International Journal of Engineering and Applied Sciences (IJEAS)

ISSN: 2394-3661, Volume-4, Issue-12, December 2017

DMAIC Methodology to Solder Paste Printing

Process in Printed Circuit Boards
Beyza Nur Sezgin, Sérgio Dinis Teixeira de Sousa, Eusébio Manuel Pinto Nunes, Kemal
Alaykıran

Abstract— Nowadays, production of defective items is a significant value, as 3.4 DPMO is close the perfection, and
crucial issue for manufacturers. In repetitive and mature that makes it a more attainable and realistic goal to achieve
processes with low defect levels, measured by defects per million [8].
opportunities (DPMO), it is difficult to reduce them even further.
Specification limits associated to products are performance
The purpose of this study is to reduce the defects rate in one key
process, surface mount technology (SMT). The methodology is
ranges that customers accept [9]. These limits are typically
based on case study of an automotive supplier of electrical and represented by: lower specification limit (LSL), upper
electronic devices. It focuses on implementing Six Sigma tools, specification limit (USL) and target value (T) (Figure 1).
using the DMAIC to improve the solder paste printing process
of Printed Circuit Boards (PCBs) in SMT. In the case study,
solder paste volume defect is defined as the most common type of
defect occurred in the process. The used method (proflow) was
compared with a new selected method (squeegee) using
statistical analyses. The volume defect was reduced over 50%
and the sigma level was increased from 5.0 to 5.2.

Index Terms— DMAIC; Six Sigma; Surface Mount

Technology – Printing Process Figure 1. Normal distribution with the mean shifted by ±1.5 [7].

The process mean is to be kept at the target value in

I. INTRODUCTION practice. However, the process mean during one time period
Manufacturers of automotive electronic components have is usually different from that of another time period for
successfully implemented quality managements systems, various reasons [9]. This means that the process mean
quality tools and techniques to support systems. The constantly shifts around the target value. To address typical
prerequisites for improvement of manufacturing processes in maximum shifts of the process mean Motorola added the shift
the electronics field are the continuous growth of different value ±1.5σ to the process mean. This shift of the mean is used
methodologies; as well as the increasing level of quality when computing a process sigma level. The process mean can
requirements. be drifted 1.5 sigma in either direction [10]. The area of a
The environment associated with surface mount technology normal distribution, beyond 4.5 sigma from the mean is
(SMT), has been successfully compatible with Six Sigma, it is indeed 3.4.
a project based DMAIC methodology (the sequential phases DMAIC is used by Six Sigma as a generic problem solving
Define, Measure, Analyze, Improve and Control) that make methodology that applies across cultures, processes,
up the improvement cycle. functions, types of industry [11]. It has developed by using of
The use of Six Sigma detects and eliminates root cause of this or similar approaches around the world in many different
defects in a given system [1]. Various industries applied the improvement circumstances.
Six Sigma for defect or problem reduction and sigma level The importance of SMT has been reflected in many
improvement purposes [2], [3], [4], [5]. published studies. They particularly focus on the application
Six Sigma represents the idealized goal of a defect rate of of the solder printing process because most of SMT defects
3.4 DPMO (defects per million opportunities), or 3.4 are originated in solder paste printing process. The capability
defective products on a sample of 1 million, which of solder paste printing process was improved by reducing the
corresponds to a quality rate of 99.9997% [6]. variation of solder thickness that may cause PCB failure in
If the customer dissatisfaction is measured as a defect, then SMT [12]. In another study, DMAIC (Define, Measure,
Six Sigma indicates that there would be only 3.4 defects for Analyze, Improve and Control) methodology was applied to
every million opportunities, or near perfection [7]. The reason improve the same and also by reducing thickness variations
of choosing six sigma level is that the five sigma could not from a nominal value [13]. Another work [14] reported a
meet the customer satisfaction and the seven do not add reduction in the defective rate and increase of yield using Six
Sigma in a printed circuit assembly line.
Beyza Nur Sezgin, Department of Industrial Engineering, University of DMAIC methodology was used in Printed Circuit Board
Necmettin Erbakan, Konya, Turkey, +905057523833 (PCB) manufacturing, particularly in the solder paste printing
Sérgio Dinis Teixeira de Sousa, Department of Production and
Systems, University of Minho Braga, Portugal, +351253604762
process, where product failures reduction and continuous
Eusébio Manuel Pinto Nunes, Department of Production and Systems, improvement are key objectives and are the focus of this work
University of Minho, Braga, Portugal, +351253604755 in an assembly-manufacturing site for the automotive sector,
Third Author name, Department of Industrial Engineering, University located in Braga, Portugal.
of Necmettin Erbakan, Konya, Turkey, +905056321327

