MX25L512

512K-BIT [x 1] CMOS SERIAL FLASH

FEATURES

GENERAL
• Serial Peripheral Interface (SPI) compatible -- Mode 0 and Mode 3
• 524,288 x 1 bit structure
• 16 Equal Sectors with 4K byte each
- Any Sector can be erased individually
• Single Power Supply Operation
- 2.7 to 3.6 volt for read, erase, and program operations
• Latch-up protected to 100mA from -1V to Vcc +1V

PERFORMANCE
• High Performance
- Fast access time: 85MHz serial clock (15pF + 1TTL Load) and 66MHz serial clock (30pF + 1TTL Load)
- Fast program time: 1.4ms(typ.) and 5ms(max.)/page (256-byte per page)
- Fast erase time: 60ms(typ.) and 120ms(max.)/sector (4K-byte per sector) ; 1s(typ.) and 2s(max.)/chip(512Kb)
• Low Power Consumption
- Low active read current: 12mA(max.) at 85MHz, 8mA(max.) at 66MHz and 4mA(max.) at 33MHz
- Low active programming current: 15mA (max.)
- Low active erase current: 15mA (max.)
- Low standby current: 10uA (max.)
- Deep power-down mode 1uA (typical)
• Minimum 100,000 erase/program cycles

SOFTWARE FEATURES
• Input Data Format
- 1-byte Command code
• Block Lock protection
- The BP0~BP1 status bit defines the size of the area to be software protected against Program and Erase in-
structions.
• Auto Erase and Auto Program Algorithm
- Automatically erases and verifies data at selected sector
- Automatically programs and verifies data at selected page by an internal algorithm that automatically times the
program pulse widths (Any page to be programed should have page in the erased state first)
• Status Register Feature
• Electronic Identification
- JEDEC 2-byte Device ID
- RES command, 1-byte Device ID

HARDWARE FEATURES
• SCLK Input
- Serial clock input

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• SI Input
- Serial Data Input
• SO Output
- Serial Data Output
• WP# pin
- Hardware write protection
• HOLD# pin
- pause the chip without diselecting the chip
• PACKAGE
- 8-pin SOP (150mil)
- 8-USON (2x3mm)
- All Pb-free devices are RoHS Compliant

GENERAL DESCRIPTION

MX25L512 is a CMOS 524,288 bit serial Flash memory, which is configured as 65,536 x 8 internally. MX25L512
features a serial peripheral interface and software protocol allowing operation on a simple 3-wire bus. The three bus
signals are a clock input (SCLK), a serial data input (SI), and a serial data output (SO). SPI access to the device is
enabled by CS# input.

MX25L512 provide sequential read operation on whole chip.

After program/erase command is issued, auto program/ erase algorithms which program/ erase and verify the spec-
ified page or sector/block locations will be executed. Program command is executed on page (256 bytes) basis, and
erase command is executes on chip or sector (4K-bytes).

To provide user with ease of interface, a status register is included to indicate the status of the chip. The status read
command can be issued to detect completion status of a program or erase operation via WIP bit.

When the device is not in operation and CS# is high, it is put in standby mode and draws less than 10uA DC cur-
rent.

The MX25L512 utilize MXIC's proprietary memory cell, which reliably stores memory contents even after 100,000
program and erase cycles.

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PIN CONFIGURATIONS PIN DESCRIPTION

8-PIN SOP (150mil) SYMBOL DESCRIPTION
CS# Chip Select
SI Serial Data Input
CS# 1 VCC
SO 2
8
7 HOLD#
SO Serial Data Output
WP# 3 6 SCLK SCLK Clock Input
GND 4 5 SI
HOLD# Hold, to pause the device without
deselecting the device
WP# Write Protection
VCC + 3.3V Power Supply
8-LAND USON (2x3mm) GND Ground

CS# 1 8 VCC
SO 2 7 HOLD#
WP# 3 6 SCLK
GND 4 5 SI

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BLOCK DIAGRAM

Address

X-Decoder
Generator
Memory Array

Page Buffer

SI Data
Register
Y-Decoder
SRAM
Buffer

Sense Output
Mode State Amplifier Buffer
CS# Logic Machine HV
Generator

SO

SCLK Clock Generator

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DATA PROTECTION

MX25L512 is designed to offer protection against accidental erasure or programming caused by spurious system
level signals that may exist during power transition. During power up the device automatically resets the state ma-
chine in the standby mode. In addition, with its control register architecture, alteration of the memory contents only
occurs after successful completion of specific command sequences. The device also incorporates several features
to prevent inadvertent write cycles resulting from VCC power-up and power-down transition or system noise.

• Valid command length checking: The command length will be checked whether it is at byte base and completed
on byte boundary.

• Write Enable (WREN) command: WREN command is required to set the Write Enable Latch bit (WEL) before
other command to change data. The WEL bit will return to reset stage under following situation:
- Power-up
- Write Disable (WRDI) command completion
- Write Status Register (WRSR) command completion
- Page Program (PP) command completion
- Sector Erase (SE) command completion
- Block Erase (BE) command completion
- Chip Erase (CE) command completion

• Software Protection Mode (SPM): by using BP0-BP1 bits to set the part of Flash protected from data change.

• Hardware Protection Mode (HPM): by using WP# going low to protect the BP0-BP1 bits and SRWD bit from data
change.

• Deep Power Down Mode: By entering deep power down mode, the flash device also is under protected from
writing all commands except Release from deep power down mode command (RDP) and Read Electronic Sig-
nature command (RES).

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Table 1. Protected Area Sizes

Status bit
Protect level 512b
BP1 BP0
0 0 0 (none) None
0 1 1 (All) All
1 0 2 (All) All
1 1 3 (All) All

HOLD FEATURE

HOLD# pin signal goes low to hold any serial communications with the device. The HOLD feature will not stop the
operation of write status register, programming, or erasing in progress.

