PIC DEVELOPMENT BOARD WITH PROGRAMMER

A Thesis Submitted in Partial Fulfillment of the Requirements for the

award of the degree of

Bachelor of Science in Computer Engineering

By
Name: ID
1. TARIKU WORKINEH ETS 1035/08
2. MATHEWOS BUDUSA ETS 0735/08
3. PETROS TARIKU ETS 0923/08
4. BRIHANU TESHALE ETS 0242/08

Under the guidance of

Yonas Tesfaye (MSc)

ADDIS ABABA SCIENCE AND TECHNOLOGY UNIVERSITY

JAN 2020
 Examining Committee Approval Sheet

PIC Development Board with Programmer:

Tariku workineh (ETS1035/08) _________________________________

Mathewos Budusa (ETS0735/08) ________________________________

Petros Tariku (ETS0923/08) _________________________________

Brihanu Teshale (ETS0242/08) _________________________________

Approved by the examining committee members:

Name Academic Rank Signature Date

Advisor: ________________ ________________ ___________ ___________

Co-Advisor: ________________ ________________ ___________ ___________

Examiner: ________________ ________________ ___________ ___________

Examiner: ________________ ________________ ___________ ___________

Name Signature Date

DC Chairperson: ________________ ________________ ________________

Associate Dean for ________________ ________________ ________________

Under Graduate Programs:

i|Page
 ADDIS ABABA SCIENCE AND TECHNOLOGY UNIVERSITY
COLLEGE OF ELECTRICAL AND MECHANICAL ENGINEERING
DEPARTMENT OF COMPUTER ENGINEERING

Certificate

This is to certify that the thesis entitled “PIC Development board with programmer”
is submitted by TARIKU WORKINEH, MATHEWOS BUDUSA, PETROS
TARIKU, and BRIHANU TESHALE for the award of the degree of Bachelor of Science
in Computer Engineering, Addis Ababa Science and Technology University is a record of original
work carried out under my supervision and they fulfills the requirements of the regulations laid
down by the University and meets the accepted standards concerning originality and quality.

The results of the thesis have neither partially nor fully been submitted to any other University
or Institute for the award of any Degree or Diploma.

Name of Advisor: Yonas TESFAYE(MSc) Signature: __________

Head of Department: YONAS TESFAYE (MSc) Signature: ___________

ii | P a g e
 Declaration

We are students of Addis Ababa Science and Technology University (AASTU)

College of Electrical and Mechanical Engineering. The information found in this
project is our original work and all source of materials that are used for the project
are fully acknowledged.

Name ID Signature
Tariku Workineh ETS1035/08 _______________
Mathewos Budusa ETS0735/08 ________________
Petros Tariku ETS0923/08 ________________
Brihanu Teshale ETS0242/08 ________________

Date of Submission: ___________________

This project has been submitted for examination with our approval as university
advisor.

Name Signature Date

Mr. Yonas Tesfaye ____________ __________

iii | P a g e
 ACKNOWLEDGEMENT

First and foremost, we are extremely grateful to our almighty God for giving us the strength and
initiation to accomplish this undergraduate final project. Next, we would like to express our
deepest and sincere gratitude to our project advisor Mr. Yonas Tesfaye for his guidance,
encouragement, motivational thoughts, and support throughout the project. And also, we would
like to extend our gratitude to all staff members of the computer engineering department. Last,
but not least we want to thanks our parents for their encouragement, motivation, and support
throughout our study.

Project associates

1. Tariku Workineh

2. Mathewos Budusa

3. Petros Tariku

4. Birhanu Teshale

iv | P a g e
 ABSTRACT

Many researchers and project builders use pic and programmers separately. However, buying
separately costs a lot. So, to solve that problem we have developed a PIC development board
with an inbuilt pic kit programmer and training area of the board. The PIC development board is
flexible and cost-effective for the users. It gets power from PC via USB cable then LED shows
blink. Load Firmware uses to program the desired PIC microcontroller by the programmer then
puts the desired PIC on the socket and its programs by loading the .hex file. After that, we can
put the desired PIC microcontroller in the training area and do what we want. Finally, this project
solves the problem of dependency on the library inbuilt device like Arduino.

