TOP246YN

®
TOP242-249
TOPSwitch®-GX Family
Extended Power, Design Flexible,
®
EcoSmart , Integrated Off-line Switcher
Product Highlights
+
Lower System Cost, High Design Flexibility AC DC
• Extended power range to 250 W IN OUT
-
• Features eliminate or reduce cost of external components
• Fully integrated soft-start for minimum stress/overshoot
• Externally programmable accurate current limit D L
• Wider duty cycle for more power, smaller input capacitor CONTROL
• Separate line sense and current limit pins on Y/R packages TOPSwitch-GX C
• Line under-voltage (UV) detection: no turn off glitches
• Line overvoltage (OV) shutdown extends line surge limit S X F
• Line feed forward with maximum duty cycle (DCMAX)

reduction rejects line ripple and limits DCMAX at high line PI-2632-060200
• Frequency jittering reduces EMI and EMI filtering costs
Figure 1. Typical Flyback Application.
• Regulates to zero load without dummy loading
• 132 kHz frequency reduces transformer/power supply size
• Half frequency option in Y/R packages for video applications OUTPUT POWER TABLE
• Hysteretic thermal shutdown for automatic fault recovery
230 VAC ±15%4 85-265 VAC
• Large thermal hysteresis prevents PC board overheating
PRODUCT3 Open Open
Adapter1 Adapter1
Frame2 Frame2
EcoSmart - Energy Efficient
• Extremely low consumption in remote off mode TOP242 P or G 9W 15 W 6.5 W 10 W
(80 mW @ 110 VAC, 160 mW @ 230 VAC) TOP242 R 10 W 22 W 7W 14 W
• Frequency lowered with load for high standby efficiency TOP242 Y 10 W 22 W 7W 14 W
• Allows shutdown/wake-up via LAN/input port TOP243 P or G 13 W 25 W 9W 15 W
TOP243 R 20 W 43 W 15 W 23 W
Description TOP243 Y 13 W 45 W 15 W 30 W
TOPSwitch-GX uses the same proven topology as TOPSwitch, TOP244 P or G 16 W 30 W 11 W 20 W
cost effectively integrating the high voltage power MOSFET, TOP244 R 28 W 52 W 18 W 28 W
PWM control, fault protection and other control circuitry onto TOP244 Y 30 W 65 W 20 W 45 W
a single CMOS chip. Many new functions are integrated to TOP245 R 33 W 58 W 20 W 32 W
reduce system cost and improve design flexibility, performance TOP245 Y 40 W 85 W 26 W 60 W
and energy efficiency.
TOP246 R 37 W 65 W 24 W 36 W
TOP246 Y 60 W 125 W 40 W 90 W
Depending on package type, the TOPSwitch-GX family has
either 1 or 3 additional pins over the standard DRAIN, SOURCE TOP247 R 41 W 73 W 26 W 43 W
and CONTROL terminals. allowing the following functions: TOP247 Y 85 W 165 W 55 W 125 W
line sensing (OV/UV, line feedforward/DC max reduction), TOP248 R 43 W 78 W 28 W 48 W
accurate externally set current limit, remote on/off, and TOP248 Y 105 W 205 W 70 W 155 W
synchronization to an external lower frequency and frequency TOP249 R 45 W 82 W 30 W 52 W
selection (132 kHz/66 kHz). TOP249 Y 120 W 250 W 80 W 180 W
All package types provide the following transparent features: Table 1. Notes: 1. Typical continuous power in a non-ventilated
Soft-start, 132 kHz switching frequency (automatically reduced enclosed adapter measured at 50 °C ambient. Assumes 1 sq. in. of
at light load), frequency jittering for lower EMI, wider DCMAX, 2 oz. copper heat sink area for R package. 2. Maximum practical
hysteretic thermal shutdown and larger creepage packages. In continuous power in an open frame design at 50 °C ambient. See
Key Applications for detailed conditions. Assumes 3 sq. in. of 2 oz.
addition, all critical parameters (i.e. current limit, frequency, copper heat sink area for R package. 3. See Part Ordering Information.
PWM gain) have tighter temperature and absolute tolerance, to 4. 230 VAC or 100/115 VAC with doubler.
simplify design and optimize system cost.
July 2001
TOP242-249
Section List
Functional Block Diagram ......................................................................................................................................... 3
Pin Functional Description ........................................................................................................................................ 4
TOPSwitch-GX Family Functional Description ........................................................................................................ 5
CONTROL (C) Pin Operation ................................................................................................................................. 6
Oscillator and Switching Frequency ....................................................................................................................... 6
Pulse Width Modulator and Maximum Duty Cycle ................................................................................................. 7
Light Load Frequency Reduction ............................................................................................................................ 7
Error Amplifier ......................................................................................................................................................... 7
On-chip Current Limit with External Programmability ............................................................................................. 7
Line Under-Voltage Detection (UV) ........................................................................................................................ 8
Line Overvoltage Shutdown (OV) ........................................................................................................................... 8
Line Feed Forward with DCMAX Reduction .............................................................................................................. 8
Remote ON/OFF and Synchronization ................................................................................................................... 9
Soft-Start ................................................................................................................................................................ 9
Shutdown/Auto-Restart .......................................................................................................................................... 9
Hysteretic Over-Temperature Protection ................................................................................................................ 9
Bandgap Reference ................................................................................................................................................ 9
High-Voltage Bias Current Source ........................................................................................................................ 10
Using Feature Pins .................................................................................................................................................... 11
FREQUENCY (F) Pin Operation........................................................................................................................... 11
LINE-SENSE (L) Pin Operation ............................................................................................................................ 11
EXTERNAL CURRENT LIMIT (X) Pin Operation ................................................................................................. 11
MULTI-FUNCTION (M) Pin Operation .................................................................................................................. 12
Typical Uses of FREQUENCY (F) Pin ...................................................................................................................... 15
Typical Uses of LINE-SENSE (L) and EXTERNAL CURRENT LIMIT (X) Pins ....................................................... 16
Typical Uses of MULTI-FUNCTION (M) Pin ............................................................................................................. 19
Application Examples ............................................................................................................................................... 21
A High Efficiency, 30 W, Universal Input Power Supply ........................................................................................ 21
A High Efficiency, Enclosed, 70 W, Universal Adapter Supply.............................................................................. 22
A High Efficiency, 250 W, 250 - 380 VDC Input Power Supply ............................................................................. 23
Multiple Output, 60 W, 185 - 265 VAC Input Power Supply .................................................................................. 24
Processor Controlled Supply Turn On/Off ............................................................................................................ 25
Key Application Considerations .............................................................................................................................. 27
TOPSwitch-II vs. TOPSwitch-GX .......................................................................................................................... 27
TOPSwitch-FX vs. TOPSwitch-GX ....................................................................................................................... 28
TOPSwitch-GX Design Considerations ................................................................................................................ 29
TOPSwitch-GX Layout Considerations................................................................................................................. 31
Quick Design Checklist ......................................................................................................................................... 31
Design Tools ......................................................................................................................................................... 33
Product Specifications and Test Conditions .......................................................................................................... 34
Typical Performance Characteristics ...................................................................................................................... 41
Part Ordering Information ........................................................................................................................................ 45
Package Outlines ...................................................................................................................................................... 45
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TOP242-249
VC
0
CONTROL (C) DRAIN (D)
ZC INTERNAL
1 SUPPLY
SHUNT REGULATOR/
ERROR AMPLIFIER +
SOFT START
- 5.8 V
4.8 V -
+ 5.8 V
INTERNAL UV
IFB COMPARATOR
VI (LIMIT)
CURRENT
LIMIT SOFT
ADJUST START -
ON/OFF ÷8
+
VBG + VT SHUTDOWN/
AUTO-RESTART CURRENT LIMIT
COMPARATOR
EXTERNAL
CURRENT LIMIT (X) HYSTERETIC
STOP LOGIC THERMAL
SHUTDOWN
LINE-SENSE (L) 1V
CONTROLLED
VBG TURN-ON
STOP SOFT- GATE DRIVER
OV/UV START
LINE DMAX
SENSE DCMAX DCMAX
CLOCK
S Q
HALF SAW - LEADING
FREQ. EDGE
R
FREQUENCY (F) + BLANKING
OSCILLATOR WITH JITTER
PWM
COMPARATOR
LIGHT LOAD
FREQUENCY
RE
REDUCTION
SOURCE (S)
PI-2639-060600
PI-2639-060600
Figure 2a. Functional Block Diagram (Y or R Package).
VC
0
CONTROL (C) DRAIN (D)
ZC INTERNAL
1 SUPPLY
SHUNT REGULATOR/
ERROR AMPLIFIER +
SOFT START
- 5.8 V
4.8 V -
+ 5.8 V
INTERNAL UV
IFB COMPARATOR
VI (LIMIT)
CURRENT
LIMIT SOFT
START -
ADJUST
ON/OFF ÷8
+
SHUTDOWN/
AUTO-RESTART CURRENT LIMIT
VBG + VT COMPARATOR
STOP LOGIC HYSTERETIC

MULTI-
FUNCTION (M) THERMAL
SHUTDOWN
VBG CONTROLLED
TURN-ON
STOP SOFT- GATE DRIVER
OV/UV START
LINE DMAX
SENSE DCMAX DCMAX
CLOCK
S Q
SAW - LEADING
R EDGE
+ BLANKING
OSCILLATOR WITH JITTER
PWM
COMPARATOR
LIGHT LOAD
FREQUENCY
RE
REDUCTION
SOURCE (S)
PI-2631-061200
PI-2641-061200
Figure 2b. Functional Block Diagram (P or G Package).
August 8, 2000 E
7/01 3
TOP242-249
Pin Functional Description connected to SOURCE pin and 66 kHz if connected to

CONTROL pin. The switching frequency is internally set for
DRAIN (D) Pin: fixed 132 kHz operation in P and G packages.
High voltage power MOSFET drain output. The internal start-
up bias current is drawn from this pin through a switched high- SOURCE (S) Pin:
voltage current source. Internal current limit sense point for Output MOSFET source connection for high voltage power
drain current. return. Primary side control circuit common and reference point.
CONTROL (C) Pin: VUV = IUV x RLS

Error amplifier and feedback current input pin for duty cycle +
VOV = IOV x RLS
control. Internal shunt regulator connection to provide internal
For RLS = 2 MΩ
bias current during normal operation. It is also used as the RLS 2 MΩ
VUV = 100 VDC
connection point for the supply bypass and auto-restart/ VOV = 450 VDC
compensation capacitor. DC DCMAX@100 VDC = 78%
D L
Input DCMAX@375 VDC = 38%
Voltage CONTROL
LINE-SENSE (L) Pin: (Y or R package only) C
Input pin for OV, UV, line feed forward with DCMAX reduction, For RIL = 12 kΩ
remote ON/OFF and synchronization. A connection to SOURCE S X ILIMIT = 69%
pin disables all functions on this pin. RIL
See fig. 55 for other
12 kΩ resistor values (RIL)
- to select different ILIMIT
EXTERNAL CURRENT LIMIT (X) Pin: (Y or R package only) values PI-2629-040501
Input pin for external current limit adjustment, remote
ON/OFF, and synchronization. A connection to SOURCE pin Figure 4. Y/R Package Line Sense and Externally Set Current
Limit.
disables all functions on this pin.
MULTI-FUNCTION (M) Pin: (P or G package only)

+
This pin combines the functions of the LINE-SENSE (L) and VUV = IUV x RLS
EXTERNAL CURRENT LIMIT (X) pins of the Y package into VOV = IOV x RLS
one pin. Input pin for OV, UV, line feed forward with DCMAX
RLS 2 MΩ For RLS = 2 MΩ
reduction, external current limit adjustment, remote ON/OFF VUV = 100 VDC
and synchronization. A connection to SOURCE pin disables all DC VOV = 450 VDC
Input
functions on this pin and makes TOPSwitch-GX operate in
Voltage DCMAX@100 VDC = 78%
simple three terminal mode (like TOPSwitch-II). D M DCMAX@375 VDC = 38%
CONTROL
C
FREQUENCY (F) Pin: (Y or R package only)
Input pin for selecting switching frequency: 132 kHz if
S
-
Y Package (TO-220-7C) PI-2509-040501
Tab Internally 7D Figure 5. P/G Package Line Sense.

Connected to 5F
SOURCE Pin 4S
3X
2L +
1C
For RIL = 12 kΩ
R Package ILIMIT = 69%
(TO-263-7C) For RIL = 25 kΩ
P Package (DIP-8B) ILIMIT = 43%
G Package (SMD-8B) DC
Input
resistor values (RIL)
M 1 8 S Voltage
to select different
D M
ILIMIT values
S 2 7 S CONTROL
RIL C
S 3
S
C 4 5 D -
123 4 5 7
PI-2517-040501
CL X S F D PI-2724-033001
Figure 3. Pin Configuration (top view). Figure 6. P/G Package Externally Set Current Limit.
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TOP242-249
TOPSwitch-GX Family Functional Description

Like TOPSwitch, TOPSwitch-GX is an integrated switched Auto-restart
mode power supply chip that converts a current at the control ICD1 IB
input to a duty cycle at the open drain output of a high voltage
I = 125 µA
L
power MOSFET. During normal operation the duty cycle of the
132
power MOSFET decreases linearly with increasing CONTROL
Frequency (kHz)
pin current as shown in Figure 7. IL < IL(DC)
I = 190 µA
L
In addition to the three terminal TOPSwitch features, such as the

high voltage start-up, the cycle-by-cycle current limiting, loop
compensation circuitry, auto-restart, thermal shutdown, the 30
TOPSwitch-GX incorporates many additional functions that
reduce system cost, increase power supply performance and
design flexibility. A patented high voltage CMOS technology IC (mA)
allows both the high voltage power MOSFET and all the low
voltage control circuitry to be cost effectively integrated onto a
single monolithic chip. Auto-restart
ICD1 IB
Three terminals, FREQUENCY, LINE-SENSE, and
EXTERNAL CURRENT LIMIT (available in Y or R package) 78
Slope = PWM Gain
or one terminal MULTI-FUNCTION (available in P or G
Duty Cycle (%)
Package) have been added to implement some of the new
functions. These terminals can be connected to the SOURCE IL = 125 µA
pin to operate the TOPSwitch-GX in a TOPSwitch-like three 38
terminal mode. However, even in this three terminal mode, the IL < IL(DC)
TOPSwitch-GX offers many new transparent features that do IL = 190 µA