30 www.ijeas.org
 DMAIC Methodology to Solder Paste Printing Process in Printed Circuit Boards

This paper is organized in four sections. After this

introduction, section II presents SMT process and the main
process focused on. In third section is organized according to
DMAIC cycle. Types of defect are described and the root
cause is designated. Previous method and the method of
solder printing by calculating sigma levels. The comparison Figure 3. Printing process flowchart.
indicates improvement of process with statistical analyze.
Finally, on the last section, the achievements are compared Solder paste printing is only the first step in the SMT
with pre-defined objectives and general conclusions are process, and defects usually appear only after reflow
drawn. soldering. If the printing solder paste inspection does not
exist in the process or is not reliable, the process improvement
II. DESCRIPTION OF SMT PROCESS gets difficult.
This work was developed in Delphi Automotive-Braga, By focus on process improvement, the main objectives of
which is an assembly-manufacturing site. Delphi this work are:
Automotive-Braga manufactures PCB products mostly by • Present and understand details of each step of the solder
using SMT) which is a technique of placing surface mount paste printing process;
devices (SMDs) on the surface of a PCB. • Identify the main type of defects;
The company strives to use the better existing technology; • Identify each defect and respective root causes;
it is equipped with twelve fully automated SMT assembly • Eliminate the root causes from the processes by
lines to quickly and efficiently meet customer's expected developing and implementing new solutions;
product requirements. The study is in one of these lines • Control the impact of the changes performed.
(Figure 2).
III. APPLYING DMAIC PHASES

A. Define
A team was formed and a project charter was defined
(Table 1). This project was scheduled for three months
between March and July 2017.

TABLE I. PROJECT CHARTER OF PRINTING PROCESS

Project Charter
Project Name: DMAIC Approach to Solder Paste Printing
Figure 2. SMT Flowchart.
in Printed Circuit Boards.
Problem Statement & Objective: Defects cause low
SMT production line consists of three manufacturing
performance in the printing process. DMAIC cycle is used
processes [12]: (1) solder paste printing process; (2)
to improve the solder paste printing process of Printed
pick-and-place for SMT components and (3) reflow of solder
Circuit Boards (PCBs) in surface mount technology
paste.
(SMT). The purpose of project is to focus on the reducing
PCB is placed in the operation line properly (loader
of defect rate in the process.
placement). The next operation is the solder paste printing
Business Case: In the case study, solder paste defect is
that puts the required paste down on a board and makes a
defined as the most common type of defect occurred in the
deposition on a pad. Printed board is automatically inspected.
process. The used method (proflow) can be compared with
The operation automatically runs by picking up components
new selected method (squeegee) using statistical analyses.
and placing them down into the solder paste. After the
Team Members: Project Area: SMT Line /
placement of components, the placed board goes through the
Fernando Guedes Solder Paste Printing Process
reflow oven to melt solder paste and burn off flux. Then the
Jorge Goncalves
solder paste is hardened to bond the components into place
Diogo Leitão Duration: 1/3/2017 -
and form to electronic connection. Automatic product
José Machado 15/7/2017
inspection is the last control. PCBs are analyzed and
Beyza Nur Sezgin
classified by properly trained and certified employees who
decide, in case of defect detection, whether there is a
possibility of rework or it is classified as scrap. A team was formed and a project charter was defined
In the beginning of solder paste printing process (Figure 3), (Table 1). This project was scheduled for three months
the checklist including stencil type, printing program and between March and July 2017.
solder paste type is controlled by the operator. Then, solder In order to detect the defects that may cause PCB failure,
paste is put in the PCB through the stencil. Since there are all types of defects were considered. The company has
different PCBs, the program is adjusted for each board. In accepted these defects which are identified by inspection
order to use the solder paste efficiently, it is kneaded in the machine as a problem that should be reduced.
machine before the printing. The solder paste is pushed The standard limits and parameter values for printing
through the stencil to fulfill the gaps. After the printing process depend on the printing line, supplier
process, the stencil is removed and the place of the stencil is recommendations and customer requirements. The types of
cleaned. defects that can be associated with each solder paste

