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INCH-POUND
MIL-STD-981C
1 July 2010
SUPERSEDING
MIL-STD-981B
31 January 1992

DEPARTMENT OF DEFENSE
STANDARD PRACTICE
Design, Manufacturing and Quality Standards for Custom Electromagnetic
Devices for Space Applications

AMSC N/A FSC 5950

DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
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MIL-STD-981C

FOREWORD

1. This standard is approved for use by all Departments and Agencies of the Department of
Defense (DoD).

2. Beneficial comments (recommendations, additions, deletions) and any pertinent data which may
be of use in improving this document should be addressed to:

Defense Supply Center Columbus

ATTN: DSCC-VAT
P.O. Box 3990
Columbus, Ohio 43218

Since contact information can change, you may want to verify the currency of this address
information using the ASSIST Online database at https://assist.daps.dla.mil.

3. This standard is the technical baseline for the design, manufacturing, and quality standards of
custom electromagnetic devices. The intent of this standard is to provide uniform requirements
for devices that are used in critical space applications and mission-essential ground equipment.
This standard also covers devices in noncritical flight and non-mission-essential ground support
applications.

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MIL-STD-981C

CONTENTS

PARAGRAPH PAGE

1. SCOPE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 Scope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.2 Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

2. APPLICABLE DOCUMENTS . . . . . . . .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2.2 Government documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2.3 Non-government documents . . . . . . . .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3
2.4 Order of precedence . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

3. DEFINITIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
3.1 Definitions . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

4. GENERAL REQUIREMENTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
4.1 Procurement documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
4.2 Power transformers, power inductors, etc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
4.3 Radio frequency, fixed and variable transformers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
4.4 Radio frequency, fixed and variable coils . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
4.5 Low power pulse transformers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
4.6 Radio frequency, chip, fixed and variable coils . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
4.7 Frequency, molded, fixed, established reliability, coils . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

5. DETAILED REQUIREMENTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
5.1 Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
5.2 Internal elements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5.3 Radiographic inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5.4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5.5 Manufacturing practices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5.6 Quality assurance provisions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

6. NOTES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
6.1 Subject term (key word) listings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
6.2 Environmentally preferable material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
6.3 Changes from previous issue . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

FIGURES

1. Recommended bobbin coil termination anchoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

2. A recommended toroidal coil termination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3. Recommended magnet wire-to-post termination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-15
4. Antirotation features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
B-1. A typical transformer/inductor construction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49-51
B-2. Axial orientation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
B-3. Unacceptable extraneous material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53-57
B-4. Unacceptable alignment and clearances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
B-5. Unacceptable processing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
B-6. Unacceptable processing damage – toroidal core . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
B-7. Unacceptable workmanship for radio frequency coils . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
B-8. Unacceptable workmanship for radio frequency coils (Surface Mount) . . . . . . . . . . . . . . . 62
B-9. Unacceptable workmanship for radio frequency coils (Surface Mount) . . . . . . . . . . . . . . . 63

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MIL-STD-981C

TABLES

I. Device types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
II. Wire limitations for magnet wire . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
III. Termination limitations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
IV. Inspection of transformers and inductors similar to
transformers and inductors that have been qualified by test . . . . . . . . . . . . . . . . . . . . . . 24
V. Group A screening tests for families 03, 04, etc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
VI. Group A screening tests for families 11 and 12 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
VII. Group A screening tests for families 13 and 14 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
VIII. Group A screening tests for family 31 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
IX. Group A screening tests for families 50 and 51 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
X. Group A screening tests for family 52 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
XI. Group B tests for power transformers, etc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
XII. Group B tests for RF coils . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
XIII. Group B tests for RF transformers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
XIV. Group B tests for RF chip coils . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
XV. Group B tests for RF fixed coils . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

APPENDICES

A. Product assurance program . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

B. Radiographic inspection (Real time X-ray) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

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1. SCOPE

1.1 Scope. This standard establishes the requirements for acceptable design, manufacturing, and
quality control criteria for custom electromagnetic, open and closed construction, leaded and surface
mount devices for space applications.

1.1.1 Intended use of or reference to MIL-STD-981. When this document is referenced or is used
as a standard for the design, processing, manufacturing and screening of custom electromagnetic devices
for space flight applications, such design, processing, manufacturing, and screening will be in full
conformance with all the applicable general and detailed requirements of this standard for the individual
device type. Any device meeting only selected provisions of this standard is considered noncompliant.

1.1.2 Compliant electromagnetic devices. Compliant electromagnetic devices will meet without
exception all of the applicable requirements and quality standards of MIL-STD-981. Any device that is
processed with deviations, omissions, or does not meet the full intent of this standard will not be claimed
to be compliant.

1.1.3 Noncompliant electromagnetic devices. Any device that is processed with deviations and
is not processed in compliance with the provisions of this standard will not be claimed to be compliant and
will not be marked in any manner that would indicate compliance or partial compliance. All applicable
documentation (including detail specifications and responses to Request for Quotations invoking MIL-
STD-981) will clearly and specifically define the areas of nonconformance and identify each as a deviation.
Such deviations will be approved by the acquiring activity.

1.2 Classification.

1.2.1 Families. Table I shows numerical designations that are used in this standard to indicate various
device types:
TABLE I. Device types.

Applicable Military
Device Type Family
Specification

Transformer, power 03 MIL-PRF-27

Inductor, power 04 MIL-PRF-27
Transformer, R.F. fixed 11 MIL-T-55631
Transformer, R.F. variable 12 MIL-T-55631
Coil, R.F., fixed 13 MIL-PRF-15305
Coil, R.F., variable 14 MIL-PRF-15305
Inductor, audio 20 MIL-PRF-27
Transformer, audio 21 MIL-PRF-27
Transformer, pulse, low, power 31 MIL-PRF-21038
Transformer, pulse, high, power 36 MIL-PRF-27
Inductor, charging 37 MIL-PRF-27
Transformer, saturable 40 MIL-PRF-27
Inductor, saturable 41 MIL-PRF-27
Coil, R.F., chip, fixed 50 MIL-PRF-83446
Coil, R.F., chip, variable 51 MIL-PRF-83446
Coil, R.F., fixed 52 MIL-PRF-39010

1.2.2 Classes. Two classes of requirements are defined in this standard. Class S parts are
intended for critical flight and mission essential ground support applications and any application that is
critical to safety. Class B parts are for use in noncritical flight and non-mission essential ground support
applications.

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MIL-STD-981C

2. APPLICABLE DOCUMENTS

2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this standard.
This section does not include documents cited in other sections of this standard or recommended for
additional information or as examples. While every effort has been made to ensure the completeness of
this list, document users are cautioned that they must meet all specified requirements of documents cited
in sections 3, 4, or 5 of this standard, whether or not they are listed.

2.2 Government documents

2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and
handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the
issues of these documents are those cited in the solicitation or contract.

SPECIFICATION

DEPARTMENT OF DEFENSE

MIL-PRF-27 - Transformers and Inductors (Audio, Power, and High-Power Pulse), General
Specification For
MIL-PRF-15305 - Coils, Fixed and Variable, Radio Frequency, General Specification For.
MIL-PRF-21038 - Transformers, Pulse, Low Power, General Specification For
MIL-PRF-39010 - Coil, Radio Frequency, Fixed, Molded, Established Reliability and
Non-established Reliability, General Specification For.
MIL-T-55631 - Transformers, Intermediate Frequency, Radio Frequency and Discriminator,
General Specification For.
MIL-PRF-83446 - Coils, Radio Frequency, Chip, Fixed or Variable General Specification For

STANDARDS

DEPARTMENT OF DEFENSE

MIL-STD-202 - Test Methods for Electronic and Electrical Component Parts.

MIL-STD-1285 - Marking of Electrical and Electronic Parts
MIL-STD-1580 - Destructive Physical Analysis for Electronic, Electromagnetic, and
Electromechanical Devices

(Copies of these documents are available online at https://assist.daps.dla.mil/quicksearch/ or from the

Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.3 Non-Government publications. The following documents form a part of this document to the extent
specified herein. Unless otherwise specified, the issues of the documents are those cited in the
solicitation or contract.

AMERICAN NATIONAL STANDARDS

J-STD-004 - Requirements for Soldering Fluxes.

J-STD-005 - Requirements for Soldering Pastes.
J-STD-006 - Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solder
Solders for Electronic Soldering Applications.

(DoD activities may obtain copies of American National Standards from the Standardization Document
Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094. The private sector and
other Government agencies may purchase copies from the Institute for Interconnecting and Packaging
Electronic Circuits (IPC), 7380 N. Lincoln Avenue, Lincolnwood, IL 60646-1776. http://www.ipc.org/).

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MIL-STD-981C

NATIONAL CONFERENCE OF STANDARDS LABORITORIES (NCSL)

NCSL Z540.3 - Calibration Laboratories and Measuring and Test Equipment - General
Requirements.

(Copies of these documents can be obtained online at https://www.ncsli.org or by contacting National

Conference of Standards Laboratories, 2995 Wilderness Place, Suite 107, Boulder, CO, 80301-5404.)

AMERICAN NATIONAL STANDARDS INSTITUTE (ANSI)

ANSI/NEMA MW-1000 – Magnet Wire.

ISO 10012 - Quality Assurance Requirements for Measuring Equipment - Part 1:

Meterological Confirmation System for Measuring Equipment.

(Copies of these documents can be obtained online at https://www.ansi.org or by contacting American

National Standards Institute, 1819 L Street NW, Suite 600, Washington, DC 20036).

AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM)

ASTM-E-595 - Standard Test Method for Total Mass Loss and Collected Volatile
Condensable Material from Outgassing in a Vacuum Environment.
ASTM-D-2240 - Standard Test Method for Rubber Property-Durometer Hardness

(Application for copies should be addressed to the American Society for Testing and Materials (ASTM),
100 Barr Harbor Drive, West Conshohocken, PA 19428-2959 or http://www.astm.org/

NATIONAL AERONAUTICS AND SPACE ADMINISTRATION (NASA)

NASA-STD-8739.3 - Workmanship Standard for Soldered Electrical Connections.

NASA-STD-8739.4 - Crimping, Interconnecting Cables Harness, and Wiring.

(Copies of these documents are available online at http://standards.nasa.gov/documents/nasa

STANFORD APPLIED ENGINEERING (SAE) INTERNATIONAL

SAE-AS22759 - Wire, Electrical, Fluoropolymer-Insulated, Copper or Copper Alloy

(Copies of these documents are available online at https://www.sae.org/ or from SAE World
Headquarters, 400 Commonwealth Drive, Warrendale PA 15096-0001.)

(Non-Government standards and other publications are normally available from the organizations that
prepare or distribute the documents. These documents also may be available in or through libraries or
other informational services.)

2.4 Order of precedence. In the event of a conflict between the text of this specification and the
references cited herein, the text of this specification takes precedence. Nothing in this document,
however, supersedes applicable laws and regulations unless a specific exemption has been obtained.

3. DEFINITIONS

3.1 Definitions. The meaning of terms used in this standard are in accordance with MIL-PRF-27,
MIL-PRF-15305, MIL-PRF-21038, MIL-T-55631, MIL-PRF-83446, and MIL-PRF-39010.

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4. GENERAL REQUIREMENTS

4.1 Procurement documents. Electromagnetic devices shall meet the requirements specified herein
and in the applicable procurement document on the individual part type. Procurement documents will be
provided by the procuring activity or, when specified by the procuring activity, prepared by the contractor
and submitted to the procuring activity for approval. In the event of conflict between this standard and the
procurement document, the latter shall govern.

4.2 Power transformers, power inductors, audio transformers, audio inductors, high power pulse
transformers, charging inductors, saturable transformers and saturable inductors (families 03, 04, 20, 21,
36, 37, 40, and 41 respectively). These devices shall meet the applicable requirements of MIL-PRF-27,
Product Level T, or Product Level M, for Grades 4, 5 or 6 and classes Q, R, S, V, T, or U devices and as
specified herein.

