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GANGES TECHNOLOGY

Ferrite Chip Bead

For High Current
Applications

HCB Series
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High Current Chip Bead HCB/HPB Series

1. Features
HCB/HPB□□□□-series for Large Current Application
The HCB/HPB series can be used in high current circuits due to its low DC resistance. It can match power lines to
maximum of 6A DC.

2. Dimension

D Chip size
Size A(mm) B(mm) C(mm) D(mm)
1608 1.6±0.15 0.80±0.15 0.80±0.15 0.30±0.2

2012 2.0±0.20 1.25±0.20 0.85±0.20 0.50±0.3

A
3216 3.2±0.20 1.60±0.20 1.10±0.20 0.50±0.3

3225 3.2±0.20 2.50±0.20 1.30±0.20 0.50±0.3

C

4516 4.5±0.20 1.60±0.20 1.60±0.20 0.50±0.3

B 4532 4.5±0.20 3.20±0.20 1.50±0.20 0.50±0.3

5750 5.7±0.2 5.0±0.3 1.8±0.2 0.5±0.3

3. Part Numbering

HCB 3216 K - 301 T 10

A B C D E F

A: Series
B: Dimension LxW
C: Material
D: Impedance 301=300Ω , 300=30Ω
E: Packaging T=Taping and Reel , B=Bulk(Bags)
F: Rated Current 10=1000mA=1A

4.Specification
Customer YOSONIC Impedance Test Frequency Rated Current DCR
Reference
Part Number Part Number (Ohm) (MHz) (mA) max. (Ohm) max.

HCB1608K-300T30 30±25% 100 3000 0.04

HCB1608K-800T30 80±25% 100 3000 0.04

HCB1608K-121T20 120±25% 100 2000 0.10

HCB1608K-151T20 150±25% 100 2000 0.10

HCB1608K-221T20 220±25% 100 2000 0.10

HCB1608K-301T10 300±25% 100 1000 0.20

For Large Current
HCB1608K-471T10 470±25% 100 1000 0.20

HCB1608K-601T10 600±25% 100 1000 0.20

HCB2012K-300T30 30±25% 100 3000 0.04

HCB2012K-800T30 80±25% 100 3000 0.04

HCB2012K-121T20 120±25% 100 2000 0.10

HCB2012K-151T20 150±25% 100 2000 0.10

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Customer YOSONIC Impedance Test Frequency Rated Current DCR

Reference
Part Number Part Number (Ohm) (MHz) (mA) max. (Ohm) max.

HCB2012K-221T20 220±25% 100 2000 0.10

HCB2012K-301T10 300±25% 100 1000 0.20

HCB2012K-471T10 470±25% 100 1000 0.20

HCB2012K-601T10 600±25% 100 1000 0.20

HPB2012Z-300T50 30±25% 100 5000 0.01

HPB2012Z-101T40 100±25% 100 4000 0.02

HPB2012Z-221T30 220±25% 100 3000 0.04

HPB2012Z-331T25 330±25% 100 2500 0.05

HPB2012Z-471T20 470±25% 100 2000 0.08

HPB2012Z-601T15 600±25% 100 1500 0.10

HCB3216K-300T30 30 ±25% 100 3000 0.04

HCB3216K-500T30 50 ±25% 100 3000 0.04

HCB3216K-800T30 80 ±25% 100 3000 0.04

HCB3216K-121T20 120 ±25% 100 2000 0.10

HCB3216K-151T20 150 ±25% 100 2000 0.10

HCB3216K-301T10 300 ±25% 100 1000 0.20

HCB3216K-471T10 470 ±25% 100 1000 0.20

HCB3216K-501T30 500 ±25% 100 3000 0.04

For Large Current
HCB3216K-601T20 600 ±25% 100 2000 0.10

HCB3225K-600T40 60 ±25% 100 4000 0.03

HCB3225K-900T20 90 ±25% 100 2000 0.10

HCB3225K-151T50 150 ±25% 100 5000 0.02

HCB3225K-201T40 200 ±25% 100 4000 0.03

HCB4516K-600T60 60 ±25% 100 6000 0.01

HCB4516K-800T30 80 ±25% 100 3000 0.04

HCB4516C-102T15 1000 ±25% 100 1500 0.15

HCB4532K-800T60 80 ±25% 100 6000 0.01

HCB4532K-131T30 130 ±25% 100 3000 0.04

HCB4532K-151T50 150 ±25% 100 5000 0.02

HCB4532H-681T40 680±25% 100 4000 0.03

HCB4532H-132T30 1300 ±25% 60 3000 0.06

HCB4532M-132T30 1300 ±25% 100 3000 0.06

HCB5750V-101T60 100 ±25% 100 6000 0.01

HCB5750V-151T30 150 ±25% 100 3000 0.04

HCB5750V-181T30 180 ±25% 100 3000 0.04

HCB5750H-601T30 600 ±25% 100 3000 0.04

5. Reliability and Test Condition

Item Performance Test Condition

Operating Temperature -55~+125℃

Storage temperature and -55~+125℃

humidity range 70%RH (max)