31 www.ijeas.org
 International Journal of Engineering and Applied Sciences (IJEAS)
ISSN: 2394-3661, Volume-4, Issue-12, December 2017
deposition in the PCB are defined as volume, position, C. Analyze
bridging, height and area. According to sigma levels, the result showed that volume
Volume: Two types of defect occur in volume defect; defect is the most frequent type of defect in the studied
excessive is when the solder paste exceeds the upper process. However, the consequences of different types of
specification amount of solder paste, and insufficient is when defects can be different. For example, some types of defects
the solder paste falls below minimum level of volume. are easier, faster or cheaper to repair than others, while others
Position: Position defect is defined as the solder paste that may result in sending the PCB to scrap. Thus, the following
is deposited in an inaccurate position instead of at the method was used to clarify the criticality of the different types
pre-defined coordinates. of defects.
Bridging: Bridging defect occurs when the solder forms an First, the scale definition was created for pairwise
abnormal connection between two or more adjacent pads to comparison and decision-making using AHP scripting
form a conductive path. language in Table 3. A pairwise comparison matrix was
Height: Upper height defect is when the solder paste height created based on the cost of defect in the process. In this
is greater than the upper specification level; lower height is study, the key criterion used was cost. According to the effect
when the solder height is lower than a minimum specification of defects on process, the scales were assigned for comparing
level. the criticality of different types of defects. The survey has
Area: High area defects occur on the board when the solder done by operators according to pairwise comparison matrix.
paste is outside the maximum area defined (the area is Operators selected the number for each comparison
regarded as size of the stencil hole). If the area of solder paste considering AHP scripting language.
is less than the minimum percentage, the result of inspection is
a low area defect. TABLE III. DECISION-MAKING USING AHP SCRIPTING LANGUAGE

B. Measure AHP Scale of Numeric Reciprocal

Since there were various types of PCBs in production, one Importance for Rating (decimal)
of the production lines was selected to evaluate the data. This comparison pair (aij)
line manufactures different PCBs, each one with different Extreme 9 1/9
number of pads, but the process is similar in all products. In Very strong to 8 1/8
this phase, Sigma level for each type of defect was calculated Very strong importance
extremely 7 1/7
to measure the process quality level. Overall, PCBs with Strongly to very strong 6 1/6
35503890 pads were inspected during 10 days in April 2017 Strong 5 1/5
and defects were collected. As a result 9123 defects were Moderately to strong 4 1/4
found. The data and the sigma values calculated for each type Moderate 3 1/3
of defect are shown in Table 2. Equally to moderately 2 1/2
Equal 1 1
TABLE II. INITIAL SIGMA LEVEL
The comparison matrices were circulated among the
Defect Total Number PMO Sigma
technical staff and operators of the printing operation. This
Type Number of of Level
method conducted pairwise comparisons across all possible
Pads Defects
combinations of parties.
Volume 35503890 8629 243.04 5.0
Since there were five comparisons matter, 5 by 5 matrix
Position 35503890 95 2.67 Over 6
was made and then the diagonal elements of the matrix were
Bridging 35503890 380 10.70 5.7
defined as 1, because it would correspond to a comparison
Height 35503890 15 0.10 Over 6
with one type of defect with itself. The upper triangular matrix
Area 35503890 4 0.42 Over 6
was filled up. According to survey result, the numeric rating
Total 35503890 9123 256.96 5.0
and reciprocal values were put on the matrix (Table 4).
1 9 15 1 4
Considering all types of defects, the corresponding sigma 1 9 1 1 7 1 7 1 2
level is 5.0. 
5 7 1 7 8
Pareto analysis (Figure 4) showed that volume defect is the  
1 7 17 1 4
most frequent type of defect, representing 94.6% of total 1 4 2 1 8 1 4 1 
defects occurred in solder printing process.
TABLE IV. PAIRWISE COMPARISON MATRIX OF THE MAIN CRITERIA
WITH RESPECT TO THE GOAL

Volume Position Bridging Height Area

Volume 1 9 0.2 1 4
Position 0.11 1 0.14 0.14 0.50
Bridging 5 7 1 7 8
Height 1 7 0.14 1 4
Area 0.25 2 0.13 0.25 1
Total 7.36 26 1.61 9.39 17.50
Figure 4. Pareto chart of defect types.

