2020 MILITARY

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& AEROSPACE
EMC GUIDE

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EXCELLENCE IN TEST AND
MEASUREMENT SOLUTIONS
In the aerospace and defense industry, innovation and disruptive
technologies are a key element of success. To ensure success, the
highest requirements need to be met for the design, verification and
test of electronic systems. As a world market leader in EMC, Rohde
& Schwarz provides test and measurement solutions with decades of
industry experience, we provide the means for our customers to push
the limits of technological progress in aerospace and defense.

www.rohde-schwarz.com
 INTERFERENCE TECHNOLOGY

TABLE OF CONTENTS
Editorial 3

Military & Aerospace EMC 5

Equipment Manufacturers

MIL-STD-461G and RTCA/DO-160 8

Test Configuration Management
STEVE FERGUSON
Compliance Direction LLC

Things Not on the Schematic—How 14

the Unseen Keeps Us Busy
PATRICK ANDRE
Andre Consulting, Inc.

Circuit Level Design and Test for the 19

MIL-STD-461 200 V/m RS103 and the DO-160
Radiated Susceptibility Test at 200 V/m
DAVID WESTON
EMC Consulting Inc.

REFERENCE SECTION
References 24
(Article Links, Directories, Conferences, & LinkedIn Groups)

Table of New Equipment 26

Allowed/Required in MIL-STD-461G
Military Related Documents and Standards 29
Aerospace Standards 30
Index of Advertisers 32

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EDITORIAL
Jennifer Arroyo
Editorial Director, Interference Technology

Welcome to the 2020 edition of the Military & Aerospace EMC Guide from Interference
Technology. We hope you enjoy the informative articles and helpful resources and refer-
headshot ences we have featured in this guide.

Electromagnetic compatibility (EMC) is a consideration for most electronic devices, but it

becomes even more important in the military and aerospace sectors. Products and com-
ponents in these markets must hold up to harsh environmental conditions and pass strin-
gent standards set by government organizations.

The articles in the guide keep this in mind as they deliver valuable information to the EMC engineering community. In
“MIL-STD-461G and RTCA/DO-160 Test Configuration Management,” Steve Ferguson explains various test configu-
ration parameters for these standards and offers some supplementary guidance on best practices.

Patrick Andre provides real-life examples on how to identify causes of electromagnetic interference (EMI) during test-
ing in his article, “Things Not on the Schematic—How the Unseen Keeps Us Busy.”

We round out our feature articles with “Circuit Level Design and Test for the MIL-STD-461 200 V/m RS103 and the
DO-160 Radiated Susceptibility Test at 200 V/m,” by David Weston, who provides a thorough look at designing circuits
with Mil/Aero standards in mind.

Finally, I wanted to note the new downloadable EMC guides we’ve produced this year. If you visit our homepage,
you’ll see the list of guides. Some of the more popular ones include Automotive, Testing, EMC Fundamentals, and
IoT, Wireless, 5G.

Cheers,

Jennifer Arroyo
Editorial Director, Interference Technology
[email protected]

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MILITARY & AEROSPACE
EMC EQUIPMENT MANUFACTURERS
Introduction
The following chart is a quick reference guide of test equipment and includes everything you’ll need from the bare
minimum required for key evaluation testing, probing, and troubleshooting, to setting up a full in-house precom-
pliance or full compliance test lab for military and aerospace testing. The list includes amplifiers, antennas, current
probes, ESD simulators, LISNs, near field probes, RF signal generators, spectrum analyzers, EMI receivers, and TEM
cells. Equipment rental companies are also listed. The products listed can help you evaluate radiated and conducted
emissions, radiated and conducted immunity, and a host of other immunity tests, such as the new ESD test for MIL-
STD-461G.

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 INTERFERENCE TECHNOLOGY

EMC Equipment Manufacturers Type of Product/Service

Spectrum Analyzers/EMI Receivers

RF Signal Generators
Conducted Immunity

Pre-Compliance Test
Manufacturer Contact Information - URL

Radiated Immunity
Rental Companies
Near Field Probes
ESD Simulators
Current Probes

EMC Testing
EMC Filters
Amplifiers

Shielding

TEM Cells
Antennas

Software
Chokes

LISNs
A.H. Systems www.ahsystems.com X X X X
Aaronia AG www.aaronia.com X X X X
Advanced Test Equipment
www.atecorp.com X X X X X X X X X X X X X
Rentals
ALTAIR www.altair.com X
Anritsu www.anritsu.com X X X X
API Technologies www.apitech.com X
AR RF/Microwave
www.arworld.us X X X X X X X X X
Instrumentation
Captor Corporation www.captorcorp.com X
Coilcraft Inc. www.coilcraft.com X
Electro Rent www.electrorent.com X X X X X X X X X
EM Test www.emtest.com/home.php X X X
Empower RF Systems www.empowerrf.com X X
Exodus Advanced
www.exoduscomm.com X X X
Communications
Fischer Custom
www.fischercc.com X X X X
Communications
Gauss Instruments www.gauss-instruments.com/en/ X
HV Technologies, Inc. www.hvtechnologies.com X X X X X X
Instruments For
www.ifi.com X X X
Industry (IFI)
ITG Electronics www.itg-electronics.com X
Keysight Technologies www.keysight.com/main/home.jspx?cc=US&lc=eng X X X X X X
Milmega www.milmega.co.uk X X X
Narda/PMM www.narda-sts.it/narda/default_en.asp X X X X X X X
Noiseken www.noiseken.com X X X
Ophir RF www.ophirrf.com X X
Pearson Electronics www.pearsonelectronics.com X
PPM Test www.ppmtest.com X X X X X
R&B Laboratory www.rblaboratory.com X
Rigol Technologies www.rigolna.com X X X X X X X
Rohde & Schwarz www.rohde-schwarz.com/us/home_48230.html X X X X X X X X X X X
Siglent Technologies www.siglentamerica.com X X X X X
Signal Hound www.signalhound.com X X X X X X
Solar Electronics www.solar-emc.com X X X X X X X
Spira Manufacturing www.spira-emi.com X
TekBox Technologies www.tekbox.com X X X X X X
Tektronix www.tek.com X X X X
Teseq www.teseq.com/en/index.php X X X X X X X
Test Equity www.testequity.com X X X X X X X X X
Thurlby Thandar (AIM-TTi) www.aimtti.us X X X
Toyotech (Toyo) www.toyotechus.com/emc-electromagnetic-compatibility/ X X X X X X
Transient Specialists www.transientspecialists.com X X X
TRSRenTelCo www.trsrentelco.com/categories/spectrum-analyzers/emc-test-equipment X X X X X X X X X
Vectawave Technology www.vectawave.com X
Windfreak Technologies www.windfreaktech.com X X

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EMI Filtering The broadest line of standard products
and custom passive component solutions.

n Ceramic Capacitors
Exhibit low parasitic capacitance and
superior EMI filtering capabilities

n Coaxial Filters & Interconnects

Delivering a broad range of custom
and off-the-shelf options to meet
your design requirements

n Magnetics
Broad range of custom, application-
specific solutions

n Power Filters
Ideal to filter the AC or DC power
entering your system to prevent
radiated or conducted EMI

n Specialty Connectors
Custom connectors can be
designed to meet RTCA/DO-160 Innovative solutions from
Section 22 Lighting Strike components to complex
assemblies.

