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Department of Electrical Engineering Technology Revision No. 1

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FACULTY OF ENGINEERING TECHNOLOGY

DEPARTMENT OF ELECTRICAL ENGINEERING TECHNOLOGY

ONLINE LEARNING
WORKING INSTRUCTION AND REPORT

Course Code & Name BNR23502 / ELECTRICAL LABORATORY II

Code & Title of Experiment Lab 8 - Proteus Schematic and PCB Development
Date of Experiment
Programme BND, BNE, BNF
Section/Group Section : Group :
Name/Nama Matrix No.
Group Members 1.
2.
3.
Instructor Name Ts. Hazli Bin Roslan
Schematic Labwork 1 /5%
PCB Layout Labwork 1 /5%
C Schematic Labwork 2 /5%
PCB Layout Labwork 2 /10%
Conclusion /10%
Schematic Labwork 1 /5%
PCB Layout Labwork 1 /5%
Assessment 3D Visualizer Labwork 1 /5%
P
Schematic Labwork 2 /15%
PCB Layout Labwork 2 /15%
3D Visualizer Labwork 2 /5%
Discussion /10%
A
Ethic, Teamwork & Discipline /5%

TOTAL /100%
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1. EXPERIMENT LEARNING OUTCOMES

At the end of the experiment, students should be able to:

1.1. Able to make schematic diagram and Printed Circuit Board (PCB) layout by using Proteus
Software (A2, PLO4)
1.2. Understand how to make simulations and convert schematics to PCB layouts (C3, PLO4)
1.3. Simulate a circuit diagram on a Proteus Software (P3, PLO2)

2. GENERAL INSTRUCTION

1. Grouping: Lab group is predetermined and consists of at most THREE team members.
2. Lab Activities: The learning process and lab activities are online.
3. Report Organization: Report must be organized according to a given answer sheet.
4. Report Submission: The report should be submitted a week after the date the lab was
conducted. Duplication of reports is prohibited and deduction of marks or ZERO mark will be
made to the group members involved.

3. INTRODUCTION / THEORY

3.1 PROTEUS

Ref: https://www.labcenter.com/

3.5.1 Proteus

Proteus is used to simulate, design and drawing of electronic circuits. It was invented by the
Labcenter electronic. By using proteus you can make two-dimensional circuits designs as well. With the use
of this engineering software, you can construct and simulate different electrical and electronic circuits on
your personal computers or laptops.
There are numerous benefits to simulate circuits on proteus before make them practically.
Designing of circuits on the proteus takes less time than practical construction of the circuit. The possibility
of error is less in software simulation such as loose connection that takes a lot of time to find out
connections problems in a practical circuit. Circuit simulations provide the main feature that some
components of circuits are not practical then you can construct your circuit on proteus. There is zero
possibility of burning and damaging of any electronic component in proteus.
The electronic tools that are very expensive can easily get in proteus such as an oscilloscope. Using
proteus you can find different parents of circuits such as current, a voltage value of any component and
resistance at any instant which is very difficult in a practical circuit.
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Department of Electrical Engineering Technology Revision No. 1

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3.5.2 Features of Proteus

There are 2 main parts of proteus first is used to design and draw different circuits and the second is for
designing of PCB layout.
 ISIS that used to design and simulate circuits.
 ARES that used for designing of a printed circuit board.

It also provides features related to the three-dimensional view of design in PCB.

3.5.3 Circuit Simulation Software

Proteus Virtual System Modelling (VSM) blends mixed-mode SPICE simulation with world leading
fast microcontroller simulation. It enables rapid prototyping of both hardware and firmware designs, in
software. Design, Test and Debug your embedded projects in the Proteus electronic circuit simulator before
a physical prototype is ordered. Agile development for the embedded systems workflow.

 Complete Embedded Workflow

For embedded engineers, Proteus VSM bridges the gap in the design life cycle between schematic
capture and PCB layout. It enables you to write and apply your firmware to a supported microcontroller on
the schematic and then co-simulate the program within a mixed-mode SPICE circuit simulation, including
MCU peripherals. You can interact with the design using on screen indicators such as LED and LCD
displays as well as actuators such as switches and buttons. Proteus VSM also provides extensive debugging
facilities including breakpoints, single stepping and variable display for both assembly code and high level
language source.

