Mechatronics: Application of Transistors
Mechatronics: Application of Transistors
Mechatronics: Application of Transistors
APPLICATION OF TRANSISTORS
1
Introduction
3
Common Emitter Connection
• Input current IB
• Output current IC
• Base current amplification
∆𝐼𝐶
factor = =𝛽
∆𝐼𝐵
• ∆𝐼𝐵 < 5% ∆𝐼𝐸
• 𝛽 > 20 (IC ≈ IE)
• 𝛽 ≈ 100
4
• If a BJT’s emitter is grounded
and we apply an input voltage
to the base, we get the
common emitter circuit.
• Input characteristics IB VCE=1V
• VBE v/s IB for VCE=constant
VBE
5
Output Characteristic
6
• As IC increases, voltage
drop across RC increases,
so VCE drops towards
ground.
• Transistor is said to go to
saturation i.e., collector
current is determined by
RC and linear relation
between IC and IB no
longer holds.
7
• When designing a transistor switch, we need to guarantee
that the transistor is in fully saturation condition.
• VCE minimum is about 0.2 V for BJT.
• Power dissipated is smallest= IC VCE for given collector current
when it is fully saturated.
• If transistor is not fully saturated it gets hot faster and can fail.
8
Bipolar Transistor Switch
Off
9
• If VBE=0.7V, BE junction is
forward biased. Current
passes through CE circuit
• Vo is close to ground
potential (0.2V) for
saturated BJT.
ON
10
• RB required to limit base current
𝑉𝑖 − 𝑉𝐵𝐸
𝐼𝐵 =
𝑅𝐵
• When Vi < 0.7 V, IB = 0 and VBE=Vi
• Transistors used for power application are called power
transistor.
11
Bipolar Transistor Packages
• Pair of transistors
• Current gain is product of
two individual transistor
gains.
• Can be of the order of
10000
• Used in power circuit of
mechatronic system.
14
Phototransistor
15
Optoisolator
16
Angular Position of a Robotic Scanner
• Problem statement
• In design of autonomous robot,
include a laser scanning device to
sweep the environment to detect the
obstacles. Head of the scanner is
rotated through 360˚ by a DC motor.
Find
– Angular position of scan head.
– What should be done, if on board
computer to use this scanned
value.
17
• Solution
• Design a sensor that provides digital output.
• Use LED-photo transistor pair called photo-interrupter.
• The device produce a light that can be broken or
interrupted.
• Provide a disk attached to motor passing through slot.
• Each slot will provide digital pulse as it interrupts the
light beam during rotation.
18
• R1- current limiting resistor
• R2- pull up resistor to provide
output.
• As slotted disk rotates
• When light passes, transistor
conducts – 0 o/p.
• Slot interrupted, 5V o/p returned.
• No of pulses is measure of rotation.
• If 360 slots, 1 pulse = 1˚
19
Field Effect Transistors
20
Construction Details
Drain(D) Drain(D)
• A p-type or n type silicon
bar containing two pn
n p
junctions at the sides.
p p n
• Bar forms the conducting Gate(G) n
Gate(G)
channel for the charges n p
carriers.
• If bar is n type, it is called
n channel FET and if it is p Source(S) Source(S)
type it is p channel FET. n-Channel FET p-Channel FET
21
Drain(D)
• The two pn junctions forming
diodes are connected internally
and common terminal is called
n
Gate.
p p
• Thus FET has three terminals Gate(G)
i.e., Gate (G), Source (S) and n
Drain (D).
Source(S)
n-Channel FET
22
FET Polarities
Drain(D)
• Voltage between
Gate and Source is
such that it is reverse n
biased. p p
Gate(G) VDS
• Drain and Source n
terminals are VGS
interchangeable.
Source(S)
n-Channel FET
23
Working principle of FET
Drain(D)
• (i) As VDS>0, VGS=0
• pn junction establishes
depletion layer.
n
• Electrons flow from
source to drain through p p
Gate(G) VDS
channel between
n
depletion layer. VGS
• Size of layer determines
width of channel and
current through the bar. Source(S)
n-Channel FET
24
Drain(D)
• Reverse voltage at VGS
• Width of depletion layer
increases
n
• Width of conducting
channel decreases p p
Gate(G) VDS
• Resistance increases of n n
type bar VGS
• Current flow decreases.
• Current can be controlled
Source(S)
by reverse voltage.
n-Channel FET
25
Schematic Symbol
D D
G G
S S
n-Channel FET p-Channel FET
26
Difference between FET and Bipolar Transistor
Bipolar FET
• Both n and p type carrier • Unipolar(either n or p type carrier)
• Low input impedance • High input impedance (isolation
possible)
• Current driven device • Voltage driven device
• Characterise by current • Characterise by transconductance
gain (ratio of change in o/p current to
i/p (gate) voltage.
27
Output Characteristic of FET
𝐼𝐷
• Keep VGS at some
constant value
• ID rapidly increases, as 𝑉𝐺𝑆 = 1𝑉
VDB increases. 𝑉𝐺𝑆 = 2𝑉
• After pinch off voltage, 𝑉𝐺𝑆 = 3𝑉
channel width becomes
𝑉𝐷𝑆
narrow so constant O A
current is obtained.
28
Metal Oxide Semiconductor FET (MOSFET)
29
MOSFET Construction Details
Drain(D)
• Only a single p region Oxide layer D
• A thin layer of metal oxide
(usually silicon dioxide) is n
deposited over the left side Subtrate Subtrate
of the channel. p G
Gate(G)
• A metallic gate is deposited n
over the oxide layer.
• As silicon dioxide is an S
insulator , so gate is
insulated from channel Source(S)
n-Channel FET
30
Working of MOSFET
32
Thank You
33