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10 - Acceleration and Vibration Measurement - Sensors

1) An accelerometer uses a mass connected to a housing through a spring and damper to measure acceleration. As the object accelerates, the mass experiences relative motion compared to the housing. 2) The relative motion is measured by a displacement transducer, and the output can be related to the absolute acceleration of the object. Piezoelectric elements are commonly used as the sensing component. 3) An ideal accelerometer is designed to have a unity amplitude ratio and linear phase response over a wide frequency range. This allows the measured relative displacement to directly correspond to the input acceleration.

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0% found this document useful (0 votes)
102 views28 pages

10 - Acceleration and Vibration Measurement - Sensors

1) An accelerometer uses a mass connected to a housing through a spring and damper to measure acceleration. As the object accelerates, the mass experiences relative motion compared to the housing. 2) The relative motion is measured by a displacement transducer, and the output can be related to the absolute acceleration of the object. Piezoelectric elements are commonly used as the sensing component. 3) An ideal accelerometer is designed to have a unity amplitude ratio and linear phase response over a wide frequency range. This allows the measured relative displacement to directly correspond to the input acceleration.

Uploaded by

KARTHIK S S
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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MECHATRONICS

ACCELERATION & VIBRATION MEASUREMENT


SENSORS
PUSHPARAJ MANI PATHAK
MECHANICAL & INDUSTRIAL ENGINEEING, IIT ROORKEE

1
Introduction

• An accelerometer is a sensor designed to measure acceleration, or


rate of change of speed, due to motion, vibration, and impact
events.
• Accelerometers are normally mechanically attached or bonded to
an object or structure for which acceleration is to be measured.
• The accelerometer detects acceleration along one axis and is
insensitive to motion in orthogonal directions.
• Strain gages or piezoelectric elements constitute the sensing
element of an accelerometer, converting acceleration into a voltage
signal.
MIED, IITR 2
Vibration and Acceleration Measurement

• The design of an accelerometer is based on the Accelerometer Displacement


inertial effects associated with a mass connected housing transducer
to a moving object through a spring, damper, and
displacement sensor.
• As object accelerates, there is relative motion Seismic
𝑥𝑜
between the housing and the seismic mass. mass (m)
• A displacement transducer senses the relative
motion. k c
• From frequency response analysis one can relate 𝑥𝑖
the displacement transducer output to either the
Vibrating object
absolute position or acceleration of the object.
3
Frequency Response of the Accelerometer

• Relative displacement (𝑥𝑟 ) between the seismic mass


and the object is 𝑥𝑟 = 𝑥𝑜 - 𝑥𝑖
• Using Newton’s second law, the equation of motion for 𝑥𝑜 m
the seismic mass is
𝑚𝑥ሷ 𝑜 = −𝑘𝑥𝑟 − 𝑐 𝑥ሶ 𝑟
𝑚(𝑥ሷ 𝑟 +𝑥ሷ 𝑖 ) = −𝑘𝑥𝑟 − 𝑐 𝑥ሶ 𝑟 𝑘𝑥𝑟 𝑐𝑥ሶ 𝑟
𝑚𝑥ሷ 𝑟 + 𝑐 𝑥ሶ 𝑟 + 𝑘𝑥𝑟 = −𝑚𝑥ሷ 𝑖
Free body diagram
• This 2nd order differential equation relates the
measured relative displacement 𝑥𝑟 to the input
displacement 𝑥𝑖

MIED, IITR 4
• 𝑚𝑥ሷ 𝑟 + 𝑐 𝑥ሶ 𝑟 + 𝑘𝑥𝑟 = −𝑚𝑥ሷ 𝑖 • For a frequency response
analysis, let the i/p
𝑐 𝑘 displacement is 𝑥𝑖 𝑡 =
• 𝑥ሷ 𝑟 + 𝑥ሶ 𝑟 + 𝑥 = −𝑥ሷ 𝑖
𝑚 𝑚 𝑟 𝑋𝑖 sin 𝜔𝑡 (of sinusoidal
𝑘 form)
• Let us define 𝜔𝑛2 = and • Since the system is linear, the
𝑚
𝑐2 𝑐 resulting relative o/p
𝜁2 = then 𝜁 = displacement will be 𝑥𝑟 𝑡 =
4𝑚𝑘 2 𝑚𝑘
𝑋𝑟 sin 𝜔𝑡 + 𝜙 (sinusoidal of
• 𝑥ሷ 𝑟 + 2𝜁𝜔𝑛 𝑥ሶ 𝑟 + 𝜔𝑛2 𝑥𝑟 = −𝑥ሷ 𝑖 the same frequency but
different phase)

