Bluetooth Mini Module

Assembly No. ASY90147-1, 2&3

Technical Specifications
Version 1.1

Communication Products Division

Smart Modular Technologies
4211 Starboard Drive
Fremont, CA 94538, USA

HANTZ + PARTNER
The Upgrade Company! www.hantz.com
Deutschland:
Tel.: 0761 / 592100
Fax: 0761 / 585228
Schweiz:
Tel.: 061 / 27311-31
Fax: 061 / 27311-39
Österreich:
Tel.: 01 / 5 85 54-30
Fax: 01 / 5 85 54-60
Smart Modular Technologies Specification ASY90147-1,2&3

Table of Contents
Item Page
1. Revision Record…….……………………………………………………………………………….2
2. Reference……….…………………………………………………………………………………....2
3. Scope…….………………………………………………………………………………………..….2
4. General Features and Chipset Description.……..………………………………………………...2
5. Mechanic Drawing..………………………………………………………………………………...4
6. Interface Definitions..……….………..……………………………………………………….…....4
7. General Specifications..….……………….….………………………………………………….….6
8. Block Diagram……..……………………………………………………………………………….7
9. Electrical Characteristics………….……………………………………………………………….8
10. UART Interface…………………….…….………………………………………………………..11
11. USB Interface…………………….…….…………………………………………………………..11
12. PCM Interface……………………………………………………………………………………...11
13. Parallel Input Output (PIO) Port……………………………………………………….………...12
14. Key Features of HCI Stack..….…………….………………………………..……………………14
15. Qualification Test..………………………………………………………………………………...14
16. Agency and Regulatory Body Approvals………………………………………………………...15
17. Manufacture Procedure and Production Test…………………………………………………...15
18. Product Design and Related Documentations……………………………………….…………..16

1. Document Status
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Revision Date Comments

0.5 September 6, 2002 First draft
0.9 September 23, 2002 Modified Table 1.
0.92 October 11, 2002 Modified Table 1, mechanical drawing, HCI
stack features and reflow chart.
0.94 December 6, 2002 Modified Table 1 and mechanical drawing.
1.0 December 10, 2002 First formal release version.
1.1 July, 31, 2003 Minor modifications to reflect address
changes and deletion of information, and the
three different modules –1, -2,and -3
To make a request for change, correction, additions or information on references, please
contact:

Product Management
Communication Products Division
Smart Modular Technologies,
4211 Starboard Drive
Fremont, CA 94538.USA
+1 (510)-623-1231

2. Reference
[1] Specification of the Bluetooth System, Version 1.1, February 22, 2001.
[2} BC02-SM-003Pa, “HCIStack1.1v16.3 Software Release Note”, Novemb er 2002.

3. Scope
The intention of this specification is to provide a general guideline on the integration of
a Bluetooth Mini module. The product specification complies with Bluetooth
Specification 1.1 [1].

4. Module General Features and Chipset Description

4.1 Module General Features
The Smart Modular Technologies’ Bluetooth Mini module is based on a single chip
design. The module can be configured as USB or UART. It is a complete Bluetooth
system. The module is offered in three versions:

1. 90147-1: USB configuration up to the HCI level

2. 90147-2: UART configuration up to the HCI level
3. 90147-3: UART configuration with SPP profile preloaded

The module has the following general main features:

• Small footprint 52-pin BGA package with 0.8mm ball and1.27mm pitch (14.43mm x
21.47mm x 3.0mm).
• Highly integrated small, thin module built with high-density mounting technology.
• Class II device.
• On board pin out for direct 50Ω RF trace connection.
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• Fully compliant with Bluetooth specification v1.1.

• Full speed HCI UART.
• USB v1.1 compliant and USB2.0 compatible.
• Pulse Code Modulation (PCM) interface.
• Programmable Parallel Input Output (PIO) ports.
• Serial Peripheral Interface (SPI).
• Low power 1.8V operation.
• Full speed Bluetooth T M operation.
• Full speed USB interface supports OHCI and UHCI host interface.
• Full piconet support.
• 8Mbit external flash.
• Very low power consumption in active and standby modes.
• Support for low power sleep modes.
• Firmware upgradeable via UART, USB or SPI interface.
• RF Shielding Can.
• Conforms to FCC Part 15, ICAN RSS-210, ETSI, ARIB ST-T66, CE and (per
customers request for other countries’ EMI standards).
• Temperature range: -20°C to +95°C.

