Sed1330F/1335F/1336F LCD Controller Ics Technical Manual: S-Mos Systems, Inc. September, 1995
Sed1330F/1335F/1336F LCD Controller Ics Technical Manual: S-Mos Systems, Inc. September, 1995
268-0.4 S-MOS Systems, Inc. • 2460 North First Street • San Jose, CA 95131 • Tel: (408) 922-0200 • Fax: (408) 922-0238 1
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Table of Contents SED1330F/1335F/1336F
CONTENTS
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SED1330F/1335F/1336F Table of Contents
3.3 Display Control Commands ......................................................................................................... 36
3.3.1 DISP ON/OFF ......................................................................................................... 36
3.3.1.1 D ........................................................................................................ 37
3.3.1.2 FC ...................................................................................................... 37
3.3.1.3 FP ...................................................................................................... 37
3.3.2 SCROLL ................................................................................................................. 37
3.3.2.1 C ........................................................................................................ 37
3.3.2.2 SL1, SL2 ............................................................................................ 38
3.3.3 CSRFORM.............................................................................................................. 42
3.3.3.1 CRX ................................................................................................... 42
3.3.3.2 CRY .................................................................................................... 42
3.3.3.3 CM ..................................................................................................... 43
3.3.4 CSRDIR .................................................................................................................. 43
3.3.5 OVLAY .................................................................................................................... 43
3.3.5.1 MX0, MX1 .......................................................................................... 43
3.3.5.2 DM1, DM2 .......................................................................................... 45
3.3.5.3 OV ...................................................................................................... 45
3.3.6 CGRAM ADR .......................................................................................................... 45
3.3.7 HDOT SCR ............................................................................................................. 45
3.3.7.1 D0 to D2 ............................................................................................. 45
3.4 Drawing Control Commands ....................................................................................................... 46
3.4.1 CSRW ..................................................................................................................... 46
3.4.2 CSRR ...................................................................................................................... 46
3.5 Memory Control Commands ....................................................................................................... 47
3.5.1 MWRITE ................................................................................................................. 47
3.5.2 MREAD ................................................................................................................... 47
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Table of Contents SED1330F/1335F/1336F
4.4.6 Oscillator timing ...................................................................................................... 60
4.4.6.1 SED1330F ......................................................................................... 60
4.4.7 Measurement circuit ............................................................................................... 61
4.5 SED1335/SED1336 AC Timing Diagrams ................................................................................... 62
4.5.1 8080 family Interface Timing ................................................................................... 62
4.5.1.1 SED1335F ......................................................................................... 62
4.5.1.2 SED1336F ......................................................................................... 63
4.5.2 6800 family Interface Timing ................................................................................... 64
4.5.2.1 SED1335F ......................................................................................... 65
4.5.2.2 SED1336F ......................................................................................... 65
4.5.3 Display Memory Read Timing ................................................................................. 66
4.5.3.1 SED1335F ......................................................................................... 66
4.5.3.2 SED1336F ......................................................................................... 67
4.5.4 Display Memory Write Timing ................................................................................. 68
4.5.4.1 SED1335F ......................................................................................... 69
4.5.4.2 SED1336F ......................................................................................... 70
4.5.5 SLEEP IN Command Timing .................................................................................. 71
4.5.5.1 SED1335F ......................................................................................... 71
4.5.5.2 SED1336F ......................................................................................... 71
4.5.6 External Oscillator Signal Timing ............................................................................ 72
4.5.6.1 SED1335F ......................................................................................... 72
4.5.6.2 SED1336F ......................................................................................... 72
4.5.7 E-1330 LCD Controller IC ........................................................................................................ 73
4.5.7.1 SED1335F ......................................................................................... 75
4.5.7.2 SED1336F ......................................................................................... 75
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SED1330F/1335F/1336F Table of Contents
6.0 Character Generator ........................................................................................ 95
6.1 CG Characteristics ...................................................................................................................... 97
6.1.1 Internal Character Generator .................................................................................. 97
6.1.2 External Character Generator ROM ....................................................................... 97
6.1.3 Character Generator RAM ...................................................................................... 97
6.2 CG Memory Allocation................................................................................................................. 98
6.3 Setting the Character Generator Address ................................................................................... 99
6.3.1 M1 = 1 ................................................................................................................... 100
6.3.2 CG RAM Addressing Example .............................................................................. 100
6.4 Character Codes ....................................................................................................................... 101
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Table of Contents SED1330F/1335F/1336F
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SED1330F/1335F/1336F Table of Contents
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1.0
Overview
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1.0 – 1.2 1.0 Overview
1.0 Overview
The SED1330/1335F/1336F is a family of versatile • Text, graphics and combined text/graphics dis-
LCD controller ICs that can display text and graphics play modes
on a medium size LCD panel. The software is • Three overlapping screens in graphics mode
compatible among all three chips. S-MOS recom-
• 640 × 256 pixel LCD panel display resolution
mends new designs use the SED1335 since the
SED1330 will gradually be replaced by the SED1335. • Programmable cursor control
• Smooth horizontal and vertical scrolling of all or
The SED1336F incorporates a TV sync generator part of the display
circuit that is compatible with both NTSC and PAL • 1/2-duty to 1/256-duty LCD drive
systems. The 256 × 200 pixel TV display comprises
three superimposed layers, and is identical to the • Up to 64 Kbytes of external static RAM frame
simultaneous LCD panel display. When driving an buffer memory
LCD only, up to 3 overlapping layers can be displayed • Internal character generator
on LCD panels up to 640 × 256 pixels in size. The • 160, 5 × 7 pixel characters in internal mask-
SED1330/1335F does not incorporate a TV controller. programmed character generator ROM
• Up to 64, 8 × 16 pixel characters in external
The SED1330/1335F/1336F can display layered text
character generator RAM
and graphics, scroll the display in any direction and
partition the display into multiple screens. • Up to 256, 8 × 16 pixel characters in external
character generator ROM
The SED1330/1335F/1336F stores text, character • 6800 and 8080 family microprocessor inter-
codes and bit-mapped graphics data in external frame faces
buffer memory. Display controller functions include
• NTSC and PAL systems compatible
transferring data from the controlling microprocessor
(SED1336F only)
to the buffer memory, reading memory data, convert-
ing data to display pixels and generating timing sig- • 256 × 200 pixel TV monitor display resolution
nals for the buffer memory, TV monitor and LCD (SED1336F only)
panel. • Low power consumption—3.5 mA operating
current (VDD = 3.5V), 0.05 µA standby current
The SED1330/1335F/1336F has an internal charac- • 4.5 to 5.5V (SED1330F)
ter generator with 160, 5 × 7 pixel characters in
internal mask ROM. The character generators sup- • 2.7 to 5.5V (SED1330F/1335F)
port up to 64, 8 × 16 pixel characters in external • 3.0 to 5.5V (SED1336F)
character generator RAM and up to 256, 8 × 16 pixel • Available in 60-pin QFPs
characters in external character generator ROM.
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1.0 Overview 1.3
1.3 Block Diagram
YSCL,YD,YDIS
VA0 to VA15
VR/W
XSCL, XECL
XD0 to XD3
VD0 to VD7
LP, WF
VCE
Input/Output
Video RAM Interface Register LCD Controller
RES
RD, WR
A0, CS
D0 to D7
OSC1 OSC2
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1.3 1.0 Overview
1.3 Block Diagram
XSCL, XECL
XD0 to XD3
VD0 to VD7
LP, WF
SNC
VSD
VRD,
VCE,
VWR
VWR
VRD
Input/Output TV
Video RAM Interface LCD Controller
Register Controller*
RES
RD, WR
A0, CS
D0 to D7
XG XD
*SED1336F only
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1.0 Overview 1.4 – 1.4.2
1.4 Pinouts
SEL1
SEL2
YSCL
XSCL
XECL
VWR
YDIS
RES
VCE
VA0
VA1
VA2
VA3
VA4
VA5
VA6
VA7
VD4
VD5
VD6
VD7
XD0
XD1
XD2
WR
XG
RD
NC
NC
NC
WF
VSS
YD
LP
45 31
VD3 46 30 XD3
XD 55 50 45 40 VA8 VD2 D7
CS VA9
VA10
VD1 D6
A0
VDD VA11 VD0 D5
D0 VA12 VA15 D4
D1 60 SED1330FBA 30 VA13 VA14 D3
VA13 SED1330FBB D2
1 Index VA12 D1
D2 29 NC
D3 VA14 VA11 D0
D4 VA15 Index VDD
VA10
D5 VD0 VA9 A0
D6 5 VD1 VA8 CS
6 10 15 20 VD2
VA7 OSC2
VA6 OSC1
60 16
NC 1 15 SEL 1
D7
XD3
XD2
XD1
XD0
XECL
XSCL
VSS
LP
WF
YDIS
YD
YSCL
VD7
VD6
VD5
VD4
VD3
VA5
VA4
VA3
VA2
VA1
VA0
VR/W
VCE
NC
RES
NC
NC
RD
WR
SEL 2
YSCL(SNC)
XECL(VSD)
XSCL
YDIS
VD4
VD5
VD6
VD7
XD0
XD1
XD2
WF
VSS
SEL1
SEL2
YD
VWR
LP
VRD
RES
VCE
VA0
VA1
VA2
VA3
VA4
VA5
VA6
VA7
WR
XG
RD
NC
NC
45 31
VD3 46 30 XD3
VD2 D7
XD 55 50 45 40 VA8 VD1 D6
CS VA9 VD0 D5
A0 VA10 VA15 D4
VDD VA11
D0 VA12
VA14 SED1335F0B D3
SED1335FOA VA13 (SED1336F0A) D2
D1 60 30 VA13
VA12 D1
1 Index VA11 D0
D2 29 NC Index
D3 VA14 VA10 VDD
D4 VA15 VA9 A0
D5 VD0 VA8 CS
D6 5 VD1 VA7 XD
6 10 15 20 VD2 VA6 XG
60 16
NC 1 15 SEL1
D7
XD3
XD2
XD1
XD0
XECL
XSCL
VSS
LP
WF
YDIS
YD
YSCL
VD7
VD6
VD5
VD4
VD3
VA5
VA4
VA3
VA2
VA1
VA0
VWR
VCE
VRD
RES
NC
NC(CLO)
RD
WR
SEL 2(NT/PL)
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1.4 – 1.4.2 1.0 Overview
1.5 Package Dimensions
55 35
14.0 ± 0.1
19.6 ± 0.4
60 30
1 Index
29
5
24
6 23
1.0 ± 0.1 0.35 ± 0.1
0.15 ± 0.05
2.7 ± 0.1
0 ~ 12°
1.5 ± 0.3
2.8
46 30
14.0 ± 0.2
17.6 ± 0.4
Index
60 16
1 15
0.15 ± 0.05
2.7 ± 0.1
0 ~ 12°
0.8 ± 0.3
1.8
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2.0
Pin Description
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2.0 Pin Description 2.0 – 2.1
2.0 Pin Description
Number
Name Type Description
SED1330F0A SED1330FBB
27 to 28 50 to 59
VA0 to VA15 Output VRAM address bus
30 to 43 1 to 6
VR/W 44 7 Output VRAM write signal
VCE 45 8 Output Memory control signal
RES 47 10 Input Reset
NC 29, 46, 48, 49 9, 11, 12, 60 — No connection
8080 family: Read signal
RD 50 13 Input
6800 family: Enable clock (E)
8080 family: Write signal
WR 51 14 Input
6800 family: R/W signal
8080 or 6800 family interface
SEL2 52 15 Input
select
8080 or 6800 family interface
SEL1 53 16 Input
select
OSC1 54 17 Input Oscillator connection
OSC2 55 18 Output Oscillator connection
CS 56 19 Input Chip select
A0 57 20 Input Data type select
VDD 58 21 Supply 4.5 to 5.5V supply
59 to 60
D0 to D7 22 to 29 Input/output Data bus
1 to 6
XD0 to XD3 10 to 7 33 to 30 Output X-driver data
XECL 11 34 Output X-driver enable chain clock
XSCL 12 35 Output X-driver data shift clock
VSS 13 36 Supply Ground
LP 14 37 Output Latch pulse
WF 15 38 Output Frame signal
Power-down signal when display is
YDIS 16 39 Output
blanked
YD 17 40 Output Scan start pulse
YSCL 18 41 Output Y-driver shift clock
VD0 to VD7 26 to 19 49 to 42 Input/output VRAM data bus
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2.0 – 2.2 2.0 Pin Description
2.0 Pin Description
Number
Name Type Description
SED1335F0A SED1335F0B
27 to 28 50 to 59
VA0 to VA15 Output VRAM address bus
30 to 43 1 to 6
VWR 44 7 Output VRAM write signal
VCE 45 8 Output Memory control signal
VRD 46 9 Output VRAM read signal
RES 47 10 Input Reset
NC 29, 48, 49 11, 12, 60 — No connection
8080 family: Read signal
RD 50 13 Input
6800 family: Enable clock (E)
8080 family: Write signal
WR 51 14 Input
6800 family: R/W signal
8080 or 6800 family interface
SEL2 52 15 Input
select
8080 or 6800 family interface
SEL1 53 16 Input
select
XG 54 17 Input Oscillator connection
XD 55 18 Output Oscillator connection
CS 56 19 Input Chip select
A0 57 20 Input Data type select
VDD 58 21 Supply 2.7 to 5.5V supply
59 to 60
D0 to D7 22 to 29 Input/output Data bus
1 to 6
XD0 to XD3 10 to 7 33 to 30 Output X-driver data
XECL 11 34 Output X-driver enable chain clock
XSCL 12 35 Output X-driver data shift clock
VSS 13 36 Supply Ground
LP 14 37 Output Latch pulse
WF 15 38 Output Frame signal
Power-down signal when display is
YDIS 16 39 Output
blanked
YD 17 40 Output Scan start pulse
YSCL 18 41 Output Y-driver shift clock
VD0 to VD7 26 to 19 49 to 42 Input/output VRAM data bus
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2.0 Pin Description 2.3
2.3 SED1336F0A Pin Summary
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2.4 – 2.4.3 2.0 Pin Description
2.4 Pin Functions
2.4.2 Oscillator
Note: SEL1 should be tied directly to VDD or V SS to prevent noise. If noise does appear on SEL1, decouple it to ground using a
capacitor placed as close to the pin as possible.