The operation of HOLD requires Chip Select(CS#) keeping low and starts on falling edge of HOLD# pin signal
while Serial Clock (SCLK) signal is being low (if Serial Clock signal is not being low, HOLD operation will not start
until Serial Clock signal being low). The HOLD condition ends on the rising edge of HOLD# pin signal while Se-
rial Clock(SCLK) signal is being low( if Serial Clock signal is not being low, HOLD operation will not end until Serial
Clock being low), see Figure 1.

Figure 1. Hold Condition Operation

CS#

SCLK

HOLD#

Hold Hold
Condition Condition
(standard) (non-standard)

The Serial Data Output (SO) is high impedance, both Serial Data Input (SI) and Serial Clock (SCLK) are don't care
during the HOLD operation. If Chip Select (CS#) drives high during HOLD operation, it will reset the internal logic of
the device. To re-start communication with chip, the HOLD# must be at high and CS# must be at low.

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Table 2. COMMAND DEFINITION

RDSR (read WRSR Fast Read
COMMAND WREN (write WRDI (write RDID (read READ
status (write status (fast read
(byte) enable) disable) identification) (read data)
register) register) data)
1st 06 (hex) 04 (hex) 9F (hex) 05 (hex) 01 (hex) 03 (hex) 0B (hex)
2nd AD1 AD1
3rd AD2 AD2
4th AD3 AD3
5th x
sets the (WEL) resets the outputs to read out to write new n bytes read
write enable (WEL) write manufacturer the status values to the out until CS#
Action latch bit enable latch ID and 2-byte register status register goes high
bit device ID

RDP
REMS (Read
BE (2) DP(Deep (Release RES (Read
COMMAND SE(Sector CE (Chip PP(Page Electronic
(Block Power from Deep Electronic
(byte) Erase) Erase) Program) Manufacturer
Erase) Down) Power- ID)
& Device ID)
down)
52 or D8 60 or C7
1st 20 (hex) 02 (hex) B9 (hex) AB (hex) AB (hex) 90 (hex)
(hex) (hex)
2nd AD1 AD1 AD1 x x
3rd AD2 AD2 AD2 x x
4th AD3 AD3 AD3 x ADD(1)
5th
Output the
manufacturer
Action ID and device
ID

(1) ADD=00H will output the manufacturer's ID first and ADD=01H will output device ID first.
(2) BE command may erase whole 512Kb chip.
(3) It is not recommended to adopt any other code which is not in the above command definition table.

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Table 3. Memory Organization

Sector Address Range

15 00F000h 00FFFFh
: : :
3 003000h 003FFFh
2 002000h 002FFFh
1 001000h 001FFFh
0 000000h 000FFFh

DEVICE OPERATION

1. Before a command is issued, status register should be checked to ensure device is ready for the intended op-
eration.

2. When incorrect command is inputted to this LSI, this LSI becomes standby mode and keeps the standby mode
until next CS# falling edge. In standby mode, SO pin of this LSI should be High-Z.

3. When correct command is inputted to this LSI, this LSI becomes active mode and keeps the active mode until
next CS# rising edge.

4. Input data is latched on the rising edge of Serial Clock(SCLK) and data shifts out on the falling edge of SCLK.
The difference of SPI mode 0 and mode 3 is shown as Figure 2.

5. For the following instructions: RDID, RDSR, READ, FAST_READ, RES and REMS the shifted-in instruction se-
quence is followed by a data-out sequence. After any bit of data being shifted out, the CS# can be high. For the
following instructions: WREN, WRDI, WRSR, SE, BE, CE, PP, RDP and DP the CS# must go high exactly at the
byte boundary; otherwise, the instruction will be rejected and not executed.

6. During the progress of Write Status Register, Program, Erase operation, to access the memory array is neglect-
ed and not affect the current operation of Write Status Register, Program, Erase.

Figure 2. SPI Modes Supported

CPOL CPHA shift in shift out

(Serial mode 0) 0 0 SCLK

(Serial mode 3) 1 1 SCLK

SI MSB

SO MSB

Note:
CPOL indicates clock polarity of SPI master, CPOL=1 for SCLK high while idle, CPOL=0 for SCLK low while not
transmitting. CPHA indicates clock phase. The combination of CPOL bit and CPHA bit decides which SPI mode is
supported.

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COMMAND DESCRIPTION

(1) Write Enable (WREN)

The Write Enable (WREN) instruction is for setting Write Enable Latch (WEL) bit. For those instructions like PP, SE,
BE, CE, and WRSR, which are intended to change the device content, should be set every time after the WREN in-
struction setting the WEL bit.

The sequence of issuing WREN instruction is: CS# goes low-> sending WREN instruction code-> CS# goes high. (see
Figure 11)

(2) Write Disable (WRDI)

The Write Disable (WRDI) instruction is for resetting Write Enable Latch (WEL) bit.

The sequence of issuing WRDI instruction is: CS# goes low-> sending WRDI instruction code-> CS# goes high. (see
Figure 12)

The WEL bit is reset by following situations:

- Power-up
- Write Disable (WRDI) instruction completion
- Write Status Register (WRSR) instruction completion
- Page Program (PP) instruction completion
- Sector Erase (SE) instruction completion
- Block Erase (BE) instruction completion
- Chip Erase (CE) instruction completion

(3) Read Identification (RDID)

RDID instruction is for reading the manufacturer ID of 1-byte and followed by Device ID of 2-byte. The MXIC Manu-
facturer ID is C2(hex), the memory type ID is 20(hex) as the first-byte device ID, and the individual device ID of
second-byte ID is as followings: 10(hex) for MX25L512.

The sequence of issuing RDID instruction is: CS# goes low→sending RDID instruction code→24-bits ID data out on
SO→to end RDID operation can use CS# to high at any time during data out. (see Figure. 13)

While Program/Erase operation is in progress, it will not decode the RDID instruction, so there's no effect on the cy-
cle of program/erase operation which is currently in progress. When CS# goes high, the device is at standby stage.

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(4) Read Status Register (RDSR)

The RDSR instruction is for reading Status Register Bits. The Read Status Register can be read at any time (even in
program/erase/write status register condition) and continuously. It is recommended to check the Write in Progress (WIP)
bit before sending a new instruction when a program, erase, or write status register operation is in progress.