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Ø
5. Mechanical Drawing:

Figure 1. Mechanical drawing of Bluetooth Mini module.

6. Interface Definitions:

Table 1. Bluetooth Mini module interface definitions

Pin# Name Type Note

A2 GND GND Ground
A8 VIN_3.3V I 3.3V input
A9 VIN_3.3V I 3.3V input
B1 N/C No Connection
B2 N/C No Connection
B8 GND GND Ground
B9 GND GND Ground
C1 PCM_IN I PCM synchronous data input
C2 N/C No Connection
C8 N/C No Connection
C9 N/C No Connection
D1 PCM_OUT O PCM synchronous data output
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D2 PCM_SYNC I/O PCM synchronous data SYNC

D8 PIO[10] I/O Programmable I/O terminal
D9 PIO[2] I/O USB_PULL_UP
E1 PCM_CLK I/O PCM synchronous data clock
E2 RXD I UART data input active high
E8 PIO[5] I USB_DETACH
E9 PIO[11] I/O Programmable I/O terminal
F1 CTS I UART clear to send active low
F2 TXD O UART data output active high
F8 PIO[9] I/O Programmable I/O terminal
F9 PIO[8] I/O Programmable I/O terminal
G1 SPI_MOSI I Serial Peripheral interface data input
G2 RTS O UART request to send active low
G8 PIO[7] I/O Programmable I/O terminal
G9 PIO[6] I/O CLK_REQ
H1 USB D+ I/O USB data plus
H2 SPI_CLK I Serial Peripheral interface clock
H8 PIO[1] I/O Control output for external PA Class I
application only
H9 RST I Hardware reset, 3.3V±10% for > 5ms
J1 USB D- I/O USB data minus
J2 SPI_CSB I Select for Synchronous Serial Interface
active low
J8 NC No Connection
J9 NC No Connection
K1 SPI_MISO O Serial Peripheral interface data output
K2 PIO[0] I/O Control output for external LNA (if fitted)
K8 N/C No Connection
K9 N/C No Connection
Pin# Name Type Note
L1 PIO[4] I/O USB_ON
L2 N/C No Connection
L8 N/C No connection
L9 N/C No connection
M1 PIO[3] I/O USB_WAKE_UP
M2 N/C No connection
M8 N/C No connection
M9 N/C No connection
N1 ANT RF I/O 50 Ω RX/TX connection to antenna
N2 GND GND Ground
N3 N/C No connection
N8 GND GND Ground
N9 GND GND Ground

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7. General Specifications

Table 2. General Specifications

Item SPECIFICATION
Carrier Frequency 2400MHz to 2483.5MHz
Modulation GFSK, 1Mbps, 0.5BT Gaussian
Channel Intervals 1MHz
Number of Channels 79
Frequency Hopping 1600 hops/sec, 1MHz channel space
Receive Sensitivity -82 dBm typ. @0.1% BER
Transmission Power +4dBm max.
Maximum Data Throughput Asynchronous : 721kbps/57.6kbps
Synchronous : 432.6kbps/432.6kbps
Output Interface Full speed UART (921.6kbps), USB
(12Mbits/s), PCM, SPI and PIO.
Reset Hardware and Software
Power Supply 3.3V±10%
Operating Voltage 1.8V for the BT chip
Operating Temperature Range -20°C to 95°C
Storage Temperature Range -40°C to 150°C
Dimensions 14.43 mm x 21.47mm x 3.0mm
Antenna Interface Direct 50 Ω RF trace contact

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8. Bluetooth Mini Module Block Diagram

UART_TX
UART_RX
To RF Crystal Memory UART UART_RTS
Output Pin Mapped
RAM UART_CTS
Control/
Status PCM_IN
Clock
BPF Generator PCM_OUT
PCM PCM_SYNC
PCM_CLK
SPI_CLK
SPI SPI_MISO
RF SPI_MOSI
Receiver Baseband and Logic SPI_CSB
Balun

