data channel signals on page A-7
• Write response channel signals on page A-7
• Read address channel signals on page A-8
• Read data channel signals on page A-9
• AXI low-power interface signals on page A-9.

A.3.1 Write address channel signals

Table A-6 shows the AXI write address channel signals.

Table A-6 Write address channel signals

Signal AMBA equivalent a

awaddr[31:0] AWADDR

awburst[1:0] AWBURST[1:0]

awcache[3:0] b AWCACHE[3:0]

awid[AID_WIDTH–1:0] c AWID[AID_WIDTH–1:0]

awlen[3:0] AWLEN[3:0]

awlock[1:0] AWLOCK[1:0]

awprot[2:0] b AWPROT[2:0]

awready AWREADY

awsize[2:0] AWSIZE[2:0]

awvalid AWVALID

a. For a description of these signals, see the AMBA AXI Protocol v1.0 Specification.
b. The DMC ignores any information that it receives on these signals.
c. The value of AID_WIDTH is set during configuration of the DMC.

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A.3.2 Write data channel signals

Table A-7 shows the AXI write data channel signals.

Table A-7 Write data channel signals

Signal AMBA equivalent a

wdata[AXI_DATA_MSB:0] b WDATA

wid[AID_WIDTH–1:0] b WID[AID_WIDTH-1:0]

wlast WLAST

wready WREADY

wstrb[AXI_STRB_MSB:0] b WSTRB

wvalid WVALID

a. For a description of these signals, see the AMBA AXI Protocol v1.0 Specification.
b. The value of AXI_DATA_MSB and AID_WIDTH are set during configuration
of the DMC. AXI_STRB_MSB=AXI_DATA_MSB÷8.

A.3.3 Write response channel signals

Table A-8 shows the AXI write response channel signals.

Table A-8 Write response channel signals

Signal AMBA equivalent a

bid[AID_WIDTH–1:0] b BID[AID_WIDTH-1:0]

bready BREADY

bresp[1:0] c BRESP[1:0]

bvalid BVALID

a. For a description of these signals, see the AMBA AXI Protocol v1.0 Specification.
b. The value of AID_WIDTH is set during configuration of the DMC.
c. The DMC ties bresp[1] LOW and therefore it only provides OKAY or EXOKAY
responses.

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A.3.4 Read address channel signals

Table A-9 shows the AXI read address channel signals.

Table A-9 Read address channel signals

Signal AMBA equivalent a

araddr[31:0] ARADDR[31:0]

arburst[1:0] ARBURST[1:0]

arcache[3:0] b ARCACHE[3:0]

arid[AID_WIDTH–1:0] c ARID[AID_WIDTH-1:0]

arlen[3:0] ARLEN[3:0]

arlock[1:0] ARLOCK[1:0]

arprot[2:0] b ARPROT[2:0]

arready ARREADY

arsize[2:0] ARSIZE[2:0]

arvalid ARVALID

a. For a description of these signals, see the AMBA AXI Protocol v1.0 Specification.
b. The DMC ignores any information that it receives on these signals.
c. The value of AID_WIDTH is set during configuration of the DMC.

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A.3.5 Read data channel signals

Table A-10 shows the AXI read data channel signals.

Table A-10 Read data channel signals

Signal AMBA equivalent a

rdata[AXI_DATA_MSB:0] b RDATA

rid[AID_WIDTH–1:0] b RID[AID_WIDTH-1:0]

rlast RLAST

rready c RREADY

rresp[1:0] d RRESP[1:0]

rvalid RVALID

a. For a description of these signals, see the AMBA AXI Protocol v1.0 Specification.
b. The value of AXI_DATA_MSB and AID_WIDTH are set during configuration of the DMC.
c. It is possible for refreshes to be missed if rready is held LOW for longer than one refresh
period, and the read data FIFO, command FIFO, and arbiter queue become full. An OVL error
is triggered if this occurs in simulation. Ensure that the device has a sufficiently high system
priority to prevent this.
d. The DMC ties rresp[1] LOW and therefore it only provides OKAY or EXOKAY responses.