The sequence of issuing RDSR instruction is: CS# goes low→sending RDSR instruction code→Status Register
data out on SO (see Figure. 14)

The definition of the status register bits is as below:

WIP bit. The Write in Progress (WIP) bit, a volatile bit, indicates whether the device is busy in program/erase/write
status register progress. When WIP bit sets to 1, which means the device is busy in program/erase/write status
register progress. When WIP bit sets to 0, which means the device is not in progress of program/erase/write status
register cycle.

WEL bit. The Write Enable Latch (WEL) bit, a volatile bit, indicates whether the device is set to internal write enable
latch. When WEL bit sets to 1, which means the internal write enable latch is set, the device can accept program/
erase/write status register instruction. When WEL bit sets to 0, which means no internal write enable latch; the de-
vice will not accept program/erase/write status register instruction.

BP1, BP0 bits. The Block Protect (BP1, BP0) bits, non-volatile bits, indicate the protected area(as defined in table
1) of the device to against the program/erase instruction without hardware protection mode being set. To write the
Block Protect (BP1, BP0) bits requires the Write Status Register (WRSR) instruction to be executed. Those bits
define the protected area of the memory to against Page Program (PP), Sector Erase (SE), Block Erase (BE) and
Chip Erase(CE) instructions (only if all Block Protect bits set to 0, the CE instruction can be executed)

SRWD bit. The Status Register Write Disable (SRWD) bit, non-volatile bit, is operated together with Write Protec-
tion (WP#) pin for providing hardware protection mode. The hardware protection mode requires SRWD sets to 1
and WP# pin signal is low stage. In the hardware protection mode, the Write Status Register (WRSR) instruction is
no longer accepted for execution and the SRWD bit and Block Protect bits (BP1, BP0) are read only.

bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0

BP1 BP0
SRWD (status WEL WIP
(level of (level of
register write 0 0 0 (write enable (write in
protected protected
protect) latch) progress bit)
block) block)
1=write 1=write
1=status
enable operation
register write (note 1) (note 1)
0=not write 0=not in write
disable
enable operation

Note: 1. See the table "Protected Area Sizes".

2. The endurance cycles of protect bits are 100,000 cycles; however, the tW time out spec of protect bits is
relaxed as tW = N x 15ms (N is a multiple of 10,000 cycles, ex. N = 2 for 20,000 cycles) after 10,000 cycles
on those bits.

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(5) Write Status Register (WRSR)

The WRSR instruction is for changing the values of Status Register Bits. Before sending WRSR instruction, the
Write Enable (WREN) instruction must be decoded and executed to set the Write Enable Latch (WEL) bit in ad-
vance. The WRSR instruction can change the value of Block Protect (BP1, BP0) bits to define the protected area
of memory (as shown in table 1). The WRSR also can set or reset the Status Register Write Disable (SRWD) bit in
accordance with Write Protection (WP#) pin signal. The WRSR instruction cannot be executed once the Hardware
Protected Mode (HPM) is entered.

The sequence of issuing WRSR instruction is: CS# goes low-> sending WRSR instruction code-> Status Register
data on SI-> CS# goes high. (see Figure 15)

The WRSR instruction has no effect on b6, b5, b4, b1, b0 of the status register.

The CS# must go high exactly at the byte boundary; otherwise, the instruction will be rejected and not executed.
The self-timed Write Status Register cycle time (tW) is initiated as soon as Chip Select (CS#) goes high. The Write
in Progress (WIP) bit still can be check out during the Write Status Register cycle is in progress. The WIP sets 1
during the tW timing, and sets 0 when Write Status Register Cycle is completed, and the Write Enable Latch (WEL)
bit is reset.

Table 4. Protection Modes

Mode Status register condition WP# and SRWD bit status Memory
Status register can be written
Software protection WP#=1 and SRWD bit=0, or The protected area
in (WEL bit is set to "1") and
mode (SPM) WP#=0 and SRWD bit=0, or cannot
the SRWD, BP0-BP1
WP#=1 and SRWD=1 be program or erase.
bits can be changed
The SRWD, BP0-BP1 of The protected area
Hardware protection
status register bits cannot be WP#=0, SRWD bit=1 cannot
mode (HPM)
changed be program or erase.

Note:
1. As defined by the values in the Block Protect (BP1, BP0) bits of the Status Register, as shown in Table 1.

As the table above showing, the summary of the Software Protected Mode (SPM) and Hardware Protected Mode (HPM).

Software Protected Mode (SPM):

- When SRWD bit=0, no matter WP# is low or high, the WREN instruction may set the WEL bit and can change
the values of SRWD, BP1, BP0. The protected area, which is defined by BP1, BP0, is at software protected
mode (SPM).
- When SRWD bit=1 and WP# is high, the WREN instruction may set the WEL bit can change the values of
SRWD, BP1, BP0. The protected area, which is defined by BP1, BP0, is at software protected mode (SPM)

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Note: If SRWD bit=1 but WP# is low, it is impossible to write the Status Register even if the WEL bit has previously
been set. It is rejected to write the Status Register and not be executed.

Hardware Protected Mode (HPM):

- When SRWD bit=1, and then WP# is low (or WP# is low before SRWD bit=1), it enters the hardware protected
mode (HPM). The data of the protected area is protected by software protected mode by BP1, BP0 and hard-
ware protected mode by the WP# to against data modification.

Note: to exit the hardware protected mode requires WP# driving high once the hardware protected mode is entered.
If the WP# pin is permanently connected to high, the hardware protected mode can never be entered; only can use
software protected mode via BP1, BP0.

(6) Read Data Bytes (READ)

The read instruction is for reading data out. The address is latched on rising edge of SCLK, and data shifts out on
the falling edge of SCLK at a maximum frequency fR. The first address byte can be at any location. The address
is automatically increased to the next higher address after each byte data is shifted out, so the whole memory can
be read out at a single READ instruction. The address counter rolls over to 0 when the highest address has been
reached.