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2.0 Pin Description 2.4.3
When the 8080 family interface is selected, this signal acts as the active-LOW read strobe. The
SED1330F/1335F/1336F’s output buffers are enabled when this signal is active.
RD or E
When the 6800 family interface is selected, this signal acts as the active-HIGH enable clock.
Data is read from or written to the SED1330F/1335F/1336F when this clock goes HIGH.
When the 8080 family interface is selected, this signal acts as the active-LOW write strobe. The
bus data is latched on the rising edge of this signal.
WR or R/W When the 6800 family interface is selected, this signal acts as the read/write control signal. Data
is read from the SED1330F/1335F/1336F if this signal is HIGH, and written to the SED1330F/
1335F/1336F if it is LOW.
Chip select. This active-LOW input enables the SED1330F/1335F/1336F. It is usually
CS connected to the output of an address decoder device that maps the SED1330F/1335F/1336F
into the memory space of the controlling microprocessor.
This active-LOW input performs a hardware reset on the SED1330F/1335F/1336F. It is a
RES Schmitt-trigger input for enhanced noise immunity; however, care should be taken to ensure
that it is not triggered if the supply voltage is lowered.
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2.4.4 – 2.4.5 2.0 Pin Description
2.4.4 Display Memory Control
The SED1330F/1335F/1336F can directly access static these two types of memory to achieve an optimum
RAM and PROM. The designer may use a mixture of trade-off between low cost and low power consumption.
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1.0 Overview 1.3
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1.3 – 1.4 1.0 Overview
3.0
Command Description
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3.0 – 3.1 3.0 Command Description
3.0 Command Description
Command
Code Read
Class Command Hex Command Description Parameters
No. of Sec-
RD WR A0 D7 D6 D5 D4 D3 D2 D1 D0
Bytes tion
Initialize device and dis-
System SYSTEM SET 1 0 1 0 1 0 0 0 0 0 0 40 8 3.2.1
play
control
SLEEP IN 1 0 1 0 1 0 1 0 0 1 1 53 Enter standby mode 0 3.2.2
58, Enable and disable dis-
DISP ON/OFF 1 0 1 0 1 0 1 1 0 0 D 1 3.3.1
59 play and display flashing
Set display start address
SCROLL 1 0 1 0 1 0 0 0 1 0 0 44 10 3.3.2
and display regions
CSRFORM 1 0 1 0 1 0 1 1 1 0 1 5D Set cursor type 2 3.3.3
Set start address of char-
Display CGRAM ADR 1 0 1 0 1 0 1 1 1 0 0 5C 2 3.3.6
acter generator RAM
control
4C
CD CD Set direction of cursor
CSRDIR 1 0 1 0 1 0 0 1 1 to 0 3.3.4
1 0 movement
4F
Set horizontal scroll pos-
HDOT SCR 1 0 1 0 1 0 1 1 0 1 0 5A 1 3.3.7
ition
Set display overlay for-
OVLAY 1 0 1 0 1 0 1 1 0 1 1 5B 1 3.3.5
mat
Drawing CSRW 1 0 1 0 1 0 0 0 1 1 0 46 Set cursor address 2 3.4.1
control CSRR 1 0 1 0 1 0 0 0 1 1 1 47 Read cursor address 2 3.4.2
MWRITE 1 0 1 0 1 0 0 0 0 1 0 42 Write to display memory — 3.5.1
Memory
control Read from display mem-
MREAD 1 0 1 0 1 0 0 0 0 1 1 43 — 3.5.2
ory
Notes:
1. In general, the internal registers of the SED1330F/1335F/1336F are modified as each command parameter is input. However,
the microprocessor does not have to set all the parameters of a command and may send a new command before all parameters
have been input. The internal registers for the parameters that have been input will have been changed but the remaining
parameter registers are unchanged.
2-byte parameters (where two bytes are treated as one data item) are handled as follows:
a. CSRW, CSRR: Each byte is processed individually. The microprocessor may read or write just the low byte of the cursor
address.
b. SYSTEM SET, SCROLL, CGRAM ADR: Both parameter bytes are processed together. If the command is changed after
half of the parameter has been input, the single byte is ignored.
2. APL and APH are 2-byte parameters, but are treated as two 1-byte parameters.
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3.0 Command Description 3.2 – 3.2.1
3.2 System Control Commands
Initializes the device, sets the window sizes, and 1335F/1336F, an incorrect SYSTEM SET command
selects the LCD interface format. Since the command may cause other commands to operate incorrectly.
sets the basic operating parameters of the SED1330F/
MSB LSB
D7 D6 D5 D4 D3 D2 D1 D0 A0 WR RD
C 0 1 0 0 0 0 0 0 1 0 1
P1 DR T/L IV 1 W/S M2 M1 M0 0 0 1
P2 WF 0 0 0 0 FX 0 0 1
P3 0 0 0 0 FY 0 0 1
P4 C/R 0 0 1
P5 TC/R 0 0 1
P6 L/F 0 0 1
P7 APL 0 0 1
P8 APH 0 0 1
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3.2.1.1 – 3.2.1.5 3.0 Command Description
3.2.1.1 C as character generator RAM, and the CG RAM2
address space is treated as character generator ROM.
This control byte performs the following:
M1 = 1: 64 char CG RAM + CG RAM2
1. Resets the internal timing generator
2. Disables the display The CG RAM1 and CG RAM2 address spaces are
3. Cancels sleep mode contiguous and are both treated as character genera-
tor RAM.
Parameters following P1 are not needed if only can-
celing sleep mode.
3.2.1.4 M2
M1 = 0: CG RAM1; 32 char
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3.0 Command Description 3.2.1.5
EI X driver X driver
YD
Y driver LCD
EI X driver X driver
YD
Upper Panel
Y driver
Lower Panel
X driver X driver
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3.2.1.5 3.0 Command Description
YD
Y driver
Left Panel Right Panel
Note: There are no Seiko-Epson LCD units in the configuration shown in Figure 10.
W/S = 0 W/S = 1
Parameter
IV = 1 IV = 0 IV = 1 IV = 0
C/R C/R C/R C/R C/R
TC/R TC/R TC/R (see note 1) TC/R TC/R
L/F L/F L/F L/F L/F
00H to L/F + 1
SL1 00H to L/F (L/F) / 2 (L/F) / 2
(see note 2)
00H to L/F + 1
SL2 00H to L/F (L/F) / 2 (L/F) / 2
(see note 2)
SAD1 First screen block First screen block First screen block First screen block
SAD2 Second screen block Second screen block Second screen block Second screen block
SAD3 Third screen block Third screen block Third screen block Third screen block
SAD4 Invalid Invalid Fourth screen block Fourth screen block
Cursor move- Above-and-below configuration:
Continuous movement over whole screen
ment range continuousmovement over whole screen
Notes:
1. See table 31 (page 105) for further details on setting the C/R and TC/R parameters when using the HDOT SCR command.
2. The value of SL when IV = 0 is equal to the value of SL when IV = 1, plus one.
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3.0 Command Description 3.2.1.6 – 3.2.1.9
3.2.1.6 IV 3.2.1.7 T/L
Screen origin compensation for inverse display. IV is Selects TV or LCD mode. When TV mode is selected,
usually set to 1. the TV sync generator circuit is ON.
HDOT SCR
Table 4. Horizontal character size selection
FX
FX
FY
8 bits 8 bits
FY
8 bits 8 bits
3.2.1.10 WF 3.2.1.11 FY
Selects the AC frame drive waveform period. WF is Sets the height, in pixels, of the character. The height
usually set to 1. in pixels is equal to FY + 1.
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3.0 Command Description 3.2.1.12 – 3.2.1.13
3.2.1.12 C/R
Sets the address range covered by one display line, characters, less 2. See Section 9.1.1 for the calcula-
that is, the number of characters less one, multiplied tion of C/R.
by the number of horizontal bytes per character.
[C/R] cannot be set to a value greater than the
C/R can range from 0 to 239. address range. It can, however, be set smaller than
the address range, in which case the excess display
For example, if the character width is 10 pixels, then area is blank. The number of excess pixels must not
the address range is equal to twice the number of exceed 64.
C/R
[C/R] bytes per display line
HEX D7 D6 D5 D4 D3 D2 D1 D0
00 0 0 0 0 0 0 0 0 1
01 0 0 0 0 0 0 0 1 2
↓ ↓ ↓ ↓ ↓ ↓ ↓ ↓ ↓ ↓
4F 0 1 0 0 1 1 1 1 80
↓ ↓ ↓ ↓ ↓ ↓ ↓ ↓ ↓ ↓
EE 1 1 1 0 1 1 1 0 239
EF 1 1 1 0 1 1 1 1 240
3.2.1.13 TC/R
Sets the length, including horizontal blanking, of one according to the equation given in section 9.1.1 in
line. The line length is equal to TC/R + 1, where TC/ order to hold the frame period constant and minimize
R can range from 0 to 255. jitter for any given main oscillator frequency, fOSC.
TC/R
[TC/R] line length (bytes)
HEX D7 D6 D5 D4 D3 D2 D1 D0
00 0 0 0 0 0 0 0 0 1
01 0 0 0 0 0 0 0 1 2
↓ ↓ ↓ ↓ ↓ ↓ ↓ ↓ ↓ ↓
52 0 1 0 1 0 0 1 0 83
↓ ↓ ↓ ↓ ↓ ↓ ↓ ↓ ↓ ↓
FE 1 1 1 1 1 1 1 0 255
FF 1 1 1 1 1 1 1 1 256
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3.2.1.14 – 3.2.1.15 3.0 Command Description
3.2.1.14 L/F
Sets the height, in lines, of a frame. The height in lines If W/S is set to 1, selecting two-screen display, the
is equal to L/F + 1, where L/F can range from 0 to 255. number of lines must be even and L/F must, therefore,
be an odd number.
L/F
[L/F] lines per frame
HEX D7 D6 D5 D4 D3 D2 D1 D0
00 0 0 0 0 0 0 0 0 1
01 0 0 0 0 0 0 0 1 2
↓ ↓ ↓ ↓ ↓ ↓ ↓ ↓ ↓ ↓
7F 0 1 1 1 1 1 1 1 128
↓ ↓ ↓ ↓ ↓ ↓ ↓ ↓ ↓ ↓
FE 1 1 1 1 1 1 1 0 255
FF 1 1 1 1 1 1 1 1 256
Table 9. Frame heights and compatible LCD units Table 10. Horizontal address range
Number of lines [LF] Panel Duty Cycle Hex code [AP] addresses
APH APL per line
64 1/64
0 0 0 0 0
0 0 0 1 1
128 1/64
↓ ↓ ↓ ↓ ↓
0 0 5 0 80
↓ ↓ ↓ ↓ ↓
F F F E 16
2 –2
3.2.1.15 AP
F F F F 216 – 1
Defines the horizontal address range of the virtual
screen. APL is the least significant byte of the ad-
dress.