4.3. Radio frequency, fixed and variable transformers (families 11 and 12 respectively). These
devices shall meet the applicable requirements of MIL-T-55631 for Grade 1, class A or B devices and as
specified herein.

4.4 Radio frequency, fixed and variable coils (families 13 and 14, respectively). These devices shall
meet the applicable requirements of MIL-PRF-15305 for Grade 1, class A or B devices and as specified
herein.

4.5 Low power pulse transformers (family 31). These devices shall meet the applicable requirements
of MIL-PRF-21038, Product Level T, or Product Level M, and as specified herein.

4.6 Radio frequency, chip, fixed and variable coils (families 50 and 51, respectively). These devices
shall meet the applicable requirements of MIL-PRF-83446 and as specified herein.

4.7 Radio frequency, molded, fixed, established reliability, coils (family 52). These devices shall meet
the applicable requirements of MIL-PRF-39010 and as specified herein.

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5. DETAILED REQUIREMENTS

5.1 Materials.

5.1.1 Outgassing. Materials used in nonhermetic sealed devices for spaceflight application must not
exceed a maximum total mass loss (TML) of 1.0 percent and maximum collected volatile condensable
material (CVCM) of 0.1 percent when tested in accordance with ASTM-E-595. (See 6.2)

5.1.2 Hydrolytic stability. When requested by the acquiring activity: hydrolytic stability of any polymeric
materials used must be verified by test data. In the absence of hard data, samples of any polymeric
material used shall be cast into blocks approximately 2 inches square by 1/2 inch thick. The shore
hardness shall be measured in accordance with ASTM-D-2240. The samples shall be exposed to an
atmosphere of 71°C, 95 percent relative humidity for 1000 hours. The shore hardness shall again be
measured and samples examined for liquid reversion. Materials shall show no visible reversion to the
liquid state and any decrease in hardness shall not exceed 30 percent.

5.1.3 Tapes, films and insulating materials. Insulating materials or combinations of insulating
materials shall have a minimum RMS dielectric strength of at least twice the maximum peak operating
voltage to be induced between coil winding layers, or twice the RMS dielectric withstanding voltage to be
applied between the coil winding and ground, or twice the dielectric withstanding voltage to be applied
between the coil winding and other coil windings to be insulated from it. These requirements shall be met
at the maximum operating temperature. Devices with materials stresses greater than 100 volts/mil due to
the maximum operating voltage shall be tested for corona discharge in accordance with MIL-PRF-27.

5.1.4 Wire.

5.1.4.1 Magnet wire. Magnet wire shall conform to and be of the types and sizes specified in MW-
1000 and shall be of the appropriate class for the maximum temperature within the winding. Magnet wire
used for coil winding shall conform to the size limits of Table II as absolute limits. Temperature rise limits
must also be observed in selecting wire sizes. Procuring activity approval shall be required when other
types and sizes of magnet wire are used.

TABLE II. Wire Limitations for Magnet Wire (see 5.1.4.1).

Minimum Wire Size 1/

Family (AWG)
Class S Class B
03, 04, 36, 37, 40, and 41 38 44

11, 12, 13, 14, 20, 21, 31, 50, 51 and 52 44 50

1/ Procuring activity approval shall be required when other sizes of magnet wire are used.

5.1.4.2 Insulated wire. When insulated wire is used as wire terminals, the wire shall be of the types
and sizes covered in SAE-AS22759. Wire size shall conform to the limits of Table III. Procuring activity
approval shall be required when other types and sizes of insulated wire are used as terminals.

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5.1.4.3 Termination limitations. Internal wire leads shall be attached to the coils and other internal
components and terminals or case by soldering (see 5.5.10), welding, brazing, crimping or other method
in such a manner as to provide adequate electrical connection and mechanical strength. However,
devices with smaller diameter gauge than AWG 36, the wire shall be terminated within the device and a
wire larger than AWG 36 shall be used to connect to the terminal. Twisting smaller gauge wires (such as
AWG 36) and soldering to form a larger lead may fulfill the requirements for terminating with larger wires.
Where soft solder is used to provide the electrical connection, wire leads shall be anchored mechanically.
Wire sizes shall conform to the limits of Table III. Terminations shall be such that adequate stress relief
is provided for all leads. Procuring activity approval shall be required when other terminations are used.

TABLE III. Termination Limitations (see 5.1.4.3).

Minimum Terminal/Self Lead Wire Size

Type of Termination (AWG)
Class S Class B

Interconnected Lead 29 32

External terminal/self lead 1/ 26 28

1/ Spliced internal lead diameter ratios shall not exceed 5 to 1 for magnet wire sizes larger than #44.

5.1.5 Solder and soldering flux. Solder, when used, shall be in accordance with J-STD-005, and J-
STD-006, except that pure tin shall not be used. Soldering flux shall be in accordance with J-STD-004,
Type L0 or L1 for class B and S.

5.1.5.1 Internal Solders. To prevent internal solder reflow, devices shall utilize higher solder melt
temperatures than assembly reflow. Internal solder shall have a minimum melt temperature of 260˚C.

5.1.6 Screws, nuts, and washers. All mounting and terminal screws, nuts, and washers shall be
protected against corrosion. Cadmium, Zinc, or Tin-plating shall not be used on any surface exposed to
space environment. All materials shall be compatible and not support galvanic corrosion or tin whisker
growth.

5.1.7 Recycled and recovered material. Under no circumstances should recycled or recovered
materials be used in space level devices, unless specifically approved by the acquiring activity.

5.2 Internal elements. Packaged or unpackaged parts (other than the wound magnetic elements)
used within these devices shall be approved by the acquiring activity. The request for approval must
justify the need for the part and provide sufficient data to substantiate the suitability of the part in the
application. Procurement documentation for the part shall be submitted to the procuring activity for
approval.

5.3 Radiographic inspection (when applicable). Devices shall be inspected in accordance with
Appendix B.

5.3.1 Real time x-ray analysis. Real-time x-ray with images (provided as part of the data package)
shall be performed with a view of overall construction and two side views of each individual device.
Images shall be provided in digital media format. Devices shall be carefully analyzed for winding, core,
termination and with close-up views of any anomalous conditions. Devices shall meet the workmanship
rd
and x-ray criteria specified herein for class S parts. 2 views minimum and the 3 view when applicable.

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5.4 Marking. Devices shall be marked as specified in the procurement document on the part in
accordance with Appendix I of MIL-STD-1285. When space provides, the marking as a minimum shall
include the procurement document number, manufacturer’s part number and CAGE, trademark or
symbol, terminal identification, and lot date code.

5.5 Manufacturing Practices. The contractor shall provide to the procuring activity for review and
approval a copy of the contractor’s written procedures covering manufacturing practices. Proprietary
documents shall be reviewed, approved and maintained at the manufacturer's facility. These procedures
shall, as a minimum, conform to the requirements specified herein. Any change from the approved
procedures shall require approval of the procuring activity in writing. The contractor may, at his option,
provide separate sets of procedures for Class S and Class B.

5.5.1 Clean handling. Operators shall have clean hands (free from handcream, etc.) while handling
these devices. The use of clean, lint-free gloves or finger cot is recommended whenever practical.
Magnet wire spools shall be handled by the rim of the spools only. Materials and piece parts stored, or
being transferred to or between work stations shall be kept in covered containers to maintain a dust-free
seal.

5.5.1.1 Solvents. Crazing of magnet wire may occur as a result of uncontrolled exposure to solvents
such as water or alcohol. The use of alcohol or alcohol based cleaning agents for the cleaning of magnet
wire or assemblies shall be controlled and properly documented.

5.5.2 Work areas. Work and inspection areas must be cleared of all foreign materials before parts or
materials for these devices are placed thereon. While working on these devices, the work areas shall not
be used to store any parts, materials, or devices used on any other devices.

5.5.3 Foreign material. Care must be exercised to prevent introduction of foreign materials into the
component. At each in-process inspection, the operator shall examine the device under 10X to 30X
magnification to assure that no foreign materials are present. Special attention should be given to loose
wire-ends, solder splashes, wire scrapings, or residues.

5.5.4 Tools. Except for cutting pliers, the tools used shall not be capable of cutting, nicking, or
damaging the wire insulation in any manner. All tools used in the handling of magnet wire shall be free of
sharp or rough surfaces or edges. This may be accomplished by the application of an epoxy or by filing
any of the sharp surfaces or edges.

5.5.5 Carriers. Wound cores, coils or bobbins shall not be carried or stored on pegboards using nails
or other sharp pegs that may cause damage to wire insulation. All sharp or abrasive pegs shall be
sufficiently covered to insure against damaging wire. The carriers shall be covered with a material that will
prevent contamination by foreign materials during transport and storage.

5.5.6 Damaged material. Material that exhibits evidence of damage shall not be used in the
fabrication of the devices.

5.5.7 Travelers. A lot traveler specifying each operation in the proper sequence shall be provided with
each lot. Initialing or stamping of the individual traveler by the operator or inspector prior to moving to the
next work station shall be required for each operation in the manufacturing process.

5.5.8 In-process inspection. All critical in-process operations used in the manufacturing of these
devices shall be inspected by an adequately trained inspector. If circumstances preclude inspections after
the process is complete, the inspection shall occur during the process. These inspection stations shall be
defined in the manufacturing process.

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5.5.8.1 Pre-cap visual inspection. A pre-cap visual inspection shall be performed on all devices
immediately prior to potting or encapsulation. The visual inspection, utilizing 10X minimum to 30X
maximum magnification, shall be performed to ensure that the devices have been fabricated in
accordance with good manufacturing practices and meet the requirements specified. Devices that fail to
meet these requirements shall be removed from the lot and shall not be shipped.

5.5.8.1.1 In process color images. If DPA, per MIL-STD-1580 is required, then the 4 stage color
photographs may be substituted with consent from the acquiring activity. Color images shall be taken on a
random sample of five parts per lot (or quantity specified on the contract or purchase order) during pre-
cap inspection when solder joints/splices are still visible. Pre-cap images shall consist of the following:

a. One overall image of the part, using enough magnification so that the part fills the frame.
b. Close up images of each visible solder joint, using a minimum of 10X magnification. Images
may contain more than one solder joint.
c. A minimum of six images per device shall also be taken at 10X minimum magnification, one
in each orthographic plane, plus a sufficient number of views to assure that the devices are
consistent with high-reliability construction and workmanship. For cylindrical objects (coils),
a minimum of four images shall also be taken at 10X magnification, one end image plus
three full length view images (0˚, 90˚ rotated, and 180˚ rotated), to assure that the devices
are consistent with high-reliability construction and workmanship.

Images shall be identified with the contract or purchase order number.

5.5.9 Coil windings.

5.5.9.1 Tension. A suitable device shall be used to provide near uniform tension during the machine
winding process of any coil of wire size AWG 18 or smaller diameter. For coils wound on square forms,
special provision must be made to prevent excessive tension on the corners. This device and the winding
machine used shall be inspected for proper operation a minimum of twice daily or once each lot whichever
is more frequent. Tension control on larger wire is preferred but not mandatory. For machines which
cannot accommodate any tension device, other criteria shall be established. Any portion of the device
which contacts the magnet wire (pulleys, sliders, etc) shall be free of nicks, burrs, rough spots, or any
other anomalies that could cause damage to the coil wire.

5.5.9.2 Wire breaks. There shall be no wire breaks for any winding within the coil. The winding
operation can be considered complete only when the coil has been made with an unbroken winding.
Should the magnet wire break during winding operations, the magnet wire may be unwound and rewound.
In no case may a broken coil wire be repaired. If magnet wire opens after assembly, the entire device
shall be rejected. Those devices that are designed as multi-series connected windings are not to be
identified as wire breaks within the definition of this paragraph.

5.5.9.3 Crossed wires. Winding shall be even and smooth. In insulated interleaved layer-wound coils,
no uninsulated turns shall cross over other turns. In toroidal and cylindrical or random wound
bobbin coils wound in segments, there shall be no uninsulated cross-over of any one turn to the adjacent
winding segment. All situations where voltage stress exceeds the ability of the magnet wire insulation to
withstand it shall be avoided. Family 13, 14, 50, 51 and 52 RF coils are often wound in a multilayer,
progressive, or single pass (linear) wind pattern in order to achieve high Q and high SRF. These winding
patterns shall not be interpreted as “crossed wires”.

