INFORMATION SHEET 1.3.

Learning Outcome No. 3

MOUNT AND SOLDER ELECTRONIC COMPONENTS

Objectives:

At the end of this module the trainees will be knowledgeable and skilled in
the proper mounting, soldering and de-soldering electronic components in the
Printed Circuit Board.

MOUNTING

In recent years, semiconductor packaging has evolved with an increased demand for
greater functionality, smaller size, and added utility. A modern PCBA design has two
main methods for mounting components onto a PCB: Through-Hole
Mounting and Surface Mounting.  

Through-Hole Mounting (THM):

Through-hole mounting is the process by which component leads are placed into
drilled holes on a bare PCB. The process was standard practice until the rise of
surface mount technology (SMT) in the 1980s, at which time it was expected to
completely phase out through-hole. Yet, despite a severe drop in popularity over the
years, through-hole technology has proven resilient in the age of SMT, offering a
number of advantages and niche applications: namely, reliability.  

Through-hole components are best used for high-reliability products that require
stronger connections between layers. Whereas SMT components are secured only
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by solder on the surface of the board, through-hole component leads run through the
board, allowing the components to withstand more environmental stress. This is why
through-hole technology is commonly used in military and aerospace products that
may experience extreme accelerations, collisions, or high temperatures. Through-
hole technology is also useful in test and prototyping applications that sometimes
require manual adjustments and replacements.

Overall, through-hole’s complete disappearance from PCB assembly is a wide

misconception. Barring the above uses for through-hole technology, one should
always keep in mind the factors of availability and cost. Not all components are
available as SMD packages, and some through-hole components are less
expensive.

However, that doesn’t negate that fact that, in a modern assembly facility, through-
hole is considered a secondary operation.

Axial vs. Radial Lead Components

There are two types of through-hole components: axial and radial lead components.
Axial leads run through a component in a straight line ("axially"), with each end of the
lead wire exiting the component on either end. Both ends are then placed through
two separate holes in the board, allowing the component to fit closer, flatter fit.
Radial lead components, on the other hand, protrude from the board, as its leads are
located on one side of the component.

Both through-hole component types are "twin" lead components, and both have their
distinct advantages. While axial lead components are used for their snugness to the
board, radial leads occupy less surface area, making them better for high density
boards. Generally, axial lead configuration may come in the form of carbon resistors,
electrolytic capacitors, fuses, and light-emitting diodes (LEDs). Radial lead
components are available as ceramic disk capacitors.  

Advantages: THM provides stronger mechanical bonds than SMT, making through-

hole ideal for components that might undergo mechanical stress, such as connectors
or transformers. Good for test and prototyping. 

Disadvantages: On the bare PCB side, THM requires the drilling holes, which
is expensive and time consuming. THM also limits the available routing area on any
multilayer boards, because the drilled holes must pass through all the PCB’s layers.
On the assembly side, component placement rates for THM are a fraction of surface
mount placement rates, making THM prohibitively expensive. Further, THM requires
the use of wave, selective, or hand-soldering techniques, which are much less
reliable and repeatable than reflow ovens used for surface mount. Most of all,
through-hole technology requires soldering on both sides of the board, as opposed
to surface-mounts, which only -- for the most part -- require attention to one side of
the board. 

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Surface Mount Technology (SMT):

SMT the process by which components are mounted directly onto the surface of the
PCB. Known originally as “planar mounting,” the method was developed in the 1960s
and has grown increasingly popular since the 1980s. Nowadays, virtually all
electronic hardware is manufactured using SMT. It has become essential to PCB
design and manufacturing, having improved the quality and performance of PCBs
overall, and has reduced the costs of processing and handling greatly.  

The key differences between SMT and through-hole mounting are (a) SMT does not
require holes to be drilled through a PCB, (b) SMT components are much smaller,
and (c) SMT components can be mounted on both side of the board. The ability to fit
a high number of small components on a PCB has allowed for much denser, higher
performing, and smaller PCBs.

Through-hole component leads, which run through the board and connect a board’s
layers, have been replaced by "vias" -- small components which allow a conductive
connection between the different layers of a PCB, and which essentially act as
through-hole leads. Some surface mount components like BGAs are higher
performing components with shorter leads and more interconnection pins that allow
for higher speeds. 

