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Technical Service Data Sheet

ECT CUPRATECH AC 382

HIGH PERFORMANCE ACID COPPER PLATING PROCESS

1.Properties
High performance Copper brightener additive system
Imparts highest degree of brightness, levelling and coverage.
Has very good pinkish bright appearance.
Suitable for Rack processes only.
Operates at wide current density range

2.Application
BATH MAKE UP

CHEMICALS CONCENTRATION RANGE OPTIMUM

COPPER SULPHATE PURE 175-250 g/l 200 g/l
SULPHURIC ACID CP GRADE 25-35 ml/l 30 ml/l
CHLORIDE ION 100-130 ppm 120 ppm
ECT CUPRATECH AC 382 4.0-6.0 ml/l 5.0 ml/l
ECT CUPRATECH AC 383 0.3 – 0.5 ml/l 0.4 ml/l

OPERATING CONDITION :

Temperature : 20-320C
Cathode Current density : 2.0-6.0 A/dm2
Anode Current density : 1.0-3.0 A/dm2
Agitation : Vigorous and uniform Low pressure air.
Anodes : Phosporized Copper
Anode Bag : Polypropylene
Rate of Deposition at 4.5 A/dm2 : 1.0 Micron / minute

Tank material: Rubber lined steel, Polyethylene lined fibre glass or polypropylene.

BATH MAKE UP
Fill the treatment tank two third full of water, preferable deionized water and heat to 60C.
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NOTE: In case of normal supply of water is used, the chloride content should be analysed
and then to be used. In case the water contains high chloride, the use of deionized water is
recommended.
1. Dissolve required amount of copper sulphate in hot water with continuous agitation.
2. To the solution, add 2.0 g/l activated carbon (approved quality) and stir well and allow to
settle for overnight.
3. Carefully filter the treated solution into the plating tank.
4. Add the measured quantity of concentrated sulphuric acid, agitate to mix well and add
more water to make up the final level.
5. Add the required amount of AR grade Hydrochloric acid and mix well. Normally 265 ml
AR HCL (35- 37%) is required for 1000 litre of copper solution prepared from deionized
water to provide a chloride concentration of 120 ppm. If other than deionized water is
used, the amount of chloride ion present in the water must be subtracted from the
120ppm. Value and addition of hydrochloric acid is to be adjusted to obtain optimum
value of chloride.
6. Cool the solution to operating temperature and add the required quantity of ECT
CUPRATECH AC 382 and ECT CUPRATECH AC 383. Then mix the solution well by
employing air agitation.

FUNCTION OF SOLUTION COMPONENTS

COPPER SULPHATE
Copper sulphate is the source of metal which is plated out on the work. It is important that
the concentration of copper sulphate be maintained within the recommended limits. Low
concentration will result in burning of the deposit at high current density areas, whereas high
concentration will result in crystallisation of copper sulphate from the solution which will
tend to plug air agitation coils and possibly coat the anodes resulting in anode polarisation
and also reduces low current density brightness range.

SULPHURIC ACID
The principal function of Sulphuric acid is to increase the solution conductivity, which
produces the desired current density with minimum voltage. Excessive sulphuric acid
concentration will reduce the limiting current and also reduce the levelling ability of the
process.

CHLORIDE ION
The careful control of the concentration of the chloride ions in bright acid copper plating
solution is of paramount importance. Low chloride concentrations (less than 20 PPM.) will
result in deposits with poor brightness, and the deposit becomes striated and the tendency
towards “treeing” is increased whereas high chloride concentration will decrease levelling
and reduce low current density brightness and increase the consumption of addition agents.

ECT CUPRATECH AC 382

ECT CUPRATECH AC 382 is used for initial make-up and for maintenance purpose. ECT
Cupratech AC 382 along with Cupratech AC 383 will give uniform bright results. To
maintain consistent results Cupratech AC 382 is to be regularly added, preferably on 1000
ampere hours basis. Lower additions of Cupratech AC 382 will lead to hazy bright deposits at
high and medium current densities and excess addition will produce dull deposit at low
current densities.
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ECT CUPRATECH AC 383

Cupratech AC 383 is basically does the function of leveler and this is to be added during
initial make up and for further maintenance purpose. Lower dosages of Cupratech AC 383
reduces the levelling effect over the entire current density range and excess dosages of
Cupratech AC 383 will reduce the brightness at low current density region. It is always
better to start with low concentration of Cupratech AC 383 and on make up slowly increase
the addition to the optimum value.

ECT CUPRATECH AC 384

A special additive used to further improve the leveling of the acid copper bath. Only added in
small quantities of 0.01 ml/l.

ECT CUPRATECH AC 385

Cupratech AC 385 can be used as a low C.D. extender.

ECT CUPRATECH AC 386 (Antipitting agent)

Cupratech AC 386 can be added at 0.5 - 1.0 ml/l whenever pitting problem arises.

REPLENISHMENT

ECT CUPRATECH AC 382 : 50 - 75 ml/1000 Ampere hours.

ECT CUPRATECH AC 383 : 75-100 ml/1000 Ampere hours.

NOTES ON OPERATING CONDITIONS

It is essential that the Chloride content be analysed weekly and adjusted it to optimum level.
The copper sulphate and sulphuric acid should be checked and adjusted on weekly basis.
Laboratory plating tests can be carried out in an air agitated Hull Cell. It is recommended
that the panels be made of the same metal being plated and have the same surface finish.
With experience the brighteners can be controlled by these tests.
Copper Sulphate should be added to the solution through anode bag or through a filter.
Sulphuric acid may be added directly to the plating solution. brighteners should be added on
the basis of ampere hours of operation. Small frequent additions, are preferred.
The temperature should be held reasonably close to 25°C. The low current density areas are
brightened, but below 20°C. the tendency to burn is increased. At temperature about 35°C.
the low current density areas have a tendency to become hazy. This may be overcome
partially by increasing the feed rate of the Cupratech AC 383.