5.5.9.4 Kinks, nicks, and damaged insulation. The winding process shall not introduce any kinks,
nicks, and insulation damage.

5.5.9.5 Tapes. The use of pressure sensitive adhesive tapes shall be kept to a minimum. The
adhesive system must meet the outgassing requirements of 5.1.1.

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5.5.9.6 Terminations. The recommended method to anchor the lead is shown in Figures 1 and 2. The
lead anchor shall be performed with minimum use of tape wrap to keep outgassing low. (See 5.5.9.5.)

5.5.9.7 Magnet wire to terminal post connections. Recommended magnet wire (wire or coil) to
terminal post connections are depicted in Figure 3 a-h, j, k, m, n, and p. For high voltage, corona-free
connections, no protruding wires are allowed and balling of the joint is recommended. Care shall be
exercised when using the heat shrink tubing to avoid the concentration of heat at the solder joint. Heat
shall be controlled in accordance with manufacturer’s stated recommended conditions.

5.5.9.8 Antirotation feature. Each terminal lead shall be internally constructed as illustrated on Figure
4 or equivalent. Flattened or dimpled area thickness shall be no less than one-half the lead diameter and
shall not exhibit sharp edges. The radius, R, shall be no greater than twice or less than one times the
diameter of the terminal lead. This radius shall be formed prior to soldering. The antirotation feature shall
be completely contained within the magnetic device package. Antirotation is not applicable to all axial
leaded parts listed for Families 04, 13, 14, 50, 51 and 52.

5.5.9.9 Terminal twist. Finished devices with solid wire terminals shall meet the terminal twist test in
accordance with MIL-STD-202, method 211, test condition D without causing discontinuity in the winding.
When the bending of the terminal leads, as specified in MIL-STD-202, is impractical, the device shall be
held stationary. The lead shall be clamped in a hand chuck and the chuck rotated as required. During the
twist test, the winding shall be monitored for open circuit with equipment able to detect dropouts of 100
microseconds or less.

5.5.9.10 Toroidal winders. Shuttle rings and sliders must be inspected for nicks, burrs and rough
spots. Inspect the toroid for physical damage after removal from the shuttle.

5.5.9.11 De-reeling. De-reeling (de-spooling) devices shall be such that they do not cause variations
in tension beyond the control of the tension device (see 5.5.9.1). All portions of the device which contact
the magnet wire (pulleys, sliders, spool flange, etc) shall be free of nicks, burrs, and rough spots.

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FIGURE 1. Recommended bobbin coil termination anchoring (see 5.5.9.6).

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FIGURE 2. A recommended toroidal coil termination anchoring (see 5.5.9.6).

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FIGURE 3 (1 of 4). Recommended magnet wire-to-post termination (see 5.5.9.7).

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FIGURE 3 (2 of 4). Recommended magnet wire-to-post termination (see 5.5.9.7).

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FIGURE 3 (3 of 4). Recommended magnet wire-to-post termination (see 5.5.9.7).

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FIGURE 3 (4 of 4). Recommended magnet wire-to-post termination (see 5.5.9.7).

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FIGURE 4. Antirotation features (see 5.5.9.8).

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5.5.10 Soldering. Soldering and preparation of soldering shall conform to NASA-STD-8739.3. Use of
any other soldering standard in lieu of or in addition to NASA-STD-8739.3 shall require the approval of the
procuring activity. When several solder compositions are combined to complete a solder joint (e.g.the
terminal is pre-plated, low temperature solder is used to wick magnet wire insulation, and the joint is made
with a third solder) care shall be taken to assure that the combined materials have the desired melting
point.

5.5.11 Soldering equipment and tools. Shall conform to NASA-STD-8739.3 . Use of any other
soldering standard in lieu of or in addition to NASA-STD-8739.3 shall require the approval of the procuring
activity.

5.5.12 Prepot visual inspection.

5.5.12.1 Examination. The device examination shall include, but not be limited to, inspection for
conformance to the construction and workmanship criteria specified below.

5.5.12.2 Solder joints. All solder joints shall be well formed and positioned and shall not show any of
the following characteristics when inspected under 10X minimum to 30X maximum magnification.

a. Sharp solder joints (tips, peaks).

b. Excessive solder which obscurers the connection configuration, except connections

of AWG 38 or smaller magnet wires.

c. Swelling of stranded leads due to excessive wicking.

d. Loose wire (except stress relief wraps), leads and core bands (if applicable).

e. Foreign or extraneous material embedded in the solder.

f. Fractures, cracks, or pinholes.

g. Bare conductor or dewetting within the solder joint area.

h. Protrusion of the bare wire end of strand out of solder joint.

i. Necking down of the magnet wire at the joint.

j. Pitting or voids in corona free ball connections.

5.5.12.3 Lead wires. Lead wires shall have stress relief of at least three times the insulated wire
diameter whenever practical. Stress relief loops shall not interfere with other conductive paths. For any
bend, the radius of the bend shall not be less than three times the insulated wire diameter. In addition, the
magnet wire shall also have adequate stress relief at the solder joint, and shall be anchored to the coil. A
device that displays a sharp bend of any lead wire (solid or stranded) at the solder joint, or peeling out
from the solder fillet, shall be rejected, even if the solder joint otherwise appears to be well formed.

NOTE: Due to space limitations, stress relief of magnet wire for cylindrical parts is not practical, in the
absence of space limitations, for Families 04, 13, 14, 50, 51 and 52.

5.5.12.4 Coils. Coils of “C” cores and laminations shall be wound either on bobbins or core tubes of
appropriate material size.

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5.5.12.5 Crossover of turns. There shall be no uninsulated crossover of any one turn in any one layer
of insulated interleaved layer-wound coils, nor crossover to the adjacent winding segment of toroidal or
cylindrical coils wound in segments.

5.5.12.6 Splices. There shall be no splicing of magnet wires of the same winding or lead wires of the
same size. The solder connection of the magnet wires between windings or series connection of
designed multi-wound series windings or to lead wire shall not be regarded as a splice within the definition
of this section.

5.5.12.7 Extraneous material. There shall be no evidence of extraneous material:

a. In the path of leakage currents, such as: terminal-to-terminal, terminal-to-adjacent

winding, terminal-to metallic case, and winding-to-core. (See Figure B-3.)

b. In coil margins, in layer-to-layer or winding-to-winding insulation. (See Figure B-7a, B-8

and B-9).)

5.5.12.8 Cores.

a. Laminated cores (“C” cores, laminations, etc.) shall not show excessive distortion,
misalignment of pole faces, foreign material, or excessive spacing in the gap, loose
or bent laminations, or any other anomaly.

b. Ferrite and powder cores shall be free of cracks and chips. Chip-outs, as a result of
manufacturing, smaller than 0.02 inch in the largest dimension that do not reduce
the cross section of the magnetic path by more than 5 percent shall be acceptable.

c. All molypermalloy powder cores (MPP) shall be coated by phenolic resin or epoxy
impregnation to provide a minimum breakdown of 500 V rms.

d. Toroidal cores encased in sealed protective boxes shall show no evidence of

damage or defect that may allow leakage of the damping medium or introduction of
foreign material.

5.5.12.8.1 Protective coating. When possible ferrite and powder toroidal cores shall be of epoxy or
parylene coated type or shall be tape wrapped prior to winding. Wire shall be protected from possible
abrasion in areas of contact with core.

5.5.12.9 Rejection criteria. Devices which fail to meet one or more of the requirements specified shall
be removed from the lot and shall not be shipped.

5.5.13 Impregnation and potting.

5.5.13.1 Drying. Prior to impregnation and potting, all devices shall be dried at sufficient temperatures
and for sufficient length of time to minimize the moisture and to cure all tapes. The vacuum drying of
devices is preferred. The devices shall be impregnated within 20 minutes after being removed from the
drying oven or vacuum chamber. If this is impractical, the devices shall be stored in controlled dry
atmosphere. If the devices were exposed to a relative humidity in excess of 30 percent for 30 minutes or
more, they shall be re-dried at sufficient temperature and for a sufficient length of time to minimize the
moisture.

5.5.13.2 Impregnation. Each device shall be impregnated in an appropriate chamber or molded to

assure thorough, void-free impregnation “when practical”.

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5.5.13.3 Curing. The cure schedule shall be sufficient to assure the complete cure of the
impregnation and potting compound throughout the device. Impregnation, potting and bonding materials
shall be cured to meet the outgassing requirements of 5.1.1.

5.5.13.4 Preparation of cups or molds. Cups or molds shall be prepared for potting or impregnation as
follows:

a. Clean plastic or metal cups with solvents that will not contribute to the degradation of the
part; such as commercial grades of isopropyl alcohol, acetone, stoddard solvent, or
equivalent. Plastic cups shall be sandblasted or otherwise etched on the inside surface to
assure good adhesion of the resin compound to the cups.

NOTE: Cleaned inner surfaces shall not be touched with bare hands or fingers and
cups or molds shall be stored in such a manner as to preclude atmospheric contamination.

b. Wipe molds with the same solvents, or equivalent, for removal of visible dust, dirt, and
other undesirable matter.

c. Final rinse cups and molds with the same solvent used in b. above.

5.5.13.5 Impregnating and potting compounds. All impregnating and potting compounds must be
degassed. Pot life of materials shall be controlled and shall be in accordance with manufacturer’s
recommendations. In addition, all potting materials shall be dated for expiration of shelf life, and shall not
be used after this date.

5.5.13.6 Equipment. Vacuum chambers and other equipment shall have adequate automatic controls
and shall be capable of maintaining the required pressure and temperatures for the time period specified
by the applicable specification or source control drawing or by the product bulletin of the compound
manufacturer. The inside of the chamber, chamber lid seal, resin containers and device holding fixtures
shall be maintained free of dirt and other foreign materials that may inhibit proper operation of the
equipment.

5.5.13.7 Voids. Units shall be potted or encapsulated in such a manner as to prevent voids, bubbles,
and cracks.

5.5.13.7.1 Internal voids. There shall be no internal voids greater than 0.015 inch in the largest
dimension located within 0.005 inch of any bare conductor, solder joint, or terminal. The total volume all
voids, and the volume of any one void shall not exceed 10 and 5 percent respectively of the total volume
of encapsulant within the device, and shall in no way jeopardize the mechanical or functional integrity of
the device.

5.5.13.7.2 Surface voids and depressions. Surface voids and depressions shall not reduce the
thickness of the covering over internal parts to less than what is shown in Figure B-4.

5.5.13.7.3 Extraneous material. Care shall be taken to ensure that extraneous material is not
introduced during the potting process.

5.6 Quality assurance provisions. Unless otherwise specified, test and inspection methods and
criteria shall be in accordance with MIL-PRF-27, MIL-PRF-15305, MIL-PRF-21038, MIL-T-55631, MIL-
PRF-83446 or MIL-PRF-39010 as applicable.

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5.6.1 Product assurance program. A product assurance program shall be established by the
contractor to meet the requirements of appendix A. The contractor shall obtain procuring activity approval
of the product assurance program in accordance with appendix A. Approval shall include a product and
quality audit by the procuring activity or their designated representative. This audit will cover verification of
the implementation of the product assurance program, conformance of design standard and
manufacturing techniques of the requirements of this document and test and inspection capabilities.

5.6.1.1 Documentation. Documents shall be maintained, in accordance with appendix A, which

specify materials, calibration techniques, processing, test and measurements controls and procedures.
These documents shall cover all process steps to be controlled. The documentation shall be available to
the operating personnel at all times. It shall be made available to the procuring agency for the purpose of
verifying its existence, coverage, implementation and adequacy.

5.6.1.1.1 Lot control.

5.6.1.1.1.1 Class B. A lot control shall be used for each lot. The lot control shall include as a
minimum: lot identification, operation, quantity, date of operation, and operator identification.