Standard configurable and fully

customizable electromagnetic
integrated solutions.

Email: [email protected]
Phone: +1 855-294-3800
www.apitech.com/eis
MIL-STD-461G AND RTCA/DO-160 TEST
CONFIGURATION MANAGEMENT
Steve Ferguson
Compliance Direction LLC
[email protected]

Introduction
MIL-STD-461G and RTCA/DO-160 (DO-160) provide in-depth discussions regarding the test configuration with gen-
eralized diagrams to support the discussion. The primary purpose for the discussions is to provide guidance and
standardize testing at various laboratories hoping to obtain like results at any test facility. Variations in the test con-
figuration are listed for some of the individual test methods if directed to accommodate the usage of the test and
measurement equipment and transducers.

We recognize that the test configuration in either standard is a generic arrangement meant to simulate various instal-
lation requirements. Many of the specific configuration parameters make efforts to relate the arrangement to an as-
sumed installation, but if we were able to exactly duplicate the installation, more realistic results would be obtained.
This desired duplication of the installation is only realizable for testing a few items with single applications. If this is
reasonable, I believe that the duplication is worthwhile and should be proposed in the test procedure instead of using
a generic arrangement. But, this is seldom reasonable.

A discussion of various test configuration parameters follows with some explanatory information to supplement the
guidance provided. Note that the DO-160 user guide RTCA/DO-357 contains additional information supplementing
the DO-160 standard and it should be used in conjunction with DO-160 for supporting information.

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2020 MILITARY & AEROSPACE EMC GUIDE

MIL-STD-461G AND RTCA/DO-160 TEST one must realize that maintaining the exact layout for
each test is not feasible. Some test methods call for
CONFIGURATION MANAGEMENT changes in the arrangement, therefore being able to re-
store the general configuration established as the stan-
General Configurations
dard configuration for the specific test program is nec-
The two standards being reviewed here have a few dif-
essary. The “standard” configuration for a particular test
ferences, so a couple of general diagrams are provided
will see some difference to accommodate the test article
here to establish a discussion basis. The discussion is
size and cable routing demands. In addition, the phys-
based on using the anechoic shielded enclosure method
ical layout of the test facility regarding interface panel
for testing, but if other methods are used the basic prin-
positions and doors will influence the layout and cable
ciples would still apply. These will be used throughout
routes. Positioning changes of the cable arrangement
this review. Figure 1 shows a general test configuration
can change the test results by 20 dB or more, making
diagram including some optional items that are includ-
documenting the layout critical for testing and the ability
ed or removed depending the test being accomplished
to repeat the testing.
and specifics about the deployed installation. Although
the diagram is closely associated with DO-160, the MIL-
In the the diagram below, some details are provided
STD-461 only has a few variations that will be discussed
to describe the configuration and how the various ele-
as we review the configuration layout details.
ments differ between DO-160 and MIL-STD-461 (note
that revision “G” is used as the configuration basis for
The details are normally documented in a test procedure both standards).
so the test personnel and approval authority can readily
see how things are arranged and how the various items Ground straps are attached between the ground plane
are implemented. Having knowledge of the test config- and the shielded enclosure using copper sheets with a
uration helps in the overall preparation for testing, by length to width ratio of 5:1 or less to minimize the induc-
providing a guide that identifies the detailed parameters tive reactance effects. Several ground straps are typ-
of the layout. ically used to provide a parallel path to further reduce
the resistance and inductance. The DC bonding resis-
The general test configuration shown in Figure 1 in- tance between the ground plane and enclosure wall is
cludes layout considerations for a variety of tests, and required to be less than 2.5 milliohms.

Figure 1: General Test Configuration

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 INTERFERENCE TECHNOLOGY

EUT Positioning The maximum resistance of the EUT bonding is not spec-
Figure 1 indicates that the EUT tends to be centered in ified in the standards, it needs to conform to the instal-
the test boundary, but both standards support positioning lation. However, safety regulations may impose a maxi-
at either side of the ground plane allowing cables to be mum resistance if hazardous voltage levels are present,
routed in the same direction. for example MIL-HDBK-2036 calls out less than 100 mil-
liohms for safety considerations in the final installation.
The diagram indicates that the EUT interface side fac- MIL-STD-464C also notes some specific maximums for
es the antenna in DO-160 and is shown parallel to the selected ground connections and points to less than 2.5
ground plane front in MIL-STD-461. These diagram milliohms for individual faying surfaces.
orientations may be a bit misleading because the test
orientation should be selected to produce the maximum Most test configurations use a copper ground plane meet-
emissions or most susceptible face. Experience indi- ing the size and conductivity requirements. If the instal-
cates that the cable face tends to be the worst case for lation uses a different plane or no ground plane, then the
lower-frequency signals (<~200 MHz) and equipment test configuration should match the installation by using a
aperture face tends to be worse at higher frequencies composite material or no ground plane for items that may
(>~200 MHz). Often, this leads us into testing multiple be hand-held.
faces unless probing clearly identifies a worst-case ori-
entation. Line Impedance Stabilization Network (LISN)
Arrangement
The white areas in Figure 1 indicate a 5 cm spacing to el- Power for the test article is normally brought into the en-
evate the cables. This elevation could possibly (although closure via a filtering arrangement to reduce ambient sig-
rarely) include the EUT. Normally the EUT is placed di- nals that could affect the test. The LISN is used to stan-
rectly on the ground plane unless the installation does dardize the power line impedance, compensating for a
not provide for this kind of ground connection. wide variety of installation impedances.

