GSM Phone Repairs & Maintenance Training

Synopses
Youth empowerment is one of the key pillars for growth and development of any
nation as they play a pivotal role in nation building.” In one of his speeches, the
Executive Secretary of NCDMB, Engr. Simbi Kesiye Wabote explained that the Board is
charged with developing local talents, facilities and assets that support the oil and gas
operations and its linkage sectors but it had realised that the oil industry is incapable of
absorbing all local talents even at peak capacity, hence the conceptualization of strategic
youth empowerment programme

The executive Secretary NCDMB went further to justify why the Board decided on GSM
Training, Wabote stated that “since the GSM revolution in 2001, the ICT sector has
evolved as a major contributor to employment, wealth creation, technology
development and innovation. The ICT sector has grown its contribution to the Gross
Domestic Product (GDP) from about three percent in 2001 to 11 percent in 2019.”

Sequel to the above, this training programme is designed to impact and boost the
potentials of youths’ entrepreneurial skills in phone repairs and to key in to His
Excellency President Muhammadu Buhari in fulfilling his promise of lifting 100 million
youths out of poverty in Nigeria.

Program Objective;

At the end of the programme, trainees are expected to benefit among other thigs;
entrepreneurship, phone repairs and troubleshooting, couching, mentorship,
equipment handlings, safety of work place, basic electrical and electronics theory as
relates to cell phones and other succors to enable them start their businesses without
initial hiccups starters do face in line with the NITDA approved curriculum.

Program Content;
Participants will be introduced to various modules ranging from entrepreneurship
topics to cell phones repairs among others;
Module 1:
Introduction to Telecommunications.
The Nature of Electricity: Insulators, Conductors, and Batteries.
Ohm’s Law and Circuit Analysis.
Magnetism and Electromagnetism.
Capacitors and Inductors.
Analog VOM Meter.
Alternating Current in Electronic Circuits.
Inductors in AC Circuits.
Capacitors in AC Circuits.
Transformers for Electronic and Other Applications.
Experiments with DC Theory.
Rectification and Basic Electronic Devices .
Basic Semiconductor Components: Diodes.
Safety of equipment and worker

Module 2:
Hardware :
Basics of Mobile Communication.
Tools & instruments used in mobile phone repairing.
Various components used in mobile phones.
Basic parts of mobile phones (Mic, Speaker, Buzzer, LCD, Antenna, etc).
Use of Multimeter.
Use of Battery Booster.
Basic Circuit Board/ Motherboard Introduction.
Assembling & disassembling of different mobile phones.
Soldering & DE-soldering Components Using Different Soldering Tools.
Names of Different ICs.
Work of Different ICs.
Fault finding & Troubleshooting.
Repairing procedure for repairing different hardware faults.
Module 3:
Software:
Flashing
Formatting
Unlocking
Use of secret codes
Downloading
Bluetooth/ infrared
Module 4:
How to set up and manage profitable GSM Repairs and maintenance servicing business
Module 5:
Entrepreneur and entrepreneurship with regards to cell phone repairs

Methodology;
Trainees to be selected based on the demographic representation of the area and he/s
should be able to read and wright.
Highly Experienced GSM instructors who had put many years in GSM repairs and
servicing shall be deployed to conduct both the theory, practical and practice in order
to engage with the participants for optimum result.

Venue;
Government Science Secondary Soba assembly hall

Course Content
The course is divided into three parts –
Theory
Practical
Practice

WEEKEND
Duration: Three (3) Weekends
Starting Starting November 25, 2017.
Time : Saturday 9am -1pm ,Sunday 2pm - 5pm

Venue:

RAINING FEE: ₦14,999

www.mobilecellphonerepairing.com1
Introduction

Online Free Course in Mobile Repairing (Card & Chip Level Training).

Taught and Trained by Experienced Teachers.

Learn Mobile Repairing with Modern Tools and Equipment and Latest Technology.

Students can Start Their Own Business after Completing the Course.
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Scope for Students

Students can Start Their Own Business in Mobile Phone Repairing and Cell Phone
Industry.

Students can Work as a Technician in a Cell Phone Service Centre.

Students can Find Job in Cell Phone Industry.

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Course Overview

Introduction & Identification of PCB (Printed Circuit Board).

Fault Finding of Mobile Phone Sections with Block Diagram.

Hardware of Mobile Phone.

Use of Tools and Equipment.

Mobile Phone Software.

Multimedia and Downloading.