not require any external components: 10
TOP242/5 1.6 2.0 5.2 6.0

1. A fully integrated 10 ms soft-start limits peak currents and TOP246/9 2.2 2.6 5.8 6.6
voltages during start-up and dramatically reduces or IC (mA)
eliminates output overshoot in most applications. Note: For P and G packages IL is replaced with IM.
2. DCMAX of 78% allows smaller input storage capacitor, lower PI-2633-060500
input voltage requirement and/or higher power capability.
3. Frequency reduction at light loads lowers the switching Figure 7. Relationship of Duty Cycle and Frequency to CONTROL
Pin Current.
losses and maintains good cross regulation in multiple
output supplies. The pin can also be used as a remote ON/OFF and a
4. Higher switching frequency of 132 kHz reduces the synchronization input.
transformer size with no noticeable impact on EMI.
5. Frequency jittering reduces EMI. The EXTERNAL CURRENT LIMIT (X) pin is usually used to
6. Hysteretic over-temperature shutdown ensures automatic reduce the current limit externally to a value close to the operating
recovery from thermal fault. Large hysteresis prevents circuit peak current, by connecting the pin to SOURCE through a
board overheating. resistor. This pin can also be used as a remote ON/OFF and a
7. Packages with omitted pins and lead forming provide large synchronization input in both modes. See Table 2 and Figure 11.
drain creepage distance.
8. Tighter absolute tolerances and smaller temperature vari- For the P or G packages the LINE-SENSE and EXTERNAL
ations on switching frequency, current limit and PWM gain. CURRENT LIMIT pin functions are combined on one MULTI-
FUNCTION (M) pin. However, some of the functions become
The LINE-SENSE (L) pin is usually used for line sensing by mutually exclusive as shown in Table 3.
connecting a resistor from this pin to the rectified DC high
voltage bus to implement line overvoltage (OV), under-voltage The FREQUENCY (F) pin in the Y or R package sets the
(UV) and line feed forward with DCMAX reduction. In this switching frequency to the default value of 132 kHz when
mode, the value of the resistor determines the OV/UV thresholds connected to SOURCE pin. A half frequency option of 66 kHz
and the DCMAX is reduced linearly starting from a line voltage can be chosen by connecting this pin to CONTROL pin instead.
above the under-voltage threshold. See Table 2 and Figure 11. Leaving this pin open is not recommended.
August 8, 2000 E
7/01 5
TOP242-249
CONTROL (C) Pin Operation in excess of the consumption of the chip is shunted to SOURCE
The CONTROL pin is a low impedance node that is capable of through resistor RE as shown in Figure 2. This current flowing
receiving a combined supply and feedback current. During through RE controls the duty cycle of the power MOSFET to
normal operation, a shunt regulator is used to separate the provide closed loop regulation. The shunt regulator has a finite
feedback signal from the supply current. CONTROL pin low output impedance ZC that sets the gain of the error amplifier
voltage VC is the supply voltage for the control circuitry when used in a primary feedback configuration. The dynamic
including the MOSFET gate driver. An external bypass capacitor impedance ZC of the CONTROL pin together with the external
closely connected between the CONTROL and SOURCE pins CONTROL pin capacitance sets the dominant pole for the
is required to supply the instantaneous gate drive current. The control loop.
total amount of capacitance connected to this pin also sets the
auto-restart timing as well as control loop compensation. When a fault condition such as an open loop or shorted output
prevents the flow of an external current into the CONTROL pin,
When rectified DC high voltage is applied to the DRAIN pin the capacitor on the CONTROL pin discharges towards 4.8 V.
during start-up, the MOSFET is initially off, and the CONTROL At 4.8 V, auto-restart is activated which turns the output
pin capacitor is charged through a switched high voltage current MOSFET off and puts the control circuitry in a low current
source connected internally between the DRAIN and CONTROL standby mode. The high-voltage current source turns on and
pins. When the CONTROL pin voltage V C reaches charges the external capacitance again. A hysteretic internal
approximately 5.8 V, the control circuitry is activated and the supply under-voltage comparator keeps VC within a window of
soft-start begins. The soft-start circuit gradually increases the typically 4.8 to 5.8 V by turning the high-voltage current source
duty cycle of the MOSFET from zero to the maximum value on and off as shown in Figure 8. The auto-restart circuit has a
over approximately 10 ms. If no external feedback/supply divide-by-8 counter which prevents the output MOSFET from
current is fed into the CONTROL pin by the end of the soft-start, turning on again until eight discharge/charge cycles have elapsed.
the high voltage current source is turned off and the CONTROL This is accomplished by enabling the output MOSFET only
pin will start discharging in response to the supply current when the divide-by-8 counter reaches full count (S7). The
drawn by the control circuitry. If the power supply is designed counter effectively limits TOPSwitch-GX power dissipation by
properly, and no fault condition such as open loop or shorted reducing the auto-restart duty cycle to typically 4%. Auto-
output exists, the feedback loop will close, providing external restart mode continues until output voltage regulation is again
CONTROL pin current, before the CONTROL pin voltage has achieved through closure of the feedback loop.
had a chance to discharge to the lower threshold voltage of
approximately 4.8 V (internal supply under-voltage lockout Oscillator and Switching Frequency
threshold). When the externally fed current charges the The internal oscillator linearly charges and discharges an internal
CONTROL pin to the shunt regulator voltage of 5.8 V, current capacitance between two voltage levels to create a sawtooth
~
~
~
~
VUV
~
~
~
~
~
~
VLINE
0V
S7 S0 S1 S2 S6 S7 S0 S1 S2 S6 S7 S0 S1 S2 S6 S7 S7 5.8 V
~
~
~
~
~
~
VC 4.8 V
0V
~
~
~
~
VDRAIN
~
~
0V
VOUT
~
~
~
~
~
~
0V
1 2 3 2 4
Note: S0 through S7 are the output states of the auto-restart counter PI-2545-082299
Figure 8. Typical Waveforms for (1) Power Up (2) Normal Operation (3) Auto-restart (4) Power Down.
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6 7/01 August 8, 2000
TOP242-249
waveform for the pulse width modulator. This oscillator sets
PI-2550-092499
the pulse width modulator/current limit latch at the beginning 136 kHz
of each cycle. Switching
Frequency
128 kHz
The nominal switching frequency of 132 kHz was chosen to
minimize transformer size while keeping the fundamental EMI
4 ms
frequency below 150 kHz. The FREQUENCY pin (available
only in Y or R package), when shorted to the CONTROL pin,
lowers the switching frequency to 66 kHz (half frequency) VDRAIN
which may be preferable in some cases such as noise sensitive
video applications or a high efficiency standby mode. Otherwise, Time
the FREQUENCY pin should be connected to the SOURCE pin
for the default 132 kHz. Figure 9. Switching Frequency Jitter. (Idealized VDRAIN waveform)
To further reduce the EMI level, the switching frequency is cycle of 0% (refer to Figure 7). The minimum frequency is
jittered (frequency modulated) by approximately ±4 kHz at typically 30 kHz and 15 kHz for 132 kHz and 66 kHz operation,
250 Hz (typical) rate as shown in Figure 9. Figure 46 shows the respectively.
typical improvement of EMI measurements with frequency
jitter. This feature allows a power supply to operate at lower frequency
at light loads thus lowering the switching losses while
Pulse Width Modulator and Maximum Duty Cycle maintaining good cross regulation performance and low output
The pulse width modulator implements voltage mode control ripple.
by driving the output MOSFET with a duty cycle inversely
proportional to the current into the CONTROL pin that is in Error Amplifier
excess of the internal supply current of the chip (see Figure 7). The shunt regulator can also perform the function of an error
The excess current is the feedback error signal that appears amplifier in primary side feedback applications. The shunt
across RE (see Figure 2). This signal is filtered by an RC regulator voltage is accurately derived from a temperature-
network with a typical corner frequency of 7 kHz to reduce the compensated bandgap reference. The gain of the error amplifier
effect of switching noise in the chip supply current generated by is set by the CONTROL pin dynamic impedance. The
the MOSFET gate driver. The filtered error signal is compared CONTROL pin clamps external circuit signals to the VC
with the internal oscillator sawtooth waveform to generate the voltage level. The CONTROL pin current in excess of the
duty cycle waveform. As the control current increases, the duty supply current is separated by the shunt regulator and flows
cycle decreases. A clock signal from the oscillator sets a latch through RE as a voltage error signal.
which turns on the output MOSFET. The pulse width modulator
resets the latch, turning off the output MOSFET. Note that a On-chip Current Limit with External Programmability
minimum current must be driven into the CONTROL pin The cycle-by-cycle peak drain current limit circuit uses the
before the duty cycle begins to change. output MOSFET ON-resistance as a sense resistor. A current
limit comparator compares the output MOSFET on-state drain
The maximum duty cycle, DCMAX, is set at a default maximum to source voltage, VDS(ON) with a threshold voltage. High drain
value of 78% (typical). However, by connecting the LINE- current causes VDS(ON) to exceed the threshold voltage and turns
SENSE or MULTI-FUNCTION pin (depending on the package) the output MOSFET off until the start of the next clock cycle.
to the rectified DC high voltage bus through a resistor with The current limit comparator threshold voltage is temperature
appropriate value, the maximum duty cycle can be made to compensated to minimize the variation of the current limit due
decrease from 78% to 38% (typical) as shown in Figure 11 when to temperature related changes in RDS(ON) of the output MOSFET.
input line voltage increases (see line feed forward with DCMAX The default current limit of TOPSwitch-GX is preset internally.
reduction). However, with a resistor connected between EXTERNAL
CURRENT LIMIT (X) pin (Y or R package) or MULTI-
Light Load Frequency Reduction FUNCTION (M) pin (P or G package) and SOURCE pin,
The pulse width modulator duty cycle reduces as the load at the current limit can be programmed externally to a lower level
power supply output decreases. This reduction in duty cycle is between 30% and 100% of the default current limit. Please
proportional to the current flowing into the CONTROL pin. As refer to the graphs in the typical performance characteristics
the CONTROL pin current increases, the duty cycle decreases section for the selection of the resistor value. By setting current
linearly towards a duty cycle of 10%. Below 10% duty cycle, to limit low, a larger TOPSwitch-GX than necessary for the power
maintain high efficiency at light loads, the frequency is also required can be used to take advantage of the lower RDS(ON) for
reduced linearly until a minimum frequency is reached at a duty higher efficiency/smaller heat sinking requirements. With a
August 8, 2000 E
7/01 7
TOP242-249
second resistor connected between the EXTERNAL CURRENT 40% of the initial UV threshold to allow extended input voltage
LIMIT (X) pin (Y or R package) or MULTI-FUNCTION (M) operating range (UV low threshold). If the UV low threshold
pin (P or G package) and the rectified DC high voltage bus, the is reached during operation without the power supply losing
current limit is reduced with increasing line voltage, allowing regulation the device will turn off and stay off until UV (high
a true power limiting operation against line variation to be threshold) has been reached again. If the power supply loses
implemented. When using an RCD clamp, this power limiting regulation before reaching the UV low threshold, the device
technique reduces maximum clamp voltage at high line. This will enter auto-restart. At the end of each auto-restart cycle (S7),
allows for higher reflected voltage designs as well as reducing the UV comparator is enabled. If the UV high threshold is not
clamp dissipation. exceeded the MOSFET will be disabled during the next cycle (see
figure 8). The UV feature can be disabled independent of OV
The leading edge blanking circuit inhibits the current limit feature as shown in Figure 19 and 23.
comparator for a short time after the output MOSFET is turned
on. The leading edge blanking time has been set so that, if a Line Overvoltage Shutdown (OV)
power supply is designed properly, current spikes caused by The same resistor used for UV also sets an overvoltage threshold
primary-side capacitances and secondary-side rectifier reverse which, once exceeded, will force TOPSwitch-GX output into
recovery time should not cause premature termination of the off-state. The ratio of OV and UV thresholds is preset at 4.5 as
switching pulse. can be seen in Figure 11. When the MOSFET is off, the rectified
DC high voltage surge capability is increased to the voltage
The current limit is lower for a short period after the leading rating of the MOSFET (700 V), due to the absence of the
edge blanking time as shown in Figure 52. This is due to reflected voltage and leakage spikes on the drain. A small
dynamic characteristics of the MOSFET. To avoid triggering amount of hysteresis is provided on the OV threshold to prevent
the current limit in normal operation, the drain current waveform noise triggering. The OV feature can be disabled independent
should stay within the envelope shown. of the UV feature as shown in Figure 18 and 32.
Line Under-Voltage Detection (UV) Line Feed Forward with DCMAX Reduction
At power up, UV keeps TOPSwitch-GX off until the input line The same resistor used for UV and OV also implements line
voltage reaches the under voltage threshold. At power down, voltage feed forward which minimizes output line ripple and
UV prevents auto-restart attempts after the output goes out of reduces power supply output sensitivity to line transients. This
regulation. This eliminates power down glitches caused by the feed forward operation is illustrated in Figure 7 by the different
slow discharge of large input storage capacitor present in values of IL (Y or R package) or IM (P or G Package). Note that
applications such as standby supplies. A single resistor connected for the same CONTROL pin current, higher line voltage results
from the LINE-SENSE pin (Y or R package) or MULTI- in smaller operating duty cycle. As an added feature, the
FUNCTION pin (P or G package) to the rectified DC high maximum duty cycle DCMAX is also reduced from 78% (typical)
voltage bus sets UV threshold during power up. Once the power at a voltage slightly higher than the UV threshold to 38%
supply is successfully turned on, the UV threshold is lowered to (typical) at the OV threshold (see Figures 7, 11). Limiting
Oscillator
(SAW)
DMAX
Enable from
X, L or M Pin (STOP)
Time
PI-2637-060600
Figure 10. Synchronization Timing Diagram.
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8 7/01 August 8, 2000
TOP242-249
DCMAX at higher line voltages helps prevent transformer open). When the TOPSwitch-GX is remotely turned on after
saturation due to large load transients in forward converter entering this mode, it will initiate a normal start-up sequence
applications. DCMAX of 38% at the OV threshold was chosen to with soft-start the next time the CONTROL pin reaches 5.8 V.
ensure that the power capability of the TOPSwitch-GX is not In the worst case, the delay from remote on to start-up can be
restricted by this feature under normal operation. equal to the full discharge/charge cycle time of the CONTROL
pin, which is approximately 125 ms for a 47 µF CONTROL pin
Remote ON/OFF and Synchronization capacitor. This reduced consumption remote off mode can
TOPSwitch-GX can be turned on or off by controlling the eliminate expensive and unreliable in-line mechanical switches.
current into the LINE-SENSE pin or out from the EXTERNAL It also allows for microprocessor controlled turn-on and turn-
CURRENT LIMIT pin (Y or R package) and into or out from off sequences that may be required in certain applications such
the MULTI-FUNCTION pin (P or G package) (see Figure 11). as inkjet and laser printers.
In addition, the LINE-SENSE pin has a 1 V threshold comparator
connected at its input. This voltage threshold can also be used Soft-Start
to perform remote ON/OFF control. This allows easy Two on-chip soft-start functions are activated at start-up with a
implementation of remote ON/OFF control of TOPSwitch-GX duration of 10 ms (typical). Maximum duty cycle starts from
in several different ways. A transistor or an optocoupler output 0% and linearly increases to the default maximum of 78% at the
connected between the EXTERNAL CURRENT LIMIT or end of the 10 ms duration and the current limit starts from about
LINE-SENSE pins (Y or R package) or the MULTI-FUNCTION 85% and linearly increases to 100% at the end of the 10ms
pin (P or G package) and the SOURCE pin implements this duration. In addition to start-up, soft-start is also activated at
function with “active-on” (Figure 22, 29 and 36) while a each restart attempt during auto-restart and when restarting
transistor or an optocoupler output connected between the after being in hysteretic regulation of CONTROL pin voltage
LINE-SENSE pin (Y or R package) or the MULTI-FUNCTION (VC), due to remote off or thermal shutdown conditions. This
(P or G package) pin and the CONTROL pin implements the effectively minimizes current and voltage stresses on the output
function with “active-off” (Figure 23 and 37). MOSFET, the clamp circuit and the output rectifier during start-
up. This feature also helps minimize output overshoot and
When a signal is received at the LINE-SENSE pin or the prevents saturation of the transformer during start-up.
EXTERNAL CURRENT LIMIT pin (Y or R package) or the
MULTI-FUNCTION pin (P or G package) to disable the output Shutdown/Auto-Restart
through any of the pin functions such as OV, UV and remote To minimize TOPSwitch-GX power dissipation under fault
ON/OFF, TOPSwitch-GX always completes its current switching conditions, the shutdown/auto-restart circuit turns the power
cycle, as illustrated in Figure 10, before the output is forced off. supply on and off at an auto-restart duty cycle of typically 4%
The internal oscillator is stopped slightly before the end of the if an out of regulation condition persists. Loss of regulation
current cycle and stays there as long as the disable signal exists. interrupts the external current into the CONTROL pin. VC
When the signal at the above pins changes state from disable to regulation changes from shunt mode to the hysteretic auto-
enable, the internal oscillator starts the next switching cycle. restart mode as described in CONTROL pin operation section.
This approach allows the use of this pin to synchronize When the fault condition is removed, the power supply output
TOPSwitch-GX to any external signal with a frequency lower becomes regulated, VC regulation returns to shunt mode, and
than its internal switching frequency. normal operation of the power supply resumes.
As seen above, the remote ON/OFF feature allows the Hysteretic Over-Temperature Protection
TOPSwitch-GX to be turned on and off instantly, on a cycle-by- Temperature protection is provided by a precision analog
cycle basis, with very little delay. However, remote ON/OFF circuit that turns the output MOSFET off when the junction
can also be used as a standby or power switch to turn off the temperature exceeds the thermal shutdown temperature
TOPSwitch-GX and keep it in a very low power consumption (140 °C typical). When the junction temperature cools to below
state for indefinitely long periods. If the TOPSwitch-GX is held the hysteretic temperature, normal operation resumes providing
in remote off state for long enough time to allow the CONTROL automatic recovery. A large hysteresis of 70 °C (typical) is
pin to dishcharge to the internal supply under-voltage threshold provided to prevent overheating of the PC board due to a
of 4.8 V (approximately 32 ms for a 47 µF CONTROL pin continuous fault condition. VC is regulated in hysteretic mode
capacitance), the CONTROL pin goes into the hysteretic mode and a 4.8 V to 5.8 V (typical) sawtooth waveform is present on
of regulation. In this mode, the CONTROL pin goes through the CONTROL pin while in thermal shutdown.
alternate charge and discharge cycles between 4.8 V and 5.8 V
(see CONTROL pin operation section above) and runs entirely Bandgap Reference
off the high voltage DC input, but with very low power All critical TOPSwitch-GX internal voltages are derived from a
consumption (160 mW typical at 230 VAC with M or X pins temperature-compensated bandgap reference. This reference is
August 8, 2000 E
7/01 9
TOP242-249
also used to generate a temperature-compensated current

reference which is trimmed to accurately set the switching
frequency, MOSFET gate drive current, current limit, and the
line OV/UV thresholds. TOPSwitch-GX has improved circuitry
to maintain all of the above critical parameters within very tight
absolute and temperature tolerances.
High-Voltage Bias Current Source

