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CC2642R
SWRS194G – JANUARY 2018 – REVISED APRIL 2020

CC2642R SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

1 Device Overview

1.1
1
Features
• Microcontroller • External system
– Powerful 48-MHz Arm® Cortex®-M4F processor – On-chip Buck DC/DC converter
– EEMBC CoreMark® score: 148 • Low power
– 352KB of in-system Programmable Flash – Wide supply voltage range: 1.8 V to 3.8 V
– 256KB of ROM for protocols and library – Active-Mode RX: 6.9 mA
functions – Active-Mode TX 0 dBm: 7.3 mA
– 8KB of Cache SRAM (Alternatively available as – Active-Mode TX 5 dBm: 9.6 mA
general-purpose RAM) – Active-Mode MCU 48 MHz (CoreMark):
– 80KB of ultra-low leakage SRAM. The SRAM is 3.4 mA (71 μA/MHz)
protected by parity to ensure high reliability of – Sensor Controller, Low Power-Mode, 2 MHz,
operation. running infinite loop: 30.1 μA
– 2-Pin cJTAG and JTAG debugging – Sensor Controller, Active-Mode, 24 MHz,
– Supports Over-the-Air upgrade (OTA) running infinite loop: 808 μA
• Ultra-low power sensor controller with 4KB of – Standby: 0.94 µA (RTC on, 80KB RAM and
SRAM CPU retention)
– Sample, store, and process sensor data – Shutdown: 150 nA (wakeup on external events)
– Operation independent from system CPU • Radio section
– Fast wake-up for low-power operation – 2.4 GHz RF transceiver compatible with
• TI-RTOS, drivers, Bootloader, Bluetooth® 5.1 Low Bluetooth 5.1 Low Energy and earlier LE
Energy Controller in ROM for optimized application specifications
size – Excellent receiver sensitivity:
• RoHS-compliant package -105 dBm for Bluetooth 125-kbps (LE Coded
– 7-mm × 7-mm RGZ VQFN48 (31 GPIOs) PHY)
• Peripherals -97 dBm for 1-Mbps PHY
– Digital peripherals can be routed to any GPIO – Output power up to +5 dBm with temperature
compensation
– 4× 32-bit or 8× 16-bit general-purpose timers
– Suitable for systems targeting compliance with
– 12-Bit ADC, 200 kSamples/s, 8 channels
worldwide radio frequency regulations
– 2× comparators with internal reference DAC
– EN 300 328, (Europe)
(1× continuous time, 1× ultra-low power)
– EN 300 440 Category 2
– Programmable current source
– FCC CFR47 Part 15
– 2× UART
– ARIB STD-T66 (Japan)
– 2× SSI (SPI, MICROWIRE, TI)
• Development Tools and Software
– I2C
– CC26x2R LaunchPad™ Development Kit
– I2S
– SimpleLink™ CC13x2 and CC26x2 Software
– Real-Time Clock (RTC)
Development Kit (SDK)
– AES 128- and 256-bit Crypto Accelerator
– SmartRF™ Studio for simple radio configuration
– ECC and RSA Public Key Hardware Accelerator
– Sensor Controller Studio for building low-power
– SHA2 Accelerator (Full suite up to SHA-512) sensing applications
– True Random Number Generator (TRNG)
– Capacitive sensing, up to 8 channels
– Integrated temperature and battery monitor

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
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1.2 Applications
• Mobile phones – battery pack for mobile phone • Communication equipment
• Medical – Wired networking – wireless LAN or Wi-Fi
• Building automation access points, edge router
– Building security systems – motion detector, • Personal electronics
electronic smart lock, door and window sensor, – Portable electronics – RF smart remote control
garage door system, gateway – Home theater & entertainment – smart
– HVAC – thermostat, wireless environmental speakers, smart display, set-top box
sensor, HVAC system controller, gateway – Connected peripherals – consumer wireless
– Fire safety system – smoke and heat detector, module, pointing devices, keyboards and
fire alarm control panel (FACP) keypads
– Video surveillance – IP network camera – Gaming – electronic and robotic toys
• Factory automation and control – Wearables (non-medical) – smart trackers,
• Electronic point of sale (EPOS) – RFID reader smart clothing
• Grid infrastructure
– Smart meters – water meter, gas meter,
electricity meter, and heat cost allocators
– Grid communications – wireless
communications – Long-range sensor
applications
– Other alternative energy – energy harvesting