Keyword: Printed Circuit Board, PIC, DIP socket, microcontroller

v|Page
 List of Abbreviations
PIC Peripheral Interface Controller
PCB Printed circuit board
CAD Computer-aided design
18F 18 family
SMD Surface-mounted device
SMT Surface-mounted technology
WWII World war second
3D Three dimensions
USB Universal serial bus
DIP Dual inline packages
IC Integrated circuit
DMM Digital multimeter
DRC Design rule checker
PC Personal computer
C Capacitor
R Resistor
D Diode
L Inductor
Q Transistor
MCLR Master clear
VPP Peak-to-peak Voltage
DC Direct current
X Crystal oscillator
LED Light-emitting diode
PGD Program data
PGC Program clock
J Jumper
nF Nano-farad
uF Micro-farad
MHz Megahertz
SW Switch
BOM Bill of materials
IDE Integrated development environment
MPLab Mansfield Public Library Advisory Board
dsPIC Digital signal controller PIC
USART Universal Serial Asynchronous Receiver Transmitter
I2C Inter-Integrated Circuit
B Button

vi | P a g e
 List of Figures

Figure 1: PIC18f2550 …….............................................................................................................. 6

Figure 2: PIC18f4550………………............................................................................................. 7
Figure 3: USB type-B connector ................................................................................................... 7
Figure 4: crystal oscillator............................................................................................................. 8
Figure 5: 40 pin sockets………………......................................................................................... 9
Figure 6: 28 pin sockets………………......................................................................................... 9
Figure 7: Digital multimeter………….........................................................................................10
Figure 8: Soldering iron ...............................................................................................................10
Figure 9: Lead…………...............................................................................................................11
Figure 10: Block diagram…... .....................................................................................................12
Figure 11: Circuit diagram…………. ..........................................................................................14
Figure 12: PCB layout….……….…. ..........................................................................................16
Figure 13: Both front and back side 3D view …..........................................................................18

vii | P a g e
 List of Table

Table 1: USB cable wire type.........................................................................................................8

Table 2: Passive and active components ........................................................................................8

viii | P a g e
Table of Contents
CHAPTER ONE ..............................................................................................................................1
1.0.Introduction ..........................................................................................................................1
1.1. Background ..........................................................................................................................2
1.2.Statement of problem ...........................................................................................................3
1.3.Objective ...............................................................................................................................3
1.3.1. General objective ..........................................................................................................3
1.3.2. Specific objective .........................................................................................................3
1.4.Scope and limitation ..............................................................................................................4
1.4.1. Scope of project ............................................................................................................4
1.4.2. Limitation of the project ...............................................................................................4
CHAPTER TWO .............................................................................................................................5
2.0. Literature Review..........................................................................................................5
CHAPTER THREE .........................................................................................................................6
3.0. Materials & methodology .....................................................................................................6
3.1.Materials ..............................................................................................................................6
3.1.1. PIC18f2550 .................................................................................................................6
3.1.2. PIC18f4550 .................................................................................................................7
3.1.3. USB type-B connector ................................................................................................7
3.1.4. Crystal oscillator .........................................................................................................8
3.1.5. Other passive and active components .........................................................................8
3.1.6. 40 pin DIP narrow socket ...........................................................................................9
3.1.7. 28-pin DIP narrow socket ...........................................................................................9
3.1.8. Digital multimeter, soldering Iron, Lead ..................................................................10
3.2.Methodology ......................................................................................................................11
3.2.1. Block diagram ...........................................................................................................12
3.2.2. Software requirement ...............................................................................................13
CHAPTER Four .............................................................................................................................14
4.0.Result and discussion .........................................................................................................14
4.1.Discussion .........................................................................................................................14
4.1.1. Circuit diagram of PIC development board with programmer .................................14
4.1.2. Simulation PCB layout .............................................................................................16

ix | P a g e
 4.2.Result ...............................................................................................................................18
4.2.1. Result of PIC development board with programmer ...............................................18
4.2.2. Working principle .............................................................................................................. 19