Impedance HP4291A, HP4287A+16092A

Refer to standard electrical characteristics list
DC Resistance HP4338B

Rated Current 1000~6000mA (HCB), 1500~5000mA (HPB) P3.

Item Performance Test Condition

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1. Applied the allowed DC current.
Temperature Rise Test 30℃ max. (Δt) 2. Temperature measured by digital surface
thermometer.

Preheating Dipping Natural cooling

Preheat:150℃,60sec.
260°C
Solder : H63A
Appearance: No significant abnormality. Solder tamperature:260±5℃
Solder heat Resistance
150°C
Impedance change: Within ± 30%. Flux: rosin
second second
Dip time:10±0.5sec.

Preheating Dipping Natural cooling

Preheat:150℃,60sec.
230°C Solder : H63A
More than 90% of the terminal
Solder tamperature:230±5℃
Solderability electrode should be covered with
150°C Flux: rosin
solder.
second second
Dip time:4±1sec.

For HCB HPB:

Size Force (Kfg) Time(sec)
1608 0.5
2012 0.6
The terminal electrode and the dielectric must 3216 1.0 >25
W 3225 1.0
Terminal strength not be damaged by the forces applied on the
4516 1.0
right conditions.
4532 1.5
5750 2.0

20(.787)

The terminal electrode and the dielectric must Bending

Solder a chip on a test substrate, bend the
Flexture strength not be damaged by the forces applied on the 45(1.772) 45(1.772)
substrate by 2mm (0.079in)and return.
right conditions. 40(1.575)

100(3.937)

Series name mm(inches) P-Kgf

1608 0.80(0.033) 0.3

The ferrite should not be damaged by R 0.5(0.02)
Bending Strength Forces applied on the right condition. 2012 0.14(0.055) 1.0
3216
2.00(0.079) 2.5
3225
A 4516
2.70(0.106) 2.5
4532

Temperature:125±5℃.
Applied current:rated current.
Loading at High Appearance: no damage.
Duration:500±12hrs.
Temperature Impedance: within±30%of initial value.
Measured at room temperature after placing
for 2 to 3hrs.

Humidity:90~95%RH.
Temperature:40±2℃.
Loading under Damp Appearance: no damage. Applied current: rated current.
Heat Impedance: within±30%of initial value. Duration:500±12hrs.
Measured at room temperature after placing
for 2 to 3hrs.

Item Performance Test Condition

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For HCB HPB

Phase Temperature(℃) Time(min)
Condition for 1 cycle
1 -55±2℃ 30±3 Step1:-55±2℃ 30±3 min.
Appearance: no damage. Step2:Room temperature 10 to15 min.
2 Room Temp. 10~15 Step3:+125±5℃ 30±3 min.
Thermal shock
Impedance: within±30%of initial value.
Step4: Room temperature 10 to15 min.
3 +125±5℃ 30±3
Number of cycles:5
4 Room Temp. 10~15
Measured at room temperature after placing
Measured:5 times for 2 to 3 hrs.

Temperature:-55±2℃.
Applied current:rated current.
Low temperature storage Appearance: no damage.
Duration:500±12hrs.
test
Impedance: within±30%of initial value.
Measured at room temperature after placing
for 2 to 3hrs.
Frequency: 10-55-10Hz for 1 min.
Amplitude: 1.52mm
Appearance: Cracking, shipping and any other defects harmful to the
Directions and times: X, Y, Z directions for 2
Random Vibration Test characteristics should not be allowed.
hours.
Impedance: Within±30% of initial value.
A period of 2 hours in each of 3 mutually
perpendicular directions (Total 6 hours).

a: No mechanical damage
Drop Drop 10 times on a concrete floor from a height of 75cm
b: Impedance change: ±30%