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Index
1.Mobile Phone Dictionary: Full Forms of Terms Used in Mobile Phone.
2.Mobile Phone Repairing Tools and Equipment.
3.Identification of Card Level Parts.
4.Identification of PCB.
5.Identification of Big Parts in a Mobile Phone.
6.Identification of Small Parts in a Mobile Phone.
7.About IC (Integrated Circuit) and Counting Techniques of Leg-Type and Ball-Type IC.
8.About Current.
9.Circuit (CKT) Symbol.
10.Sections of a Mobile Phone.
11.Software Tools.
12.Software Problems and Solutions.
13.Multimedia and Downloading.
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Mobile Phone Dictionary
1.1G:1StGeneration in Mobile Telephony.
2.2G:2NdGeneration in Mobile Telephony.
3.3G:3RdGeneration in Mobile Telephony.
4.4G:4ThGeneration in Mobile Telephony.
5.AC:Alternate Current.
6.BGA:Ball Grid Array.
7.BSI:Battery Status Indicator.
8.CDMA:Code Division Multiple Access.
9.CPU:Central Processing Unit.
10.DCT:Digital Core Technology.
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Mobile Phone Dictionary
11.DC:Direct Current.
12.GSM:Global System for Mobile Communications.
13.IMEI:International Mobile Equipment Identity.
14.IC:Integrated Circuit.
15.LED:Light Emitting Diode.
16.PDA:Personal Digital Assistant.
17.PFO:Power Frequency Oscillator.
18.PCB:Printed Circuit Board.
19.RAM:Random Access Memory.
20.RF:Radio Frequency.
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Mobile Phone Dictionary
21.ROM:Read Only Memory.
22.RTC:Real Time Clock.
23.RX:Receive / Receiver (Receiving Section).
24.SMD:Surface Mount Device.
25.TX:Transmit (Transmitting Section).
26.UEM:Universal Energy Manager.
27.VCO:Voltage-Controlled Oscillator.
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Mobile Phone Repairing Tools and Equipment
1.Soldering Iron or Soldering Station: Used to Solder.
Soldering IronSoldering Station
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Mobile Phone Repairing Tools and Equipment

P.C.B Stand:Used to Hold PCB.

Solder Wire (Ranga):Used to Solder.

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Mobile Phone Repairing Tools and Equipment

Thinner:Used to Clean PCB.

Jumper Wire:Used to Connect One Point to Another Point on a PCB.

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Mobile Phone Repairing Tools and Equipment

Blade Cutter:Used to Cut and Remove Lamination.

Point Cutter:Used to Cut Wire.

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Mobile Phone Repairing Tools and Equipment
Nose Cutter:Used to Cut Wire.

Screwdriver (T6,T5,T4,+,-): Used to Remove and Tighten Screws from Mobile Phone.
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Mobile Phone Repairing Tools and Equipment

Tweezers:To Hold Wire and Components.

Brush:For Cleaning.
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Mobile Phone Repairing Tools and Equipment

Multimeter:To Check PCB Track and Electronic Components.

Blower (S.M.D Rework Station):To Remove and Solder SMD / Chip Components.
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Mobile Phone Repairing Tools and Equipment

Battery Booster:To Boost Voltage of Battery.

Ultrasonic Cleaner:To Clean PCB and Electronic Components.

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Mobile Phone Repairing Tools and Equipment

BGA Kit:To Reball and Repair Ball-Type IC.

Magnifying Lamp:To Get Magnified View of PCB and Components.

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Mobile Phone Repairing Tools and Equipment

Case and Screen Opener: To Open the Screen and Case of a Mobile Phone.

Regulated DC Power Supply:To Supply DC Electricity.

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Mobile Phone Repairing Tools and Equipment

Liquid Flux:To Clean PCB Track and Legs of Electronic Components While Soldering.

Paste Flux:Used While Soldering.

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Mobile Phone Repairing Tools and Equipment

Solder Paste:Solder in Semi-Solid Form. Used to Solder.

File / Reti / Cleaning Sponge:To Clean Tip of Soldering Iron

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Mobile Phone Repairing Tools and Equipment

Desoldering Wire:To Desolder Electronic Components and To Remove Excess Solder

from PCB Track.

Screwdriver Kit:To Disassemble and Assemble Mobile Phone.