CHAPTER Five .............................................................................................................................19

5.0. Recommendation ........................................................................................................................... 19
2.1. Conclusion .......................................................................................................................... 19
Reference ................................................................................................................................................... 20

Appendix .................................................................................................................................................... 21

x|Page
 CHAPTER ONE
1.0. INTRODUCTION

A Printed Circuit Board (PCB) is a rugged, copper and non-conductive substrate-based

structure to connect electrical components. The PCB is the backbone of electrical devices,
allowing the connection of passive components, active components, and embedded devices
together, into specific form factors to fit the design need. Connections between the components
are made through copper connections which become passageways for electrical signals.
It is mechanically supported and electrically connects electrical or electronic components using
conductive tracks, pads and other features etched from one or more sheet layers of copper
laminated onto and/or between sheet layers of a non-conductive substrate. Components are
generally soldered onto the PCB to both electrically connect and mechanically fasten them to it.
Printed circuit boards are used in all electronic products. It includes wire wrap and point-to-point
construction, both once popular but now rarely used. PCBs require additional design effort to lay
out the circuit, but manufacturing and assembly can be automated and manually. Specialized
CAD software is available to do much of the work of layout.
EasyEDA, Altium Designer, and EAGLE are some of them. Mass-producing circuits with PCBs
are cheaper and faster than with other wiring methods, as components are mounted and wired in
one operation.
PCBs can be single-sided (one copper layer), double-sided (two copper layers on both sides of
one substrate layer), or multi-layer (outer and inner layers of copper, alternating with layers of
the substrate). Multi-layer PCBs allow for much higher component density because circuit traces
on the inner layers would otherwise take up surface space between components. However, our
PIC development board with a programmer was designed by EasyEDA software. It is a two-
layer PCB.

1|Page
 1.1. Background

A printed circuit board, or PCB, is a self-contained module of interconnected electronic

components found in devices ranging from common beepers, pagers, and radios to sophisticated
radar and computer systems. The circuits are formed by a thin layer of conducting material
deposited, or “printed,” on the surface of an insulating board known as the substrate. Individual
electronic components are placed on the surface of the substrate and soldered to the
interconnecting circuits. Contact fingers along one or more edges of the substrate act as
connectors to other PCBs or external electrical devices such as on-off switches. A printed circuit
board may have circuits that perform a single function, such as a signal amplifier, or multiple
functions.
There are three major types of printed circuit board construction: single-sided, double-sided, and
multi-layered. Single-sided boards have the components on one side of the substrate. When the
number of components becomes too much for a single-sided board, a double-sided board may be
used. Electrical connections between the circuits on each side are made by drilling holes through
the substrate in appropriate locations and plating the inside of the holes with a conducting
material. The third type, a multi-layered board, has a substrate made up of layers of printed
circuits separated by layers of insulation. The components on the surface connect through plated
holes drilled down to the appropriate circuit layer. This greatly simplifies the circuit pattern.

Components on a printed circuit board are electrically connected to the circuits by two different
methods: the older “through-hole technology” and the newer “surface mount technology.” With
through-hole technology, each component has thin wires, or leads, which are pushed through
small holes in the substrate and soldered to connection pads in the circuits on the opposite side.
Gravity and friction between the leads and the sides of the holes keep the components in place
until they are soldered. With surface mount technology, stubby J-shaped or L-shaped legs on
each component contact the printed circuits directly. A solder paste consisting of glue, flux, and
solder is applied at the point of contact to hold the components in place until the solder is melted,
or “reflowed,” in an oven to make the final connection. Although surface mount technology
requires greater care in the placement of the components, it eliminates the time-consuming

2|Page
drilling process and the space-consuming connection pads inherent with through-hole
technology. Both technologies are used today.