 Design
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Proteus VSM uses our proven Schematic Capture software to provide the environment for design
entry and development. Proteus capture is a long established product and combines ease of use with
powerful editing tools. It is capable of supporting schematic capture for both simulation and PCB design.
The Proteus schematic capture module also provides a very high degree of control over the drawing
appearance, in terms of line widths, fill styles, fonts, etc. These capabilities are used to the full in providing
the graphics necessary for circuit animation.

 Simulation

The most exciting and important feature of Proteus VSM is its ability to simulate the interaction between
software running on a microcontroller and any analogue or digital electronics connected to it. The micro-
controller model sits on the schematic along with the other elements of your product design. It simulates the
execution of your object code (machine code), just like a real chip. If the program code writes to a port, the
logic levels in circuit change accordingly, and if the circuit changes the state of the processor's pins, this will
be seen by your program code, just as in real life.
The VSM CPU models fully simulate I/O ports, interrupts, timers, USARTs and all other peripherals
present on each supported processor. It is anything but a simple software simulator since the interaction of
all these peripherals with the external circuit is fully modelled down to waveform level and the entire system
is therefore simulated.
With over 750 supported micro-processor variants, many thousands of embedded SPICE models and one
the worlds largest libraries of embedded simulation peripherals, Proteus VSM remains the first choice for
embedded simulation.

 Measurement and Analysis

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Proteus VSM includes a number of virtual instruments including an Oscilloscope, Logic

Analyser, Function Generator, Pattern Generator, Counter Timer and Virtual Terminal as well as simple
voltmeters and ammeters. In addition, we provide dedicated Master/Slave/Monitor mode protocol
analysers for SPI and I2C - simply wire them onto the serial lines and monitor or interact with the data
live during simulation. A truly invaluable (and inexpensive!) way to get your communication software
right prior to hardware prototyping.
Should you wish to take detailed measurements on graphs, or perform other analysis types such
as frequency, distortion, noise or sweep analyses of analogue circuits, you can purchase the Advanced
Simulation Option. This option also includes Conformance Analysis - a unique and powerful tool for
Software Quality Assurance.

 Debugging

Whilst Proteus VSM is already unique in its capability to run near real time simulations of
complete micro-controller systems, its real power comes from its ability to perform these simulations in
single step mode. This works just like your favourite software debugger, except that as you single step
the code, you can observe the effect on the entire design - including all the electronics external to the
microcontroller.
In addition to traditional debugging where you set one or breakpoints in your source and then step
the code when they are triggered, Proteus allows you to set breakpoints on the schematic so that a
hardware condition can trigger a breakpoint. If a problem is identifiable as a hardware fault, then using
hardware breakpoints will pause the simulation whenever the fault condition occurs. For example, if
malformed characters were appearing on the LCD display setting a hardware breakpoint on the busy line
would be a good place to start investigating.
The other major tool at your disposal for single step debugging is the watch window. This allows
register and/or address monitoring and also allows you to add variables from the variables window for
inspection. You can set breakpoints on a logical condition of any item added to the watch window
making it easy for example to trap a timer overflow.

 Diagnostics

Proteus is equipped with comprehensive diagnostic or trace messaging. This allows you to
specify which components or processor peripherals that are of interest at any given time and receive
detailed textual reporting of all activity and system interaction. You can specify which on-board
peripherals of the MCU that you want to monitor (e.g. SPI, VIC) and also monitor external peripherals
such as memory devices, LCD displays or brushless motors.
This ability to monitor both sides of communications is invaluable as a debugging aid, allowing
you to locate and fix problems in both software and hardware much faster than you could when working
on a physical prototype.

 The VSM Advantage

The Proteus Design Suite is wholly unique in offering the ability to co-simulate both high and
low-level micro-controller code in the context of a mixed-mode SPICE circuit simulation. With this
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Virtual System Modelling facility, you can truly use agile development philosophy in embedded
engineering projects, reaping huge rewards in terms of reduced time to market and lower costs of
development.
If one person designs both the hardware and the software then that person benefits as the
hardware design may be changed just as easily (and at the same time) as the software design. In larger
organisations where the two roles are separated, the software designers can begin work as soon as the
schematic is completed; there is no need for them to wait until a physical prototype exists.