Nomenclature

There are perhaps too many terms that describe different aspects of surface mount
technology. Here’s what they mean:

 SMA (surface-mount assembly) – a build or module assembled using SMT.

 SMC (surface-mount components) – components for SMT.
 SMD (surface-mount devices) – active, passive, and electromechanical
components.
 SME (surface-mount equipment) – machines used for SMT.
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 SMP (surface mount packages) – SMD case forms.
 SMT (surface-technology) – the act and method of assembling and mounting
electronic technology.

COMMON OF SURFACE MOUNT DEVICES (SMDS)

The taxonomy of surface mount devices (SMDs) is so expansive and ever-changing

that covering it in full would be impossible. But here are several types that are very
common and very important to know.

MELF (Metal Electrode Face Bonded): Consisting of two terminals bonded to a

cylindrical body, these SMD components are less expensive than flat chips but
require special handing during assembly. Furthermore, one of their biggest
disadvantages is their tendency to roll off solder pads during assembly. Generally
speaking, they come in the form of diodes, resistors, and capacitors.

SOT Transistors and Diodes: These are usually rectangular and easy to place,
though they're a bit outdated. The most common SOTs are SOT 23, SOT 89, SOT
143, and SOT 223. Its most common packaging is tape & reel.

INTEGRATED CIRCUITS (ICS):

Small outline Integrated Circuit (SOIC) – These are good SMT alternatives
to the duel in-line package (DIP), due to their dramatically reduced size. In general,
they take up 30 – 50% less space and 70% less thickness than an average DIP.

Thin Small Outline Package (TSOP) – TSOPs are low profile packages with fine-
pitch leads. TSOPs are typically meant to accommodate large silicon chips in high
density packages (RAM or flash memory ICs), largely because of their low
volume/high pin count.

Quad Flat Pack (QFN) – QFNs are high lead count packages (44 – 304). Its leads
are typically gull wing. There are many kinds of QFNs, and they are one of the most
common surface-mount ICs.

Plastic Leaded Chip Carrier (PLCC) - Connections are made on all four edges of a
square package with a relatively high pin count. PLCCs can have roughly 18 – 100
leads (usually J-leads). Many of them can fit into IC sockets and can be easily
replaced in the field. PLCCs have long been a popular option.  

Lead-less Chip Carrier (LCC) – Not to be confused with PLCC, LCCs have no
leads. Rather, LCCs are soldered directly onto PCBs by their (castellation) solder
pads. These are usually designed for Mil Spec because, with no leads to damage,
they're quite "rugged." LCCs are great for high temperature and aerospace
applications.  

Pin Grid Array (PGA) – PGAs are typically square or rectangular, with pins
arranged underneath the package. They're design was highly influential on the now
ubiquitous BGA. 
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Flip Chip – Flip chips are bare die packages, with small bottom-side solder bumps
that act as leads. They are soldered directly onto the PCB.

Ball Grid Array (BGA) – BGAs are perhaps one of the best performing SMT
packages in use today, due to their high densities. The BGA is a descendent of the
PGA, yet instead of pins, it has solder balls that can be placed directly onto the PCB.
Because of their high density, BGAs are typically used to house microprocessors.

Advantages: SMT allows for smaller PCB size, higher component density, and more
real estate to work with. Because fewer drilling holes are required, SMT allows for
lower cost and faster production time. During assembly, SMT components can be
placed at rates of thousands—even tens of thousands—of placements per hour,
versus less than a thousand for THM. Solder joint formation is much more reliable
and repeatable using programmed reflow ovens versus through techniques. SMT
has proven to be more stable and better performing in shake and vibration
conditions.

Disadvantages: SMT can be unreliable when used as the sole attachment method

for components subject to mechanical stress (i.e. external devices that are frequently
attached or detached).

Overall, surface mounting will almost always prove more efficient and cost-effective
than through-hole mounting. It is used in more than 90 percent of PCBAs today.
However, special mechanical, electrical, and thermal considerations will continue to
require THM, keeping it relevant well into the future.

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 BASIC SOLDERING PROCEDURE

Check that your soldering iron tip is suitable for the Project. (no larger than the
diameter of the pad).
Check the tip is clean and shiny. If not, tin it by adding a small amount of solder to the
tip.

