SN5545xB, SN7545xB Dual-Peripheral Drivers For High-Current, High-Speed Switching
SN5545xB, SN7545xB Dual-Peripheral Drivers For High-Current, High-Speed Switching
SN5545xB, SN7545xB Dual-Peripheral Drivers For High-Current, High-Speed Switching
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SN55451B, SN55452B, SN55453B, SN55454B
SN75451B, SN75452B, SN75453B, SN75454B
SLRS021D – DECEMBER 1967 – REVISED JANUARY 2017 www.ti.com
Table of Contents
1 Features .................................................................. 1 9.3 Feature Description................................................. 10
2 Applications ........................................................... 1 9.4 Device Functional Modes........................................ 10
3 Description ............................................................. 1 10 Application and Implementation........................ 13
4 Revision History..................................................... 2 10.1 Application Information.......................................... 13
10.2 Typical Application ................................................ 13
5 Device Comparison Table..................................... 3
6 Pin Configuration and Functions ......................... 3 11 Power Supply Recommendations ..................... 14
7 Specifications......................................................... 4 12 Layout................................................................... 14
12.1 Layout Guidelines ................................................. 14
7.1 Absolute Maximum Ratings ...................................... 4
12.2 Layout Example .................................................... 14
7.2 Recommended Operating Conditions....................... 4
7.3 Thermal Information .................................................. 4 13 Device and Documentation Support ................. 15
7.4 Electrical Characteristics........................................... 5 13.1 Related Links ........................................................ 15
7.5 Switching Characteristics, VCC = 5 V, TA = 25°C ..... 5 13.2 Receiving Notification of Documentation Updates 15
7.6 Dissipation Ratings ................................................... 5 13.3 Community Resources.......................................... 15
7.7 Typical Characteristics .............................................. 6 13.4 Trademarks ........................................................... 15
13.5 Electrostatic Discharge Caution ............................ 15
8 Parameter Measurement Information .................. 6
13.6 Glossary ................................................................ 15
9 Detailed Description .............................................. 9
9.1 Overview ................................................................... 9 14 Mechanical, Packaging, and Orderable
Information ........................................................... 15
9.2 Functional Block Diagrams ....................................... 9
4 Revision History
Changes from Revision C (May 2016) to Revision D Page
• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section. ................................................................................................. 1
Product Folder Links: SN55451B SN55452B SN55453B SN55454B SN75451B SN75452B SN75453B SN75454B
SN55451B, SN55452B, SN55453B, SN55454B
SN75451B, SN75452B, SN75453B, SN75454B
www.ti.com SLRS021D – DECEMBER 1967 – REVISED JANUARY 2017
VCC
NC
NC
NC
1A
1A 1 8 VCC
1B 2 7 2B 3 2 1 20 19
NC 4 18 NC
1Y 3 6 2A 1B 2B
5 17
GND 4 5 2Y NC 6 16 NC
1Y 7 15 2A
NC 8 14 NC
9 10 11 12 13
2Y
NC
NC
NC
GND
NC – No internal connection
Pin Functions
PIN
CDIP, SOIC, PDIP, I/O DESCRIPTION
NAME LCCC
SO
1A 1 2 I Channel 1 Logic Input A
1B 2 5 I Channel 1 Logic Input B
1Y 3 7 O Channel 1 Driver
2A 6 15 I Channel 2 Logic Input A
2B 7 17 I Channel 2 Logic Input B
2Y 5 12 O Channel 2 Driver
GND 4 10 — Ground
1, 3, 4, 6, 8,
9, 11, 13,
NC — — No Internal Connection
14, 16, 18,
19
VCC 8 20 — Supply Voltage
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
(2)
VCC Supply voltage, (see ) 7 V
VI Input voltage 5.5 V
(3)
Inter-emitter voltage (see Note ) 5.5 V
VO Off-state output voltage 30 V
(4)
IOK Continuous collector or output current, (see Note ) 400 mA
(5)
Peak collector or output current, II (tw ≤ 10 ms, duty cycle ≤ 50%, see Note ) 500 mA
See Dissipation
Continuous total power dissipation
Ratings
SN5545xB –55 125
TA Operating free-air temperature °C
SN7545xB 0 70
Case temperature for 60 seconds SN5545xB FK package 260 °C
Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds SN5545xB JG package 100 °C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds SN7545xB D or P package 260 °C
TJ Operating virtual junction temperature 150 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Voltage values are with respect to network GND, unless otherwise specified.