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3.0 Command Description 3.2.1.15 – 3.3.1
1. The YDIS signal goes LOW between one
and two frames after the SLEEP IN com-
mand is received. Since YDIS forces all
display driver outputs to go to the dese-
lected output voltage, YDIS can be used as
Display area a power-down signal for the LCD unit. This
can be done by having YDIS turn off the
relatively high-power LCD drive supplies at
C/R
the same time as it blanks the display.
AP
If reliability is a prime consideration, turn off
the LCD drive supplies before issuing the
Figure 14. AP and C/R relationship SLEEP IN command.
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3.3.1.1 – 3.3.2.1 3.0 Command Description
3.3.1.1 D Note: If SAD4 is enabled by setting W/S to 1, FP3 and FP2
control both SAD2 and SAD4. The attributes of SAD2
and SAD4 cannot be set independently.
Turns the display ON or OFF. The D bit takes prece-
dence over the FP bits in the parameter.
D = 0: Display OFF
3.3.2 SCROLL
D = 1: Display ON
3.3.2.1 C
P6 L7 L6 L5 L4 L3 L2 L1 L0 (SL 2)
3.3.1.3 FP
Each pair of bits in FP sets the attributes of one screen P7 A7 A6 A5 A4 A3 A2 A1 A0 (SAD 3L)
block, as follows.
P8 A15 A14 A13 A12 A11 A10 A9 A8 (SAD 3H)
Table 12. Screen block attribute selection
P9 A7 A6 A5 A4 A3 A2 A1 A0 (SAD 4L)
FP1 FP0 First screen block (SAD1)
Second screen block (SAD2,
FP3 FP2 P10 A15 A14 A13 A12 A11 A10 A9 A8 (SAD 4H)
SAD4). See note.
FP5 FP4 Third screen block (SAD3)
Note: Set parameters P9 and P10 only if both two-screen
0 0 OFF (blank) drive (W/S = 1) and two-layer configuration are se-
0 1 No flashing lected. SAD4 is the fourth screen block display start
address.
Flash at fFR/32 Hz
1 0 ON (approx. 2 Hz)
Flash at fFR/4 Hz Figure 17. SCROLL instruction parameters
1 1
(approx. 16 Hz)
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3.0 Command Description 3.3.2.1 – 3.3.2.2
Table 13. Screen block start address selection
SL1, SL2
[SL] screen lines
HEX L7 L6 L5 L4 L3 L2 L1 L0
00 0 0 0 0 0 0 0 0 1
01 0 0 0 0 0 0 0 1 2
↓ ↓ ↓ ↓ ↓ ↓ ↓ ↓ ↓ ↓
7F 0 1 1 1 1 1 1 1 128
↓ ↓ ↓ ↓ ↓ ↓ ↓ ↓ ↓ ↓
FE 1 1 1 1 1 1 1 0 255
FF 1 1 1 1 1 1 1 1 256
SL1 and SL2 set the number of lines per scrolling The relationship between SAD, SL and the display
screen. The number of lines is SL1 or SL2 plus one. mode is described below.
SAD2
SAD1
0 SL2
SAD3
Layer 1
(continued)
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3.3.2.2 3.0 Command Description
Table 14. Text display mode (continued)
SAD2
SAD1
SAD3
Graphics display page 4
(SAD4)
Character display page 3
Layer 1 Layer 2
Notes:
1. SAD3 has the same value as either SAD1 or SAD2, whichever has the least number of lines (set by SL1 and SL2).
2. Since the parameters corresponding to SL3 and SL4 are fixed by L/F, they do not have to be set in this mode.
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3.0 Command Description 3.3.2.2
Table 15. Graphics display mode
SAD2
SAD1
SL2
0
Graphics display page 2
SL1 Character display page 1
SAD3
Layer 1 Layer 2
SAD3
Graphics display page 3
SAD2
SAD1
SL2
SL1
0 Graphics display page 2
Layer 3
Layer 1 Layer 2
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3.3.2.2 3.0 Command Description
Table 15. Graphics display mode (continued)
SAD2
SAD1
1
Graphics display page 2
SL1 Graphics display page 1
SAD3
Graphics display page 4
Layer 1 Layer 2
Notes:
1. SAD3 has the same value as either SAD1 or SAD2, whichever has the least number of lines (set by SL1 and SL2).
2. Since the parameters corresponding to SL3 and SL4 are fixed by L/F, they do not have to be set.
3. If, and only if, W/S = 1, the differences between SL1 and (L/F + 1) / 2, and between SL2 and (L/F + 1) / 2, are blanked.
SL1
Upper Panel
L
Graphics
L/2 Lower Panel
Sets the cursor size and display mode. Although the Sets the location of an underscored cursor in lines,
cursor is normally only used in text displays, it may from the character origin. When using a block cursor,
also be used in graphics displays when displaying CRY sets the vertical size of the cursor from the
special characters. character origin. CRY is equal to the number of lines
less one.
3.3.3.1 CRX
8 1 0 0 0 9 6
↓ ↓ ↓ ↓ ↓ ↓ 7
E 1 1 1 0 15 8
F 1 1 1 1 16 9
CRX = 5 dots
CRY = 9 dots
CM = 0
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3.3.3.3 – 3.3.5.1 3.0 Command Description
3.3.3.3 CM Table 18. Cursor shift direction
Sets the cursor display mode. Always set CM to 1 C CD1 CD0 Shift direction
when in graphics mode. 4CH 0 0 Right
4DH 0 1 Left
CM = 0: Underline cursor
4EH 1 0 Up
CM = 1: Block cursor
4FH 1 1 Down
Note: Since the cursor moves in address units even if FX ≥ 9,
the cursor address increment must be preset for move-
ment in character units. See Section 5.3.
3.3.4 CSRDIR
C 0 1 0 1 1 0 1 1
MSB LSB
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3.0 Command Description 3.3.5.1
Table 19. Composition method selection
Notes:
L1: Not flashing
L2: Flashing at 1 Hz
L3: Flashing at 2 Hz
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3.3.5.2 – 3.3.7.1 3.0 Command Description
3.3.5.2 DM1, DM2 3.3.7 HDOT SCR
DM1 and DM2 specify the display mode of screen While the scroll command only allows scrolling by
blocks 1 and 3, respectively. characters, HDOT SCR allows the screen to be scrolled
horizontally by pixels. HDOT SCR cannot be used on
DM1/2 = 0: Text mode individual layers.
DM1/2 = 1: Graphics mode
Note 1: Screen blocks 2 and 4 can only display graphics.
MSB LSB
Note 2: DM1 and DM2 must be the same, regardless of the
setting of W/S. C 0 1 0 1 1 0 1 0
P1 0 0 0 0 0 D2 D1 D0
3.3.5.3 OV
Specifies two- or three-layer composition in graphics Figure 26. HDOT SCR parameters
mode.
OV = 0: Two-layer composition
OV = 1: Three-layer composition 3.3.7.1 D0 to D2
P1 Number of pixels
MSB LSB
HEX D2 D1 D0 to scroll
C 0 1 0 1 1 1 0 0
00 0 0 0 0
01 0 0 1 1
P1 A7 A6 A5 A4 A3 A2 A1 A0 (SAGL)
02 0 1 0 2
P2 A15 A14 A13 A12 A11 A10 A9 A8 (SAGH) ↓ ↓ ↓ ↓ ↓
06 1 1 0 6
07 1 1 1 7
Figure 25. CGRAM ADR parameters
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3.0 Command Description 3.4 – 3.4.2
Note that the microprocessor cannot directly access
the display memory.
M
MSB LSB
P2 A15 A14 A13 A12 A11 A10 A9 A8 (CSRH)
C 0 1 0 0 0 1 1 0
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3.5 – 3.5.2 3.0 Command Description
3.5 Memory Control Commands 3.5.2 MREAD
MSB LSB If the cursor is displayed, the read data will be from two
positions ahead of the cursor.
C 0 1 0 0 0 0 1 0
P1 MSB LSB
C 0 1 0 0 0 0 1 1
P2
P1
Pn n≥1
P2
Note:
P1, P2, ..., Pn: display data.
Pn n≥1
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1.0 Overview 1.3
48 S-MOS Systems, Inc. • 2460 North First Street • San Jose, CA 95131 • Tel: (408) 922-0200 • Fax: (408) 922-0238 268-0.4
3.3.2.2 3.0 Command Description
4.0
Specifications
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THIS PAGE INTENTIONALLY BLANK
50 S-MOS Systems, Inc. • 2460 North First Street • San Jose, CA 95131 • Tel: (408) 922-0200 • Fax: (408) 922-0238 268-0.4
4.0 – 4.1 4.0 Specifications
4.0 Specifications
4.1.1 SED1330
4.1.2 SED1335/SED1336
Notes:
1. The humidity resistance of the flat package may be reduced if the package is immersed in solder. Use a soldering technique
that does not heatstress the package.
2. If the power supply has a high impedance, a large voltage differential can occur between the input and supply voltages. Take
appropriate care with the power supply and the layout of the supply lines. (See Section 2.3.)
3. All supply voltages are referenced to VSS = 0V.
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4.0 Specifications 4.2
4.2 SED 1330 Electrical Characteristics
VDD = 5V ±10%, VSS = 0V, Ta = –20 to 75°C
Rating
Parameter Symbol Condition Unit
min typ max
Supply voltage VDD 4.5 5.0 5.5 V
Register data retention voltage VOH 2.0 — 5.5 V
Input leakage current ILI VI = VDD. — 0.05 2.0 µA
Output leakage current ILO VI = VSS. — 0.10 5.0 µA
Operating supply current Iopr See note 4. — 8 12 mA
Notes:
1. D0 to D7, A0, CS, RD, WR, VD0 to VD7, VA0 to VA15,
VR/W and VCE are TTL-level inputs.
2. SEL1, SEL2 and OSC1 are CMOS-level inputs. YD,
XD0 to XD3, XSCL, YECL, LP, WF, YSCL, YDIS and
CLO are CMOS-level outputs.
3. RES is a Schmitt-trigger input. The pulsewidth on RES
must be at least 200 µs. Note that pulses of more than
a few seconds will cause DC voltages to be applied to
the LCD panel.
4. fOSC = 10 MHz, no load (no display memory), internal
character generator, 256 × 200 pixel display. The
operating supply current can be reduced by approxi-
mately 1 mA by setting both CLO and the display OFF.
52 S-MOS Systems, Inc. • 2460 North First Street • San Jose, CA 95131 • Tel: (408) 922-0200 • Fax: (408) 922-0238 268-0.4
4.3 4.0 Specifications
4.3 SED1335/1336 Electrical Characteristics
VDD = 4.5 to 5.5V, VSS = 0V, Ta = –20 to 75°C
Rating
Parameter Symbol Condition Unit
min typ max
Supply voltage VDD 4.5 5.0 5.5 V
Register data retention voltage VOH 2.0 — 6.0 V
Input leakage current I LI VI = VDD. See note 6. — 0.05 2.0 µA
Output leakage current ILO VI = VSS. See note 6. — 0.10 5.0 µA
Operating supply current Iopr See note 4. — 11 15 mA
Sleep mode,
Quiescent supply current IQ — 0.05 20.0 µA
VOSC1 = VCS = VRD = VDD
Oscillator frequency f OSC Measured at crystal, 1.0 — 10.0 MHz
External clock frequency f CL 47.5% duty cycle. 1.0 — 10.0 MHz
Oscillator feedback resistance Rf See note 7. 0.5 1.0 3.0 MΩ
TTL
HIGH-level input voltage VIHT See note 1. 0.5V DD — VDD V
LOW-level input voltage VILT See note 1. VSS — 0.2V DD V
IOH = –5.0 mA.
HIGH-level output voltage VOHT 2.4 — — V
See note 1.
LOW-level output voltage VOLT IOL = 5.0 mA. See note 1. — — VSS + 0.4 V
CMOS
HIGH-level input voltage VIHC See note 2. 0.8V DD — VDD V
LOW-level input voltage VILC See note 2. VSS — 0.2V DD V
HIGH-level output voltage VOHC IOH = –2.0 mA. See note 2. VDD – 0.4 — — V
LOW-level output voltage VOLC IOH = 1.6 mA. See note 2. — — VSS + 0.4 V
Open-drain
LOW-level output voltage VOLN IOL = 6.0 mA. See note 5. — — VSS + 0.4 V
Schmitt-trigger
Rising-edge threshold voltage VT+ See note 3. 0.5V DD 0.7V DD 0.8V DD V
Falling-edge threshold voltage VT– See note 3. 0.2V DD 0.3V DD 0.5V DD V
Notes:
1. D0 to D7, A0, CS, RD, WR, VD0 to VD7, VA0 to VA15,
VRD, VWR and VCE are TTL-level inputs.