1.3 Description
The SimpleLink™ CC2642R device is a 2.4 GHz wireless microcontroller (MCU) supporting Bluetooth® 5.1
Low Energy and Proprietary 2.4 GHz applications. The device is optimized for low-power wireless
communication and advanced sensing in building security systems, HVAC, asset tracking, medical, wired
networking, portable electronics, home theater & entertainment, and connected peripherals markets
markets, and applications where industrial performance is required. The highlighted features of this device
include:
• Support for Bluetooth® 5.1 features: LE Coded PHYs (Long Range), LE 2-Mbit PHY (High Speed),
Advertising Extensions, Multiple Advertisement Sets, CSA#2, as well as backwards compatibility and
support for key features from the Bluetooth® 4.2 and earlier Low Energy specifications.
• Fully-qualified Bluetooth® 5.1 software protocol stack included with the SimpleLink™ CC13x2 and
CC26x2 Software Development Kit (SDK).
• Longer battery life wireless applications with low standby current of 0.94 µA with full RAM retention.
• Industrial temperature ready with lowest standby current of 11 µA at 105 ⁰C.
• Advanced sensing with a programmable, autonomous ultra-low power Sensor Controller CPU with fast
wake-up capability. As an example, the sensor controller is capable of 1-Hz ADC sampling at 1 µA
system current.
• Low SER (Soft Error Rate) FIT (Failure-in-time) for long operation lifetime with no disruption for
industrial markets with always-on SRAM parity against corruption due to potential radiation events.
• Dedicated software controlled radio controller (Arm® Cortex®-M0) providing flexible low-power RF
transceiver capability to support multiple physical layers and RF standards, such as real-time
localization (RTLS) technologies.
• Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth® Low
Energy (-105 dBm for 125-kbps LE Coded PHY).

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The CC2642R device is part of the SimpleLink™ MCU platform, which consists of
Wi-Fi®, Bluetooth Low Energy, Thread, Zigbee, Sub-1 GHz MCUs, and host MCUs that all share a
common, easy-to-use development environment with a single core software development kit (SDK) and
rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of
the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements
change. For more information, visit SimpleLink™ MCU platform.

Device Information (1)

PART NUMBER PACKAGE BODY SIZE (NOM)
CC2642R1FRGZ VQFN (48) 7.00 mm × 7.00 mm
(1) For the most current part, package, and ordering information for all available devices, see the Package Option Addendum in Section 9,
or see the TI website.

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1.4 Functional Block Diagram

2.4 GHz
CC26x2R

RF Core
cJTAG

Main CPU

256KB ADC
ROM

ADC
Arm®
Cortex®-M4F
Processor Up to
352KB Digital PLL
Flash
with 8KB
DSP Modem
Cache