(3) This is the voltage between two emitters of a multiple-emitter transistor.
(4) This value applies when the base-emitter resistance (RBE) is equal to or less than 500 Ω.
(5) Both halves of these dual circuits may conduct rated current simultaneously; however, power dissipation averaged over a short time
interval must fall within the continuous dissipation rating.
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
Product Folder Links: SN55451B SN55452B SN55453B SN55454B SN75451B SN75452B SN75453B SN75454B
SN55451B, SN55452B, SN55453B, SN55454B
SN75451B, SN75452B, SN75453B, SN75454B
www.ti.com SLRS021D – DECEMBER 1967 – REVISED JANUARY 2017
(1) For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
(2) All typical values are at VCC = 5 V, TA = 25°C.
0.4
TA = 70°C
0.3
TA = 0°C
0.2
0.1 TA = 25°C
VCE(sat)
0
10 20 40 70 100 200 400
IC – Collector Current – mA
’451B RL = 50 W
’452B
Output
Pulse
Generator
(see Note A) Circuit
Under
Test
CL = 15 pF
’453B GND SUB (see Note B)
’454B
0.4 V
A. The pulse generator has the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω.
B. CL includes probe and jig capacitance.
Product Folder Links: SN55451B SN55452B SN55453B SN55454B SN75451B SN75452B SN75453B SN75454B
SN55451B, SN55452B, SN55453B, SN55454B
SN75451B, SN75452B, SN75453B, SN75454B
www.ti.com SLRS021D – DECEMBER 1967 – REVISED JANUARY 2017
≤ 5 ns ≤ 10 ns
3V
90% 90%
Input
’451B 1.5 V 1.5 V
’453B 10% 10%
0V
0.5 ms
≤ 5 ns ≤ 10 ns
3V
Input 90% 90%
’452B
’454B 1.5 V 1.5 V
10% 10%
0V
tPHL tPLH
VOH
90% 90%
Output 50% 50%
10% 10%
VOL
tTHL tTLH
A. The pulse generator has the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω.
B. CL includes probe and jig capacitance.
VS = 20 V
2 mH
Input 2.4 V 5V
’451B 1N3064 65 W
’452B
Pulse Output
Generator
(see Note A) Circuit
Under
Test
CL = 15 pF
(see Note B)
0.4 V
A. The pulse generator has the following characteristics: PRR ≤ 12.5 kHz, ZO = 50 Ω.
B. CL includes probe and jig capacitance.
≤ 5 ns ≤ 10 ns
3V
90% 90%
Input
’451B 1.5 V 1.5 V
’453B 10% 10%
0V
40 ms
≤ 5 ns ≤ 10 ns
3V
Input 90% 90%
’452B
’454B 1.5 V 1.5 V
10% 10%
0V
VOH
Output
VOL
A. The pulse generator has the following characteristics: PRR ≤ 12.5 kHz, ZO = 50 Ω.
B. CL includes probe and jig capacitance.
Product Folder Links: SN55451B SN55452B SN55453B SN55454B SN75451B SN75452B SN75453B SN75454B
SN55451B, SN55452B, SN55453B, SN55454B
SN75451B, SN75452B, SN75453B, SN75454B
www.ti.com SLRS021D – DECEMBER 1967 – REVISED JANUARY 2017
9 Detailed Description
9.1 Overview
The SN7545xB and SN5545xB devices provide dual-output drivers with AND, NAND, NOR, or OR logic inputs. If
each logic input is set to the appropriate voltage level, then the output driver will turn on, pulling the driver to
ground and allowing current to flow.
