Data Sheet: Stereo Audio Coder-Decoder For MD, CD and MP3
Data Sheet: Stereo Audio Coder-Decoder For MD, CD and MP3
DATA SHEET
UDA1380
Stereo audio coder-decoder
for MD, CD and MP3
Product specification 2004 Apr 22
Supersedes data of 2003 Apr 04
NXP Semiconductors Product specification
2004 Apr 22 2
NXP Semiconductors Product specification
1 FEATURES
1.1 General
• 2.4 to 3.6 V power supply
• 5 V tolerant digital inputs (at 2.7 to 3.6 V power supply)
• 24-bit data path for Analog-to-Digital Converter (ADC)
and Digital-to-Analog Converter (DAC)
• Selectable control via L3-bus microcontroller interface
or I2C-bus interface; choice of 2 device addresses in
L3-bus and I2C-bus mode 1.2 Multiple format data input interface
Remark: This device does not have a static mode. • Slave BCK and WS signals
• Supports sample frequencies from 8 to 55 kHz for the • I2S-bus format
ADC part, and 8 to 100 kHz for the DAC part. The ADC • MSB-justified format compatible
does not support DVD audio (96 kHz audio), only
• LSB-justified format compatible.
Mini-Disc (MD), Compact-Disc (CD) and Moving Picture
Experts Group Layer-3 Audio (MP3). For playback
1.3 Multiple format data output interface
8 to 100 kHz is specified. DVD playback is supported
• Power management unit: • Select option for digital output interface: either the
decimator output (ADC signal) or the output signal of the
– Separate power control for ADC, Automatic Volume
digital mixer which is in the interpolator DSP
Control (AVC), DAC, Phase Locked Loop (PLL) and
headphone driver • Selectable master or slave BCK and WS signals for
digital ADC output
– Analog blocks like ADC and Programmable Gain
Amplifier (PGA) have a block to power-down the bias Remark: SYSCLK must be applied in WSPLL mode and
circuits master mode
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NXP Semiconductors Product specification
1.5 DAC features The DAC part is equipped with a stereo line output and a
headphone driver output. The headphone driver is capable
• DAC plus interpolator can run at either WSPLL
of driving a 16 Ω load. The headphone driver is also
(regenerating the clock from WSI) or at SYSCLK
capable of driving a headphone without the need for
• Separate digital logarithmic volume control for left and external DC decoupling capacitors, since the headphone
right channels via L3-bus or I2C-bus from 0 to −78 dB in can be connected to a pin VREF(HP) on the chip.
steps of 0.25 dB
In addition, there is a built-in short-circuit protection for the
• Digital tone control, bass boost and treble via L3-bus or headphone driver output which, in case of short-circuit,
I2C-bus interface
limits the current through the operational amplifiers and
• Digital de-emphasis for sample frequencies of: signals the event via its L3-bus or I2C-bus register.
32, 44.1, 48 and 96 kHz via L3-bus or I2C-bus interface
The UDA1380 also supports an application mode in which
• Cosine roll-off soft mute function the coder-decoder itself is not running, but an analog
• Output signal polarity control via L3-bus or I2C-bus signal, for instance coming from an FM tuner, can be
interface controlled in gain and applied to the output via the
• Digital mixer for mixing ADC output signal and digital headphone driver and line outputs.
serial input signal, if they run at the same sampling The UDA1380 supports the I2S-bus data format with word
frequency. lengths of up to 24 bits, the MSB-justified data format with
word lengths of up to 24 bits and the LSB-justified serial
2 APPLICATIONS data format with word lengths of 16, 18, 20 or 24 bits
(LSB-justified 24 bits is only supported for the output
This audio coder-decoder is suitable for home and interface).
portable applications like MD, CD and MP3 players.
The UDA1380 has sound processing features in playback
mode, de-emphasis, volume, mute, bass boost and treble
3 GENERAL DESCRIPTION which can be controlled by the L3-bus or I2C-bus interface.
The UDA1380 is a stereo audio coder-decoder, available
in TSSOP32 (UDA1380TT) and HVQFN32 (UDA1380HN)
packages. All functions and features are identical for both
package versions. The term ‘UDA1380’ in this document
refers to both UDA1380TT and UDA1380HN, unless
particularly specified.
The front-end of the UDA1380 is equipped with a stereo
line input, which has a PGA control, and a mono
microphone input with an LNA and a VGA. The digital
decimation filter is equipped with an AGC which can be
used in case of voice-recording.
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NXP Semiconductors Product specification
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NXP Semiconductors Product specification
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NXP Semiconductors Product specification
5 ORDERING INFORMATION
TYPE PACKAGE
NUMBER NAME DESCRIPTION VERSION
UDA1380TT TSSOP32 plastic thin shrink small outline package; 32 leads; SOT487-1
body width 6.1 mm; lead pitch 0.65 mm
UDA1380HN HVQFN32 plastic thermal enhanced very thin quad flat package; no leads; SOT617-1
32 terminals; body 5 × 5 × 0.85 mm
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NXP Semiconductors Product specification
6 BLOCK DIAGRAM
handbook, full pagewidth VDDA(AD) VSSA(AD) VADCP VADCN VREF VDDD VDDA(DA)
31 (27) 1 (29)
VINL PGA SDC SDC PGA VINR
+29 dB
3 (31)
VINM MIC AMP SDC
n.c.