Memory Management USB USB_D+

RF USB_D-
Transmitter Memory
Driver

PIO[0]/RXEN
PIO[1]/TXEN
RF Synthesizer 4 or 8Mbit PIO[2]/USB_PULL_UP
Flash Memory PIO[3]/USB_WAKE_UP
RISC PIO[4]/USB_ON
Mico-Controller
REG PIO[5]/USB_DETACH
Programmable
PIO[6]/CLK_REQ
I/O
PIO[7]/Programmable I/O
PIO[8]/Programmable I/O
PIO[9]/Programmable I/O
PIO[10]/Programmable I/O
3.3V PIO[11]/Programmable I/O

Figure 2. Bluetooth Mini Module Block Diagram

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9. Electrical Characteristics
Absolute maximum Ratings
• Storage Temperature ---------- -40°C to 150°C (ambient)
• Supply Voltage ---------------- -0.4V to 3.6V (MAX)

Operating Conditions
• Temperature Range ----------- -20°C< TA<95°C
• Supply Voltage Range --------- 3.3V±10%

Table 3. Radio Characteristics(Note: 3)

VDD = 1.8V Temperature = -20°C

Frequency Bluetooth
Receiver Min Typ Max Unit
(GHz) Specification
2.402 - -83 -80 dBm
Sensitivity at 0.1% BER 2.441 - -85 -80 ≤-70 dBm
2.480 - -85 -80 dBm
Maximum received signal at 0.1% BER 0 - - ≥-20 dBm
Frequency Bluetooth
Transmitter Min Typ Max Unit
(GHz) Specification
2.402 0 3 4 dBm
RF transmit power 2.441 0 3 4 -6 to +4 dBm
2.480 0 3 4 dBm
RF power control range - 35 - ≥16 dB
RF power range control resolution - 1.8 - - dB
20 dB bandwidth for modulated carrier - 800 - 1000 KHz
Initial carrier frequency tolerance - ±25 - ≤ ±75 KHz
Drift - ±15 - ≤ ±25 KHz
Drift Rate - ±20 - 400 Hz/µs
∆f1avg "Maximum Modulation" - 165 - 140<∆f1avg <175 KHz
∆f2avg "Minimum Modulation" - 150 - 115 KHz

VDD = 1.8V Temperature = +20°C

Frequency Bluetooth
Receiver Min Typ Max Unit
(GHz) Specification
2.402 - -82 -80 dBm
Sensitivity at 0.1% BER 2.441 - -84 -80 ≤-70 dBm
2.480 - -84 -80 dBm

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Maximum received signal at 0.1% BER 0 - - ≥-20 dBm

Frequency Bluetooth
Transmitter Min Typ Max Unit
(GHz) Specification
2.402 0 2.5 4 dBm
RF transmit power 2.441 0 2.5 4 -6 to +4 dBm
2.480 0 2.5 4 dBm
RF power control range - 35 - ≥16 dB
RF power range control resolution - 1.8 - - dB
20 dB bandwidth for modulated carrier - 800 - 1000 kHz
Initial carrier frequency tolerance - ±25 - ≤ ±75 kHz
Drift - ±15 - ≤ ±25 kHz
Drift Rate - ±20 - 400 Hz/µs
∆f1avg "Maximum Modulation" - 165 - 140<∆f1avg <175 kHz
∆f2avg "Minimum Modulation" - 150 - 115 kHz
C/I co-channel - 10 11 ≤ 11 dB
Adjacent channel selectivity C/I f=f0 ± 1MHz - -4 0 ≤0 dB
Adjacent channel selectivity C/I f=f0 ± 2MHz - -35 -30 ≤ -30 dB
Adjacent channel selectivity C/I f ≥ f0 +3MHz - -45 - ≤ -40 dB
Adjacent channel selectivity C/I f ≤ f0 -3MHz - -45 - ≤ -40 dB
Adjacent channel selectivity C/I f=fimage - -18 -9 ≤ -9 dB
Adjacent channel Transmit power f=f0 ±2MHz - -35 -20 ≤ -20 dBc
Adjacent channel Transmit power f=f0 ±3MHz - -45 -40 ≤ -40 dBc

