GL823 Design Guide - 100
GL823 Design Guide - 100
GL823
USB 2.0 SD/MMC Card Reader
Controller
Design Guide
Rev. 1.00
Sep 8, 2009
GL823 Design Guide
Copyright:
Copyright © 2009 Genesys Logic, Inc. All rights reserved. No part of the materials shall be reproduced in any
form or by any means without prior written consent of Genesys Logic, Inc.
Disclaimer
All Materials are provided “as is”. Genesys Logic, Inc. makes no warranties, express, implied or otherwise,
regarding their accuracy, merchantability, fitness for any particular purpose, and non-infringement of
intellectual property. In no event shall Genesys Logic, Inc. be liable for any damages, including, without
limitation, any direct, indirect, consequential, or incidental damages. The materials may contain errors or
omissions. Genesys Logic, Inc. may make changes to the materials or to the products described herein at
anytime without notice.
Revision History
CONTENTS
1. PREFACE…. .................................................................................................. 5
2. GENERAL MAIN BOARD LAYOUT GUIDELINE ................................ 5
2.1 Component Routing and Placement...................................................... 5
2.2 Recommended Layout Sequence ........................................................... 5
2.3 Differential Signal ................................................................................... 5
2.4 Power Line ............................................................................................... 8
2.5 Card Interface Signal.............................................................................. 8
1. PREFACE
The purpose of this document is to provide suggestions and descriptions for the design of PCB layout
concerning the GL823 Card Reader Controller of Genesys Logic Inc., so that the client can verify in the
shortest time and start mass production.
Layer Description
Layer 1 Component and Signals
Layer 2 Signals
2.1.2
4-layer PCB: Layer 1 is used for component placement and signal layout, Layer 2 is GND plane, Layer 3 is
Power plane, and Layer 4 is used for component placement and signal layout.
Layer Description
Layer 1 Components and Signals
Layer 2 Ground
Layer 3 Power
Layer 4 Components and Signals
2.3.2
The space between GND or digital signal and the USB signal pairs shall be at least 20mils. Keep away from
the high speed signal or clock; the space should be at least 50mils. The width of the D+/D- tracing shall be
the same and approximate spacing (W approximate to S). See Figure 2.1.
2.3.3
USB signal traces shall be placed parallel as in Figure 2.2, not as in Figure2. 3.
2.3.4
Keep differential pair in the same layer as possible; keep minimum turns and shortest length to the USB
connector. When vias are used, they should always be placed in same location and symmetric. See Figure
2.4.
2.3.5
USB signal pair (D+, D-) traces shall be have equal length, Max trace-length mismatch should be no greater
than 60 mils. And guarded by ground plane is recommended. See Figure 2.5.
2.3.6
Place continuous ground area or power plane under signal traces. Please avoid crossing the different
reference power plane.
2.3.7
Place continuous ground area or power plane under signal traces. Please avoid crossing the different
reference power plane.
2.4.2
Place the bypass capacitor as close as possible to the chip, such as C7. See Figure 2.6.
2.4.3
It is best to have a complete GND below the IC. You can add some holes to increase the GND area. The EMI
will also have a better performance if you do so.
2.4.4
Add a series DC decoupling component (bead-100 ohm) to isolate the noise of DC-Power.
2.5.2
GL823’s Pin “SD_CLK” is clock signals. Please make it far away from other signals to avoid the noise
crosstalk.
2.5.3
Add a 4.7uF capacitor at SD card power (PMOS) trace and close to SD card connector.
2.5.4
When traces are encountered, please use 45° bends (or turns) of traces. It shows at Figure 2.7. All angles
between traces should be greater than 135 degrees. (α ≥ 135°) and the length of B and C should be
minimized. The number of left and right bends should be matched as closely as possible. This reduces
reflections on the signal by minimizing impedance discontinuities.
2.5.5
Keep the card bus as short as possible and keep the length of each data line equal in PCB design.
Figure 2.7 - Use the 45°° Bends, Preferred and Alternative Layout