5.6.1.1.1.2 Class S. Lot control for class S devices shall be required for each part design. As a
minimum requirement, the lot control shall constrain the inspection lot to consist of a single part number
representing one design and processed as a single lot through all manufacturing steps on the same
equipment to the same product assurance program and procurement document and identified with the
same date and lot code designation. In addition, the lot shall conform to the following:

a. Each element, such as cores, magnet wire, finished cases, wire lugs and terminals,
potting or molding compound used in he manufacture of the part shall be from a
single lot and traceable to the lot.

b. Solder for each application shall be of a uniform composition and traceable to the source.

c. In general, all single process operations shall not be changed during processing of the lot.

d. A lot identifying number shall be assigned at the time the lot is assembled. This unique lot
identifying number shall be maintained through acceptance and shall be traceable to the
production lot and to the lot date code.

e. The manufacturer shall maintain traceability and test records for a minimum of 10 years on
each lot date code. The manufacturer shall record when in-process controls and quality
conformance inspections start and when they have been completed. The manufacturer shall
notify the acquiring activity 30 days minimum prior to the destruction of records.

f. All requirements specified in 5.6.1.1.1.1.

5.6.1.1.2 Process control charts. Process control charts shall be maintained during manufacture. The
charts shall contain information such as: process step, lot no. and/or date, action limits and absolute limits
and range. Where absolute limits are exceeded, the manufacturer shall document the corrective action
taken.

5.6.2 Incoming inspection. Methods and procedures which are used to control inspection, storage,
and handling of incoming materials shall be documented. Records shall be provided which verify that
materials used in production meet the requirements of the manufacturer's specifications and of the
general and detail specifications. As a minimum the following items will be covered.

5.6.2.1 Magnet wire. Magnet wire used in the design and construction of parts specified in
accordance with this standard shall meet the following requirements:

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a. Each spool of magnet wire prior to being used shall be subjected to the following tests of MW-
1000 :

(1) Dielectric test.

(2) Visual and mechanical examination.

(3) Check of bare wire size of the magnet wire by a DC resistance

measurement.

b. Provisions shall be made to procure and utilize magnet wire not older than five years from
the date of its manufacture. Wire older than five years from the date of its manufacture shall
not be used. Wire, by design, shall meet the following evaluation tests in accordance with
MW-1000.

(1) Visual and dimension.

(2) Adherence and flexibility including mandrel test.

(3) Elongation.

(4) Springback.

(5) DWV at rated temperature.

(6) Bend (rectangular wire only).

(7) Heat shock.

d. Magnet wire shall be stored in protective resealable containers to protect against dust.

e. Magnet wire shall be stored in a controlled environment, at a temperature of +25°C (±7°C), a

pressure of no less than one Standard Atmosphere, and a relative humidity of between 30 to
70 percent.

5.6.2.2 Layer insulation. Dielectric strength, tensile strength, volume resistivity and flexibility.

5.6.2.3 Potting and encapsulation materials. (On samples mixed and cured according to the
manufacturer's documented process) dielectric strength, volume resistivity, hydrolitic stability and
outgassing.

5.6.2.4 Incoming inspection DPA. Incoming inspection shall be in accordance with MIL-STD-1580,
except DPA is not required for open construction devices. 100 percent pre-cap inspection with color
images of representative samples (see 5.5.8.1.1) in combination with real-time x-ray (per 5.3.1) may be
used in lieu of DPA. All metal surfaces shall be verified for the absence of prohibited materials (e.g., pure
tin, zinc, or cadmium). Though DPA is not required, open construction magnetic devices require
functional electrical tests and visual and mechanical inspection as a minimum.

5.6.3 Calibration. The establishment and maintenance of a calibration system to control accuracy of
the measuring and test equipment shall be in accordance with ANSI/NCSL Z540.3, ISO 10012 or
equivalent.

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5.6.4 Classification of inspections. The inspections specified herein are classified as follows:

a. Materials inspection.
b. First article inspection.
c. Quality conformance inspection.

5.6.5 Materials inspection. Materials inspection shall be as specified in MIL-PRF-27, MIL-PRF-15305,

MIL-PRF-21038, MIL-T-55631, MIL-PRF-83446 or MIL-PRF-39010 as applicable. However, when a
definite material is not specified, a material shall be used which will enable the parts to meet the
performance requirements of this standard. Acceptance or approval of any constituent material shall not
be construed as a guaranty of the acceptance of the finished product. In addition, polymeric materials
shall be tested for outgassing and hydrolytic stability, when applicable (see 5.1.1, 5.1.2 and 6.2).

5.6.6 First article inspection. (When specified on contract)

5.6.6.1 First article inspection requirements for qualification. First article inspection shall be performed
in lieu of the qualification inspection specified in MIL-T-55631 as applicable. Requirements pertaining to
First article inspection shall be as specified in MIL-T-55631. Qualification inspection specified under MIL-
PRF-27, MIL-PRF-21038, MIL-PRF-39010, MIL-PRF-15305 and MIL-PRF-83446 shall serve as First
article inspection requirements and shall be performed for the applicable part type under MIL-PRF-27,
MIL-PRF-21038, MIL-PRF-39010, MIL-PRF-15305 and MIL-PRF-83446. First article approval is valid only
on the contract under which it is granted, for a period not exceeding three years from the date of initial
qualification, unless extended by the acquiring activity to another contract, provided that during this period
the device has been manufactured at least once during each successive twelve month period.

5.6.6.2 Qualification of transformers and inductors based on similarity. Only a transformer or an

inductor having passed the First article inspection requirements of 5.6.6.1 shall be used as the reference
device to establish a qualification by similarity. A Class S device shall not be qualified on the basis of
similarity. The Class B transformer or inductor to be qualified on the basis of similarity shall be
manufactured at the same production facility utilizing the same processes as the reference device.

5.6.6.2.1 Similar transformers and inductors (Class B only)(Families 03, 04, 20, 21, 31, 36,37,
40, 41). A similar device defined as a transformer or inductor that meets the following conditions when
compared to the reference device.

a. Same or lower operating temperature.

b. Same or lower operating frequency and the same or lower operating power.
c. Same or lower ambient temperature.
d. To be used at an atmospheric pressure of the same or lower altitude.
e. To be used at the same or lower operating voltages and the same or lower dielectric strees
per mil of same insulation.
f. Same or lower shock and vibration requirements.
g. Same or greater life time expectancy.
h. Same or lower temperature class.
i. Same family as defined in 4.2 thru 4.7.
j. Same grade as defined in the applicable military specifications.
k. Same type of external and internal mounting, same type of case construction with nominal
wall thickness within 25 percent when a case is used, same shape, and same termination (pin
or hook terminals).
l. Linear envelope dimensions neither greater than 150 percent nor less than 70 percent of the
corresponding dimensions. The total volume of envelope not to exceed 250 percent.
m. Same or greater wire size (cross-sectional area), and the same wire coating material for
corresponding windings.

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n. Same processing material and specification for case, finish and marking.
o. Same processing material and composition for potting, insulation (tapes and films),
impregnation, staking and filling.
p. Same material composition, characteristic and coating for the ferrite and MMP core, same
shape, and the same manufacturer.
q. Same bobbin material and characteristics.
r. Same solder composition and welding.
s. Same construction and material for the terminals. For terminals of the same dimensions the
required terminal strength requirements to be the same or lower.

5.6.6.2.2 Inspection requirements. Transformers and inductors shall be subjected to and pass the
applicable quality conformance inspection requirements of 5.6.7.

5.6.7 Quality conformance inspection.

5.6.7.1 Inspection of product for delivery.

5.6.7.1.1 Class S devices. Inspection of product for delivery shall consist of the applicable group A
screening tests (see 5.6.7.3.3 through 5.6.7.3.9.2) and the applicable group B tests (see tables XI through
XV). Sample size for group B tests shall be as specified under the sampling plan (see 5.6.7.4.1.2).

5.6.7.1.2 Class B devices. Inspection of product for delivery shall consist of the applicable group A
screening tests (see 5.6.7.3.3 through 5.6.7.3.9.2). A device to be qualified by similarity shall be subjected
to the tests specified in TABLE IV. Samples of each part type shall be selected at random from the
inspection lot which has passed the group A tests.

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TABLE IV. Inspection of transformers and inductors similar to Transformers and inductors that have
been qualified by test. (Families 03, 04, 20, 21, 31, 36,37,40, 41)

Class B
Test 1/
Sample size Rejects allowed

Visual and mechanical examination (external)

Resistance to soldering heat
Terminal strength
Dielectric withstanding voltage (at atmospheric pressure) 2/
Temperature rise
Vibration
Shock
Dielectric withstanding voltage(at reduced voltage)
Insulation resistance
Winding continuity 3 0
Resistance to solvents
Solderability
Corona discharge (when specified)
Electrical characteristics
Life (minimum six week test duration, for 1000 hours minimum)
Dielectric withstanding voltage (at reduced voltage)
Insulation resistance 3/
Electrical characteristics
Visual and mechanical examination (external)
Visual and mechanical examination (internal) (one sample unit)

1/ Specified test shall be performed in accordance with MIL-PRF-27 or MIL-PRF-21038

as applicable and in the order shown.
2/ At maximum temperature for the class.
3/ At specified voltage with insulation resistance (IR) of 7,500 megohms minimum.

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5.6.7.2 Inspection lot.

5.6.7.2.1 Class B. An inspection lot shall include completely assembled devices of the same grade,
construction, class, family, and electrical characteristics, manufactured under essentially the same
conditions and having similar construction and materials. (Similar construction and materials shall be
construed to include differences that will not affect test results.) Sample units shall be so selected as to
be, as far as practicable, representative of the volt-ampere range of electrical values and physical
dimensions included in the lot.

5.6.7.2.2 Class S. An inspection lot shall consist of completely assembled devices of a single grade,
construction, class, family, and part number from one procurement document. Each lot shall meet all the
lot controls specified in 5.6.1.1.1.2 for Class S devices.

5.6.7.3 Group A screening inspection. Screening inspections shall consist of the examinations and
tests as specified in Tables V through X.

5.6.7.3.1 Lot acceptance. If, during the 100 percent inspection of subgroup I, 5 percent or (1) device
whichever is greater, is discarded, the lot shall be rejected. NOTE: Radiographic and visual inspection
shall not be included in the PDA calculation.

5.6.7.3.2 Rejected lots. For class B devices, if an inspection lot is rejected, the contractor may rework
it to correct the defects, or screen out the defective units and resubmit for reinspection. Resubmitted lots
shall be 100 percent inspected. Such lots shall be separate from new lots, and shall be clearly identified
as reinspected lots. Rework of Class S devices shall not be permitted unless approved by the procuring
activity.

5.6.7.3.3 Power transformers, power inductors, audio transformers, audio inductors, high power pulse
transformers, charging inductors, saturable transformers, and saturable inductors (families 03, 04, 20, 21,
36, 37, 40 and 41 respectively). These devices shall be subjected to the group A screening tests of
TABLE V.

5.6.7.3.3.1 Thermal shock. Thermal shock screening shall be in accordance with MIL-PRF-27, and as
follows:

a. Number of cycles - The number of cycles shall be as specified in the procurement document
but shall be restricted to 5, 10, 15, 25 or 50 cycles for Class B parts and 25 cycles minimum for
Class S parts.
b. Continually monitor continuity during the entire final cycle to verify no intermittent conditions.
Continuity monitoring current shall not exceed 100 microamperes. Equipment shall be capable
of detecting intermittent opens exceeding 100 microseconds.

NOTE: Continuity monitoring is not required for self-leaded parts with 26 gauge wire and
heavier, or equivalent cross sectional area.

c. Class S parts using magnet wire smaller than AWG 38 shall have DC resistance measured
before and after the thermal shock screen. The change in resistance shall not exceed ±3
percent.

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5.6.7.3.4 Burn-in Applicable to Class S and B parts.

5.6.7.3.4.1 Transformers

5.6.7.3.4.1.1 Power burn-in (applicable for transformers with an output greater than 0.8 watts or
temperature rise exceeding 30˚C). Devices shall be tested as follows:

a. Test duration: 96 hours minimum.

b. Test temperature: maximum rated ambient temperature. (See applicable specification)
c. Test voltages and currents: Rated input voltage and current at minimum rated frequency and
at maximum rated load.