The sequence of issuing READ instruction is: CS# goes low→ sending READ instruction code→ 3-byte address on
SI→ data out on SO→ to end READ operation can use CS# to high at any time during data out. (see Figure. 16)

(7) Read Data Bytes at Higher Speed (FAST_READ)

The FAST_READ instruction is for quickly reading data out. The address is latched on rising edge of SCLK, and
data of each bit shifts out on the falling edge of SCLK at a maximum frequency fC. The first address byte can be at
any location. The address is automatically increased to the next higher address after each byte data is shifted out,
so the whole memory can be read out at a single FAST_READ instruction. The address counter rolls over to 0 when
the highest address has been reached.

The sequence of issuing FAST_READ instruction is: CS# goes low→ sending FAST_READ instruction code→
3-byte address on SI→ 1-dummy byte address on SI→data out on SO→ to end FAST_READ operation can use
CS# to high at any time during data out. (see Figure. 17)

While Program/Erase/Write Status Register cycle is in progress, FAST_READ instruction is rejected without any im-
pact on the Program/Erase/Write Status Register current cycle.

(8) Sector Erase (SE)

The Sector Erase (SE) instruction is for erasing the data of the chosen sector to be "1". A Write Enable (WREN) in-
struction must execute to set the Write Enable Latch (WEL) bit before sending the Sector Erase (SE). Any address
of the sector (see table 3) is a valid address for Sector Erase (SE) instruction. The CS# must go high exactly at the
byte boundary (the latest eighth of address byte been latched-in); otherwise, the instruction will be rejected and not
executed.

Address bits [Am-A12] (Am is the most significant address) select the sector address.

The sequence of issuing SE instruction is: CS# goes low → sending SE instruction code→ 3-byte address on SI →
CS# goes high. (see Figure 19)

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The self-timed Sector Erase Cycle time (tSE) is initiated as soon as Chip Select (CS#) goes high. The Write in
Progress (WIP) bit still can be check out during the Sector Erase cycle is in progress. The WIP sets 1 during the
tSE timing, and sets 0 when Sector Erase Cycle is completed, and the Write Enable Latch (WEL) bit is reset. If the
page is protected by BP1, BP0 bits, the Sector Erase (SE) instruction will not be executed on the page.

(9) Block Erase (BE)

The Block Erase (BE) instruction is for erasing the data of the chosen block to be "1". A Write Enable (WREN) in-
struction must execute to set the Write Enable Latch (WEL) bit before sending the Block Erase (BE). Any address
of the block (see table 3) is a valid address for Block Erase (BE) instruction. The CS# must go high exactly at the
byte boundary (the latest eighth of address byte been latched-in); otherwise, the instruction will be rejected and not
executed.

The sequence of issuing BE instruction is: CS# goes low → sending BE instruction code→ 3-byte address on SI →
CS# goes high. (see Figure 20)

The self-timed Block Erase Cycle time (tBE) is initiated as soon as Chip Select (CS#) goes high. The Write in
Progress (WIP) bit still can be check out during the Sector Erase cycle is in progress. The WIP sets 1 during the
tBE timing, and sets 0 when Sector Erase Cycle is completed, and the Write Enable Latch (WEL) bit is reset. If the
page is protected by BP1, BP0 bits, the Block Erase (BE) instruction will not be executed on the page.

(10) Chip Erase (CE)

The Chip Erase (CE) instruction is for erasing the data of the whole chip to be "1". A Write Enable (WREN) instruc-
tion must execute to set the Write Enable Latch (WEL) bit before sending the Chip Erase (CE). Any address of the
sector (see table 3) is a valid address for Chip Erase (CE) instruction. The CS# must go high exactly at the byte
boundary( the latest eighth of address byte been latched-in); otherwise, the instruction will be rejected and not ex-
ecuted.

The sequence of issuing CE instruction is: CS# goes low→ sending CE instruction code→ CS# goes high. (see
Figure 20)

The self-timed Chip Erase Cycle time (tCE) is initiated as soon as Chip Select (CS#) goes high. The Write in
Progress (WIP) bit still can be check out during the Chip Erase cycle is in progress. The WIP sets 1 during the tCE
timing, and sets 0 when Chip Erase Cycle is completed, and the Write Enable Latch (WEL) bit is reset. If the chip
is protected by BP1, BP0 bits, the Chip Erase (CE) instruction will not be executed. It will be only executed when
BP1, BP0 all set to "0".

(11) Page Program (PP)

The Page Program (PP) instruction is for programming the memory to be "0". A Write Enable (WREN) instruction
must execute to set the Write Enable Latch (WEL) bit before sending the Page Program (PP). If the eight least sig-
nificant address bits (A7-A0) are not all 0, all transmitted data which goes beyond the end of the current page are
programmed from the start address if the same page (from the address whose 8 least significant address bits (A7-
A0) are all 0). The CS# must keep during the whole Page Program cycle. The CS# must go high exactly at the
byte boundary( the latest eighth of address byte been latched-in); otherwise, the instruction will be rejected and not
executed. If more than 256 bytes are sent to the device, the data of the last 256-byte is programmed at the request
page and previous data will be disregarded. If less than 256 bytes are sent to the device, the data is programmed
at the request address of the page without effect on other address of the same page.

The sequence of issuing PP instruction is: CS# goes low→ sending PP instruction code→ 3-byte address on SI→

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at least 1-byte on data on SI→ CS# goes high. (see Figure 18)

The self-timed Page Program Cycle time (tPP) is initiated as soon as Chip Select (CS#) goes high. The Write in
Progress (WIP) bit still can be check out during the Page Program cycle is in progress. The WIP sets 1 during the
tPP timing, and sets 0 when Page Program Cycle is completed, and the Write Enable Latch (WEL) bit is reset. If the
page is protected by BP1, BP0 bits, the Page Program (PP) instruction will not be executed.