Two other types of circuit assemblies are related to the printed circuit board. An integrated
circuit, sometimes called an IC or microchip, performs similar functions to a printed circuit
board except the IC contains many more circuits and components that are electrochemically
“grown” in place on the surface of a very small chip of silicon. A hybrid circuit, as the name
implies, looks like a printed circuit board, but contains some components that are grown onto the
surface of the substrate rather than being placed on the surface and soldered.[4]

1.2. Problem Statement

Many people are familiar with Arduino but not PIC microcontroller, PIC microcontroller is hard
to understand for the beginner rather than Arduino. And it is not available in the form of easy
and flexible for the researcher. Also buying PIC and programmer separately costs a lot. Also,
when the components are used separately, they may give errors and short circuits.

1.3. Objective
1.3.1. General objective

 To build a PIC development board with an inbuilt programmer that is flexible and cost-
effective for the users. It makes easy to interfaces other modules and to program
different PIC microcontroller.

1.3.2. Specific objective

 Easily interface with the module.

 Simple for beginner trainers.
 Easily program PIC microcontroller without making a circuit.

3|Page
 1.4. Scope and limitation of the project
1.4.1. Scope of the project

The scope of this project is to develop PIC 18F microcontroller training board with an inbuilt
programmer, that program different microcontroller and to build prototype easily. Moreover; this
project helps to design multipurpose educational machines in a different aspect.

1.4.2. Limitation of the project

 Our system can’t program greater than 40 pin PIC microcontrollers.

 The system can’t program SMD/SMT PIC microcontroller.
 The system can take the only 5V from another system, but can’t connect directly with
220v.
 Our system can’t store power.

4|Page
 CHAPTER TWO

2.0. Literature Review

The first printed circuit boards (PCBs) can be traced all the back to the early 1900s and a patent
for the path directly on an insulated surface. It was a revolutionary idea because it could
eliminate complex wiring and provide consistent results. Still, they didn’t catch on until after
WWII, when Dr. Paul Eisler in Austria began making the first real operational printed circuit
boards in 1943. The early PCB material could be almost anything, from Bakelite and Masonite to
plain old thin pieces of wood. Holes could be drilled into the material and flat brass wires would
be riveted onto it. It may not have been pretty, but the concept was there, and it worked. It was
often used in radios and gramophones at the time. In 1947, the first double-sided PCBs with
plated through holes were produced. In 1950, the types of materials used for the board were
shifting to different resins and other materials, but they could still only be printed on a single
side. The wiring would be printed on one side and the electrical components would be on the
other. Still, it was a much more efficient option than bulky wiring, so it was starting to see wider
adoption. One of the biggest steps forward came in 1956 when the U.S. Patent Office granted a
patent to a small group of users to create a printing plate for an offset printing press. This is
what was used to print the wire in acid-resistant production. [5]

5|Page
 CHAPTER THREE
3.0. Material and methodology
Methods
The following methods are needed to accomplish our project.
 Detailed system requirements both on the hardware system and software.
 Detail study about the circuit and electric components
 Designing the circuit and the PCB layout as well as a 3D view.
 Generating the Gerber file.
 Fabrication of PCB and test it.
 Installing firmware file(bootloader)
 Test the functionality of the PCB board

3.1. Materials
3.1.1. PIC18f2550

Fig 1: PIC18f2550

PIC18F2550 is a High-Performance, Enhanced flash, USB Microcontroller with Nano-Watt-

Technology. This is an 8-bit microcontroller popular among makers and engineers due to its
features and low cost. PIC18F2550 comes in various packages like DIP and can be selected
according to the project requirement. It is a 28-pin microcontroller. All its feature found under
the link:[1]
Why did we use it? To program other PIC.