48 MHz
16KB
71 µA/MHz (3.0 V) Arm® SRAM
Up to Cortex®-M0
80KB Processor
SRAM ROM
with Parity

General Hardware Peripherals and Modules Sensor Interface

I2C and I2S 4× 32-bit Timers ULP Sensor Controller

2× UART 2× SSI (SPI) 8-bit DAC

32 ch. µDMA Watchdog Timer 12-bit ADC, 200 ks/s

31 GPIOs TRNG 2x Low-Power Comparator

Temperature and SPI-I2C Digital Sensor IF

AES-256, SHA2-512
Battery Monitor

ECC, RSA RTC Capacitive Touch IF

Time-to-Digital Converter

LDO, Clocks, and References

Optional DC/DC Converter 4KB SRAM

Figure 1-1. CC2642R Block Diagram

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Table of Contents
1 Device Overview ......................................... 1 6.1 Overview............................................ 43
1.1 Features .............................................. 1 6.2 System CPU ........................................ 43
1.2 Applications ........................................... 2 6.3 Radio (RF Core) ..................................... 44
1.3 Description ............................................ 2 6.4 Memory .............................................. 45
1.4 Functional Block Diagram ............................ 4 6.5 Sensor Controller ................................... 46
2 Revision History ......................................... 5 6.6 Cryptography ........................................ 47
3 Device Comparison ..................................... 6 6.7 Timers ............................................... 48
4 Terminal Configuration and Functions .............. 7 6.8 Serial Peripherals and I/O........................... 49
4.1 Pin Diagram – RGZ Package (Top View) ............ 7 6.9 Battery and Temperature Monitor ................... 49
4.2 Signal Descriptions – RGZ Package ................. 8 6.10 µDMA ................................................ 49
4.3 Connections for Unused Pins and Modules .......... 9 6.11 Debug ............................................... 49
5 Specifications ........................................... 10 6.12 Power Management ................................. 50
5.1 Absolute Maximum Ratings ......................... 10 6.13 Clock Systems ...................................... 51
5.2 ESD Ratings........................................ 10 6.14 Network Processor .................................. 51
5.3 Recommended Operating Conditions ............... 10 7 Application, Implementation, and Layout ......... 52
5.4 Power Supply and Modules ......................... 10 7.1 Reference Designs .................................. 52
5.5 Power Consumption - Power Modes ............... 11 7.2 Junction Temperature Calculation .................. 53
5.6 Power Consumption - Radio Modes ............... 12 8 Device and Documentation Support ............... 54
5.7 Nonvolatile (Flash) Memory Characteristics ........ 12 8.1 Tools and Software .................................. 54
5.8 Thermal Resistance Characteristics ................ 13 8.2 Documentation Support ............................. 56
5.9 RF Frequency Bands ............................... 13 8.3 Support Resources .................................. 57
5.10 Bluetooth Low Energy - Receive (RX) .............. 14 8.4 Trademarks.......................................... 57
5.11 Bluetooth Low Energy - Transmit (TX) .............. 17 8.5 Electrostatic Discharge Caution ..................... 57
5.12 Timing and Switching Characteristics ............... 18 8.6 Glossary ............................................. 57
5.13 Peripheral Characteristics ........................... 22 9 Mechanical, Packaging, and Orderable
5.14 Typical Characteristics .............................. 30 Information .............................................. 57
6 Detailed Description ................................... 43 9.1 Packaging Information .............................. 57

2 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision F (September 2019) to Revision G Page

• Changed Sensor Controller, Low Power-Mode current value in Section 1.1 ................................................. 1
• Added Communication equipment to Section 1.2 ................................................................................ 2
• Added Personal electronics to Section 1.2 ........................................................................................ 2
• Changed Section 1.3 ................................................................................................................. 2
• Added CC2642R-Q1 to Table 3-1 .................................................................................................. 6
• Added RF Frequency Bands in Section 5........................................................................................ 13
• Changed TEST CONDITIONS for 2Mbps Intermodulation in Bluetooth Low Energy - Receive (RX) table in
Section 5.10 .......................................................................................................................... 14
• Changed Motional inductance TYP value in 48 MHz Crystal Oscillator (XOSC_HF) table in Section 5.12.1 .......... 19
• Deleted Figure 5-6. Standby Mode (MCU) Current vs. Temperature (VDDS = 3.6 V). Subsequent figures
renumbered in Section 5.14. ....................................................................................................... 31