3.2 PRINTED CIRCUIT BOARD (PCB)

3.2.1 What's a PCB?

Printed circuit board is the most common name but may also be called "printed wiring boards" or
"printed wiring cards". Before the advent of the PCB circuits were constructed through a laborious process
of point-to-point wiring. This led to frequent failures at wire junctions and short circuits when wire
insulation began to age and crack.

A significant advance was the development of wire wrapping, where a small gauge wire is literally
wrapped around a post at each connection point, creating a gas-tight connection which is highly durable
and easily changeable.
As electronics moved from vacuum tubes and relays to silicon and integrated circuits, the size and
cost of electronic components began to decrease. Electronics became more prevalent in consumer goods,
and the pressure to reduce the size and manufacturing costs of electronic products drove manufacturers
to look for better solutions. Thus was born the PCB.
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LilyPad PCB

PCB is an acronym for printed circuit board. It is a board that has lines and pads that connect various
points together. In the picture above, there are traces that electrically connect the various connectors and
components to each other. A PCB allows signals and power to be routed between physical devices. Solder
is the metal that makes the electrical connections between the surface of the PCB and the electronic
components. Being metal, solder also serves as a strong mechanical adhesive.

3.2.2 Composition

A PCB is sort of like a layer cake or lasagna- there are alternating layers of different materials which
are laminated together with heat and adhesive such that the result is a single object.

 FR4

The base material, or substrate, is usually fiberglass. Historically, the most common designator
for this fiberglass is "FR4". This solid core gives the PCB its rigidity and thickness. There are also
flexible PCBs built on flexible high-temperature plastic (Kapton or the equivalent).
You will find many different thickness PCBs; the most common thickness for SparkFun
products is 1.6mm (0.063"). Some of our products- LilyPad boards and Arudino Pro Micro boards-
use a 0.8mm thick board.
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Perf board

Cheaper PCBs and perf boards (shown above) will be made with other materials such as
epoxies or phenolics which lack the durability of FR4 but are much less expensive. You will know
you are working with this type of PCB when you solder to it - they have a very distictive bad smell.
These types of substrates are also typically found in low-end consumer electronics. Phenolics have
a low thermal decomposition temperature which causes them to delaminate, smoke and char
when the soldering iron is held too long on the board.

 Copper

The next layer is a thin copper foil, which is laminated to the board with heat and adhesive. On
common, double sided PCBs, copper is applied to both sides of the substrate. In lower cost
electronic gadgets the PCB may have copper on only one side. When we refer to a double sided or
2-layer board we are referring to the number of copper layers (2) in our lasagna. This can be as few
as 1 layer or as many as 16 layers or more.

PCB with copper exposed, no solder mask or silkscreen.

The copper thickness can vary and is specified by weight, in ounces per square foot. The vast
majority of PCBs have 1 ounce of copper per square foot but some PCBs that handle very high
power may use 2 or 3 ounce copper. Each ounce per square translates to about 35 micrometers or
1.4 thousandths of an inch of thickness of copper.
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 Soldermask

The layer on top of the copper foil is called the soldermask layer. This layer gives the PCB its
green (or, at SparkFun, red) color. It is overlaid onto the copper layer to insulate the copper traces
from accidental contact with other metal, solder, or conductive bits. This layer helps the user to
solder to the correct places and prevent solder jumpers.
In the example below, the green solder mask is applied to the majority of the PCB, covering up
the small traces but leaving the silver rings and SMD pads exposed so they can be soldered to.

Green Solder Mask

Soldermask is most commonly green in color but nearly any color is possible. We use red for
almost all the SparkFun boards, white for the IOIO board, and purple for the LilyPad boards.

 Silkscreen

The white silkscreen layer is applied on top of the soldermask layer. The silkscreen adds
letters, numbers, and symbols to the PCB that allow for easier assembly and indicators for humans
to better understand the board. We often use silkscreen labels to indicate what the function of
each pin or LED.

PCB with silkscreen

Silkscreen is most commonly white but any ink color can be used. Black, gray, red, and even
yellow silkscreen colors are widely available; it is, however, uncommon to see more than one color
on a single board.
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3.2.3 Terminology

Now that you've got an idea of what a PCB structure is, let's define some terms that you may hear when
dealing with PCBs:

 Annular ring - the ring of copper around a plated through hole in a PCB.