A.3.6 AXI low-power interface signals

Table A-11 shows the low-power interface signals.

Table A-11 AXI low-power interface signals

Signal AMBA equivalent a

cactive CACTIVE

csysack CSYSACK

csysreq CSYSREQ

a. For a description of these signals, see the AMBA

AXI Protocol v1.0 Specification.

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A.4 APB signals

Table A-12 shows the APB signals.

Table A-12 APB interface signals

Signal AMBA equivalent a

paddr[31:0] b PADDR

penable PENABLE

prdata[31:0] PRDATA

pready PREADY

psel PSELx

pslverr c PSLVERR

pwdata[31:0] PWDATA

pwrite PWRITE
a. For a description of these signals, see the AMBA 3 APB Protocol Specification.
b. The DMC uses bits [11:2]. It ignores bits [31:12] and bits [1:0].
c. The DMC ties pslverr LOW.

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A.5 Pad interface signals

The DMC can implement either a legacy pad interface or a DFI pad interface. The
choice of pad interface is set during configuration of the DMC.

The following sections describe:

• Legacy pad interface
• DFI pad interface on page A-12.

A.5.1 Legacy pad interface

Table A-13 shows the legacy pad interface signals.

Table A-13 Legacy pad interface signals

Source or
Signal Type Description
destination

add[15:0] Output External memory Address bus

ap Output External memory Auto precharge bit

ba[1:0] Output External memory Bank select

cas_n Output External memory Column address strobe

cke[MEMORY_CHIPS–1:0] a b Output External memory Clock enable

clk_out[MEMORY_CHIPS–1:0] b Output External memory Memory clock

cs_n[MEMORY_CHIPS–1:0] b Output External memory Chip select

data_en Output External memory Data direction enable

dqm[MEMORY_BYTES–1:0] c Output External memory Data bus mask bits

dqs_in_<n> Input External memory Data strobe in, DDR only

dq_in[MEMWIDTH–1:0] d Input External memory Data bus input

dqs_in_n_<n> Input External memory Data strobe in bar, DDR only

dqs_out_<n> Output External memory Data strobe out, DDR only

dq_out[MEMWIDTH–1:0] d Output External memory Data bus output

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Table A-13 Legacy pad interface signals (continued)

Source or
Signal Type Description
destination

fbclk_in Input External memory Fedback clock

ras_n Output External memory Row address strobe

we_n Output External memory Write enable

a. cke can be configured to be a global cke for all memory devices or a local cke for each memory device.
b. MEMORY_CHIPS is the number of chip selects and is set during configuration of the DMC.
c. MEMORY_BYTES is the data width of the external memory bus in bytes and is set during
configuration of the DMC.
d. MEMWIDTH is the data width of the external memory bus in bits and is set during configuration of
the DMC.

A.5.2 DFI pad interface

Table A-14 on page A-13 shows the DFI pad interface signals. For a description of
these signals, see the DDR PHY Interface (DFI) Specification .

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Table A-14 DFI pad interface signals

Signal Type Source or destination

dfi_address[15:0] Output PHY device

dfi_bank[1:0] Output

dfi_cas_n Output

dfi_cke[MEMORY_CHIPS–1:0]a Output

dfi_cs_n[MEMORY_CHIPS–1:0] a Output

dfi_dram_clk_disable[MEMORY_CHIPS–1:0] b Output

dfi_init_complete Input

dfi_phyupd_ack Output

dfi_phyupd_req Input

dfi_phyupd_type[1:0] Input

dfi_ras_n Output

dfi_rddata_en[MEMORY_BYTES–1:0] b Output

dfi_rddata[MEMWIDTH–1:0] c Input

dfi_rddata_valid d Input

dfi_we_n Output

dfi_wrdata_en[MEMORY_BYTES–1:0] b Output

dfi_wrdata[MEMWIDTH–1:0] c Output

dfi_wrdata_mask[MEMORY_BYTES–1:0] b Output

a. MEMORY_CHIPS is the number of chip selects and is set during configuration of the DMC.
b. MEMORY_BYTES is the data width of the external memory bus in bytes and is set during
configuration of the DMC.
c. MEMWIDTH is the data width of the external memory bus in bits and is set during configuration of
the DMC.