2. SEL1 and NT/PL are CMOS-level inputs. YD, XD0 to
XD3, XSCL, XECL, LP, WF, YSCL, YDIS and CLO are
CMOS-level outputs.
3. RES is a Schmitt-trigger input. The pulsewidth on RES
must be at least 200 µs. Note that pulses of more than
a few seconds will cause DC voltages to be applied to
the LCD panel.
4. fOSC = 10 MHz, no load (no display memory), internal
character generator, 256 × 200 pixel display. The
operating supply current can be reduced by approxi-
mately 1 mA by setting both CLO and the display OFF.
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4.0 Specifications 4.4 – 4.4.1
4.4 SED1330 Timing Diagrams
tAH8
A0, CS
tAW8
tCYC
tCC
WR, RD
tDS8
tDH8
D0~D7
(WRITE)
tACC8 tOH8
D0~D7
(READ)
4.4.1.1 SED1330F
Ta = –20 to 75°C
Rating
Signal Symbol Parameter Unit Condition
min max
tAH8 Address hold time 10 — ns
A0, CS
tAW8 Address setup time 30 — ns
tCYC System cycle time (1) — ns
WR, RD
tCC Strobe pulsewidth 220 — ns CL = 100
tDS8 Data setup time 120 — ns pF
tDH8 Data hold time 10 — ns
D0 to D7
tACC8 RD access time — 120 ns
tOH8 Output disable time 10 50 ns
Note: tCYC = 2tC + tCC + tCEA + 75 > tACV + 245:
memory control/movement control commands:
= 4tC + tCC + 30:
all other commands:
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4.4.2 – 4.4.2.1 4.0 Specifications
4.4 SED1330 Timing Diagrams
tCYC6
E
tAW6 tEW
R/W
tAH6
A0, CS
tDS6
tDH6
D0~D7
(WRITE)
tACC6 tOH6
D0~D7
(READ)
4.4.2.1 SED1330F
Ta = –20 to 75°C
Rating
Signal Symbol Parameter Unit Condition
min max
t AH6 Address hold time 10 — ns
A0, CS
t AW6 Address setup time 30 — ns
R/W
tCYC6 System cycle time (1) — ns
CL=100pF+1TTL
t DS6 Data setup time 120 — ns
pF
tDH6 Data hold time 10 — ns
D0 to D7
tACC6 Access time — 120 ns
t OH6 Output disable time 10 50 ns
E t EW Enable pulse width 220 — ns
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4.0 Specifications 4.4.3 – 4.4.3.1
4.4 SED1330 Timing Diagrams
tC
EXTφO
tW tCE tW
VCE
tCYR
VA0~VA15
tASC tAHC tRCH
VD0~VD7
4.4.3.1 SED1330F
Ta = –20 to 75°C
Rating
Signal Symbol Parameter Unit Condition
min max
EXT Ø0 tC Clock cycle 100 — ns
tW VCE high level pulse width tc–40 — ns
VCE
tCE VCE low level pulse width 2tc–40 — ns
tCYR Read cycle time (1) — ns
VA0
tASC VCE address setup time (fall) tc–45 — ns CL = 100pF
to VA15
tAHC VCE address hold time (fall) 2tc–40 — ns +1TTL
tRCS VCE read cycle setup time (fall) tc–45 — ns
VR/W
tRCH VCE read cycle hold time (fall) tc/2–35 — ns
tACV Address access time — (2) ns
VD0 tCEA VCE access time — (3) ns
to VD7 tOH2 Output data hold time 0 — ns
tCE2 VCE data off time 0 — ns
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4.4.4 – 4.4.4.1 4.0 Specifications
4.4 SED1330 Timing Diagrams
tC
EXTφO
tW tCE
VCE
tASC tCA
tAHC
VA0~VA15
tCYW
tAS tWSC
tWHC tAH2
VWR
tOSC tOH2
tOHC
VD0~VD7
4.4.4.1 SED1330F
Ta = –20 to 75°C
Rating
Signal Symbol Parameter Unit Condition
min max
EXT Ø0 tC Clock cycle 100 — ns
tW VCE high level pulse width tc–40 — ns
VCE
t CE VCE low level pulse width 2tc–40 — ns
tCYW Write cycle time 3tc — ns
tAHC VCE address hold time (fall) 2tc–40 — ns
VA0 t ASC VCE address setup time (fall) tc–55 — ns CL = 100pF
to VA15 t CA VCE address hold time (rise) 5 — ns +1TTL
tAS VR/W address setup time (fall) 0 — ns
t AH2 VR/W address hold time (rise) 15 — ns
tWSC VCE write setup time (fall) tc–55 — ns
VR/W
t WHC VCE write hold time (fall) tc2–40 — ns
tDSC VCE data input setup time (fall) twsc–10 — ns
VD0
t DHC VCE data input hold time (fall) 2tc–30 — ns
to VD7
tDH2 VR/W data hold time (rise) 10* 50 ns
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4.0 Specifications 4.4.5
4.4 SED1330 Timing Diagrams
ROW NO
LP
1 frame period
YD
WF
YSCL
WF 1 line period
YSCL
ROW64 ROW1 ROW2
LP
XSCL
XD0~XD3
XECL
tr tWX tf tCX
XSCL
tDS tDH
XD0~XD3
tWL
tL1 tL2
LP
tS2 tS1
XECL tWXE
WF(B)
YD
tDf
YSCL
tLD
tDHY
tWY
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4.4.5.1 4.0 Specifications
4.4 SED1330 Timing Diagrams
4.4.5.1 SED1330F
Ta = –20 to 75°C
Rating
Signal Symbol Parameter Unit Condition
min max
EXT Ø0 tC Clock cycle 100 — ns
tr VCE high level pulse width — 35 ns
tf VCE low level pulse width — 35 ns
t CX Shift clock cycle time 4tc — ns
XSCL
t WX XSCL clock pulse width t CX2–80 — ns
XD0 tDH X-data hold time t CX2–100 — ns VDD = 5.0V
to XD3 t DS X-data setup time t CX2–100 — ns ±10%
tLS Latch data setup time t CX2–100 — ns CL=150F
LP
t WL LP signal pulse width t CX4–80 — ns
tL1 XECL setup time t CX3–100 — ns
tL2 XECL data hold time t C–30 — ns
XECL tS1 Enable setup time t C–30 — ns
tS1 Enable delay time t C–30 — ns
t WXE XECL clock pulse width t CX3–80 — ns
WF tDF Time allowance of WF delay — 100 ns
t LD LP delay time against YSCL t CX4–100 — ns
YSCL
t WY YSCL clock pulse width t CX4–80 — ns
YD tDHY Y-data hold time t CX6–100 — ns
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4.0 Specifications 4.4 .6– 4.4.6.1
4.4 SED1330 Timing Diagrams
VDD
tOSP
CLO
tOSS
YDIS
Power ON Sleep period
tRCL tFCL
EXT 0O
tWL tWH
tCL
4.4.6.1 SED1330F
Ta = –20 to 75°C
Rating
Signal Symbol Parameter Unit Condition
min max
tOSP Time to stable CLO output after power ON — 3 ms RES = H
CLO
tOSS Time to stable CLO output after sleep OFF — 1 ms 20 pF
tRCL External clock rise time — 15 ns
tFCL External clock fall time — 15 ns
EXTø0 tWH External clock high-pulse width Note 1 Note 2 ns
tWL External clock low-pulse width Note 1 Note 2 ns
tCL External clock cycle 100 — ns
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4.4.7 4.0 Specifications
4.4 SED1330 Timing Diagrams
VDD
2.1 KΩ
Measurement
Terminal
C = 100 pF 24 KΩ
IN 916
COMPATABLE
VSS
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4.0 Specifications 4.5 – 4.5.1.1
4.5 SED1335/SED1336 AC Timing Diagrams
AO, CS
tAW8 tAH8
tCYC
WR, RD
tCC
tDH8
tDS8
D0 to D7
(Write)
tACC8 tOH8
D0 to D7
(Read)
4.5.1.1 SED1335F
Ta = –20 to 75°C
VDD = 4.5 to 5.5V VDD = 2.7 to 4.5V
Signal Symbol Parameter Unit Condition
min max min max
tAH8 Address hold time 10 — 10 — ns
A0, CS
tAW8 Address setup time 0 — 0 — ns
tCYC System cycle time See note — See note — ns
WR, RD
tCC Strobe pulsewidth 120 — 150 — ns CL = 100
tDS8 Data setup time 120 — 120 — ns pF
tDH8 Data hold time 5 — 5 — ns
D0 to D7
tACC8 RD access time — 50 — 80 ns
tOH8 Output disable time 10 50 10 55 ns
Note: For memory control and system control commands:
tCYC8 = 2tC + tCC + tCEA + 75 > tACV + 245
For all other commands:
tCYC8 = 4tC + tCC + 30
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4.5.1.2 4.0 Specifications
4.5.1.2 SED1336F
Ta = –20 to 75°C
VDD = 4.5 to 5.5V VDD = 3.0 to 4.5V
Signal Symbol Parameter Unit Condition
min max min max
t AH8 Address hold time 10 — 10 — ns
A0, CS
t AW8 Address setup time 0 — 0 — ns
tCYC System cycle time See note — See note — ns
WR, RD
tCC Strobe pulsewidth 120 — 140 — ns CL = 100
t DS8 Data setup time 120 — 120 — ns pF
tDH8 Data hold time 5 — 5 — ns
D0 to D7
tACC8 RD access time — 50 — 70 ns
t OH8 Output disable time 10 50 10 50 ns
Note: For memory control and system control commands:
tCYC8 = 2tC + tCC + tCEA + 75 > tACV + 245
For all other commands:
tCYC8 = 4tC + tCC + 30
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4.0 Specifications 4.5.2
4.5.2 6800 family Interface Timing
tCYC
tAW6 tEW
R/W
tAH6
AO, CS
tDH6
tDS6
D0 to D7
(Write)
tACC6 tOH6
D0 to D7
(Read)
Note: tCYC6 indicates the interval during which CS is LOW and E is HIGH.