3
1 1Y
1A
2
1B 5
6 2Y
2A
7
2B
4
GND
3
1 1Y
1A
2
1B 5
6 2Y
2A
7
2B
4
GND
3
1 1Y
1A
2
1B 5
6 2Y
2A
7
2B
4
GND
Product Folder Links: SN55451B SN55452B SN55453B SN55454B SN75451B SN75452B SN75453B SN75454B
SN55451B, SN55452B, SN55453B, SN55454B
SN75451B, SN75452B, SN75453B, SN75454B
www.ti.com SLRS021D – DECEMBER 1967 – REVISED JANUARY 2017
1
1A & 3
2 1Y
1B
6
2A 5
7 2Y
2B
1
1A ≥1 3
2 1Y
1B
6
2A 5
7 2Y
2B
1
1A ≥1 3
2 1Y
1B
6
2A
7 2Y
2B
VCC VCC
1.6 kW
4 kW 1.6 kW 130W 4 kW 130W
1.6 kW
Y
Y A
A
B
B 500W
1 kW 1 kW
500W
GND
1 kW
Resistor values shown are nominal.
GND Copyright © 2016 Texas Instruments Incorporated
Resistor values shown are nominal.
Copyright © 2016 Texas Instruments Incorporated
Figure 14. SNx5451B Schematic (Each Driver) Figure 15. SNx5452B Schematic (Each Driver)
VCC VCC
2 kW 2 kW 1.6
4 kW 1.6 kW 4 kW 130 W 4 kW 4 130W
kW kW
Y A Y
A B
B
1 kW 1 kW 500W
500 W
GND
1 kW
GND Resistor values shown are nominal.
Copyright © 2016 Texas Instruments Incorporated
Resistor values shown are nominal.
Copyright © 2016 Texas Instruments Incorporated
Figure 16. SNx5453B Schematic (Each Driver) Figure 17. SNx5454B Schematic (Each Driver)
Product Folder Links: SN55451B SN55452B SN55453B SN55454B SN75451B SN75452B SN75453B SN75454B
SN55451B, SN55452B, SN55453B, SN55454B
SN75451B, SN75452B, SN75453B, SN75454B
www.ti.com SLRS021D – DECEMBER 1967 – REVISED JANUARY 2017
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
VSUP
VSUP
1A VCC 24 V
1B 2B
1Y 2A RLOAD
GND 2Y
70 0.40
Outputs Low Vcc = 4.75 V
0 0.00
0 1 2 3 4 5 0 50 100 150 200 250 300
VCC - Supply Voltage (V) IOK - Collector Current (mA)
C001 C001
Figure 19. SN75451B Typical Supply Current vs Supply Figure 20. SN75451B Typical Low-Level Output Voltage vs
Voltage Collector Current
12 Layout
1A 1 8 VCC
1B 2 7 2B
1Y 3 6 2A
GND 4 5 2Y
Product Folder Links: SN55451B SN55452B SN55453B SN55454B SN75451B SN75452B SN75453B SN75454B
SN55451B, SN55452B, SN55453B, SN55454B
SN75451B, SN75452B, SN75453B, SN75454B
www.ti.com SLRS021D – DECEMBER 1967 – REVISED JANUARY 2017
13.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
13.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
13.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 17-Jul-2020
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
5962-9563301Q2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
9563301Q2A
SNJ55
453BFK
5962-9563301QPA ACTIVE CDIP JG 8 1 TBD SNPB N / A for Pkg Type -55 to 125 9563301QPA
SNJ55453B
77049012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 77049012A
SNJ55
452BFK
7704901PA ACTIVE CDIP JG 8 1 TBD SNPB N / A for Pkg Type -55 to 125 7704901PA
SNJ55452B
77049022A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 77049022A
SNJ55
451BFK
7704902PA ACTIVE CDIP JG 8 1 TBD SNPB N / A for Pkg Type -55 to 125 7704902PA
SNJ55451B
JM38510/12902BPA ACTIVE CDIP JG 8 1 TBD SNPB N / A for Pkg Type -55 to 125 JM38510
/12902BPA
JM38510/12903BPA ACTIVE CDIP JG 8 1 TBD SNPB N / A for Pkg Type -55 to 125 JM38510
/12903BPA
