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Dynasolve™ 185: Cleaning Applications: Product Usage Guidelines

Dynasolve 185 is a formulated solvent used to remove amine-cured epoxy systems in both electronic and industrial applications. It contains a proprietary blend that facilitates polymer removal without redepositing particles. The document provides information on applications, advantages, specifications, materials removed, usage guidelines and contact information.

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mario230991
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275 views2 pages

Dynasolve™ 185: Cleaning Applications: Product Usage Guidelines

Dynasolve 185 is a formulated solvent used to remove amine-cured epoxy systems in both electronic and industrial applications. It contains a proprietary blend that facilitates polymer removal without redepositing particles. The document provides information on applications, advantages, specifications, materials removed, usage guidelines and contact information.

Uploaded by

mario230991
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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Dynasolve™ 185

––– 
Amine‐cured Epoxy Cleaning Solvent
 

Dynasolve 185 is a formulated solvent used to remove amine‐cured epoxy systems in both electronic
and industrial applica ons. It contains a proprietary blend of ingredients that facilitate polymer
removal and prevent the deposi ng of par cles back onto a part.

CLEANING APPLICATIONS: PRODUCT USAGE GUIDELINES


Depo ng and decapsula ng of electronic components  (SEE SDS FOR EH&S INFORMATION)
Industrial epoxy removal and cleaning  1.  Heat Dynasolve 185 to 200°F (93°C) and immerse part.  
2.  Observe carefully. If epoxy appears unaffected a er 1 
hour, increase temperature to 250° – 300°F (121° – 148°C).  
ADVANTAGES:
3.  A er successful removal of epoxy, rinse with alcohol or 
More efficient than acetone, MEK & other solvents  water.  
Formulated to be highly selec ve  4.  If epoxy appears unaffected a er 2 hours, call for technical 
No chlorinated, acidic or caus c components  support.  
High resin loading capacity allows for reuse and reduced cost of 
ownership  MATERIAL COMPATIBILITY:
High flash point  Recommended materials including:
All metals 
SPECIFICATIONS: Teflon® 
Polyethylene & polypropylene 
Specific gravity:   1.04 
 
Boiling point:   > 369°F ( > 187°C) 
Avoid materials including:
Flash point:   207°F (97°C)  Viton® 
PVC 
Acrylic 
MATERIALS REMOVED:
Amine‐cured epoxy 
Many types of inks 
Acrylic emulsions 

Versum Materials Dynaloy technical support: (317) 788‐5694


 

For more informa on, please contact us at:  The informa on contained herein is offered without charge for use by technically  


qualified personnel at their discre on and risk. All statements, technical informa on 
VERSUM MATERIALS, LLC and recommenda ons contained herein are based on tests and data which we believe 
VERSUMMATERIALS.COM to be reliable, but the accuracy or completeness thereof is not guaranteed and no 
warranty of any kind is made with respect thereto. 

Versum and the Versum Materials logo are trademarks of Versum Materials, Inc. © 2017 Versum Materials, Inc.  325‐17‐054‐GLOBAL 

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