EUT Grounding and Bonding Notice in the diagram that two LISNs are shown with one
Both standards call for conforming to the installation for in a dotted line indicating that only one may be required.
the grounding and bonding of the EUT, specifying the The second LISN is not used if the EUT installation uses
use of the same materials and size grounds that is called a local ground for the power return. For that configura-
out in the installation. This includes using an equipment tion, the power return lead is connected to the ground
mount that matches the installation. This could present plane along with the input power return being connected
some difficulty for some installation types. When a vehi- to the ground plane. This single LISN configuration is ap-
cle or aircraft mount is specified, the mount is normal- propriate for both DO-160 and MIL-STD-461 testing.
ly part of the EUT configuration, and this includes the
associated straps, mounting base, and ground straps. The LISN chassis is bonded to the ground plane with a
The installation of rack-mounted equipment could in- resistance of less than 2.5 milliohms, indicating that the
dicate isolation of the chassis from the ground plane if surfaces of the ground plane and LISN base be free of
the rack-mounting flanges are insulated. The connection contaminates to assure the low resistance requirement.
of the EUT chassis to the ground plane should not in-
clude these incidental connections unless the installation MIL-STD-461 calls out the use of a 50 μH LISN but sup-
specifies the physical contacts. ports the use of 5 μH LISNs for certain applications. If a
5 μH LISN is used, adjustments to the test and limits are
Included in the grounding instructions, the chassis necessary for power line conducted tests. DO-160 calls
ground terminal is to be connected as installed using the for using a 5 μH LISN and places 10 μF capacitors on the
materials as defined in the installation drawings. DO-160 line side of the LISN.
adds a 30 cm representative type of wire, if the instal-
lation fails to define the ground terminal connection. A Arrangement of Signal/Control Leads and Cables
representative wire is usually a wire of the same size as Figure 1 shows a general layout of cables but often the
used or the power lead. actual configuration requires some creative placement to
manage multiple cables and provide for the connection to
The bonding and grounding method used is to be doc- the support equipment. Standardization and the ability to
umented in the test report. MIL-STD-461 requires that fit within the test chamber dictate several elements asso-
measurement of the bonding resistance be included in ciated with the arrangement.
the report, and it is a good practice to include the mea-
surements for DO-160 tests, although, it is not specifi- Both standards call for elevating the cables 5 cm above
cally required. This bonding measurement should be ac- the ground plane with the front cable located 10 cm be-
complished prior to installing cables to obtain the highest hind the front edge of the ground plane. The location of
bonding resistance representative of the installation. the EUT and the cable arrangement on the ground plane

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2020 MILITARY & AEROSPACE EMC GUIDE

forms the test boundary. DO-160 calls for at least 1 meter concept. Where power connections share a common in-
of cable be aligned at the test boundary front and MIL- terface with other signal connections, the power leads
STD-461 specifies at least 2 meters at this edge. After are separated from the other wires at the EUT interface.
meeting the front edge length requirement, excess cable When power leads are normally included in a shielded ca-
is routed toward the rear of the ground plane arranged in a ble, MIL-STD-461 calls for separating the power leads at
zig-zag pattern until the required cable length is satisfied. the EUT connector. However, when the power leads are
installed in a shielded cable connected to another equip-
The cable length maximum is 10 meters for MIL-STD-461 ment instead of the mains connection, keeping the shield-
and 15 meters for DO-160 for installations calling for long ed cable intact is permitted if the other equipment provid-
cable runs. Actual cable lengths should be used if known, ed isolation or filtering between the mains and the EUT.
and DO-160 uses 3.3 meter length as standard if installa-
tion parameters are unknown. This implies that if the actu- Using a local ground for the power neutral or return calls
al cable length is shorter than the specified front edge lay- for direct connection to the ground plane as discussed in
out, then a shorter cable is used in the test configuration. the LISN arrangement above.

Cables are to be of the type used in the installation. Antenna Cable Arrangement
Shielded cables, twisted pairs or triplets, types of shields, Antenna cables are often ignored in the MIL-STD-461
wire diameters, insulation type, and other parameters test configuration. DO-160 calls for terminating the anten-
bring parasitic elements into the configuration and aid in na cable with a dummy load matching the cable charac-
simulating the installation environment. Using the correct teristic impedance and MIL-STD-461 calls for terminating
cables and following the layout guidance supports the the antenna port. The word choice leads some people to
desired standardization. Note that the test configuration believe that the antenna cable is not present in the con-
should not drive the installation—the installation should figuration and they simply place a terminator on the EUT
drive the configuration. If testing reveals that certain in- antenna connector. This action virtually eliminates radiat-
stallations practices need to be modified, those changes ed emissions from the antenna cable from being detected
must be accepted prior to accepting the test results. and fails to assess susceptibility associated with cable
coupling into a sensitive circuit. The CS114 test method
Cables that exit the area above the ground plane are not helps alleviate the ambiguity by calling for antenna cable
typically considered to be within the test boundary. The testing for surface ship and submarine applications.
cable length beyond the ground plane normally routed
to external support equipment, may be shielded as stat- The antenna cable representative of the installation
ed in DO-160. MIL-STD-461 does not acknowledge that should be present in the MIL-STD-461 test configuration,
this portion of the cable is present, so the test procedure with a terminator at the end of the cable.
should account for this layout and should incorporate
shielding as indicated in DO-160. Measurement System Antenna Arrangement
During radiated emission testing, the measurement sys-
Do not forget that the cables should be properly termi- tem antenna is positioned 1 meter from the test boundary
nated into loads or support equipment representative of (0.9 meter from the ground plane). The antenna center
the system equipment associated with the test item. Also, is 120 cm above the enclosure floor for MIL-STD-461
remember that mechanical loads need to be included in testing and 30 cm above the ground plane level for DO-
the termination requirements. 160 testing. MIL-STD-461 provides additional guidance
on using multiple antenna positions and the EUT and
Arrangement of Power Leads and Cables cable coverage within the antenna beamwidth. DO-160
Power cable arrangements are much like the signal/con- provides for multiple antenna positions where the entire
trol cable arrangements, but a few specific requirements EUT plus a half-wavelength (λ/2) of cabling. This multiple
merit this separate discussion. positioning is discussed in the radiated susceptibility sec-
tion of the standard and would also apply to the radiated
DO-160 is very specific regarding a 1 meter power ca- emissions section.
ble length with a ±10% tolerance and MIL-STD-461 calls
for less than 2.5 meters. This prevents being able to do Radiated susceptibility and radiating antenna positions
a DO-160 test and a MIL-STD-461 test with the same may be greater than 1 meter if the required field strength
power cable because of the front edge requirement for 2 can be generated. This increased distance provides
meters of power cable. If needing to do testing for both greater coverage area, so fewer antenna positions are
standards, seek approval to implement a common power required to fully illuminate the EUT.
cable arrangement.
Field Probe Arrangement
MIL-STD-461 is very specific that shielded power cables Figure 1 shows the field probe adjacent to the EUT at
are not to be used and DO-160 basically uses the same the test boundary. Positioning of the probe should avoid