This current source biases TOPSwitch-GX from the DRAIN pin
and charges the CONTROL pin external capacitance during
start-up or hysteretic operation. Hysteretic operation occurs
during auto-restart, remote off and over-temperature shutdown.
In this mode of operation, the current source is switched on and
off with an effective duty cycle of approximately 35%. This
duty cycle is determined by the ratio of CONTROL pin charge
(IC) and discharge currents (ICD1 and ICD2). This current source
is turned off during normal operation when the output MOSFET
is switching. The effect of the current source switching will be
seen on the DRAIN voltage waveform as small disturbances
and is normal.
E
10 7/01 August 8, 2000
TOP242-249
Using Feature Pins

FREQUENCY (F) Pin Operation Refer to Table 2 for possible combinations of the functions with
The FREQUENCY pin is a digital input pin available in the example circuits shown in Figure 16 through Figure 40. A
Y or R package only. Shorting the FREQUENCY pin to description of specific functions in terms of the LINE-SENSE
SOURCE pin selects the nominal switching frequency of pin I/V characteristic is shown in Figure 11 (right hand side).
132 kHz (Figure 13) which is suited for most applications. For The horizontal axis represents LINE-SENSE pin current with
other cases that may benefit from lower switching frequency positive polarity indicating currents flowing into the pin. The
such as noise sensitive video applications, a 66 kHz switching meaning of the vertical axes varies with functions. For those
frequency (half frequency) can be selected by shorting the that control the on/off states of the output such as UV, OV and
FREQUENCY pin to the CONTROL pin (Figure 14). In remote ON/OFF, the vertical axis represents the enable/disable
addition, an example circuit shown in Figure 15 may be used to states of the output. UV triggers at IUV (+50 µA typical with
lower the switching frequency from 132 kHz in normal 30 µA hysteresis) and OV triggers at IOV (+225 µA typical with
operation to 66 kHz in standby mode for very low standby 8 µA hysteresis). Between the UV and OV thresholds, the
power consumption. output is enabled. For line feed forward with DCMAX reduction,
the vertical axis represents the magnitude of the DCMAX. Line
LINE-SENSE (L) Pin Operation (Y and R Packages) feed forward with DCMAX reduction lowers maximum duty cycle
When current is fed into the LINE-SENSE pin, it works as a from 78% at IL(DC) (+60 µA typical) to 38% at IOV (+225 µA).
voltage source of approximately 2.6 V up to a maximum
current of +400 µA (typical). At +400 µA, this pin turns into EXTERNAL CURRENT LIMIT (X) Pin Operation
a constant current sink. Refer to Figure 12a. In addition, a (Y and R Packages)
comparator with a threshold of 1 V is connected at the pin and When current is drawn out of the EXTERNAL CURRENT
is used to detect when the pin is shorted to the SOURCE pin. LIMIT pin, it works as a voltage source of approximately 1.3
V up to a maximum current of –240 µA (typical). At –240 µA,
There are a total of four functions available through the use of it turns into a constant current source (refer to Figure 12a).
the LINE-SENSE pin: OV, UV, line feed forward with DCMAX
reduction, and remote ON/OFF. Connecting the LINE-SENSE There are two functions available through the use of the
pin to the SOURCE pin disables all four functions. The LINE- EXTERNAL CURRENT LIMIT pin: external current limit
SENSE pin is typically used for line sensing by connecting a and remote ON/OFF. Connecting the EXTERNAL CURRENT
resistor from this pin to the rectified DC high voltage bus to LIMIT pin and SOURCE pin disables the two functions. In
implement OV, UV and DCMAX reduction with line voltage. In high efficiency applications this pin can be used to reduce the
this mode, the value of the resistor determines the line OV/UV current limit externally to a value close to the operating peak
thresholds, and the DCMAX is reduced linearly with rectified DC current, by connecting the pin to the SOURCE pin through a
high voltage starting from just above the UV threshold. The pin resistor. The pin can also be used as a remote on/off. Table 2
can also be used as a remote on/off and a synchronization input. shows several possible combinations using this pin. See Figure
LINE-SENSE AND EXTERNAL CURRENT LIMIT PIN TABLE*

▲
Figure Number 16 17 18 19 20 21 22 23 24 25 26 27 28 29
Three Terminal Operation ✔
Under-Voltage ✔ ✔ ✔ ✔ ✔
Overvoltage ✔ ✔ ✔ ✔ ✔
Line Feed Forward (DCMAX) ✔ ✔ ✔ ✔
Overload Power Limiting ✔
External Current Limit ✔ ✔ ✔ ✔ ✔ ✔
Remote ON/OFF ✔ ✔ ✔ ✔ ✔ ✔ ✔
*This table is only a partial list of many LINE-SENSE and EXTERNAL CURRENT LIMIT pin configurations that are possible.
Table 2. Typical LINE-SENSE and EXTERNAL CURRENT LIMIT Pin Configurations.
August 8, 2000 E
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TOP242-249
MULTI-FUNCTION PIN TABLE*
▲
Figure Number 30 31 32 33 34 35 36 37 38 39 40
Three Terminal Operation ✔
Under-Voltage ✔ ✔ ✔
Overvoltage ✔ ✔ ✔
Line Feed Forward (DCMAX) ✔ ✔
Overload Power Limiting ✔
External Current Limit ✔ ✔ ✔ ✔
Remote ON/OFF ✔ ✔ ✔ ✔ ✔
*This table is only a partial list of many MULTI-FUNCTION pin configurations that are possible.
Table 3. Typical MULTI-FUNCTION Pin Configurations.
11 for a description of the functions where the horizontal axis TOPSwitch-GX to operate in a simple three terminal mode like
(left hand side) represents the EXTERNAL CURRENT LIMIT TOPSwitch-II. The MULTI-FUNCTION pin is typically used
pin current. The meaning of the vertical axes varies with for line sensing by connecting a resistor from this pin to the
function. For those that control the on/off states of the output rectified DC high voltage bus to implement OV, UV and DCMAX
such as remote ON/OFF, the vertical axis represents the enable/ reduction with line voltage. In this mode, the value of the
disable states of the output. For external current limit, the resistor determines the line OV/UV thresholds, and the DCMAX
vertical axis represents the magnitude of the ILIMIT. Please see is reduced linearly with rectified DC high voltage starting from
graphs in the typical performance characteristics section for the just above the UV threshold. In high efficiency applications
current limit programming range and the selection of appropriate this pin can be used in the external current limit mode instead,
resistor value. to reduce the current limit externally to a value close to the
operating peak current, by connecting the pin to the SOURCE
MULTI-FUNCTION (M) Pin Operation (P and G Packages) pin through a resistor. The same pin can also be used as a remote
The LINE-SENSE and EXTERNAL CURRENT LIMIT pin on/off and a synchronization input in both modes. Please refer
functions are combined to a single MULTI-FUNCTION pin for to Table 3 for possible combinations of the functions with
P and G packages. The comparator with a 1 V threshold at the example circuits shown in Figure 30 through Figure 40. A
LINE-SENSE pin is removed in this case as shown in Figure 2b. description of specific functions in terms of the MULTI-
All of the other functions are kept intact. However, since some FUNCTION pin I/V characteristic is shown in Figure 11. The
of the functions require opposite polarity of input current horizontal axis represents MULTI-FUNCTION pin current
(MULTI-FUNCTION pin), they are mutually exclusive. For with positive polarity indicating currents flowing into the pin.
example, line sensing features cannot be used simultaneously The meaning of the vertical axes varies with functions. For
with external current limit setting. When current is fed into the those that control the on/off states of the output such as UV, OV
MULTI-FUNCTION pin, it works as a voltage source of and remote ON/OFF, the vertical axis represents the enable/
approximately 2.6 V up to a maximum current of +400 µA disable states of the output. UV triggers at IUV (+50 µA typical)
(typical). At +400 µA, this pin turns into a constant current sink. and OV triggers at IOV (+225 µA typical with 30 µA hysteresis).
When current is drawn out of the MULTI-FUNCTION pin, it Between the UV and OV thresholds, the output is enabled. For
works as a voltage source of approximately 1.3 V up to a external current limit and line feed forward with DCMAX
maximum current of –240 µA (typical). At –240 µA, it turns reduction, the vertical axis represents the magnitude of the ILIMIT
into a constant current source. Refer to Figure 12b. and DCMAX. Line feed forward with DCMAX reduction lowers
maximum duty cycle from 78% at IM(DC) (+60 µA typical) to 38%
There are a total of five functions available through the use of at IOV (+225 µA). External current limit is available only with
the MULTI-FUNCTION pin: OV, UV, line feed forward with negative MULTI-FUNCTION pin current. Please see graphs in
DCMAX reduction, external current limit and remote ON/OFF. A the typical performance characteristics section for the current
short circuit between the MULTI-FUNCTION pin and limit programming range and the selection of appropriate resistor
SOURCE pin disables all five functions and forces value.
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12 7/01 August 8, 2000
TOP242-249
M Pin
X Pin L Pin
IREM(N) IUV IOV

(Enabled)
Output
MOSFET
Switching
(Disabled)
Disabled when supply I

output goes out of
regulation
ILIMIT (Default)
Current
Limit
DCMAX (78.5%)
Maximum
Duty Cycle
I
-22 µA
-27 µA
VBG + VTP
VBG
Pin Voltage
I
-250 -200 -150 -100 -50 0 50 100 150 200 250 300 350 400
X and L Pins (Y or R Package) and M Pin (P or G Package) Current (µA)
Note: This figure provides idealized functional characteristics with typical performance values. Please refer to the parametric
table and typical performance characteristics sections of the data sheet for measured data.
PI-2636-040501
Figure 11. MULTI-FUNCTION (P or G package), LINE-SENSE, and EXTERNAL CURRENT LIMIT (Y or R package) Pin Characteristics.
August 8, 2000 E
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TOP242-249
Y and R Package
CONTROL Pin
TOPSwitch-GX
240 µA
(Negative Current Sense - ON/OFF,

Current Limit Adjustment)
EXTERNAL CURRENT LIMIT (X) VBG + VT
(Voltage Sense)
LINE-SENSE (L) 1V
VBG
(Positive Current Sense - Under-Voltage,
Overvoltage, ON/OFF Maximum Duty
Cycle Reduction)
400 µA
PI-2634-033001
Figure 12a. LINE-SENSE (L), and EXTERNAL CURRENT LIMIT (X) Pin Input Simplified Schematic.
P and G Package
CONTROL Pin
TOPSwitch-GX
240 µA
(Negative Current Sense - ON/OFF,

Current Limit Adjustment)
VBG + VT
MULTI-FUNCTION (M)
VBG
(Positive Current Sense - Under-Voltage,
Overvoltage, Maximum Duty
Cycle Reduction)
400 µA
PI-2548-092399
Figure 12b. MULTI-FUNCTION (M) Pin Input Simplified Schematic.
E
14 7/01 August 8, 2000
TOP242-249
Typical Uses of FREQUENCY (F) Pin
+ +
DC DC
D D
Input Input
Voltage CONTROL Voltage CONTROL
C C
S F S F
- -
PI-2654-071700 PI-2655-071700
Figure 13. Full Frequency Operation (132 kHz). Figure 14. Half Frequency Operation (66 kHz).
+
QS can be an optocoupler output.
DC
D
Input
Voltage CONTROL
C
STANDBY
S F 47 kΩ
QS
RHF
20 kΩ 1 nF
-
PI-2656-040501
Figure 15. Half Frequency Standby Mode (For High Standby

Efficiency).
August 8, 2000 E
7/01 15
TOP242-249
Typical Uses of LINE-SENSE (L) and EXTERNAL CURRENT LIMIT (X) Pins
+ + VUV = IUV x RLS

VOV = IOV x RLS
For RLS = 2 MΩ
CLXS F D RLS 2MΩ VUV = 100 VDC
VOV = 450 VDC
DC DC
Input Input DCMAX@100 VDC = 78%
Voltage Voltage DCMAX@375 VDC = 38%
D L D L
CONTROL C S D CONTROL
C C
S X F S
- -
PI-2617-050100 PI-2618-040501
Figure 16. Three Terminal Operation (LINE-SENSE and Figure 17. Line-Sensing for Under-Voltage, Overvoltage and
EXTERNAL CURRENT LIMIT Features Disabled. Line Feed Forward.
FREQUENCY Pin can be tied to SOURCE or
CONTROL Pin).
+ +
2 MΩ VUV = RLS x IUV 2 MΩ VOV = IOV x RLS
For Value Shown For Values Shown

RLS VUV = 100 VDC RLS VOV = 450 VDC
DC DC
Input 22 kΩ Input 30 kΩ
Voltage Voltage 1N4148
D M D L
CONTROL CONTROL
C C
6.2 V
S
- S -
PI-2510-040501 PI-2620-040501
Figure 18. Line-Sensing for Under-Voltage Only (Overvoltage Figure 19. Line-Sensing for Overvoltage Only (Under-Voltage
Disabled). Disabled). Maximum Duty Cycle will be reduced at
Low Line.
+ For RIL = 12 kΩ + ILIMIT = 100% @ 100 VDC

ILIMIT = 69% ILIMIT = 63% @ 300 VDC
RLS 2.5 MΩ
For RIL = 25 kΩ
ILIMIT = 43%
DC See fig. 55 for other DC