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3 Device Comparison

Table 3-1. Device Family Overview

FLASH RAM
DEVICE RADIO SUPPORT GPIO PACKAGE SIZE
(KB) (KB)
CC1312R Sub-1 GHz 352 80 30 RGZ (7-mm × 7-mm VQFN48)
Multiprotocol
Sub-1 GHz
Bluetooth 5.1 Low Energy
CC1352P Zigbee 352 80 26 RGZ (7-mm × 7-mm VQFN48)
Thread
2.4 GHz proprietary FSK-based formats
+20-dBm high-power amplifier
Multiprotocol
Sub-1 GHz
Bluetooth 5.1 Low Energy
CC1352R 352 80 28 RGZ (7-mm × 7-mm VQFN48)
Zigbee
Thread
2.4 GHz proprietary FSK-based formats
Bluetooth 5.1 Low Energy
CC2642R 352 80 31 RGZ (7-mm × 7-mm VQFN48)
2.4 GHz proprietary FSK-based formats
CC2642R-Q1 Bluetooth 5.1 Low Energy 352 80 31 RTC (7-mm × 7-mm VQFN48)
Multiprotocol
Bluetooth 5.1 Low Energy
CC2652R Zigbee 352 80 31 RGZ (7-mm × 7-mm VQFN48)
Thread
2.4 GHz proprietary FSK-based formats
Multiprotocol
Bluetooth 5.1 Low Energy
CC2652RB Zigbee 352 80 31 RGZ (7-mm × 7-mm VQFN48)
Thread
2.4 GHz proprietary FSK-based formats
Multiprotocol
Bluetooth 5.1 Low Energy
Zigbee
CC2652P 352 80 26 RGZ (7-mm × 7-mm VQFN48)
Thread
2.4 GHz proprietary FSK-based formats
+19.5-dBm high-power amplifier
RGZ (7-mm × 7-mm VQFN48)
CC1310 Sub-1 GHz 32–128 16–20 10–31 RHB (5-mm × 5-mm VQFN32)
RSM (4-mm × 4-mm VQFN32)
RGZ (7-mm × 7-mm VQFN48)
Sub-1 GHz
CC1350 128 20 10–31 RHB (5-mm × 5-mm VQFN32)
Bluetooth 4.2 Low Energy
RSM (4-mm × 4-mm VQFN32)
RGZ (7-mm × 7-mm VQFN48)
Bluetooth 5.1 Low Energy RHB (5-mm × 5-mm VQFN32)
CC2640R2F 128 20 10–31
2.4 GHz proprietary FSK-based formats RSM (4-mm × 4-mm VQFN32)
YFV (2.7-mm × 2.7-mm DSBGA34)
Bluetooth 5.1 Low Energy
CC2640R2F-Q1 128 20 31 RGZ (7-mm × 7-mm VQFN48)
2.4 GHz proprietary FSK-based formats

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4 Terminal Configuration and Functions

4.1 Pin Diagram – RGZ Package (Top View)

48 VDDR_RF

46 X48M_N
47 X48M_P

43 DIO_30
42 DIO_29
41 DIO_28
40 DIO_27
39 DIO_26
38 DIO_25
37 DIO_24
45 VDDR
44 VDDS
RF_P 1 36 DIO_23
RF_N 2 35 RESET_N
X32K_Q1 3 34 VDDS_DCDC
X32K_Q2 4 33 DCDC_SW
DIO_0 5 32 DIO_22
DIO_1 6 31 DIO_21
DIO_2 7 30 DIO_20
DIO_3 8 29 DIO_19
DIO_4 9 28 DIO_18
DIO_5 10 27 DIO_17
DIO_6 11 26 DIO_16
DIO_7 12 25 JTAG_TCKC
VDDS2 13
DIO_8 14
DIO_9 15
DIO_10 16
DIO_11 17
DIO_12 18
DIO_13 19
DIO_14 20
DIO_15 21
VDDS3 22
DCOUPL 23
JTAG_TMSC 24

Figure 4-1. RGZ (7-mm × 7-mm) Pinout, 0.5-mm Pitch (Top View)

The following I/O pins marked in Figure 4-1 in bold have high-drive capabilities:
• Pin 10, DIO_5
• Pin 11, DIO_6
• Pin 12, DIO_7
• Pin 24, JTAG_TMSC
• Pin 26, DIO_16
• Pin 27, DIO_17
The following I/O pins marked in Figure 4-1 in italics have analog capabilities:
• Pin 36, DIO_23
• Pin 37, DIO_24
• Pin 38, DIO_25
• Pin 39, DIO_26
• Pin 40, DIO_27
• Pin 41, DIO_28
• Pin 42, DIO_29
• Pin 43, DIO_30