VDD = 1.8V Temperature = +95°C

Frequency Bluetooth
Receiver Min Typ Max Unit
(GHz) Specification
2.402 - -81 -80 dBm
Sensitivity at 0.1% BER 2.441 - -82 -80 ≤-70 dBm
2.480 - -82 -80 dBm
Maximum received signal at 0.1% BER 0 - - ≥-20 dBm
Frequency Bluetooth
Transmitter Min Typ Max Unit
(GHz) Specification
2.402 0 1 4 dBm
RF transmit power 2.441 0 1 4 -6 to +4 dBm
2.480 0 1 4 dBm
RF power control range - 35 - ≥16 dB

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RF power range control resolution - 1.8 - - dB

20 dB bandwidth for modulated carrier - 800 - 1000 kHz
Initial carrier frequency tolerance - ±25 - ≤ ±75 kHz
Drift - ±15 - ≤ ±25 kHz
Drift Rate - ±20 - 400 Hz/µs
∆f1avg "Maximum Modulation" - 165 - 140<∆f1avg <175 kHz
∆f2avg "Minimum Modulation" - 150 - 115 kHz
Note 1. Power at antenna port.
Note 2. Measured according to the Bluetooth specification v1.1 and Bluetooth RF test specification 0.91.
Note3. Some of the data is based on the Bluetooth chip, Module data may differs.

Table 4. Module Current Consumption

Average Current Consumption

VDD = 1.8V Temperature = +20°C
Mode Avg Peak Unit
SCO connection HV3 (40 ms interval Sniff Mode) (Slave) 26.0 - mA
SCO connection HV3 (40 ms interval Sniff Mode) (Master) 26.0 - mA
SCO connection HV1 (Slave) 53.0 - mA
SCO connection HV1 (Master) 53.0 - mA
ACL data transfer 115.2kbps UART (Master) 15.0 - mA
ACL connection, Sniff Mode 40ms interval, 38.4kpbs UART 4 - mA
ACL connection, Sniff Mode 1.28s interval, 38.4kpbs UART 8 - mA
Parked Slave, 1.28s beacon interval, 38.4kpbs UART .6 - mA
ACL data transfer 720kbps USB (Slave) 53.0 - mA
ACL data transfer 720kbps USB (Master) 53.0 - mA
Standby mode (Connected to host, no RF activity) 7 - mΑ
Peak Current Consumption
VDD = 1.8V Temperature = +20°C
Mode Typ Max Unit
Deep Sleep Mode 300 500 µA
Peak current during TX burst (+4 dBm) 70.0 80 mA
Peak current during TX burst (0dBm) 60.0 70 mA
Peak current during RX burst (-85 dBm) 50.0 70 mA
Notes: Current consumption is based on BC0212015A and includes current supplied to external 3V Flash.

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10. UART Interface

The Universal Asynchronous Receiver Transmitter (UART) interface provides a

mechanism for communicating with other serial devices using the RS232 standard. When
the module is connected to another digital device, UART_RX and UART_TX transfer data
between the two devices. The other two signals, UART_CTS and UART_RTS, can be used
to implement RS232 hardware flow control where both are active low indicators.

Table 5. Possible UART Settings

Parameter Possible Values

1200 Baud (≤2% Error)
Minimum
Baud Rate 9600 Baud (≤1% Error)
Maximum 1.5MBaud (≤1% Error)
Flow Control RTS/CTS or None
Parity None, Odd or Even
Number of Stop Bits 1 or 2
Bits per channel 8

11. USB Interface

The Universal Serial Bus (USB) interface on the module provides a full-speed
(12Mbits/s) data throughput, capable of driving a USB cable directly. No external USB
transceiver is required. The device operates as a USB peripheral, responding to requests
from a master host controller such as a PC. Both the OHCI and the UHCI standards are
supported. Only the USB slave operation is supported.

Table 6. USB Data Connections

USB Connections Function

D- “Differential” 0
D+ “Differential” 1

12. PCM

Pulse Code Modulation (PCM) is the standard method used to digitize human voice
patterns for transmission over digital communication channels. The module has hardware
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support for continual transmission and reception of PCM data, thus reducing processor
overhead for wireless headset applications. The module offers a bi-directional digital audio
interface routes directly into the baseband layer of the on-chip firmware. Up to three SCO
connections can be supported by the PCM interface at any one time.