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 INTERFERENCE TECHNOLOGY

the probe being in a shadow of the EUT and to avoid probe. MIL-STD-461 conducted emission testing places
reflections from the EUT. The elevation above the ground the monitor probe 5 cm from the LISN connection instead
plane should be at least 30 cm to avoid ground plane of near the EUT. Although the drawing shows current
reflections reaching the measurement head. Many lay- probe cables being routed to measurement equipment
out drawings show the probe directly in front of the EUT, outside the enclosure, it is common to locate the mea-
which works for pre-calibrating the field without the EUT surement equipment in the enclosure to minimize cable
being present. This position should be avoided when ac- lengths and prevent injected signals radiating from the
tive field leveling is used during test. The important issue cable into the environment.
is to make sure that the illuminating field is at the proper
level to avoid over- or under-testing. Summary
Some specific test methods call for changes to the gener-
DO-160 supports a field pre-calibration method where al configuration discussed above, so make sure to make
the field probe is located where the front of the EUT will the changes for those tests—the details are noted in the
be placed. The field is measured without the EUT, and standards for those tests and should also be included in
the required power is recorded. The recorded power is the test procedure. Do not forget to restore the general
used during test once the EUT is in test to apply the test configuration minimizing the variations in how the layout
field strength. is arranged—changes in cable positions can significantly
impact the test repeatability.
Current Probe Arrangement
Current probes are used during conducted emission Hopefully, you will find this information useful and I wel-
and conducted susceptibility testing. The measurement come questions. If you have a topic associated with EMC
probe is placed around the cable under test, 5 cm from that you would like to have reviewed, let me know and I
the EUT (EUT connector not 5 cm from the cable back- will try to place it in the queue for future articles.
shell). Injection probes are located 5 cm from the monitor

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THINGS NOT ON THE SCHEMATIC—HOW
THE UNSEEN KEEPS US BUSY

Patrick Andre
Andre Consulting, Inc.
[email protected]

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2020 MILITARY & AEROSPACE EMC GUIDE

THINGS NOT ON THE SCHEMATIC—HOW

THE UNSEEN KEEPS US BUSY
The engineer I was working with and I stood amazed at
the results. A capacitor that was moved less than 1 inch
away from a connector and turned sideways degraded
the emission results several dB and increased it above
the limit. How could that be? They were identical on the
schematic.

I heard once that the field of EMC is the design of circuits

and equipment which considers things that do not appear Figure 1: Where are the fields from?
on a schematic. These are the issues of electric field
and magnetic field coupling into adjacent circuits, wires,
and components, and issues of unknown or uncontrolled The cause of this issue was due to magnetic field cou-
current paths. To control these issues, it requires being pling. Magnetic fields from the device’s internal trans-
aware of these fields, how they are generated, and the former coupled into an adjacent trace, which induced a
mechanism by which they couple, as well as how cur- current in that trace. It was a surprise to us. From the
rents are generated and how they return to the source of outside, it does not look like something that will cause
the energy that created those currents. any issues with conducted emissions. And the specifica-
tion for this component shows performance with a wide
When EMI problems occur, they are often due to un- margin with respect to conducted emissions limits.
known or unforeseen issues of components. Take the
following, for example. In Figure 1, if we were going to If you use this device, just make sure you do not have
be concerned with cross coupled issues, we may want to anything important next to it.
reroute that cable we see over the circuit board. Or, may-
be, we would have concerns about the large inductor in These magnetic coupling issues are usually found in
the upper right corner, or the small one in the lower right lower impedance circuits, where currents can flow with
under the cable. These may have uncontrolled magnetic greater ease. But what happens in high impedance cir-
fields, which could couple energy into nearby traces. It cuits? These are more susceptible to capacitive coupling.
turns out, neither of these were a problem. One way to demonstrate that is using a standard MIL-
STD-461 or DO-160 setup.
Look at where the arrow is pointing on the left side of
the photo. This is a DC-DC converter, which contains an I took an inexpensive spectrum analyzer with a track-
internal transformer. The fields from this device ended ing generator. A tracking generator is an internal signal
up coupling into the input power trace running under the source that creates a signal at a set amplitude and the
near side of the device indicated in this picture. Due to same frequency the analyzer is measuring. I ran the
a misplaced filter, the input power conducted emissions tracking generator signal into an unterminated 5-foot wire
increased by 20 dB and more, due to the proximity of this (150 cm), and the return signal was routed to a ground
converter and internal transformer. Rerouting the trace plane. A current probe was placed on the drive end of the
improved the results radically (see Figure 2). wire. A simplified setup drawing is shown in Figure 3.

Figure 2: Rerouted trace and the resulting emissions

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 INTERFERENCE TECHNOLOGY

ground plane to close the current loop. The loop is closed

by displacement currents, a time varying electric field due
to the voltage difference between the wire and the ground
plane (which was the return). Now, how do we use this to
our advantage or to avoid problems?

If I have a cable inside my equipment that I want to avoid

Figure 3: An experiment on capacitive coupling radiating on to a sensitive circuit, I can route that wire
away. If I can route it near a conductive surface, such as
The figure shows the wire on 5 cm standoffs, as is com- a chassis, the conductor can couple that energy away,
monly used for our tests. However, I then routed the wire and preferably back to the source in a controlled man-
directly on the ground plane, and also routed the wire off ner. Conversely, if that cable is sensitive to energy being
the ground plane so that it was in space (held up with a picked up from high-energy or noisy circuits or systems,
plastic stand to avoid other parasitic coupling). The wire routing the cable along the conductive surface will help
was swept with a signal from 100 kHz to 100 MHz. Only minimize the energy induced onto it. This comes from the
the wire was moved during the three scans, and no other concept that parallel electric fields at the surface of a per-
changes were made to the setup, and the current probe fect conductor go to zero.
was as close to the output port as physically possible.
The results are shown in Figure 4. So, the solution may be to route wires near chassis, or
maybe not. And, care may be needed to assure traces do
not couple electric field into them from unwanted sourc-
es. However, using traces over ground planes are often
highly beneficial and improve signal integrity when de-
signed properly.

In a recent article, I discussed an issue with chassis

bonds. A common method of determining the quality of a
shield was to consider the material conductivity, the thick-
ness and the screw spacing. The conductivity along with
the thickness will provide the maximum capability of the
material to shield. If it is not conductive enough, or thick
enough, you may never get the desired results.

But what about screw spacing. I have often seen draw-

ings that show contact points as shown in Figure 5. One
concept is that contact occurs for the first third of the
spacing between fasteners, and again for the last third,
Figure 4: Wire over a ground plane but the middle third is open.