5
• 𝑥ሷ 𝑟 + 2𝜁𝜔𝑛 𝑥ሶ 𝑟 + 𝜔𝑛2 𝑥𝑟 = −𝑥ሷ 𝑖 𝑋𝑟 𝜔/𝜔𝑛 2
• = 𝜔 2
𝑋𝑖
• Take Lapalce of both sides 1−
𝜔𝑛
+𝑗(2𝜁𝜔/𝜔𝑛 )

𝑋𝑟 𝑠2 • Simplifying
• = − 2 2
𝑋𝑖 𝑠 +2𝜁𝜔𝑛 𝑠+𝜔𝑛
𝜔 2
• Replace 𝑠 = 𝑗𝜔 and simplify 𝑋𝑟 𝜔𝑛2 1−
𝜔𝑛
−𝑗(2𝜁𝜔/𝜔𝑛 )
• = 2
𝑋𝑟 𝜔2 𝑋𝑖 𝜔 2 𝜔 2
1− +(2𝜁𝜔/𝜔𝑛 )2
• = 2 𝜔𝑛
𝑋𝑖 −𝜔2 +𝑗(2𝜁𝜔𝑛 𝜔)+𝜔𝑛

6
• Writing the real and imaginary portion separately
𝜔 2
𝑋𝑟 𝜔𝑛2 1− (2𝜁𝜔/𝜔𝑛 )
𝜔𝑛
• = 2 −𝑗 2
𝑋𝑖 𝜔 2 𝜔 2 𝜔 2
1− +(2𝜁𝜔/𝜔𝑛 )2 1− +(2𝜁𝜔/𝜔𝑛 )2
𝜔𝑛 𝜔𝑛

• The amplitude ratio and phase angle can be found as


𝑋𝑟 𝜔/𝜔𝑛 2 (2𝜁𝜔/𝜔𝑛 )
• = ; 𝜙 = − tan−1 𝜔 2
𝑋𝑖 2 1−
𝜔 2 𝜔𝑛
1− +(2𝜁𝜔/𝜔𝑛 )2
𝜔𝑛

7
• To relate the relative output displacement signal 𝑥𝑟 to the input
acceleration 𝑥ሷ 𝑖
• 𝑥𝑖 𝑡 = 𝑋𝑖 sin 𝜔𝑡
• 𝑥ሷ 𝑖 𝑡 = −𝜔2 𝑋𝑖 sin 𝜔𝑡
• So amplitude of input acceleration is 𝜔2 𝑋𝑖 , so rewriting amplitude
ratio expression as
2
𝑋𝑟 𝜔𝑛 1
• = = 𝐻𝑎 (𝜔) so,
𝑋𝑖 𝜔2 2
𝜔 2
1− +(2𝜁𝜔/𝜔𝑛 )2
𝜔𝑛

8
Phase response of an
ideal accelerometer

Amplitude response of an ideal


accelerometer

9
• If we design the accelerometer so that 𝐻𝑎 (𝜔) ≈ 1 over a large
frequency range, then
• 𝑋𝑖 𝜔2 = 𝑋𝑟 𝜔𝑛2 /𝐻𝑎 (𝜔) becomes 𝑋𝑖 𝜔2 = 𝑋𝑟 𝜔𝑛2 i.e.,
• Input acceleration amplitude= 𝜔𝑛2 (relative displacement amplitude)
• The largest frequency range resulting in a unity amplitude ratio
occurs when the 𝜁= 0.707 and the 𝜔𝑛 is as large as possible.
• Also, a 𝜁 = 0.707 results in the best phase linearity for the system.
• One can make the natural frequency large by choosing a small
seismic mass and a large spring constant as 𝜔𝑛 = 𝑘/𝑚.