The PCM interface can be configured as Master or Slave. When it operates as the
PCM interface Master, it generates an output clock of 128, 256 or 521kHz. When configured
as PCM interface Slave, it can operate with an input clock up to 2048kHz. It is compatible
with a variety of clock formats, including Long Frame Sync, Short Frame Sync and GCI
timing.

The module supports 13 or 16-bit linear, 8-bit µ-law or A- law sample formats at
8ksamples/s and can receive and transmit on any selection of the three of the first four slots
following PCM_SYNC.

The PCM interface on the module can interfaces directly to PCM audio devices
includes the following:
• Qualcomm MSM 3000 series and MSM 5000 series CDMA baseband
devices.
• OKI MSM7705 four-channel A- lay and µ- law CODEC.
• Motorola MC145481 8-bit A- law and µ- law CODEC.
• Motorola MC145483 13-bit linear CODEC.

13. The Parallel Input Output (PIO) Port

The PIO is a general-purpose I/O interface to the module. The module has ports with
twelve programmable, bi-directional I/O lines, PIO[11:0]. Programmable I/O lines can be
accessed either via an embedded application running on the module or via private channel or
manufacture-specific HCI commands. Six PIO ports, PIO[5:0], are implemented on the
module.

PIO[0]/RXEN
This is a multifunction terminal. Its function is selected by setting the Persistent Store Key
PSKEY_TX/RX_PIO_CONTROL (0x209). It can be used as a programmable I/O, however
it will normally be used to control the radio front-end receive switch.
PIO[1]/TXEN
This is a multifunction terminal. Its function is selected by setting the Persistent Store Key
PSKEY_TX/RX_PIO_CONTROL (0x209). It can be used as a programmable I/O, however
it will normally be used to control the radio front-end transmit switch.

PIO[2]/USB_PULL_UP
This is a multifunction terminal. For UART versions, it is a programmable I/O. On USB
versions, it can drive a pull- up resistor on USB_D+. For application using external RAM
this terminal may be programmed for chip select.

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PIO[3]/USB_WAKE_UP
This is a multifunction terminal. For UART versions, it is a programmable I/O. On USB
versions, its function is selected by setting the Persistent Store Key
PSKEY_USB_PIO_WAKEUP (0x2cf) either as a programmable I/O or as a
USB_WAKE_UP function.

PIO[4]/USN_ON
This is a multifunction terminal. For UART versions, it is a programmable I/O. On USB
versions, the USB_ON function is also selectable.

PIO[5]/USB_DETACH
This is a multifunction terminal. For UART versions, it is a programmable I/O. On USB
versions, the US B_DETACH function is also selectable.

PIO[6]/CLK_REQ
This is a multifunction terminal, its function is determined by Persistent Store Keys. Using
PSKEY_CLOCK_REQUEST_ENABLE (0x246), it can be configured to be low when the
module is in deep sleep and high when a clock is required. The clock must be supplied
within 4ms of the rising edge of PIO[6] to avoid losing timing accuracy in certain Bluetooth
operation modes.

PIO[7]
Programmable I/O terminal.

PIO[8]
Programmable I/O terminal.

PIO[9]
Programmable I/O terminal.

PIO[10]
Programmable I/O terminal.

PIO[11]
Programmable I/O terminal.

Note: USB functions can be software mapped to any PIO terminal, the present module support PIOs [0 - 5].

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14. Key Features of HCI Stack

• Bluetooth compone nts: Baseband (including LC), LM and HCI.