TABLE V. Group A screening tests for families 03, 04, 20, 21, 36, 37,40 and 41 respectively (see
5.6.7.3.3).

Class Applicable Military

Examination/Test Inspection
S B Specification

Subgroup I

Thermal shock X X See 5.6.7.3.3.1

Temperature rise 1/ X X MIL-PRF-27
Burn-in X X See 5.6.7.3.4
Seal (when applicable) X X MIL-PRF-27
Induced voltage X X MIL-PRF-27
100 percent
Dielectric withstanding voltage X X MIL-PRF-27
(at atmospheric pressure)
Insulation resistance X X MIL-PRF-27
Electrical characteristics X X MIL-PRF-27
Corona discharge (when X X MIL-PRF-27
specified)
Radiographic inspection X 2/ See appendix B

Subgroup II

Visual and dimensional X X MIL-PRF-27 100 percent

examination (external)

1/ Test 2 units for temperature rise per applicable specification if temperature rise is not known.
2/ When specified.

5.6.7.3.4.1.2 No load burn-in (applicable for transformers with an output equal to or less than 0.8 watts
and temperature rise less than 30˚C). Devices shall be tested as follows:

a. Test duration: 96 hours minimum

b. Test temperature: Maximum rated ambient temperature. (See applicable specification)
c. Test voltages and current: Rated input voltage and current at minimum rated frequency with
no load.

5.6.7.3.4.2 No-load burn-in for Inductors: Devices shall be tested as follows:

a. Test duration: 96 hours minimum

b. Test temperature: Maximum operating temperature. (See applicable specification)
c. Test voltages and currents: Not applicable.

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5.6.7.3.5 Radio frequency, fixed, and variable transformers (families 11 and 12, respectively). These
devices shall be subjected to the group A screening tests in TABLE VI.

TABLE VI. Group A screening tests for families 11, 12 respectively (see 5.6.7.3.5).

Class Applicable Military

Examination/Test Inspection
S B Specification

Subgroup I

Thermal shock X X See 5.6.7.3.3.1

Temperature rise 1/ X X MIL-T-55631
Burn-in X X See 5.6.7.3.4
Seal (when applicable) X X MIL-T-55631
100 percent
Induced voltage MIL-T-55631
Dielectric withstanding voltage X X MIL-T-55631
(at atmospheric pressure)
Insulation resistance X X MIL-T-55631
Electrical characteristics X X MIL-T-55631
Radiographic inspection X 2/ See appendix B

Subgroup II

Visual and dimensional X X MIL-T-55631 100 percent

examination (external)

1/ Test 2 units for temperature rise per applicable specification if temperature rise is not known.
2/ When specified.

5.6.7.3.6 Radio frequency fixed and variable coils (families 13 and 14 respectively). These devices shall
be subjected to the group A screening tests, in TABLE VII.

TABLE VII. Group A screening tests for families 13 and 14 (See 5.6.7.3.6)

Class Applicable Military

Examination/Test Inspection
S B Specification
Subgroup I

Thermal shock X X See 5.6.7.3.6.1

Temperature rise 1/ X X MIL-PRF-15305
No-load Burn-in X X See 5.6.7.3.6.2
Dielectric withstanding voltage X X MIL-PRF-15305
Insulation resistance X X MIL-PRF-15305 100 percent
Inductance X X MIL-PRF-15305
Q X X MIL-PRF-15305
Self resonant frequency X X MIL-PRF-15305
DC resistance X X MIL-PRF-15305
Radiographic inspection X 2/ See appendix B
Subgroup II

Visual and dimensional

examination (external) X X MIL-PRF-15305 100 percent

1/ Test 2 units for temperature rise per applicable specification if temperature rise is not known.
2/ When specified.

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5.6.7.3.6.1 Thermal shock. Thermal shock screening shall be in accordance with MIL-PRF-15305, and
as follows: (Note: End point measurements per MIL-PRF-15305 shall not apply).

a. Number of cycles: 25.

b. Continually monitor continuity during the entire final cycle to verify no intermittent conditions.
Continuity monitoring current shall not exceed 100 microamperes. Equipment shall be capable
of detecting intermittent opens exceeding 100 microseconds.
c. Class S parts using magnet wire smaller than AWG 38 shall have DC resistance measured
before and after the thermal shock screen. The change in resistance shall not exceed ±3
percent.

5.6.7.3.6.2 No load burn-in. Devices shall be tested as follows:

a. Test duration: 96 hours minimum

b. Test temperature: Maximum rated operating temperature. (See applicable specification)
c. Test voltage: Not applicable

5.6.7.3.7 Low power pulse transformers (family 31). These devices shall be subjected to the group A
screening tests in TABLE VIII.

TABLE VIII. Group A screening tests for family 31 (see 5.6.7.3.7).

Class Applicable Military

Examination/Test Inspection
S B Specification

Subgroup I

Thermal shock X X See 5.6.7.3.6.1

Temperature rise 1/ X X MIL-PRF-21038
No-load Burn-in X X See 5.6.7.3.6.2
Dielectric withstanding voltage X X MIL-PRF-21038
100 percent
Insulation resistance X X MIL-PRF-21038
Inductance X X MIL-PRF-21038
Q X X MIL-PRF-21038
Self resonant frequency X X MIL-PRF-21038
DC resistance X X MIL-PRF-21038
Radiographic inspection X 2/ See appendix B

Subgroup II

Visual and dimensional

examination (external) X X MIL-PRF-21038 100 percent

1/ Test 2 units for temperature rise per applicable specification if temperature rise is not known.
2/ When specified.

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5.6.7.3.8 Radio frequency, fixed and variable, chip coils (families 50 and 51, respectively). These
devices shall be subjected to the group A screening tests in TABLE IX.

TABLE IX. Group A screening tests for families 50 and 51 (see 5.6.7.3.8).

Class Applicable Military

Examination/Test Inspection
S B Specification

Subgroup I

Thermal shock X X See 5.6.7.3.8.1

No-load Burn-in X X See 5.6.7.3.8.2
Dielectric withstanding voltage X X MIL-PRF-83446
Insulation resistance X X MIL-PRF-83446 100 percent
Inductance X X MIL-PRF-83446
Q X X MIL-PRF-83446
Self resonant frequency X X MIL-PRF-83446
DC resistance X X MIL-PRF-83446
Radiographic inspection X 1/ See Appendix B

Subgroup II

Visual and dimensional

examination (external) X X MIL-PRF-83446 100 percent

1/ When specified.

5.6.7.3.8.1 Thermal shock. Thermal shock screening shall be in accordance with MIL-PRF-83446, and
as follows:

a. Number of cycles: 25
b. Continually monitor continuity during the entire final cycle to verify no intermittent conditions.
Continuity monitoring current shall not exceed 100 microamperes. Equipment shall be capable
of detecting intermittent opens exceeding 100 microseconds.
c. Class S parts using magnet wire smaller than AWG 38 shall have DC resistance measured
before and after the thermal shock screen. The change in resistance shall not exceed ±3
percent.

5.6.7.3.8.2 No-load burn-in.

a. Test duration: 96 hours minimum.

b. Test temperature: Maximum rated operating temperature. (See applicable specification)
c. Test voltage: Not applicable.

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5.6.7.3.9 Radio frequency fixed coils (family 52). These devices shall be subjected to the group A
screening tests, in TABLE X.

TABLE X. Group A screening tests for family 52 (See 5.6.7.3.9)

Class Applicable Military

Examination/Test Inspection
S B Specification

Subgroup I

Thermal shock X X See 5.6.7.3.9.1

Temperature rise 1/ X X MIL-PRF-39010
No-load Burn-in X X See 5.6.7.3.9.2
Dielectric withstanding voltage X X MIL-PRF-39010
100 percent
Insulation resistance X X MIL-PRF-39010
Inductance X X MIL-PRF-39010
Q X X MIL-PRF-39010
Self resonant frequency X X MIL-PRF-39010
DC resistance X X MIL-PRF-39010
Radiographic inspection X 2/ See appendix B

Subgroup II

Visual and dimensional

examination X X MIL-PRF-39010 100 percent

1/ Test 2 units for temperature rise per applicable specification if temperature rise in not known.
2/ When specified.

5.6.7.3.9.1 Thermal shock. Thermal shock screening shall be in accordance with MIL-PRF-39010, and
as follows:

a. Number of cycles: 25
b. Continually monitor continuity during the entire final cycle to verify no intermittent conditions.
Continuity monitoring current shall not exceed 100 microamperes. Equipment shall be capable
of detecting intermittent opens exceeding 100 microseconds.
c. Class S parts using magnet wire smaller than AWG 38 shall have DC resistance measured
before and after the thermal shock screen. The change in resistance shall not exceed ±3
percent.

5.6.7.3.9.2 No-load burn-in.

a. Test duration: 96 hours minimum.

b. Test temperature: Maximum rated operating temperature. (See applicable specification)
c. Test voltage: Not applicable.

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5.6.7.4 Group B inspection. Group B inspection shall consist of the applicable group B tests (see
tables XI through XV). For Class S devices, the group B inspection shall be performed on sample units
selected at random from each inspection lot that passed the group A inspection. Group B inspection shall
not apply to those lots from which devices are sampled for First article inspection. Group B inspection for
Class B devices shall be performed when specified by the procurement document. The group B

inspection, when specified for Class B devices, shall be performed on sample units selected at
random from inspection lots which have passed the group A inspection. Group B inspection shall not apply
to those lots from which devices are sampled for First article inspection.

5.6.7.4.1 Sampling plan.

5.6.7.4.1.1 Class B. The sampling plan shall be specified in the procurement document. For device
qualification based on similarity, a sample consisting of three of the devices shall be subjected to
applicable tests specified in TABLE IV.

5.6.7.4.1.2 Class S. Four sample units shall be subjected to the applicable group B tests. Two
sample units shall be subjected to the tests of Subgroup 1 and two sample units to the tests of
Subgroup 2.

5.6.7.4.2 Failures.

5.6.7.4.2.1 Class S. If the number of failures exceeds the number allowed in Tables XI through XV,
the sample shall be considered to have failed. (See 5.6.7.4.4)

5.6.7.4.2.2 Class B. The number of allowable failures shall be specified in the procurement document.

5.6.7.4.3 Disposition of sample units. Disposition of sample units which have been subjected to the
group B inspection shall be as specified in the procurement document.

5.6.7.4.4 Noncompliance.

5.6.7.4.4.1 Class B devices. If a sample fails to pass group B inspection, the manufacturer shall notify
the procuring activity and the cognizant inspection activity of such failure and take corrective action on the
materials or processes, or both, as warranted, and on all units of product which can be corrected and
which were manufactured under essentially the same conditions, with essentially the same materials,
processes, etc., and which are considered subject to the same failure. Acceptance and shipment of the
product shall be discontinued until corrective action acceptable to the procuring activity has been taken.
After the corrective action has been taken, group B inspection shall be repeated on additional sample
units (all inspections, or the inspection which the original sample failed, at the option of the qualifying
activity). Group A inspection may be reinstituted; however, final acceptance and shipment shall be
withheld until the group B inspection has shown that the corrective action was successful. In the event of
failure after reinspection, information concerning the failure shall be furnished to the cognizant inspection
activity and the procuring activity.

5.6.7.4.4.2 Class S devices. If an inspection lot fails to pass group B inspection, the inspection lot
shall not be delivered on the contract or purchase order. The manufacturer shall notify the procuring
activity and cognizant inspection activity of the failure and take corrective action on the material or
processes, or both as warranted. A failure analysis (see 5.6.7.4.4.2.1) shall be performed on the failing
product and forwarded to the procuring activity. A copy of the results shall be maintained by the
manufacturer.