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 DMAIC Methodology to Solder Paste Printing Process in Printed Circuit Boards

In order to normalize the matrix, each column of the inconsistency is acceptable. Table 7 presents defect relevance
reciprocal matrix was summed and then each element of the obtained by the multiplication of defect occurrence and defect
matrix was divided with the sum of its column. The relative criticality weight.
weight of the criticality of each defect type is presented by:
TABLE VII. DEFECT WEIGHT OF PRINTING PROCESS
TABLE V. THE MATRIX DIVIDED WITH THE SUM OF ITS COLUMN
Type of Number of Defect Cumulative Cumulative
Volume Position Bridging Height Area Defects Defects Relevance Count (%)
Volume 8629 1624.33 1624.33 88.22
Volume 0.14 0.35 0.12 0.11 0.23
Bridging 380 210.65 1834.98 99.66
Position 0.02 0.04 0.09 0.02 0.03 Position 95 3.53 1838.51 99.85
Bridging 0.68 0.27 0.62 0.75 0.46 Height 15 2.49 1841 99.99
Height 0.14 0.27 0.09 0.11 0.23 Area 4 0.22 1841.22 100.00
Area 0.03 0.08 0.08 0.03 0.06
The Pareto analysis shown in Figure 5, based on data from
Total 100 1.00 1.00 1.00 1.00 Table 7, illustrates the list of occurring defects, which reveals
that volume is the most relevant defect. The successive phases
0.14  0.35  0.12  0.11  0.23 0.19 have concentrated on identifying the major root causes that
0.02   
0.04  0.09  0.02  0.03 0.04 contribute to this volume defect.
1
Weight  0.68  0.27  0.62  0.75  0.46  0.55
5   
0.14  0.27  0.09  0.11  0.23 0.17
0.03  0.08  0.08  0.03  0.06 0.05

The Consistency Ratio (CR) assesses the consistency

between answers regarding relative importance of pairwise
comparisons. Its value should be lower than 10%.
In order to calculate the CR the Principal Eigen value
  was obtained from the summation of products between
max

each element of Eigen vectors and the sum of columns of the

reciprocal matrix.
 MAX
 (7.36  0.19)  (23  0.04)  (1.93  0.55) 
(7.40  0.17)  (15.20  0.05)
Figure 5. Pareto analysis of “quantity of defect * weight”.
 MAX
 5.37
Based on the detailed Fishbone diagram, the project team


Thus for = 5.37 and n=5 (five comparisons), the members discussed factors that may cause a volume defect by
max using brainstorming, and summarized all the factors in the
consistency index (CI) is calculated as follows: cause-and-effect diagram (Figure 6). It was concluded that the

CR   max
n root cause in the process is the proflow printing method of
depositing solder paste.
n 1 (1)
CR  0.0925

TABLE VI. RANDOM CONSISTENCY INDEX (RI)

n 1 2 3 4 5 6 7 8 9 10

RI 0 0 0.58 0.9 1.12 1.24 1.32 1.41 1.45 1.49

Figure 6. Cause and effect diagram for volume defect

Then, Consistency Ratio, is given by equation 4.
This is the printing method (Figure 7) that the solder tube is
CR CI (2) attached to print carriages and is used to print various high
RI
viscosity materials which display non Newtonian
CR  0.0826 characteristics based on pressure. During the print process the
rotation of the conditioning grid, working together with the
The value of Consistency Ratio is smaller 10%, the
print medium pressure, forces print medium into the stencil‟s
inconsistency is acceptable. Table 7 presents defect relevance
apertures. This is the most significant characteristic of
obtained by the multiplication of defect occurrence and defect
proflow that is the way of deposition into the aperture of
criticality weight.
stencil.
The value of Consistency Ratio is smaller than 10%, the

33 www.ijeas.org
 International Journal of Engineering and Applied Sciences (IJEAS)
ISSN: 2394-3661, Volume-4, Issue-12, December 2017
collected corresponding to two printing methods: Proflow and
squeegee. Table 9 presents data of volume in these two cases.
In the first observation; regarding to the data, 99.4% of data
are good and 0.6% of data are error by using proflow method,
while 99.9% of data are good and 0.1% of data are error by
using squeegee in printing process.
According to mean numbers, it is demonstrated that
squeegee deposits 16% more solder paste on the pads than
proflow (Table 9).