PURIFICATION TREATMENTS
With normal use of Cupratech bright acid copper plating process, oxidation and/or batch
carbon treatments are seldom required. When an oxidation and/or batch carbon treatment
becomes necessary in case of drag-in of impurities, the plating solution be pumped into a
treatment tank and treat the solution with activated carbon.

EQUIPMENT
Acid copper solution are highly corrosive and precautions should be taken to protect outside
tank walls and bottoms, floors and any other equipment that may come in contact with the
solution. Several coats of acid resistant paint will provide the necessary protection.

TANKS
Plating tanks should be rubber lined steel, Polyethylene lined fibre glass or polypropylene.
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New tank lining should be leached with 3-5% sulphuric acid at 50-60°C. Tanks should have
sufficient free board height (6 inches) to contain any spray mist generated by air agitation.
Exhaust ventilation is recommended to remove the spray mist.
AGITATION
Solution for Cupratech should be air agitated. Polypropylene or PVC are recommended for
the air lines. The agitation pipes should be accurately located midway between the cathode
and anode bars and fixed in suitable manner so that no drifting occurs. Air holes should be
directed at a 45° angle towards the bottom of the tank. Air holes should be 2 cm apart and 3
mm in diameter. This ensures even distribution of air and allows the agitation pipes to drain
when the plating solution is emptied. A clearance of 15 cm. should be maintained between
the bottom of the rack and the top of the air agitation pipes. Low pressure air, not
compressed air, should be used and the air should pass through a filter before entering the
solution.

FILTRATION
Continuous filtration is strongly recommended. However continuous filtration through
activated carbon is not recommended, as this will remove brighteners. The pump and filter
should have sufficient capacity to turn over the solution at least twice every hour. Because of
the highly corrosive nature of the solution, all surfaces of the filter pump connections and
parts that come in contact with the solution must be acid resistant. Plastic and hard rubber
are recommended for pumps. PVC, rubber, ebonite or Polypropylene is recommended for
filter chamber and polypropylene is recommended for filter disc.

RACKS
Plating racks must be coated with materials that will not contaminate the plating solution.
Usually the type of rack coating used for bright nickel solution is satisfactory.

ANODE
Phosphorized copper anodes with a minimum of 0.03 percent phosphorous should be used in
cupratech solution. Other anodes may cause excessive brightener consumption poor
levelling and roughness. The anode area should be twice the cathode area. Anode bags
should be used and they should be of polypropylene or Terylene. It is recommended that
anode bags be rinsed thoroughly and leached in a 5% by volume sulphuric acid solution
before using. The bags should then be thoroughly rinsed in clear water before introducing to
the plating tank. If anode baskets are used, they should be made of titanium.
COOLING
It is recommended that the solution be operated at 25-30 degree.C. Loss of brightness and
levelling occurs at temperatures above 35 Degree.C. Teflon, titanium or lead cooling coils or
exchangers are recommended to cool the solution, if necessary.

4. Analytical Control & Maintenance

Analysis by Titration

1. Copper Sulphate

Reagents Needed
1. Ammonium Hydroxide
2. Glacial Acetic acid
3. Potassium Iodide
4. Starch Indicator solution 5 g/l
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5. Sodium Thiosulphate 0.1 N

Procedure:
1. Pipette 5 ml of the plating solution into a 500 ml Erlenmeyer flask.
2. Add about 20 ml distilled water.
3. Add ammonium hydroxide by drops until a deep blue colour develops.
4. Dilute to 150-250 ml with distilled water.
5. Add 10 ml glacial acetic acid and 3-4 gms of potassium iodide.
6. Titrate with 0.1 N sodium thiosulphate solution using starch indicator.

Calculation:
ml of 0.1 N Sodium Thiosulpahte x 5.0 = g/l of Copper Sulphate

2. Sulphuric Acid

Reagents required :
1. Methyl Orange
2. 0.1N NaOH

Procedure :
1.Pipette 10 ml of the solution into 250 ml conical flask and dilute it with 100 ml D.M water.
2.Add about 3-4 drops Methyl Orange indicator.
3.Titrate against 0.1 N NaOH until yellow colour develops.

Calculation:
ml of 0.1 N NaOH x 4.9 = g/l of Sulphuric Acid

3. Chloride content

Reagents required :
1.50% Nitric Acid
2. 0.01 N Mercuric Nitrate
3.0.1 N Silver Nitrate

Procedure :
1 Pipette 50 ml of Cupratech 382 operating solution into a 250 ml conical flask.
2. Add 40 ml. of distilled water and 10 ml of 50 % Nitric Acid solution.
3. Add sufficient 0.1 N Silver Nitrate Solution to produce turbidity (usually 4-5 drops).
4. Immediately titrate with 0.01 N Mercuric Nitrate Solution by dropwise additions with
stirring until turbidity clears.

Calculation
ml of Mercuric Nitrate x 7.09 = mg/l of Chloride (PPM of chloride.)

5. Disclaimer
All data given in this information sheet are based on normal operating conditions and have
been prepared according to the best of our knowledge. We guarantee our products to be of
uniform quality. We can accept no responsibility for their use under conditions beyond our
control.

For further information please contact: [email protected]