Adjust the temperature of the soldering station to 350 0 C (degrees Celsius )

Ensure the solder sponge is damp. A dry sponge will not clean the tip effectively, and
one that is too wet will lower the temperature of the tip making for an ineffective
solder joint.
Carefully wipe the tip on the damp sponge until clean. Continually wipe the tip while
soldering a circuit board.
Bend the lead of the component
using fine pliers so that it easily
slides into the holes of the printed
circuit pad.

Insert the component to be soldered into the circuit board and bend the leads
protruding from the bottom of the circuit board at an angle of approx 45 0.

Cut the leads of the component close to the outer edge of the solder pad.

When ready, hold the soldering iron at a 45° angle, and heat both the lead and the
pad simultaneously. Touch the solder wire in the space between the iron tip and the
lead.

Keep the soldering iron tip still while moving the solder around the joint as it melts.

Remove the solder tip first and the solder wire next, (prevents spiking).
Allow to the joint to cool naturally and undisturbed, do not blow on the solder joint to
cool it.
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When you have completed all solder joints thoroughly clean your board, using
Isopropyl Alcohol, and a bristle brush, to remove the flux residue and other
contaminants.

Wipe or pat dry with a lint free tissue to remove traces of residue.

Inspect for a good solder connection. The solder joint should be clean, smooth and
shiny.

The solder fillet should be concave in shape, feathering out smoothly to the edge of
the pad. In the diagram below figure b) is the ideal solder joint.

Figure a) the amount of solder applied is minimal and may result in a poor electrical
connection over time.

Figure c) indicates an excessive amount of solder has been applied to the

connection. This may damage the solder pad due to excessive heat applied.

Leave a large blob of solder on the tip when switching the iron off as this will protect
the tip from oxidation and contamination.

DISASSEMBLY AND ASSEMBLY OF THE CIRCUIT

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 DESOLDERING

At some stage, you will probably need to de-solder a joint to remove or

reposition a wire or component. The easiest and most common way is the use of de-
soldering pump. Shown below is the proper way of removing electronic components
from the circuit using a de-soldering tool.

Removing components in PCB using a de-soldering pump (solder sucker)

1. Set the pump by pushing the spring-loaded plunger down until it locks.

2. Apply both the pump nozzle and the tip of your soldering iron to the joint.

3. Wait a second or two for the solder to melt.

4. Then press the button on the pump to release the plunger and suck the molten
solder into the tool.

5. Repeat if necessary to remove as much solder as possible.

6. The pump will need emptying occasionally by unscrewing the nozzle.

After removing most of the solder from the joint(s), you may be able to remove the
wire or component lead straight away (allow a few seconds for it to cool). If the joint
does not come apart easily apply your soldering iron to melt the remaining traces of
solder at the same time as pulling the joint apart, taking care to avoid burning
yourself. Be careful in desoldering to be sure that no component is damaged during
the process.

The best way to solder surface mount devices (SMDs) onto printed circuit boards
(PCBs) is with a reflow oven, but when that's not possible, a hot-air station can be
successfully used.

Warning! Hot-air soldering, like all soldering, involves temperatures that may
exceed 500ºC, which can burn eyes, skin, furniture, draperies, clothing, etc. Be
very careful when soldering; eye protection is especially important. If any of the
actions in this article are unclear or seem risky to you, don't do them. Safety is
your first responsibility.
In order to get the most from this article, you should know the basics of
hand SOLDERING. You should be familiar with what constitutes a good solder
joint, different types of solder that may be used, and a few basic tools common to
electronic assembly. The knowledge gained by using a reflow oven is also
beneficial. 

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 TOOLS AND EQUIPMENT
The key piece of equipment for hot-air soldering is, of course, a hot-air rework
station. The unit shown in the photo below is the one used by the author; it is
available under a variety of brand names and was built in China. Its price is near
the bottom of the range, but it seems reasonably well-built and more than
adequate for hobbyist use. Professionals will likely use a more expensive station.
As you can see, it includes not only a hot-air soldering station but also a hand
soldering station, as well. There is a separate temperature control and digital
readout (in Celsius) for each tool; the hot-air station also has a dial for setting air
flow volume.
In addition to controlling the amount of air sent across the heating element in the
gun, the unit also includes three tips to use for aiming the hot air output. The photo
below shows the included nozzle sizes; other sizes and shapes are available as
accessories.
A few additional items are needed to effectively use a hot-air rework station. The
photo below contains examples of some of the most essential items.
 The syringe contains solder paste, which is a mixture of very small solder
particles and flux. Pressing on the syringe plunger forces the solder paste through
a blunt needle, which is often used to apply solder and flux directly to the PCB
pads before placing the surface mount components. Solder paste is also available
in small jars, from which the paste may be transferred to a syringe or applied
directly to the PCB using a very small tool to dip in the paste and dab on the pads.