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4.5.2.1 – 4.5.2.2 4.0 Specifications
4.5.2.1 SED1335F
Ta = –20 to 75°C
VDD = 4.5 to 5.5V VDD = 2.7 to 4.5V
Signal Symbol Parameter Unit Condition
min max min max
A0, tCYC6 System cycle time See note — See note — ns
CS, t AW6 Address setup time 0 — 10 — ns
R/W t AH6 Address hold time 0 — 0 — ns
t DS6 Data setup time 100 — 120 — ns CL =
tDH6 Data hold time 0 — 0 — ns 100 pF
D0 to D7
t OH6 Output disable time 10 50 10 75 ns
tACC6 Access time — 85 — 130 ns
E t EW Enable pulsewidth 120 — 150 — ns
Note: For memory control and system control commands:
tCYC6 = 2tC + tEW + tCEA + 75 > tACV + 245
For all other commands:
tCYC6 = 4tC + tEW + 30
4.5.2.2 SED1336F
Ta = –20 to 75°C
VDD = 4.5 to 5.5V VDD = 3.0 to 4.5V
Signal Symbol Parameter Unit Condition
min max min max
A0, tCYC6 System cycle time See note — See note — ns
CS, t AW6 Address setup time 0 — 10 — ns
R/W t AH6 Address hold time 0 — 0 — ns
t DS6 Data setup time 100 — 120 — ns CL =
tDH6 Data hold time 0 — 0 — ns 100 pF
D0 to D7
t OH6 Output disable time 10 50 10 70 ns
tACC6 Access time — 85 — 120 ns
E t EW Enable pulsewidth 120 — 140 — ns
Note: For memory control and system control commands:
tCYC6 = 2tC + tEW + tCEA + 75 > tACV + 245
For all other commands:
tCYC6 = 4tC + tEW + 30
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4.0 Specifications 4.5.3 – 4.5.3.1
4.5.3 Display Memory Read Timing
EXTΦ0
tC
tW tCE tW
VCE
tCYR
VA0 to VA15
tASC tAHC
tRCH
VRD
tRCS tCEA tCE3
tACV tOH2
VD0 to VD7
(SED1335F)
4.5.3.1 SED1335F
Ta = –20 to 75°C
VDD = 4.5 to 5.5V VDD = 2.7 to 4.5V
Signal Symbol Parameter Unit Condition
min max min max
EXT φ0 tC Clock period 100 — 125 — ns
VCE HIGH-level pulse-
tW tC – 50 — tC – 50 — ns
width
VCE
VCE LOW-level pulse-
tCE 2tC – 30 — 2tC – 30 — ns
width
tCYR Read cycle time 3tC — 3t C — ns
Address setup time to
VA0 to tASC tC – 70 — tC – 100 — ns
falling edge of VCE
VA15 CL = 100
Address hold time from
tAHC 2tC – 30 — 2tC – 40 — ns pF
falling edge of VCE
Read cycle setup time to
tRCS tC – 45 — tC – 60 — ns
falling edge of VCE
VRD
Read cycle hold time
tRCH 0.5tC — 0.5tC — ns
from rising edge of VCE
tACV Address access time — 3tC – 100 — 3tC – 115 ns
VD0 to tCEA VCE access time — 2tC – 80 — 2tC – 90 ns
VD7 tOH2 Output data hold time 0 — 0 — ns
tCE3 VCE to data off time 0 — 0 — ns
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4.5.3.2 4.0 Specifications
4.5.3.2 SED1336F
Ta = –20 to 75°C
VDD = 4.5 to 5.5V VDD = 3.0 to 4.5V
Signal Symbol Parameter Unit Condition
min max min max
EXT φ0 tC Clock period 100 — 125 — ns
VCE HIGH-level pulse-
tW tC – 50 — tC – 50 — ns
width
VCE
VCE LOW-level pulse-
t CE 2tC – 30 — 2tC – 30 — ns
width
tCYR Read cycle time 3tC — 3t C — ns
Address setup time to
VA0 to t ASC tC – 70 — tC – 100 — ns
falling edge of VCE
VA15 CL = 100
Address hold time from
tAHC 2tC – 30 — 2tC – 40 — ns pF
falling edge of VCE
Read cycle setup time to
tRCS tC – 45 — tC – 55 — ns
falling edge of VCE
VRD
Read cycle hold time
t RCH 0.5tC — 0.5tC — ns
from rising egde of VCE
t ACV Address access time — 3tC – 100 — 3tC – 110 ns
VD0 to t CEA VCE access time — 2tC – 80 — 2tC – 85 ns
VD7 t OH2 Output data hold time 0 — 0 — ns
t CE3 VCE to data off time 0 — 0 — ns
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4.0 Specifications 4.5.4
4.5.4 Display Memory Write Timing
tC
EXTφO
tW tCE
VCE
tASC tCA
tAHC
VA0~VA15
tCYW
tAS tWSC
tWHC tAH2
VWR
tOSC tOH2
tOHC
VD0~VD7
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4.5.4.1 4.0 Specifications
4.5.4.1 SED1335F
Ta = –20 to 75°C
VDD = 4.5 to 5.5V VDD = 2.7 to 4.5V
Signal Symbol Parameter Unit Condition
min max min max
EXT φ0 tC Clock period 100 — 125 — ns
VCE HIGH-level pulse-
tW tC – 50 — tC – 50 — ns
width
VCE
VCE LOW-level pulse-
t CE 2tC – 30 — 2tC – 30 — ns
width
tCYW Write cycle time 3tC — 3t C — ns
Address hold time from
tAHC 2tC – 30 — 2tC – 40 — ns
falling edge of VCE
Address setup time to
t ASC tC – 70 — tC – 110 — ns
falling edge of VCE
VA0 to
Address hold time from
VA15 t CA 0 — 0 — ns CL = 100
rising edge of VCE
Address setup time to pF
tAS 0 — 0 — ns
falling edge of VWR
Address hold time from
t AH2 10 — 10 — ns
rising edge of VWR
Write setup time to falling
tWSC tC – 80 — tC – 115 — ns
edge of VCE
VWR
Write hold time from fall-
t WHC 2tC – 20 — 2tC – 20 — ns
ing edge of VCE
Data input setup time to
tDSC tC – 85 — tC – 125 — ns
falling edge of VCE
VD0 to Data input hold time
t DHC 2tC – 30 — 2tC – 30 — ns
VD7 from falling edge of VCE
Data hold time from
tDH2 5 50 5 50 ns
rising edge of VWR
Note: VD0 to VD7 are latching input/outputs. While the bus is high impedance, VD0 to VD7 retain the write data until the data read
from the memory is placed on the bus.
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4.0 Specifications 4.5.4.2
4.5.4.2 SED1336F
Ta = –20 to 75°C
VDD = 4.5 to 5.5V VDD = 3.0 to 4.5V
Signal Symbol Parameter Unit Condition
min max min max
EXT φ0 tC Clock period 100 — 125 — ns
VCE HIGH-level pulse-
tW tC – 50 — tC – 50 — ns
width
VCE
VCE LOW-level pulse-
tCE 2tC – 30 — 2tC – 30 — ns
width
tCYW Write cycle time 3tC — 3t C — ns
Address hold time from
tAHC 2tC – 30 — 2tC – 40 — ns
falling edge of VCE
Address setup time to
tASC tC – 70 — tC – 100 — ns
falling edge of VCE
VA0 to
Address hold time from
VA15 tCA 0 — 0 — ns CL = 100
rising edge of VCE
Address setup time to pF
tAS 0 — 0 — ns
falling edge of VWR
Address hold time from
tAH2 10 — 10 — ns
rising edge of VWR
Write setup time to falling
tWSC tC – 80 — tC – 110 — ns
edge of VCE
VWR
Write hold time from fall-
tWHC 2tC – 20 — 2tC – 20 — ns
ing edge of VCE
Data input setup time to
tDSC tC – 85 — tC – 120 — ns
falling edge of VCE
VD0 to Data input hold time
tDHC 2tC – 30 — 2tC – 30 — ns
VD7 from falling edge of VCE
Data hold time from
tDH2 5 50 5 50 ns
rising edge of VWR
Note: VD0 to VD7 are latching input/outputs. While the bus is high impedance, VD0 to VD7 retain the write data until the data read
from the memory is placed on the bus.
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4.5.5 – 4.5.5.2 4.0 Specifications
4.5.5 SLEEP IN Command Timing
tWRL tWRD
WR
(command input)
YDIS
4.5.5.1 SED1335F
Ta = –20 to 75°C
VDD = 4.5 to 5.5V VDD = 2.7 to 4.5V
Signal Symbol Parameter Unit Condition
min max min max
VCE falling-edge delay
t WRD See note 1 — See note 1 — ns
time CL = 100
WR
YDIS falling-edge delay pF
tWRL — See note 2 — See note 2 ns
time
Notes:
1. tWRD = 18tC + tOSS + 40 (tOSS is the time delay from the sleep state until stable operation)
2. tWRL = 36tC × [TC/R] × [L/F] + 70
4.5.5.2 SED1336F
Ta = –20 to 75°C
VDD = 4.5 to 5.5V VDD = 3.0 to 4.5V
Signal Symbol Parameter Unit Condition
min max min max
VCE falling-edge delay
t WRD See note 1 — See note 1 — ns
time CL = 100
WR
YDIS falling-edge delay pF
tWRL — See note 2 — See note 2 ns
time
Notes:
1. tWRD = 18tC + tOSS + 40 (tOSS is the time delay from the sleep state until stable operation)
2. tWRL = 36tC × [TC/R] × [L/F] + 70
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4.0 Specifications 4.5.6 – 4.5.6.2
4.5.6 External Oscillator Signal Timing
tRCL tFCL
EXTφ0
tWL tWH
tCL
4.5.6.1 SED1335F
Ta = –20 to 75°C
VDD = 4.5 to 5.5V VDD = 2.7 to 4.5V
Signal Symbol Parameter Unit Condition
min max min max
tRCL External clock rise time — 15 — 15 ns
tFCL External clock fall time — 15 — 15 ns
External clock
EXT φ0 tWH
HIGH-level pulsewidth
See note 1 See note 2 See note 1 See note 2 ns
External clock
tWL See note 1 See note 2 See note 1 See note 2 ns
LOW-level pulsewidth
tC External clock period 100 — 125 — ns
Notes:
1. 475
(tC – tRCL – tFCL) × < tWH, tWL
1000
2. 525
(tC – tRCL – tFCL) × > tWH, tWL
1000
4.5.6.2 SED1336F
Ta = –20 to 75°C
VDD = 4.5 to 5.5V VDD = 3.0 to 4.5V
Signal Symbol Parameter Unit Condition
min max min max
tRCL External clock rise time — 15 — 15 ns
tFCL External clock fall time — 15 — 15 ns
External clock
EXT φ0 tWH
HIGH-level pulsewidth
See note 1 See note 2 See note 1 See note 2 ns
External clock
tWL See note 1 See note 2 See note 1 See note 2 ns
LOW-level pulsewidth
tC External clock period 100 — 125 — ns
Notes:
1. 475
(tC – tRCL – tFCL) × < tWH, tWL
1000
2. 525
(tC – tRCL – tFCL) × > tWH, tWL
1000
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4.5.7 4.0 Specifications
4.5.7 LCD Output Timing
ROW 62 63 64 1 2 3 4 60 61 62 63 64
LP
1 frame period
YD
WF
YSCL
WF
1 line period
LP
XSCL
XD0~XD3
XECL
tr tWX tf tCX
XSCL
tDS tDH
XD0~XD3
tWL
LP tL2
tL1
tS2 tS1
XECL
tWXE
tDf
WF(B)
tLD
YD
tDHY
tWY
YSCL
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4.0 Specifications 4.5.7
4.5.7.1 SED1330F
Ta = –20 to 75°C
Rating
Signal Symbol Parameter Unit Condition
min max
tr VCE high level pulse width — 35 ns
tf VCE low level pulse width — 35 ns
tCX Shift clock cycle time 4tc–70 — ns
XSCL
tWX XSCL clock pulse width 2t C–80 — ns
XD0 tDH X-data hold time 2t C–100 — ns VDD = 5.0V
to XD3 tDS X-data setup time 2t C–100 — ns ±10%
tLS Latch data setup time 2tC–100 — ns CL=150F
LP
tWL LP signal pulse width 4t C–80 — ns
tL1 XECL setup time 3tC–100 — ns
tL2 XECL data hold time tC–30 — ns
XECL tS1 Enable setup time tC–30 — ns
tS1 Enable delay time tC–30 — ns
tWXE XECL clock pulse width 3t C–80 — ns
WF tDF Time allowance of WF delay — 100 ns
tLD LP delay time against YSCL 4tC–100 — ns
YSCL
tWY YSCL clock pulse width 4t C–80 — ns
YD tDHY Y-data hold time 6t C–100 — ns
Notes:
1. The E-1330 reads display memory data from the address of the top left corner of the display screen, then scans horizontally until
it reaches the address for the bottom right corner of the display screen. Therefore, each line of X-driver data is sent starting from
the left side of the display line.
2. The E-1330 uses nine cycles of ø0 as the basic cycle (tc). The XSCL waveform is shown in the following figure.
ø0
4 tC 5 tC
XSCL
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4.5.7.2 – 4.5.7.3 4.0 Specifications
4.5.7.2 SED1335F
Ta = –20 to 75°C
VDD = 4.5 to 5.5V VDD = 2.7 to 4.5V
Signal Symbol Parameter Unit Condition
min max min max
tr Rise time — 30 — 40 ns
tf Fall time — 30 — 40 ns
t CX Shift clock cycle time 4tC — 4t C — ns
XSCL
t WX XSCL clock pulsewidth 2tC – 60 — 2tC – 60 — ns
XD0 to tDH X data hold time 2tC – 50 — 2tC – 50 — ns CL =
XD3 t DS X data setup time 2tC – 100 — 2tC – 105 — ns 100 pF
tLS Latch data setup time 2tC – 50 — 2tC – 50 — ns
LP t WL LP pulsewidth 4tC – 80 — 4tC – 120 — ns
t LD LP delay time from XSCL 0 — 0 — ns
WF tDF Permitted WF delay — 50 — 50 ns
YD tDHY Y data hold time 2tC – 20 — 2tC – 20 — ns
4.5.7.3 SED1336F
Ta = –20 to 75°C
VDD = 4.5 to 5.5V VDD = 3.0 to 4.5V
Signal Symbol Parameter Unit Condition
min max min max
tr Rise time — 30 — 35 ns
tf Fall time — 30 — 35 ns
t CX Shift clock cycle time 4tC — 4t C — ns
XSCL
t WX XSCL clock pulsewidth 2tC – 60 — 2tC – 60 — ns
XD0 to tDH X data hold time 2tC – 50 — 2tC – 50 — ns CL =
XD3 t DS X data setup time 2tC – 100 — 2tC – 100 — ns 100 pF
tLS Latch data setup time 2tC – 50 — 2tC – 50 — ns
LP t WL LP pulsewidth 4tC – 80 — 4tC – 100 — ns
t LD LP delay time from XSCL 0 — 0 — ns
WF tDF Permitted WF delay — 50 — 50 ns
YD tDHY Y data hold time 2tC – 20 — 2tC – 20 — ns
Note: The SED1335F/1336F reads display memory data from the address of the top left corner of the display screen, then scans
horizontally until it reaches the address for the bottom right corner of the display screen. Therefore, each line of X-driver data
is sent starting from the left side of the display line.