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5.6.7.4.4.2.1 Failure analysis. If any of the sample units subjected to the group B tests fail during
testing, a detailed failure analysis shall be conducted to establish the cause of failure and the corrective
actions that would eliminate subsequent failures of a similar type. A failure is categorized as lot oriented if
its occurrence is apparently related to an identified lot or lots. A failure is categorized as not lot oriented if
its occurrence is random and it cannot be related to a specific lot or lots. Each failure is further identified
as screenable or not screenable from the completed production items. If the failure analysis shows that
the failure mechanism is screenable, the entire failed lot may be screened and the group B test in which
the failure occurred shall be repeated. If a failure occurs during the second group B test, the entire
production lot shall be rejected. If the failure mechanism is screenable, all prior and subsequent
production lots that may contain the identified failure mechanism shall also be screened, except as may
be stated otherwise in the detailed requirements for the specific part type. If the failure mechanism is lot
oriented and not screenable, all production lots that contain the identified failure mechanism shall be
rejected unless other disposition is directed by the contracting officer and procuring activity.

5.6.7.5 Inspection of packaging. Inspection of packaging for delivery shall be as specified in MIL-PRF-
27, MIL-PRF-15305, MIL-PRF-21038, MIL-T-55631, MIL-PRF-39010 or MIL-PRF-83446 as applicable.

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TABLE XI. Group B tests for power transformers, power inductors, audio transformers, audio inductors,
high power pulse transformers, charging inductors, saturable transformers, and saturable inductors
(families 03, 04, 20, 21, 36, 37 40 and 41 respectively) and low power pulse transformers (family 31)
(see 5.6.7.4).

Class S
Test 1/ Sample Defective units
Size allowed
Subgroup 1

Resistance to soldering heat 2/

Terminal strength 3/
Induced voltage 4/ 5/
2 0
Dielectric withstanding voltage 4/
(at atmospheric pressure)
Electrical characteristics
Visual and mechanical examination (external)
Visual and mechanical examination (internal) (one sample unit) 6/
Subgroup 2

Solderability
Resistance to solvents
Vibration
Shock
Life 7/ 2 0
Induced voltage 5/ 10/
Dielectric withstanding voltage (at reducedvoltage)
Insulation resistance 8/
Electrical characteristics
Visual and mechanical examination (external)
Visual and mechanical examination (internal) (one sample unit) 6/
Subgroup 3

Corona discharge 9/ 2 0

1/ Specified tests shall be performed in accordance with MIL-PRF-27, except tests for family 31 shall be
performed in accordance with MIL-PRF-21038.
2/ Not applicable to self-leaded parts with lead lengths that meet a 4 inch minimum requirement with
26 gauge wire and smaller.
3/ Twist test is not applicable to self leaded parts.
4/ At maximum temperature for the class.
5/ Applicable when any winding has a rated voltage in excess of 25 volts rms.
6/ Real time x-ray is an acceptable method of examination in lieu of dissection or disassembly.
7/ Reduced life test, raise temperature one class for the duration of 500 hours total.
8/ At specified voltage with insulation resistance (IR) of 7,500 megohms minimum, except family 31 (IR)
will be at 750 megohms minimum.
9/ Applicable when materials stressed greater than 100 volts/mil due to maximum operating voltage.
Subject one sample each from subgroups 1 and 2 to this test.
10/ Reduce induced voltage 1.3X the rated voltage of the device.

NOTE: Induced voltage is not applicable to single winding inductors.

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Table XII. Group B tests for RF Coils (families 13, and 14) (see 5.6.7.4).

Class S
Test 1/ Defective units
Sample Size
allowed

Subgroup 1
Electrical characteristics (initial)
Terminal strength
Vibration 3/
Shock (specified pulse) 3/
Resistance to soldering heat 2 0
Temperature rise
Electrical characteristics (final)
Visual and mechanical examination (external)
Visual and mechanical examination (internal)
(one sample unit) 2/

Subgroup 2

Solderability
Resistance to solvents
Electrical characteristics (initial)
Life 2 0
Dielectric withstanding voltage (at reduced
voltage)
Insulation resistance
Electrical characteristics (final)
Visual and mechanical examination (external)

1/ Specified tests shall be performed in accordance with MIL-PRF-15305

2/ Real time x-ray is an acceptable method of examination in lieu of dissection or disassembly.
3/ Sample units shall be mounted with the body clamped or cemented to a flat surface rather
than soldered to rigidly supported terminals.

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Table XIII. Group B tests for RF transformers (families 11 and 12) (see 5.6.7.4).

Class S
Test 1/ Defective units
Sample Size
allowed

Subgroup 1

Resistance to soldering heat

Terminal strength
Operating torque (when applicable)
Temperature rise
2 0
Dielectric withstanding voltage
(2 x working voltage) 2/
Electrical characteristics
Vibration, winding continuity
Visual and mechanical examination (external)
Visual and mechanical examination (internal)
*(one sample unit) 6/

Subgroup 2

Solderability
Resistance to solvents
Life 3/
Induced voltage
Dielectric withstanding voltage (at reduced 2 0
voltage)
Insulation resistance 4/
Electrical characteristics (final)
Visual and mechanical examination
(external)
Visual and mechanical examination (internal)
*(one sample unit) 6/

Subgroup 3

Corona discharge 5/ 2 0

1/ Specified tests shall be performed in accordance with MIL-T-55631.

2/ At maximum temperature for the class.
3/ Raise temperature one class, for 500 hours.
4/ Full voltage with insulation resistance (IR) of 1.5 times the specified value.
5/ Applicable when material is stressed greater than 100 volts/mil due to maximum operating
Voltage. Subject one sample each from subgroups 1 and 2 to this test.
6/ Real time x-ray is an acceptable method of examination in lieu of dissection or disassembly.

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Table XIV. Group B tests for RF Chip Coils (families 50 and 51) (see 5.6.7.4).

Class S
Test 1/ Defective units
Sample Size
allowed

Subgroup 1

Electrical characteristics (initial) 2/

Low temperature operation
Temperature rise
Overload
Moisture resistance
Electrical characteristics
Inductance
2 0
Q
High temperature exposure
Electrical characteristics (final) 2/
Turning torque (when applicable)
Bond strength
Visual and mechanical examination
(external)
Visual and mechanical examination
(internal)(one Sample) 3/

Subgroup 2

Solderability
Electrical characteristics (initial) 2/
Life
Dielectric withstanding voltage (at reduced 2 0
voltage)
Insulation resistance
Electrical characteristics (final) 2/
Visual and mechanical examination
(external)

1/ Specified tests shall be performed in accordance with MIL-PRF-83446

2/ All measurements are made with sample devices mounted on substrates.
3/ Real time x-ray is an acceptable method of examination in lieu of dissection or disassembly.

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Table XV. Group B tests for RF fixed coils (family 52) (see 5.6.7.4).

Class S
Test 1/ Defective units
Sample Size
allowed

Subgroup 1

Electrical characteristics (initial)

Terminal strength
Vibration
Shock (specified pulse) 2 0
Resistance to soldering heat
Temperature rise
Electrical characteristics (final)
Visual and mechanical examination (external)
Visual and mechanical examination (internal)
(one sample unit) 2/

Subgroup 2

Resistance to solvents
Solderability
Electrical characteristics (initial)
Life 3/ 2 0
Dielectric withstanding voltage (at reduced
voltage)
Insulation resistance
Electrical characteristics (final)
Visual and mechanical examination (external)

1/ Specified tests shall be performed in accordance with MIL-PRF-39010.

2/ Real time x-ray is an acceptable method of examination in lieu of dissection or disassembly.
3/ Duration of test is 2000 hours or as specified by the acquiring activity.

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6. NOTES

(This section contains information of a general or explanatory nature that may be helpful, but is not
mandatory.)

6.1 Subject term (key word) listing.

Cores
Families
Impregnation and potting
Internal elements
Materials
Solder joints
Splices
Voids

6.2 Environmentally preferable material. Environmentally preferable materials should be used to the
maximum extent possible to meet the requirements of this specification. As of the dating of this
document, the U.S. Environmental Protection Agency (EPA) is focusing efforts on reducing 31 priority
chemicals. The list of chemicals and additional information is available on their website
https://www.epa.gov/osw/hazard/wastemin/priority.htm. Use of these materials should be minimized or
eliminated unless needed to meet the requirements specified herein.

6.3 Changes from previous issue. Marginal notations are not used in this revision to identify changes with
respect to the previous issue due to the extent of the changes.

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APPENDIX A

PRODUCT ASSURANCE PROGRAM

A.1. SCOPE

A.1.1 This appendix contains details of the product assurance program requirements which serve as the
basis for product line verification and constitute a pre-condition for supplying devices in accordance with this
standard. The information contained herein is intended for compliance.

A.2. APPLICABLE DOCUMENTS

This section is not applicable to this appendix.

A.3. PRODUCT ASSURANCE PROGRAM

A.3.1 Manufacturers requirements. The manufacturer shall establish, implement, and maintain a
product assurance program in accordance with A.3.1 through A.3.1.3.6. The manufacturer's product
assurance program shall demonstrate and assure that design, manufacture, inspection, and testing are
adequate to assure compliance with the applicable requirements and quality standards of this standard and
the procurement document. Where the manufacture or any portion of the manufacturing and testing
operation is done at other than the manufacturer's facility, it shall be the responsibility of the manufacturer to
secure and prove the documentation and control of the product assurance program as described herein.
The program shall be documented in these ways:

a. Design, processing, manufacturing, and testing instructions (see A.3.1.1)

b. Records to be maintained (see A.3.1.2)

c. Program Plan (see A.3.1.3).

The program shall indicate which documentation applies to Class S and which to Class B.

All required documentation shall be available at, and continually effective in, the plant of the manufacturer
producing devices which are intended to be offered for first article and quality conformance inspections
under this standard.

All required program documentation shall be available for review by the procuring agency upon request, and
the procuring agency shall have access to nonproprietary areas of the manufacturer's plant for the purpose
of verifying its implementation.

The implementation of all proprietary documentation shall be certified by a responsible official of the
manufacturer upon request by the procuring agency.

A.3.1.1 Design, processing, manufacturing, and testing instructions. The manufacturer shall have in
effect documented instructions covering, as a minimum, these areas:

a. Conversion of customer requirements into manufacturer's internal instructions (see A.3.1.1.1)

b. Personnel training and testing (see A.3.1.1.2)
c. Inspection of incoming materials, manufacturing facilities, and work in process (see A.3.1.1.3)
d. Quality-control operations (see A.3.1.1.4)
e. Quality-assurance operations (see A.3.1.1.5)
f. Design, processing, rework tool and materials standards and instructions (see A.3.1.1.6)
g. Cleanliness control in work areas (see A.3.1.1.7)
h. Design, material, and process change control (see A.3.1.1.8)
i. Tool, gauge, and test equipment maintenance and calibration (see A.3.1.1.9)

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APPENDIX A

j. Failure and defect analysis and data feedback (see A.3.1.1.10)

k. Corrective action and evaluation (see A.3.1.1.11)
l. Incoming, in-process, and outgoing inventory control (see A.3.1.1.12)

Detailed requirements for coverage of these items are stated in A.3.1.1.1 through A.3.1.1.12. These
requirements will normally be expected to be met by the manufacturer's standard drawings, specifications,
process instructions, and other established manufacturing practices. If particular requirements are not
covered by the manufacturers established practices, suitable documentation shall be added to satisfy those
requirements.

A.3.1.1.1 Conversion of customer requirements into manufacturer's internal instructions. The

procedure by which customer requirements, as expressed in specifications, purchase orders, etc., are
converted into working instructions for the manufacturer's personnel shall be documented.

A.3.1.1.2 Personnel training and testing. The motivational and work training and testing practices
employed to establish, evaluate, and maintain the skills of personnel engaged in reliability-critical work shall
be documented as to form, content, and frequency of use.

A.3.1.1.2.1 Certification of Personnel. The contractor shall have a written procedure covering the
training of production and inspection personnel. All employees shall be instructed in proper handling of
parts and materials during production, testing, and inspection operations. Only employees who have
received this instruction shall be allowed to handle these materials or parts. In addition there shall be a
written procedure whereby personnel performing critical tasks on Class S parts are certified to perform their
assigned tasks. Certification shall be determined on a continuous basis for each operator and a record
maintained of each operator's performance. Any operator whose quality performance does not meet
certification requirements shall receive retraining or reassignment as required. The term "critical tasks"
shall, as a minimum, include coil winding, coil termination, soldering, welding, assembly, potting,
encapsulation, and testing.