Upon closer examination I found the following. At 10 MHz

the induced current in the wire on the ground plane was
9 dB higher than the same wire on 5 cm standoffs, and
12 dB higher than the wire routed away from the ground
plane. Above 30 MHz, this system starts to break down,
likely due to the cross coupled energy at the source, the
line impedances (inductance), and so forth. However, up
to 30 MHz, the results were repeatable.

So, what does this tell us? First, there is some coupling
of energy from wires on 5 cm standoffs over a ground Figure 5: Chassis bonds
plane. That should not surprise most experienced military
and aerospace test engineers. This is also how the wires Some of these “rules of thumb” do not consider the stiff-
are routed in most military and aerospace applications— ness of the materials, the spacing of the fasteners, nor
wires over a metal structure. Also, note that unterminated the coatings. For example, if I have a steel box with a
wires closely coupled to conductive surfaces can capac- sheet metal lid that is 50 cm wide and only put fasteners
itively couple their own return path. Remember this is an in the corners, the likelihood of gaps in the middle of the
unterminated wire, so I did not allow a connection to the seam is rather significant. There is not enough rigidness

www.interferencetechnology.com | 16 | 2020 Military & Aerospace EMC Guide

2020 MILITARY & AEROSPACE EMC GUIDE

in the lid to maintain a bond in the middle. In this case, created a voltage between the lid and the chassis. Volt-
fasteners may need to be 5 to 10 cm apart to assure a ages between two pieces of metal with an impedance be-
bond. But what if I have a thick-walled chassis that has a tween them act like an antenna and tend to transmit ener-
thick lid? The spacings between fasteners may be a bit gy. This may have been viewed as a transfer impedance
wider and still maintain the bond. And yet the whole thing problem, or the creation of displacement currents. The
can go to waste if there is a coating on the chassis. impedance between these metal parts could have been
one molecule thick, too thin to transmit radio frequencies
If one only looks at the potential opening, or window cre- sideways through it. However, if currents cannot flow
ated between fasteners, as the driving factor in shielding across the gap, even that small, then the resulting voltag-
effectiveness, you may miss a critical aspect of shielding. es on the two sides of this barrier will still transmit energy.
Take my sheet metal box with 50 cm spacing. If the win-
dow is the full 50 cm, and that relates to the half wave- This same issue arose recently on a display I was work-
length of the leakage, then we would think that below 300 ing on. The case it was mounted in was nearly 1 inch
MHz, this shield should start to work well. If we reduce thick, and yet we developed significant emissions from
the spacing to 5 cm, the shield should be 20 dB better the display that were not found earlier. We discovered
across the frequency range. Yet often that is not the case. one corner bolt used to seal the chassis had stripped out.
For the situation I discussed in my past article, the unit The corner was not bonded well and was leaking. Clamp-
had a thick-walled chassis made of aluminum, with fas- ing the corner dropped the emissions a great deal.
teners about 5 cm apart. The emissions we found from
1-10 MHz failed the MIL-STD-461 limit where the shield- Try as we might to capture all the relevant issues con-
ing effectiveness should have been well over 100 dB. The cerning EMC on a schematic, we often find we missed
emissions did not change much when the lid was off. If several things. They do not provide DC to DC converters
you were wondering, no, the emissions were not from with magnetic field maps. And, inductors are best mod-
the cables. However, once we cleaned off all the oil and eled with capacitance across them, and capacitors with
grease built up on the chassis and lid from the handling inductors in series. Wires and traces include a bit of ev-
and construction of the unit, the emissions dropped 20 dB erything. Diodes are making wonderful noise generators
and we passed the test. over 30 MHz now.

In this case, we were working on a power supply with As EMC engineers, we need to be proficient in several
significant currents flowing internally and several mag- disciplines, in many fields of engineering, to fully support
netic cores inside. The resulting fields from the current the engineers we work with. Schematics will only tell you
flow and the magnetics would induce currents in the alu- part of the story. Many parasitic elements are not docu-
minum chassis under and around the circuit board, as mented. Mechanical and manufacturing techniques play
well as in the lid near the magnetics. Once these currents a role in passing EMC requirements. I guess we, as EMC
started to flow, they need to complete a loop. When the engineers, will just keep busy.
induced currents reached the seam, they met an imped-
ance that prevented the flow of the current directly. This

www.interferencetechnology.com | 17 | Interference Technology Guide Series

 The Single Source for
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CIRCUIT LEVEL DESIGN AND TEST FOR THE
MIL-STD-461 200 V/M RS103 AND THE DO-160
RADIATED SUSCEPTIBILITY TEST AT 200 V/M

David Weston
EMC Consulting Inc.
[email protected]

Introduction
For Army, Navy, and Air Force military equipment and DO-160 commercial aircraft avionics, radiated susceptibility
test levels as high as 200 V/m may be specified. As always, it is better to design immunity to the test levels into
equipment than to wait until equipment is completed and then perform tests.

This article assumes the worst-case qualification test levels of 200 V/m. If the radiated susceptibility test levels are
lower than all of the predicted circuit test levels can be reduced accordingly.

This article shows levels induced into the circuits when 200 V/m is incident on the equipment’s shielded or unshield-
ed cables. With this information, circuits can be designed to be immune to the levels. The high-level tests require
high-power amplifiers and antennas capable of coping with the power. Although common in test labs, these are not
so common in manufacturers’ test facilities. The circuit-level tests described here require only signal generators or
low power amplifiers with a spectrum analyzer or oscilloscope.

Military equipment and avionic equipment are typically enclosed in well-shielded enclosures and the coupling from
an incident E field is predominantly to cables at 1 GHz and at lower frequencies. For this reason, this report concen-
trates on cable coupling.

www.interferencetechnology.com | 19 | Interference Technology Guide

 INTERFERENCE TECHNOLOGY

CIRCUIT LEVEL DESIGN AND TEST FOR THE For example, for the asymmetrical connection these fre-
quencies are 25 MHz, 75 MHz, 125 MHz, 225 MHz, 275
MIL-STD-461 200 V/M RS103 AND THE DO-160
MHz, 325 MHz, 375 MHz, 425 MHz, and 975 MHz, and
RADIATED SUSCEPTIBILITY TEST AT 200 V/M for the symmetrical connection 50 MHz, 150 MHz, 250
MHz, 350 MHz, 450 MHz, 550 MHz, 650 MHz, 750 MHz,
Analyzing the Circuit Test Levels 850 MHz, and 1950 MHz. The MOM program used was
The methods of moments (MOM) formulation was used to 4NEC2D by Arie Voors. Figure 1 shows the model for a sin-
model the RS103 and the DO-160 test set up. A ground gle conductor at low frequency and Figure 2 at 975 MHz.
plane 4 m x 2 m constructed of numerous patches with the
patch maximum dimension limited to 0.3 λ. Either a single The 4NEC2D program was used to predict the E field at
conductor or two conductors 3 m long in were constructed the center of the conductor, 5 cm above the ground plane
at a height of 5 cm above the ground plane. The single and the current through the termination to the ground
conductor was located 10 cm from the front of the ground plane. Also the current down the conductor and in the ter-
plane. The second conductor was placed a few mm apart mination of the conductor to the ground plane. Based on
from the first. The single conductor was terminated in an the ratio of the 200 V/m and the MOM predicted E field,
S/C representing the connection of a shielded cable to the cable and termination currents have been corrected
the ground plane. One conductor of the twin conductor for 200 V/m. Figure 1a shows the S/C termination current
cable was terminated in either a short circuit, a 50 Ohm, and Figure 2a shows the cable current.
or 1,000 Ohm load and the second to the ground plane.