UDA1380TT
ADC ADC
(UDA1380HN)
5 (1)
RESET
DECIMATION FILTER
AGC
DC-CANCELLATION FILTER
13 (9)
SYSCLK
9 (5)
DATAO 17 (13)
7 (3) DATA OUTPUT L3CLOCK/SCL
BCKO
8 (4) INTERFACE L3 or I2C-BUS 16 (12)
WSO L3MODE
INTERFACE 18 (14)
10 (6) L3DATA/SDA
BCKI
11 (7) DATA INPUT
WSI 19 (15)
12 (8) INTERFACE
DATAI SEL_L3_IIC
15 (11)
DSP FEATURES RTCB
NOISE SHAPER
27 (23) 25 (21)
VOUTL VOUTR
HEADPHONE HEADPHONE
DRIVER DRIVER
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NXP Semiconductors Product specification
7 PINNING
PIN
SYMBOL TYPE DESCRIPTION
UDA1380TT UDA1380HN
VINR 1 29 analog pad ADC input right, also connected
to the mixer input of the FSDAC
VADCN 2 30 analog pad ADC reference voltage
VINM 3 31 analog pad microphone input
VADCP 4 32 analog pad ADC reference voltage
RESET 5 1 5 V tolerant digital input pad; pin RESET with pull-down, for
push-pull; TTL with hysteresis; making Power-On Reset (POR)
pull-down
VDDD 6 2 digital supply pad digital supply voltage
BCKO 7 3 5 V tolerant digital bidirectional bit clock output
WSO 8 4 pad; push-pull input; 3-state word select output
output; 5 ns slew-rate control;
TTL with hysteresis
DATAO 9 5 output pad; push-pull; 5 ns data output
slew-rate control; CMOS
BCKI 10 6 5 V tolerant digital input pad; bit clock input
WSI 11 7 push-pull; TTL with hysteresis word select input
DATAI 12 8 data input
SYSCLK 13 9 system clock 256fs, 384fs,
512fs or 768fs input
VSSD 14 10 digital ground pad digital ground
RTCB 15 11 5 V tolerant digital input pad; test control input, to be connected
push-pull; TTL with hysteresis; to digital ground in the application
pull-down
L3MODE 16 12 5 V tolerant digital bidirectional L3-bus mode input or pin A1 for
pad; push-pull input; 3-state I2C-bus slave address setting
output; 5 ns slew-rate control;
TTL with hysteresis
L3CLOCK/SC 17 13 5 V tolerant digital input pad; L3-bus or I2C-bus clock input
L push-pull; TTL with hysteresis
L3DATA/SDA 18 14 I2C-bus pad; 400 kHz I2C-bus L3-bus or I2C-bus data input and
specification output
SEL_L3_IIC 19 15 5 V tolerant digital input pad; input channel select
push-pull; TTL with hysteresis
VSSA(HP) 20 16 analog ground pad headphone ground
VOUTRHP 21 17 analog pad headphone output right
VREF(HP) 22 18 analog pad headphone reference voltage
VOUTLHP 23 19 analog pad headphone output left
VDDA(HP) 24 20 analog supply pad headphone supply voltage
VOUTR 25 21 analog pad DAC output right
VDDA(DA) 26 22 analog supply pad DAC analog supply voltage
VOUTL 27 23 analog pad DAC output left
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NXP Semiconductors Product specification
PIN
SYMBOL TYPE DESCRIPTION
UDA1380TT UDA1380HN
VSSA(DA) 28 24 analog ground pad DAC analog ground
VREF 29 25 analog pad ADC and DAC reference voltage
VSSA(AD) 30 26 analog ground pad ADC analog ground
VINL 31 27 analog pad ADC input left, also connected to
the mixer input of the FSDAC
VDDA(AD) 32 28 analog supply pad ADC analog supply voltage
handbook, halfpage
VINR 1 32 VDDA(AD)
VADCN 2 31 VINL
28 VDDA(AD)
26 VSSA(AD)
30 VADCN
32 VADCP
VINM 3 30 VSSA(AD)
31 VINM
29 VINR
25 VREF
27 VINL
terminal 1
VADCP 4 29 VREF index area
RESET 5 28 VSSA(DA)
RESET 1 24 VSSA(DA)
VDDD 6 27 VOUTL VDDD 2 23 VOUTL
BCKO 3 22 VDDA(DA)
BCKO 7 26 VDDA(DA)
WSO 4 21 VOUTR
WSO 8 25 VOUTR UDA1380HN
DATAO 5 20 VDDA(HP)
UDA1380TT
DATAO 9 24 VDDA(HP) BCKI 6 19 VOUTLHP
WSI 7 18 VREF(HP)
BCKI 10 23 VOUTLHP
DATAI 8 17 VOUTRHP
WSI 11 22 VREF(HP)
VSSD 10
RTCB 11
L3MODE 12
L3CLOCK/SCL 13
L3DATA/SDA 14
SEL_L3_IIC 15
VSSA(HP) 16
9
SYSCLK
DATAI 12 21 VOUTRHP
mgw778
SYSCLK 13 20 VSSA(HP)
VSSD 14 19 SEL_L3_IIC
L3MODE 16 17 L3CLOCK/SCL
MGU525
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NXP Semiconductors Product specification
• The ADC can run at the SYSCLK input, and at the same
time the DAC part can run (at a different frequency) at DIV1 PRE1
the clock re-generated from the WSI signal
• The ADC and the DAC can both run at the clock 128fs
regenerated from the WSI signal. (digital parts)
256fs
(ADC and FSDAC) MGU527
2004 Apr 22 11
NXP Semiconductors Product specification
enable clock
handbook, full pagewidth
256/384/512/768fs ADC
ADC_CLK
128fs
SYSCLK CLK_DIV 128fs
DECIMATOR
enable L3 or I2C-BUS
clock REGISTER
DECIMATOR
I2S-BUS
OUTPUT BLOCK
I2S-BUS
INPUT BLOCK
L3 or I2C-BUS
enable
REGISTER
clock
INTERPOLATOR
256fs
128fs
INTERPOLATOR
WSI WSPLL 128fs
DAC_CLK
FSDAC
Fig.5 Clock routing for the main blocks inside the coder-decoder.
2004 Apr 22 12
NXP Semiconductors Product specification
• The input impedance of the PGA (line input) is 12 kΩ, for • Mixed PGA and LNA mode: one line input and one
the LNA this is 5 kΩ microphone input.
More information on the analog frond-end is given in
Section 8.11.1.
1
VINR PGA SDC ADC bitstream
(29)
right
31
VINL PGA SDC
(27)
bitstream
ADC
left
3
VINM LNA SDC
(31)
SEL_LNA MGU530
2004 Apr 22 13
NXP Semiconductors Product specification
In applications in which a 2 V (RMS) input signal is used, Table 3 Decimation filter characteristics
a 12 kΩ resistor must be used in series with the input of the
ITEM CONDITION VALUE (dB)
ADC (see Fig.7). This forms a voltage divider together with
the internal ADC resistor and ensures that the voltage, Pass-band ripple 0 to 0.45fs 0.01
applied to the input of the IC, never exceeds 1 V (RMS). Stop band >0.55fs −70
Using this application for a 2 V (RMS) input signal, the
Dynamic range 0 to 0.45fs >135
switch must be set to 0 dB. When a 1 V (RMS) input signal
is applied to the ADC in the same application, the gain Digital output at 0 dB input −1.5
switch must be set to 6 dB. level analog
2004 Apr 22 14
NXP Semiconductors Product specification
2004 Apr 22 15
NXP Semiconductors Product specification
bitstream FSDAC
MGU531
2004 Apr 22 16
NXP Semiconductors Product specification
SEL_SOURCE
PON_AVC
handbook, full pagewidth
RESISTOR
NETWORK to FSDAC
from analog mixer input
front-end
2004 Apr 22 17
NXP Semiconductors Product specification
8.9 Application modes The reset timing is determined by the external capacitor
and resistor which are connected to pin RESET, and the
The operation mode can be set with pin SEL_L3_IIC,
internal pull-down resistor. On Power-on reset, all the
either to L3-bus mode (LOW) or to the I2C-bus mode
digital sound processing features and the system
(HIGH) as given in Table 5.
controlling features are set to the default setting of the
For all features in microcontroller mode see Chapter 9. L3-bus and I2C-bus control modes.
Remark: The reset time should be at least 1 μs, and during
Table 5 Pin function in the selected mode
the reset time the system clock should be running. In case
L3-BUS MODE I2C-BUS MODE the WSPLL is selected as the clock source, a clock must
PIN
SEL_L3_IIC = L SEL_L3_IIC = H be connected to the SYSCLK input in order to have a
proper reset of the L3-bus or I2C-bus registers. This is
L3CLOCK/SCL L3CLOCK SCL
because the clock source is set to SYSCLK by default.
