STPS30H100C

Datasheet

100 V power Schottky rectifier

A1
Features
K
A2 • Negligible switching losses
• Low leakage current
K • Good trade off between leakage current and forward voltage drop
• Avalanche rated
• ECOPACK®2 compliant
A2 A2
K K
A1 A1 Applications
TO-220AB TO-247
• Switching diode
• SMPS
• DC/DC converter
• LED lighting

Description
This dual Schottky rectifier is designed for high frequency miniature switch mode
power supplies such as adaptors and on-board DC-DC converters.
Packaged in TO-200AB and TO-247, this STPS30H100C is optimized for use in high
frequency inverters.

Product status link

STPS30H100C
Product summary

IF(AV) 2 x 15 A

VRRM 100 V

Tj (max) 175 °C

VF (typ) 0.64 V

DS1560 - Rev 9 - June 2018 www.st.com

For further information contact your local STMicroelectronics sales office.
 STPS30H100C
Characteristics

1 Characteristics

Table 1. Absolute Ratings (limiting values at 25 °C, unless otherwise specified)

Symbol Parameter Value Unit

VRRM Repetitive peak reverse voltage 100 V

IF(RMS) Forward rms current 30 A

TC = 155 °C Per diode 15

IF(AV) Average forward current, δ = 0.5 A
TC = 150 °C Per device 30

IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 250 A

PARM Repetitive peak avalanche power tp = 10 µs , Tj = 125 °C 778 W

Tstg Storage temperature range -65 to +175 °C

Tj Maximum operating junction temperature(1) +175 °C

1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink.

Table 2. Thermal resistance parameter

Symbol Parameter Value Unit

Per diode 1.6

Rth(j-c) Junction to case °C/W
Total 0.9
Rth(c) Coupling 0.10 °C/W

When the diodes 1 and 2 are used simultaneously :

ΔTj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c)

DS1560 - Rev 9 page 2/12

 STPS30H100C
Characteristics

Table 3. Static electrical characteristics (per diode)

Symbol Parameter Test conditions Min. Typ. Max. Unit

Tj = 25 °C - 5 µA
IR(1) Reverse leakage current VR = VRRM
Tj = 125 °C - 2 6 mA

Tj = 25 °C - 0.80
IF = 15 A
Tj = 125 °C - 0.64 0.67
VF(2) Forward voltage drop V
Tj = 25 °C - 0.93
IF = 30 A
Tj = 125 °C - 0.74 0.80

1. Pulse test: tp = 5 ms, δ < 2%

2. Pulse test: tp = 380 µs, δ < 2%

To evaluate the conduction losses use the following equation:

P = 0.54 x IF(AV) + 0.0086 IF2(RMS)
For more information, please refer to the following application notes related to the power losses :
• AN604: Calculation of conduction losses in a power rectifier
• AN4021: Calculation of reverse losses on a power diode

DS1560 - Rev 9 page 3/12

 STPS30H100C
Characteristics (curves)

1.2 Characteristics (curves)

Figure 1. Average forward power dissipation versus Figure 2. Average forward current versus ambient
average forward current (per diode) temperature (δ= 0.5, per diode)
PF(AV) (W) IF(AV)(A)
14 18
δ = 0.1 δ= 0.2
δ = 0.5
16 Rth(j-a)=Rth(j-c)
12 δ = 0.05
14
10
δ= 1 12
8 10
Rth(j-a) = 15 °C/W
6 8
6
4 T T
4
2 2
IF(AV) (A) δ =tp/T tp δ =tp/T tp Tamb (°C)
0 0
0 2 4 6 8 10 12 14 16 18 20 0 25 50 75 100 125 150 175

Figure 3. Normalized avalanche power derating versus Figure 4. Relative variation of thermal impedance junction
pulse duration (Tj= 125 °C) to case versus pulse duration
PARM (t p ) Zth(j-c) / Rth(j-c)
PARM (10 µs) 1.0
1

0.8

0.1 0.6

0.4

0.01
0.2

Single pulse
t p (s)
0.0
t p(µs)
1E-4 1E-3 1E-2 1E-1 1E+0
0.001
1 10 100 1000

DS1560 - Rev 9 page 4/12

 STPS30H100C
Characteristics (curves)

Figure 5. Reverse leakage current versus reverse voltage

applied (typical values, per diode) Figure 6. Junction capacitance versus reverse voltage
applied (typical values, per diode)