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A.6 EBI signals

Table A-15 shows the External Bus Interface (EBI) signals.

Note
The EBI is only present when the DMC is configured to implement a legacy pad
interface.

Table A-15 EBI signals

Source or
Signal Type Description
destination

ebibackoff Input DMC External memory bus access backoff. The EBI backoff signal goes HIGH when
the PrimeCell EBI (PL220) wants to remove the DMC from the memory bus so
that another memory controller can be granted the memory bus.

ebigrant Input DMC External memory bus grant. This signal goes HIGH when the EBI (PL220)
grants the external memory bus to the DMC.

ebireq Output External External memory bus request. The DMC sets this signal HIGH when it requests
access to the memory bus.

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Appendix B
Revisions

This appendix describes the technical changes between released issues of this book.

Table B-1 Differences between issue F and issue G

Change Location Affects

Added the DDR PHY Interface (DFI) pad interface feature Throughout book r4p0
including the DFI signals and registers

Updated description of the supported memory data bus Supported memory widths on page 1-4 All revisions
widths

Removed support for 64-bit SDRAMs Table 1-1 on page 1-5 r4p0

Updated AXI slave interface attributes and added read AXI slave interface attributes on All revisions
interleave depth page 2-12

Updated bus widths for arprot, awprot, arcache, and • Figure 2-2 on page 2-4 All revisions
awcache • AXI signals on page A-6

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Table B-1 Differences between issue F and issue G (continued)

Change Location Affects

Added user_config1 signals and user_config1 Register • Miscellaneous signals on r4p0

page 2-18
• User Config1 Register on
page 3-42
• User signals on page A-5

Added configurable bus width for the user_status, Throughout book r4p0
user_config, and user_config1 signals

Added configurable bus width for the arid, awid, bid, rid, Throughout book r4p0
and wid signals

Added early write response feature Early BRESP on page 2-13 r4p0

Added Read After Write hazard Hazard detection on page 2-22 r4p0

Updated description of system state 11 Recommended power states on All revisions

page 2-39

Updated listing of the dynamic low-power modes operation Table 2-7 on page 2-43 All revisions
and removed the illegal bit combinations

Removed restriction of issuing the NOP command when the • Controller management r4p0
controller includes the NVM plug-in operations on page 2-18
• Deep Power-Down on page 2-46
• Table 3-6 on page 3-14

Support for moving all of the memory devices to the deep Deep Power-Down on page 2-46 r4p0
power-down mode

Added a new section TrustZone Support for DMC TrustZone technology support on r4p0
page 2-48

Added supported bit, or field, values to the timing registers Chapter 3 Programmers Model All revisions

Updated the function description for fp_time bit Table 3-7 on page 3-16 r4p0

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 Revisions

Table B-1 Differences between issue F and issue G (continued)

Change Location Affects

Field names changed as follows: Memory Controller Status Register on r2p0

• from memory_banks[1:0] to banks_bit[1:0] page 3-9
• from memory_type to memory_support
• from memory_width to max_memory_width

Added the combined SDR-DDR-LPDDR option to the r2p0

memory_support field

Updated description of the max_memory_width field All revisions

Updated description of the sr_enable, fp_time, and Memory Configuration Register on All revisions
fp_enable bits page 3-15

Removed restriction of enabling the sr_enable and r4p0

stop_mem_clock bits at the same time

Updated description of the cas_half_cycle bit CAS Latency Register on page 3-19 All revisions