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Identification of Card Level Parts.
1.Fascia2.Back Facia
FaciaBack Facia
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Identification of Card Level Parts.
3.Haddi / Internal Fascia4.Ringer / Loudspeaker
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Identification of Card Level Parts.
5.Speaker / Earpiece6.Mic / Microphone
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Identification of Card Level Parts.
7.Vibrator / Motor8.LED
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Identification of Card Level Parts.
9.Charging Connector10.Headphone / Earphone Connector
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Identification of Card Level Parts.
11.Data Cable Connector
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Identification of Card Level Parts.
12.Battery13.Battery Connector
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Identification of Card Level Parts.
14.SIM Card15.SIM Card Connector
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Identification of Card Level Parts.
16.Memory Card17.Memory Card Connector
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Identification of Card Level Parts.
18.Camera19.Camera Connector
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Identification of Card Level Parts.
20.Keypad Button21.Keypad Carbon / Tickly
Keypad Carbon
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Identification of Card Level Parts.
22.Keypad Connector23.ON / OFF Switch
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Identification of Card Level Parts.
24.Display25.Display Connector
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Identification of Card Level Parts.
26.Antenna27.PCB
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Identification of Card Level Parts.
28.PDA
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Nokia 3310 Mobile Phone PCB Diagram
Antenna Point
On / OFF Switch
Antenna Switch
PFO / PA
RX Filter
Network IC
VCO
BSI
Network Section
Power IC
Charging IC
CPU
R22
Audio IC
Flash IC
RAM
UI Module / Logic IC
MIC Interface
Buzzer Interface
RTC
Power Section
NOTES:
1.UEM= Logic IC + Charging IC + Audio IC + Power IC
2.PFO= Antenna Switch + PFO
3.Flash IC= RAM + Flash IC
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Identification of PCB
1.Antenna Point:The point where anteena is connected is called anteena point.
2.Network Section:The section below anteena point and above power section is called
network section.
3.Anteena Switch:It is found in the network section. It is made from metal and non-
metal. It has 16 points or legs.
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Identification of PCB
4.In some mobile phones, the anteena switch is merged with PFO.
5.PFO: It is present beside the antenna switch.
6.Network IC:It is below or beside the anteena switch and PFO.
7.In some mobile phones, the Network IC is merged with the CPU. E.g.: Nokia 1200,
1650, 1208, 1209 etc.
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Identification of PCB
8.Power Section:This section is below the Network Section.
9.Power IC:In the Power Section, the IC around which there are several brown-coloured
capacitors, is called Power IC. In some mobile phones there are 2 Power IC.
10.CPU:In the power section, the largest IC is the CPU. In some sets there are 2 CPU.
11.Flash IC:This IC is found beside the CPU.
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Identification of PCB
12.Logic IC: The IC with 20 legs is the Logic IC.
13.Charging IC: In the Power Section, the IC beside R22 is the Charging IC.
14.Audio IC: The IC parallel to Power IC is the Audio IC.
15.UEM = Logic IC + Charging IC + Audio IC + Power IC
16.PFO = Antenna Switch + PFO
17.Flash IC = RAM + Flash IC
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Definition of Big Parts
1.Antenna Switch: It is found in the Network Section of a Mobile Phone and is made up
of metal and non-metal. In GSM sets it is found in white colour and in CDMA sets it is
found in golden metal.
Work:It searches network and passes forward after tuning.
Faults:If the Anteena Switch is faulty then there will be no network in the mobile phone.
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Definition of Big Parts
2.P.F.O: It is found near the Anteena Switch in the Network Section of a Mobile Phone.
It is also called P.A (Power Amplifier) and Band Pass Filter.
Work: It filters and amplifies network frequency and selects the home network.
Faults: If the PFO is faulty then there will be no network in the mobile phone. If it gets
short then the mobile phone will get dead.
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Definition of Big Parts
3.RF IC / Hager / Network IC: It is found near the PFO in the Network Section of a
Mobile Phone. It is also called RF signal processor.
Work: It works as transmitter and receiver of audio and radio waves according to the
instruction from the CPU.
Faults: If the RF IC is faulty then there will be problem with network in the mobile
phone. Sometimes mobile phone can even get dead.
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Definition of Big Parts
4.26 MHz Crystal Oscillator: It is found near the PFO in the Network Section of a
Mobile Phone. It is also called Network Crystal. Itis made up of metal.
Work: It creates frequency during outgoing calls.
Faults: If this crystal is faulty then there will be no outgoing call and no network in the
mobile phone.
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Definition of Big Parts
5.VCO: It is found near the Network IC in the Network Section of a Mobile Phone.
Work: It sends time, date and voltage to the RF IC / Hager and the CPU. It also creates
frequency after taking command from the CPU.
Faults: If it is faulty then there will be no network in the mobile phone and it will
display “Call End” or “Call Failed”.
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Definition of Big Parts
6.RX Filter: It is found in the Network Section of a Mobile Phone.
Work: It filters frequency during incoming calls. Faults: If it is faulty then there will
network problem during incoming calls.
7.TX Filter: It is found in the Network Section of a Mobile Phone.
Work: It filters frequency during outgoing calls.
Faults: If it is faulty then there will network problem during outgoing calls.
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Definition of Big Parts
8.ROM: It is found in the Power Section of a Mobile Phone.
Work: It loads current operating program in a Mobile Phone.
Faults: If ROM is faulty then there will software problem in the mobile phone and the
set will get dead.
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Definition of Big Parts
9.RAM: It is found in the Power Section of a Mobile Phone.
Work: It sends and receives commands of the operating program in a mobile phone.
Faults: If RAM is faulty then there will be software problem in the mobile phone and it
will get frequently get hanged and the set can even get dead.
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Definition of Big Parts
10.Flash IC: It is found in the Power Section of a Mobile Phone. It is also called
EEPROM IC, Memory IC, RAM IC and ROM IC.
Work: Software of the mobile phone is installed in the Flash IC.
Faults: If Flash IC is faulty then the mobile phone will not work properly and it can
even get dead.