6|Page
 3.1.2. PIC18F4550

Fig 2: PIC18f4550

It is one of the popular Microcontrollers from the microchip technology, comes with a High-
Performance, Enhanced flash, USB Microcontroller with nano-Watt-Technology. This is an
8-bit microcontroller popular among makers and engineers due to its features and easy
applications. PIC18F4550 comes in various packages like DIP and can be selected according
to the project requirement. It is a 40 pin microcontroller. All its feature found under the
link:[2]

Why did we use it? To make exercise and interface with the external module.

3.1.3. USB type-B connector

Fig 3: USB type-B connector

USB Type B connectors officially referred to as Standard-B connectors, are square with either a
slight rounding or large square protrusion on the top, depending on the USB version. It is easy to
sell on the PCB board. It has four pins

7|Page
 Pin Name Wire Color Description
1 Vbus Red/orange +5V
2 D- White/gold Data-
3 D+ green Data+
4 GND Black/blue Ground

Table 1: USB cable type.

3.1.4. Crystal oscillator

Fig 4: crystal oscillator

Crystal Oscillators have two leads, there is no polarity for crystals and hence can be connected in
both directions. It will create an electrical signal with a given frequency & external clock to the
system or PIC microcontroller. All feature of the crystal oscillator found under the link: [3]

3.1.5. Other passive and active components

We use many passive and active components to design this PCB board. Some of them are listed
below
Resistor Transistor
Diode Ceramic Capacitor
Electrolytic capacitor Inductor
Jumper Sockets
Switch

Table 2: passive and active components

8|Page
Why we use active and passive components?

Even though they need an external source for their operation, active components supply the
energy to the circuit, whereas the passive components are can only receive energy. Active
components can control the flow of current, but the passive components cannot control the flow
of the current. The passive component doesn’t need an external source for its operation.

3.1.6. 40-pin DIP socket

Fig 5: 40-pin socket

Dual in package (DIP) is an electronic component package with a rectangular housing and two
parallel rows of electrical connecting pins. The package may be through-hole mounted to
a printed circuit board (PCB) or inserted in a socket. And hold programmed PIC or IC.

Why did we use it? It holds 40-pin PIC18f4550 on the board and controls the pin damage.

3.1.7. 28-pin DIP socket

Fig 6: 28 pin sockets

It is the same as a 40-pin DIP socket, but it holds 28-PIC18f2550.

Why did we use it? To hold PIC18f2550 on the board and control pin damage.

9|Page
 3.1.8. Multimeter, soldering iron, lead

Fig 7: Digital multimeter

A digital multimeter (DMM) is one of the most useful items of test equipment to diagnose
electrical or electronic problems. It’s a measuring device that takes analog information and uses
an analog to digital converter to convert it into a digital signal which reads out on the display.

Why did we use it? To measure the voltage, current and, resistance, and other electrical
components. To test and troubleshoot the circuit and PCB.

Soldering iron:

Fig 8: soldering iron

A soldering iron is a hand tool used in soldering. It supplies heat to melt solder so that it can flow
into the joint between two workpieces. A soldering iron is composed of a heated metal tip and an
insulated handle. Heating is often achieved electrically, bypassing an electric current through a
resistive heating element.

Why did we use it? To sign up for the two objects collectively so they can be a part of together
permanently with the solder.

10 | P a g e
Lead:

Fig 9: lead
Lead is a fusible metal alloy used to create a permanent bond between metal workpieces. Lead is
melted to adhere to and connect the pieces after cooling, which requires that an alloy suitable for
use as solder has a lower melting point than the pieces being joined.

Why did we use it? To attach components onto the circuit boards.

11 | P a g e
 3.2. Methodology
3.2.1. Block diagram

The overall system design is as shown in Fig below.

Fig 10: Block diagram

Programmer PIC connects with PC via USB cable. After checking the successfully connected,
prepare code to program another IC and put IC on the socket. If it is successfully connected click
on the red button in the software and view the IC name. Then load a prepared program to the PIC
or IC. Release PIC from the socket and put it on the training socket.