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THIS PAGE INTENTIONALLY BLANK
76 S-MOS Systems, Inc. • 2460 North First Street • San Jose, CA 95131 • Tel: (408) 922-0200 • Fax: (408) 922-0238 268-0.4
5.0
Display Control Functions
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THIS PAGE INTENTIONALLY BLANK
78 S-MOS Systems, Inc. • 2460 North First Street • San Jose, CA 95131 • Tel: (408) 922-0200 • Fax: (408) 922-0238 268-0.4
5.0 – 5.1 5.0 Display Control Functions
5.0 Display Control Functions
The origin of each character bitmap is in the top left If the area outside the character bitmap contains only
corner as shown in Figure 38. Adjacent bits in each zeros, the displayed character size can easily be
byte are horizontally adjacent in the corresponding increased by increasing FX and FY, as the zeros
character image. ensure that the extra space between displayed char-
acters is blank.
Although the size of the bitmap is fixed by the charac-
ter generator, the actual displayed size of the charac- The displayed character width can be set to any value
ter field can be varied in both dimensions. up to 16 even if each horizontal row of the bitmap is
two bytes wide.
FX D7 to D0
R0 0 1 1 1 0 0 0 0
R1 1 0 0 0 1 0 0 0
R2 1 0 0 0 1 0 0 0
R3 1 0 0 0 1 0 0 0
Character
height R4 1 1 1 1 1 0 0 0
R5 1 0 0 0 1 0 0 0
R6 1 0 0 0 1 0 0 0
R7 0 0 0 0 0 0 0 0
FY
R8 0 0 0 0 0 0 0 0
R9 0 0 0 0 0 0 0 0
R10 0 0 0 0 0 0 0 0
R11 0 0 0 0 0 0 0 0 Space
Space
data
R12 0 0 0 0 0 0 0 0
R13 0 0 0 0 0 0 0 0
R14 0 0 0 0 0 0 0 0
R15 0 0 0 0 0 0 0 0
Space
Character width Space
data
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5.0 Display Control Functions 5.1
Horizontal
FX non-display
area
Character
Height
FY
16 dots
Space
Vertical
non-display
area
8 dots 8 dots
Note: The SED1330F/1335F/1336F does not automatically insert spaces between characters. If the displayed character size is
8 pixels or less and the space between character origins is nine pixels or more, the bitmap must use two bytes per row,
even though the character image requires only one.
Figure 47. Character width greater than one byte wide ([FX] = 9)
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5.2 – 5.2.2 5.0 Display Control Functions
5.2 Screen Configuration
The basic screen configuration of the SED1330F/ Figure 40 shows the relationship between the virtual
1335F/1336F is as a single text screen or as overlap- screens and the physical screen.
ping text and graphics screens. The graphics screen
uses eight times as much display memory as the text
screen.
A/P
C/R
0000H
Character
memory area
0800H
07FFH
Graphics
memory area
Display 47FFH
memory
window (0,YM)
(XW,YM)
Y (XM,YM)
(0,0)
(XM,0)
The SED1330F/1335F/1336F scans the display memory In text mode, the address counter is set to the same
in the same way as a raster scan CRT screen. Each row start address, and the same character data is read, for
is scanned from left to right until the address range each row in the character bitmap. However, a new row
equals C/R. Rows are scanned from top to bottom. of the character generator output is used each time.
Once all the rows in the character bitmap have been
In graphics mode, at the start of each line, the address displayed, the address counter is set to the start
counter is set to the address at the start of the previous address plus AP and the next line of text is displayed.
line plus the address pitch, AP.
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5.0 Display Control Functions 5.2.2
1
• SAD SAD + 1 SAD + 2 SAD + C/R
•
•
8
9
• SAD + AP SAD + AP SAD + AP SAD + AP
• +1 +2 + C/R
•
16
17 SAD + 2AP
•
•
•
24
•
•
•
•
C/R
W/S = 0, FX = 8, FY = 8
SAD + AP + C/R
SAD + 2AP
Line 3
C/R
W/S = 0, FX = 8
1
SAD1 SAD1 + 1 SAD1 + 2 SAD1 + C/R
•
•
•
8
9 SAD1 + AP SAD1 + AP SAD1 + AP SAD1 + AP
+1 +2 + C/R
•
•
•
16
17
SAD1 + 2AP
•
•
•
24
25
•
•
•
(L/F)/2 = β
β+1 SAD3 + 1 SAD3 + 2 SAD3 + C/R
•
•
•
β+8
β+9 SAD3 + AP SAD3 + AP SAD3 + AP SAD3 + AP
+1 +2 + C/R
•
•
•
β + 16
β + 17 SAD3 + 2AP
•
•
•
β + 24
β + 25
•
•
•
•
(L/F)
C/R
W/S = 1, FX = 8, FY = 8
Note: In two-panel drive, the SED1330F/1335F/1336F reads line 1 and line β + 1 as one cycle. The upper and lower panels are
thus read alternately, one line at a time.
Figure 44 shows the basic timing of the SED1330F/ cycles, though the LCD drive signals are still gener-
1335F/1336F. One display memory read cycle takes ated. TC/R may be set to any value within the con-
nine periods of the system clock, φ0 (f OSC). This cycle straints imposed by C/R, fOSC, fFR, and the size of the
repeats (C/R + 1) times per display line. LCD panel, and it may be used to fine tune the frame
frequency. The microprocessor may also use this
When reading, the display memory pauses at the end pause to access the display memory data.
of each line for (TC/R – C/R) display memory read
φ0
T0 T1 T2
Display read cycle interval
VCE
Graphics generator
Character read interval Graphics read interval read interval
VA
Line 1 O R
2 O R
3 O R
Frame
period •
•
•
•
•
(L/F) O R
LP
Note: The divider adjustment interval (R) applies to both the upper and lower screens even if W/S = 1. In this case, LP is active
only at the end of the lower screen’s display interval.
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5.3 – 5.3.3 5.0 Display Control Functions
5.3 Cursor Control
5.3.1 Cursor Register Function the cursor layer moved within the display memory if it
is necessary to display the cursor on a layer other than
The SED1330F/1335F/1336F cursor address regis- the present cursor layer.
ter functions as both the displayed cursor position
address register and the display memory access Although the cursor is normally displayed for charac-
address register. When accessing display memory ter data, the SED1330F/1335F/1336F may also dis-
outside the actual screen memory, the address regis- play a dummy cursor for graphical characters. This is
ter must be saved before accessing the memory and only possible if the graphics screen is displayed, the
restored after memory access is complete. text screen is turned off and the microprocessor
generates the cursor control address.
Cursor display
address register
Cursor register D=1
Address pointer
FC1 = 0
Figure 54. Cursor addressing Cursor ON
FC0 = 1
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5.0 Display Control Functions 5.3.3
18 dots
Auto shift
If no text screen is displayed, only a bar cursor can be SED1330F/1335F/1336F automatically decides which
displayed at the cursor address. cursor shape to display. On the text screen it displays
a block cursor, and on the graphics screen, a bar
If the first layer is a mixed text and graphics screen cursor.
and the cursor shape is set to a block cursor, the
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5.4 5.0 Display Control Functions
5.4 Memory to Display Relationship
The SED1330F/1335F/1336F supports virtual blocks, with each block able to display a different
screens that are larger than the physical size of the portion of the virtual screen.
LCD panel address range, C/R. A layer of the
SED1330F/1335F/1336F can be considered as a This enables, for example, one block to dynamically
window in the larger virtual screen held in display scroll through a data area while the other acts as a
memory. This window can be divided into two status message display area. See Figure 49 and 50.
AP
C/R
SAD1
W/S = 0 W/S = 1
Character page 1 SAD1
SAD3
Character page 3 SAD3 Display page 1
Display page 1 Display page 3
SAD2
Character page 2 SAD2 Layer 1
Layer 1 SAD4
Character page 2 SAD4 Display page 2
Display page 2 C/R Display page 4
Layer 2
Layer 2
CG RAM
SAD1 C/R
Character page 1
SAD1
Display page 1 C/R
SAD3
Display page 3 SAD3 Character page 3
Layer 1
SAD2 C/R
SAD2
Display page 2
Graphics page 2
Layer 2
C/R
SAD3
Graphics page 3
SAD3 C/R
SAD2 Display page 3 SAD2 Graphics page 2
SAD1 Display page 2
Display page 1
C/R
SAD1
Graphics page 1
Layer 1 Layer 2
Layer 3
AP
0000H
FX
SAD1
FY CRY
CSRA CRX
Display
L/F window
Virtual display
memory limit
CRX
FFFFH
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5.4
D7 to D0 D7 to D0
SAD1
0000
A (Code) 0000
SL1 Page 1 ABC
Character B
code 0300
0400
C
Page 2
XY
0800 Display
SAD2 X
Page 1
SL2 Y 02FF
2000 α β
2800 α 0080
Back layer
β (MSB) (LSB)(MSB) (LSB)
D7 D0 D7 D0
Page 2
γ
4440
SAG
4800
χ 1FFF
Character generator
RAM
4A00
HEX D7 D0
Not used
Example of character A
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89
5.0 Display Control Functions
5.0 Display Control Functions 5.5 – 5.5.1
5.5 Scrolling 5.5.1 On-page Scrolling
The controlling microprocessor can set the SED1330F/ The normal method of scrolling within a page is to
1335F/1336F scrolling modes by overwriting the scroll move the whole display up one line and erase the
address registers SAD1 to SAD4, and by directly bottom line. Since the SED1330F/1335F/1336F does
setting the scrolling mode and scrolling rate. not automatically erase the bottom line, it must be
erased with blanking data when changing the scroll
address register.
Display memory
AP
C/R
SAD3 Blank
WXYZ 789
Blank
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5.5.2 5.0 Display Control Functions
5.5.2 Inter-page Scrolling
Display memory
AP
C/R
WXYZ 789
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5.0 Display Control Functions 5.5.3
5.5.3 Horizontal Scrolling
AP
C/R
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5.5.4 – 5.5.5 5.0 Display Control Functions
5.5.4 Bidirectional Scrolling
Bidirectional scrolling can be performed only if the SCR command can be used to scroll horizontally in
display memory is larger than the physical screen pixel units. Single-pixel scrolling both horizontally and
both horizontally and vertically. Although scrolling is vertically can be performed by using the SCROLL and
normally done in single-character units, the HDOT HDOT SCR commands. See Section 9.4
Display memory
AP
BC
Before scrolling EFG
TUV A BC
12 EFG
TUV
12 34
567
C/R 89
ABC
E FG
FG TUV
After scrolling TUV
1234
56
1234
56 7
89
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6.0
Character Generator
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6.0 – 6.1.3 6.0 Character Generator
6.0 Character Generator
6.1 CG Characteristics
6.1.1 Internal Character Generator • Mapped into the display memory address space
at F000H to F7FFH (M2 = 0) or F000H to
The internal character generator is recommended for FFFFH (M2 = 1)
minimum system configurations containing a • Characters can be up to 8 × 16-pixels; how-
SEDSED1330F/1335F/1336F, display RAM, LCD ever, excess bits must be set to zero.
panel, single-chip microprocessor and power supply.
Since the internal character generator uses a CMOS
mask ROM, it is also recommended for low-power
applications.
6.1.3 Character Generator RAM
• 5 × 7-pixel font (See Section 10)
The user can freely use the character generator RAM
• 160 JIS standard characters
for storing graphics characters. The character gen-
• Can be mixed with character generator RAM erator RAM can be mapped by the microprocessor
(maximum of 64 CG RAM characters) anywhere in display memory, allowing effective use of
• Can be automatically spaced out up to 8 × 16 unused address space.
pixels
• Up to 8 × 8-pixel characters (M2 = 0) or 8 × 16
characters (M2 = 1)
• Up to 256 characters if mapped at F000H to
6.1.2 External Character Generator ROM FFFFH (64 if used together with character
generator ROM)
The external CG ROM can be used when fonts other • Can be mapped anywhere in display memory
than those in the internal ROM are needed. Data is address space if used with the character gen-
stored in the external ROM in the same format used erator ROM
in the internal ROM. (See Section 6.3.) • Mapped into the display memory address space
at F000H to F7FFH if not used with the charac-
• Up to 8 × 8-pixel characters (M2 = 0) or 8 × 16-
ter generator ROM (more than 64 characters
pixel characters (M2 = 1)
are in the CG RAM). Set SAG0 to F000H and
• Up to 256 characters (192 if used together with M1 to zero when defining characters number
the internal ROM) 193 upwards.