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Definition of Big Parts
11.Power IC: It is found in the Power Section of a Mobile Phone. There are many small
components mainly capacitor around this IC. RTC is near the Power IC
Work: It takes power from the battery and supplies to all other parts of a mobile phone.
Faults: If Power IC is faulty then the set will get dead.
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Definition of Big Parts
12.Charging IC: It is found in the Power Section near R22.
Work: It takes current from the charger and charge the battery.
Faults: If Charging IC is faulty then the set will not get charged. If the Charging IC is
short then the set will get dead.
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Definition of Big Parts
13.RTC (Simple Silicon Crystal): It is found in the Power Section near Power IC. It is
made up of either metal or non-metal. It is of long shape.
Work: It helps to run the date and time in a mobile phone.
Faults: If RTC is faulty then there will be no date or time in the mobile phone and the
set can even get dead.
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Definition of Big Parts
14.CPU: It is found in the Power Section. It is also called MAD IC, RAP IC and UPP. It is
the largest IC on the PCB of a Mobile Phone and it looks different from all other ICs.
Work: It controls all sections of a mobile phone.
Faults: If CPU is faulty then the mobile phone will get dead.
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Definition of Big Parts
15.Logic IC / UI IC: It is found in any section of a mobile phone. It has 20 pins or legs. It
is also called UI IC and Interface IC.
Work: It controls Ringer, Vibrator and LED of a mobile phone.
Faults: If Logic IC / UI IC is faulty then Ringer, Vibrator and LED of mobile phone will
nor work properly.
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Definition of Big Parts
16.Audio IC: It is found in Power Section of a mobile phone. It is also called Cobba IC
and Melody IC.
Work: It controls Speaker and Microphone of a mobile phone.
Faults: If Audio IC is faulty then Speaker and Microphone of a mobile phone will not
work and the set can even get dead.
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Identification of Small Parts 1.Crystal: There are 2 types of crystal in a mobile phone:
i)Network Crystal: This crystal is found in the Network Section of a Mobile Phone. It is
made up of metal.
Work: It filters network.
Faults: If the Network Crystal is faulty then there will be no network in the mobile
phone.
ii)Simple Silicon Crystal (RTC): This crystal is found in the Power Section of a mobile
phone. It is made up of either metal or non-metal and is of long shape.
Work: It runs the clock of a mobile phone.
Faults: If this crystal is faulty then the clock of the mobile phone will not work and the
set can get dead.
Network Crystal / 26 MHz Crystal Oscillator
Simple Silicon Crystal / RTC
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Identification of Small Parts
2.Coupler:This electronic component is found in the Network Section of a mobile
phone. It is of either black or white colour and has 6 pins bent inside.
Work: It filters network.
Faults: If the coupler is faulty then there will be no network in the mobile phone.
Coupler
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Identification of Small Parts
3.Diode: Diodes are of 4 types:-
i) Rectifier Diode:It is found in black colour and converts AC Current to DC Current. It
passes current in one direction. It does not pass current in reverse direction.
ii) LED:It is found in white or light yellow colour and emits light.
iii) Zener Diode:It is found in charging section. It filters and minimize current and
passes forward. It acts as voltage regulator. Zenor diode has fixed capacity like 4V, 6V,
8V etc.
iv) Photo Diode:It is used for Infrared. It captures Infrared Rays.
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Identification of Small Parts
4.Transistor: This electronic component is found in any section of a mobile phone. It is
of black colour and it has 3 legs. It does the work of switching.
5.Regulator: This electronic component is found in any section of a mobile phone. It is
of black colour and has 5 or 6 legs. It filters current and regulates voltage.
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Identification of Small Parts
6.Resistance: There are 2 types of resistance on a the PCB of a mobile phone: a) Chip
Resistance: It can be found in any section of a mobile phone. It is of black colour. In
some sets it is also found in blue andgreen colour. It is the smallest electronic
components on the PCB of amobile phone. It decreases current and passes forward.
b) Network Resistance: It can be found in any section of a mobile phone. It is made from
2 or more Chip Resistance.
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Identification of Small Parts
7.Capacitor: 3 types of capacitor are found in a mobile phone:
a) Non-Electrolytic Capacitor: It is found in any section of a mobile phone. It’s height is
little more than chip resistance. It can be of light black, yellowor brownin colour. It has
no Positive (+) or Negative (-) side. It filters DC current.
b) Electrolytic Capacitor: It is found in any section of a mobile phone. It’s size is larger
than non-electrolytic capacitor. It is found in 2 colours –(i) Orangewith brown strip: and
(ii) Blackwith white strip. The side with the strip is Positive(+) and the other side is
Negative (-). It filters and stores current.
c)Network Capacitor:It is found in any section of a mobile phone. It is made from 2 or
more Non-Electrolytic Capacitors.
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Identification of Small Parts
8.Coil: It is found in any section of a mobile phone. It is found in many shapes and sizes.
Coils are found in 2 colours: (i) Black and white; and (ii) Blue and white. It has binding
of copper coil inside. It filters and decreases Current and Voltage.
Boost Coil: It’s size is little bigger than coil. It is found in black colour and look like
button. It increases current. If this coil gets damaged then it has to be changed.
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Identification of Small Parts
1. Microphone 1. Speaker If Component is Faulty If Component is Good
Electronic Components that Will Give Beep When Tested with Multimeter on Buzzer
Mode.
3. Diode 3. Resistance 2. Capacitor 2. Coil
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IC & Counting
IC (Integrated Circuit):IC is an electronic component that is made up of many other
small electronic components like resistance, capacitor, coil, diode, transistor etc. There
are 2 types of ICs –(i)Leg-Type IC; and (ii)Ball- Type IC.
Counting: Leg-Type IC: Counting of leg-type IC starts in Numerical Digitin
Anticlockwise Directionstarting from the NosePoint or Cut Point.
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IC & Counting
Counting: Ball-Type IC: Counting of Ball-type IC is done in Both Clockwise and Anti-
Clockwise Direction. Rows are counted in Digit Numbers (1,2,3,4…) in Clockwise
Direction. Columns are Counted in Alphabet (A,B,C,D…) in Anti-Clockwise Direction.
NOTE: When counting Columns, “I” and “O” are omitted because they look like “1”
and “0”.
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Current
Unit of Current: Ampere or Amp (A).

