Harish FeGa - 2011
Harish FeGa - 2011
Harish FeGa - 2011
Microcantilevers have been at the heart of atomic force demonstrate the piezoresistivity in metallic Fe0.7Ga0.3 thin
microscopy and a range of chemical and biological sensing films and its use for both magnetic actuation and piezoresis-
applications. The transduction of microcantilevers often in- tive sensing in micromechanical devices. Our fabrication
volves off-chip actuators such as a piezoshaker, as well as process starts with micromachined membranes of high-stress
off-chip displacement readout, such as optical deflection. Ac- silicon nitride 共330 nm thick兲 on a silicon wafer made by
tive cantilevers that contain integrated actuation and sensing anisotropic KOH etch. A thin layer of Fe0.7Ga0.3 共100 nm兲 is
elements do not require alignment of actuating and sensing sputtered on the membranes 共for details of the material, see
components. Therefore they offer a higher level of system Zhao et al.7兲. The cantilever structures are then patterned
integration and are more suitable for portable applications. using photolithography. Ion milling is used to etch the
Active cantilevers can be constructed by integrating Fe0.7Ga0.3 layer. This is followed by etching Si3N4 in a reac-
piezoelectric1–3 or magnetic thin films4,5 to exert driving tive ion etcher using CHF3 to pattern and release the canti-
forces. Using magnetic forces to actuate micromechanical lever beams. The cantilevers are designed to have a stress
devices is advantageous for applications that are susceptible concentration region at the base in order to optimize the pi-
to perturbations, as magnetic fields can be generated re- ezoresistive response 关Fig. 1共a兲兴. Based on finite element
motely. To build active magnetic cantilevers, on-chip readout simulations of stress distribution in the cantilever, we esti-
of the mechanical motion is also desired. One scheme is to mate that the stress concentration region accounts for ⬃85%
integrate a layer of piezoelectric material, so that a potential of the measured resistance in the fabricated devices, thus
difference is generated in the piezoelectric layer when the contributing to the bulk of the piezoresistive response. A
device is stressed by magnetic force. This so-called magne- scanning electron micrograph image of a fabricated cantile-
toelectric effect 共ME兲 has been utilized in sensors using a ver of dimensions 100 共length兲 ⫻ 20 共width兲 m2 is shown
variety of magnetostrictive materials.6–9 However, when de- in Fig. 1共a兲. We note that due to the intrinsic stress in the
vices are scaled to smaller dimensions, the use of a thick deposited Fe0.7Ga0.3 layer, bending of the cantilever struc-
multilayer structural stack that is necessary for harvesting tures is observed. This bending causes imperfect alignment
ME effects is often undesirable. In this letter, instead of using of magnetic field with the cantilever beam. As a result, the
the ME effect, we utilize the intrinsic piezoresistivity in a magnetic actuation is a combined effect of magnetic torque
thin film Fe0.7Ga0.3 共Ref. 7兲 to detect and magnetically actu- and magnetostriction of Fe0.7Ga0.3 thin films. As we demon-
ate micromechanical motion. This method has significant ad- strate later, a qualitative comparison of the relative magni-
vantages over the ME effect in that it permits further scaling tude of each of these effects can be obtained.
down of device dimensions, meanwhile eliminating the need We first investigate the piezoresistivity of the Fe0.7Ga0.3
for integration of piezoelectric materials and electrodes film by directly driving a piezodisk mounted below the
which involves extensive processing. sample holder. The nominal resistance of the cantilevers is
Although piezoresistivity in metals is a well-known phe- around 1.7 k⍀. All measurements are carried out in high
nomenon, this property is rarely applied as transducing ele- vacuum at the resonance frequency of the cantilever in the
ments in microdevices due to the nominally low gauge factor dynamic regime. A schematic for the piezoresistive measure-
␥ 关defined as 共dR / R兲 / 共dL / L兲, where L and R are the length ment is shown in Fig. 1共b兲. The device resistance Rcant
and resistance of a strain gauge, respectively兴. Recently, gold changes as a function of strain induced by the bending of the
thin films have been shown to be efficient piezoresistive sen- cantilever. A dc bias voltage Vcant = 1 V is supplied to the
sors on nanoscale mechanical devices.10,11 In this letter, we cantilever to convert the resistance variation to voltage sig-
nal, which is amplified with a preamplifier. The frequency
a兲
Author to whom correspondence should be addressed. Electronic mail: response of the cantilever measured with a network analyzer
[email protected]. is shown in Fig. 1共c兲. Fe0.7Ga0.3 cantilevers are observed to
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