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4.2 Signal Descriptions – RGZ Package

Table 4-1. Signal Descriptions – RGZ Package

PIN
I/O TYPE DESCRIPTION
NAME NO.
DCDC_SW 33 — Power Output from internal DC/DC converter (1)
(2)
DCOUPL 23 — Power For decoupling of internal 1.27 V regulated digital-supply
DIO_0 5 I/O Digital GPIO
DIO_1 6 I/O Digital GPIO
DIO_2 7 I/O Digital GPIO
DIO_3 8 I/O Digital GPIO
DIO_4 9 I/O Digital GPIO
DIO_5 10 I/O Digital GPIO, high-drive capability
DIO_6 11 I/O Digital GPIO, high-drive capability
DIO_7 12 I/O Digital GPIO, high-drive capability
DIO_8 14 I/O Digital GPIO
DIO_9 15 I/O Digital GPIO
DIO_10 16 I/O Digital GPIO
DIO_11 17 I/O Digital GPIO
DIO_12 18 I/O Digital GPIO
DIO_13 19 I/O Digital GPIO
DIO_14 20 I/O Digital GPIO
DIO_15 21 I/O Digital GPIO
DIO_16 26 I/O Digital GPIO, JTAG_TDO, high-drive capability
DIO_17 27 I/O Digital GPIO, JTAG_TDI, high-drive capability
DIO_18 28 I/O Digital GPIO
DIO_19 29 I/O Digital GPIO
DIO_20 30 I/O Digital GPIO
DIO_21 31 I/O Digital GPIO
DIO_22 32 I/O Digital GPIO
DIO_23 36 I/O Digital or Analog GPIO, analog capability
DIO_24 37 I/O Digital or Analog GPIO, analog capability
DIO_25 38 I/O Digital or Analog GPIO, analog capability
DIO_26 39 I/O Digital or Analog GPIO, analog capability
DIO_27 40 I/O Digital or Analog GPIO, analog capability
DIO_28 41 I/O Digital or Analog GPIO, analog capability
DIO_29 42 I/O Digital or Analog GPIO, analog capability
DIO_30 43 I/O Digital or Analog GPIO, analog capability
EGP — — GND Ground – exposed ground pad (3)
JTAG_TMSC 24 I/O Digital JTAG TMSC, high-drive capability
JTAG_TCKC 25 I Digital JTAG TCKC
RESET_N 35 I Digital Reset, active low. No internal pullup resistor
Positive RF input signal to LNA during RX
RF_P 1 — RF
Positive RF output signal from PA during TX
Negative RF input signal to LNA during RX
RF_N 2 — RF
Negative RF output signal from PA during TX

(1) For more details, see technical reference manual listed in Section 8.2.
(2) Do not supply external circuitry from this pin.
(3) EGP is the only ground connection for the device. Good electrical connection to device ground on printed circuit board (PCB) is
imperative for proper device operation.
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Table 4-1. Signal Descriptions – RGZ Package (continued)

PIN
I/O TYPE DESCRIPTION
NAME NO.
Internal supply, must be powered from the internal DC/DC
VDDR 45 — Power
converter or the internal LDO (4) (2) (5)
Internal supply, must be powered from the internal DC/DC
VDDR_RF 48 — Power
converter or the internal LDO (6) (2) (5)
VDDS 44 — Power 1.8-V to 3.8-V main chip supply (1)
VDDS2 13 — Power 1.8-V to 3.8-V DIO supply (1)
VDDS3 22 — Power 1.8-V to 3.8-V DIO supply (1)
VDDS_DCDC 34 — Power 1.8-V to 3.8-V DC/DC converter supply
X48M_N 46 — Analog 48-MHz crystal oscillator pin 1
X48M_P 47 — Analog 48-MHz crystal oscillator pin 2
X32K_Q1 3 — Analog 32-kHz crystal oscillator pin 1
X32K_Q2 4 — Analog 32-kHz crystal oscillator pin 2
(4) If internal DC/DC converter is not used, this pin is supplied internally from the main LDO.
(5) Output from internal DC/DC and LDO is trimmed to 1.68 V.
(6) If internal DC/DC converter is not used, this pin must be connected to VDDR for supply from the main LDO.