Unit of Voltage: Volt (V).

Current: Flow of Electric Charge through a Conductive Medium.

Types of Current: (1) Alternate Current (AC) and (2) Direct Current (DC).

Alternate Current (AC): The Movement of Electric Charge Periodically Reverses

Direction. E.g: Power Substation.

Direct Current (DC): The Movement of Electric Charge is in One Direction. E.g: Power
from Battery.
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Circuit (CKT) Symbol
1.AC Current:
2.DC Current:
3.Capacitor:
4.Coil:
5.Fuse:
6.Resistance:
8.Diode:
9.LED:
10.Transistor:
11.Crystal:
12.Regulator:
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Ringer: Faults & Solution

Ringer: Type of component that rings or plays loud sound is called Ringer. It is also
called by several other names like –I.H.F Speaker, Buzzer, Melody etc.

Faults:
1.Ringer not working. 2.Less sound from the Ringer. 3.Sound coming from Ringer but
with interruption. 4.Sound not clear.

Solution:
1.Check Ringer Settings in Mobile Phone. Check Ringer Volume and Silent Mode. (See
Video) 2.Open Mobile Phone and Clean Ringer Point and Ringer Connector. (See Video)
3.Check Ringer by Keeping the Multimeter in Buzzer Mode. Value must be 8 ~ 10 Ohm.
If the Value is not between 8~10 Ohm then change the Ringer. (See Video) 4.Check
Track of Ringer Section. Do Jumper Wherever required. (See Video) 5.Check Ringer IC.
Heat or Change if Required. (See Video) 6.UEM / Logic IC: Heat, Reball or Change.
(See Video) 7.CPU: Heat, Reball or Change. (See Video)
NOTES:
1.If there is less sound from the Ringer then change the Ringer. 2.If the problem is not
solved then heat or change the Ringer IC.
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Vibrator: Faults & Solution

Vibrator: Type of component that vibrates. It is also called Motor. Vibrator is controlled
by Logic IC or Power IC.

Faults:
1.Vibrator not working. 2.Vibration with interruption. 3.Vibration Hangs.

Solution:
1.Check Vibrator Settings in Mobile Phone. Check if Vibrator is ONor OFF. 2.Open
Mobile Phone and Clean Vibrator Tips Connector. 3.Check Vibrator by Keeping the
Multimeter in Buzzer Mode. Value must be 8~16 Ohm. If the Value is not between 8~16
Ohm then change the Vibrator / Motor. 4.Check Track of Vibrator Section. Do Jumper
Wherever required. 5.UEM / Logic IC / Power IC: Heat, Reball or Change. 6.CPU:
Heat, Reball or Change.
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Light: Faults & Solution

LED: Type of component that generates light in the Mobile Phone. These are generally
LED or Light Emitting Diode.

Faults:
1.No Light. 2.Light in only Keypad or Display. 3.Some lights not working.

Solution:
1.Check Light Settings. 2.Resold all LED. There are 2 types of connection in the Light
Section of a Mobile Phone: (i) Series Connection; and (ii) Parallel Connection. 3.Change
Display and Check. 4.Keep Multimeter in Buzzer Mode and Check LED. If LED is Good
then it will Glow. If LED is Faulty then it will Not Glow. 5.Change LED or Jumper.
6.Check Track and Jumper if Required. 7.Check Boosting Coil and Change if Required.
8.Light IC: Heat or Change. 9.Power IC: Hear, Reball of Change.
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Light: Faults & Solution

Note: 1.In all Nokia Mobile Phones, there are 2 Types of Light IC:
(i) Ball-Type Light IC: Beside the Boosting Coil, There is a Small- Sized Ball-Type IC.
When this IC is Desoldered, There are 8 Ball Underneath. This is the Light IC.
(ii) Leg-Type Light IC: Beside the Boosting Coil, There is a Small- Sized, 4+4 = 8-Leg-
Type IC. This is Light IC.
2.Light IC = Back Light + Display Light
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Earpiece: Faults & Solution

Earpiece:Type of component that helps to listen to sound during phone call. It is also
called Speaker or Ear Speaker. Earpiece is controlled by Audio IC or Power IC (UEM).

Faults:
1.No sound during phone call. 2.Less sound during phone call. 3.Sound with
interruption.