A.3.1.1.3 Inspection of incoming materials and manufacturing facilities , and work in process.
Inspection operations shall be documented as to type of inspection, sampling and test procedures,
acceptance-rejection criteria, and frequency of use.

A.3.1.1.4 Quality-control operations. Quality-control operations shall be documented as to type,

procedures, rating criteria, action criteria, records, and frequency of use. All critical in-process operations
used in the manufacturing of these devices shall be inspected by an adequately trained inspector. If
circumstances preclude inspections after the process is complete, the inspection shall occur during the
process.

A.3.1.1.5 Quality-assurance operations. Quality-assurance operations shall be documented as to type,

procedures, equipment, judgment and action criteria, records, and frequency of use.

A.3.1.1.6 Design, processing, manufacturing, equipment, and materials instructions. Device design,
processing, manufacturing equipment and materials shall be documented in drawings, standards,
specifications, or other appropriate media which shall cover the requirements and tolerances for all aspects
of design and manufacture including equipment test, materials procurement, and handling,
design-verification testing, and processing steps. As a minimum requirement, detailed documentation must
exist for the following items and must be adequate to assure that quantitative controls are exercised, that
tolerances or limits of control are sufficiently tight to assure a reproducible high quality product and that
process and inspection records reflect the results actually achieved:

a. Incoming materials control

b. Winding machine setup
c. Winding uniformity

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MIL-STD-981C
APPENDIX A

d. Layer insulation
e. Winding finishing and termination
f. Soldering and/or welding
g. Core assembly
h. Rework
i. Potting and encapsulation
j. Sealing.

A.3.1.1.7 Cleanliness in work areas. The requirements for cleanliness in each work area in which
unsealed devices, or parts thereof, are processed or assembled shall be documented.

A.3.1.1.8 Design, material, and process change control. The methods and procedures for
implementation and control of changes in device design, material, and processing, and for making change
information available to the procuring activity, when applicable, shall be documented.

A.3.1.1.9 Tool, gauge, and test equipment maintenance and calibration. The maintenance and
calibration procedures and the frequency of scheduled actions for tools, gauges, and test equipment shall
be documented and in accordance with the requirements of ANSI/NCSL Z540.3, ISO 10012 or equivalent.

A.3.1.1.10 Failure and defect analysis and feedback. The procedures for identification, handling, and
analysis of failed or defective devices and for dissemination of analysis data shall be documented, including
the procedure for informing the procuring agency of analysis results, when applicable.

A.3.1.1.11 Corrective action and evaluation. The procedure and responsibility for decisions regarding
the necessity for corrective action as a result of failure or defect analysis, and for evaluation and approval of
proposed corrective actions, shall be documented. If the procedure for evaluation and approval of changes
proposed for other reasons, such as cost reduction or product improvement, differs from the above, it shall
also be documented.

A.3.1.1.12 Incoming, in-process, and outgoing inventory control. The methods and procedures shall be
documented which are used to control storage and handling of incoming materials, work in process, and
warehoused and outgoing product in order to (a) achieve such factors as age control of limited-life
materials, work, or finished and (b) prevent inadvertent mixing of conforming and nonconforming materials,
work, or finished product. In addition, for class S devices, tests and inspections performed by the
manufacturers on procured materials and supplies shall include verification of chemical, physical, and
functional characteristics required by manufacturer drawings and specifications. Procedures shall be
prepared and maintained for controlling the receipt of procured materials and supplies. The procedures
shall provide the following:

a. Withholding received materials or supplies from use pending completion of

the required inspections or tests, or the receipt of necessary reports.
b. Segregation and identification of nonconforming materials and supplies from conforming
materials and supplies and removal of nonconforming subassemblies and parts.
c. Identification and control of limited-life materials and supplies.
d. Identification and control of raw materials.
e. Assurance that the required tests reports, certifications, etc., have been received.
f. Correct identification of materials released from receiving inspection and test to clearly indicate
acceptance or rejection status of material pending review action.
g. Traceability of materials throughout the production process to the accepted product. Completed
parts shall be identified to permit positive correlation to the production lot.

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APPENDIX A

A.3.1.2 Records to be maintained. The records required by this section shall be continuously
maintained during the manufacture of devices which are intended to be submitted for quality conformance
inspection under this specification. The records pertaining to incoming and in-process inspections and
those pertaining to quality conformance inspection shall be retained for a minimum of 3 years, after
performance of the inspections. Records shall be maintained as a minimum for:

a. Personnel training and testing (A.3.1.2.1)

b. Inspection operations (A.3.1.2.2)
c. Failure and defect reports and analyses (A.3.1.2.3)
d. Initial documentation and subsequent changes in designs, materials or processing (A.3.1.2.4)
e. Equipment calibrations (A.3.1.2.5)
f. Process, manufacturing facilities, and materials controls (A.3.1.2.6)
g. Product lot identification (A.3.1.2.7)

Detail requirements for records are stated in A.3.1.2.1 through A.3.1.2.7.

A.3.1.2.1 Personnel training and testing. Records shall cover the nature of training or testing given, the
date thereof by week and length in hours, and the group(s) of personnel given work training and testing.
The records need not indicate occasional specialized training, retraining, or testing of individuals, and are
required only for motivational and product-related training and testing as distinguished from safety, first aid,
etc.

A.3.1.2.1.1 Training of operators and inspectors for Class S. All critical processes and production
inspections shall be performed by personnel who have been trained by the manufacturer to perform their
assigned task in accordance with manufacturer's in-house standards, including a formal training and test
procedure to assure the proficiency of each individual. Each individual shall be retested and/or retrained at
the end of a designated period or when personnel performance indicates poor proficiency. Personnel shall
not be used in critical processes or inspections until the required level of proficiency has been
demonstrated.

A.3.1.2.2 Inspection operations. Records of inspection operations shall cover the tests or inspections
made, the materials group (lot, batch, etc.) inspected, the controlling documentation, the date of completion
of inspection, the amount of material tested, and acceptance, rejection, or other final disposition of the
material.

A.3.1.2.3 Failure and defect reports and analyses. Records of failed or defective devices shall cover the
source from which each device was received, the test or operation during which failure occurred or defects
were observed, and prior testing or screening history of the device, the date of receipt, and the disposition of
the device. Records of failure and defect analyses shall cover the nature of the reported failure or defect
(failure or defect mode), verification of the failure or defect, the nature of any device discrepancies which
were found during analysis (failure or defect mechanism), assignment of the failure-activating cause if
possible, the date of completion of the analysis, identification of the group performing the analysis,
disposition of the device after analysis, and the distribution of the record. The record shall also treat the
relationship of observed failure or defect modes in related lots or devices and, where applicable, corrective
action taken as a result of the findings.

A.3.1.2.4 Changes in design, materials, or processing. Records shall cover the initial documentation
and all changes with the date upon which each change in design, materials, or processing becomes
effective. For devices intended to be submitted for quality conformance inspection under this specification,
the documents authorizing and implementing the change, and identification of the first production and/or
quality conformance inspection lot(s) (as applicable) within which product incorporating the change is
included shall be maintained.

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APPENDIX A

A.3.1.2.5 Equipment calibrations. Records shall cover the scheduled calibration intervals for each
equipment item, the dates of completion of actual calibration, identification of the group performing the
calibration, and certification of the compliance of the equipment with documented requirements after
calibration, in accordance with ANSI/NCSL Z540.3, ISO 10012 or equivalent.

A.3.1.2.6 Process, manufacturing facilities, and materials controls. Records shall cover the
implementation of devices such as control charts (e.g., X and R charts) or other means of indication of the
degree of control achieved at the points in the material, manufacturing facility, and assembly process flow
documented in the manufacturing instructions. Records shall also indicate the action taken when each
out-of-control condition is observed, and the disposition of product processed during the period of
out-of-control operation.

A.3.1.2.7 Product lot identification. Records shall be capable of identifying each production and/or
acceptance-inspection lot (as applicable) of product, these items as a minimum:

a. The acceptance-inspection tests performed on the lot, and their results.

b. The serial numbers (when applicable) of all devices in the lot.
c. The date of completion of acceptance inspection of the lot.
d. Identification of the lot.
e. The pertinent detail specification under which inspection was performed.
f. Final disposition of the lot (withdrawn, not accepted, accepted).
g. Procuring activity source inspection disposition of the lot.
h. Traceability of all materials used in the production process back to the manufacturer and his lot
or batch identification.

A.3.1.3 Program plan. The program plan shall be established and maintained on a current basis by the
manufacturer, and shall be delivered to the procuring agency for review (prior to survey, when applicable).
It shall consist of a volume or portfolio, or series of same, which will serve to demonstrate to the procuring
agency that the manufacturer's understanding of a complete product assurance program, as exemplified by
his documentation system, is adequate to assure compliance of his product with the applicable
specifications and quality standards. If the product assurance program exemplified is applied consistently
to all product lines intended to be submitted for acceptance inspection under this specification, only one
program plan is required for each manufacturing plant; any difference in treatment of different product lines
within a plant shall be stated and explained in the program plan, or separate program plans prepared for
such different lines. The program plan shall contain as a minimum, these items:

a. Functional block organizational chart (A.3.1.3.1)

b. Manufacturing flow chart (A.3.1.3.2)
c. Proprietary documents (A.3.1.3.3)
d. Examples of design, material, equipment, visual standard, and processing instructions
(A.3.1.3.4)
e. Examples of records (A.3.1.3.5)
f. Examples of design, material and process change control documents (A.3.1.1.8)
g. Examples of failure and defect analysis and feedback documents (A.3.1.1.10)
h. Examples of corrective action and evaluation documents (A.3.1.1.11)
i. Manufacturer's internal instructions for internal visual inspection (A.3.1.3.6)
j. Manufacturing practices (see 5.5).

Detail requirements for these items are described in A.3.1.3.1 through A.3.1.3.6, A.3.1.1.8, A.3.1.1.10, and
A.3.1.1.11.

A.3.1.3.1 Functional block organization chart. This chart shall show, in functional block-diagram form,
the lines of authority and responsibility (both line and staff) for origination, approval, and implementation of
the several aspects of the product assurance program. Names of incumbents are not required in this chart.

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APPENDIX A

A.3.1.3.2 Manufacturing flow chart. This chart shall show, in flow-chart form, the manufacturing
sequence typical of the product line under consideration, including inspection and process-control stations.
If desired, a separate chart may be used for quality-assurance operations. Insofar as practical, each
manufacturing flow chart station shall be keyed (by document number and the step(s) it controls) to the
pertinent exemplary documents (see A.3.1.3.3 through A.3.1.3.5) included in the program plan, to facilitate
understanding of the interrelationships of the various documents.

A.3.1.3.2.1 Manufacturing baseline for class S devices. The flow chart for class S devices will show all
manufacturing, inspection, testing, and quality verification points and the point where all materials or
subassemblies enter the flow. The chart will identify all documents pertaining to the procurement and
inspection of materials, the production processes, the production environments and production controls
which were used. The documents will be identified by name, number, and revision in effect at the time of
manufacturer certification, or changes approved thereafter. The manufacturer shall maintain a file/book of
all referenced documents noted on the flow chart, including in-house documents referenced there for use by
the qualification teams and the designated procurement agency representative(s).

A.3.1.3.3 Proprietary-documents. A listing of proprietary documents shall be included in the program

plan and maintained on a current basis (see A.3.1).

A.3.1.3.4 Examples of design, material, equipment, and processing instructions. An example of each
type of design, material, equipment, visual standard, and processing instructions used in the manufacture of
devices intended to be submitted for acceptance inspection under this standard shall be included in the
program plan. These may be either dummies or actual working documents, but shall in either event show
the form of the pertinent document; blank forms shall not be included.

A.3.1.3.5 Examples of records. Examples of records, complying with the requirements of A.3.1.3.4 for
instructions, shall be included in the program plan.