12 | P a g e
 3.3. Software requirement

EasyEDA: is a web-based EDA tool suite that enables hardware engineers to

design, simulate, share - publicly and privately - and discuss schematics, simulations, and printed
circuit boards. Other features include the creation of a bill of materials, Gerber files, and pick
and place files and documentary outputs in PDF, PNG, and SVG formats. EasyEDA allows the
creation and editing of schematic diagrams, SPICE simulation of mixed analog and digital
circuits, and the creation and editing of printed circuit boards.

MPLab IDE and Pickit2

MPLAB is a proprietary freeware integrated development environment for the development of

embedded applications on PIC and dsPIC microcontrollers and is developed by Microchip
Technology. We used it to test training PIC. Pickit2, to test the connection and load firmware.

13 | P a g e
 CHAPTER FOUR

4.0. Result and discussion

4.1. Discussion

4.1.1. Circuit diagram PIC development board with programmer

Fig 11: circuit diagram

Circuit explanation:

All circuits are made based on the PIC18f PIC microcontroller datasheet.
During all stages of the layout, keep the design error-free by using the design rule
checker (DRC) that found under EasyEDA. Design rule checking should cover package-to-

14 | P a g e
package spacing, unconnected nets, shorted nets, air-gap violations if vias are too close to solder
pads if vias are too close to each other, and vertical clearance violations.

Firstly, we would like to explain the programmer PIC part of the circuit.

A programmer is a USB-powered device, that is it gets power from a PC USB +5V power
supply. USB microcontroller PIC18F2550 is the breath of the programmer. The USB Data+ and
Data- from the PC are connected to the D+ and D- pins of the PIC182550. The built-in-clock
generator of PIC uses external crystal oscillator X1, C2, and C3 to ensure the correct system
clock rate. The inductor L1, transistor Q3, diode D1, capacitors C6, and C8 form a DC-
DC converter (Buck Converter) which converts 5V from PC to 12V, which to be applied to the
MCLR/VPP pin of a microcontroller at the time of programming. This is controlled by the PIC
firmware.
The resistors R12 and R18 forms a voltage sensing feedback network, which is given to the
analog pin AN0 of the PIC. Transistor Q4, Q1, R15 & R20 are used for switching Vpp to
MCLR/Vpp output. The Vdd sensing feedback is given to the analog pin AN1 of the PIC via
resistor R4. The LED3 with current limiting resistor R6 is controlled by the PIC firmware,
normally glows during reading and write operations indicating busy states. The LED2 with
current limiting resistor R5 indicates that the circuit is powered from USB. The transistor Q2 and
resistor R3 are for switching Vdd to output whenever required. LED1 along with current limiting
resistor R7 indicates that Vdd is switched to output. The resistors R4, R8, and R17 are current
limiting resistors in series with output lines PGD, PGC. B1 Button with current limiting resistors
R9 uses to reset the system. There are 6 jumper wire: J1, J2, J3, J4, J5 & J6. We use one of them
during the programming based on the programmed PIC. They are connected to the socket. socket
hold PIC during the programming. Lock J1when we program 40 pin PICs. The rest are for other
IC, like 28 pins, 24 pins, 16 pins, 8 pins.
Secondly, we explain the training PIC part

The PIC18F4550 will be ‘bus-powered’; this means that the device will draw its power from the
USB host (our PC) so no power regulation is required. The 470nF capacitor (C13) is required so
the PIC can operate the internal USB circuitry (it helps with regulating the USB voltages
required by the on-board USB interface in the PIC). X2, C54, and C15 are generated and correct
system clock. C13 can be any value between 220nF and 470nF but the datasheet recommends us

15 | P a g e
220nF. However, we had 470nF available, it doesn’t make any error to the functioning of the
circuit. We use an 8MHz external oscillator with two 22pF ceramic capacitors to generate the
system clock. B2 is the reset button & C10, R21 are reduced noise for a button. SW1 is a power
switch for the training PIC.