TABLE IX. THE DESCRIPTIVE STATISTIC OF VOLUME% FOR

PROFLOW AND SQUEEGEE USING PAD U29

Figure 7. Proflow print medium and Conditioning Grid. METHOD N Min Max Mea S.D. Cp Cpk
TYPE n

It was decided to analyze proflow process in different 216160 11.29 131.70 67.76 7.969 2.93 1.16
Proflow
aspects. The main purpose of the analysis is to compare
proflow method to an alternative printing method: squeegee. Squeegee 188654 6.31 242.95 83.92 7.106 3.28 2.06
Considering technological evolutions and requirements
evolutions, there is an alternative printing method that could
be compared to proflow. Technically, this involves changing Both printing methods show capability to produce within
a tool in the solder past deposition machine. specification ranges because the Capability index Cp in both
The comparison was implemented in the same environment methods is bigger than 1.33. However, the Cpk is smaller in
conditions such as temperature, humidity, noise, time, proflow indication that has a bigger difference from the
material lots, and parameters. The type of PCB used in this volume average to volume nominal reference.
experiment is VW MIB*441A. This PCB contains 4457 pads. As a result it can be concluded that Squeegee method
The pad is a point on the PCB where the solder paste is deposit the amount of solder paste required (between upper
deposited. Printed paste on the pads is melted and bonded the and lower limit). However, proflow method barely fell under
components. Additionally, in order to examine volume effects lower limit. Headings, or heads, are organizational devices
on the pads, different pad sizes were considered such as the that guide the reader through your paper. There are two types:
smallest, the biggest and the middle size (U29, C152, C137 component heads and text heads.
and U66). One production line was decided to work on this
analysis. The line has been worked with both proflow and 2) Experience 2
squeegee methods. PASW Statistic 18 and Minitab 18
statistical software were used to analyze the difference Component C152 contains two similar pads and the pad
between two printing methods. size is 5.3 mm x 1.7 mm. Data are almost good by using
The optimal volume value is calculated by using the pad squeegee method, while 99.8% of data are good and 0.2% of
length, width and the stencil height. Specification limits are data are error by using proflow in printing process. It was
defined as volume percentage relatively to the optimal observed that squeegee method does not cause error in the
volume value (100%). The amount of solder paste volume to process.
avoid defects is between 40% and 180%, i.e., the amount of Using the method squeegee can achieve 18.5% more
solder paste is between this range, the printing process is volume then proflow method (Table 10).
accepted as Good.
TABLE X. THE DESCRIPTIVE STATISTIC OF VOLUME% FOR
ROFLOW AND SQUEEGEE USING PAD C152

TABLE VIII. RANGES FOR SOLDER PASTE VOLUME

METHOD N Min Max Mean S.D. Cp Cpk
TYPE
Impact on
Range Amount Type
Quality
Proflow 1080 77.31 269.23 97.55 6.97 3.35 2.75
0% - 40% Insufficient Defective 8
40% - 80% Low Sufficient Acceptable
Squeegee 9438 79,50 191.56 116.04 3.34 6.99 6.38
80% - 120% Optimal Very Good
120% - 180% High Sufficient Good
>180% Excessive Defective
3) Experience 3
This component consists of two pins and pin size is 1.7 mm
The company‟s experience showed that having a “high x 5.3 mm. It was observed that good frequency is 99.9% and
sufficient” volume is slightly better than a “low sufficient” error frequency is 0.1% when the squeegee method is used in
volume. the process. However, the proflow value is very close to
squeegee results. The good frequency is 99.8% and the error
1) Experience 1 frequency is 0.2%. The description statistic is shown that
solder paste variation is deposited more by using squeegee
The component U29 contains the smallest pads. The method than usage of squeegee. The amount of volume
minimum pad size is 0.7 mm x 0.18 mm. Two samples were