MIED, IITR 10
• Thus we can have small package common to commercial
accelerometers.
• Equation 𝑋𝑖 𝜔2 = 𝑋𝑟 𝜔𝑛2 applies to every frequency component lying
within the bandwidth of the sensor.
• If an arbitrary i/p composed of a number of frequencies that lie
within the bandwidth, each frequency contributes to the signal
according to Equation 𝑋𝑖 𝜔2 = 𝑋𝑟 𝜔𝑛2 .
• So, the total acceleration, due to all frequency components, is also
directly related to the total measured relative displacement, i.e.,
• 𝑥ሷ 𝑖 𝑡 = 𝜔𝑛2 𝑥𝑟 (𝑡)
11
Vibrometer
• The same spring-mass-damper
configuration used to measure
acceleration can also be
designed to measure
displacement.
𝑋𝑟
• Let us define 𝐻𝑑 (𝜔) =
𝑋𝑖
𝑋𝑟
• So 𝑋𝑖 =
𝐻𝑑 (𝜔)
• If we design the vibrometer so
that 𝐻𝑑 (𝜔) ≈ 1 over a large Amplitude response of a
frequency range, then 𝑋𝑖 = 𝑋𝑟 Vibrometer

12
• The largest frequency range resulting
in a 𝐻𝑑 (𝜔) ≈ 1 occurs when the 𝜁=
0.707 and the natural frequency 𝜔𝑛 is
as small as possible.
• We can make the natural frequency
small by choosing a large seismic mass
and a small spring constant as 𝜔𝑛 =
𝑘/𝑚.
• This is why seismographs which
measure motion due to an earthquake
has large mass.

13
Piezoelectric Accelerometer
Accelerometer
housing Damper
• The highest quality Preloaded
accelerometers use spring
piezoelectric crystal.
• When the vibrating object Mass
experiences acceleration, Conductive
relative displacement occurs Piezo-
coating crystal
between the object and the
mass due to the inertia of the Vibrating object
mass.
14
• The resulting strain in the piezoelectric
crystal causes a displacement charge
between the crystal conductive coatings
as a result of the piezoelectric effect.
• This accelerometer requires no external
power supply.
• It measures acceleration in the mounted Commercially
direction (along the axis of spring) available piezoelectric
accelerometer

15
• Piezoelectric crystal is effectively a capacitor
and a charge source that generates a charge Equivalent circuit for
q across the capacitor plates proportional to piezoelectric crystal.
the deformation of the crystal.
• Representing the accelerometer by a
Thevenin equivalent circuit the open circuit
𝑞
voltage V is 𝑉 =
𝐶𝑝
• Typically q is in the picocoulomb range, and Thevenin equivalent of
𝐶𝑝 in the picofarad range. piezoelectric crystal.
16
• The sensitivity of the accelerometer is the ratio of the charge output to
the acceleration of the housing expressed in pC/g, (rms pC)/g, or (peak
pC)/g, where g is the acceleration due to gravity.
• The o/p of the accelerometer is attached to a charge amplifier, which
converts the displacement charge on the crystal to a voltage that can be
measured.
• Accelerometers are calibrated in millivolts/ g for a specified charge
amplifier.
• In general, piezoelectric accelerometers cannot measure constant or
slowly changing accelerations.
• But they are excellent for dynamic measurements such as vibration and
impacts.

17
Seminconductor Sensor and Microelectromechanical
(MEM) Devices
• Technique of producing IC’s developed new class
semiconductor sensors and actuators called MEM devices.
• In 1980 first MEM sensor was developed using IC technology
to etch silicon and produce a device that responds to
acceleration.
• It consists of tiny silicon cantilever with integrated
semiconductor strain gauge.
• Acceleration deflects the cantilever (due to inertia) and strain
gauge sense the magnitude of acceleration.