With the asymmetrical connection of the cable/s (con-

nected to the ground plane at one end only) the MOM
calculation has been proven to be correct (Reference 1).
However, with the symmetrical connection, the MOM fails.
This is not a problem as the load current and maximum
cable currents are the same as the asymmetrical connec-
tion only the resonant frequencies change.

Figure 1a: Current in S/C load

Figure 1: MOM RS103 test set up low frequency

Figure 2: MOM RS103 test set up at 975 MHz Figure 2a: Current down cable with S/C load

www.interferencetechnology.com | 20 | 2020 Military & Aerospace EMC Guide

2020 MILITARY & AEROSPACE EMC GUIDE

The cable current and voltage induced into a two-conduc- Table 1 shows also shows the voltages.
tor line, where one line is terminated to the ground plane
and the second line terminated in either 50 Ohm or 1,000
Ohm, was computed. This represents an unshielded sig-
nal or control line with 50 Ohm or 1,000 Ohm common
mode impedance or the input impedance for signals with
the return referenced to chassis. The voltages developed
across 50 Ohm for the 200 V/m incident E field is shown
in Figure 3 and for 1,000 Ohm in Figure 4.

Table 1: Voltages developed across a 50 Ohm and 1,000 Ohm load

Voltage Developed into a Shielded Cable at 200 V/m

As current flows down a shielded cable, a transferred volt-
age is developed on the center conductor(s). The voltage
is developed across the transfer impedance of the cable.
Two common cables used in military and avionic equip-
ment are a single braid with high optical coverage and
a double braid with high optical coverage. Assuming the
cable shield is terminated at one end to the ground plane,
the cable current will be that shown in Figure 5.
Figure 3: Voltages developed across 50 Ohm load

Figure 5: Cable current with a short circuit termination

Figure 4: Voltages developed across 1,000 Ohm load Reference 1 shows data on single braid and double braid
cable from 100 kHz to 20 GHz.
Clearly, for many signal interfaces, a signal line filter will
be required. Reference 1 describes the design and imple- Table 2 shows the current with the transfer impedances
mentation of a large number of such filters. of the cables and the transferred voltages.

www.interferencetechnology.com | 21 | Interference Technology Guide Series

 INTERFERENCE TECHNOLOGY

for the 1,000 pF capacitors is to reduce the C/M current

on the cable, and, thus, the radiated emissions and this
has been shown to be effective.

Table 2: The values of Vt for single and double braid cables Table 3: Voltage across 1,000 pF with the predicted short circuit current

The values in Table 2 are based on well-shielded cables, Conclusion

and assume the transfer impedance of the connector and This article provides the predicted voltages developed
EMI backshell are very low. When these are not the case into cables with an incident 200 V/m E field. An analysis
then the transferred voltages may be much higher. of the effect on the interface circuits can then be made
using a tool such as SPICE. Alternatively, a breadboard
If the cable shield is terminated in a pigtail, then the of the interfaces can be made and common laboratory
shielding effectiveness may be much lower and the trans- equipment used to test the immunity of the circuits.
fer impedance higher as shown in Reference 1. A sec-
ondary effect that may be overlooked is that a voltage Reference 1
will be developed between the ground plane due to the Electromagnetic Compatibility Methods, Analysis, Cir-
inductance of the pigtail (long wire) shield ground. This cuits, and Measurement. David A. Weston. CRC press.
voltage will be capacitively coupled between the shield 2017
and center conductor/s of the shielded cable, which, if the
conductors are referenced to chassis or have an imped-
ance to chassis, may result in EMI.

Voltage Developed at the Input of a Power Line Filter

Very often the requirement for input power lines is that
the lines must be unshielded. Often isolating converters
are used, in which case the power line and return are
isolated from chassis, and this isolation is also commonly
a requirement. The current induced and the voltage de-
veloped due to the incident field is thus C/M.

A very good practice is to include low-value capacitors

between the power line and chassis and the power return
and chassis at the location where the power enters the
enclosure. A good value for the capacitors is 1,000 pF.

Assuming 0805 surface mount 1,000 V capacitors con-

nected to a double-sided PCB with a single via connect-
ing the power line side to the chassis side of the PCB,
the total combined capacitor parasitic inductance and via
inductance is approximately 3.0 nH. Based on the short
circuit current, the voltage developed across a 1,000 pF
capacitor is shown in Table 3.

Most power line filters are designed to reduce conduct-

ed emissions and are not effective at reducing radiated
emissions above a certain frequency. The main purpose

www.interferencetechnology.com | 22 | 2020 Military & Aerospace EMC Guide

 Critical Moments
call for Critical Products

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Our critical-grade RF and Power inductors are built We also offer comprehensive product testing and
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REFERENCES
(ARTICLE LINKS, DIRECTORIES, CONFERENCES, & LINKEDIN GROUPS)

LINKS TO LONGER ARTICLES CONFERENCE DIRECTORIES

“MIL-STD-461G – The Compleat Review” AFCEA Events:

https://interferencetechnology.com/mil-std-461g- www.afcea.org/site/
compleat-review/
ASCE Events:
“Selecting the Proper EMI Filter Circuit For Military https://www.asce.org/aerospace-engineering/aerospace-
and Defense Applications” conferences-and-events/
https://interferencetechnology.com/selecting-proper-emi-
filter-circuit-military-defense-applications/ ASD Events:
https://www.asdevents.com/aerospace-defence
“Why is there AIR (In MIL-STD-461G)?”
https://interferencetechnology.com/air-mil-std-461g/ Aviation Week Event Calendar:
www.events.aviationweek.com/current/Public/Enter.aspx
“Overview of the DO-160 standard”
https://interferencetechnology.com/overview-of-the-do- Defense Conferences:
160-standard/ www.defenseconference.com/