Solution:
1.Check Speaker Volume during Phone Call. 2.Check Earpiece / Speaker by Keeping
the Multimeter in Buzzer Mode. Value must be 25~35 Ohm. If the Value is not between
25~35 Ohm then change theEarpiece / Speaker. 3.Check Track of Earpiece Section. Do
Jumper Wherever required. 4.UEM / Audio IC: Heat, Reball or Change. 5.CPU: Heat,
Reball or Change.
Note:
1.If there is less sound or sound is not clear during phone call then change the speaker.
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Microphone: Faults & Solution

Microphone: Type of component that helps to transmit sound from one mobile phone to
another during phone call.

Faults:
1.No sound or Less Sound during phone call. 2.Sound with interruption or Changed
sound.

Solution:
1.Check Microphone settings. 2.Check and clean Microphone Tips and Connector.
3.Check Microphone by Keeping the Multimeter in Buzzer Mode. Valuemust be
600~1800 Ohm. If the Value is not between 600~1800 Ohm then change the Microphone.
NOTE: Only one side will give value. The other side will not give any value. 4.Check
Track of Microphone Section. Do Jumper Wherever required. 5.Microphone IC: Heat or
Change. 6.UEM / Audio IC / Power IC: Heat, Reball or Change. 7.CPU: Heat, Reball or
Change.
Note:
1.If there is less sound or sound is not clear during phone call then change the
Microphone.
www.mobilecellphonerepairing.com75
Headphone: Faults & Solution

Headphone: Type of component that does the job of Mic and Speaker separately. When
we insert Headphone, then Speaker and Microphone of the Mobile Phone Gets
Disconnected. Headphone is controlled by C.P.U.

Faults:
1.No sound from Headphone or sound from only one side of the Headphone. 2.Sound
does no go from the Mic of the Headphone.

Solution:
1.Change the Headphone and Check. 2.Clean Headphone Jack and Connector.
3.Resolder or Change the Headphone Connector. 4.Check Track of Headphone Section.
Do Jumper Wherever required. 5.Headphone IC: Heat or Change. 6.UEM / Audio IC /
Power IC: Heat, Reball or Change. 7.CPU: Heat, Reball or Change.
Note:
1.If there is symbol of Headphone without inserting the Headphone then there is
problem with the CPU. To solve the problem, clean or change the Headphone
Connector OR Short the Headphone Connector.
www.mobilecellphonerepairing.com76
Keypad: Faults & Solution

Keypad: Type of component that helps to operate a mobile phone. Some mobile phones
are screen touch and are operated by PDA.
Faults:
1.No Key Working or only Some Key Working. 2.Keys need more pressure to work. Or
when pressed a key works continuously. 3.One key is pressed and some other key
works OR when one key is pressed, some other key works simultaneously.

Solution:
1.Check Facial of the Keypad. 2.Clean Keypad Tikli and Keypad Points. 3.Keep
Multimeter in Buzzer Mode and Check Row and Column of the Keypad. If there is Beep
Sound then Pad is OK. 4.Keypad IC / Interface IC: Heat or Change. 5.CPU: Heat,
Reball or Change.
Note:
1.In a Mobile Phone, when we press a Key and it works very slow then Reload Software
to Solve the Problem. 2.In all Nokia Mobile Phones, if only some key works or non of
thekeys are working then change the Keypad IC to solve the Problem. 3.If Keypad
problem is not solved by Hardware, then Reload Software in the Mobile Phone to Solve
the Problem.
www.mobilecellphonerepairing.com77
Screen Touch: Faults & Solution

Screen Touch: Type of component that helps to operate a mobile phone by touching the
screen. Touch Screen is available in different sizes. It normally has 4 Points Namely: -
(+), (-), (RX), (TX). Screen Touch is also called PDA. It is controlled by the CPU. In some
Mobile Phones there is an Interface IC called PDA IC or Screen Touch IC.

Faults:
1.Screen Touch not Working. 2.Only Half Screen Touch Works. 3.One key is pressed
and some other key works.

Solution:
1.Check Settings if the Mobile Phone has Both Keypad and Touch Screen. 2.Clean and
Resold PDA Tips and PDA Connector. 3.Change PDA. 4.Check Track of the PDA
Section and Jumper if Required. 5.PDA IC: Heat or Change. 6.CPU: Heat, Reball or
Change. Note:
1.If the PDA Problem is not solved by Hardware Then Reload Software to Solve the
Problem.
www.mobilecellphonerepairing.com78
Screen Touch: Faults & Solution Note: 2.Construction of PDA:
3.Any PDA of SAME Size will Fit any Mobile Phone. Any One of the Following 5
Jumper Settings will Work:
www.mobilecellphonerepairing.com79
Display: Faults & Solution

Display: The Display Section of a Mobile Phone is controlled by the CPU. In some
Mobile Phones, there is an Interface IC called Display IC between the Display and the
CPU.

Faults:
1.Nothing shows on the Display or Display is Blank. 2.Only Half Display Working.
3.Display Broken or Crack. 4.Sometimes Display Works and Sometimes it doesn’t work.
5.There is only light in the Display and nothing else.