L3MODE L3MODE A1
L3DATA/SDA L3DATA SDA 8.11 Power-down requirements
The following blocks have power-down control via the
Remark: In the I2C-bus mode there is a bit A1 which sets L3-bus or I2C-bus interface:
the LSB bit of the address of the UDA1380. In • Microphone amplifier (LNA) including its Single-Ended
L3-bus mode this bit is not available, meaning the device to Differential Converter (SDC) and VGA
has only one L3-bus device address.
• ADC plus SDC and the PGA, for left and right separate
8.10 Power-on reset • Bias generation circuit for the front-end and the FSDAC
The UDA1380 has a dedicated reset pin, which has a • Headphone driver
pull-down resistor. This way a Power-on reset circuit can • WSPLL
be made with a capacitor and a resistor at the pin. The • FSDAC.
internal pull-down resistor cannot be used because of the
5 V tolerant nature of the pad. The pull-down resistor is Clocks of the decimator, interpolator and the analog blocks
shielded from the outside world by a transmission gate in have separate enable and disable controls.
order to support 5 V tolerance.
2004 Apr 22 18
NXP Semiconductors Product specification
1 bitstream
VINR PGA SDC ADC
(29) right
31
VINL PGA SDC
(27)
bitstream
ADC
left
3
VINM LNA SDC
(31) PON_BIAS
8.11.2 FSDAC POWER CONTROL the FSDAC or headphone driver can be powered-down.
In case the FSDAC or headphone driver must be
The FSDAC block has power-on pins: one of which shuts
powered-up, first the analog part is switched on, then the
down the DAC itself, but leaves the output still at VREF
digital part is demuted
voltage (which is half the power supply). This function is
set by the bit PON_DAC in the L3-bus or I2C-bus register. • When the ADC must be powered-down, a digital mute
sequence must be applied. When the digital output
A second L3-bus or I2C-bus bit shuts down the complete signal is completely muted, the ADC can be
bias circuit of the FSDAC, via bit PON_BIAS in the powered-down. In case the ADC must be powered-up,
L3-bus or I2C-bus register. This bit PON_BIAS acts the first the analog part must be powered-up, then the digital
same as given in Fig.12 for the analog front-end. part must be demuted
• When there is a change of, for example, clock divider
8.12 Plop prevention
settings or clock source (selecting between SYSCLK
Plops are ticks and other strange sounds that can occur and WSPLL clock), then also digital mute for that block
when a part of a device is powered-up or powered-down, (either decimator or interpolator) should be used.
or when switching between modes is done.
Remark: All items mentioned in Section 8.12 are not
Some ways to prevent plops from occurring are: ‘hard-wired’ implemented, but are to be followed by the
• When the FSDAC or headphone driver must be user as a guideline for plop prevention.
powered-down, first a digital mute is applied. After that
2004 Apr 22 19
NXP Semiconductors Product specification
8.13 Digital audio data input and output The slave and master modes can be selected by the
bit Serial Interface Mode (SIM) in the L3-bus or I2C-bus
The supported audio formats for the control modes are:
interface.
• I2S-bus
• MSB-justified 9 L3-BUS INTERFACE DESCRIPTION
• LSB-justified, 16 bits
The UDA1380 has an L3-bus microcontroller
• LSB-justified, 18 bits interface mode. Controllable system and digital sound
• LSB-justified, 20 bits processing features are:
• LSB-justified, 24 bits (only for the output interface). • Software reset
The bit clock BCK can be up to 128fs, or in other words the • System clock frequency (selection between 256fs, 384fs,
BCK frequency is 128 times the WS frequency or less: 512fs and 768fs clock divider settings)
fBCK ≤ 128fWS. • Clock mode setting, for instance, which block runs at
which clock, and clock enabling
Remark: The WS edge must coincide with the negative
edge of the BCK at all times, for proper operation of the • Power control for the WSPLL
digital I/O data interface. Figure 13 shows the interface • Data input and data output format control, for input and
signals. output independently including data source selection for
the digital output interface
8.13.1 DIGITAL AUDIO INPUT INTERFACE
• ADC features:
The digital audio input interface is slave only, meaning the – Digital mute
system must provide the WSI and BCKI signals (next to
the DATAI signal). – AGC enable and settings
– Polarity control
Either the WSPLL locks onto the WSI signal and provides
the internal clocks for the interpolator and the FSDAC, or – Input line amplifier control (0 to 24 dB in steps of
a system clock must be applied which must be in 3 dB)
frequency lock to the digital data input interface signals. – DC filtering control
– Digital gain control (+24 to −63 dB gain in steps of
8.13.2 DIGITAL AUDIO OUTPUT INTERFACE 0.5 dB) for left and right
The digital audio output interface can be either master or – Power control
slave. The data source for the data output can be selected
– VGA of the microphone input
from either the decimator (ADC front-end) or the digital
mixer output. – Selection of line or microphone input.
• DAC and headphone driver features:
Remark: The digital mixer output is only valid if both the
decimator and the interpolator run at the same clock: – Power control FSDAC and headphone driver
• In slave mode the signals on pins BCKO, WSO and – Polarity control
SYSCLK must be applied from the application (signals – Mixing control (only available when both decimator
must be in frequency lock) and the UDA1380 returns the and interpolator run at the same speed). This
DATAO signal from the decimator. The applied signal includes the mixer volumes, mute and mixer position
from pin BCKO can be for instance: 32fs, 48fs, 64fs, switch
96fs or 128fs – De-emphasis control
• In master mode the SYSCLK signal must be applied
– Master volume and balance control
from the system, then the UDA1380 returns with the
BCKO, WSO and the DATAO signals. For the BCKO – Flat/minimum/maximum settings for bass boost and
clock, there are 2 general rules: treble
– When the SYSCLK is either 256fs or 512fs, the BCKO – Tone control: bass boost and treble
frequency is 64fs – Master mute control
– When the SYSCLK is either 384fs or 768fs, the BCKO – Headphone driver short-circuit protection status bits.
signal is 48fs.
2004 Apr 22 20
andbook, full pagewidth
2004 Apr 22
NXP Semiconductors
for MD, CD and MP3
Stereo audio coder-decoder
WS LEFT RIGHT
1 2 3 >=8 1 2 3 >=8
BCK
I2S-BUS FORMAT
WS LEFT RIGHT
1 2 3 >=8 1 2 3 >=8
BCK
MSB-JUSTIFIED FORMAT
WS LEFT RIGHT
16 15 2 1 16 15 2 1
BCK
WS LEFT RIGHT
18 17 16 15 2 1 18 17 16 15 2 1
BCK
WS LEFT RIGHT
20 19 18 17 16 15 2 1 20 19 18 17 16 15 2 1
BCK
WS LEFT RIGHT
24 23 22 21 20 19 18 17 16 15 2 1 24 23 22 21 20 19 18 17 16 15 2 1
Product specification
BCK
UDA1380
DATA MSB B2 B3 B4 B5 B6 B7 B8 B9 B10 B23 LSB MSB B2 B3 B4 B5 B6 B7 B8 B9 B10 B23 LSB
9.1 Introduction The device address consists of one byte, which is split-up
in two parts:
The exchange of data and control information between the
microcontroller and the UDA1380, is accomplished • Bits 7 to 2 represent a 6-bit device address. In the
through a serial hardware interface comprising the UDA1380 this is 000001
following pins: • Bits 1 to 0 called Data Operation Mode, or DOM bits,
L3DATA/SDA: microcontroller interface data line represent the type of data transfer according to Table 6.