D resistor values (RIL) D
Input Input
C C
S X S X
RIL RIL
6 kΩ
- -
PI-2623-040501 PI-2624-040501
Figure 20. Externally Set Current Limit. Figure 21. Current Limit Reduction with Line Voltage.
E
16 7/01 August 8, 2000
TOP242-249
Typical Uses of LINE-SENSE (L) and EXTERNAL CURRENT LIMIT (X) Pins (cont.)
+ + QR can be an
QR can be an optocoupler optocoupler output or
output or can be replaced by can be replaced
a manual switch. by a manual switch.
QR
ON/OFF
47 kΩ RMC
DC DC
D
Input Input 45 kΩ
Voltage CONTROL Voltage
C D L
CONTROL
S X C
QR ON/OFF
47 kΩ S
- -
PI-2625-040501 PI-2621-040501
Figure 22. Active-on (Fail Safe) Remote ON/OFF. Figure 23. Active-off Remote ON/OFF. Maximum Duty Cycle will
be reduced.
+ QR can be an optocoupler
+ QR
QR can be an
optocoupler output
output or can be replaced ON/OFF or can be replaced
by a manual switch. 47 kΩ RMC by a manual switch.
For RIL = 12 kΩ 45 kΩ
ILIMIT = 69 % DC
DC
D For RIL = 25 kΩ Input D L
Input
Voltage CONTROL ILIMIT = 43 % Voltage CONTROL
C C
S X S X
RIL RIL
QR ON/OFF
- 47 kΩ -
PI-2626-040501 PI-2627-040501
Figure 24. Active-on Remote ON/OFF with Externally Set Current Figure 25. Active-off Remote ON/OFF with Externally Set Current
Limit. Limit.
+ VUV = IUV x RLS

VOV = IOV x RLS
RLS 2 MΩ output or can be replaced
by a manual switch.
DCMAX@100 VDC = 78%
RLS 2 MΩ
QR DCMAX@375 VDC = 38%
For RLS = 2 MΩ
ON/OFF QR can be an optocoupler
47 kΩ VUV = 100 VDC DC output or can be replaced
D L
VOV = 450 VDC Input by a manual switch.
Voltage CONTROL
DC C
Input D L For RIL = 12 kΩ
Voltage CONTROL ILIMIT = 69 %
C S X
QR
RIL
ON/OFF
S -
- 47 kΩ
PI-2622-040501 PI-2628-040501
Figure 26. Active-off Remote ON/OFF with LINE-SENSE. Figure 27. Active-on Remote ON/OFF with LINE-SENSE and
EXTERNAL CURRENT LIMIT.
August 8, 2000 E
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TOP242-249
Typical Uses of LINE-SENSE (L) and EXTERNAL CURRENT LIMIT (X) Pins (cont.)
VUV = IUV x RLS +

VOV = IOV x RLS
output or can be replaced by
For RLS = 2 MΩ a manual switch.
RLS 2 MΩ
VUV = 100 VDC
VOV = 450 VDC
DC DC 300 kΩ
D L DCMAX@100 VDC = 78% D L
Input Input
DCMAX@375 VDC = 38%
C C
For RIL = 12 kΩ
S X ILIMIT = 69% S
RIL
See fig. 55 for other QR ON/OFF
resistor values (RIL) 47 kΩ
- 12 kΩ
to select different ILIMIT
-
values PI-2629-040501 PI-2640-040501
Figure 28. Line-Sensing and Externally Set Current Limit. Figure 29. Active-on Remote ON/OFF.
E
18 7/01 August 8, 2000
TOP242-249
Typical Uses of MULTI-FUNCTION (M) Pin
+ +
VUV = IUV x RLS
VOV = IOV x RLS
C S S
M
RLS 2 MΩ For RLS = 2 MΩ
D S S VUV = 100 VDC
DC DC VOV = 450 VDC
Input Input
Voltage Voltage DCMAX@100 VDC = 78%
D M D M DCMAX@375 VDC = 38%
C D S
CONTROL CONTROL
C C
S S
- -
PI-2508-081199 PI-2509-040501
Figure 30. Three Terminal Operation (MULTI-FUNCTION Figure 31. Line Sensing for Undervoltage, Over-Voltage and
Features Disabled). Line Feed Forward.
+ +
2 MΩ VUV = RLS x IUV VOV = IOV x RLS
2 MΩ
For Value Shown For Values Shown

RLS RLS
VUV = 100 VDC VOV = 450 VDC
DC DC
Input 22 kΩ Input 30 kΩ
1N4148
Voltage Voltage
D M D M
CONTROL CONTROL
C C
6.2 V
S S
- -
PI-2510-040501 PI-2516-040501
Figure 32. Line Sensing for Under-Voltage Only (Overvoltage Figure 33. Line Sensing for Overvoltage Only (Under-Voltage
Disabled). Disabled). Maximum Duty Cycle will be reduced at
Low Line.
+ +
For RIL = 12 kΩ
ILIMIT = 69% ILIMIT = 100% @ 100 VDC
RLS 2.5 MΩ ILIMIT = 63% @ 300 VDC
For RIL = 25 kΩ
ILIMIT = 43%
DC DC
Input Input
resistor values (RIL)
Voltage Voltage
to select different D M
D M
ILIMIT values
CONTROL RIL 6 kΩ CONTROL
RIL C C
S S
- -
PI-2517-040501 PI-2518-040501
Figure 34. Externally Set Current Limit. Figure 35. Current Limit Reduction with Line Voltage.
August 8, 2000 E
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TOP242-249
Typical Uses of MULTI-FUNCTION (M) Pin (cont.)
+ + QR can be an optocoupler
QR can be an optocoupler output or can be replaced
output or can be replaced by by a manual switch.
a manual switch.
QR
DC DC ON/OFF
Input Input 47 kΩ RMC
Voltage Voltage
D M 45 kΩ
D M
CONTROL CONTROL
QR C C
ON/OFF
47 kΩ S
- S
-
PI-2519-040501 PI-2522-040501
Figure 36. Active-on (Fail Safe) Remote ON/OFF. Figure 37. Active-off Remote ON/OFF. Maximum Duty Cycle will
be Reduced.
+ + QR can be an optocoupler
QR can be an optocoupler
output or can be replaced output or can be replaced
by a manual switch. by a manual switch.
For RIL = 12 kΩ QR
ILIMIT = 69 % ON/OFF
DC DC 47 kΩ
Input For RIL = 25 kΩ Input
Voltage Voltage RMC 24 kΩ RMC = 2RIL
RIL D M ILIMIT = 43 %
D M
CONTROL CONTROL
QR C RIL 12 kΩ C
ON/OFF
47 kΩ S
- S
-
PI-2520-040501 PI-2521-040501
Figure 38. Active-on Remote ON/OFF with Externally Set Figure 39. Active-off Remote ON/OFF with Externally Set
Current Limit. Current Limit.
output or can be replaced
by a manual switch.
RLS 2 MΩ
QR
DC ON/OFF
Input 47 kΩ
Voltage For RLS = 2 MΩ
D M
CONTROL
VUV = 100 VDC
C VOV = 450 VDC
S
-
PI-2523-040501
Figure 40. Active-off Remote ON/OFF with LINE-SENSE.
E
20 7/01 August 8, 2000
TOP242-249
Application Examples margin under worst case conditions. Resistor R4 provides line
sensing, setting UV at 100 VDC and OV at 450 VDC. The
A High Efficiency, 30 W, Universal Input Power Supply extended maximum duty cycle feature of TOPSwitch-GX
The circuit shown in Figure 41 takes advantage of several of the (guaranteed minimum value of 75% vs. 64% for TOPSwitch-II)
TOPSwitch-GX features to reduce system cost and power allows the use of a smaller input capacitor (C1). The extended
supply size and to improve efficiency. This design delivers maximum duty cycle and the higher reflected voltage possible
30 W at 12 V, from an 85 to 265 VAC input, at an ambient of with the RCD clamp also permit the use of a higher primary to
50 °C, in an open frame configuration. A nominal efficiency of secondary turns ratio for T1 which reduces the peak reverse
80% at full load is achieved using TOP244Y. voltage experienced by the secondary rectifier D8. As a result
a 60 V Schottky rectifier can be used for up to 15 V outputs,
The current limit is externally set by resistors R1 and R2 to a which greatly improves power supply efficiency. The frequency
value just above the low line operating peak DRAIN current of reduction feature of the TOPSwitch-GX eliminates the need for
approximately 70% of the default current limit. This allows use any dummy loading for regulation at no load and reduces the no
of a smaller transformer core size and/or higher transformer load/standby consumption of the power supply. Frequency
primary inductance for a given output power, reducing jitter provides improved margin for conducted EMI meeting the
TOPSwitch-GX power dissipation, while at the same time CISPR 22 (FCC B) specification.
avoiding transformer core saturation during startup and output
transient conditions. The resistors R1 & R2 provide a signal Output regulation is achieved by using a simple Zener sense
that reduces the current limit with increasing line voltage, circuit for low cost. The output voltage is determined by the
which in turn limits the maximum overload power at high input Zener diode (VR2) voltage and the voltage drops across the
line voltage. This function in combination with the built-in optocoupler (U2) LED and resistor R6. Resistor R8 provides
soft-start feature of TOPSwitch-GX, allows the use of a low cost bias current to Zener VR2 for typical regulation of ±5% at the
RCD clamp (R3, C3 and D1) with a higher reflected voltage, by 12 V output level, over line and load and component variations.
safely limiting the TOPSwitch-GX drain voltage, with adequate
PERFORMANCE SUMMARY
Output Power: 30 W
CY1
Regulation: ± 4% 2.2 nF
Efficiency: ≥ 79% C14 R15
Ripple: ≤ 50 mV pk-pk 1 nF 150 Ω
L3 12 V
3.3 µH @ 2.5 A
C3 R3
4.7 nF 68 kΩ
2W D8 C10 C11 C12
1 kV 220 µF
MBR1060 560 µF 560 µF
35 V 35 V 35 V
BR1
600 V D1 RTN
2A UF4005
R4 D2
L1 2 MΩ 1N4148 R6
20 mH 1/2 W 150 Ω R8
R1 T1 C6 150 Ω
4.7 MΩ 0.1 µF
C1 1/2 W U2
CX1 68 µF LTV817A
100 nF 400 V D L TOPSwitch-GX
250 VAC U1 CONTROL
TOP244Y C
R5
F1 S X F 6.8 Ω VR2
J1 3.15 A 1N5240C
10 V, 2%
L R2 C5
9.09 kΩ 47 µF
10 V
N
PI-2657-040501
Figure 41. 30 W Power Supply using External Current Limit Programming and Line Sensing for UV and OV.
August 8, 2000 E
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TOP242-249
A High Efficiency, Enclosed, 70 W, Universal Adapter Supply Capacitor C11 has been added in parallel with VR1 to reduce
The circuit shown in figure 42 takes advantage of several of the Zener clamp dissipation. With a switching frequency of
TOPSwitch-GX features to reduce cost, power supply size and 132 kHz a PQ26/20 core can be used to provide 70 W. To
increase efficiency. This design delivers 70 W at 19 V, from an maximize efficiency, by reducing winding losses, two output
85 to 265 VAC input, at an ambient of 40 °C, in a small sealed windings are used each with their own dual 100 V Schottky
adapter case (4” x 2.15” x 1”). Full load efficiency is 85% at 85 rectifier (D2 and D3). The frequency reduction feature of the
VAC rising to 90% at 230 VAC input. TOPSwitch-GX eliminates any dummy loading to maintain
regulation at no-load and reduces the no-load consumption of
Due to the thermal environment of a sealed adapter a TOP249Y the power supply to only 520 mW at 230 VAC input. Frequency
is used to minimize device dissipation. Resistors R9 and R10 jittering provides conducted EMI meeting the CISPR 22
externally program the current limit level to just above the (FCC B) / EN55022B specification, using simple filter
operating peak DRAIN current at full load and low line. This components (C7, L2, L3 and C6) even with the output earth
allows the use of a smaller transformer core size without saturation grounded.
during startup or output load transients. Resistors R9 and R10 also
reduce the current limit with increasing line voltage, limiting the To regulate the output an optocoupler (U2) is used with a
maximum overload power at high input line voltage, removing the secondary reference sensing the output voltage via a resistor
need for any protection circuitry on the secondary. Resistor R11 divider (U3, R4, R5, R6). Diode D4 and C15 filter and smooth
implements an under voltage and over voltage sense as well as the output of the bias winding. Capacitor C15 (1uF) prevents
providing line feed forward for reduced output line frequency the bias voltage from falling during zero to full load transients.
ripple. With resistor R11 set at 2 MΩ the power supply does not Resistor R8 provides filtering of leakage inductance spikes
start operating until the DC rail voltage reaches 100 VDC. On keeping the bias voltage constant even at high output loads.
removal of the AC input the UV sense prevents the output Resistor R7, C9 and C10 together with C5 and R3 provide loop
glitching as C1 discharges, turning off the TOPSwitch-GX when compensation.
the output regulation is lost or when the input voltage falls to below
40 V, whichever occurs first. This same value of R11 sets the OV Due to the large primary currents, all the small signal control
threshold to 450 V. If exceeded, for example during a line surge, components are connected to a separate source node that is
TOPSwitch-GX stops switching for the duration of the surge Kelvin connected to the source pin of the TOPSwitch-GX. For
extending the high voltage withstand to 700 V without device improved common mode surge immunity the bias winding
damage. common returns directly to the DC bulk capacitor (C1).
C7 2.2 nF PERFORMANCE SUMMARY

