AO3413 P-Channel Enhancement Mode Field Effect Transistor: Features General Description
AO3413 P-Channel Enhancement Mode Field Effect Transistor: Features General Description
AO3413 P-Channel Enhancement Mode Field Effect Transistor: Features General Description
TO-236 D
D
(SOT-23)
G
S S
G
Thermal Characteristics
Parameter Symbol Typ Max Units
Maximum Junction-to-Ambient A t ≤ 10s 70 90 °C/W
RθJA
Maximum Junction-to-Ambient A Steady-State 100 125 °C/W
Maximum Junction-to-Lead C Steady-State RθJL 63 80 °C/W
A: The value of R θJA is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a still air environment with T A =25°C. The value
in any given application depends on the user's specific board design. The current rating is based on the t ≤ 10s thermal resistance rating.
B: Repetitive rating, pulse width limited by junction temperature.
C. The R θJA is the sum of the thermal impedence from junction to lead R θJL and lead to ambient.
D. The static characteristics in Figures 1 to 6,12,14 are obtained using <300 µs pulses, duty cycle 0.5% max.
E. These tests are performed with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with
T A=25°C. The SOA curve provides a single pulse rating.
Rev 8: Aug 2008
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
15 6
-4.5V
VDS=-5V
-3.0V -2.5V
-8V
10 4
-2.0V
-ID (A)
-ID(A)
5 2 125°C
VGS=-1.5V
25°C
0 0
0 1 2 3 4 5 0 0.5 1 1.5 2
-VDS (Volts) -VGS(Volts)
Fig 1: On-Region Characteristics Figure 2: Transfer Characteristics
200 1.8
VGS=-2.5V
VGS=-1.8V
Normalized On-Resistance
1.6
150
RDS(ON) (mΩ )
VGS=-1.8V
1.4
VGS=-2.5V VGS=-4.5V
100 1.2
VGS=-4.5V
50
0 2 4 6 0.8
-ID (A) 0 25 50 75 100 125 150 175
Figure 3: On-Resistance vs. Drain Current and Gate Temperature (°C)
Voltage Figure 4: On-Resistance vs. Junction Temperature
200 1E+01
1E+00
ID=-4A
1E-01 125°C
150
RDS(ON) (mΩ )
1E-02 25°C
-IS (A)
125°C
1E-03
100 25°C
1E-04
1E-05
50
1E-06
0 2 4 6 8
0.0 0.2 0.4 0.6 0.8 1.0 1.2
-VGS (Volts) -VSD (Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage Figure 6: Body-Diode Characteristics
5 800
VDS=-10V
4 ID=-3A Ciss
600
Capacitance (pF)
-VGS (Volts)
3
400
2
200 Crss
1
Coss
0 0
0 2 4 6 8 0 5 10 15 20
-Qg (nC) -VDS (Volts)
Figure 7: Gate-Charge Characteristics Figure 8: Capacitance Characteristics
100.0
20
TJ(Max)=150°C TJ(Max)=150°C
TA=25°C 100µs TA=25°C
10µs 15
10.0
-ID (Amps)
Power (W)
RDS(ON)
limited 1ms
10
0.1s 10ms
1.0
1s 5
10s
DC
0
0.1
0.001 0.01 0.1 1 10 100 1000
0.1 1 10 100
-VDS (Volts) Pulse Width (s)
Figure 10: Single Pulse Power Rating Junction-to-
Figure 9: Maximum Forward Biased Safe
Ambient (Note E)
Operating Area (Note E)
10
In descending order
D=T on/T
Zθ JA Normalized Transient
RθJA=90°C/W
1
PD
0.1
Ton
Single Pulse T
0.01
0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance
Ig
Charge
td(on) tr t d(off) tf
Vgs
-
Vgs D UT VDC
Vdd 90%
Rg
+
Vgs 10%
Vds
Vds + Q rr = - Idt
DUT
Vgs
t rr
Vds - L -Isd -I F
Isd dI/dt
+ Vdd -I RM
Vgs VDC
Vdd
Ig
- -Vds