L3MODE: microcontroller interface mode line
9.3 Slave address
L3CLOCK/SCL: microcontroller interface clock line.
The UDA1380 acts as a slave receiver or a slave
Information transfer via the microcontroller bus is transmitter. Therefore the signals L3CLOCK and L3MODE
organized LSB first, and in accordance with the so called are only input signals. The data signal L3DATA is a
‘L3’ format, in which two different modes of operation can bidirectional line. The UDA1380 slave address is shown in
be distinguished: address mode and data transfer mode. Table 7.
Inside the microcontroller interface there is a hand-shake
mechanism which takes care of proper data transfer from Table 7 L3 slave address
the microcontroller interface clock to the destination clock (MSB) BIT (LSB)
domains. This means that when data is sent to the
microcontroller interface, the system clock must be 0 0 0 0 0 1
running.
9.4 Register addressing
9.2 Device addressing After sending the device address, including the flags (the
The device addressing mode is used to select a device for DOM bits) whether information is read or written, one byte
subsequent data transfer. The address mode is is sent with the destination register address using 7 bits,
characterized by the signal on pin L3MODE being LOW and one bit which signals whether information will be read
and a burst of 8 pulses on pin L3CLOCK/SCL, or written. The fundamental timing for L3 is given in Fig.19.
accompanied by an 8 bit device address on Basically there are three forms for register addressing:
pin L3DATA/SDA. The fundamental timing is shown in
• Register addressing for L3 write: the first bit is a logic 0
Figs 14 and 15.
indicating a write action to the destination register,
followed by seven register address bits
Table 6 Selection of data transfer
• Prepare read addressing: the first bit of the byte is
DOM DOM logic 1; signalling data will be read from the register
TRANSFER
BIT 1 BIT 0 indicated
0 0 not used • The read action itself: in this case the device returns a
0 1 not used register address prior to sending data from that register.
1 0 DATA and STATUS write or pre-read When the first bit of the byte is logic 0, the register
address was valid, in case the first bit is a logic 1 the
1 1 DATA and STATUS read
register address was invalid.
Remarks:
Table 6 shows that there are two types of data transfers:
DATA and STATUS which can be read and written. • Each time a new destination address needs to be
Table 6 also shows that the DATA and STATUS read and written, the device address must be sent again
write actions are combined. • When addressing the device for the first time after
power-up of the device, at least one L3 clock-cycle must
be given to enable the L3 interface.
2004 Apr 22 22
NXP Semiconductors Product specification
BIT
L3 MODE DATA TYPE
0(1) 1 2 3 4 5 6 7(2)
Addressing mode device address 0 1 1 0 0 0 0 0
Data transfer 1 register address 0 A6 A5 A4 A3 A2 A1 A0
Data transfer 2 MS data byte D15 D14 D13 D12 D11 D10 D9 D8
Data transfer 3 LS data byte D7 D6 D5 D4 D3 D2 D1 D0
Notes
1. First bit in time.
2. Last bit in time.
9.6 Data read mode • One byte with the device address including ‘11’ is sent
to the device, being 00000111. The ‘11’ indicates that
For reading from the device, first a prepare-read must be
the device must write data to the microcontroller, then
done. After this, the device address is sent again. The
the microcontroller frees the L3DATA-bus so the
device then returns with the register address, indicating
UDA1380 can send the register address byte and its
whether the address was valid or not, and the data of the
two-byte contents
register. The following five steps explain this procedure,
and an example of transmission is given in Fig.15. • The device now writes the requested register address
on the bus, indicating whether the requested register
• One byte with the device address, being ‘00000110’,
was valid or not (logic 0 means valid, logic 1 means
which is including the LSB code 01 for signalling write to
invalid)
the device
• The device writes the data from the requested register
• One byte is sent with the register address from which it
on the bus, being two bytes.
needs to be read. This byte starts with a logic 1, which
indicates that there will be a read action from the register The SYSCLK signal must be applied in data read mode.
2004 Apr 22 23
NXP Semiconductors Product specification
BIT
L3 MODE DATA TYPE
0(1) 1 2 3 4 5 6 7(2)
Addressing mode device address 0 1 1 0 0 0 0 0
Data transfer 1 register address 1 A6 A5 A4 A3 A2 A1 A0
Notes
1. First bit in time.
2. Last bit in time.
BIT
L3 MODE DATA TYPE
0(1) 1 2 3 4 5 6 7(2)
Addressing mode device address 1 1 1 0 0 0 0 0
Data transfer 1; register address 0: valid A6 A5 A4 A3 A2 A1 A0
note 3 1: invalid
Data transfer 2; MS data byte D15 D14 D13 D12 D11 D10 D9 D8
note 3
Data transfer 3; LS data byte D7 D6 D5 D4 D3 D2 D1 D0
note 3
Notes
1. First bit in time.
2. Last bit in time.
3. Data transfer from the UDA1380 to the microcontroller.
2004 Apr 22 24
2004 Apr 22
NXP Semiconductors
for MD, CD and MP3
Stereo audio coder-decoder
L3CLOCK
L3MODE
L3DATA 0 1 0
MGU535
DOM bits write
L3CLOCK
L3MODE
L3DATA 0 1 1 1 1 0/1
Product specification
DOM bits read valid/non-valid
UDA1380
prepare read send by the device MGU536
The UDA1380 supports I2C-bus microcontroller interface The UDA1380 acts as either a slave receiver or a slave
mode as well as the L3-bus mode; all features can be transmitter. Therefore the clock signal SCL is only an input
controlled by the microcontroller with the same register signal. The data signal SDA is a bidirectional line. Table 11
addresses as in the L3-bus mode. shows the device address of the UDA1380.
The exchange of data and control information between the The device can be set to one of the two addresses by using
microcontroller and the UDA1380 in I2C-bus mode is bit A1 (which is pin L3MODE) to select.
accomplished through a serial hardware interface
comprising the following pins: Table 11 I2C-bus device address
L3CLOCK/SCL: microcontroller interface clock line, (MSB) BIT (LSB)
SCL
0 0 1 1 0 A1 0 R/W
L3MODE: sets the bit A1of the I2C-bus device address
L3DATA/SDA: microcontroller interface data line, SDA. 10.1.2 REGISTER ADDRESS
Figure 20 shows the clock and data timing of the I2C-bus Table 12 shows the register address format of the
transfer. UDA1380. The register mapping in I2C-bus mode is the
same as for the L3-bus interface.