C13 C12 C11 D2
MBR20100 Output Power: 70 W
0.33 µF 0.022 µF 0.01 µF
400 V 400 V 400 V Y1 Safety Regulation: ± 4%
Efficiency: ≥ 84%
Ripple: ≤ 120 mV pk-pk
No Load Consumption: < 0.52 W @ 230 VAC
VR1 D3
P6KE- MBR20100
C3 C14
200 820 µF L1 0.1 µF 19 V
BR1 25 V 200 µH 50 V @ 3.6 A
RS805 D1
8A 600 V UF4006
C2 C4 RTN
D4 820 µF R1 820 µF
L2 R11 1N4148 25 V 270 Ω 25 V
820 µH 2 MΩ U2
R4
2A 1/2 W R8 31.6 kΩ
PC817A
C1 4.7 Ω 1%
T1 R2
150 µF C15 R5
1 kΩ
C6 400 V TOPSwitch-GX 1 µF 562 Ω
0.1 µF D L 50 V C9 1%
X2 L3 TOP249Y 4.7 nF 50 V
CONTROL
RT1 75 µH R9 C U1
10 Ω t° 2A 13 MΩ C10
1.7 A R3 0.1 µF
R7
F1 S X F 6.8 Ω 56 kΩ 50 V
J1 3.15 A R10 C8 U3
0.1 µF
85-265 VAC
TL431 R6
20.5 kΩ 4.75 kΩ
L 50 V C5
47 µF 1%
16 V
N All resistors 1/8 W 5% unless otherwise stated.
PI-2691-033001
Figure 42. 70 W Power Supply using Current Limit Reduction with Line and Line Sensing for UV and OV.
E
22 7/01 August 8, 2000
TOP242-249
A High Efficiency, 250 W, 250 – 380 VDC Input Power Supply is essential to limit the peak drain voltage during start-up and/
The circuit shown in figure 43 delivers 250 W (48 V @ 5.2 A) or overload conditions to below the 700 V rating of the
at 84% efficiency using a TOP249 from a 250 to 380 VDC TOPSwitch-GX MOSFET.
input. DC input is shown, as typically at this power level a p.f.c.
boost stage would preceed this supply, providing the DC input The secondary is rectifed and smoothed by D2 and C9, C10 and
(C1 is included to provide local decoupling). Flyback topology C11. Three capacitors are used to meet the secondary ripple
is still useable at this power level due to the high output voltage, current requirement. Inductor L2 and C12 provide switching
keeping the secondary peak currents low enough so that the noise filtering.
output diode and capacitors are reasonably sized.
A simple Zener sensing chain regulates the output voltage. The
In this example the TOP249 is at the upper limit of its power sum of the voltage drop of VR2, VR3 and VR4 plus the LED
capability and the current limit is set to the internal maximum drop of U2 gives the desired output voltage. Resistor R6 limits
by connecting the X pin to SOURCE. However, line sensing is LED current and sets overall control loop DC gain. Diode D4
implemented by connecting a 2 MΩ resistor from the L pin to and C14 provide secondary soft-finish, feeding current into the
the DC rail. If the DC input rail rises above 450 VDC, then CONTROL pin prior to output regulation and thus ensuring that
TOPSwitch-GX will stop switching until the voltage returns to the output voltage reaches regulation at start-up under low line,
normal, preventing device damage. full load conditions. Resistor R9 provides a discharge path for
C14. Capacitor C13 and R8 provide control loop compensation
Due to the high primary current, a low leakage inductance and are required due to the gain associated with such a high
transformer is essential. Therefore, a sandwich winding with a output voltage.
copper foil secondary was used. Even with this technique the
leakage inductance energy is beyond the power capability of a Sufficient heat sinking is required to keep the TOPSwitch-GX
simple Zener clamp. Therefore, R2, R3 and C6 are added in device below 110 °C when operating under full load, low line
parallel to VR1. These have been sized such that during normal and maximum ambient temperature. Airflow may also be
operation very little power is dissipated by VR1, the leakage required if a large heat sink area is not acceptable.
energy instead being dissipated by R2 and R3. However, VR1
C7
2.2 nF Y1 D2
R2 R3 C6 MUR1640CT
C10 C11 L2
VR1 68 kΩ 68 kΩ 4.7 nF 560 µF 560 µF 3 µH 8A
+250 - 380 VDC P6KE200 2W 2W 1 kV 63 V 63 V 48 V @ 5.2 A
C9 C12
560 µF 68 µF
63 V 63 V
D1
BYV26C D2 RTN
1N4148 U2
LTV817A
R1
2 MΩ
1/2 W T1 R9
C4 10 kΩ
C1 1 µF
22 µF 50 V
R6
400 V 100 Ω
TOPSwitch-GX
D L TOP249Y C13
PERFORMANCE SUMMARY 150 nF D4
CONTROL U1 63 V 1N4148
Output Power: 250 W C
VR2 22 V
Line Regulation: ± 1% BZX79B22
Load Regulation: ± 5% R4
S X F 6.8 Ω C14
Efficiency: ≥ 85% VR3 12 V 22 µF
Ripple: < 100 mV pk-pk C3 BZX79B12 R8
0.1 µF C3 56 Ω 63 V
No Load Consumption: ≤ 1.4 W (300 VDC) 47 µF
50 V VR4 12 V
10 V BZX79B12
0V
All resistor 1/8 W 5% unless
otherwise stated. PI-2692-033001
Figure 43. 250 W, 48 V Power Supply using TOP249.
August 8, 2000 E
7/01 23
TOP242-249
Multiple Output, 60 W, 185-265 VAC Input Power Supply Leakage inductance clamping is provided by VR1, R5 and C5,
Figure 44 shows a multiple output supply typical for high end keeping the DRAIN voltage below 700 V under all conditions.
set-top boxes or cable decoders containing high capacity hard Resistor R5 and capacitor C5 are selected such that VR1
disks for recording. The supply delivers an output power of dissipates very little power except during overload conditions.
45 W cont./60 W peak (thermally limited) from an input voltage The frequency jittering feature of TOPSwitch-GX allows the
of 185 to 265 VAC. Efficiency at 45 W, 185 VAC is ≥ 75%. circuit shown to meet CISPR22B with simple EMI filtering
(C1, L1 and C6) and the output grounded.
The 3.3 V and 5 V outputs are regulated to ±5% without the need
for secondary linear regulators. DC stacking (the secondary The secondaries are rectified and smoothed by D7 to D11, C7,
winding reference for the other output voltages is connected to C9, C11, C13, C14, C16 and C17. Diode D11 for the 3.3 V
the cathode of D10 rather than the anode) is used to minimize output is a Schottky diode to maximize efficiency. Diode D10
the voltage error for the higher voltage outputs. for the 5 V output is a PN type to center the 5 V output at 5 V.
The 3.3 V and 5 V output require two capacitors in parallel to
Due to the high ambient operating temperature requirement meet the ripple current requirement. Switching noise filtering
typical of a set-top box (60 °C) the TOP246Y is used to reduce is provided by L2 to L5 and C8, C10, C12, C15 and C18.
conduction losses and minimize heat sink size. Resistor R2 sets Resistor R6 prevents peak charging of the lightly loaded 30 V
the device current limit to 80% of typical to limit overload output. The outputs are regulated using a secondary reference
power. The line sense resistor (R1) protects the TOPSwitch-GX (U3). Both the 3.3 V and 5 V outputs are sensed via R11 and
from line surges and transients by sensing when the DC rail R10. Resistor R8 provides bias for U3 and R7 sets the overall
voltage rises to above 450 V. In this condition the DC gain. Resistor R9, C19, R3 and C4 provide loop
TOPSwitch-GX stops switching, extending the input voltage compensation. A soft-finish capacitor (C20) eliminates output
withstand to 496 VAC which is ideal for countries with poor overshoot.
power quality. A thermistor (RT1) is used to prevent premature
failure of the fuse by limiting the inrush current (due to the
relatively large size of C2). An optional MOV (RV1) extends
the differential surge protection to 6 kV from 4 kV.
PERFORMANCE SUMMARY
Output Power: 45 W Cont./60 W Peak
Regulation:
R6
3.3 V: ± 5% 10 Ω
D7
UF4003 30 V @
5 V: ± 5% L2
0.03 A
C7 C8
12 V: ± 7% D8 47 µF 3.3 µH 10 µF
18 V: ± 7% UF5402 50 V 3A 50 V 18 V @
0.5 A
30 V: ± 8% C9 L3 C10
Efficiency: ≥75% D9 330 µF 3.3 µH 100 µF
No Load Consumption: 0.6 W UF5402 25 V 3A 25 V 12 V @
0.6 A
C11 C13 C16 C12
C6 L4
390 µF 1000 µF 1000 µF 100 µF
2.2 nF 35 V 25 V 25 V 3.3 µH
Y1 25 V
VR1 5A 5V@
R5 3.2 A
P6KE170 68 kΩ
2W C14 L5 C15
D10 1000 µF 3.3 µH 220 µF
BYV32-200 25 V 5A 165 V 3.3 V @
C5 3A
1 nF C18
400 V D11 C17
MBR1045 220 µF
1000 µF 16 V
D1-D4 25 V
1N4007 V D6 RTN
1N4937
C2
L1 68 µF
20 mH 400 V D6 C3 R10
R7 15.0
0.8A R1 1N4148 1 µF 150 Ω
50 V kΩ
C1 2 MΩ T1 U2
1/2 W R8
0.1 µF LTV817
1 kΩ R11
X1 9.53
kΩ
RV1 D L TOPSwitch-GX
275 V CONTROL R9 C19
3.3 kΩ 0.1 µF
14 mm C
F1 TOP246Y C3
0.1 µF R3
J1
3.15 A U1 S X F 6.8 Ω
RT1 50 V
185-265 VAC
t°
10 Ω .R2 C5 C20 U3
L
1.7 A 9.08 kΩ 47 µF 22 µF TL431 R12
10 V 10 V 10 k
N
PI-2693-033001
Figure 44. 60 W Multiple Output Power Supply using TOP246.
E
24 7/01 August 8, 2000
TOP242-249
Processor Controlled Supply Turn On/Off position. In the case of products with a disk drive, the shutdown
A low cost momentary contact switch can be used to turn the procedure may include saving data or settings to the disk. After
TOPSwitch-GX power on and off under microprocessor control the shutdown procedure is complete, when it is safe to turn off
that may be required in some applications such as printers. The the power supply, the microprocessor releases the M pin by
low power remote off feature allows an elegant implementation turning the optocoupler U4 off. If the manual switch and the
of this function with very few external components as shown in optocouplers U3 and U4 are not located close to the M pin, a
Figure 45. Whenever the push button momentary contact capacitor CM may be needed to prevent noise coupling to the pin
switch P1 is closed by the user, the optocoupler U3 is activated when it is open.
to inform the microprocessor of this action. Initially, when the
power supply is off (M pin is floating), closing of P1 turns the The power supply could also be turned on remotely through a
power supply on by shorting the M pin of the TOPSwitch-GX local area network or a parallel or serial port by driving the
to SOURCE through a diode (remote on). When the secondary optocoupler U4 input LED with a logic signal. Sometimes it is
output voltage VCC is established, the microprocessor comes easier to send a train of logic pulses through a cable (due to AC
alive and recognizes that the switch P1 is closed through the coupling of cable, for example) instead of a DC logic level as
switch status input that is driven by the optocoupler U3 output. a wake up signal. In this case, a simple RC filter can be used to
The microprocessor then sends a power supply control signal to generate a DC level to drive U4 (not shown in Figure 45). This
hold the power supply in the on-state through the optocoupler remote on feature can be used to wake up peripherals such as
U4. If the user presses the switch P1 again to command a turn printers, scanners, external modems, disk drives, etc., as needed
off, the microprocessor detects this through the optocoupler U3 from a computer. Peripherals are usually designed to turn off
and initiates a shutdown procedure that is product specific. For automatically if they are not being used for a period of time, to
example, in the case of the inkjet printer, the shutdown procedure save power.
may include safely parking the print heads in the storage
VCC
(+5 V)
External
High Voltage Wake-up
Signal
DC Input
MICRO Power
PROCESSOR/ Supply
100 kΩ CONTROLLER ON/OFF
U2 Control
27 kΩ
LOGIC LOGIC 1N4148

1N4148
INPUT OUTPUT 6.8 kΩ
D M TOPSwitch-GX
U4
CONTROL
U3 C
6.8 kΩ
CM 47 µF
S F U1 U3
P1 1 nF P1 Switch
LTV817A Status U4
-
LTV817A
RETURN
PI-2561-033001
Figure 45. Remote ON/OFF using Microcontroller.
August 8, 2000 E
7/01 25
TOP242-249
In addition to using a minimum number of components, sequence when it detects the first closure of the switch, and
TOPSwitch-GX provides many technical advantages in this subsequent bouncing of the switch has no effect. If necessary,
type of application: the microprocessor could implement the switch debouncing
in software during turn-off, or a filter capacitor can be used
1. Extremely low power consumption in the off mode: 80 mW at the switch status input.
typical at 110 VAC and 160 mW typical at 230 VAC. This
is because in the remote/off mode the TOPSwitch-GX 4. No external current limiting circuitry is needed for the
consumes very little power, and the external circuitry does operation of the U4 optocoupler output due to internal
not consume any current (either M, L or X pin is open) from limiting of M pin current.
the high voltage DC input.
5. No high voltage resistors to the input DC voltage rail are
2. A very low cost, low voltage/current, momentary contact required to power the external circuitry in the primary. Even
switch can be used. the LED current for U3 can be derived from the CONTROL
pin. This not only saves components and simplifies layout,
3. No debouncing circuitry for the momentary switch is required. but also eliminates the power loss associated with the high
During turn-on, the start-up time of the power supply voltage resistors in both on and off states.
(typically 10 to 20 ms) plus the microprocessor initiation
time act as a debouncing filter, allowing a turn-on only if the 6. Robust design: There is no on/off latch that can be accidentally
switch is depressed firmly for at least the above delay time. triggered by transients. Instead, the power supply is held in
During turn-off, the microprocessor initiates the shutdown the on-state through the secondary side microprocessor.
E
26 7/01 August 8, 2000
TOP242-249
Key Application Considerations

TOPSwitch-II vs. TOPSwitch-GX
Table 4 compares the features and performance differences Other features increase the robustness of design allowing cost
between TOPSwitch-GX and TOPSwitch-II. Many of the new savings in the transformer and other power components.
features eliminate the need for additional discrete components.
Function TOPSwitch-II TOPSwitch-GX Figures TOPSwitch-GX Advantages
Soft-Start N/A* 10 ms • Limits peak current and voltage