• Standard USB v1.1 and UART (H4) HCI Transport Layers.
• All standard radio packet types.
• Full Bluetooth data rate, up to 721kbps asymmetric.
• Operation with up to seven slaves.
• Maximum number of simultaneous active AC L connections: 7
• Maximum number of simultaneous active SCO connections: 3
• Operation with up to 3 SCO links, routed to one or more slaves.
• Role switch: can reverse Maser/Slave relationship.
• All standard SCO voice codings, plus “transparent SCO”.
• Standard operating modes: page, inquiry, page-scan and inquiry-scan.
• All standard pairing, authentication, link key and encryption operations.
• Standard Bluetooth power saving mechanisms: Hold, Sniff and Park modes,
including “Forced Hold”.
• Dynamic control of peers’ transmit power via LMP.
• Master/Slave switch.
• Broadcast.
• Channel quality driven data rate.
• All standard Bluetooth Test Modes.
• Standard firmware upgrade via UART interface.
• Standard firmware upgrade via USB interface.
• Provides manufacture-specific HCI extension commands with the following features:
Ø Access to the chip’s general-purpose PIO port.
Ø Access to the chip’s Bluetooth clock.
Ø The negotiated effective encryption length on established Bluetooth links.
Ø Access to the firmware’s random number generator.
Ø Controls to set the default and maximum transmit powers.
Ø Dynamic UART configuration.
Ø Radio transmitter enable/disable.
• A UART “break” condition can be used in two ways:
Ø Presenting a UART break condition on the module can force the chip to
perform a hardware reboot.
Ø Presenting a break condition at boot time can hold the chip in a low power
state, thus preventing normal initialization while the condition exists.
• Hardware low power modes: Shallow Sleep and Deep Sleep.
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• SCO channels are normally routed over HCI. Ho wever, up to three SCO channels
can be routed over the chip’s single PCM port (at the same time as routing other
SCO channels over HCI).

15. Qualification

15.1 Bluetooth Qualification Tests.

15.2 USB Qualification Tests.

16. Agency and Regulatory Body Approvals

16.1 Safety Compliance

• IEC 60 950:1999 (3rd Edition) “Safety of Information Technology” including
all CB scheme country deviations.
• EN 60950:2000 “Safety of Information Technology”, European Union.
• UL 60950:2000 (3rd Edition) “Safety of Information Technology”, USA,
Canada.

16.2 Electromagnetic Compatibility (EMC)

• FCC Part 15, Class B “Radio Frequency Devices”, USA.
• ICES-003, Issue 3 "Interference-causing equipment standard - digital
apparatus", Canada.
• EN 301 489-17:2000 “Electromagnetic Compatibility for Radio Equipment
and Services”, European Union.
• VCCI, “Interference By Information Technology Equipment”, Japan.

16.3 Radio Compliance

• FCC Part 15 “Radio Frequency Devices”, USA.
• ICAN RSS-210, Issue 5 “Low Power License-Exempt Radio
Communication Devices”, Canada.
• EN 300 328-2:2001 “Data Transmission Equipment Operating in 2.4GHz
ISM Band Using Spread Spectrum Modulation Technique”, European Union.
• ARIB STD- T66 “Second Generation Low Power Data Communication
System and Wireless LAN System”, ARIB STD-33, “Low Power data
Communication System of Wireless Equipment”, Japan.

16.4 CE Marking
• EN 60950:2000 “Safety of Information Technology”, European Union.
• EN 301 489-17:2000: “Electromagnetic Compatibility for Radio Equipment
and Services”, European Union.
• EN 300 328-2:2001 “Data Transmission Equipment Operating in 2.4GHz
ISM Band Using Spread Spectrum Modulation Technique”, European Union.

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17. Manufacture Procedure and Production Test

17.1 Manufacture Process Flow

• Process and X-ray
17.2 Manufacture Test
• F/T

18. Product Design and Related Documentations

• Hardware & SW Functional Test Reports

• Hardware Compatibility Test Report
• Hardware/SW performance Test Report
• Hardware EMI Test Report
• Hardware Reliability Test Report
• Hardware Environmental Test Report
• Product Specifications
• Chipsets Specifications
• Schematics
• BOM
• Layout
• Drawings
• PCB artwork
• SW Process Control / Release process document

HANTZ + PARTNER
The Upgrade Company! www.hantz.com
Deutschland:
Tel.: 0761 / 592100
Fax: 0761 / 585228
Schweiz:
Tel.: 061 / 27311-31
Fax: 061 / 27311-39
Österreich:
Tel.: 01 / 5 85 54-30
Fax: 01 / 5 85 54-60