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 DMAIC Methodology to Solder Paste Printing Process in Printed Circuit Boards

difference is 15%. Cp values for both two methods are : There was not a significant difference in volume defect
respectively 3.94 and 4.12. of using C137 for „proflow‟ and „squeegee‟.
TABLE XI. THE DESCRIPTIVE STATISTIC OF VOLUME% FOR
: There was a significant difference in volume defect of
ROFLOW AND SQUEEGEE USING PAD C137 using C137 for „proflow‟ and „squeegee‟.
d) Hypoheses 4:
METHOD N Min Max Mean S.D. Cp Cpk
TYPE
: There was not a significant difference in volume defect
Proflow 8252 79.07 209.58 93.87 5.920 3.94 3.03 of using U66 for „proflow‟ and „squeegee‟.
: There was a significant difference in volume defect of
Squeegee 9447 3.70 141.94 108.40 5.660 4.12 4.03 using U66 for „proflow‟ and „squeegee‟.
e) Interpretation of the Independent Sample T-test Analyze
4) Experience 4
In the difference between „proflow‟ and „squeegee‟ test, it
The component which has one of the biggest pads and was resulted in a Sig. (p) value that was less than significance
different shape was analyzed in the process. The descriptive level (p < 0.05). The null hypothesis was rejected, and the
statistic is shown that both of methods achieve to reach out alternative hypothesis was accepted for each pad types shown
optimal values considering mean value. Their amounts of in Table 13.
volume are both between 80% - 120% and more than 100%. It There was a significant difference in volume defect of
might be proved that squeegee deposits 4% more solder paste using pad U29 for „proflow‟ (M=67.76, SD=7.969) and
into pads (Table 12). This situation is considered as an „squeegee‟ (M=83.92, SD=7.106) conditions; t
advantage. (404812)=-676,58 ,p=0.00.
There was a significant difference in volume defect of
TABLE XII. THE DESCRIPTIVE STATISTIC OF VOLUME% FOR using pad C152 for „proflow‟ (M=97.55, SD=6.968) and
ROFLOW AND SQUEEGEE USING PAD U66 „squeegee‟ (M=116.04, SD=3.34) conditions; t (176977)
=-166,85 ,p=0.00.
METHOD N Min Max Mean S.D. Cp Cpk
TYPE
There was a significant difference in volume defect of
using pad C137 for „proflow‟ (M=93.87, SD=5.92) and
Proflow 5404 80.96 126.60 104.44 6.14 3.80 3.50 „squeegee‟ (M=108.40, SD=5.66) conditions; t (20244)
=-235,37 ,p=0.00.
Squeegee 4460 24.47 249.91 108.39 7.95 2.94 2.87 There was a significant difference in volume defect of
using pad U66 for „proflow‟ (M=104.44, SD=6.142) and
5) Hypotheses for The Independent T-test „squeegee‟ (M=108.39, SD=7.95) conditions; t (9862)
=-27,87,p=0.00
The independent samples t-test evaluates the difference
TABLE XIII. THE SIGNIFICANCE OF VOLUME ACCORDING TO
between the means of two independent or unrelated groups. STATUS
In this study, it was evaluated whether there was a
significant difference between the means in two unrelated Component
df t Sig.
groups. With the independent test sample t test, it was Type
evaluated whether the mean value of the volume defect for U29 404812 -676,58 0,000
one group 'proflow' differs significantly from the mean value C137 176977 -166,85 0,000
of the test variable for the second group 'squeegee'. Null and C152 20244 -235,37 0,000
alternative hypotheses were set up for each experiment of the U66 9862 -27,87 0,000
pad type (U29, C152, C137, U66).
In order to compare the significant different between
statuses, significance level (alpha) was set up as 0.05 which D. Improve
allows the analysis to either reject or accept the alternative The reason of the thoughts bases on previous experience in
hypothesis. the company that always accepted as an advantage that the
amount of solder paste is more on the board. Therefore, the
a) Hypotheses 1:
squeegee printing method which deposits more solder paste
: There was not a significant difference in volume defect than proflow printing method has been accepted as a new
of using U29 for „proflow‟ and „squeegee‟. method to be used in improve phase. Statistical experiments
on four different pads as shown:
: There was a significant difference in volume defect of
• The analysis of the components named U29 which
using U29 for „proflow‟ and „squeegee‟.
consists of smallest pads showed that squeegee deposits 16%
b) Hypoheses 2: more solder paste into the pads.
• According to analysis of named C152 component, its
: There was not a significant difference in volume defect pads was filled 16% more solder paste into the apertures.
of using C152 for „proflow‟ and „squeegee‟. • Amount of solder paste was found 15% more solder
: There was a significant difference in volume defect of paste in the squeegee method when the deposition was
using C152 for „proflow‟ and „squeegee‟. compared between squeegee and proflow.
• In the last observation of the last component named U66
c) Hypoheses 3:

35 www.ijeas.org
 International Journal of Engineering and Applied Sciences (IJEAS)
ISSN: 2394-3661, Volume-4, Issue-12, December 2017
showed that the results of the amount solder paste were close for the template. Duplicate the template file by using the Save
to each other. It was slightly more in the squeegee method. As command, and use the naming convention prescribed by
Squeegee is one of the printing methods in the SMT line. your conference for the name of your paper. In this newly
The squeegee module allows the setting and monitoring of created file, highlight all of the contents and import your
squeegee height and pressure during the print stroke. prepared text file. You are now ready to style your paper; use
the scroll down window on the left of the MS Word
Formatting toolbar.

IV. CONCLUSION
In order to reducing the defect rate and raise the sigma
level, DMAIC methodology was implemented in this study.
Five phases were successfully applied step by step. This
consideration was crucial to identify the critical root causes
for the mentioned problem as well as to improve the process.
The defects of soldering paste printing were identified,
classified into five types of defects, and its frequency was
analyzed. This study also used AHP, involving experienced
workers, to assess the criticality of these types of defects, not
Figure 8. Squeegee printing method. assessing only its frequency, as it is reported in typical Six
A quantity of paste is placed on the stencil in front of the Sigma projects. The volume defect was considered the most
traveling squeegee. Due to the angle of the squeegee blade the critical defect to be minimized.
paste has a tendency to move in rolling motion. This rolling The root cause of volume defects in the soldering paste
motion plays very significant part in the distribution of paste printing process was determined by brainstorming, cause-and
and the final print quality. During the rolling action the paste effect diagram and Pareto chart. The printing method
is worked into and fills the apertures in the stencil, thereby “proflow” could be changed to an alternative method:
showing the importance of the paste rolling action during “squeegee”.
printing. The new printing method (squeegee) was compared with
current method “proflow”. According to amount of volume, it
E. Control was observed the reachability to the optimal value. The
In this phase, it will be proved that the performance of the comparison indicated that the performance of the new method
new method and variation of volume error rates which are (Squeegee) reduced defects from 243 to 118 per million
caused by using proflow and squeegee method. There are opportunities. Afterward, Squeegee printing method was
significant circumstances in the control phase to avoid the introduced in the improve phase.
problems in the last phase. The control phase was applied
according to these particular steps: ACKNOWLEDGMENT
• Implementing ongoing measurement
We would like to thank Delphi Automotive-Braga Factory
• Standardizing the solutions
for all data and facility conditions.
• Quantifying the improvement
In the first step, the sigma level was recalculated in the
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After the text edit has been completed, the paper is ready

36 www.ijeas.org
 DMAIC Methodology to Solder Paste Printing Process in Printed Circuit Boards

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Beyza Nur Sezgin is currently a master student at Necmettin Erbakan

University, Turkey and exchange student at University of Minho, Portugal.
Her research focuses on „DMAIC Approach to Solder Paste Printing Process
in Printed Circuit Boards‟. Degree in Industrial Engineering – Selçuk
University, Konya 2014.

Sérgio Dinis Teixeira de Sousa received PhD in Manufacturing and

Mechanical Engineering, on “Quality improvement measures in SMEs”,
University of Birmingham - UK, 2005, MSc in Electrical and Computer
Engineering – area of Systems, FEUP – University of Porto, 1999. Winner of
Best Paper of the TQM Journal 2015 - Awarded by Emerald 2016

Eusébio Manuel Pinto Nunes received PhD in Electrical and Computer

Engineering, under the theme "Reliability of Non-Markovian Processes with
Uncertain Parameters", Faculty of Engineering, University of Porto (FEUP)
2005, MSc in Operational Research and Systems Engineering, Instituto
Superior Técnico of the Technical University of Lisbon, 1996, Degree in
Production Engineering - Textile Branch, School of Engineering, University
of Minho, 1991.

Kemal Alaykıran received PhD in Industrial Engineering, under the

theme "A Mathematical Model for Multi-Product Recycling Network
Design", Faculty of Engineering, University of Gazi, Turkey, 2013, MSc in
Industrial Engineering– Selçuk University, Konya 2004. AMCOM-Asset
Management Competence Development Profiling and Knowledge,
Erasmus+, 2014

37 www.ijeas.org