component stresses during start-up
• Eliminates external components
used for soft-start in most
applications
• Reduces or eliminates output
overshoot
External Current Limit N/A* Programmable 11,20,21, • Smaller transformer
100% to 30% of 24,25,27, • Higher efficiency
default current 28,34,35, • Allows power limiting (constant over-
limit 38,39 load power independent of line
voltage
• Allows use of larger device for lower
losses, higher efficiency and smaller
heatsink
DCMAX 67% 78% 7 • Smaller input cap (wider dynamic
range)
• Higher power capability (when used
with RCD clamp for large VOR)
• Allows use of Schottky secondary
rectifier diode for up to 15 V output
for high efficiency
Line Feed Forward with N/A* 78% to 38% 7,11,17, • Rejects line ripple
DCMAX Reduction 26,27,28,
31,40
Line OV Shutdown N/A* Single resistor 11,17,19, • Increases voltage withstand cap-
programmable 26,27,28, ability against line surge
31,33,40
Line UV Detection N/A* Single resistor 11,17,18, • Prevents auto-restart glitches
programmable 26,27,28, during power down
31,32,40
Switching Frequency 100 kHz ±10% 132 kHz ±6% 13,15 • Smaller transformer
• Below start of conducted EMI limits
Switching Frequency N/A* 66 kHz ±7% 14,15 • Lower losses when using RC and
Option (Y and R RCD snubber for noise reduction in
Packages) video applications
• Allows for higher efficiency in
standby mode
• Lower EMI (second harmonic below
150 kHz)
Frequency Jitter N/A* ±4 kHz@132 kHz 9,46 • Reduces conducted EMI
±2 kHz@66 kHz
Frequency Reduction N/A* At a Duty Cycle 7 • Zero load regulation without dummy
below 10% load
• Low power consumption at no load
Table 4. Comparison Between TOPSwitch-II and TOPSwitch-GX. (continued on next page) *Not available
August 8, 2000 E
7/01 27
TOP242-249
Function TOPSwitch-II TOPSwitch-GX Figures TOPSwitch-GX Advantages
Remote ON/OFF N/A* Single transistor 11, 22, • Fast on/off (cycle by cycle)
or optocoupler 23, 24, • Active-on or active-off control
interface or manual 25, 26, • Low consumption in remote off state
switch 27, 29, • Active-on control for fail-safe
36, 37, • Eliminates expensive in-line on/off
38, 39, switch
40 • Allows processor controlled turn
on/off
• Permits shutdown/wake-up of
peripherals via LAN or parallel port
Synchronization N/A* Single transistor • Synchronization to external lower
or optocoupler frequency signal
interface • Starts new switching cycle on
demand
Thermal Shutdown 125 °C min. Hysteretic 130 °C • Automatic recovery from thermal
Latched min. Shutdown (with fault
75 °C hysteresis) • Large hysteresis prevents circuit
board overheating
Current Limit Tolerance ±10% (@25 °C) ±7% (@25 °C) • 10% higher power capability due to
-8% (0 °C to100 °C) -4% (0 °C to 100 °C) tighter tolerance
DRAIN DIP 0.037" / 0.94 mm 0.137" / 3.48 mm • Greater immunity to arcing as a
Creepage SMD 0.037" / 0.94 mm 0.137" / 3.48 mm result of build-up of dust, debris and
at Package TO-220 0.046" / 1.17 mm 0.068" / 1.73 mm other contaminants
DRAIN Creepage at 0.045" / 1.14 mm 0.113" / 2.87 mm • Preformed leads accommodate
PCB for Y and R (R Package N/A*) (preformed leads) large creepage for PCB layout
Packages • Easier to meet Safety (UL/VDE)
Table 4 (cont). Comparison Between TOPSwitch-II and TOPSwitch-GX. *Not available
TOPSwitch-FX vs. TOPSwitch-GX
Table 5 compares the features and performance differences Other features increase the robustness of design allowing cost
between TOPSwitch-GX and TOPSwitch-FX. Many of the new savings in the transformer and other power components.
features eliminate the need for additional discrete components.
Function TOPSwitch-FX TOPSwitch-GX TOPSwitch-GX Advantages
Light Load Operation Cycle skipping Frequency and Duty Cycle • Improves light load efficiency
reduction • Reduces no-load consumption
Line Sensing/Externally Line sensing and Line sensing and externally • Additional design flexibility allows all
Set Current Limit externally set set current limit possible features to be used simultaneously
(Y and R Packages) current limit simultaneously
mutually (functions split onto
exclusive (M pin) L and X pins)
Current Limit 100-40% 100-30% • Minimizes transformer core size
Programming in highly continuous designs
Range
Table 5. Comparison Between TOPSwitch-FX and TOPSwitch-GX. (continued on next page)
E
28 7/01 August 8, 2000
TOP242-249
Function TOPSwitch-FX TOPSwitch-GX TOPSwitch-GX Advantages
P/G Package Current Identical to Y TOP243P or G and • Matches device current limit to
Limits packages TOP244P or G internal package dissipation capability
current limits reduced • Allows more continuous design to
lower device dissipation (lower RMS
currents)
Y/R Package Current 100% 90% (for equivalent RDS (ON)) • Minimizes transformer core size
Limits (R package N/A*) • Optimizes efficiency for most
applications
Thermal Shutdown 125 °C min. 130 °C min. 75 °C • Allows higher output powers in
70 °C hysteresis hysteresis high ambient temperature
applications
Maximum Duty Cycle 90 µA 60 µA • Reduces output line frequency
Reduction Threshold ripple at low line
• DMAX reduction optimized for
forward design
Line Under-Voltage N/A* 40% of positive (turn-on) • Provides a well defined turn-off
Negative (turn-off) threshold threshold as the line voltage falls
Threshold
Soft-Start 10 ms (duty cycle) 10 ms (duty cycle + current • Gradually increasing current limit
limit) in addition to duty cycle during soft-
start further reduces peak current
and voltage
• Further reduces component
stresses during start up
Table 5 (cont). Comparison Between TOPSwitch-FX and TOPSwitch-GX. *Not available
TOPSwitch-GX Design Considerations applications where higher efficiency is needed or minimal heat
sinking is available.
Power Table
Datasheet power table represents the maximum practical Input Capacitor
continuous output power based on the following conditions: The input capacitor must be chosen to provide the minimum
TOP242 to TOP246: 12 V output, Schottky output diode, DC voltage required for the TOPSwitch-GX converter to maintain
150 V reflected voltage (VOR) and efficiency estimates from regulation at the lowest specified input voltage and maximum
curves contained in application note AN-29. TOP247 to TOP249: output power. Since TOPSwitch-GX has a higher DCMAX than
Higher output voltages used with a maximum output current of TOPSwitch-II, it is possible to use a smaller input capacitor.
6 A. For TOPSwitch-GX, a capacitance of 2 µF per watt is possible
for universal input with an appropriately designed transformer.
For all devices a 100 VDC minimum for 85-265 VAC and 250
VDC minimum for 230 VDC are assumed and sufficient heat Primary Clamp and Output Reflected Voltage VOR
sinking to keep device temperature ≤ 100 °C. Power levels A primary clamp is necessary to limit the peak TOPSwitch-GX
shown in the power table for the R package device assume drain to source voltage. A Zener clamp requires few parts and
6.45 cm2 of 610 g/m2 copper heat sink area in an enclosed takes up little board space. For good efficiency, the clamp
adapter, or 19.4 cm2 in an open frame. Zener should be selected to be at least 1.5 times the output
reflected voltage VOR as this keeps the leakage spike conduction
TOPSwitch-GX Selection time short. When using a Zener clamp in a universal input
Selecting the optimum TOPSwitch-GX depends upon required application, a VOR of less than 135 V is recommended to allow
maximum output power, efficiency, heat sinking constraints for the absolute tolerances and temperature variations of the
and cost goals. With the option to externally reduce current Zener. This will ensure efficient operation of the clamp circuit
limit, a larger TOPSwitch-GX may be used for lower power and will also keep the maximum drain voltage below the rated
breakdown voltage of the TOPSwitch-GX MOSFET.
August 8, 2000 E
7/01 29
TOP242-249
A high VOR is required to take full advantage of the wider DCMAX For 10 W or below, it is possible to use a simple inductor in
of TOPSwitch-GX. An RCD clamp provides tighter clamp place of a more costly AC input common mode choke to meet
voltage tolerance than a Zener clamp and allows a VOR as high worldwide conducted EMI limits.
as 150 V. RCD clamp dissipation can be minimized by
reducing the external current limit as a function of input line Transformer Design
voltage (see Figure 21 and 35). The RCD clamp is more cost It is recommended that the transformer be designed for maximum
effective than the Zener clamp but requires more careful design operating flux density of 3000 Gauss and a peak flux density of
(see quick design checklist). 4200 Gauss at maximum current limit. The turns ratio should be
chosen for a reflected voltage (VOR) no greater than 135 V when
Output Diode using a Zener clamp, or 150 V (max) when using RCD clamp
The output diode is selected for peak inverse voltage, output with current limit reduction with line voltage (overload
current, and thermal conditions in the application (including protection).
heatsinking, air circulation, etc.). The higher DCMAX of
TOPSwitch-GX along with an appropriate transformer turns For designs where operating current is significantly lower than
ratio can allow the use of a 60 V Schoktty diode for higher the default current limit, it is recommended to use an externally
efficiency on output voltages as high as 15 V (see Figure 41. A set current limit close to the operating peak current to reduce
12 V, 30 W design using a 60 V Schottky for the output diode). peak flux density and peak power (see Figure 20 and 34). In
most applications, the tighter current limit tolerance, higher
Bias Winding Capacitor
80
PI-2576-010600
Due to the low frequency operation at no-load a 1µF bias
winding capacitor is recommended. 70 TOPSwitch-II (no jitter)
Amplitude (dBµV) 60
Soft-Start 50
Generally a power supply experiences maximum stress at start-
40
up before the feedback loop achieves regulation. For a period
of 10 ms the on-chip soft-start linearly increases the duty cycle 30
from zero to the default DCMAX at turn on. In addition, the 20
primary current limit increases from 85% to 100% over the -10
same period. This causes the output voltage to rise in an orderly
0
manner allowing time for the feedback loop to take control of EN55022B (QP)
the duty cycle. This reduces the stress on the TOPSwitch-GX -10 EN55022B (AV)
MOSFET, clamp circuit and output diode(s), and helps prevent -20
transformer saturation during start-up. Also soft-start limits the 0.15 1 10 30
amount of output voltage overshoot, and in many applications Frequency (MHz)
eliminates the need for a soft-finish capacitor.
Figure 46a. TOPSwitch-II Full Range EMI Scan
(100 kHz, no jitter)
EMI
The frequency jitter feature modulates the switching frequency 80
PI-2577-010600
over a narrow band as a means to reduce conducted EMI peaks 70 TOPSwitch-GX (with jitter)
associated with the harmonics of the fundamental switching 60
frequency. This is particularly beneficial for average detection
Amplitude (dBµV)
50
mode. As can be seen in Figure 46, the benefits of jitter increase
with the order of the switching harmonic due to an increase in 40
frequency deviation. 30
20
The FREQUENCY pin of TOPSwitch-GX offers a switching
frequency option of 132 kHz or 66 kHz. In applications that -10
require heavy snubbers on the drain node for reducing high 0
frequency radiated noise (for example, video noise sensitive EN55022B (QP)
-10 EN55022B (AV)
applications such as VCR, DVD, monitor, TV, etc.), operating -20
at 66 kHz will reduce snubber loss resulting in better efficiency. 0.15 1 10 30
Also, in applications where transformer size is not a concern,
Frequency (MHz)
use of the 66 kHz option will provide lower EMI and higher
efficiency. Note that the second harmonic of 66 kHz is still Figure 46b. TOPSwitch-GX Full Range EMI Scan (132 kHz,
below 150 kHz, above which the conducted EMI specifications with jitter) with Identical Circuitry and
Conditions.
get much tighter.
E
30 7/01 August 8, 2000
TOP242-249
switching frequency and soft-start features of TOPSwitch-GX Y-Capacitor

contribute to a smaller transformer when compared to The Y-capacitor should be connected close to the secondary
TOPSwitch-II. output return pin(s) and the positive primary DC input pin of the
transformer.
Standby Consumption
Frequency reduction can significantly reduce power loss at Heat Sinking
light or no load, especially when a Zener clamp is used. For very The tab of the Y package (TO-220) is internally electrically
low secondary power consumption use a TL431 regulator for tied to the SOURCE pin. To avoid circulating currents, a heat
feedback control. Alternately, switching losses can be sink attached to the tab should not be electrically tied to any
significantly reduced by changing from 132 kHz in normal primary ground/source nodes on the PC board.
operation to 66 kHz under light load conditions.
When using a P (DIP-8), G (SMD-8) or R (TO-263) package,
TOPSwitch-GX Layout Considerations a copper area underneath the package connected to the SOURCE
pins will act as an effective heat sink. On double sided boards
As TOPSwitch-GX has additional pins and operates at much (Figure 49), top side and bottom side areas connected with vias
higher power levels compared to previous TOPSwitch can be used to increase the effective heat sinking area.
families, the following guidelines should be carefully
followed. In addition, sufficient copper area should be provided at the
anode and cathode leads of the output diode(s) for heat sinking.
Primary Side Connections
Use a single point (Kelvin) connection at the negative terminal In Figures 47, 48 and 49 a narrow trace is shown between the
of the input filter capacitor for TOPSwitch-GX source pin and output rectifier and output filter capacitor. This trace acts as a
bias winding return. This improves surge capabilities by returning thermal relief between the rectifier and filter capacitor to
surge currents from the bias winding directly to the input filter prevent excessive heating of the capacitor.
capacitor.
Quick Design Checklist
The CONTROL pin bypass capacitor should be located as
As with any power supply design, all TOPSwitch-GX designs
close as possible to the SOURCE and CONTROL pins and its
should be verified on the bench to make sure that components
SOURCE connection trace should not be shared by the main
specifications are not exceeded under worst case conditions.
MOSFET switching currents. All SOURCE pin referenced
The following minimum set of tests is strongly recommended:
components connected to the MULTI-FUNCTION, LINE-
SENSE or EXTERNAL CURRENT LIMIT pins should also be
1. Maximum drain voltage – Verify that peak VDS does not
located closely between their respective pin and SOURCE.
exceed 675 V at highest input voltage and maximum overload
Once again the SOURCE connection trace of these components
output power. Maximum overload output power occurs
should not be shared by the main MOSFET switching currents.
when the output is overloaded to a level just before the
It is very critical that SOURCE pin switching currents are
power supply goes into auto-restart (loss of regulation).
returned to the input capacitor negative terminal through a
seperate trace that is not shared by the components connected
2. Maximum drain current – At maximum ambient temperature,
to CONTROL, MULTI-FUNCTION, LINE-SENSE or
maximum input voltage and maximum output load, verify
EXTERNAL CURRENT LIMIT pins. This is because the
drain current waveforms at start-up for any signs of
SOURCE pin is also the controller ground reference pin.
transformer saturation and excessive leading edge current
spikes. TOPSwitch-GX has a leading edge blanking time of
Any traces to the M, L or X pins should be kept as short as
220 ns to prevent premature termination of the on-cycle.
possible and away from the DRAIN trace to prevent noise
Verify that the leading edge current spike is below the
coupling. LINE-SENSE resistor (R1 in figures 47-49) should
allowed current limit envelope (see Figure 52) for the drain
be located close to the M or L pin to minimize the trace length
current waveform at the end of the 220 ns blanking period.
on the M or L pin side.
3. Thermal check – At maximum output power, minimum
In addition to the 47 µF CONTROL pin capacitor, a high
input voltage and maximum ambient temperature, verify
frequency bypass capacitor in parallel may be used for better
that temperature specifications are not exceeded for
noise immunity. The feedback optocoupler output should also
TOPSwitch-GX, transformer, output diodes and output
be located close to the CONTROL and SOURCE pins of
capacitors. Enough thermal margin should be allowed for
TOPSwitch-GX.
August 8, 2000 E
7/01 31
TOP242-249
Safety Spacing Maximize hatched copper

areas ( ) for optimum
Y1- heat sinking
Capacitor
+ Output Rectifier
HV Output Filter Capacitor
Input Filter Capacitor
- PRI T
r
BIAS a SEC
n
s
PRI f
S S D o
r
m
TOPSwitch-GX
e
BIAS r
TOP VIEW
M S S C
Opto-
R1 coupler
- DC +
R2 Out
PI-2670-042301
Figure 47. Layout Considerations for TOPSwitch-GX using P or G Packages.
Safety Spacing
Y1- Maximize hatched copper

+ Capacitor
areas ( ) for optimum
heat sinking
HV Input Filter Capacitor
Output Rectifier
Output Filter Capacitor
-
T
r SEC
a
TOPSwitch-GX
n
D s
f
o
X r
L m
C e
TOP VIEW r
Opto-
R1 Heat Sink coupler
- DC +
Out
PI-2669-042301
Figure 48. Layout Considerations for TOPSwitch-GX using Y Package.
E
32 7/01 August 8, 2000
TOP242-249
Solder Side Output Filter Capacitors

Safety Spacing
Component Side
Y1-
+ Capacitor
TOP VIEW
HV
T
PRI r
Input Filter
a
n
Capacitor PRI s
- SEC
f
R1a - 1c o
r
m
BIAS e
r
D
S
X
L - DC +
C Out
Opto- Maximize hatched copper
coupler
areas( ) for optimum
TOPSwitch-GX heat sinking
PI-2734-043001
Figure 49. Layout Considerations for TOPSwitch-GX using R Package.
the part-to-part variation of the RDS(ON) of TOPSwitch-GX as Design Tools

specified in the data sheet. The margin required can either Up to date information on design tools can be found at the
be calculated from the tolerances or it can be accounted for Power Integrations Web site: www.powerint.com
by connecting an external resistance in series with the
DRAIN pin and attached to the same heatsink, having a
resistance value that is equal to the difference between the
measured RDS(ON) of the device under test and the worst case
maximum specification.
August 8, 2000 E
7/01 33
TOP242-249
ABSOLUTE MAXIMUM RATINGS(1)

DRAIN Voltage ............................................ -0.3 to 700 V LINE SENSE Pin Voltage ................................ -0.3 to 9 V
DRAIN Peak Current: TOP242 ............................... 0.72 A CURRENT LIMIT Pin Voltage ..................... -0.3 to 4.5 V
TOP243 ............................... 1.44 A MULTI-FUNCTION Pin Voltage .................... -0.3 to 9 V
TOP244 ............................... 2.16 A FREQUENCY Pin Voltage ............................... -0.3 to 9 V
TOP245 ............................... 2.88 A Storage Temperature ..................................... -65 to 150 °C
Operating Junction Temperature (2) ............... -40 to 150 °C
TOP246 ............................... 4.32 A
Lead Temperature (3) ............................................... 260 °C
TOP247 ............................... 5.76 A
TOP248 ............................... 7.20 A Notes:
TOP249 ............................... 8.64 A 1. All voltages referenced to SOURCE, TA = 25 °C.
CONTROL Voltage .......................................... -0.3 to 9 V 2. Normally limited by internal circuitry.
CONTROL Current ............................................... 100 mA 3. 1/16" from case for 5 seconds.
THERMAL IMPEDANCE
Thermal Impedance: Y Package (θJA) (1) ............... 70 °C/W Notes:
(θJC) (2) ................ 2 °C/W 1. Free standing with no heatsink.
P or G Package: 2. Measured at the back surface of tab.
(θJA) ...... 45 °C/W (3); 35 °C/W (4) 3. Soldered to 0.36 sq. inch (232 mm2), 2oz. (610 gm/m2) copper clad.
(θJC) (5) ......................... 11 °C/W 4. Soldered to 1 sq. inch (645 mm2), 2oz. (610 gm/m2) copper clad.
5. Measured on the SOURCE pin close to plastic interface.
Conditions
(Unless Otherwise Specified)
Parameter Symbol Min Typ Max Units
See Figure 53
SOURCE = 0 V; TJ = -40 to 125 °C
CONTROL FUNCTIONS
FREQUENCY Pin
Switching IC = 3 mA; Connected to SOURCE
124 132 140
Frequency fOSC
TJ = 25 °C kHz
(average) FREQUENCY Pin 61.5 66 70.5
Connected to CONTROL
Duty Cycle at
ONSET of Fre- DC(ONSET) 10 %
quency Reduction
Switching 132 kHz Operation 30
Frequency near fOSC (DMIN) kHz
0% Duty Cycle 66 kHz Operation 15
Frequency Jitter 132 kHz Operation ±4