10.1 Addressing
Before any data is transmitted on the I2C-bus, the device Table 12 I2C-bus register address
which should respond is addressed first. The addressing is (MSB) BIT (LSB)
always done with the first byte transmitted after the start
procedure. The UDA1380 device address is 0 A6 A5 A4 A3 A2 A1 A0
[A6 to A0] 00110(A1)0, with bit A1 as the address
selection bit (two addresses possible).
2004 Apr 22 26
2004 Apr 22 10.2 WRITE cycle
NXP Semiconductors
for MD, CD and MP3
Stereo audio coder-decoder
Table 13 shows the I2C-bus configuration for a WRITE cycle. The WRITE cycle is used to write the data to the internal registers. The device and register
addresses are one byte each, the setting data is always a pair of two bytes.
The format of the WRITE cycle is as follows:
1. The microcontroller begins by asserting a start condition (S).
2. The first byte (8 bits) contains the device address ‘00110A10’ and the R/W bit is set to logic 0 (WRITE).
3. The UDA1380 asserts an acknowledge (A).
4. The microcontroller writes the 8-bit address (ADDR) of the UDA1380 register to which the data will be written.
5. The UDA1380 acknowledges this register address (A).
6. The microcontroller sends two bytes of data with the Most Significant (MS) byte first, followed by the Least Significant (LS) byte; after each byte the
UDA1380 asserts an acknowledge (A).
7. After each pair of bytes transmitted, the register address is auto-incremented; after each byte the UDA1380 asserts an acknowledge (A).
8. The UDA1380 frees the I2C-bus allowing the microcontroller to generate a stop condition (P).
Product specification
UDA1380
2004 Apr 22 10.3 READ cycle
NXP Semiconductors
for MD, CD and MP3
Stereo audio coder-decoder
Table 14 shows the I2C-bus configuration for a READ cycle. The READ cycle is used to read the data values from the internal registers.
The format of the READ cycle is as follows:
1. The microcontroller begins by asserting a start condition (S).
2. The first byte (8 bits) contains the device address ‘00110A10’ and the R/W bit is set to logic 0 (WRITE).
3. The UDA1380 asserts an acknowledge (A).
4. The microcontroller writes the 8-bit address (ADDR) of the UDA1380 register from which the data will be read.
5. The UDA1380 acknowledges this register address (A).
6. The microcontroller generates a repeated start (Sr).
7. The microcontroller generates the device address ‘00110A10’ again, but this time the R/W bit is set to logic 1 (READ).
8. The UDA1380 asserts an acknowledge (A).
9. The UDA1380 sends two bytes of data with the Most Significant (MS) byte first, followed by the Least Significant (LS) byte; after each byte the
microcontroller asserts an acknowledge (A).
10. After each pair of bytes transmitted, the register address is auto-incremented; after each byte the microcontroller asserts an acknowledge (A).
11. The microcontroller stops this cycle by generating a negative acknowledge (NA).
12. The UDA1380 frees the I2C-bus allowing the microcontroller to generate a stop condition (P).
28
Table 14 Master transmitter reads from the UDA1380 registers in the I2C-bus mode
Product specification
UDA1380
NXP Semiconductors Product specification
11 REGISTER MAPPING
Table 15 Register map of control settings (write)
REGISTER
FUNCTION
ADDRESS
REGISTER
FUNCTION
ADDRESS
Headphone driver and interpolation filter
18H interpolation filter status
Decimator
28H decimator status
2004 Apr 22 29
NXP Semiconductors Product specification
BIT 15 14 13 12 11 10 9 8
Symbol EV2 EV1 EV0 − EN_ADC EN_DEC EN_DAC EN_INT
Default 0 0 0 0 0 1 0 1
BIT 7 6 5 4 3 2 1 0
Symbol − − ADC_CLK DAC_CLK sys_div1 sys_div0 PLL1 PLL0
Default 0 0 0 0 0 0 1 0
2004 Apr 22 30
NXP Semiconductors Product specification
2004 Apr 22 31
NXP Semiconductors Product specification
BIT 15 14 13 12 11 10 9 8
Symbol − − − − − SFORI2 SFORI1 SFORI0
Default 0 0 0 0 0 0 0 0
BIT 7 6 5 4 3 2 1 0
Symbol − SEL_ − SIM − SFORO2 SFORO1 SFORO0
SOURCE
Default 0 0 0 0 0 0 0 0
2004 Apr 22 32
NXP Semiconductors Product specification
BIT 7 6 5 4 3 2 1 0
Symbol EN_AVC PON_AVC − PON_LNA PON_ PON_ PON_ PON_
PGAL ADCL PGAR ADCR
Default 0 0 0 0 0 0 0 0
2004 Apr 22 33
NXP Semiconductors Product specification
2004 Apr 22 34
NXP Semiconductors Product specification
BIT 15 14 13 12 11 10 9 8
Symbol − − AVCL5 AVCL4 AVCL3 AVCL2 AVCL1 AVCL0
Default 0 0 1 1 1 1 1 1
BIT 7 6 5 4 3 2 1 0
Symbol − − AVCR5 AVCR4 AVCR3 AVCR2 AVCR1 AVCR0
Default 0 0 1 1 1 1 1 1
2004 Apr 22 35
NXP Semiconductors Product specification
BIT 15 14 13 12 11 10 9 8