6. Soldering and Mounting

6-1. Recommended PC Board Pattern
L

Land Patterns For

Chip size
Reflow Soldering

H
Series Type A(mm) B(mm) C(mm) D(mm) L(mm) G(mm) H(mm)
G
1608 1.6±0.15 0.80±0.15 0.80±0.15 0.30±0.2 2.60 0.60 0.80

2012 2.0±0.20 1.25±0.20 0.85±0.20 0.50±0.3 3.00 1.00 1.00 PC board should be designed so that
products are not sufficient under
3216 3.2±0.20 1.60±0.20 1.10±0.20 0.50±0.3 4.40 2.20 1.40
HCB/HPB mechanical stress as warping the
3225 3.2±0.20 2.50±0.20 1.30±0.20 0.50±0.3 4.40 2.20 3.40 board.
Products shall be positioned in the
4516 4.5±0.20 1.60±0.20 1.60±0.20 0.50±0.3 5.70 2.70 1.40 sideway direction against the
4532 4.5±0.20 3.20±0.20 1.50±0.20 0.50±0.3 5.90 2.57 4.22
mechanical stress to prevent failure.

6-2. Soldering
Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused
by the difference in coefficients of expansion between solder, chip and substrate. YOSONIC terminations are suitable for
all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of
hot air soldering tools.

6-2.1 Solder re-flow:

Recommended temperature profiles for re-flow soldering in Figure 1.
6-2.2 Solder Wave:
Wave soldering is perhaps the most rigorous of surface mount soldering processes due to the steep rise in temperature
seen by the circuit when immersed in the molten solder wave , typical at 240℃. Due to the risk of thermal damage to
products, wave soldering of large size products is discouraged. Recommended temperature profile for wave soldering is
shown in Figure 2.
6-2.3 Soldering Iron(Figure 3):
Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that
a soldering iron must be employed the following precautions are recommended.
‧Preheat circuit and products to 150℃ ‧Never contact the ceramic with the iron tip ‧Use a 20 watt soldering iron with tip diameter of 1.0mm
‧280℃ tip temperature (max) ‧1.0mm tip diameter (max) ‧Limit soldering time to 3 sec.
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PRE-HEATING SOLDERING NATURAL PRE-HEATING SOLDERING NATURAL PRE-HEATING SOLDERING NATURAL

COOLING COOLING COOLING

250
The force for tearing off cover tape is 15 to 60 grams
280

230
(446)
F in the arrow direction under the following conditions.

TEMPERATURE C

TEMPERATURE C
230
TEMPERATURE C 230

0
0

150 165° to180° 150 150

Top cover tape (302)

Room Temp. Room Humidity Room atm Tearing Speed

(℃) (%) (hPa) mm/min

Base tape 5~35 45~85 860~1060 300

Over 1 min. Over 1 min. Gradual Cooling Over 2 min. Gradual Cooling Over 1 min. Gradual Cooling
Within 10 sec. Within 3 sec. Within 3 sec.

Figure 1. Re-flow Soldering Figure 2. Wave Soldering Figure 3. Hand Soldering

6-2.4 Solder Volume:
Accordingly Increasing the solder volume, the mechanical stress to
product is also increased. Exceeding solder volume may cause the
failure of mechanical or electrical performance. Solder shall be used
not to be exceed as shown in right side:

7. Packaging Information
7-1. Reel Dimension
A

2±0.5
Type A(mm) B(mm) C(mm) D(mm)
.5
±0 0.5
.5
R1
13
D
B

R1
.9 7”x8mm 9.0±0.5 60±2 13.5±0.5 178±2
R0.5

120° 7”x12mm 13.5±0.5 60±2 13.5±0.5 178±2

7"x8mm 7"x12mm
7-2.1 Tape Dimension / 8mm

P2:2±0.05 Po:4±0.1 . 1 t
+0 A Series size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm)
1 .5
D:
E:1.75±0.1

HCB 160808 1.80±0.10 1.01±0.10 1.02±0.10 4.0±0.1 0.22±0.05

W:8.0±0.1

HCB,HPB 201209 2.25±0.10 1.42±0.10 1.04±0.10 4.0±0.1 0.22±0.05

Bo

HCB 321611 3.50±0.10 1.88±0.10 1.27±0.10 4.0±0.1 0.22±0.05

F:3.5±0.05

D1

HCB 322513 3.42±0.10 2.77±0.10 1.55±0.10 4.0±0.1 0.22±0.05

P Ko
:1 ±

A
Ao
0.
1

SECTION A-A

7-2.2 Tape Dimension / 12mm

Po:4±0.1 P2:2.0±0.05 t
1.75±0.1

D:1.5+0.1

Series Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm)