Solution:
1.Clean Display Tips and Display Connector and Reset the Display. 2.Resold the
Display Connector. 3.Change the Display. 4.Check Display Track. 5.Resold or Change
Display IC. 6.C.P.U: Heat, Reball or Change.
www.mobilecellphonerepairing.com80
Display: Faults & Solution Note:

If the Display is Up-Side Down or only Half Display is Working or if the Display is
Broken then Change the Display.
If the Display is White and the Display is changed but the problem is not solved then
Reload Software in the Mobile Phone.

In some Mobile Phone Sets, like Nokia 6600, N72, when the set is Switched ON, the
Nokia Logo Appears and then it Disappears. This is problem of the BOOT IC. Change
the Boot IC.

In slider mobile phone handsets, if there is display problem then it is mainly because of
Display Track (Patta) that connects the Display with the Mobile Phone PCB. This will
create White Display or Display will not work properly. Change the Display Track to
solve the problem.

he Nigerian Content Development and Monitoring Board (NCDMB) in collaboration with

the National Information Technology Development Agency (NITDA), commenced a virtual
training programme for 1000 youths in Yobe State.
The training programme will focus on GSM repairs, hardware and software
engineering, and Entrepreneurship development will to keep them up to speed with the
current technological trends and also in line with the present administration’s resolve to
lift 100 million Nigerians out of poverty, thereby creating jobs and wealth.

The training programme is taking place at five centers namely; Federal University,
Gashua, Federal Polytechnic, Damaturu, Atiku Abubakar College of Legal Studies,
Nguru and Federal College of Education, potiskum all in Yobe State simultaneously.

The NITDA Director General, Mallam Kashifu Inuwa Abdullahi, while delivering his
good will message stated that this programme is in fulfillment of the promise made by
Mr President, His Excellency, President Muhammadu Buhari to lift 100 million
Nigerians out of poverty in the next 10 years.

“You may recall that the Honorable Minister of Communications and Digital Economy,
Dr Isa Ali Ibrahim Pantami upon assumption of office proactively changed the
landscape of Information and Communication Technology (ICT) with revolutionary
policies and programmes  with National Digital Economy policy and strategy for a
Digital Nigeria,” he said.
Abdullahi said that National Digital Economy policies and strategies anchored on 8
pillars which includes; Digital Literacy and skills, Service infrastructure, Soft
Infrastructure, Indigenous Content Development and promotion which he said the
programme supports the five pillar of the National Digital Economy Plan and Strategy. 

According to Mallam Abdullahi, Capacity building is one of the mandates of the

Agency aimed at building and boosting the potentials of citizens across the country. 

“Youths are assets to the country and also play significant role towards the drive to
Digital Economy simply because innovation and technology evolves around youths
which makes them to bring out the embedded potentials deposited in them,” he said. 

The DG pointed out that, NITDA has been doing a lot in its drive to achieving its
mandates, this he said are evident from trainings, deployment of Digital Hubs across
the country, promotion of local contents, Data Protection, IT clearance among others.

“NITDA will continue to lead effort on creating an enabling environment for

technology innovation and entrepreneurship ecosystem”, he added.

The NITDA boss applauded the Executive Secretary of NCDMB Engr Simbi Kesiye
Wabote, for his relentless effort and passion towards the development of youths across
the country which at the end of the day will bring about growth and development of
the nation.

Earlier, the Executive Secretary NCDMB, Engr Simbi Wabote during his welcome
address stated that youth empowerment is one of the key pillars for growth and
development of any nation adding that “youths play pivotal role in nation building.”

“This training programme is designed to impact and boost the potentials of youths
which end to end process of learning is adopted to aid them key into the trend
of technology as a yard stick for job creation and revenue flow,”he emphasized.

At the end of the training programme, participants are expected to benefit from

mentorship, renting and furnishing of shops, payment of stipends among others to
enable them start their businesses without initial hiccups startups do face.
The Senate President, Dr. Ahmad Ibrahim Lawan on Thursday flagged off the training
sponsored by the Nigerian Content Development and Monitoring Board (NCDMB) for
1,000 youths from Yobe State, focussing on GSM phone repairs, hardware, software,
and entrepreneurship development.

The training is part of NCDMB’s Youth Empowerment Programme for the North East
and is designed to train and empower youths in high impact economic sectors such as
ICT, Agriculture and construction.

The training is conducted in partnership with the National Information Technology

Agency (NITDA) and the learning centres will be located at the Federal University,
Gashua, Yobe State; Federal Polytechnic, Damaturu, Yobe State; Atiku Abubakar
College of Legal Studies, Nguru, Yobe State and the Federal College of Education,
Potiskum, Yobe State.

In his remarks at the virtual event, the Senate President described the programme as a
landmark effort in the Federal Government’s commitment to uplift the wellbeing of
youths which constitute key part of the nation’s population.
He noted that GSM devices are growing in sophistication as important communication
tools, just as users are multiplying by the day, such that any person that is skilled in
repairs will have continuous patronage.

He canvassed for increased budgetary allocation for the youth population and creative
engagement, to enable them contribute meaningfully to the economy and stay away
from crime, which is often the result of idleness.

Lawan also praised the synergy between NCDMB and (NITDA) in jointly organizing
the training, assuring that the Senate would continue to provide legislative impetus for
collaborations amongst government agencies in the delivery of their mandate.