Annular ring on resistor & Annular ring on vias

 DRC - design rule check. A software check of your design to make sure the design does not contain
errors such as traces that incorrectly touch, traces too skinny, or drill holes that are too small.

 Drill hit - places on a design where a hole should be drilled, or where they actually were drilled on
the board. Inaccurate drill hits caused by dull bits are a common manufacturing issue.

Bad drill hits, not so accurate, but functional drill hits.

 Finger - exposed metal pads along the edge of a board, used to create a connection between
two circuit boards. Common examples are along the edges of computer expansion or memory
boards and older cartridge-based video games.
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Gold finger PCB

 Mouse bites - an alternative to v-score for separating boards from panels. A number of drill hits
are clustered close together, creating a weak spot where the board can be broken easily after
the fact. See the SparkFun Protosnap boards for a good example.

Mouse bites on the LilyPad ProtoSnap allow the PCB to be snapped apart easily.

 Pad - a portion of exposed metal on the surface of a board to which a component is soldered.

PTH (plated through-hole) pads on the left, SMD (surface mount device) pads on the right.

 Panel - a larger circuit board composed of many smaller boards which will be broken apart
before use. Automated circuit board handling equipment frequently has trouble with smaller
boards, and by aggregating several boards together at once, the process can be sped up
significantly.
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 Paste stencil - a thin, metal (or sometimes plastic) stencil which lies over the board, allowing
solder paste to be deposited in specific areas during assembly.

Demonstration of appling solder paste to stencil PCB

 Pick-and-place - the machine or process by which components are placed on a circuit board.

Pick and place machine

 Plane - a continuous block of copper on a circuit board, define by borders rather than by a path.
Also commonly called a "pour".

Various portions of the PCB that have no traces but has a ground pour instead.
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 Plated through hole - a hole on a board which has an annular ring and which is plated all the
way through the board. May be a connection point for a through hole component, a via to pass
a signal through, or a mounting hole.

Plated through hole resistor

 Pogo pin - spring-loaded contact used to make a temporary connection for test or programming
purposes.

Pogo Pin to test beds.

 Reflow - melting the solder to create joints between pads and component leads.

Reflow Soldering process

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 Silkscreen - the letters, number, symbols, and imagery on a circuit board. Usually only one color
is available, and resolution is usually fairly low.

Silkscreen identifying this LED as the power LED.

 Slot - any hole in a board which is not round. Slots may or may not be plated. Slots sometimes
add to add cost to the board because they require extra cut-out time.

slot

 Solder paste - small balls of solder suspended in a gel medium which, with the aid of a paste
stencil, are applied to the surface mount pads on a PCB before the components are placed.
During reflow, the solder in the paste melts, creating electrical and mechanical joints between
the pads and the component.

Solder paste on a PCB shortly before the components are placed.

 Solder pot - a pot used to quickly hand solder boards with through hole components. Usually
contains a small amount of molten solder into which the board is quickly dipped, leaving solder
joints on all exposed pads.
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Solder Pot

 Soldermask - a layer of protective material laid over the metal to prevent short circuits,
corrosion, and other problems. Frequently green, although other colors (SparkFun red, Arduino
blue, or Apple black) are possible. Occasionally referred to as "resist".

Solder mask covers up the signal traces

 Solder jumper - a small, blob of solder connecting two adjacent pins on a component on a
circuit board. Depending on the design, a solder jumper can be used to connect two pads or pins
together. It can also cause unwanted shorts.

Solder Jumper

 Surface mount - construction method which allows components to be simply set on a board, not
requiring that leads pass through holes in the board. This is the dominant method of assembly in
use today, and allows boards to be populated quickly and easily.
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 Thermal - a small trace used to connect a pad to a plane. If a pad is not thermally relieved, it
becomes difficult to get the pad to a high enough temperature to create a good solder joint. An
improperly thermally relieved pad will feel "sticky" when you attempt to solder to it, and will
take an abnormally long time to reflow.

On the left, a solder pad with two small traces (thermals) connecting the pin to
the ground plane. On the right, a via with no thermals connecting it completely
to the ground plane.