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6.0 Character Generator 6.2
6.2 CG Memory Allocation
Since the SED1335F/1336F uses 8-bit character required, character generator memory can be bank-
codes, it can handle no more than 256 characters at switched using the CGRAM ADR command.
a time. However, if a wider range of characters is
Built–in CG ROM
(160 characters,
5 × 7 pixels max.) CG RAM n
CG RAM 2
Basic CG space
(256 characters,
8 × 16 pixels max.) 256 characters max.
CG RAM M1 = 0
CG ROM
M0 = 1 256 characters max.
Built-in CG ROM
(160 characters, M1 = 0
5 × 7 pixels max.)
CG RAM n
CG RAM 2
CG RAM
CG ROM CG RAM 1
ADR
(64 characters max, 8 × 16 pixels max)
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6.2 – 6.3 6.0 Character Generator
Table 22. Character mapping
Item Parameter Remarks
Internal/external character generator selection M0
1 to 8 pixels M2 = 0
Character field height 9 to 16 pixels M2 = 1
Greater than 16 pixels Graphics mode (8 bits × 1 line)
Internal CG ROM/RAM select Determined by the
Automatic
External CG ROM/RAM select character code
CG RAM bit 6 correction M1
Specified with CG RAM ADR Can be moved anywhere in the
CG RAM data storage address
command display memory address space
192 characters or less Other than the area of Figure 58
External CG ROM
address Set SAG to F000H and overly
More than 192 characters
SAG and the CG ROM table.
The CG RAM addresses in the VRAM address space address calculated from SAG + character code +
are not mapped directly from the address in the SAG ROW select address. This mapping is shown in Tables
register. The data to be displayed is at a CG RAM 23 and 24.
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6.0 Character Generator 6.3 – 6.3.2
As the character code table in Figure 58 shows, codes
80H to 9FH and E0H to FFH are allocated to the CG
Row R3 R2 R1 R0 RAM and can be used as desired. 80H is thus the first
Row 0 0 0 0 0
code for CG RAM. As characters cannot be used if
only using graphics mode, there is no need to set the
Row 1 0 0 0 1 CG RAM data.
Row 2 0 0 1 0
Line 1 Table 25. Character data example
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6.4 6.0 Character Generator
6.4 Character Codes
Upper 4 bits
Lower 4 bits 0 1 2 3 4 5 6 7 8 8 A B C D E F
0 0 @ P ' p
1 ! 1 A Q a q
2 " 2 B R b r
3 # 3 C S c s
4 $ 4 D T d t
5 % 5 E U e u
6 & 6 F V f v
7 ' 7 G W g w
8 ( 8 H X h x
9 ) 9 I Y i y
A * : J Z j z
B + ; K [ k {
C , < L ¥ l |
D . + M ] m }
E - \> N ^ n →
F / ? O _ o ←
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7.0
TV Mode
(SED1336F only)
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7.0 – 7.1 7.0 TV Mode (SED1336F only)
7.0 TV Mode (SED1336F only)
When used with an external video mixer circuit, the The TV and LCD display register parameters which
SED1336F can show the same display on a television are determined by hardware constraints are shown in
as on the LCD panel. In addition, the changeover from Table 26.
LCD-only to TV-and-LCD display is instantaneous
with the changing of the T/L register using the System
Set instruction.
The NTSC and PAL vertical sync signal waveforms vertical sync timing parameters and VSD output states
are shown in Figure 59 and 60, respectively. The are shown in Table 27.
Pre-blanking Start of
H H H H
interval field I Equalizing Vertical serration 0.5H
Horizontal pulse interval pulse interval
sync interval
Reference Post-
Display Interval before Vertical Sync Interval after Display
subcarrier phase blanking
interval equalizing pulses pulse interval equalizing pulses color field I interval interval
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7.0 TV Mode (SED1336 only) 7.1
311 312 313 314 315 316 317 318 319 320 335
Reference Post-
Display Pre-blanking Interval before Vertical sync Interval after subcarrier phase blanking Display
period interval equalizing pulses pulse interval equalizing pulses interval
color field I interval
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7.1 7.0 TV Mode (SED1336 only)
The horizontal sync signal waveforms are shown in states, in Table 28. Note that SNC and VSD are both
Figure 61, and the timing parameters and VSD output high-impedance when in LCD mode.
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8.0
Description of Circuit Blocks
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8.0 – 8.1.2.3 8.0 Description of Circuit Blocks
8.0 Description of Circuit Blocks
SEL1, SEL2 (SED1330F and SED1335F only), A0, The SED1330F/1335F/1336F interface operates at
RD, WR and CS are used as control signals for the full bus speed, completing the execution of each
microprocessor data bus. A0 is normally connected to command within the cycle time, tCYC. The controlling
the lowest bit of the system address bus. SEL1 and micro-processor’s performance is thus not hampered
SEL2 change the operation of the RD and WR pins to by polling or handshaking when accessing the
enable interfacing to either an 8080 or 6800 family SED1330F/1335F/1336F.
bus, and should have either a pull-up or a pull-down
resistor. Display flicker may occur if there is more than one
consecutive access that cannot be ignored within a
With microprocessors using an 8080 family interface, frame. The microprocessor can minimize this either
the SED1330F/1335F/1336F is normally mapped into by performing these accesses intermittently, or by
the I/O address space. continuously checking the status flag (D6) and waiting
for it to become HIGH.
8.1.1.1 8080 series
Table 29. 8080 series interface signals 8.1.2.1 Display Status Indication Output
A0 RD WR Function (For SED1336 only)
0 0 1 Status flag read When CS, A0 and RD are LOW, D6 functions as the
Display data and cursor address display status indication output. It is HIGH during the
1 0 1
read TV-mode vertical retrace period or the LCD-mode
0 1 0 Display data and parameter write horizontal retrace period, and LOW, during the period
the controller is writing to the display. By monitoring
1 1 0 Command write
D6 and writing to the data memory only during retrace
periods, the display can be updated without causing
screen flicker.
8.1.1.2 6800 series
Table 30. 6800 series interface signals 8.1.2.2 Internal Register Access
A0 RD WR Function
The SYSTEM SET and SLEEP IN commands can be
0 1 1 Status flag read used to perform input/output to the SED1330F/1335F/
Display data and cursor address 1336F independently of the system clock frequency.
1 1 1
read These are the only commands that can be used while
0 0 1 Display data and parameter write the SED1330F/1335F/1336F is in sleep mode.
1 0 1 Command write
8.1.2.3 Display Memory Access
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8.0 Description of Circuit Blocks 8.1.2.3
synchronizes its processing to the SED1330F/1335F/ When reading, the microprocessor first issues the
1336F’s timing. When writing, the microprocessor MREAD command, which causes the SED1330F/
first issues the MWRITE command. It then repeatedly 1335F/1336F to load the first read data into its output
writes display data to the SED1336F using the sys- buffer. The microprocessor then reads data from the
tem bus timing. This ensures that the microprocessor SED1330F/1335F/1336F using the system bus tim-
is not slowed down even if the display memory ing. With each read, the SED1330F/1335F/1336F
access times are slower than the system bus access reads the next data item from the display memory
times. See Figure 70. ready for the next read access. See Figure 71.
tCYC
WR
D0 to D7
WR/W
Display memory
VD0 to VD7
WR
tCYC
Command write
Microprocessor RD
D0 to D7
WR/W
Display memory
VD0 to VD7
Note: A possible problem with the display memory read cycle is that the system bus access time, tACC, does not depend on the display
memory access time, tACV. The microprocessor may only make repeated reads if the read loop time exceeds the SED1330F/
1335F/1336F cycle time, tCYC. If it does not, NOP instructions may be inserted in the program loop. tACC, tACV and tCYC limits
are given in Section 4.3.
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8.1.3 – 8.1.3.1 8.0 Description of Circuit Blocks
8.1.3 Interface Examples
IORQ
A0 A0
A1
to Decoder CS
A15
SED1335F/
Z80® D0 D0
to to 1336F
D7 D7
RD RD SEL 1
WR WR SEL 2
RESET RES
RESET
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8.0 Description of Circuit Blocks 8.1.3.2
8.1.3.2 6802 to SED1330F/1335F/1336F Interface
VMA
A0 A0
A1
to Decoder CS
A15
SED1335F/
6802
D0 D0 1336F
to to VDD
D7 D7
E RD SEL 1
R/W WR SEL 2
RESET RES
RESET
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8.2 – 8.2.2 8.0 Description of Circuit Blocks
8.2 Display Memory Interface
The figure below shows the interface between an 8K Note that bus buffers are required if the bus is heavily
× 8 static RAM and the SED1330F/1335F/1336F. loaded.
HC138
A
VA13 to VA15 to Y CE1
C VDD
VCE
CE2
SED1335F/ 6264 SRAM
1336F
OE
VR/W R/W
I/O1 to I/O8 I/O1 to I/O8
The 24 address and data lines of the SED1330F/ If VOPR = 5.0V, f = 1.0 MHz, and the display memory
1335F/1336F cycle at one-third of the oscillator fre- bus capacitance is 1.0 pF per line:
quency, fOSC. The charge and discharge current on
these pins, IVOP, is given by the equation below. IVOP ≤ 120 µA / MHz × pF
When IVOP exceeds I OPR, it can be estimated by:
To reduce current flow during display memory ac-
IVOP ∝ C V f cesses, it is important to use low-power memory, and
to minimize both the number of devices and the
where C is the capacitance of the display memory parasitic capacitance.
bus, V is the operating voltage, and f is the operating
frequency.
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8.0 Description of Circuit Blocks 8.3 – 8.4
8.3 Oscillator Circuit 8.4 Status Flag
The SED1330F/1335F/1336F incorporates an oscil- The SED1330F/1335F/1336F has a single bit status
lator circuit. A stable oscillator can be constructed flag.
simply by connecting an AT-cut crystal and two ca-
pacitors to OSC1 and OSC2, as shown in the figure D6: X line standby
below. If the oscillator frequency is increased, CD and
CG should be decreased proportionally. D7 D0
Note that the circuit board lines to OSC1 and OSC2 X D6 X X X X X X X: Don’t care
must be as short as possible to prevent wiring capaci-
tance from changing the oscillator frequency or in-
creasing the power consumption. Figure 76. Status flag
SED1335F/1336F The D6 status flag is LOW (0) for the TC/R - C/R cycles
at the end of each line where the SED1330F/1335F/
1336F is not reading the display memory. The micro-
processor may use this period to update display
memory without affecting the display; however, it is
OSC1 OSC2
CD = 3 to 20 pF
recommended that the display be turned off when
refreshing the whole display.
CG CD CG = 2 to 18 pF
LP
tTC/R
tm tC/R
XSCL
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8.4 – 8.5 8.0 Description of Circuit Blocks
8.5 Reset
VDD
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9.0
Application Notes
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9.0 – 9.1.1 9.0 Application Notes
9.0 Application Notes
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9.0 Application Notes 9.1.2
9.1.2 Initialization Example
The initialization example shown in Figure 80 is for a sor interface bus display unit (512 × 128 pixels).
SED1330F/1335F/1336F with an 8-bit microproces-
Clear first
Start
memory layer
Clear second
Supply on
memory layer
Output display
OVLAY data
DISP OFF
Note: Set the cursor address to the start of each screen’s layer memory, and use MWRITE to fill the memory with space
characters, 20H (text screen only) or 00H (graphics screen only). Determining which memory to clear is explained in section
9.1.3.