In his welcome address, the Executive Secretary of NCDMB, Engr. Simbi Kesiye Wabote
explained that the Board is charged with developing local talents, facilities and assets
that support the oil and gas operations and its linkage sectors but it had realised that
the oil industry is incapable of absorbing all local talents even at peak capacity, hence
the conceptualization of strategic youth empowerment programme.

He said the GSM programme would entail classroom phase, software and hardware
modules, entrepreneurship development phase where trainees will benefit from starter
packs and renting and furnishing of shops for apprenticeship and market linkage
opportunities.

The Board would also sponsor mentorship and business development support to
facilitate participant’s entry into the business world as SMEs and payment of stipends
during the training, apprenticeship and mentorship phases.

He assured that the model has worked effectively in previous trainings sponsored by
the Board.

On why the Board decided on GSM Training, Wabote stated that “since the GSM
revolution in 2001, the ICT sector has evolved as a major contributor to employment,
wealth creation, technology development and innovation. The ICT sector has grown its
contribution to the Gross Domestic Product (GDP) from about three percent in 2001 to
11 percent in 2019.”

He also hinted that the event further amplifies Nigerian Content outreach to Nigerians
irrespective of state of origin or residence. He further called on youths from the North
East with qualification relevant to the oil and gas industry to register on the Nigerian
Oil and Gas Industry Joint Qualification System (NOGICJQS), to stand a chance of
being selected for training and employment opportunities.

In his goodwill message at occasion, the Honorable  Minister of State for Petroleum

Resources, Chief Timipre Sylva stated that the Training and Empowerment programme
falls within the Ministry’s priority areas of contributing to President Muhammadu
Buhari’s aspiration to free 100 million Nigerians from poverty by 2030

Senate President Flags Off NCDMB’s GSM Training For 1,000 Youths
Leave a Comment / Press Releases / By ncdmb
The Senate President, Dr. Ahmad Ibrahim Lawan on Thursday opened the training
sponsored by the Nigerian Content Development and Monitoring Board (NCDMB) for
1,000 youths from Yobe State, focussing on GSM phone repairs, hardware, software,
and entrepreneurship development.

The training is part of NCDMB’s Youth Empowerment Programme for the North East
and is designed to train and empower youths in high impact economic sectors such as
ICT, Agriculture and construction.
The training is conducted in partnership with the National Information Technology
Agency (NITDA) and the learning centres will be located at the Federal University,
Gashua, Yobe State; Federal Polytechnic, Damaturu, Yobe State; Atiku Abubakar
College of Legal Studies, Nguru, Yobe State and the Federal College of Education,
Potiskum, Yobe State.

In his remarks at the virtual event, the Senate President described the programme as a
landmark effort in the Federal Government’s commitment to uplift the wellbeing of
youths which constitute key part of the nation’s population.

He noted that GSM devices are growing in sophistication as important communication

tools, just as users are multiplying by the day, such that any person that is skilled in
repairs will have continuous patronage.

He canvassed for increased budgetary allocation for the youth population and creative
engagement, to enable them contribute meaningfully to the economy and stay away
from crime, which is often the result of idleness.

Lawan also praised the synergy between NCDMB and (NITDA) in jointly organizing
the training, assuring that the Senate would continue to provide legislative impetus for
collaborations amongst government agencies in the delivery of their mandate.

In his welcome address, the Executive Secretary of NCDMB, Engr. Simbi Kesiye Wabote
explained that the Board is charged with developing local talents, facilities and assets
that support the oil and gas operations and its linkage sectors but it had realised that
the oil industry is incapable of absorbing all local talents even at peak capacity, hence
the conceptualization of strategic youth empowerment programme.

He said the GSM programme would entail classroom phase, software and hardware
modules, entrepreneurship development phase where trainees will benefit from starter
packs and renting and furnishing of shops for apprenticeship and market linkage
opportunities.

The Board would also sponsor mentorship and business development support to
facilitate participant’s entry into the business world as SMEs and payment of stipends
during the training, apprenticeship and mentorship phases.

He assured that the model has worked effectively in previous trainings sponsored by
the Board.
On why the Board decided on GSM Training, Wabote stated that “since the GSM
revolution in 2001, the ICT sector has evolved as a major contributor to employment,
wealth creation, technology development and innovation. The ICT sector has grown its
contribution to the Gross Domestic Product (GDP) from about three percent in 2001 to
11 percent in 2019.”

He also hinted that the event further amplifies Nigerian Content outreach to Nigerians
irrespective of state of origin or residence. He further called on youths from the North
East with qualification relevant to the oil and gas industry to register on the Nigerian
Oil and Gas Industry Joint Qualification System (NOGICJQS), to stand a chance of
being selected for training and employment opportunities.

In his goodwill message at occasion, the Honorable  Minister of State for Petroleum
Resources, Chief Timipre Sylva stated that the Training and Empowerment programme
falls within the Ministry’s priority areas of contributing to President Muhammadu
Buhari’s aspiration to free 100 million Nigerians from poverty by 2030.