 Solder wire is used (with a hand soldering iron) to touch up or clean up joints
that are shorted to adjacent pins or joints that are poorly connected.
 Isopropyl alcohol is used along with a soft toothbrush, cotton swabs, and/or a
cloth to clean the surface of PCBs before soldering and to remove flux residue
after soldering. The alcohol shown is almost 100% pure, but a lesser
concentration (such as 91% pure) can also be used if additional time is allowed
for the residual water to evaporate.
 Flux is necessary to obtain good flow and coverage of molten solder. In addition
to liquid flux (as shown), flux is also available in a pen-style applicator and in gel
form for application with a syringe and blunt needle.
 A pair of bent-nose tweezers is useful for handling SMDs; a vacuum pickup tool
is another option.
 Solder braid is used (with a hand soldering iron) to remove excess solder from
component leads, thereby eliminating shorts between pins. Solder braid is
available in different widths for various component sizes; both 2.0mm and 3.0mm
(shown) are useful.

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 THE PROCESS
The Test Board Area
Hot-air soldering is customarily used with surface-mount devices being attached to
printed circuit boards. The following descriptions use that method and focus on a
small section of a printed circuit board as shown below; the top photo shows
a board that has been populated and reflow soldered in an oven, and the bottom
photo shows the bare board.
 
As you see, there are only seven component locations shown in the photographs,
but the variety will be sufficient to demonstrate basic hot-air soldering
techniques: J1 is a mini-USB jack, R3 and R4 are 0805 resistors, C1, C4, and C5
are 0805 capacitors, and U1 is a TSSOP16 USB-to-UART converter.
Solder Paste Choice and Application
Solder paste is available in a variety of mixtures of metal, but the easiest to use is
approximately 60% tin and 40% lead. That is the configuration used in the pictures
and videos in this article, and is highly recommended. If you have experience
with and are comfortable using other solder types (lead-free, for example), feel
free to use them—but you will need to make adjustments to the process defined
herein.
After thoroughly cleaning the bare PCB with alcohol, the next step is solder
application. For the hobbyist, there are two primary methods of applying solder
paste to a PCB for surface mount devices: by hand with a syringe or a very small
spatula (think wooden toothpick) and by hand with a stencil.
The photo immediately below shows our test board with solder paste that was
applied with a syringe. In the case of the 0805 components, a dab of paste was
applied to each pad, but in the case of smaller pads, a strip of paste was applied
across the pads. (As will become more evident during the reflow process, there is
too much paste on every pad.)
The needles for dispensing solder paste are sized by gauge, with smaller numbers
representing smaller needles. Those potentially suitable for solder paste
application are from 14 through 20 gauge. The author prefers 16 gauge; anything
larger dispenses too much solder and anything smaller is very hard to force the
solder through. Hopefully, you will produce better results than those shown above.
Some "fill" needle examples are shown in the following photo; the sizes are coded
by the color of the plastic connector, but the color code varies from one supplier to
another. Note that the tips of the needles may be cut square or at an angle; the
author prefers square tips.
 

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SMD Parts Placement
The parts have been placed in their respective places in the two following
photographs. An obvious advantage of the board with the stencil-applied paste is
that the exact location of the pads is more apparent, which results in more
accurate component placement. A not-so-obvious advantage of the syringe-
applied paste is that the extra paste holds the parts more securely prior to
soldering.