∆f kHz
Deviation 66 kHz Operation ±2
Frequency Jitter fM 250 Hz
Modulation Rate
Maximum Duty IL ≤ IL (DC) or IM ≤ IM(DC) 75 78 83
DCMAX IC = ICD1 %
Cycle IL or IM = 190 µA 28 38 50
Soft Start Time tSOFT TJ = 25 °C; DCMIN to DCMAX 10 15 ms
E
34 7/01 August 8, 2000
TOP242-249
Conditions
See Figure 53
SOURCE = 0 V; TJ = -40 to 125 °C
CONTROL FUNCTIONS (cont.)
PWM Gain DCreg IC = 4 mA; TJ = 25 °C -28 -23 -18 %/mA
PWM Gain
See Note A -0.01 %/mA/°C
Temperature Drift
External Bias TOP242-245 1.2 2.0 3.0

lB See Figure 7 mA
Current TOP246-249 1.6 2.6 4.0
CONTROL TOP242-245 6.0 7.0

Current at 0% lC(OFF) TJ = 25 °C mA
Duty Cycle TOP246-249 6.6 8.0
Dynamic IC = 4 mA; TJ = 25 °C
ZC 10 15 22 Ω
Impedance See Figure 51
Dynamic
Impedance 0.18 %/°C
Temperature Drift
Control Pin 7 kHz

Internal Filter Pole
SHUTDOWN/AUTO-RESTART
Control Pin VC = 0 V -5.0 -3.5 -2.0
Charging Current
lC (CH) TJ = 25 °C mA
VC = 5 V -3.0 -1.8 -0.6
Charging Current 0.5

See Note A %/°C
Temperature Drift
Auto-restart Upper VC(AR)U 5.8
Threshold Voltage V
Auto-restart Lower VC(AR)L 4.5 4.8 5.1

Threshold Voltage V
Auto-restart VC(AR)hyst 0.8 1.0

Hysteresis Voltage V
Auto-restart Duty DC(AR) 4 8 %

Cycle
Auto-restart f(AR) 1.0 Hz

Frequency
August 8, 2000 E
7/01 35
TOP242-249
Conditions
See Figure 53
SOURCE = 0 V; TJ = -40 to 125 °C
MULTI-FUNCTION (M), LINE-SENSE (L) AND EXTERNAL CURRENT LIMIT (X) INPUTS
Line Under-Voltage Threshold 44 50 54 µA
Threshold Current lUV TJ = 25 °C
and Hysteresis
Hysteresis 30 µA
(M or L Pin)
Line Over-Voltage Threshold 210 225 240 µA
or Remote ON/
OFF Threshold IOV TJ = 25 °C
Current and Hys- Hysteresis 8 µA
teresis (M or L Pin)
L Pin Voltage VL(TH) 0.5 1.0 1.6 V

Threshold
Remote ON/OFF Threshold -35 -27 -20 µA
Negative Threshold IREM (N) TJ = 25 °C
Current and Hyster-
Hysteresis 5 µA
esis (M or X Pin)
L or M Pin Short IL (SC) or

IM (SC) VL, VM = VC 300 400 520 µA
Circuit Current
X or M Pin Short IX (SC) or Normal Mode -300 -240 -180
IM (SC)
VX, VM = 0 V µA
Circuit Current Auto-restart Mode -110 -90 -70
L or M Pin Voltage lL or lM = 50 µA 1.90 2.50 3.00
VL, VM V
(Positive Current) lL or lM = 225 µA 2.30 2.90 3.30
X Pin Voltage lX = -50 µA 1.26 1.33 1.40
VX V
(Negative Current) lX = -150 µA 1.18 1.24 1.30
M Pin Voltage lM = -50 µA 1.24 1.31 1.39
(Negative Current) VM V
lM = -150 µA 1.13 1.19 1.25
Maximum Duty
Cycle Reduction IL (DC) or
TJ = 25 °C 40 60 75 µA
Onset Threshold IM (DC)
Current
Maximum Duty
Cycle Reduction IL > IL(DC) or IM > IM (DC) 0.25 %/µA
Slope
X, L or M Pin
See Figure 70 0.6 1.0
Remote OFF ID(RMT)
Floating
DRAIN Supply VDRAIN = 150 V mA
Current TJ = 25 °C L or M Pin Shorted 1.0 1.6
to CONTROL
E
36 7/01 August 8, 2000
TOP242-249
Conditions
See Figure 53
SOURCE = 0 V; TJ = -40 to 125 °C
MULTI-FUNCTION (M), LINE-SENSE (L) AND CURRENT LIMIT (I) INPUTS (cont)
Remote ON Delay tR(ON) From Remote On to Drain Turn-On 2.5 µs

See Note B
Remote OFF Minimum Time Before Drain Turn-On

tR(OFF) to Disable Cycle 2.5 µs
Setup Time
See Note B
FREQUENCY INPUT
FREQUENCY Pin VF See Note B 2.9 V
Threshold Voltage
FREQUENCY Pin IF VF = V C 10 40 100 µA
Input Current
CIRCUIT PROTECTION
TOP242 P/G Internal; di/dt=90 mA/µs
TOP242 Y/R 0.418 0.45 0.481
TJ= 25 °C See Note C
TJ= 25 °C 0.697 0.75 0.802
See Note C
TOP243 Y/R Internal; di/dt=180 mA/µs
TJ= 25 °C 0.837 0.90 0.963
See Note C
TJ= 25 °C 0.930 1.00 1.070
See Note C
Self Protection ILIMIT TOP244 Y/R Internal; di/dt=270 mA/µs
1.256 1.35 1.445
Current Limit TJ= 25 °C See Note C A
TJ= 25 °C 1.674 1.80 1.926
See Note C
TJ= 25 °C 2.511 2.70 2.889
See Note C
TJ= 25 °C 3.348 3.60 3.852
See Note C
TJ= 25 °C 4.185 4.50 4.815
See Note C
TOP249 Y/R Internal;di/dt=1080 mA/µs
TJ= 25 °C 5.022 5.40 5.778
See Note C
≤ 85 VAC 0.75 x
See (Rectified Line Input) ILIMIT(MIN)
Initial Current Limit IINIT A
Note B 265 VAC 0.6 x
(Rectified Line Input) ILIMIT(MIN)
Leading Edge See Fig. 52

tLEB IC = 4 mA 220 ns
Blanking Time TJ = 25 °C
August 8, 2000 E
7/01 37
TOP242-249
Conditions
See Figure 53
SOURCE = 0 V; TJ = -40 to 125 °C
CIRCUIT PROTECTION (cont)
Current Limit Delay tIL(D) IC = 4 mA 100 ns
Thermal Shutdown 130 140 150 °C

Temperature
Thermal Shutdown °C
75
Hysteresis
Power-up Reset VC(RESET) Figure 53, S1 Open 1.75 3.0 4.25 V
Threshold Voltage
OUTPUT
TOP242 TJ = 25 °C 15.6 18.0
ID = 50 mA TJ = 100 °C 25.7 30.0
TOP243 TJ = 25 °C 7.80 9.00
ID = 100 mA TJ = 100 °C 12.9 15.0
TOP244 TJ = 25 °C 5.20 6.00
ID = 150 mA TJ = 100 °C 8.60 10.0
TOP245 TJ = 25 °C 3.90 4.50
ID = 200 mA TJ = 100 °C 6.45 7.50
ON-State RDS(ON)
TOP246 TJ = 25 °C 2.60 3.00 Ω
Resistance
ID = 300 mA TJ = 100 °C 4.30 5.00
TOP247 TJ = 25 °C 1.95 2.25
ID = 400 mA TJ = 100 °C 3.22 3.75
TOP248 TJ = 25 °C 1.56 1.80
ID = 500 mA TJ = 100 °C 2.58 3.00
TOP249 TJ = 25 °C 1.30 1.50
ID = 600 mA TJ = 100 °C 2.15 2.50
Off-State VL, VM = Floating; IC = 4mA
IDSS 400 µA
Current VDS = 560 V; TJ = 125 °C
Breakdown BVDSS
VL, VM = Floating; IC = 4mA
700 V
Voltage ID = 100 µA; TJ = 25 °C
Rise tR 100 ns
Time Measured in a Typical
Fall Flyback Converter Application
tF 50 ns
Time
E
38 7/01 August 8, 2000
TOP242-249
Conditions
See Figure 53
SOURCE = 0 V; TJ = -40 to 125 °C
SUPPLY VOLTAGE CHARACTERISTICS

DRAIN Supply See Note D 36 V
Voltage
Shunt Regulator VC(SHUNT) IC = 4 mA 5.60 5.85 6.10 V
Voltage
Shunt Regulator ±50 ppm/°C
Temperature Drift
Output TOP 242-245 1.0 1.6 2.5
lCD1 MOSFET Enabled
VL , VM = 0 V TOP 246-249 1.2 2.2 3.2
Control Supply/ mA
Discharge Current Output
lCD2 MOSFET Disabled 0.3 0.6 1.3
VL, VM = 0 V
NOTES:
A. For specifications with negative values, a negative temperature coefficient corresponds to an increase in
magnitude with increasing temperature, and a positive temperature coefficient corresponds to a decrease in
magnitude with increasing temperature.
B. Guaranteed by characterization. Not tested in production.
C. For externally adjusted current limit values, please refer to Figure 55 (Current Limit vs. External Current Limit
Resistance) in the Typical Performance Characteristics section.
D. It is possible to start up and operate TOPSwitch-GX at DRAIN voltages well below 36 V. However, the
CONTROL pin charging current is reduced, which affects start-up time, auto-restart frequency, and auto-restart
duty cycle. Refer to Figure 67, the characteristic graph on CONTROL pin charge current (IC) vs. DRAIN voltage
for low voltage operation characteristics.
August 8, 2000 E
7/01 39
TOP242-249
t2
t1
HV
90% 90%
DRAIN t
D= 1
VOLTAGE t2
10%
0V
PI-2039-033001
Figure 50. Duty Cycle Measurement.
PI-2022-033001
tLEB (Blanking Time)
120 1.3
PI-1939-091996
1.2
DRAIN Current (normalized)

CONTROL Pin Current (mA)
100 1.1
1.0
80 0.9
0.8
IINIT(MIN) @ 85 VAC
0.7
60 IINIT(MIN) @ 265 VAC
0.6
0.5
40
0.4 ILIMIT(MAX) @ 25 °C
Dynamic 1 ILIMIT(MIN) @ 25 °C
= 0.3
Impedance Slope
20 0.2
0.1
0 0
0 2 4 6 8 10 0 1 2 3 4 5 6 7 8
CONTROL Pin Voltage (V) Time (µs)
Figure 51. CONTROL Pin I-V Characteristic. Figure 52. Drain Current Operating Envelope.
Y or R Package (X and L Pin) P or G Package (M Pin)
S1 470 Ω 0-100 kΩ
0-100 kΩ
5W
S5
5-50 V M
5-50 V
0-60 kΩ
40 V
L D
470 Ω CONTROL
C C TOPSwitch-GX
S2
S4 F X S
0-15 V
S3
47 µF 0.1 µF
0-60 kΩ
NOTES: 1. This test circuit is not applicable for current limit or output characteristic measurements.
2. For P and G packages, short all SOURCE pins together. PI-2631-033001
Figure 53. TOPSwitch-GX General Test Circuit.
E
40 7/01 August 8, 2000
TOP242-249
BENCH TEST PRECAUTIONS FOR EVALUATION OF ELECTRICAL CHARACTERISTICS
The following precautions should be followed when testing restart mode, there is only a 12.5% chance that the CONTROL
TOPSwitch-GX by itself outside of a power supply. The pin oscillation will be in the correct state (drain active state) so
schematic shown in Figure 53 is suggested for laboratory that the continuous drain voltage waveform may be observed.
testing of TOPSwitch-GX. It is recommended that the VC power supply be turned on first
and the DRAIN pin power supply second if continuous drain
When the DRAIN pin supply is turned on, the part will be in the voltage waveforms are to be observed. The 12.5% chance of
auto-restart mode. The CONTROL pin voltage will be oscillating being in the correct state is due to the divide-by-8 counter.
at a low frequency between 4.8 and 5.8 V and the drain is turned Temporarily shorting the CONTROL pin to the SOURCE pin
on every eighth cycle of the CONTROL pin oscillation. If the will reset TOPSwitch-GX, which then will come up in the
CONTROL pin power supply is turned on while in this auto- correct state.
Typical Performance Characteristics

PI-2653-033001
1.1
1.0 Scaling Factors: 200

TOP242: .45
0.9 TOP243 P/G: .75 180
TOP243 Y/R: .90
Current Limit (A)
0.8 TOP244 P/G: 1 160
di/dt (mA/µs)
TOP244 Y/R: 1.35
0.7 TOP245 Y/R: 1.80 140
TOP246 Y/R: 2.70
0.6 TOP247 Y/R: 3.60 120
TOP248 Y/R: 4.50
0.5 TOP249 Y/R: 5.40 100
0.4 80
0.3 60
0.2 40
-250 -200 -150 -100 -50 0
IM (µA)
Figure 54. Current Limit vs. MULTI-FUNCTION Pin Current.
PI-2652-033001
1.1
1.0 Scaling Factors: 200

TOP242: .45
0.9 TOP243 P/G: .75 180
TOP243 Y/R: .90
Current Limit (A)
0.8 TOP244 P/G: 1 160

di/dt (mA/µs)
Maximum
TOP244 Y/R: 1.35
0.7 140
Minimum TOP245 Y/R: 1.80
TOP246 Y/R: 2.70
0.6 120
TOP247 Y/R: 3.60
Typical TOP248 Y/R: 4.50
0.5 100
TOP249 Y/R: 5.40
0.4 80
Maximum and minimum levels
0.3 are based on characterization. 60
0.2 40
0 5K 10K 15K 20K 25K 30K 35K 40K 45K
External Current Limit Resistor RIL (Ω)
Figure 55. Current Limit vs. External Current Limit Resistance.
August 8, 2000 E
7/01 41
TOP242-249
Typical Performance Characteristics (cont.)