 Thieving - hatching, gridlines, or dots of copper left in areas of a board where no plane or traces
exist. Reduces difficulty of etching because less time in the bath is required to remove unneeded
copper.
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 Trace - a continuous path of copper on a circuit board.

Traces on PCB: A small trace – Reset, A larger, thicker trace - 5V power pin

 V-score- a partial cut through a board, allowing the board to be easily snapped along a line.

 Via - a hole in a board used to pass a signal from one layer to another. Tented vias are covered by
soldermask to protect them from being soldered to. Vias where connectors and components are
to be attached are often untented (uncovered) so that they can be easily soldered.
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Front and back of the same PCB showing a tented via. This via brings the signal from
the front side of the PCB, through the middle of the board, to the back side.

 Wave solder - a method of soldering used on boards with through-hole components where the
board is passed over a standing wave of molten solder, which adheres to exposed pads and
component leads.

4. EQUIPMENT

4.1 Proteus Software

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5. PROCEDURES

5.1 LABWORK 1

5.1.1 Start Proteus software by click Proteus executed file.

Figure 1: Proteus Version 8.9 SP0

5.1.2 Click “New Project” to start a new project wizard.

Figure 2: Start Proteus project

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5.1.3 Name the project as “Lab8_PCB” and Path with “Lab8” as figure 3 below and click “Next”.

Figure 3: New project wizard (Start)

5.1.4 Select “Create a schematic from the selected template” (DEFAULT) and select “Do not create a
PCB layout”

Figure 4: New project wizard (Schematic & PCB Layout)

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5.1.5 Select “No Firmware Project” and select “Finish”

Figure 5: New project wizard (Firmware & Summary)

5.1.6 Window editing interface for the circuit will appear.

Figure 6: Proteus Overview Window

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5.1.7 Guided by video “Lab 8 video”, complete the task as in the video.
a) Schematic (Figure 7)
b) PCB Layout
c) 3D Visualizer
5.1.8 The Schematic as Figure 7 and the components list as Figure 8 below.

Figure 7: Schematic for LABWORK 1 Figure 8: Components List

5.1.9 Write your observations and results in the answer sheet.

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5.2 LABWORK 2 (Assignment)

5.2.1 From Figure 9 circuit diagram:

a) Re-draw a schematic diagram
b) PCB Layout
 Including your name
 Trace Style – T35
 No CRC errors & No DRC errors
 use your own creativity in arranging the position of the components
c) 3D Visualizer

Figure 9: Chasing Light circuit diagram

5.2.2 Components used are listed as Figure 10 below.

Figure 10: Chasing Light circuit diagram

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5.2.3 The example results for 3D Visualizer is as in the Figure 11.

Figure 11: Result for assignment 5.2.1.c (3D Visualizer)

5.2.4 Write your observations and results in the answer sheet.

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6. ANSWER SHEET.

6.1 Print Screen your Circuit diagram 5.1.7 (a) result.

(10 Marks)

6.2 Print Screen your PCB Layout 5.1.7 (b) result.

(10 Marks)
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6.3 Print Screen your PCB Layout 5.1.7 (c) results.

(5 Marks)
Top View Bottom View

6.4 Print Screen your Circuit diagram 5.2.1 (a) result.

(20 Marks)
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6.5 Print Screen your PCB Layout 5.2.1 (b) result.

(25 Marks)

6.6 Print Screen your PCB Layout 5.2.1 (c) results.

(5 Marks)
Top View Bottom View
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6. DISCUSSION (10 marks)

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7. CONCLUSION (10 marks)

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8. STUDENT INFO

Division Of Tasks in
No Name Matric No Latest Face Picture
preparing reports

9. REPORT FORMAT

9.1. The report must be written in PDF format

9.2. Report structure (susunan muka surat laporan)
9.2.1.Cover Page (page 1)
9.2.2.Student Info (page 30)
9.2.3.Answer sheet (page 25 - 29)
1. Schematic Labwork 1
2. PCB Layout Labwork 1
3. 3D Visualizer Labwork 1
4. Schematic Labwork 2
5. PCB Layout Labwork 2
6. 3D Visualizer Labwork 2
7. Discussion
8. Conclusion