4.3 Connections for Unused Pins and Modules

Table 4-2. Connections for Unused Pins

ACCEPTABLE PREFERRED
FUNCTION SIGNAL NAME PIN NUMBER
PRACTICE (1) PRACTICE (1)
5–12
14–21
GPIO DIO_n NC or GND NC
26–32
36–43
X32K_Q1 3
32.768-kHz crystal NC or GND NC
X32K_Q2 4
DCDC_SW 33 NC NC
DC/DC converter (2)
VDDS_DCDC 34 VDDS VDDS
(1) NC = No connect
(2) When the DC/DC converter is not used, the inductor between DCDC_SW and VDDR can be removed. VDDR and VDDR_RF must still
be connected and the 22 uF DCDC capacitor must be kept on the VDDR net.

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5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1) (2)

MIN MAX UNIT

VDDS (3) Supply voltage –0.3 4.1 V
Voltage on any digital pin (4) –0.3 VDDS + 0.3, max 4.1 V
Voltage on crystal oscillator pins, X32K_Q1, X32K_Q2, X48M_N and X48M_P –0.3 VDDR + 0.3, max 2.25 V
Voltage scaling enabled –0.3 VDDS
Vin Voltage on ADC input Voltage scaling disabled, internal reference –0.3 1.49 V
Voltage scaling disabled, VDDS as reference –0.3 VDDS / 2.9
Input level, RF pins 5 dBm
Tstg Storage temperature –40 150 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to ground, unless otherwise noted.
(3) VDDS_DCDC, VDDS2 and VDDS3 must be at the same potential as VDDS.
(4) Including analog capable DIOs.

5.2 ESD Ratings

VALUE UNIT

Electrostatic Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) All pins ±2000 V
VESD
discharge Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002 (2) All pins ±500 V

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process

5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Operating junction temperature (1) –40 105 °C
Operating supply voltage (VDDS) 1.8 3.8 V
Rising supply voltage slew rate 0 100 mV/µs
Falling supply voltage slew rate (2) 0 20 mV/µs

(1) For thermal resistance characteristics refer to Section 5.8. For application considerations, refer to Section 7.2.
(2) For small coin-cell batteries, with high worst-case end-of-life equivalent source resistance, a 22-µF VDDS input capacitor must be used
to ensure compliance with this slew rate.

5.4 Power Supply and Modules

over operating free-air temperature range (unless otherwise noted)
PARAMETER TYP UNIT
VDDS Power-on-Reset (POR) threshold 1.1 - 1.55 V
(1)
VDDS Brown-out Detector (BOD) Rising threshold 1.77 V
(2)
VDDS Brown-out Detector (BOD), before initial boot Rising threshold 1.70 V
(1)
VDDS Brown-out Detector (BOD) Falling threshold 1.75 V

(1) For boost mode (VDDR =1.95 V), TI drivers software initialization will trim VDDS BOD limits to maximum (approximately 2.0 V)
(2) Brown-out Detector is trimmed at initial boot, value is kept until device is reset by a POR reset or the RESET_N pin

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5.5 Power Consumption - Power Modes

When measured on the CC26x2REM-7ID reference design with Tc = 25 °C, VDDS = 3.0 V with DC/DC enabled unless
otherwise noted.
PARAMETER TEST CONDITIONS TYP UNIT
Core Current Consumption
Reset. RESET_N pin asserted or VDDS below power-on-reset threshold 150
Reset and Shutdown nA
Shutdown. No clocks running, no retention 150
RTC running, CPU, 80KB RAM and (partial) register retention.
0.94 µA
Standby RCOSC_LF
without cache retention RTC running, CPU, 80KB RAM and (partial) register retention
1.09 µA
XOSC_LF

