- Field-effect transistors (FETs) include junction FETs (JFETs) and metal-oxide-semiconductor FETs (MOSFETs).
- JFETs use a channel of one semiconductor type between two regions of the opposite type to control current. Applying a voltage to the gate varies the width of the depletion regions and thereby controls the channel's conductivity.
- In an n-channel JFET, a negative gate voltage increases the depletion regions, reducing the channel width and thus the current flow between the source and drain. The device can be turned on or off by varying the gate voltage. P-channel JFETs operate in the opposite manner.
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Field-Effect Transistors
- Field-effect transistors (FETs) include junction FETs (JFETs) and metal-oxide-semiconductor FETs (MOSFETs).
- JFETs use a channel of one semiconductor type between two regions of the opposite type to control current. Applying a voltage to the gate varies the width of the depletion regions and thereby controls the channel's conductivity.
- In an n-channel JFET, a negative gate voltage increases the depletion regions, reducing the channel width and thus the current flow between the source and drain. The device can be turned on or off by varying the gate voltage. P-channel JFETs operate in the opposite manner.
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Field-Effect Transistors
FET
Junction Field Effect Metal–oxide–semiconductor
Transistor (JFET) field-effect transistor (MOSFET)
n-channel p-channel Depletion Type Enhancement Type
FET Junction Field-Effect Transistor (JFET) N-channel JFET - n-type material forms channel between the embedded layers of p-type material - Top of the n-type channel connected through an ohmic contact to a terminal - drain (D) - Lower end of the same material connected through an ohmic contact to a terminal - source (S) - Two p-type materials connected together and to the gate (G) terminal - Drain and source connected to ends of n-type channel - Gate connected to the two layers of p-type material - In the absence of applied potentials - JFET has two p–n junctions under no-bias conditions - Depletion region at each junction - Depletion region void of free carriers - unable to support conduction N-channel JFET operation - VGS =0 V, VDS >0V - Gate and a source terminal at the same potential
- Depletion region in the low end of each p-material
- VDD (=VDS) is applied -> the electrons drawn to the
drain terminal -> establishment of conventional current ID with the defined direction - Drain and source currents are equivalent (ID = IS)
- Flow of charge limited solely by the resistance of the
n-channel between drain and source
- Depletion region wider near the top of both p-type - materials N-channel JFET operation ● ID establishes various voltage levels through the channel ● The upper region of p-type material will be reverse-biased by a higher voltage than the lower region ● Greater the applied reverse bias, wider the depletion region ● The reverse bias of the p-n junction for the length of the channel - gate current IG = 0 A Assuming uniform resistance in the n-channel ● VDS increased from 0 V to a few volts -> the current will increase as determined by Ohm’s law N-channel JFET operation ● The relative straightness of the plot - for low values of VDS, the resistance is essentially constant ● As VDS increases and approaches level VP - widening of depletion regions - a noticeable reduction in channel width ● Reduced path of conduction causes the resistance to increase ● The more horizontal the curve, the higher the resistance -> the resistance approaches “infinite” ohms in the horizontal region N-channel JFET operation ● If VDS is increased to a level where it appears that the two depletion regions would “touch” - pinch-off will result. ● VDS level that establishes this condition - pinch-off voltage (VP) ● ID maintains a saturation level - IDSS ● In reality a very small channel still exists, with a current of very high density ● The fact that ID does not drop off at pinch-off and maintains the saturation level ● Absence of a drain current would remove the possibility of different potential levels through the n-channel material to establish the varying levels of reverse bias along the p–n junction ● Result would be a loss of the depletion region distribution that caused pinch-off in the first place N-channel JFET operation ● As VDS is increased beyond VP, the region of close encounter between the two depletion regions increases in length along the channel, but the level of ID remains essentially the same ● In essence, therefore, once VDS > VP the JFET has the characteristics of a current source ● the current is fixed at ID = IDSS , voltage VDS (for levels > VP) is determined by the applied load. ● The choice of notation IDSS is derived from the fact that it is the drain-to-source current with a short-circuit connection from gate to source Current source equivalent for VGS = 0 V, VDS > VP. ● IDSS is the maximum drain current for a JFET and is defined by the conditions VGS =0 V and VDS > | VP | N-channel JFET operation
Current source equivalent
for VGS = 0 V, VDS > VP. N-channel JFET operation VGS < 0 V ● Gate terminal set at lower and lower potential levels as compared to the source ● Negative voltage of 1 V is applied between the gate and source terminals for a low level of VDS ● Effect of the negative-bias VGS - to establish depletion regions similar to those obtained with VGS 0 V, but at lower levels of VDS ● Therefore, the result of applying a negative bias to the gate is to reach the saturation level at a lower level of VDS, ● The resulting saturation level for ID has been reduced - will continue to decrease as VGS is made more and more negative. ● Pinch-off voltage continues to drop in a parabolic manner as VGS becomes more and more negative ● VGS when VGS = -VP will be sufficiently negative to establish a saturation level that is essentially 0 mA - device has been “turned off” N-channel JFET operation VGS < 0 V ● Negative voltage of 1 V is applied between gate and source terminals ● For low level of VDS -> effect of the applied negative-bias VGS to establish depletion regions similar to those obtained with VGS = 0 V at lower levels of VDS ● Result of applying a negative bias to the gate - to reach the saturation level at a lower level of VDS ● Resulting saturation level for ID reduced ● ID will continue to decrease as VGS is made more and more negative ● Pinch-off voltage continues to drop in a parabolic manner as VGS becomes more and more negative ● VGS = -VP : sufficiently negative to establish a saturation level of 0 mA - device ‘turned off’ ● Level of VGS that results in ID =0 mA is defined by VGS = VP ● VP negative for n-channel devices and positive for p-channel devices N-channel JFET operation ● Ohmic/ voltage-controlled resistance region
● JFET employed as a variable resistor resistance is controlled by the applied gate-to-source voltage
● Slope of each curve and
therefore the resistance of the device between drain and source for VDS Constant-current,saturation < VP a function of the /linear amplification region applied voltage VGS
● As VGS becomes more Typically employed in linear
and more negative, the amplifiers (amplifiers with slope of each curve becomes more and more minimum distortion of the horizontal, corresponding applied signal) to an increasing resistance level N-channel JFET operation: Summary P-channel JFET operation JFET Transfer Characteristics
DC analysis - graphical rather than a mathematical approach
Graphical approach - plot of device equation + plot of the network equation Solution defined by the point of intersection of the two curves Device characteristics will be unaffected by the network in which the device is employed JFET Transfer Characteristics JFET Transfer Characteristics JFET Transfer Characteristics JFET Transfer Characteristics JFET Transfer Characteristics JFET Transfer Characteristics (P-channel) JFET Operating Region