Symbol − − − − − RSV12 RSV11 RSV10
Default − − − − − 0 1 0
BIT 7 6 5 4 3 2 1 0
Symbol − − − − − RSV02 EN_SCP RSV00
Default − − − − − 0 1 0
2004 Apr 22 36
NXP Semiconductors Product specification
BIT 15 14 13 12 11 10 9 8
Symbol MVCR_7 MVCR_6 MVCR_5 MVCR_4 MVCR_3 MVCR_2 MVCR_1 MVCR_0
Default 0 0 0 0 0 0 0 0
BIT 7 6 5 4 3 2 1 0
Symbol MVCL_7 MVCL_6 MVCL_5 MVCL_4 MVCL_3 MVCL_2 MVCL_1 MVCL_0
Default 0 0 0 0 0 0 0 0
2004 Apr 22 37
NXP Semiconductors Product specification
BIT 15 14 13 12 11 10 9 8
Symbol VC2_7 VC2_6 VC2_5 VC2_4 VC2_3 VC2_2 VC2_1 VC2_0
Default 1 1 1 1 1 1 1 1
BIT 7 6 5 4 3 2 1 0
Symbol VC1_7 VC1_6 VC1_5 VC1_4 VC1_3 VC1_2 VC1_1 VC1_0
Default 0 0 0 0 0 0 0 0
2004 Apr 22 38
NXP Semiconductors Product specification
BIT 15 14 13 12 11 10 9 8
Symbol M1 M0 TRL1 TRL0 BBL3 BBL2 BBL1 BBL0
Default 0 0 0 0 0 0 0 0
BIT 7 6 5 4 3 2 1 0
Symbol − − TRR1 TRR0 BBR3 BBR2 BBR1 BBR0
Default 0 0 0 0 0 0 0 0
2004 Apr 22 39
NXP Semiconductors Product specification
2004 Apr 22 40
NXP Semiconductors Product specification
BIT 15 14 13 12 11 10 9 8
Symbol − MTM − − MT2 DE2_2 DE2_1 DE2_0
Default 0 1 0 0 1 0 0 0
BIT 7 6 5 4 3 2 1 0
Symbol − − − − MT1 DE1_2 DE1_1 DE1_0
Default 0 0 0 0 0 0 0 0
2004 Apr 22 41
NXP Semiconductors Product specification
BIT 15 14 13 12 11 10 9 8
Symbol DA_POL_INV SEL_NS MIX_POS MIX − − − −
Default 0 0 0 0 0 0 0 0
BIT 7 6 5 4 3 2 1 0
Symbol SILENCE SDET_ON SD_VALUE1 SD_VALUE0 − − OS1 OS0
Default 0 0 0 0 0 0 0 0
2004 Apr 22 42
NXP Semiconductors Product specification
BIT 15 14 13 12 11 10 9 8
Symbol ML_DEC7 ML_DEC6 ML_DEC5 ML_DEC4 ML_DEC3 ML_DEC2 ML_DEC1 ML_DEC0
Default 0 0 0 0 0 0 0 0
BIT 7 6 5 4 3 2 1 0
Symbol MR_DEC7 MR_DEC6 MR_DEC5 MR_DEC4 MR_DEC3 MR_DEC2 MR_DEC1 MR_DEC0
Default 0 0 0 0 0 0 0 0
2004 Apr 22 43
NXP Semiconductors Product specification
BIT 15 14 13 12 11 10 9 8
Symbol MT_ADC − − − PGA_GAIN PGA_GAIN PGA_GAIN PGA_GAIN
CTRLR3 CTRLR2 CTRLR1 CTRLR0
Default 1 0 0 0 0 0 0 0
BIT 7 6 5 4 3 2 1 0
Symbol − − − − PGA_GAIN PGA_GAIN PGA_GAIN PGA_GAIN
CTRLL3 CTRLL2 CTRLL1 CTRLL0
Default 0 0 0 0 0 0 0 0
2004 Apr 22 44
NXP Semiconductors Product specification
BIT 15 14 13 12 11 10 9 8
Symbol − − − ADCPOL_ INV VGA_CTRL3 VGA_CTRL2 VGA_CTRL1 VGA_CTRL0
Default 0 0 0 0 0 0 0 0
BIT 7 6 5 4 3 2 1 0
Symbol − − − − SEL_LNA SEL_MIC SKIP_DCFIL EN_DCFIL
Default 0 0 0 0 0 0 1 0
2004 Apr 22 45
NXP Semiconductors Product specification
2004 Apr 22 46
NXP Semiconductors Product specification
BIT 15 14 13 12 11 10 9 8
Symbol − − − − − AGC_TIME2 AGC_TIME1 AGC_TIME0
Default 0 0 0 0 0 0 0 0
BIT 7 6 5 4 3 2 1 0
Symbol − − − − AGC_LEVEL1 AGC_LEVEL0 − AGC_EN
Default 0 0 0 0 0 0 0 0
AGC SETTING
44.1 kHz SAMPLING 8 kHz SAMPLING
AGC_TIME2 AGC_TIME1 AGC_TIME0
ATTACK TIME DECAY TIME ATTACK TIME DECAY TIME
(ms) (ms) (ms) (ms)
0 0 0 11 100 61 551 (default)
0 0 1 16 100 88.2 551
0 1 0 11 200 61 1102
0 1 1 16 200 88.2 1102
1 0 0 21 200 116 1102
1 0 1 11 400 61 2205
1 1 0 16 400 88.2 2205
1 1 1 21 400 116 2205
2004 Apr 22 47
NXP Semiconductors Product specification
BIT 15 14 13 12 11 10 9 8
Default value − − − − − − − −
BIT 7 6 5 4 3 2 1 0
Default value − − − − − − − −
BIT 15 14 13 12 11 10 9 8
Symbol − − − − − HP_STCTV HP_STCTL HP_STCTR
BIT 7 6 5 4 3 2 1 0
Symbol − SDETR2 SDETL2 SDETR1 SDETL1 MUTE_ MUTE_ MUTE_
STATE_M STATE_CH2 STATE_CH1
2004 Apr 22 48
NXP Semiconductors Product specification
BIT 15 14 13 12 11 10 9 8
Symbol − − − − − − − −
BIT 7 6 5 4 3 2 1 0
Symbol − − − AGC_STAT − MT_ADC_STAT − OVERFLOW
2004 Apr 22 49
NXP Semiconductors Product specification
12 LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VDD supply voltage note 1 − 4 V
Txtal(max) maximum crystal temperature − 150 °C
Tstg storage temperature −65 +125 °C
Tamb ambient temperature −40 +85 °C
Ves electrostatic handling voltage note 2 −2000 +2000 V
note 3 −200 +200 V
Ilu(prot) latch-up protection current Tamb = 125 °C; VDD = 3.6 V − 100 mA
Isc(DAC) short-circuit current of DAC Tamb = 0 °C; VDD = 3 V; note 4
output short-circuited to VSSA(DA) − 450 mA
output short-circuited to VDDA(DA) − 325 mA
Notes
1. All supply connections must be made to the same power supply.
2. Equivalent to discharging a 100 pF capacitor via a 1.5 kΩ series resistor.
3. Equivalent to discharging a 200 pF capacitor via a 0.75 μH series inductor.
4. DAC operation after short-circuiting cannot be warranted.
13 HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
advised to take normal precautions appropriate to handling MOS devices.
14 THERMAL CHARACTERISTICS
15 QUALITY SPECIFICATION
In accordance with “SNW-FQ-611D”.