4.1.2. Simulation of PCB layout

Fig 12: PCB layout

PCB layout documentation:

Both components footprint and connection arrangement were done under this step.
The PCB’s documents should include all information about PCB like; hardware dimensional
drawings, schematic, BOM (bill of materials), layout file, component placement file, assembly
drawings and instructions, and Gerber file set. The Gerber file set is PCB jargon for the output
files of the layout that are used by PCB manufacturers to create the PCB. A complete set of
Gerber files includes output files generated from the board layout file:
• Silkscreen top and bottom
• Solder mask top and bottom
• All metal layers

16 | P a g e
• Paste mask top and bottom
• Component map (X-Y coordinates)
• Assembly drawing top and bottom
• Drill file
• Drill legend
• Netlist file
Feature of our PIC development board with programmer
 Layer: 2
 Length: 117 mm
 Width: 77 mm
 Pad Diameter:1.35mm
 Vias: 0.75mm
 We use both Thru-hole and SMD/SMT to reduce the component density on the board.
Pad: a small surface of copper where the component will be soldered to the board.
Via: a plated hole that allows the current to pass thru the board.
Track (trace): conductive path connecting 2 points (pads, vias)
Solder mask: a layer of insulating lacquer covering both surfaces of the board to prevent the
solder from short circuit two tracks from different nets.
Silkscreen (overlay): letters printed on the final board.
Footprint: Is refers to the actual physical size of a given component.

Simple step to use PIC development board with programmer

Step 1: Connect PC with PIC programmer via USB cable.

Step2: Install the needed software and driver
Step 3: Load firmware file and USB driver to the programmer.
Step 4: Put PIC on the DIP socket and lock it
Step 5: load the .hex file
Step 6: Release PIC from the DIP socket and put it on the training place
Step 7: design the circuit as someone wants.
Step 8: start train

17 | P a g e
 4.2. Result

4.2.1 Result of PIC development board with programmer

Fig 13: both front and back side 3D view

18 | P a g e
 4.3. Work principle

As with other electronics, our PCB development board needs power, so we will give power from
PC via USB cable after that the power is LED shows blink. Then Load Firmware to the
programmer to program the desired PIC microcontroller after that put the desired PIC on the
holder socket and program it by loading the .hex file. Finally, put the desired PIC microcontroller
in the training area and do what you want.

CHAPTER FIVE

5.1. Recommendation

This work could be improved by increasing some features like LCD holder, power adapter, and
battery holder. If someone adds these features, our project may be more important for users. We
provided to, anyone those who add other new feature and that makes more functional for users.

5.2. Conclusion

The main of this project is to build a PIC development board with an inbuilt programmer. This
PIC development board is a 2-layer PCB board that has three parts: -the first part contains the
programmer part; the second part contains the programming part of the desired microcontroller
and the last part contains the training area. We develop this PIC development board to overcome
the dependence of students on the inbuilt library devices like Arduino. We have solved the problem
of microcontroller users by developing a board that contains a PIC kit programmer and a training
area on it. This board reduces the complexity of the circuit.

19 | P a g e
 REFERENCE

[1] https://components101.com/microcontrollers/pic18f2550-pin-diagram-features-
datasheet

[2] https://components101.com/microcontrollers/pic18f4550-pin-diagram-features-
datasheet

[3] https://components101.com/misc/crystal-oscillator
[4] David Souza. “printed circuit board.” Internet: www.prototypepcb.com/the-
background-of-printed-circuit-boards/, January 24th, 2011[Feb 2020]
[5] DZone. “An Overview of Printed Circuit Boards.” Internet:
www.dzone.com/articles/advances-in-printed-circuit-boards, Dec. 06, 16[Feb
2020]

20 | P a g e
 APPENDIX

Burner hex file

Gerber file

21 | P a g e