ACTUAL HOT-AIR SOLDERING

There is a discussion of solder reflow profiles, which might be of interest to you. It
describes the four stages of reflow soldering and provides the times and
temperatures for each of the four stages when using a soldering reflow oven. The
four stages are: pre-heating, soaking, reflowing, and cooling. From a
wide perspective, these are applicable to reflow soldering with a hot-air station. 
The problem is that there are more variables in play when using a hot-air station
than when using a reflow oven. In addition to time and temperature, a handheld
hot-air gun involves several other factors, including the size of the nozzle, how far
the nozzle is held from the solder, the angle of the airflow from the nozzle to the
solder, the speed of the air coming from the nozzle, the speed at which the nozzle
is moved around over the areas to be soldered, and probably more factors not
recounted here.
Ideally, the gun should be held so that the nozzle opening is perpendicular to the
surface of the PCB and approximately 12mm (0.5") above it. Care should be taken
to aim the nozzle toward the pins/pads being soldered while avoiding the bodies of
the components as much as possible. Movement of the nozzle should be at as
even a pace as possible; however, larger pins/pads (such as those for the
mounting feet of J1) will require more hot air time than smaller pins/pads, and so
the nozzle will need to be moved over them more often. Generally, it is worthwhile
to mentally separate larger PCBs into smaller sections, and completely solder one
section before moving to the next. Experience will help to perfect these
techniques.
As a result of all these variables, hot-air soldering becomes very personalized—
each person develops their own combination of variables that seems to work best
for them. At the risk of alienating all the "scientific" readers, the term "style" comes
to mind.
The two videos that follow show the author soldering the two variants of the test
board section previously shown: one on which the solder paste was applied with a
syringe and the other on which it was applied with a stencil. Except for that
difference, the techniques and conditions used were intended to be identical; in
both cases, the temperature was set to 280°C, the air flow was set to 3, and the
8mm nozzle was used.

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Alas, vagaries still crept in, some of which could be blamed on the difficulty of
working a few centimeters under a camera lens and around three light stands and
a tripod. Nevertheless, there were unintentional differences in actions; watch the
two videos and take note of the differences.
 
Soldering Stencil-Pasted PCB:

The photo immediately below shows the results of the job done on the syringe-
pasted board. All the pads show too much solder, but only two components are
adversely affected. J1 has the top two or three pins bridged. U1 has pins 4, 5, and
6 bridged. Pins 9 and 10 are possibly not connected to the pads, and pins 11, 12,
13, and 14 are possibly bridged. Rework will definitely be required and probably
will be tedious.
 
The next photo shows the results of the job done on the stencil-pasted board. C1
was bumped during the soldering process but was pulled during the reflow process
closer to its intended position. C5, which was also bumped, was pulled during
reflow fully back where it belonged. J1 stayed in position despite being bumped,
thanks to the plastic pins that protrude from the bottom of the jack through holes in
the board. And U1 has no solder bridges or other functional problems despite
being slightly out of position.
For the sake of appearances, C1 should be moved to be on its pads—but even as
is, there are no solder problems that would cause a functional failure.
 
Rework of the Syringe-Pasted Board
Rework is a part of surface mount device soldering, and it was absolutely needed
on the syringe-pasted board. An attempt was made to clean the solder bridges
from U1 with copper braid, but was not successful. As a result, U1 was removed
as shown in the following video.

Removal of Old U1: 

After the removal of U1, the pads were cleared of solder with copper braid and the
area was cleaned of flux residue with isopropyl alcohol. Note that the shiny area
between pins 10 and 11 of U1 is not solder residue, but is a PCB trace that was
too short to be covered by the solder mask. In addition, the solder bridges between
the top three pins of J1 were cleared with copper braid before the two photos
below were taken.

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New U1 in Place and Being Soldered:
Because of the solder paste excess, bridges were created between some of the
pins of U1. The video below shows how to use solder braid to clear the bridges.
Note that fresh solder should be applied to the iron in order to get the best results
from the use of solder braid. The braid should be laid over the bridged pins and the
tinned iron turned almost parallel to the PCB as it is applied to the braid. It is
important to heat the braid with the iron and let the solder in the braid heat the
pins, as opposed to heating the bridged pins directly.
Clearing Bridges from Pins 1-8 and 9-16 of New U1: 
With the solder bridges cleared and the area around U1 cleaned of flux residue, it's
time for an inspection. Finally, the job passes as shown in the last video.

PROPER MOUNTING OF RESISTOR

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 Date Developed: Document No.
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PROPER MOUNTING OF CAPACITOR

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PROPER MOUNTING OF TRANSISTOR

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 SELF-CHECK 1.3-1

Learning Outcome No. 3

MOUNT AND SOLDER ELECTRONIC COMPONENTS

IDENTIFICATION: Identify the following pictures by writing capital C if it

implies proper mounting and W if not in then space provided.