5.5±0.05

W:12.0±0.1

HCB 451616 4.95±0.1 1.93±0.1 1.93±0.1 4.0±0.1 0.24±0.05

Bo

HCB 453215 4.95±0.1 3.66±0.1 1.85±0.1 8.0±0.1 0.24±0.05

D1:1.5±0.1 P Ko HCB 575018 6.10±0.1 5.40±0.1 2.00±0.1 8.0±0.1 0.30

Ao

7-3. Packaging Quantity

Chip size 575018 453215 451616 322513 321611 201209 160808

Chip / Reel 1000 1000 2000 2500 3000 4000 4000

Inner box 4000 4000 8000 12500 15000 20000 20000

Middle box 20000 20000 40000 62500 75000 100000 100000

Carton 40000 40000 80000 125000 150000 200000 200000

Bulk (Bags) 4000 12000 20000 30000 50000 150000 200000

7-4. Tearing Off Force

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Typical Impedance v.s. Frequency Curve

HCB1608K-300T30 HCB1608K-800T30 HCB1608K-121T20

120 160 300

250
90 120
IMPEDANCE(Ohm)

IMPEDANCE(Ohm)

IMPEDANCE(Ohm)
Z 200

Z
60 80 150
Z
100
30 40
50
X
R X R X R
0 0 0
1 10 100 1000 1 10 100 1000 1 10 100 1000
FREQUENCY(MHz) FREQUENCY(MHz) FREQUENCY(MHz)

HCB1608K-151T20 HCB1608K-221T20 HCB1608K-301T10

300 400 400
Z
250
300 Z 300
IMPEDANCE(Ohm)

IMPEDANCE(Ohm)

IMPEDANCE(Ohm)
200
Z

150 200 200

100
X
100 100
X X
50
R R
R
0 0 0
1 10 100 1000 1 10 100 1000 1 10 100 1000
FREQUENCY(MHz) FREQUENCY(MHz) FREQUENCY(MHz)

HCB1608K-471T10 HCB1608K-601T10 HCB2012K-300T30

800 800 90
Z

Z
600 600

IMPEDANCE(Ohm)
IMPEDANCE(Ohm)

IMPEDANCE(Ohm)

60

400 400
Z

30
200 200 X
X X

R R R
0 0 0
1 10 100 1000 1 10 100 1000 1 10 100 1000
FREQUENCY(MHz) FREQUENCY(MHz) FREQUENCY(MHz)

HCB2012K-800T30 HCB2012K-121T20 HCB2012K-151T20

200 300 400

160
300
IMPEDANCE(Ohm)
IMPEDANCE(Ohm)

IMPEDANCE(Ohm)

200
Z
120
Z
200
Z
80
100
X 100
40
X
X
R R R
0 0 0
1 10 100 1000 1 10 100 1000 1 10 100 1000
FREQUENCY(MHz) FREQUENCY(MHz) FREQUENCY(MHz)

HCB2012K-221T20 HCB2012K-301T10 HCB2012K-471T10

600 600 800

600
IMPEDANCE(Ohm)

IMPEDANCE(Ohm)

IMPEDANCE(Ohm)

400 400 Z
Z
400
Z

200 200
200
X

X X
R R R
0 0 0
1 10 100 1000 1 10 100 1000 1 10 100 1000
FREQUENCY(MHz) FREQUENCY(MHz) FREQUENCY(MHz)

HCB2012K-601T10 HPB2012Z-300T50 HPB2012Z-101T40

800 100 300

250
Z 80
600
IMPEDANCE(Ohm)

IMPEDANCE(Ohm)
IMPEDANCE(Ohm)

200
60

400 150
Z
40
Z 100
200
20
50
X X
R X R R
0 0 0
1 10 100 1000 1 10 100 1000 10000 1 10 100 1000 10000
FREQUENCY(MHz) FREQUENCY(MHz) FREQUENCY(MHz)
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Typical Impedance v.s. Frequency Curve

HPB2012Z-221T30 HPB2012Z-331T25 HPB2012Z-471T20
500 600 800

400
600
IMPEDANCE(Ohm)

IMPEDANCE(Ohm)

IMPEDANCE(Ohm)
400
Z
Z
300
Z
400
200
200
200
100
X X
X
R R R
0 0 0
1 10 100 1000 10000 1 10 100 1000 10000 1 10 100 1000 10000
FREQUENCY(MHz) FREQUENCY(MHz) FREQUENCY(MHz)