(12) Deep Power-down (DP)

The Deep Power-down (DP) instruction is for setting the device on the minimizing the power consumption (to enter-
ing the Deep Power-down mode), the standby current is reduced from ISB1 to ISB2). The Deep Power-down mode
requires the Deep Power-down (DP) instruction to enter, during the Deep Power-down mode, the device is not ac-
tive and all Write/Program/Erase instruction are ignored. When CS# goes high, it's only in standby mode not deep
power-down mode. It's different from Standby mode.

The sequence of issuing DP instruction is: CS# goes low→ sending DP instruction code→ CS# goes high. (see Fig-
ure 22)

Once the DP instruction is set, all instruction will be ignored except the Release from Deep Power-down mode (RDP)
and Read Electronic Signature (RES) instruction. (RES instruction to allow the ID been read out). When Power-
down, the deep power-down mode automatically stops, and when power-up, the device automatically is in standby
mode. For RDP instruction the CS# must go high exactly at the byte boundary (the latest eighth bit of instruction
code been latched-in); otherwise, the instruction will not executed. As soon as Chip Select (CS#) goes high, a delay
of tDP is required before entering the Deep Power-down mode and reducing the current to ISB2.

(13) Release from Deep Power-down (RDP), Read Electronic Signature (RES)

The Release from Deep Power-down (RDP) instruction is terminated by driving Chip Select (CS#) High. When Chip
Select (CS#) is driven High, the device is put in the Stand-by Power mode. If the device was not previously in the
Deep Power-down mode, the transition to the Stand-by Power mode is immediate. If the device was previously in
the Deep Power-down mode, though, the transition to the Stand-by Power mode is delayed by tRES2, and Chip
Select (CS#) must remain High for at least tRES2(max), as specified in Table 6. Once in the Stand-by Power mode,
the device waits to be selected, so that it can receive, decode and execute instructions.

RES instruction is for reading out the old style of 8-bit Electronic Signature, whose values are shown as table of ID
Definitions. This is not the same as RDID instruction. It is not recommended to use for new design. For new deisng,
please use RDID instruction. Even in Deep power-down mode, the RDP and RES are also allowed to be executed,
only except the device is in progress of program/erase/write cycle; there's no effect on the current program/erase/
write cycle in progress.

The sequence is shown as Figure 23,24.

The RES instruction is ended by CS# goes high after the ID been read out at least once. The ID outputs repeat-
edly if continuously send the additional clock cycles on SCLK while CS# is at low. If the device was not previously
in Deep Power-down mode, the device transition to standby mode is immediate. If the device was previously in
Deep Power-down mode, there's a delay of tRES2 to transit to standby mode, and CS# must remain to high at least
tRES2(max). Once in the standby mode, the device waits to be selected, so it can be receive, decode, and execute
instruction.

The RDP instruction is for releasing from Deep Power Down Mode.

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(14) Read Electronic Manufacturer ID & Device ID (REMS)

The REMS instruction is an alternative to the Release from Power-down/Device ID instruction that provides both the
JEDEC assigned manufacturer ID and the specific device ID.

The REMS instruction is very similar to the Release from Power-down/Device ID instruction. The instruction is initi-
ated by driving the CS# pin low and shift the instruction code "90h" followed by two dummy bytes and one bytes
address (A7~A0). After which, the Manufacturer ID for MXIC (C2h) and the Device ID are shifted out on the falling
edge of SCLK with most significant bit (MSB) first as shown in figure 25. The Device ID values are listed in Table of
ID Definitions on page 16. If the one-byte address is initially set to 01h, then the device ID will be read first and then
followed by the Manufacturer ID. The Manufacturer and Device IDs can be read continuously, alternating from one
to the other. The instruction is completed by driving CS# high.

Table of ID Definitions:
manufacturer ID memory type memory density
RDID Command
C2 20 10
electronic ID
RES Command
05
manufacturer ID device ID
REMS Command
C2 05

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 MX25L512

POWER-ON STATE

The device is at below states when power-up:

- Standby mode ( please note it is not deep power-down mode)
- Write Enable Latch (WEL) bit is reset

The device must not be selected during power-up and power-down stage unless the VCC achieves below correct
level:
- VCC minimum at power-up stage and then after a delay of tVSL
- GND at power-down
Please note that a pull-up resistor on CS# may ensure a safe and proper power-up/down level.

An internal power-on reset (POR) circuit may protect the device from data corruption and inadvertent data change
during power up state.

For further protection on the device, if the VCC does not reach the VCC minimum level, the correct operation is not
guaranteed. The read, write, erase, and program command should be sent after the below time delay:
- tVSL after VCC reached VCC minimum level
The device can accept read command after VCC reached VCC minimum and a time delay of tVSL.
Please refer to the figure of "power-up timing".

Note:
- To stabilize the VCC level, the VCC rail decoupled by a suitable capacitor close to package pins is recommend-
ed.(generally around 0.1uF)

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 MX25L512

ELECTRICAL SPECIFICATIONS
ABSOLUTE MAXIMUM RATINGS
RATING VALUE
Industrial grade -40°C to 85°C
Ambient Operating Temperature
Commercial grade 0°C to 70°C
Storage Temperature -55°C to 125°C
Applied Input Voltage -0.5V to 4.6V
Applied Output Voltage -0.5V to 4.6V
VCC to Ground Potential -0.5V to 4.6V

NOTICE:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the
device. This is stress rating only and functional operational sections of this specification is not implied. Expo-
sure to absolute maximum rating conditions for extended period may affect reliability.
2. Specifications contained within the following tables are subject to change.
3. During voltage transitions, all pins may overshoot to 4.6V or -0.5V for period up to 20ns.
4. All input and output pins may overshoot to VCC+0.5V while VCC+0.5V is smaller than or equal to 4.6V.