2004 Apr 22 50
NXP Semiconductors Product specification
16 DC CHARACTERISTICS
VDDD = VDDA(AD) = VDDA(DA) = VDDA(HP) = 3.0 V; Tamb = 25 °C; RL = 5 kΩ; all voltages measured with respect to ground;
unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supplies; note 1
VDDA(AD) ADC analog supply voltage 2.4 3.0 3.6 V
VDDA(DA) DAC analog supply voltage 2.4 3.0 3.6 V
VDDA(HP) headphone analog supply note 2 2.4 3.0 3.6 V
voltage
VDDD digital supply voltage 2.4 3.0 3.6 V
IDDA(AD) ADC analog supply current one ADC and microphone − 4.5 − mA
amplifier enabled; fs = 48 kHz
two ADCs and PGA enabled; − 7.0 − mA
fs = 48 kHz
all ADCs and PGAs power-down, − 3.3 − mA
but AVC activated; fs = 48 kHz
all ADCs, PGAs and LNA − 1.0 − μA
power-down; fs = 48 kHz
IDDA(DA) DAC analog supply current operating mode; fs = 48 kHz − 3.4 − mA
Power-down mode; fs = 48 kHz − 0.1 − μA
IDDA(HP) headphone analog supply no signal applied (quiescent − 0.9 − mA
current current)
Power-down mode − 0.1 − μA
IDDD digital supply current operating mode; fs = 48 kHz − 10.0 − mA
playback mode; fs = 48 kHz − 5.0 − mA
record mode; fs = 48 kHz − 6.0 − mA
Power-down mode; fs = 48 kHz − 1.0 − μA
IDD(tot) total supply current playback mode − 8 − mA
(without headphone); fs = 48 kHz
playback mode (with headphone); − 9 − mA
no signal; fs = 48 kHz
record mode (audio); fs = 48 kHz − 13 − mA
record mode (speech); − 10 − mA
fs = 48 kHz
record mode (audio and speech); − 13 − mA
fs = 48 kHz
fully operating; fs = 48 kHz − 23 − mA
signal mix-in operating, using − 12 − mA
FSDAC, AVC (with headphone);
no signal; fs = 48 kHz
Power-down mode; fs = 48 kHz − 2 − μA
2004 Apr 22 51
NXP Semiconductors Product specification
2004 Apr 22 52
NXP Semiconductors Product specification
17 AC CHARACTERISTICS
VDDD = VDDA(AD) = VDDA(DA) = VDDA(HP) = 3.0 V; fi = 1 kHz at −1 dB; Tamb = 25 °C; RL = 5 kΩ; all voltages measured with
respect to ground; unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Analog-to-digital converter
Do digital output level 0 dB setting; Vi(rms) = 1.0 V −1.5 −1 −0.5 dBFS
3 dB setting; Vi(rms) = 708 mV −1.5 −1 −0.5 dBFS
6 dB setting; Vi(rms) = 501 mV −1.5 −1 −0.5 dBFS
9 dB setting; Vi(rms) = 354 mV −1.5 −1 −0.5 dBFS
12 dB setting; Vi(rms) = 252 mV −1.5 −1 −0.5 dBFS
15 dB setting; Vi(rms) = 178 mV −1.5 −1 −0.5 dBFS
18 dB setting; Vi(rms) = 125 mV −1.5 −1 −0.5 dBFS
21 dB setting; Vi(rms) = 89 mV −1.5 −1 −0.5 dBFS
24 dB setting; Vi(rms) = 63 mV −1.5 −1 −0.5 dBFS
ΔVi unbalance between channels − <0.1 − dB
(THD + N)/S48 total harmonic at −1 dBFS
distortion-plus-noise to signal at 0 dB setting − −85 −80 dB
fs = 48 kHz
3 dB setting − −85 − dB
6 dB setting − −85 − dB
9 dB setting − −85 − dB
12 dB setting − −84 − dB
15 dB setting − −83 − dB
18 dB setting − −82 − dB
21 dB setting − −80 − dB
24 dB setting − −78 − dB
at −60 dBFS; A-weighted
0 dB setting − −37 −32 dB
3 dB setting − −36 − dB
6 dB setting − −36 − dB
9 dB setting − −36 − dB
12 dB setting − −35 − dB
15 dB setting − −34 − dB
18 dB setting − −33 − dB
21 dB setting − −32 − dB
24 dB setting − −30 − dB
S/N48 signal-to-noise ratio at Vi = 0 V; A-weighted 92 97 − dB
fs = 48 kHz
αcs channel separation − 100 − dB
PSRR power supply rejection ratio fripple = 1 kHz; − 80 − dB
Vripple = 30 mV (p-p)
2004 Apr 22 53
NXP Semiconductors Product specification
2004 Apr 22 54
NXP Semiconductors Product specification
2004 Apr 22 55
NXP Semiconductors Product specification
18 TIMING
VDDD = VDDA(AD) = VDDA(DA) = VDDA(HP) = 2.7 to 3.6 V; Tamb = −20 to +85 °C; all voltages referenced to ground; unless
otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
System clock timing; note 1
Tsys system clock cycle time fsys = 256fs 35 81 250 ns
fsys = 384fs 23 54 170 ns
fsys = 512fs 17 41 130 ns
fsys = 768fs 17 27 90 ns
tCWL system clock LOW time fsys < 19.2 MHz 0.3Tsys − 0.7Tsys ns
fsys ≥ 19.2 MHz 0.4Tsys − 0.6Tsys ns
tCWH system clock HIGH time fsys < 19.2 MHz 0.3Tsys − 0.7Tsys ns
fsys ≥ 19.2 MHz 0.4Tsys − 0.6Tsys ns
Serial interface input/output data timing (see Fig.17)
fBCK bit clock frequency − − 128fs Hz
Tcy(BCK) bit clock cycle time − − 1⁄
128Tcy(s)
(2) s
tBCKH bit clock HIGH time 30 − − ns
tBCKL bit clock LOW time 30 − − ns
tr rise time − − 20 ns
tf fall time − − 20 ns
tsu(WS) word select set-up time 10 − − ns
th(WS) word select hold time 10 − − ns
tsu(DATAI) data input set-up time 10 − − ns
th(DATAI) data input hold time 10 − − ns
th(DATAO) data output hold time 0 − − ns
td(DATAO-BCK) data output to bit clock delay − − 30 ns
td(DATAO-WS) data output to word select delay − − 30 ns
L3-bus interface timing (see Figs 18 and 19)
tr rise time note 3 − − 10 ns/V
tf fall time note 3 − − 10 ns/V
Tcy(CLK)L3 L3CLOCK cycle time note 4 500 − − ns
tCLK(L3)H L3CLOCK HIGH time note 4 250 − − ns
tCLK(L3)L L3CLOCK LOW time note 4 250 − − ns
tsu(L3)A L3MODE set-up time in address 190 − − ns
mode
th(L3)A L3MODE hold time in address 190 − − ns
mode
tsu(L3)D L3MODE set-up time in data 190 − − ns
transfer mode
th(L3)D L3MODE hold time in data transfer 190 − − ns
mode
2004 Apr 22 56
NXP Semiconductors Product specification
2004 Apr 22 57
NXP Semiconductors Product specification
MGR984
t CWL
Tsys
WS
t BCKH
t h(WS) t d(DATAO-BCK)
tr tf
t su(WS)
BCK
t BCKL
t d(DATAO-WS) t h(DATAO)
Tcy(BCK)
DATAO
t su(DATAI)
t h(DATAI)
DATAI
MGS756
2004 Apr 22 58
NXP Semiconductors Product specification
th(L3)A tsu(L3)A
tCLK(L3)L
tsu(L3)A tCLK(L3)H th(L3)A
L3CLOCK
Tcy(CLK)(L3)
tsu(L3)DA th(L3)DA
MGL723
L3MODE
tCLK(L3)L
Tcy(CLK)L3 th(L3)D
tsu(L3)D tCLK(L3)H
L3CLOCK
tsu(L3)DA
th(L3)DA
L3DATA
read
td(L3)R tdis(L3)R
MGU015
2004 Apr 22 59
2004 Apr 22
NXP Semiconductors
for MD, CD and MP3
Stereo audio coder-decoder
SDA
SCL
t HD;STA t SU;STO
t HD;DAT t HIGH t SU;DAT t SU;STA
P S Sr P
MBC611
Product specification
UDA1380
handbook, full pagewidth
19 APPLICATION INFORMATION
BLM31A601S
handbook, full pagewidth
+3 V VDDA
VDDA VDDA VDDD
BLM31A601S
VDDD 4.7 μF
100 Ω (16 V)
100 μF 100 μF
ground (16 V) (16 V)
100 μF 100 nF
(16 V) (63 V) 47 kΩ
100 nF 100 μF
(63 V) (16 V)
VADCN VADCP VSSA(HP) VDDA(HP) RESET
47 μF 2 (30) 4 (32) 20 (16) 24 (20) 5 (1)
left VINL VOUTL 100 Ω left
input 31 (27) (23) 27 output
(16 V) 47 μF
(16 V) 10 kΩ
47 μF
right VINR
input 1 (29)
(16 V)
VOUTR 100 Ω right
(21) 25 output
47 μF
micro- VINM 47 μF
phone 3 (31) (16 V) 10 kΩ
input (16 V)
L3DATA/SDA
18 (14)
L3CLOCK/SCL DATAO
17 (13) (5) 9
L3MODE
16 (12)
UDA1380TT (4) 8
WSO
(UDA1380HN) BCKO
(3) 7
SEL_L3_IIC