“Design for DO-160 pin injection for indirect lightning” Global Edge (MSU):
https://interferencetechnology.com/design-for-do-160- https://globaledge.msu.edu/industries/aerospace-and-
pin-injection-for-indirect-lightning/ defense/events/

“DO-160 cable bundle testing for indirect lightning” IEEE AESS Events:
https://interferencetechnology.com/do-160-critical- www.ieee-aess.org/conferences/home
sections-cable-bundle-for-indirect-lightning/
Jane’s Events:
PUBLICATIONS www.janes.com/events

ITEM 2020 (Interference Technology Engineer’s Master) LINKEDIN GROUPS

ITEM is an exhaustive guide full of invaluable EMC direc-
tories, standards, formulas, calculators, lists, and “how- • Aerospace and Defense Subcontractor and Suppliers
to” articles, compiled in easy-to-find formats. • Aerospace and Security and Defence Technology
https://learn.interferencetechnology.com/item-2020/ and Business (Defence spelled correctly)
• Defense and Aerospace
2019 Military & Aerospace EMC Guide • EMP Defense Council
Curated specifically for engineers working in the EMC • High Intensity RF (HIRF) Professionals
field—as well as the manufacturers and suppliers of com- • Radio, Microwave, Satellite, and Optical Communications
ponents, test equipment, and services for those engineers. • RF/Microwave Aerospace and Defense Applications
https://learn.interferencetechnology.com/2019-military- • RF and Microwave Community
and-aerospace-emc-guide/

www.interferencetechnology.com | 24 | Interference Technology Guide

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TABLE OF NEW EQUIPMENT
ALLOWED/REQUIRED IN MIL-STD-461G

Tony Keys
EMC Analytical Services

Ken Javor
EMC Compliance

The following table was compiled by Ken Javor, of EMC Compliance. The updated changes to MIL-STD-461G
require some new equipment. One of these changes allows the use of time domain EMI receivers, which will help
speed up the testing, due to their fast FFT-based signal acquisition. Following is a list of some specific changes and
equipment requirements:

CS101 (Conducted Susceptibility, Power Leads)–There is now a requirement to measure induced AC power line
ripple. This requires a new “power ripple detector”, which is a specially designed isolation transformer that matches
the power line to 50 ohms.

CS114 (Conducted Susceptibility, Bulk Cable Injection)–This injection probe test now requires the use of a current
probe calibration fixture to validate the test level during pre-calibration.

CS117 (Conducted Susceptibility, Lightning Induced Transients, Cables and Power Leads)–This is a new test added
to MIL-STD-461G and requires a lightning transient simulator.

CS118 (Conducted Susceptibility, Personnel Borne Electrostatic Discharge)–This is a new test added to MIL-STD-
461G and requires a standard electrostatic discharge simulator.

RS103 (Radiated Susceptibility, Electric Field)–This test requires an E-field antenna that can go down to 2 MHz.

www.interferencetechnology.com | 26 | Interference Technology Guide

2020 MILITARY & AEROSPACE EMC GUIDE

Table of New Equipment Required for Latest Updates to MIL-STD-461G

Requirement Equipment Type Vendor(s) Websites

Amplifier Research http://www.arworld.us/html/dsp-receiver-multistar.asp

Gauss Instruments http://www.gauss-instruments.com/en/products/tdemi

Time Domain EMI
General Keysight http://www.keysight.com/en/pdx-x201870-pn-N9038A/mxe-emi-receiver-3-hz-to-44-
receivers*
ghz?cc=UG&lc=eng

Rohde & Schwarz https://www.rohde-schwarz.com/us/product/esw-productstartpage_63493-121280.html

Frequency domain ripple

monitoring transducer* Pearson Electronics https://www.pearsonelectronics.com/news/225-mil-std-461g-cs101-simplified
High-voltage differential
Rohde & Schwarz https://www.rohde-schwarz.com/us/product/rtzd01-productstartpage_63493-34629.html
probe, 100 MHz, 1k
CS101
V(RMS) Rohde & Schwarz https://www.rohde-schwarz.com/us/product/rto-productstartpage_63493-10790.html or
Digital Oscilloscopes
(200 MHz - 4 GHZ, 5/10 Rohde & Schwarz https://www.rohde-schwarz.com/vn/product/rte-productstartpage_63493-54848.html
GSa/s)

Current probe
CS114 Solar Electronics http://www.solar-emc.com/RFI-EMI.html (scroll to bottom of page)
calibration fixture

Indirect lightning test

CS117 Solar Electronics http://www.solar-emc.com/2654-2.html
systems

EMC Partner https://www.emc-partner.com/products/immunity/esd/esd-generator

EM Test http://www.emtest.com/products/productGroups/ESD_generators.php

CS118 ESD gun LISUN Group http://www.lisungroup.com/product-id-318.html

Noiseken http://www.noiseken.com/modules/products/index.php?cat_id=1

TESEQ http://www.teseq.com/product-categories/esd-simulators.php

1 – 18 GHz electric Amplifier Research http://www.arworld.us/html/field-analyzers-field-monitoring.asp

field probe (most test
RS103 ETS/Lindgren http://www.ets-lindgren.com/EMCProbes
facilities already have
one) NARDA http://www.narda-sts.us/products_highfreq_bband.php

* Specified as acceptable for use, but not required.

www.interferencetechnology.com | 27 | Interference Technology Guide Series

2020 MILITARY & AEROSPACE EMC GUIDE

MILITARY RELATED DOCUMENTS

AND STANDARDS
The following references are not intended to be all inclusive, but rather a representation of available sources of
additional information and point of contacts.