Figure 3.Maximum Negative Overshoot Waveform Figure 4. Maximum Positive Overshoot Waveform

20ns
4.6V
0V

-0.5V 3.6V
20ns

CAPACITANCE TA = 25°C, f = 1.0 MHz

SYMBOL PARAMETER MIN. TYP MAX. UNIT CONDITIONS
CIN Input Capacitance 6 pF VIN = 0V
COUT Output Capacitance 8 pF VOUT = 0V

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 MX25L512

Figure 5. INPUT TEST WAVEFORMS AND MEASUREMENT LEVEL

Input timing referance level Output timing referance level

0.8VCC
0.7VCC AC
Measurement 0.5VCC
0.3VCC Level
0.2VCC

Note: Input pulse rise and fall time are <5ns

Figure 6. OUTPUT LOADING

DEVICE UNDER 2.7K ohm

TEST +3.3V

CL
6.2K ohm DIODES=IN3064
OR EQUIVALENT

CL=30pF Including jig capacitance

(CL=15pF Including jig capacitance for 70MHz)

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 MX25L512

Table 5. DC CHARACTERISTICS (Temperature = -40°C to 85°C for Industrial grade, Temperature = 0°C to
70°C for Commercial grade, VCC = 2.7V ~ 3.6V)
SYMBOL PARAMETER NOTES MIN. TYP. MAX. UNITS TEST CONDITIONS
VCC = VCC Max
ILI Input Load Current 1 ±2 uA
VIN = VCC or GND
VCC = VCC Max
ILO Output Leakage Current 1 ±2 uA
VIN = VCC or GND
VIN = VCC or GND
ISB1 VCC Standby Current 1 10 uA
CS#=VCC
Deep Power-down VIN = VCC or GND
ISB2 1 5 uA
Current CS#=VCC
f=85MHz
12 mA SCLK=0.1VCC/0.9VCC,
SO=Open
f=66MHz
ICC1 VCC Read 1 8 mA SCLK=0.1VCC/0.9VCC,
SO=Open
f=33MHz
4 mA SCLK=0.1VCC/0.9VCC,
SO=Open
VCC Program Current Program in Progress
ICC2 1 15 mA
(PP) CS#=VCC
VCC Write Status Program status register in
ICC3 Register (WRSR) 15 mA progress
Current CS#=VCC
VCC Sector Erase Erase in Progress
ICC4 1 15 mA
Current (SE) CS#=VCC
VCC Chip Erase Erase in Progress
ICC5 1 15 mA
Current (CE) CS#=VCC
VIL Input Low Voltage -0.5 0.3VCC V
VIH Input High Voltage 0.7VCC VCC+0.4 V
VOL Output Low Voltage 0.4 V IOL = 1.6mA
VOH Output High Voltage VCC-0.2 V IOH = -100uA
Notes :
1. Typical values at VCC = 3.3V, T = 25°C. These currents are valid for all product versions (package and speeds).
2. Typical value is calculated by simulation.

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 MX25L512

Table 6. AC CHARACTERISTICS (Temperature = -40°C to 85°C for Industrial grade, Temperature = 0°C to
70°C for Commercial grade, VCC = 2.7V ~ 3.6V)
Symbol Alt. Parameter Min. Typ. Max. Unit
85
Clock Frequency for the following instructions: MHz
(Condition:15pF)
fSCLK fC FAST_READ, PP, SE, BE, CE, DP, RES,RDP 1KHz
66 MHz
WREN, WRDI, RDID, RDSR, WRSR
(Condition:30pF)
fRSCLK fR Clock Frequency for READ instructions 1KHz 33 MHz
tCH(1) tCLH Clock High Time 5.5 ns
tCL(1) tCLL Clock Low Time 5.5 ns
tCLCH(2) Clock Rise Time (3) (peak to peak) 0.1 V/ns
tCHCL(2) Clock Fall Time (3) (peak to peak) 0.1 V/ns
tSLCH tCSS CS# Active Setup Time (relative to SCLK) 5 ns
tCHSL CS# Not Active Hold Time (relative to SCLK) 5 ns
tDVCH tDSU Data In Setup Time 2 ns
tCHDX tDH Data In Hold Time 5 ns
tCHSH CS# Active Hold Time (relative to SCLK) 5 ns
tSHCH CS# Not Active Setup Time (relative to SCLK) 5 ns
tSHSL tCSH CS# Deselect Time 100 ns
tSHQZ(2) tDIS Output Disable Time 6 ns
@33MHz 30pF 8 ns
tCLQV tV Clock Low to Output Valid @85MHz 15pF or
6 ns
@66MHz 30pF
tCLQX tHO Output Hold Time 0 ns
tHLCH HOLD# Setup Time (relative to SCLK) 5 ns
tCHHH HOLD# Hold Time (relative to SCLK) 5 ns
tHHCH HOLD Setup Time (relative to SCLK) 5 ns
tCHHL HOLD Hold Time (relative to SCLK) 5 ns
tHHQX(2) tLZ HOLD to Output Low-Z 6 ns
tHLQZ(2) tHZ HOLD# to Output High-Z 6 ns
tWHSL(4) Write Protect Setup Time 20 ns
tSHWL(4) Write Protect Hold Time 100 ns
tDP(2) CS# High to Deep Power-down Mode 3 us
CS# High to Standby Mode without Electronic Signature
tRES1(2) 3 us
Read
tRES2(2) CS# High to Standby Mode with Electronic Signature Read 1.8 us
tW Write Status Register Cycle Time 5 15 ms
tPP Page Program Cycle Time 1.4 5 ms
tSE Sector Erase Cycle Time 60 120 ms
tBE Block Erase Cycle Time 1 2 s
tCE Chip Erase Cycle Time 1 2 s
Note:
1. tCH + tCL must be greater than or equal to 1/ fC
2. Value guaranteed by characterization, not 100% tested in production.
3. Expressed as a slew-rate.
4. Only applicable as a constraint for a WRSR instruction when SRWD is set at 1.
5. Test condition is shown as Figure 3.

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 MX25L512

Table 7. Power-Up Timing

Symbol Parameter Min. Max. Unit
tVSL(1) VCC(min) to CS# low 10 us

Note: 1. The parameter is characterized only.

INITIAL DELIVERY STATE

The device is delivered with the memory array erased: all bits are set to 1 (each byte contains FFh). The Status
Register contains 00h (all Status Register bits are 0).