A.3.1.3.6 Manufacturer's internal instructions for internal visual inspection. The manufacturer's internal
instructions for visual inspection before potting shall be included in the program plan.

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MIL-STD-981C
APPENDIX B

RADIOGRAPHIC INSPECTION

B.1. SCOPE

B.1.1 This appendix contains details for performance of the radiographic inspection for devices
specified in accordance with this standard. This appendix is a mandatory part of this standard. The
information contained herein is intended for compliance only.

B.2. APPLICABLE DOCUMENTS

This section is not applicable to this appendix.

B.3. RADIOGRAPHIC INSPECTION

B.3.1 Radiographic inspection. Devices shall be tested in accordance with Method 209 of
MIL-STD-202. The following details and exceptions shall apply:

a. Radiographic quality - The radiograph shall render a clear sharp image of the penetrameter.
b. Image quality indicator - A radiograph of the penetrameter shall be included on each
radiograph film. The penetrameter may be made from a sample of the same type as that being
radiographed, with an AWG number 48 tungsten wire mounted across the body.
c. For real time x-ray, the penetrameter shall be used on the first and last image of the inspection
lot.

B.3.1.1 Transformers and inductors. Examples of typical construction and terminology are shown on
Figure B-1.

B.3.1.1.1 Views - Radiographs shall be taken of each device in each of three axes; X, Y, and Z. When
inadequate coverage is provided, additional views shall be taken as deemed necessary to satisfy the criteria
defined herein. If three views are not feasible due to part construction, a minimum of two views shall be
taken. Axial orientation is shown on Figure B-2.

B.3.1.1.2 Examination - The radiographic examination shall include, but not be limited to, inspection for
extraneous materials, alignment, clearance and processing damage.

B.3.1.1.2.1 Extraneous material – There shall be no visible extraneous materials that can cause
damage to insulation or electrical short circuit between conductors or connections. Loose or excessive
material such as weld or solder splash, solder balls and short lengths of unattached wire shall be
considered extraneous material (See Figure B-3). If the extraneous material is fully embedded in material
with a measurable shore D hardness, and DWV testing has been performed to verify that the material
does not cause damage or short circuit, it shall be considered acceptable.

Acceptable Conditions:
A. Extraneous material (as described above) that is located near a single wire or conductor,
and cannot cause damage or short circuit, is acceptable. See Figure B3 (1 of 5) and
Figure B3 (2 of 5).
B. Extraneous material (as described above) that is located near two or more conductors,
and has.010” or greater between the conductors and extraneous material. See figure B3
(1 of 5).
C. Extraneous material (as described above) that is entrapped within a soft (RTV type)
material, and is .125” or greater than from any two conductors.

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APPENDIX B

Rejectable Conditions:
D. Extraneous material (as described above) that is less than .010” between any two
conductors or wires, shall be rejectable, regardless of size. See Figure B3 (3 of 5) and
Figure B3 (4 of 5).
E. Extraneous material (as described above) that is embedded within a soft compound, such
as RTV, with less than .125” between the conductors and extraneous material. See Figure
B3 (3 of 5) and Figure B3 (5 of 5).
F. Any unattached wire clipping within the coil assembly. See Figure B3 (4 of 5).

B.3.1.1.2.2 Alignment and clearances - Acceptable parts shall exhibit adequate internal electrical and
mechanical clearances. Criteria for determining adequate clearance by inspection of radiographs shall be
established by each manufacturer and must be approved by the qualifying activity, except as specified
otherwise herein. Unacceptable alignment and clearances include the following:

a. Insufficient clearance between wires and metallic case, other conductive support, or external
surfaces. See Figure B-4.
b. Lead wire under tension that can be subjected to further stress under thermal expansion. See
Figure B-4(g).
c. Inadequate clearance of wires and installation holes, wherein the wires can be damaged in
installation.
d. Inadequate clearance between adjacent terminals due to pigtails of the wires, or wire
alignment.
e. Inadequate clearance between wires. See Figure B-4(b).

B.3.1.1.2.3. Processing damage - Unacceptable processing includes the following:

a. Raveled or frayed wire ends that can separate or pierce insulation, other wires or parts. See
Figures B-5(a) and B-6(a).
b. Partially broken wire strands. Multiple strand wire in which one or more strands have
separated. See Figure B-5(b).
c. Missing or incomplete soldering or welding of connections. See Figures B-5(c) and B-6(d).
d. Excess lengths of wires that are unsupported and can move freely under mechanical or thermal
stress. See Figure B-5(d).
e. Unauthorized splices or repair of broken wires or terminals. See Figures B-5(e) and B-6(c).
f. Voids in encapsulant in contact with the lead between the coil and external surface that
completely surround the wire or, although not surrounding the wire, extend greater than 20
percent of the distance from the coil to the external surface. See Figure B-5(f) and (g).
g. Cracked or damaged core. See figure B-6(f).
h. Encapsulation cracks that intersect any magnet wire gauge 30 or finer.

B.3.1.1.2.4 Miscellaneous - Cracked, broken or improperly assembled core, deformed or bent parts,
and voids in the seal shall be cause to reject a part.

B.3.1.2 Radio frequency coils (Family 13).

B.3.1.2.1 Views. Two views, normal to the major axis of the part shall be taken. One view shall be 90
degrees from the other.

B.3.1.2.2 Examination. The coil examination shall include, but not be limited to, inspection for
extraneous material on the windings or within the enclosure, misaligned or mispositioned core, misaligned
electrodes and physical damage to the windings of the coil.

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MIL-STD-981C
APPENDIX B

B.3.1.2.2.1 Cracked or damaged core. The core shall show no evidence of being cracked or otherwise
damaged. See figure B-7(a).

B.3.1.2.2.2 Extraneous material. There shall be no loose or attached extraneous material 0.002 inches
(.0508 mm) or larger in size located within .005 of any bare conductor, solder joint or terminal. See figure B-
7(b).

B.3.1.2.2.3 Misaligned leads. The center line of the leads shall not form an angle greater than 5
degrees. See figure B-7(c).

B.3.1.2.2.4 Windings. There shall be no excessively loose turns visible on the coil. A separation of
0.010 inches or more between a winding and the next inner layer of winding shall be considered excessive.
See figure B-7(d).

B.3.1.2.2.5 Misaligned core. The core shall be aligned with 5 degrees of a line connecting the centers
of the two electrical connections. See figure B-7(e).

B.3.1.2.2.6 Damaged magnet wire. The magnet wire shall show no evidence of being chipped, nicked
or other wise damaged. See figure B-7(f).

B.3.2.2 Radio Frequency Chip Coils, (Family 50), (MIL-PRF-83446/04 and MIL-PRF-83446/38).

B.3.2.2.1 Views. Two views, normal to the major axis of the part shall be taken. One view shall be 90
degrees from the other.

B.3.2.2.2 Examination. The coil examination shall include, but not be limited to, inspection for
extraneous material on the windings or within the enclosure, misaligned or mispositioned core, misaligned
electrodes and physical damage to the windings of the coil.

B.3.2.2.2.1 Cracked or damaged core. The core shall show no evidence of being cracked or otherwise
damaged. See figure B-8(a).

B.3.2.2.2.2 Damaged electrical connection. The magnet wire shall show no evidence of being lifted or
not connected to the termination See figure B-8(b).

B.3.2.2.2.3 Exposed core. There shall be no evidence of the core being exposed through the
encapsulant. See figure B-8(c).

B.3.2.2.2.4 Damaged magnet wire. The magnet wire shall show no evidence of being chipped, nicked
or otherwise damaged. See figure B-8(d).

B.3.2.2.2.5 Extraneous material. There shall be no loose or attached extraneous material 0.002 inches
(.0508 mm) or larger in size on the windings or within the enclosure. See figure B-8(e).

B.3.2.2.2.6 Windings. There shall be no excessively loose turns visible on the coil. A separation of
0.010 inches or more between a winding and the next inner layer of winding shall be considered
excessive.

B.3.2.3 Radio Frequency Chip Coils, Family 50, (MIL-PRF-83446/20 through /35 and /39 and /40).

B.3.2.3.1 Views. Two views, normal to the major axis of the part shall be taken. One view shall be 90
degrees from the other.

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APPENDIX B

B.3.2.3.2 Examination. The coil examination shall include, but not be limited to, inspection for
extraneous material on the windings or within the enclosure, misaligned or mispositioned core, misaligned
electrodes and physical damage to the windings of the coil.

B.3.2.3.2.1 Cracked or damaged core. The core shall show no evidence of being cracked or otherwise
damaged. See figure B-9(a).

B.3.2.3.2.2 Damaged electrical connection. The magnet wire shall show no evidence of being not
connected to the termination See figure B-9(b).

B.3.2.3.2.3 Exposed core. There shall be no evidence of the core being exposed through the
encapsulant. See figure B-9(c).

B.3.2.3.2.4 Damaged magnet wire. The magnet wire shall show no evidence of being chipped, nicked
or otherwise damaged. See figure B-9(d).

B.3.2.3.2.5 Extraneous material. There shall be no loose or attached extraneous material 0.002 inches
(.0508 mm) or larger in size on the windings or within the enclosure. See figure B-9(e).

B.3.2.3.2.6 Windings. There shall be no excessively loose turns visible on the coil. A separation of
0.010 inches or more between a winding and the next inner layer of winding shall be considered
excessive.

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MIL-STD-981C
APPENDIX B

FIGURE B-1 (1 of 3). A typical transformer/inductor construction (see B.3.1.1).

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APPENDIX B

FIGURE B-1 (2 of 3). A typical transformer/inductor construction (see B.3.1.1).

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MIL-STD-981C
APPENDIX B

FIGURE B-1 (3 of 3). A typical transformer/inductor construction (see B.3.1.1).

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APPENDIX B

FIGURE B-2. Axial orientation (see B.3.1.1.1).

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APPENDIX B

FIGURE B-3 (1 of 5). Acceptable/rejectable extraneous material (see B.3.1.1.2.1).

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APPENDIX B

FIGURE B-3 (2 of 5). Acceptable/rejectable extraneous material (see B.3.1.1.2.1).

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APPENDIX B

FIGURE B-3 (3 of 5). Acceptable/rejectable extraneous material (see B.3.1.1.2.1).

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MIL-STD-981C
APPENDIX B

FIGURE B-3 (4 of 5). Acceptable/rejectable extraneous material (see B.3.1.1.2.1).

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MIL-STD-981C
APPENDIX B

Note: This drawing depicts a transformer that is coated with a soft (RTV) material, and is then
encapsulated with a hard (Shore D measurable) material.

This criteria applies only to particles that are verified to be entrapped within the soft material.

Condition 1: Acceptable – Particle is entrapped within soft material, and is located greater than .125” from
any conductor.

Condition 2: Rejectable – Particle is entrapped within soft material, and is located less than .125” from any
conductor.

FIGURE B-3 (5 of 5). Acceptable/rejectable extraneous material (see B.3.1.1.2.1).

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APPENDIX B

FIGURE B-4. Unacceptable alignment and clearances (see B.3.1.1.2.2).

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APPENDIX B

FIGURE B-5. Unacceptable processing (see B.3.1.1.2.3).

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APPENDIX B

FIGURE B-6. Unacceptable processing damage – toroidal core (see B.3.1.1.2.3).

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APPENDIX B

FIGURE B-7. Unacceptable workmanship for radio frequency coils (see B.3.1.2.2).

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MIL-STD-981C
APPENDIX B

FIGURE B-8. Unacceptable workmanship for radio frequency chip coils (see B.3.2.2)

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MIL-STD-981C
APPENDIX B

FIGURE B-9. Unacceptable workmanship for radio frequency chip coils (see B.3.2.3)

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MIL-STD-981C

CONCLUDING MATERIAL

Custodians: Preparing activity:

NASA - NA DLA - CC
Air Force - 19
DLA - CC (Project No. 5950-2009-001)

NOTE: The activities listed above were interested in this document as of the date of this document. Since
organizations and responsibilities can change, you should verify the currency of the information above using
the ASSIST Online database at https://assist.daps.dla.mil.

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