HPB2012Z-601T15 HCB3216K-300T30 HCB3216K-500T30

800 120 150
Z

600 90
IMPEDANCE(Ohm)

IMPEDANCE(Ohm)

IMPEDANCE(Ohm)
100

400 60
Z

Z 50
200 30
X X X
R R
R
0 0 0
1 10 100 1000 10000 1 10 100 1000 1 10 100 1000
FREQUENCY(MHz) FREQUENCY(MHz) FREQUENCY(MHz)

HCB3216K-800T30 HCB3216K-121T20 HCB3216K-151T20

160 360 300

300
120
IMPEDANCE(Ohm)

IMPEDANCE(Ohm)

IMPEDANCE(Ohm)
Z 240 200
Z

80 180
Z

X 120 100
40 X
60
X
R R
R
0 0 0
1 10 100 1000 1 10 100 1000 1 10 100 1000
FREQUENCY(MHz) FREQUENCY(MHz) FREQUENCY(MHz)

HCB3216K-301T10 HCB3216K-471T10 HCB3216K-501T30

400 800 800
Z

300 600 600

IMPEDANCE(Ohm)

IMPEDANCE(Ohm)

IMPEDANCE(Ohm)

Z
Z

200 400 400

100 200 200

X X
R R X R
0 0 0
1 10 100 1000 1 10 100 1000 1 10 100 1000
FREQUENCY(MHz) FREQUENCY(MHz) FREQUENCY(MHz)

HCB3216K-601T20 HCB3225K-600T40 HCB3225K-900T20

800 200 160

Z 160
600 120
IMPEDANCE(Ohm)
IMPEDANCE(Ohm)

IMPEDANCE(Ohm)

Z
120

400 80
Z
80
X
200 40
40
X
R X R R
0 0 0
1 10 100 1000 1 10 100 1000 1 10 100 1000
FREQUENCY(MHz) FREQUENCY(MHz) FREQUENCY(MHz)

HCB3225K-151T50 HCB3225K-201T40 HCB4516K-600T60

300 300 200

Z 160
IMPEDANCE(Ohm)
IMPEDANCE(Ohm)

IMPEDANCE(Ohm)

200 200
Z 120

Z
80
100 100

X X X
40

R R
R
0 0 0
1 10 100 1000 1 10 100 1000 1 10 100 1000
FREQUENCY(MHz) FREQUENCY(MHz) FREQUENCY(MHz)
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Typical Impedance v.s. Frequency Curve

HCB4516K-800T30 HCB4516C-102T15 HCB4532K-800T60
200 3000 200

2500
160 Z 160
IMPEDANCE(Ohm)

IMPEDANCE(Ohm)

IMPEDANCE(Ohm)
2000
120 120
Z Z
1500
80 80
1000
X
40 40
500

R R R X
X
0 0 0
1 10 100 1000 1 10 100 1000 1 10 100 1000
FREQUENCY(MHz) FREQUENCY(MHz) FREQUENCY(MHz)

HCB4532K-131T30 HCB4532K-151T50 HCB4532H-681T40

250 250 1500

200 200 1200

IMPEDANCE(Ohm)

IMPEDANCE(Ohm)

IMPEDANCE(Ohm)
Z Z
150 150 900 Z

100 100 600

50 50 300
X X
R R R X
0 0 0
1 10 100 1000 1 10 100 1000 1 10 100 1000
FREQUENCY(MHz) FREQUENCY(MHz) FREQUENCY(MHz)

HCB4532H-132T30 HCB4532M-132T30 HCB5750V-101T60

2000 2500 250

Z 2000 200
1500
IMPEDANCE(Ohm)

IMPEDANCE(Ohm)

IMPEDANCE(Ohm)
Z
1500 150
Z
1000
1000 100

500 X
500 50

R X R X R
0 0 0
1 10 100 1000 1 10 100 1000 1 10 100 1000
FREQUENCY(MHz) FREQUENCY(MHz) FREQUENCY(MHz)

HCB5750V-151T30 HCB5750V-181T30 HCB5750H-601T30

250 300 600
Z

500
200
Z
IMPEDANCE(Ohm)

IMPEDANCE(Ohm)

IMPEDANCE(Ohm)

Z
200 400
150
300
100
X 100 200

50 X
100
R X
R R
0 0 0
1 10 100 1000 1 10 100 1000 1 10 100 1000
FREQUENCY(MHz) FREQUENCY(MHz) FREQUENCY(MHz)