P/N: PM1214 REV. 1.6, FEB. 17, 2009

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 MX25L512

Figure 7. Serial Input Timing

tSHSL

CS#

tCHSL tSLCH tCHSH tSHCH

SCLK

tDVCH tCHCL

tCHDX tCLCH

SI MSB LSB

High-Z
SO

Figure 8. Output Timing

CS#
tCH

SCLK
tCLQV tCLQV tCL tSHQZ

tCLQX

SO LSB

tQLQH
tQHQL

SI ADDR.LSB IN

P/N: PM1214 REV. 1.6, FEB. 17, 2009

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 MX25L512

Figure 9. Hold Timing

CS#

tHLCH

tCHHL tHHCH
SCLK

tCHHH

tHLQZ tHHQX

SO

HOLD#

* SI is "don't care" during HOLD operation.

Figure 10. WP# Disable Setup and Hold Timing during WRSR when SRWD=1

WP#
tSHWL
tWHSL

CS#

0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
SCLK

SI 01

High-Z
SO

P/N: PM1214 REV. 1.6, FEB. 17, 2009

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 MX25L512

Figure 11. Write Enable (WREN) Sequence (Command 06)

CS#

0 1 2 3 4 5 6 7
SCLK

Command

SI 06

High-Z
SO

Figure 12. Write Disable (WRDI) Sequence (Command 04)

CS#

0 1 2 3 4 5 6 7
SCLK

Command

SI 04

High-Z
SO

Figure 13. Read Identification (RDID) Sequence (Command 9F)

CS#

0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 28 29 30 31
SCLK

Command

SI 9F

Manufacturer Identification Device Identification

High-Z
SO 7 6 5 3 2 1 0 15 14 13 3 2 1 0

MSB MSB

P/N: PM1214 REV. 1.6, FEB. 17, 2009

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 MX25L512

Figure 14. Read Status Register (RDSR) Sequence (Command 05)

CS#

0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
SCLK

command

SI 05

Status Register Out Status Register Out

High-Z
SO 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7

MSB MSB

Figure 15. Write Status Register (WRSR) Sequence (Command 01)

CS#

0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
SCLK

command Status
Register In

SI 01 7 6 5 4 3 2 1 0

High-Z MSB
SO

Figure 16. Read Data Bytes (READ) Sequence (Command 03)

CS#

0 1 2 3 4 5 6 7 8 9 10 28 29 30 31 32 33 34 35 36 37 38 39

SCLK

command 24-Bit Address

SI 03 23 22 21 3 2 1 0
MSB
Data Out 1 Data Out 2
High-Z
SO 7 6 5 4 3 2 1 0 7
MSB

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 MX25L512

Figure 17. Read at Higher Speed (FAST_READ) Sequence (Command 0B)

CS#

0 1 2 3 4 5 6 7 8 9 10 28 29 30 31
SCLK

Command 24 BIT ADDRESS

SI 0B 23 22 21 3 2 1 0

High-Z
SO

CS#
32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47

SCLK

Dummy Byte

SI 7 6 5 4 3 2 1 0

DATA OUT 1 DATA OUT 2

SO 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7

MSB MSB MSB

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 MX25L512

Figure 18. Page Program (PP) Sequence (Command 02)

CS#

0 1 2 3 4 5 6 7 8 9 10 28 29 30 31 32 33 34 35 36 37 38 39
SCLK

Command 24-Bit Address Data Byte 1

SI 02 23 22 21 3 2 1 0 7 6 5 4 3 2 1 0

MSB MSB

CS#

2072
2073
2074
2075
2076
2077
2078
2079
40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55

SCLK

Data Byte 2 Data Byte 3 Data Byte 256

SI 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0

MSB MSB MSB

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 MX25L512

Figure 19. Sector Erase (SE) Sequence (Command 20)

CS#

0 1 2 3 4 5 6 7 8 9 29 30 31
SCLK

Command 24 Bit Address

SI 20 7 6 2 1 0
MSB

Note: SE command is 20(hex).

Figure 20. Block Erase (BE) Sequence (Command 52 or D8)

CS#

0 1 2 3 4 5 6 7 8 9 29 30 31
SCLK

Command 24 Bit Address

SI 52 or D8 23 22 2 1 0
MSB

Note: BE command is 52 or D8(hex).

P/N: PM1214 REV. 1.6, FEB. 17, 2009

28
 MX25L512

Figure 21. Chip Erase (CE) Sequence (Command 60 or C7)

CS#

0 1 2 3 4 5 6 7
SCLK

Command

SI 60 or C7

Note: CE command is 60(hex) or C7(hex).

Figure 22. Deep Power-down (DP) Sequence (Command B9)

CS#

0 1 2 3 4 5 6 7 tDP

SCLK

Command

SI B9

Stand-by Mode Deep Power-down Mode

Figure 23. Release from Deep Power-down and Read Electronic Signature (RES) Sequence (Command AB)

CS#

0 1 2 3 4 5 6 7 8 9 10 28 29 30 31 32 33 34 35 36 37 38
SCLK

Command 3 Dummy Bytes tRES2

SI AB 23 22 21 3 2 1 0

MSB
Electronic Signature Out
High-Z
SO 7 6 5 4 3 2 1 0
MSB

Deep Power-down Mode Stand-by Mode

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 MX25L512

Figure 24. Release from Deep Power-down (RDP) Sequence (Command AB)

CS#

0 1 2 3 4 5 6 7 tRES1

SCLK

Command

SI AB

High-Z
SO

Deep Power-down Mode Stand-by Mode

Figure 25. Read Electronic Manufacturer & Device ID (REMS) Sequence (Command 90)

CS#

0 1 2 3 4 5 6 7 8 9 10
SCLK

Command 2 Dummy Bytes

SI 15 14 13 3 2 1 0
90

High-Z
SO

CS#
28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47

SCLK

ADD (1)

SI 7 6 5 4 3 2 1 0

Manufacturer ID Device ID

SO X 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7

MSB MSB MSB

Notes:
(1) ADD=00H will output the manufacturer's ID first and ADD=01H will output device ID first

P/N: PM1214 REV. 1.6, FEB. 17, 2009

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 MX25L512

Figure 26. Power-up Timing

VCC
VCC(max)

Chip Selection is Not Allowed

VCC(min)

tVSL Device is fully

accessible

time

P/N: PM1214 REV. 1.6, FEB. 17, 2009

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 MX25L512

RECOMMENDED OPERATING CONDITIONS

At Device Power-Up

AC timing illustrated in Figure A is recommended for the supply voltages and the control signals at device power-up.
If the timing in the figure is ignored, the device may not operate correctly.