19 (15)
VREF(HP)
system SYSCLK (18) 22
clock 13 (9)
47 Ω
VOUTLHP
DATAI (19) 23
12 (8) 0Ω
WSI VOUTRHP
11 (7) (17) 21 headphone
BCKI 0Ω
10 (6)
RTCB VREF
15 (11) (25) 29
MGU537
100 nF 100 nF
(63 V) (63 V)
100 μF 100 μF
(16 V) (16 V)
1Ω 10 Ω 1Ω
2004 Apr 22 61
NXP Semiconductors Product specification
20 PACKAGE OUTLINES
TSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm;
lead pitch 0.65 mm SOT487-1
D E A
X
y HE v M A
32 17
A2 (A 3) A
A1
pin 1 index
θ
Lp
L
1 16 detail X
w M
e bp
0 2.5 5 mm
scale
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
99-12-27
SOT487-1 MO-153
03-02-18
2004 Apr 22 62
NXP Semiconductors Product specification
HVQFN32: plastic thermal enhanced very thin quad flat package; no leads;
32 terminals; body 5 x 5 x 0.85 mm SOT617-1
D B A
terminal 1
index area A
A1
E c
detail X
e1 C
e 1/2 e b v M C A B y1 C y
9 16 w M C
L
17
8
e
Eh e2
1/2 e
1
24
terminal 1
index area 32 25
Dh X
0 2.5 5 mm
scale
DIMENSIONS (mm are the original dimensions)
A(1)
UNIT A1 b c D (1) Dh E (1) Eh e e1 e2 L v w y y1
max.
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
01-08-08
SOT617-1 --- MO-220 ---
02-10-18
2004 Apr 22 63
NXP Semiconductors Product specification
2004 Apr 22 64
NXP Semiconductors Product specification
21.5 Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE(1)
WAVE REFLOW(2)
BGA, HTSSON..T(3), LBGA, LFBGA, SQFP, SSOP..T(3), TFBGA, not suitable suitable
USON, VFBGA
DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, not suitable(4) suitable
HTQFP, HTSSOP, HVQFN, HVSON, SMS
PLCC(5), SO, SOJ suitable suitable
LQFP, QFP, TQFP not recommended(5)(6) suitable
SSOP, TSSOP, VSO, VSSOP not recommended(7) suitable
CWQCCN..L(8), PMFP(9), WQCCN..L(8) not suitable not suitable
Notes
1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy
from your NXP Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account
be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature
must be kept as low as possible.
4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
5. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
6. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
8. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted
on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar
soldering process. The appropriate soldering profile can be provided on request.
9. Hot bar or manual soldering is suitable for PMFP packages.
2004 Apr 22 65
NXP Semiconductors Product specification
DOCUMENT PRODUCT
DEFINITION
STATUS(1) STATUS(2)
Objective data sheet Development This document contains data from the objective specification for product
development.
Preliminary data sheet Qualification This document contains data from the preliminary specification.
Product data sheet Production This document contains the product specification.
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
2004 Apr 22 66
NXP Semiconductors Product specification
Limiting values ⎯ Stress above one or more limiting Quick reference data ⎯ The Quick reference data is an
values (as defined in the Absolute Maximum Ratings extract of the product data given in the Limiting values and
System of IEC 60134) will cause permanent damage to Characteristics sections of this document, and as such is
the device. Limiting values are stress ratings only and not complete, exhaustive or legally binding.
(proper) operation of the device at these or any other
Non-automotive qualified products ⎯ Unless this data
conditions above those given in the Recommended
sheet expressly states that this specific NXP
operating conditions section (if present) or the
Semiconductors product is automotive qualified, the
Characteristics sections of this document is not warranted.
product is not suitable for automotive use. It is neither
Constant or repeated exposure to limiting values will
qualified nor tested in accordance with automotive testing
permanently and irreversibly affect the quality and
or application requirements. NXP Semiconductors accepts
reliability of the device.
no liability for inclusion and/or use of non-automotive
Terms and conditions of commercial sale ⎯ NXP qualified products in automotive equipment or
Semiconductors products are sold subject to the general applications.
terms and conditions of commercial sale, as published at
In the event that customer uses the product for design-in
http://www.nxp.com/profile/terms, unless otherwise
and use in automotive applications to automotive
agreed in a valid written individual agreement. In case an
specifications and standards, customer (a) shall use the
individual agreement is concluded only the terms and
product without NXP Semiconductors’ warranty of the
conditions of the respective agreement shall apply. NXP
product for such automotive applications, use and
Semiconductors hereby expressly objects to applying the
specifications, and (b) whenever customer uses the
customer’s general terms and conditions with regard to the
product for automotive applications beyond NXP
purchase of NXP Semiconductors products by customer.
Semiconductors’ specifications such use shall be solely at
No offer to sell or license ⎯ Nothing in this document customer’s own risk, and (c) customer fully indemnifies
may be interpreted or construed as an offer to sell products NXP Semiconductors for any liability, damages or failed
that is open for acceptance or the grant, conveyance or product claims resulting from customer design and use of
implication of any license under any copyrights, patents or the product for automotive applications beyond NXP
other industrial or intellectual property rights. Semiconductors’ standard warranty and NXP
Semiconductors’ product specifications.
Export control ⎯ This document as well as the item(s)
described herein may be subject to export control
regulations. Export might require a prior authorization from 24 TRADEMARKS
national authorities.
I2C-bus ⎯ logo is a trademark of NXP B.V.
2004 Apr 22 67
NXP Semiconductors
provides High Performance Mixed Signal and Standard Product
solutions that leverage its leading RF, Analog, Power Management,
Interface, Security and Digital Processing expertise
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors. No changes were
made to the content, except for the legal definitions and disclaimers.
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Printed in The Netherlands R30/04/pp68 Date of release: 2004 Apr 22 Document order number: 9397 750 13108