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 ANSWER KEY 1.3-1

1. W
2. C
3. W
4. W
5. C
6. W
7. W
8. C
9. C
10. C

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AND SERVICING NC II Developed by: Page 18 of 22
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 TASK SHEET 1.3-1

Learning Outcome No. 3

MOUNT AND SOLDER ELECTRONIC COMPONENTS

MOUNTING AND SOLDERING ELECTRONIC COMPONENTS

Performance Objective:
Demonstrate proper mounting of different electronic semi-conductor devices in
the Printed Circuit Board
Tools, Supplies, Materials and Equipment:
• Supplies and materials
• Working area/bench
• Sufficient lighting and ventilation system
• Complete electronic supplies
Steps and Procedure
1. Prepare the tools, materials, and equipment need in soldering and de-
soldering
2. Apply knowledge of lead and lead-free soldering characteristics and
requirements in accordance with OH&S standards
2. Mount and solder components in accordance with soldering principles.
3. Apply soldering/desoldering techniques and procedures in accordance with
established standards and requirements.
4. Check and comply solder products with international standards and task
specifications
5. Present the output to the teacher for evaluation
Assessment Method:

Direct Observation/Demonstration

PERFORMANCE CRITERIA CHECKLIST 1.3-1

Date Developed: Document No.

Learning Outcome 3 on JUNE 2021 VCPC-EPAS02-CORE3
ELECTRONIC Date Revised: Issued by:
PRODUCTS ASSEMBLY B&B Academy
AND SERVICING NC II Developed by: Page 19 of 22
Revision #00
(ASSEMBLE
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 Learning Outcome No. 3
MOUNT AND SOLDER ELECTRONIC COMPONENTS

CRITERIA YES NO
Did you….
1. Knowledge of lead and lead-free soldering
characteristics and requirements are applied to
mounting and soldering process in accordance with
OH&S standards

2. Components are mounted and soldered in accordance

with soldering principles.

3. Soldering/Desoldering techniques and procedures are

applied in accordance with established standards and
requirements.

4. Soldered products are checked and complied with

international standards and task specifications

TABLE OF SPECIFICATIONS 1.3-1

Date Developed: Document No.
Learning Outcome 3 on JUNE 2021 VCPC-EPAS02-CORE3
ELECTRONIC Date Revised: Issued by:
PRODUCTS ASSEMBLY B&B Academy
AND SERVICING NC II Developed by: Page 20 of 22
Revision #00
(ASSEMBLE
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 Learning Outcome No. 3
MOUNT AND SOLDER ELECTRONIC COMPONENTS

TABLE OF SPECIFICATIONS

COMPREHENSION

APPLICATION
KNOWLEDGE # OF
% OF
OBJECTIVES/ CONTENT AREAS/
TOPICS ITEMS
TEST

Proper soldering Procedure 1 1 1 3 30%

Proper Mounting Tecniques 1 1 5 7 70%

TOTAL 2 2 6 10 100%

SOURCES
Date Developed: Document No.
Learning Outcome 3 on JUNE 2021 VCPC-EPAS02-CORE3
ELECTRONIC Date Revised: Issued by:
PRODUCTS ASSEMBLY B&B Academy
AND SERVICING NC II Developed by: Page 21 of 22
Revision #00
(ASSEMBLE
ELECTRONIC
PRODUCTS)
https://speag.swiss/products/dasy6/components/mounting-device-and-adaptors-2/

https://unix.stackexchange.com/questions/18925/how-to-mount-a-device-in-linux

https://vitux.com/how-to-manually-mount-unmount-a-usb-device-on-ubuntu/

http://www.electronicsandyou.com/blog/smd-surface-mount-electronic-components-
for-smt.html

Date Developed: Document No.

Learning Outcome 3 on JUNE 2021 VCPC-EPAS02-CORE3
ELECTRONIC Date Revised: Issued by:
PRODUCTS ASSEMBLY B&B Academy
AND SERVICING NC II Developed by: Page 22 of 22
Revision #00
(ASSEMBLE
ELECTRONIC
PRODUCTS)