Updated description of the memory_width field Memory Configuration 2 Register on r2p0

page 3-30
memory_type field name changed to memory_protocol

Added the combined SDR-DDR-LPDDR option to the

memory_protocol field

a_gt_m_sync bit and sync bit changed to clock_cfg field

Updated description of the memory_cfg3 Register Memory Configuration 3 Register on r2p0

page 3-34

Added the read_transfer_delay Register Read Transfer Delay Register on r4p0

page 3-37

brc_n_rbc field name changed to address_fmt Chip Configuration Register on r3p0

page 3-39

Added the feature_ctrl Register Feature Control Register on page 3-43 r4p0

Updated the most significant byte of the conceptual • Figure 3-37 on page 3-44 All revisions
peripheral ID register • Table 3-34 on page 3-44

Added requirement to set cactive and csysack HIGH when Integration Configuration Register on All revisions
the controller exits integration test mode page 4-3

Updated register description and added an _int suffix to each Integration Outputs Register on page 4-6 All revisions
bit name

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Table B-1 Differences between issue F and issue G (continued)

Change Location Affects

Replaced the old Device Driver section with new content Chapter 5 Device Driver r4p0

Updated description of the tie-off signals Tie-offs on page A-3 All revisions

Added note about using EBI when DFI is implemented EBI signals on page A-14 r4p0

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Glossary

This glossary describes some of the terms used in technical documents from ARM.

Advanced eXtensible Interface (AXI)

A bus protocol that supports separate address/control and data phases, unaligned data
transfers using byte strobes, burst-based transactions with only start address issued,
separate read and write data channels to enable low-cost DMA, ability to issue multiple
outstanding addresses, out-of-order transaction completion, and easy addition of
register stages to provide timing closure.

The AXI protocol also includes optional extensions to cover signaling for low-power
operation.

AXI is targeted at high performance, high clock frequency system designs and includes
a number of features that make it very suitable for high speed sub-micron interconnect.
Advanced Microcontroller Bus Architecture (AMBA)
A family of protocol specifications that describe a strategy for the interconnect. AMBA
is the ARM open standard for on-chip buses. It is an on-chip bus specification that
describes a strategy for the interconnection and management of functional blocks that
make up a System-on-Chip (SoC). It aids in the development of embedded processors
with one or more CPUs or signal processors and multiple peripherals. AMBA
complements a reusable design methodology by defining a common backbone for SoC
modules.

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Advanced Peripheral Bus (APB)

A simpler bus protocol than AXI and AHB. It is designed for use with ancillary or
general-purpose peripherals such as timers, interrupt controllers, UARTs, and I/O ports.
Connection to the main system bus is through a system-to-peripheral bus bridge that
helps to reduce system power consumption.
AMBA See Advanced Microcontroller Bus Architecture.
APB See Advanced Peripheral Bus.
ATPG See Automatic Test Pattern Generation.
Automatic Test Pattern Generation (ATPG)
The process of automatically generating manufacturing test vectors for an ASIC design,
using a specialized software tool.
AXI See Advanced eXtensible Interface.
AXI channel order and interfaces
The block diagram shows:
• the order in which AXI channel signals are described
• the master and slave interface conventions for AXI components.
Write address channel (AW) Write address channel (AW)
Write data channel (W) Write data channel (W)
AXI AXI AXI
Write response channel (B) Write response channel (B)
master interconnect slave
Read address channel (AR) Read address channel (AR)
Read data channel (R) Read data channel (R)

AXI master AXI slave AXI master AXI slave

interface interface interface interface

AXI terminology The following AXI terms are general. They apply to both masters and slaves:

Active read transaction

A transaction for which the read address has transferred, but the last read
data has not yet transferred.

Active transfer
A transfer for which the xVALID1 handshake has asserted, but for which
xREADY has not yet asserted.

Active write transaction

A transaction for which the write address or leading write data has
transferred, but the write response has not yet transferred.

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Completed transfer
A transfer for which the xVALID/xREADY handshake is complete.

Payload The non-handshake signals in a transfer.

Transaction An entire burst of transfers, comprising an address, one or more data

transfers and a response transfer (writes only).

Transmit An initiator driving the payload and asserting the relevant xVALID
signal.