Document
Title
Number
MIL-HDBK-235-1C Military Operational Electromagnetic Environment Profiles Part 1C General Guidance, 1 Oct 2010.
Electromagnetic Environmental Effects and Spectrum Certification Guidance for the Acquisition
MIL-HDBK-237D
Process, 20 May 2005.
MIL-HDBK-240A Hazards of Electromagnetic Radiation to Ordnance (HERO) Test Guide, 10 Mar 2011.
Electrostatic Discharge Control Handbook for Protection of Electrical and Electronic Parts, Assem-
MIL-HDBK-263B
blies and Equipment (Excluding Electrically Initiated Explosive Devices), 31 Jul 1994.
MIL-HDBK-274A Electrical Grounding for Aircraft Safety, 14 Nov 2011.
Management and Design Guidance Electromagnetic Radiation Hardness for Air Launched Ord-
MIL-HDBK-335
nance Systems, Notice 4, 08 Jul 2008.
MIL-HDBK-419A Grounding, Bonding, and Shielding for Electronic Equipment and Facilities, 29 Dec 1987.
MIL-HDBK-454B General Guidelines for Electronic Equipment, 15 Apr 2007.
MIL-HDBK-1004-6 Lightning Protection, 30 May 1988.
MIL-HDBK-1195 Radio Frequency Shielded Enclosures, 30 Sep 1988.
Electroexplosive Subsystems, Electrically Initiated, Design Requirements and Test Methods, 30
MIL-HDBK-1512
Sep 1997.
MIL-HDBK-1857 Grounding, Bonding and Shielding Design Practices, 27 Mar 1998.
Grounding, Bonding, and Shielding for Common Long Haul/Tactical Communications-Electronics
MIL-STD-188-124B
Facilities and Equipment, 18 Dec 2000.
High-Altitude Electromagnetic Pulse (HEMP) Protection for Ground-Based C41 Facilities Perform-
MIL-STD-188-125-1
ing Critical, Time-Urgent Missions Part 1 Fixed Facilities, 17 Jul 1998.
MIL-STD-220C Test Method Standard Method of Insertion Loss Measurement, 14 May 2009.
MIL-STD-331C Fuze and Fuze Components, Environmental and Performance Tests for, 22 Jun 2009.
MIL-STD-449D Radio Frequency Spectrum Characteristics, Measurement of, 22 Feb 1973.
Requirements for the Control of Electromagnetic Interference Characteristics of Subsystems and
MIL-STD-461G
Equipment, 11 Dec 2015.
MIL-STD-464C Electromagnetic Environmental Effects Requirements for Systems, 01 Dec 2010.
MIL-STD-704F Aircraft Electric Power Characteristics, 12 Mar 2004.
Characteristics of 28 Volt DC Input Power to Utilization Equipment in Military Vehicles, 22 March
MIL-STD-1275E
2013 (MIL-STD-1275F expected in 2020)
Standard Practice for Shipboard Bonding, Grounding, and Other Techniques for Electromagnetic
MIL-STD-1310H
Compatibility Electromagnetic Pulse (EMP) Mitigation and Safety, 17 Sep 2009.
Effectiveness of Cable, Connector, and Weapon Enclosure Shielding and Filters in Precluding
MIL-STD-1377
Hazards of EM Radiation to Ordnance; Measurement of, 20 Aug 1971.
MIL-STD-1399 Section 300 Part 2 Medium Voltage Electric Power, Alternating Current 25 September 2018.

www.interferencetechnology.com | 29 | Interference Technology Guide Series

 INTERFERENCE TECHNOLOGY

Electromagnetic Compatibility and Grounding Requirements for Space System Facilities, 15 Nov
MIL-STD-1542B 1991. MIL-STD-1605 Procedures for Conducting a Shipboard Electromagnetic Interference (EMI)
Survey (Surface Ships), 08 Oct 2009.
Electrostatic Discharge Control Program for Protection of Electrical and Electronic Parts, Assem-
MIL-STD-1686C
blies, and Equipment (Excluding Electrically Initiated Explosive Devices). 25 Oct 1995.
ADS-37A-PRF Electromagnetic Environmental Effects (E3) Performance and Verification Requirements, 28 May 1996.
DOD-STD-1399 Section 070 Part 1 D.C. Magnetic Field Environment, Notice 1, 30 Nov 1989.
DoDD 3222.03 DoD Electromagnetic Environmental Effects (E3) Program, 24 Aug 2014.
DoDD 4650.01 Policy and Procedures for Management and Use of the Electromagnetic Spectrum, 09 Jan 2009.
DoDD 6055.11 Protecting Personnel from Electromagnetic Fields, 19 Aug 2009.

AEROSPACE STANDARDS
AIAA STANDARDS
http://www.aiaa.org/default.aspx

Document Number Title

S-121-2009 Electromagnetic Compatibility Requirements for Space Equipment and Systems 

RTCA STANDARDS
www.rtca.org/

Document Number Title

DO-160G Environmental Conditions and Test Procedures for Airborne Equipment 
DO-160G Change 1 Environmental Conditions and Test Procedures for Airborne Equipment 
DO-233 Portable Electronic Devices Carried on Board Aircraft 
DO-235B Assessment of Radio Frequency Interference Relevant to the GNSS L1 Frequency Band 
DO-292 Assessment of Radio Frequency Interference Relevant to the GNSS L5/E5A Frequency Band
DO-294C Guidance on Allowing Transmitting Portable Electronic Devices (T-PEDs) on Aircraft 
DO-307A Aircraft Design and Certification for Portable Electronic Device (PED) Tolerance
DO-357 User Guide: Supplement to DO-160G 
Guidance for the Development of Portable Electronic Devices (PED) Tolerance for Civil
DO-363
Aircraft 
Guidance for the Development of Portable Electronic Devices (PED) Tolerance for Civil
DO-363-1
Aircraft Change Notice 1
Minimum Aviation System Performance Standards (MASPS) for Aeronautical
DO-364
Information/Meteorological Data Link Services 
DO-381 Environmental Conditions and Test Procedures for Ground Based Equipment

SAE STANDARDS
www.sae.org/

Document Number Title

ARP 5583A Guide to Certification of Aircraft in a High Intensity Radiation (HIRF) Environment  

www.interferencetechnology.com | 30 | 2020 Military & Aerospace EMC Guide

 From the Creators of Interference Technology

I N T R O D U C I N G

THERE’S ONLY ONE SPOTLIGHT

ARE YOU IN IT?

Positioning Ambitious B2B Electronics Companies
for Aggressive Growth

www.lectrixgroup.com

PHILADELPHIA, PA | HONG KONG

 assemblies.

INTERFERENCE TECHNOLOGY
Standard configurable and fully
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Captor Corporation Coilcraft Inc. Exodus Advanced

5040 South County Road 25A 1102 Silver Lake Road Communications
Tipp City, OH 45371 Cary IL 60013 3674 East Sunset Road, Suite 100
Las Vegas, NV 89120
t: (937) 667-8484 t: (800 322-2645
e: [email protected] e: [email protected] t: (702) 534-6564
w: www.captorcorp.com w: www.coilcraft.com e: [email protected]
page: 13 page: 23 w: www.exoduscomm.com
page: 28

LECTRIX Rohde & Schwarz USA, Inc. Spira Manufacturing

1000 Germantown Pike 6821 Benjamin Franklin Drive 650 Jessie Street
Plymouth Meeting, PA 19462, U.S. Columbia, MD 21046, U.S. San Fernando, CA 91340

t: (484) 688-0300 t: (888) 837-8772 t: (818) 764-8222

e: [email protected] w: www.rohde-schwarz.com e: [email protected]
w: www.lectrixgroup.com page: 1 w: www.spira-emi.com
page: 31 page: 25

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