JM38510/12905BPA ACTIVE CDIP JG 8 1 TBD SNPB N / A for Pkg Type -55 to 125 JM38510
/12905BPA
M38510/12902BPA ACTIVE CDIP JG 8 1 TBD SNPB N / A for Pkg Type -55 to 125 JM38510
/12902BPA
M38510/12903BPA ACTIVE CDIP JG 8 1 TBD SNPB N / A for Pkg Type -55 to 125 JM38510
/12903BPA
M38510/12905BPA ACTIVE CDIP JG 8 1 TBD SNPB N / A for Pkg Type -55 to 125 JM38510
/12905BPA
SN55451BJG ACTIVE CDIP JG 8 50 TBD SNPB N / A for Pkg Type -55 to 125 SN55451BJG
SN55452BJG ACTIVE CDIP JG 8 1 TBD SNPB N / A for Pkg Type -55 to 125 SN55452BJG
SN55453BJG ACTIVE CDIP JG 8 1 TBD SNPB N / A for Pkg Type -55 to 125 SN55453BJG
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 17-Jul-2020
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
SN55454BJG ACTIVE CDIP JG 8 1 TBD SNPB N / A for Pkg Type -55 to 125 SN55454BJG
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com 17-Jul-2020
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com 17-Jul-2020
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
SNJ55453BFK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
9563301Q2A
SNJ55
453BFK
SNJ55453BJG ACTIVE CDIP JG 8 1 TBD SNPB N / A for Pkg Type -55 to 125 9563301QPA
SNJ55453B
SNJ55454BJG ACTIVE CDIP JG 8 1 TBD SNPB N / A for Pkg Type -55 to 125 SNJ55
454BJG
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 4
PACKAGE OPTION ADDENDUM
www.ti.com 17-Jul-2020
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN55451B, SN55452B, SN55453B, SN55454B, SN75451B, SN75452B, SN75453B, SN75454B :
Addendum-Page 5
PACKAGE MATERIALS INFORMATION
www.ti.com 20-Dec-2018
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 20-Dec-2018
Pack Materials-Page 2
PACKAGE OUTLINE
D0008A SCALE 2.800
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
SEATING PLANE
.228-.244 TYP
[5.80-6.19]
.004 [0.1] C
A PIN 1 ID AREA
6X .050
[1.27]
8
1
.189-.197 2X
[4.81-5.00] .150
NOTE 3 [3.81]
4X (0 -15 )
4
5
8X .012-.020
B .150-.157 [0.31-0.51]
.069 MAX
[3.81-3.98] .010 [0.25] C A B [1.75]
NOTE 4
.005-.010 TYP
[0.13-0.25]
4X (0 -15 )
SEE DETAIL A
.010
[0.25]
.004-.010
0 -8 [0.11-0.25]
.016-.050
[0.41-1.27] DETAIL A
(.041) TYPICAL
[1.04]
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
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EXAMPLE BOARD LAYOUT
D0008A SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
8X (.061 )
[1.55]
SYMM SEE
DETAILS
1
8
8X (.024)
[0.6] SYMM
(R.002 ) TYP
[0.05]
5
4
6X (.050 )
[1.27]
(.213)
[5.4]
EXPOSED
METAL EXPOSED
METAL
.0028 MAX .0028 MIN
[0.07] [0.07]
ALL AROUND ALL AROUND
4214825/C 02/2019
NOTES: (continued)
www.ti.com
EXAMPLE STENCIL DESIGN
D0008A SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
8X (.061 )
[1.55] SYMM
1
8
8X (.024)
[0.6] SYMM
(R.002 ) TYP
5 [0.05]
4
6X (.050 )
[1.27]
(.213)
[5.4]
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
MECHANICAL DATA
0.400 (10,16)
0.355 (9,00)
8 5
0.280 (7,11)
0.245 (6,22)
1 4
0.065 (1,65)
0.045 (1,14)
0.023 (0,58)
0°–15°
0.015 (0,38)
0.100 (2,54) 0.014 (0,36)
0.008 (0,20)
4040107/C 08/96
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