Transfer A single exchange of information. That is, with one xVALID/xREADY

handshake.

The following AXI terms are master interface attributes. To obtain optimum
performance, they must be specified for all components with an AXI master interface:

Combined issuing capability

The maximum number of active transactions that a master interface can
generate. It is specified for master interfaces that use combined storage
for active write and read transactions. If not specified then it is assumed
to be equal to the sum of the write and read issuing capabilities.

Read ID capability
The maximum number of different ARID values that a master interface
can generate for all active read transactions at any one time.

Read ID width
The number of bits in the ARID bus.

Read issuing capability

The maximum number of active read transactions that a master interface
can generate.

Write ID capability
The maximum number of different AWID values that a master interface
can generate for all active write transactions at any one time.

1. The letter x in the signal name denotes an AXI channel as follows:

AW Write address channel.
W Write data channel.
B Write response channel.
AR Read address channel.
R Read data channel.

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Write ID width
The number of bits in the AWID and WID buses.

Write interleave capability

The number of active write transactions for which the master interface is
capable of transmitting data. This is counted from the earliest transaction.

Write issuing capability

The maximum number of active write transactions that a master interface
can generate.

The following AXI terms are slave interface attributes. To obtain optimum
performance, they must be specified for all components with an AXI slave interface:

Combined acceptance capability

The maximum number of active transactions that a slave interface can
accept. It is specified for slave interfaces that use combined storage for
active write and read transactions. If not specified then it is assumed to
be equal to the sum of the write and read acceptance capabilities.

Read acceptance capability

The maximum number of active read transactions that a slave interface
can accept.

Read data reordering depth

The number of active read transactions for which a slave interface can
transmit data. This is counted from the earliest transaction.

Write acceptance capability

The maximum number of active write transactions that a slave interface
can accept.

Write interleave depth

The number of active write transactions for which the slave interface can
receive data. This is counted from the earliest transaction.
Beat Alternative word for an individual transfer within a burst. For example, an INCR4 burst
comprises four beats.

See also Burst.

Big-endian Byte ordering scheme in which bytes of decreasing significance in a data word are
stored at increasing addresses in memory.

See also Little-endian and Endianness.

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Burst A group of transfers to consecutive addresses. Because the addresses are consecutive,
there is no requirement to supply an address for any of the transfers after the first one.
This increases the speed at which the group of transfers can occur. Bursts over AMBA
are controlled using signals to indicate the length of the burst and how the addresses are
incremented.

See also Beat.

Clock gating Gating a clock signal for a macrocell with a control signal and using the modified clock
that results to control the operating state of the macrocell.
Doubleword A 64-bit data item. The contents are taken as being an unsigned integer unless otherwise
stated.
Endianness Byte ordering. The scheme that determines the order that successive bytes of a data
word are stored in memory. An aspect of the system’s memory mapping.

See also Little-endian and Big-endian.

Halfword A 16-bit data item.
Little-endian Byte ordering scheme in which bytes of increasing significance in a data word are
stored at increasing addresses in memory.

See also Big-endian and Endianness.

Macrocell A complex logic block with a defined interface and behavior. A typical VLSI system
comprises several macrocells (such as a processor, an ETM, and a memory block) plus
application-specific logic.
Reserved A field in a control register or instruction format is reserved if the field is to be defined
by the implementation, or produces Unpredictable results if the contents of the field are
not zero. These fields are reserved for use in future extensions of the architecture or are
implementation-specific. All reserved bits not used by the implementation must be
written as 0 and read as 0.
Unaligned A data item stored at an address that is not divisible by the number of bytes that defines
the data size is said to be unaligned. For example, a word stored at an address that is not
divisible by four.
Unpredictable For reads, the data returned when reading from this location is unpredictable. It can
have any value. For writes, writing to this location causes unpredictable behavior, or an
unpredictable change in device configuration. Unpredictable instructions must not halt
or hang the processor, or any part of the system.
Word A 32-bit data item.

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