1.1 1.2
PI-1123A-033001
PI-176B-033001
1.0
(Normalized to 25 °C)
Output Frequency
Breakdown Voltage
0.8
1.0 0.6
0.4
0.2
0.9 0
-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
Junction Temperature (°C) Junction Temperature (°C)
Figure 56. Breakdown Voltage vs. Temperature. Figure 57. Frequency vs. Temperature.
1.2 1.2
PI-2555-033001
PI-2554-033001
1.0 1.0
Current Limit
Current Limit
0.8 0.8
0.6 0.6
0.4 0.4
0.2 0.2
0 0
-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150

Figure 58. Internal Current Limit vs. Temperature. Figure 59. External Current Limit vs. Temperature
with RIL =12 kΩ.
1.2 1.2
PI-2553-033001
PI-2552-033001
Under-Voltage Threshold
Overvoltage Threshold
1.0 1.0
0.8 0.8
0.6 0.6
0.4 0.4
0.2 0.2
0 0
-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
Figure 60. Overvoltage Threshold vs. Temperature. Figure 61. Under-Voltage Threshold vs. Temperature.
E
42 7/01 August 8, 2000
TOP242-249

6.0 1.6
PI-2688-102700
PI-2689-102300
VX = 1.33 - IXx 0.66 kΩ
LINE SENSE Pin Voltage (V)
EXTERNAL CURRENT LIMIT

5.5 1.4
-200 µA ≤ IX ≤ -25 µA
5.0 1.2
Pin Voltage (V)

4.5 1.0
4.0 0.8
3.5 0.6
3.0 0.4
2.5 0.2
2.0 0
0 100 200 300 400 -240 -180 -120 -60 0
LINE-SENSE Pin Current (µA) EXTERNAL CURRENT LIMIT Pin Current (µA)
Figure 62a. LINE-SENSE Pin Voltage vs. Current. Figure 62b. EXTERNAL CURRENT LIMIT Pin Voltage
vs. Current.
6 1.6
PI-2541-102700
PI-2542-102700
MULTI-FUNCTION Pin Voltage (V)
MULTI-FUNCTION Pin Voltage (V)

VM = 1.37 - IMx 1 kΩ
1.4
5 -200 µA ≤ IM ≤ -25 µA
1.2
4
1.0
3 0.8
0.6
2
0.4
See
1 Expanded
Version 0.2
0 0
-300 -200 -100 0 100 200 300 400 500 -300 -250 -200 -150 -100 -50 0
MULTI-FUNCTION Pin Current (µA) MULTI-FUNCTION Pin Current (µA)
Figure 63a. MULTI-FUNCTION Pin Voltage vs. Current. Figure 63b. MULTI-FUNCTION Pin Voltage vs.
Current (Expanded).
1.2 1.2
PI-2562-033001
PI-2563-033001
Onset Threshold Current
1.0 1.0
CONTROL Current
0.8 0.8
0.6 0.6
0.4 0.4
0.2 0.2
0 0
-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
Figure 64. Control Current Out at 0% Duty Cycle vs. Figure 65. Max. Duty Cycle Reduction Onset Threshold
Temperature. Current vs. Temperature.
August 8, 2000 E
7/01 43
TOP242-249

6 IC vs. DRAIN VOLTAGE
PI-2645-033001
2
PI-2564-101499
VC = 5 V
5
DRAIN Current (A)
Charging Current (mA)

1.6
4
TCASE = 25 °C
CONTROL Pin
TCASE = 100 °C
1.2
3
Scaling Factors:
TOP249 1.00
2 TOP248 0.83 0.8
TOP247 0.67
TOP246 0.50
1 TOP245 0.33
TOP244 0.25 0.4
TOP243 0.17
TOP242 0.08
0 0
0 2 4 6 8 10 12 14 16 18 20 0 20 40 60 80 100
DRAIN Voltage (V) DRAIN Voltage (V)
Figure 66. Output Characteristics. Figure 67. IC vs. DRAIN Voltage.
10000 600
PI-2646-033001
PI-2650-033001
Scaling Factors:
DRAIN Capacitance (pF)
500 TOP249 1.00

TOP248 0.83
Scaling Factors: TOP247 0.67
1000 TOP249 1.00 400 TOP246 0.50
Power (mW)
TOP248 0.83 TOP245 0.33

TOP247 0.67 TOP244 0.25
TOP246 0.50 TOP243 0.17
TOP245 0.33
300 TOP242 0.08
TOP244 0.25
100 TOP243 0.17
TOP242 0.08 200
100
10 0
0 100 200 300 400 500 600
0 100 200 300 400 500 600
Drain Voltage (V) DRAIN Voltage (V)
Figure 68. COSS vs. DRAIN Voltage. Figure 69. DRAIN Capacitance Power.
Remote OFF DRAIN Supply Current
1.2
PI-2690-102700
1.0
0.8
0.6
0.4
0.2
0
-50 0 50 100 150
Junction Temperature (°C)
Figure 70. Remote OFF DRAIN Supply Current

vs. Temperature.
E
44 7/01 August 8, 2000
TOP242-249
PART ORDERING INFORMATION

TOPSwitch Product Family
GX Series Number
Package Identifier
G Plastic Surface Mount DIP
(242, 243 & 244 only)
P Plastic DIP
Y Plastic TO-220-7C
R Plastic TO-263-7C (available only with TL option)
Package/Lead Options
TOP 242 G - TL Blank Standard Configurations

TL Tape & Reel, (G Package: 1 k min., R Package: 750 min.)
TO-220-7C
.165 (4.19)
.185 (4.70)
.400 (10.16) .045 (1.14)
.146 (3.71) .415 (10.54) .055 (1.40)
.156 (3.96)
.108 (2.74) REF
+ .236 (5.99)
.260 (6.60)
.467 (11.86) .570 (14.48)

.487 (12.37) REF.
7° TYP. .670 (17.02)
.860 (21.84) REF.
.880 (22.35)
.095 (2.41)
.115 (2.92)
PIN 1 & 7 PIN 2 & 4
PIN 1 .026 (.66) .040 (1.02)

.010 (.25) M
.032 (.81) .060 (1.52)
.050 (1.27) BSC .015 (.38) .040 (1.02)
.020 (.51) .060 (1.52)
.150 (3.81) BSC
.190 (4.83)
.210 (5.33)
.050 (1.27)
.050 (1.27) Notes:
1. Controlling dimensions are inches. Millimeter
dimensions are shown in parentheses.
.050 (1.27)
2. Pin numbers start with Pin 1, and continue
.050 (1.27) from left to right when viewed from the front.
3. Dimensions do not include mold flash or
.200 (5.08) .180 (4.58) other protrusions. Mold flash or protrusions
shall not exceed .006 (.15mm) on any side.
.100 (2.54) 4. Minimum metal to metal spacing at the pack-
PIN 1 PIN 7 age body for omitted pin locations is .068
inch (1.73 mm).
.150 (3.81) .150 (3.81) 5. Position of terminals to be measured at a
location .25 (6.35) below the package body.
Y07C MOUNTING HOLE PATTERN 6. All terminals are solder plated.
PI-2644-040501
August 8, 2000 E
7/01 45
TOP242-249
DIP-8B
⊕ D S .004 (.10) Notes:
-E- 1. Package dimensions conform to JEDEC specification
MS-001-AB (Issue B 7/85) for standard dual-in-line (DIP)
package with .300 inch row spacing.
2. Controlling dimensions are inches. Millimeter sizes are
shown in parentheses.
3. Dimensions shown do not include mold flash or other
.245 (6.22)
protrusions. Mold flash or protrusions shall not exceed
.255 (6.48)
.006 (.15) on any side.
4. Pin locations start with Pin 1, and continue counter-clock-
wise to Pin 8 when viewed from the top. The notch and/or
dimple are aids in locating Pin 1. Pin 6 is omitted.
Pin 1 5. Minimum metal to metal spacing at the package body for
the omitted lead location is .137 inch (3.48 mm).
.375 (9.53) 6. Lead width measured at package body.
-D- 7. Lead spacing measured with the leads constrained to be
.385 (9.78)
.057 (1.45) perpendicular to plane T.
.063 (1.60)
(NOTE 6)
.128 (3.25) 0.15 (.38)
.132 (3.35) MINIMUM
-T-
SEATING .010 (.25)
PLANE .125 (3.18) .015 (.38)
.135 (3.43)
.300 (7.62) BSC
.100 (2.54) BSC .048 (1.22) (NOTE 7)
.014 (.36)
.053 (1.35) .300 (7.62) P08B
.022 (.56) ⊕ T E D S .010 (.25) M .390 (9.91) PI-2551-101599
SMD-8B
Notes:
⊕ D S .004 (.10) Heat Sink is 2 oz. Copper
1. Controlling dimensions are
As Big As Possible
inches. Millimeter sizes are
-E- shown in parentheses.
2. Dimensions shown do not
include mold flash or other
protrusions. Mold flash or
protrusions shall not exceed
.372 (9.45) .006 (.15) on any side.
.245 (6.22)
.388 (9.86) .420
.255 (6.48) 3. Pin locations start with Pin 1,
⊕ E S .010 (.25) and continue counter-clock
.046 .060 .060 .046 Pin 8 when viewed from the
top. Pin 6 is omitted.
4. Minimum metal to metal
.080 spacing at the package body
Pin 1 Pin 1
for the omitted lead location
.086 is .137 inch (3.48 mm).
.100 (2.54) (BSC)
.186 5. Lead width measured at
package body.
.286
.375 (9.53) 6. D and E are referenced
-D- Solder Pad Dimensions datums on the package
.385 (9.78)
body.
.057 (1.45)
.128 (3.25) .063 (1.60)
.132 (3.35) (NOTE 5)
.004 (.10)
.032 (.81) .048 (1.22)
.053 (1.35)
.009 (.23) .004 (.10) .036 (0.91) 0°- 8°
.037 (.94)
.012 (.30) .044 (1.12) G08B
PI-2546-040501
E
46 7/01 August 8, 2000
TOP242-249
TO-263-7C
.396 (10.06) .245 (6.22)
.415 (10.54) min. .045 (1.14)
.055 (1.40) .055 (1.40)
.066 (1.68)
.225 (5.72)
.326 (8.28) min.
.336 (8.53) .580 (14.73)
.620 (15.75)
.000 (0.00)
.208 (5.28) .010 (0.25)
Ref. .090 (2.29)
-A- .110 (2.79)
.010 (0.25)
LD #1
.017 (0.43)
.026 (0.66) .100 (2.54) .050 (1.27) .023 (0.58)
.032 (0.81) Ref. 0°- 8°
.315 (8.00)
Solder Pad
Dimensions .165 (4.19)
.380 (9.65) .185 (4.70)
.004 (0.10)
.638 (16.21) Notes:

1. Package Outline Exclusive of Mold Flash & Metal Burr.
2. Package Outline Inclusive of Plating Thickness.
.128 (3.25) 3. Foot Length Measured at Intercept Point Between
Datum A Lead Surface.
.050 (1.27) 4. Controlling Dimensions are in Inches. Millimeter
R07C
.038 (0.97) Dimensions are shown in Parentheses. PI-2664-040501
August 8, 2000 E
7/01 47
TOP242-249
Revision Notes Date

D - 11/00
1) Added R package (D2PAK).
E 7/01
2) Corrected abbreviations (s = seconds).
3) Corrected x-axis units in Figure 11 (µA).
4) Added missing external current limit resistor in Figure 25 (RIL).
5) Corrected spelling.
6) Added caption for Table 4.
7) Corrected Breakdown Voltage parameter condition (TJ = 25 °C)
8) Corrected font sizes in figures.
9) Figure 40 replaced.
10) Corrected schematic component values in Figure 44.
For the latest updates, visit our Web site: www.powerint.com

Power Integrations reserves the right to make changes to its products at any time to improve reliability or manufacturability.
Power Integrations does not assume any liability arising from the use of any device or circuit described herein, nor does it
convey any license under its patent rights or the rights of others.
The PI Logo, TOPSwitch, TinySwitch and EcoSmart are registered trademarks of Power Integrations, Inc.
©Copyright 2001, Power Integrations, Inc.
WORLD HEADQUARTERS EUROPE & AFRICA TAIWAN CHINA

AMERICAS Power Integrations (Europe) Ltd. Power Integrations Power Integrations
Power Integrations, Inc. Centennial Court International Holdings, Inc. International Holdings, Inc.
5245 Hellyer Avenue Easthampstead Road 17F-3, No. 510 Rm# 1705, Bao Hua Bldg.
San Jose, CA 95138 USA Bracknell Chung Hsiao E. Rd., 1016 Hua Qiang Bei Lu
Main: +1 408-414-9200 Berkshire, RG12 1YQ Sec. 5, Shenzhen, Guangdong 518031
Customer Service: United Kingdom Taipei, Taiwan 110, R.O.C. China
Phone: +1 408-414-9665 Phone: +44-1344-462-300 Phone: +886-2-2727-1221 Phone: +86-755-367-5143
Fax: +1 408-414-9765 Fax: +44-1344-311-732 Fax: +886-2-2727-1223 Fax: +86-755-377-9610
e-mail: [email protected] e-mail: [email protected] e-mail: [email protected] e-mail: [email protected]
KOREA JAPAN INDIA (Technical Support) APPLICATIONS HOTLINE

Power Integrations Power Integrations, K.K. Innovatech World Wide +1-408-414-9660
International Holdings, Inc. Keihin-Tatemono 1st Bldg. #1, 8th Main Road
Rm# 402, Handuk Building 12-20 Shin-Yokohama 2-Chome Vasanthnagar APPLICATIONS FAX
649-4 Yeoksam-Dong, Kohoku-ku, Yokohama-shi Bangalore, India 560052 World Wide +1-408-414-9760
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Fax: +82-2-568-7474 e-mail: [email protected]
e-mail: [email protected]
E
48 7/01 August 8, 2000
This datasheet has been download from:
www.datasheetcatalog.com
Datasheets for electronics components.

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®

• Line feed forward with maximum duty cycle (DCMAX)

Figure 2a. Functional Block Diagram (Y or R Package).

STOP LOGIC HYSTERETIC

Figure 2b. Functional Block Diagram (P or G Package).

Pin Functional Description connected to SOURCE pin and 66 kHz if connected to

CONTROL (C) Pin: VUV = IUV x RLS

MULTI-FUNCTION (M) Pin: (P or G package only)

Tab Internally 7D Figure 5. P/G Package Line Sense.

TOPSwitch-GX Family Functional Description

In addition to the three terminal TOPSwitch features, such as the

TOPSwitch-GX offers many new transparent features that do IL = 190 µA

TOP242/5 1.6 2.0 5.2 6.0

waveform for the pulse width modulator. This oscillator sets

Figure 10. Synchronization Timing Diagram.

also used to generate a temperature-compensated current

High-Voltage Bias Current Source

Using Feature Pins

LINE-SENSE AND EXTERNAL CURRENT LIMIT PIN TABLE*

Table 2. Typical LINE-SENSE and EXTERNAL CURRENT LIMIT Pin Configurations.

MULTI-FUNCTION PIN TABLE*

Table 3. Typical MULTI-FUNCTION Pin Configurations.

IREM(N) IUV IOV

Disabled when supply I

X and L Pins (Y or R Package) and M Pin (P or G Package) Current (µA)

(Negative Current Sense - ON/OFF,

(Negative Current Sense - ON/OFF,

Figure 12b. MULTI-FUNCTION (M) Pin Input Simplified Schematic.

Typical Uses of FREQUENCY (F) Pin

Figure 15. Half Frequency Standby Mode (For High Standby

+ + VUV = IUV x RLS

For Value Shown For Values Shown

+ For RIL = 12 kΩ + ILIMIT = 100% @ 100 VDC

DC See fig. 55 for other DC

+ VUV = IUV x RLS

VUV = IUV x RLS +

Typical Uses of MULTI-FUNCTION (M) Pin

For Value Shown For Values Shown

Typical Uses of MULTI-FUNCTION (M) Pin (cont.)

Figure 40. Active-off Remote ON/OFF with LINE-SENSE.

C7 2.2 nF PERFORMANCE SUMMARY

Figure 43. 250 W, 48 V Power Supply using TOP249.

Figure 44. 60 W Multiple Output Power Supply using TOP246.

LOGIC LOGIC 1N4148

Figure 45. Remote ON/OFF using Microcontroller.

Key Application Considerations

Function TOPSwitch-II TOPSwitch-GX Figures TOPSwitch-GX Advantages

Soft-Start N/A* 10 ms • Limits peak current and voltage

Function TOPSwitch-II TOPSwitch-GX Figures TOPSwitch-GX Advantages

TOPSwitch-FX vs. TOPSwitch-GX

Function TOPSwitch-FX TOPSwitch-GX TOPSwitch-GX Advantages

Table 5. Comparison Between TOPSwitch-FX and TOPSwitch-GX. (continued on next page)

Function TOPSwitch-FX TOPSwitch-GX TOPSwitch-GX Advantages

Table 5 (cont). Comparison Between TOPSwitch-FX and TOPSwitch-GX. *Not available

switching frequency and soft-start features of TOPSwitch-GX Y-Capacitor

Safety Spacing Maximize hatched copper

Figure 47. Layout Considerations for TOPSwitch-GX using P or G Packages.

Y1- Maximize hatched copper

Figure 48. Layout Considerations for TOPSwitch-GX using Y Package.

Solder Side Output Filter Capacitors