VCC(min)
VCC
GND
tVR tSHSL

CS#
tCHSL tSLCH tCHSH tSHCH

SCLK
tDVCH tCHCL

tCHDX tCLCH

SI MSB IN LSB IN

High Impedance
SO

Figure A. AC Timing at Device Power-Up

Symbol Parameter Notes Min. Max. Unit

tVR VCC Rise Time 1 0.5 500000 us/V

Notes :
1. Sampled, not 100% tested.
2. For AC spec tCHSL, tSLCH, tDVCH, tCHDX, tSHSL, tCHSH, tSHCH, tCHCL, tCLCH in the figure, please refer to
"AC CHARACTERISTICS" table.

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 MX25L512

ERASE AND PROGRAMMING PERFORMANCE

PARAMETER Min. TYP. (1) Max. (2) UNIT
Write Status Register Cycle Time 5 15 ms
Sector erase Time 60 120 ms
Block erase Time 1 2 s
Chip Erase Time 1 2 s
Page Program Time 1.4 5 ms
Erase/Program Cycle 100,000 cycles
Note:
1. Typical program and erase time assumes the following conditions: 25°C, 3.3V, and checker board pattern.
2. Under worst conditions of 85°C and 2.7V.
3. System-level overhead is the time required to execute the first-bus-cycle sequence for the programming com-
mand.

LATCH-UP CHARACTERISTICS
MIN. MAX.
Input Voltage with respect to GND on ACC -1.0V 12.5V
Input Voltage with respect to GND on all power pins, SI, CS# -1.0V 2 VCCmax
Input Voltage with respect to GND on SO -1.0V VCC + 1.0V
Current -100mA +100mA
Includes all pins except VCC. Test conditions: VCC = 3.0V, one pin at a time.

P/N: PM1214 REV. 1.6, FEB. 17, 2009

33
 MX25L512

ORDERING INFORMATION
CLOCK OPERATING STANDBY CURRENT
PART NO. Temperature PACKAGE Remark
(MHz) CURRENT MAX. (mA) MAX. (uA)
8-SOP
MX25L512MC-12G 85 12 10 0~70°C Pb-free
(150mil)
8-SOP
MX25L512MI-12G 85 12 10 -40~85°C Pb-free
(150mil)
8-USON
MX25L512ZUI-12G 85 12 10 -40~85°C Pb-free
(2x3mm)

P/N: PM1214 REV. 1.6, FEB. 17, 2009

34
 MX25L512

PART NAME DESCRIPTION

MX 25 L 512 M I 12 G
OPTION:
G: Pb-free
blank: normal

SPEED:
12: 85MHz

TEMPERATURE RANGE:
I: Industrial (-40℃ to 85℃)
C: Commercial (0℃ to 70℃)

PACKAGE:
M: 150mil 8-SOP
ZU: 2x3mm 8-USON

DENSITY & MODE:

512: 512Kb

TYPE:
L: 3V

DEVICE:
25: Serial Flash

P/N: PM1214 REV. 1.6, FEB. 17, 2009

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 MX25L512

PACKAGE INFORMATION

P/N: PM1214 REV. 1.6, FEB. 17, 2009

36
 MX25L512

P/N: PM1214 REV. 1.6, FEB. 17, 2009

37
 MX25L512

REVISION HISTORY

Revision No. Description Page Date

1.0 1. Modified read current:6mA@85MHz/4mA@66MHz/2mA@33MHz P1,18,33 OCT/03/2005
→ 12mA@85MHz/8mA@66MHz/4mA@33MHz
2. Modified tSE:90ms(typ)/270ms(max)→60ms(typ)/120ms(max) ; P1,19,32
tBE:3s(max)→2s(max); tCE:3s(max)→2s(max)
3. Added description about Pb-free device is RoHS compliant P1
4. Removed "Advanced Information" title P1
5. Added C-grade part number P33
1.1 1. Format change All JUN/08/2006
2. Supplemented the footnote for tW of protect/unprotect bits P9
1.2 1. Added statement P38 NOV/06/2006
1.3 1. Defined min. clock frequency of fSCLK & fRSCLK as 1KHz P20 NOV/30/2006
1.4 1. Removed 8-land SON package and order information P2,3,34,35 MAR/24/2008
1.5 1. Removed wrong Block Protect bit: BP2 P5,11 AUG/12/2008
2. Removed non Pb-free EPN P34,35
1.6 1. Modified Figure 13, 14, 16, 17, 23 (waveform) P24,25,26,29 FEB/17/2009
2. Added 8-USON package P3,34,37
3. Removed "Low Vcc write inhibit" function P1,5,16,21,31
4. Changed tCH/tCL spec from 7/7(ns) to 5.5/5.5(ns) P20

P/N: PM1214 REV. 1.6, FEB. 17, 2009

38
 MX25L512

Macronix's products are not designed, manufactured, or intended for use for any high risk applications in which
the failure of a single component could cause death, personal injury, severe physical damage, or other substan-
tial harm to persons or property, such as life-support systems, high temperature automotive, medical, aircraft
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injuries or damages that may be incurred due to use of Macronix's products in the prohibited applications.

Copyright© Macronix International Co. Ltd. 2005~2009. All Rights Reserved. Macronix, MXIC, MXIC Logo, MX
Logo, are trademarks or registered trademarks of Macronix International Co., Ltd.. The names and brands
of other companies are for identification purposes only and may be claimed as the property of the respective
companies.

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39