MIED, IITR 18
• MEM accelerometers are now used in automobiles to control
airbag systems.
• MEM sensors include pressure sensors for automobile tire
pressure monitoring systems (TPMS).
• MEM sensors also include accelerometers and gyros for
detecting orientation and motion of video game and TV
controllers and portable electronic devices (e.g., smart
phones & cameras).

19
• IC’s are made by a series of processes consisting of
– Photoresist lithographic layering.
– Light exposure
– Controlled chemical etching.
– Vapour deposition.
– Doping.
• Chemical itching process is important because tiny mechanical
devices can be created by a technique known as micromachining.
• Using carefully designed masks and timed immersion in chemical
baths, microminiature version of accelerometers, static electric
motor, and hydraulic or gas driven motors can be formed.

MIED, IITR 20
• Semiconductor sensor designs are based on different
electromagnetic properties of doped silicon and gallium arsenide
and the variety of ways they function in different physical
environments.
• The piezoresistive characteristic of doped silicon, the coupling
between resistance change and deformation, is the basis for
semiconductor strain gauges and pressure sensors.
• The piezoresistive effect describes the changing electrical
resistance of a material due to applied mechanical stress.
• The piezoresistive effect differs from the piezoelectric effect.
21
• In contrast to the piezoelectric effect, the piezoresistive effect only causes
a change in resistance; it does not produce an electric potential.
• The magnetic characteristic of doped silicon, principally the Hall effect, are
the basis of semiconductor magnetic transistors where the collector
current can be modulated by an external magnetic field.
• Electromagnetic waves and nuclear radiation induce electrical effects in
semiconductors forming the basis of light color sensor and other radiation
detectors.
• The thermal properties of semiconductors are the basis for themistors,
thermal conductivity sensors, humidity sensors, and temperature sensor
IC’s.
MIED, IITR 22
Surface Acoustic Waves (SAW)
Interdigital
transducer Reflector grating
• Important class of MEM sensor
• Consists of flat piezoelectric
substrate with metallic
patterns lithographically
deposited on the surface. Piezoelectric
substrate
• These patterns form Antenna
interdigital transducer (IDT)
and reflection coupler grating.
Transmitted pulse Reflected signal
pattern
23
• An interdigital transducer (IDT), or interdigitated transducer, is a device
which consists of two interlocking comb-shaped metallic coatings (in the
fashion of a zipper) which are applied to a piezoelectric substrate, such as
quartz or lithium niobite. IDTs are primarily used to convert microwaves to
surface acoustic waves (SAW).
• An input signal applied to an interdigital transducer excites a deformation
in the piezoelectric substrate generating an acoustic wave that propagates
on the surface.
• Conversely a SAW can induce a voltage in an interdigital transducer (IDT)
resulting in o/p signal.

MIED, IITR 24
Example

• A wireless identification system.


• Device is used in automatic highway toll both to identify the vehicles.
• MMS (Micro measurement system) has sensors, signal processing circuit,
together with a hybrid circuit that has transducer, A/D converters,
programmable memory and microprocessors.
• A transmitter sends out a pulse that is received by the passive SAW device
via antenna.
• The resulting SAW wave is reflected as a pattern of pulses unique to the
spacing within the reflector grating.
• The pulses are retransmitted through the same antenna back to the
receiver allowing the identification of SAW device.
MIED, IITR 25
• Silicon micromachining technology has helped the development of
many microsensors.
• Vision microsensors have found applications in medical technology.
• A fiberscope of approximately 0.2 mm in diameter has been developed
to inspect flaws inside tubes.
• A microtactile sensor, which uses laser light to detect the contact
between a catheter and the inner wall of blood vessels during insertion
that has sensitivity in the range of 1 mN.
• Similarly, the progress in the area of nanotechnology has led the
development of nanosensors. This helped in miniaturization and are
expected to open new avenues for sensing applications.

MIED, IITR 26
References

• D.G. Alciatore & Michael B. Histand, Introduction to


Mechatronics, Mc Graw Hill, 2014.

27
Thank You

28

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