IR(mA)
C(pF)
2E+0 1000
1E+0
Tj=125 °C F=1 MHz
VOSC=30 mVRMS
Tj=25 °C

1E-1
500

1E-2

1E-3
Tj=25 °C
200
1E-4

VR (V)
1E-5 VR(V)
100
0 10 20 30 40 50 60 70 80 90 100
1 2 5 10 20 50 100

Figure 7. Forward voltage drop versus forward current (maximum values, per diode)

IFM(A)
200

100 Tj=125 °C

Tj=25 °C

10

VFM (V)
1
0.0 0.2 0.4
4 0.6 0.8 1.0 1.2 1.4 1.6 1.8

DS1560 - Rev 9 page 5/12

 STPS30H100C
Package information

2 Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK®
packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions
and product status are available at: www.st.com. ECOPACK® is an ST trademark.

2.1 TO-247 package information

• Epoxy meets UL94, V0
• Cooling method: by conduction (C)
• Recommended torque value: 0.8 N·m
• Maximum torque value: 1.0 N·m

Figure 8. TO-247 package outline

A Heat-sink plane
E
∅P

S ∅R

L2

L1

L b1

b2
1 2 3 3 2 1
b c
A1 Back view
e

DS1560 - Rev 9 page 6/12

 STPS30H100C
TO-247 package information

Table 4. TO-247 package mechanical data

Dimensions

Ref. Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

A 4.85 5.15 0.191 0.203

A1 2.20 2.60 0.086 0.102
b 1.00 1.40 0.039 0.055
b1 2.00 2.40 0.078 0.094
b2 3.00 3.40 0.118 0.133
c 0.40 0.80 0.015 0.031
D 19.85 20.15 0.781 0.793
E 15.45 15.75 0.608 0.620
e 5.30 5.45 5.60 0.209 0.215 0.220
L 14.20 14.80 0.559 0.582
L1 3.70 4.30 0.145 0.169
L2 18.50 0.728
ØP 3.55 3.65 0.139 0.143
ØR 4.50 5.50 0.177 0.217
S 5.30 5.50 5.70 0.209 0.216 0.224

1. Inches dimensions given for reference only

DS1560 - Rev 9 page 7/12

 STPS30H100C
TO-220AB package information

2.2 TO-220AB package information

• Cooling method: by conduction (C)
• Epoxy meets UL 94,V0
• Recommended torque value: 0.55 N·m
• Maximum torque value: 0.70 N·m

Figure 9. TO-220AB package outline

DS1560 - Rev 9 page 8/12

 STPS30H100C
TO-220AB package information

Table 5. TO-220AB package mechanical data

Dimensions

Ref. Millimeters Inches

Min. Max. Min. Max.

A 4.40 4.60 0.173 0.181

b 0.61 0.88 0.240 0.035
b1 1.14 1.55 0.045 0.061
c 0.48 0.70 0.019 0.028
D 15.25 15.75 0.600 0.620
D1 1.27 typ. 0.050 typ.
E 10.00 10.40 0.394 0.409
e 2.40 2.70 0.094 0.106
e1 4.95 5.15 0.195 0.203
F 1.23 1.32 0.048 0.052
H1 6.20 6.60 0.244 0.260
J1 2.40 2.72 0.094 0.107
L 13.00 14.00 0.512 0.551
L1 3.50 3.93 0.138 0.155
L20 16.40 typ. 0.646 typ.
L30 28.90 typ. 1.138 typ.
θP 3.75 3.85 0.148 0.152
Q 2.65 2.95 0.104 0.116

DS1560 - Rev 9 page 9/12

 STPS30H100C
Ordering information

3 Ordering information

Table 6. Ordering information

Order code Marking Package Weight Base qty. Delivery mode

STPS30H100CT STPS30H100CT TO-220AB 1.95 g 50 Tube

STPS30H100CW STPS30H100CW TO-247 4.36 g 30 Tube

DS1560 - Rev 9 page 10/12

 STPS30H100C

Revision history

Table 7. Document revision history

Date Revision Changes

Jul-2003 5E Previous release

30-Mar-2011 6 Added I2PAK package.

15-Sep-2011 7 Added TO-220AB narrow leads package. Updated Table 5.

21-Jun-2012 8 Added minimum value for Tj in Table 2.

Updated PARM value and removed "Normalized avalanche power derating" curves. Removed I2PAK
01-Jun-2018 9
package information.

DS1560 - Rev 9 page 11/12

 STPS30H100C

IMPORTANT NOTICE – PLEASE READ CAREFULLY

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST
products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST
products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of
Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2018 STMicroelectronics – All rights reserved

DS1560 - Rev 9 page 12/12