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9.1.2 9.0 Application Notes
Table 32. Initialization procedure
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9.0 Application Notes 9.1.2
Table 32. Initialization procedure (continued)
Display memory
5 HDOT SCR
C = 5AH
P1 = 00H Set horizontal pixel shift to zero
6 OVLAY
C = 5BH
P1 = 01H MX 1, MX 0: Inverse video superposition
DM 1: First screen block is text mode
DM 2: Third screen block is text mode
7 DISP ON/OFF
C = 58H D: Display OFF
P1 = 56H FC1, FC0: Flash cursor at 2 Hz
FP1, FP0: First screen block ON
FP3, FP2: Second and fourth screen blocks ON
FP5, FP4: Third screen block ON
8 Clear data in first layer Fill first screen layer memory with 20H (space character)
(continued)
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9.1.2 9.0 Application Notes
Table 32. Initialization procedure (continued)
Display
Character code in every position
1st layer
Blank code in every position
2nd layer
10 CSRW
C = 46H
P1 = 00H Set cursor to start of first screen block
P2 = 00H
11 CSR FORM
C = 5DH
P1 = 04H CRX: Horizontal cursor size = 5 pixels
P2 = 86H CRY: Vertical cursor size = 7 pixels
CM: Block cursor
12 DISP ON/OFF
C = 59H Display ON
Display
13 CSR DIR
C = 4CH Set cursor shift direction to right
(continued)
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9.0 Application Notes 9.1.2
Table 32. Initialization procedure (continued)
EPSON
15 CSRW
C = 46H
P1 = 00H Set cursor to start of second screen block
P2 = 10H
16 CSR DIR
C = 4FH Set cursor shift direction to down
17 MWRITE
C = 42H
P1 = FFH Fill in a square to the left of the ‘E’
↓
P9 = FFH
EPSON
18 CSRW
C = 46H
P1 = 01H Set cursor address to 1001H
P2 = 10H
19 MWRITE
C = 42H
(continued)
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9.1.2 9.0 Application Notes
Table 32. Initialization procedure (continued)
30 CSRW
C = 46H
P1 = 00H Set cursor to line three of the first screen block
P2 = 01H
31 CSR DIR
C = 4CH Set cursor shift direction to right
32 MWRITE
C = 42H
P1 = 44H ‘D’
P2 = 6FH ‘o’
P3 = 74H ‘t’ Inverse display
P4 = 20H ‘’
P5 = 4DH ‘M’
P6 = 61H ‘a’ EPSON
P7 = 74H ‘t’
P8 = 72H ‘r’
P9 = 69H ‘i’ Dot matrix LCD
P10 = 78H ‘x’
P11 = 20H ‘’
P12 = 4CH ‘L’
P13 = 43H ‘C’
P14 = 44H ‘D’
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9.0 Application Notes 9.1.3
9.1.3 Display Mode Setting Example 1: Combining Text and Graphics
03E8H
2nd graphics layer
(8000 bytes)
0000H
1st character layer 2327H
(1000 bytes)
03E7H
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9.1.3 – 9.1.4 9.0 Application Notes
CSR FORM OVLAY
C= 5DH C= 5BH
P1 = 04H P1 = 00H
P2 = 86H
DISP ON/OFF
HDOT SCR C= 59H
C= 5AH P1 = 16H
P1 = 00H
X = Don’t care
1F40H
2nd graphics layer
(8000 bytes)
0000H
1st graphics layer 3E7FH
(8000 bytes)
1F3FH
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9.0 Application Notes 9.1.4 –9.1.5
• Register setup procedure CSR FORM
C= 40H P1 = 07H
P1 = 30H fOSC = 6 MHz P2 = 87H
P2 = 87H fFR = 70 Hz
P3 = 07H HDOT SCR
P8 = 00H C= 5BH
P1 = 0CH
SCROLL
C= 44H DISP ON/OFF
P1 = 00H C= 59H
P2 = 00H P1 = 16H
P3 = C8H
P4 = 40H X = Don’t care
P5 = 1FH
P6 = C8H
P7 = XH
P8 = XH
P9 = XH
P10 = XH
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9.1.5 9.0 Application Notes
3E80H
3rd graphics layer
(8000 bytes)
1F40H
2nd graphics layer 5DBFH
(8000 bytes)
0000H
1st graphics layer 3E7FH
(8000 bytes)
1F3FH
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9.0 Application Notes 9.1.5 – 9.2
CSR FORM OVLAY
C= 5DH C= 5BH
P1 = 07H P1 = 1CH
P2 = 87H
DISP ON/OFF
HDOT SCR C= 59H
C= 5AH P1 = 16H
P1 = 00H
X = Don’t care
Figure 84 shows the SED1330F/1335F/1336F in a Since all of the LCD control circuits are integrated
typical system. The microprocessor issues instruc- onto the SED1330F/1335F/1336F, few external com-
tions to the 1330F/SED1335F/1336F, and the ponents are required to construct a complete me-
SED1330F/1335F/1336F drives the LCD panel and dium-resolution liquid crystal display.
may have up to 64Kbytes of display memory.
SED1335F/1336F
Main
memory TV
X driver X driver X driver
control*
Data bus
Address bus Composite LCD panel
Y driver
signal
Control bus
TV
* SED1336F only
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9.3 – 9.3.1 9.0 Application Notes
9.3 System Interconnection
9.3.1 SED1330F/1335F
10MHz crystal
HC138
OSC1 OSC2 CS7
Y7
CS6
A0 A0 VA13 A Y6
to B to
to
VA15 C CS0
A1 Y0
VCE
to VR/W
A7 Decoder CS
VA0 VA12
IORQ to
VA12
Micro-
processor A0 to A12 WE A0 to A12 WE A0 to A11
D0 D0 SED1335F SRM2064 CS1 SRM2064 CS1 2732 OE
to to (RAM1) CS2 (RAM2) CS2 (CGROM)
D7 D7
D0 to D7 OE D0 to D7 OE D0 to D7 CE
RD RD
WR WR
RES RES VD0
XD0 to
to VD7
RESET
XD3
XECL
XSCL
YSCL
YDIS
WF
YD
LP
LAT
DI
INH LCD
FR
YSCL
POFF SED1630F
XSCL
XSCL
converter
ECL
ECL
ECL
V3
DO
DO
DO
D3
D3
D3
LP
LP
LP
to
to
to
V4
VREG V5
LCD UNIT
Notes:
1. The recommended common drivers are the SED1743, SED1635.
2. The recommended segment drivers are the SED1742 and SED1606.
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9.0 Application Notes 9.3.2
9.3.2 SED1336F
10MHz crystal
HC138
OSC1 OSC2 CS7
Y7
CS6
A0 A0 VA13 A Y6
to B to
to
VA15 C CS0
A1 Y0
VCE
to VR/W
A7 Decoder CS
VA0 VA12
IORQ to
VA12
Micro-
processor A0 to A12 WE A0 to A12 WE A0 to A11
D0 D0 SED1336F SRM2064 CS1 SRM2064 CS1 2732 OE
to to (RAM1) CS2 (RAM2) CS2 (CGROM)
D7 D7
D0 to D7 OE D0 to D7 OE D0 to D7 CE
RD RD
WR WR
RES RES VD0
XD0 to
to VD7
RESET
XD3
XSCL
YDIS
WF
YD
LP
DI
INH LCD
FR
YSCL
POFF SED1630F
XSCL
XSCL
converter
ECL
V3
DO
DO
DO
D3
D3
D3
LP
LP
LP
to
to
to
V4
VREG V5
LCD UNIT
Notes:
1. The recommended common drivers are the SED1743, SED1635.
2. The recommended segment drivers are the SED1742 and SED1606.
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9.3.2 – 9.4 9.0 Application Notes
• Graphics data table 9.4 Smooth Horizontal Scrolling
• Contains graphics bitmaps
Figure 87 illustrates smooth display scrolling to the
• Word length is 8 bits left. When scrolling left, the screen is effectively
• Table mapping can be changed moving to the right, over the larger virtual screen.
• CG ROM table To scroll the display to the right, the reverse proce-
• Used when the internal character genera- dure is followed.
tor is not adequate When the edge of the virtual screen is reached, the
• Can be used in conjunction with the inter- microprocessor must take appropriate steps so that
nal character generator and external char- the display is not corrupted. The scroll must be stopped
acter generator RAM or the display modified.
• Character sizes up to 8 × 16-pixels (16
bytes per character) Note that the HDOT SCR command cannot be used
to scroll individual layers.
• Maximum of 256 characters
• Fixed mapping at F000H to FFFFH
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9.0 Application Notes 9.4
P1 = 00H Magnified
AP
P1 = 01H
SAD = SAD
P1 = 02H
Display
P1 = 03H C/R
Virtual screen
P1 = 07H
P1 = 00H
SAD = SAD + 1
Note: The response time of LCD panels changes considerably at low temperatures. Smooth scrolling under these conditions may
make the display difficult to read.
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9.5 – 9.5.2.1 9.0 Application Notes
9.5 Layered Display Attributes
Attribute MX1 MX0 Combined layer display 1st layer display 2ndt layer display
0 1
Reverse IV EPSON IV EPSON
1 1
0 0
Half-tone ME Yes, No ME Yes, No
1 1
0 0
Local flashing BL Error BL Error
0 1
0 0
Ruled line RL LINE RL LINE
0 1
LINE LINE
1 1
The first layer is text, the second layer is graphics. The FP parameter can be used to generate half-
intensity display by flashing the display at 17 Hz. Note
1. CSRW, CSDIR, MWRITE that this mode of operation may cause flicker prob-
Write 1s into the graphics screen at the area to lems with certain LCD panels.
be inverted.
2. OVLAY: MX0 = 1, MX1 = 0
Set the combination of the two layers to 9.5.2.1 Menu Pad Display
Exclusive-OR.
Turn flashing off for the first layer, on at 17 Hz for the
3. DISP ON/OFF: FP0 = FP1 = 1, FP1 = FP3 = second layer, and combine the screens using the OR
0. function.
Turn on layers 1 and 2.
1. OVLAY: P1 = 00H
2. DISP ON/OFF: P1 = 34H
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9.0 Application Notes 9.5.2.1 – 9.5.3.2
AB AB
To present two overlaid graphs on the screen, config- 9.5.3.1 Small Area
ure the display as for the menu bar display and put one
graph on each screen layer. The difference in contrast To flash selected characters, the MPU can alternately
between the half- and full-intensity displays will make write the characters as character codes and blank
it easy to distinguish between the two graphs and help characters at intervals of 0.5 to 1.0 seconds.
create an attractive display.
1. OVLAY: P1 = 00H
9.5.3.2 Large Area
2. DISP ON/OFF: P1 = 34H
Divide both layer 1 and layer 2 into two screen blocks
each, layer 2 being divided into the area to be flashed
and the remainder of the screen. Flash the layer 2
screen block at 2 Hz for the area to be flashed and
combine the layers using the OR function.
ABC ABC
XYZ XYZ
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9.6 – 9.6.2 9.0 Application Notes
9.6 16 × 16-dot Graphic Display
This example shows how to display 16 × 16-pixel The program for writing large characters operates as
characters. The command sequence is as follows: follows:
CSRW Set the cursor address. 1. The microprocessor reads the character data
CSRDIR Set the cursor auto-increment di- from its ROM.
rection. 2. The microprocessor sets the display address
MWRITE Write to the display memory. and writes to the VRAM. The flowchart is
shown in Figure 91.
A0 = 0 A0 = 1
O8 O7 O6 O5 O4 O3 O2 O1 O8 O7 O6 O5 O4 O3 O2 O1 CG ROM output
0H (1) (2)
1H (3) (4)
2H (5) (6)
(n) shows the CG ROM data
3H (7) (8) readout order
4H (9) (10)
5H (11) (12)
6H (13) (14)
7H (15) (16)
8H (17) (18)
9H (19) (20)
AH (21) (22)
BH (23) (24)
CH (25) (26)
DH (27) (28)
EH (29) (30)
FH (31) (32) (Kanji ROM pattern)
1st column 2nd column
Scan address A1 to A4
(6)
(4)
(2)
Data held in the microprocessor memory Data written into the SED1330 display memory
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9.0 Application Notes 9.6 – 9.6.2
320 dots
(1) (2)
(3) (4)
(5) (6) 240 dots
(7) (8)
(9) (10)
(11) (12)
(13) (14)
(15) (16)
(17) (18)
(19) (20)
(21) (22)
(23) (24)
(25) (26)
(27) (28)
(29) (30)
(31) (32)
Write data
Write data
End
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THIS PAGE INTENTIONALLY BLANK
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10.0 10.0 Internal Character Generator Font
10.0 Internal Character Generator Font
5
Character code bits 4 to 7
Note: The shaded positions indicate characters that have the whole 6 × 8 bitmap blackened.
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THIS PAGE INTENTIONALLY BLANK
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11.0
Glossary of Terms
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THIS PAGE INTENTIONALLY BLANK
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11.0 11.0 Glossary of Terms
11.0 Glossary of Terms
A Address
CG Character generator
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11.0 Glossary of Terms 11.0
MREAD Display memory read instruction
P Parameter
R Row
S-MOS assumes no responsibility or liability for (1) any errors or inaccuracies contained in the
information herein and (2) the use of the information or a portion thereof in any application,
including any claim for (a) copyright or patent infringement or (b) direct, indirect, special or
consequential damages. There are no warranties extended or granted by this document. The
information herein is subject to change without notice from S-MOS.
September 1995 © Copyright 1995 S-MOS Systems, Inc. Printed in U.S.A. 268-0.4
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