Icore RTC running, CPU, 80KB RAM and (partial) register retention.
3.2 µA
Standby RCOSC_LF
with cache retention RTC running, CPU, 80KB RAM and (partial) register retention.
3.3 µA
XOSC_LF
Supply Systems and RAM powered
Idle 675 µA
RCOSC_HF
MCU running CoreMark at 48 MHz
Active 3.39 mA
RCOSC_HF
Peripheral Current Consumption
Peripheral power
Delta current with domain enabled 97.7
domain
Serial power domain Delta current with domain enabled 7.2
Delta current with power domain enabled,
RF Core 210.9
clock enabled, RF core idle
µDMA Delta current with clock enabled, module is idle 63.9
Timers Delta current with clock enabled, module is idle (1) 81.0
Iperi I2C Delta current with clock enabled, module is idle 10.1 µA

I2S Delta current with clock enabled, module is idle 26.3

SSI Delta current with clock enabled, module is idle 82.9
UART Delta current with clock enabled, module is idle (2) 167.5
CRYPTO (AES) Delta current with clock enabled, module is idle (3) 25.6
PKA Delta current with clock enabled, module is idle 84.7
TRNG Delta current with clock enabled, module is idle 35.6
Sensor Controller Engine Consumption
Active mode 24 MHz, infinite loop 808.5
ISCE µA
Low-power mode 2 MHz, infinite loop 30.1

(1) Only one GPTimer running

(2) Only one UART running
(3) Only one SSI running

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5.6 Power Consumption - Radio Modes

When measured on the CC26x2REM-7ID reference design with Tc = 25 °C, VDDS = 3.0 V with DC/DC enabled unless
otherwise noted.
PARAMETER TEST CONDITIONS TYP UNIT
Radio receive current 2440 MHz 6.9 mA
0 dBm output power setting
7.3 mA
2440 MHz
Radio transmit current
+5 dBm output power setting
9.6 mA
2440 MHz

5.7 Nonvolatile (Flash) Memory Characteristics

Over operating free-air temperature range and VDDS = 3.0 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Flash sector size 8 KB
Supported flash erase cycles before failure, full bank (1) (2) 30 k Cycles
Supported flash erase cycles before failure, single sector (3) 60 k Cycles
Maximum number of write operations per row before sector Write
83
erase (4) Operations
Years at
Flash retention 105 °C 11.4
105 °C
Flash sector erase current Average delta current 10.7 mA
Flash sector erase time (5) 10 ms
Flash write current Average delta current, 4 bytes at a time 6.2 mA
Flash write time (5) 4 bytes at a time 21.6 µs

(1) A full bank erase is counted as a single erase cycle on each sector
(2) Aborting flash during erase or program modes is not a safe operation.
(3) Up to 4 customer-designated sectors can be individually erased an additional 30k times beyond the baseline bank limitation of 30k
cycles
(4) Each wordline is 2048 bits (or 256 bytes) wide. This limitation corresponds to sequential memory writes of 4 (3.1) bytes minimum per
write over a whole wordline. If additional writes to the same wordline are required, a sector erase is required once the maximum number
of write operations per row is reached.
(5) This number is dependent on Flash aging and increases over time and erase cycles

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5.8 Thermal Resistance Characteristics

PACKAGE
(1) RGZ
THERMAL METRIC UNIT
(VQFN)
48 PINS
RθJA Junction-to-ambient thermal resistance 23.4 °C/W (2)
RθJC(top) Junction-to-case (top) thermal resistance 13.3 °C/W (2)
RθJB Junction-to-board thermal resistance 8.0 °C/W (2)
ψJT Junction-to-top characterization parameter 0.1 °C/W (2)
ψJB Junction-to-board characterization parameter 7.9 °C/W (2)
RθJC(bot) Junction-to-case (bottom) thermal resistance 1.7 °C/W (2)

(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.
(2) °C/W = degrees Celsius per watt.

5.9 RF Frequency Bands

Over operating free-air temperature range (unless otherwise noted).
PARAMETER MIN TYP MAX UNIT
Frequency bands 2360 2500 MHz

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5.10 Bluetooth Low Energy - Receive (RX)

When measured on the CC26x2REM-7ID reference design with Tc = 25 °C, VDDS = 3.0 V, fRF = 2440 MHz with
DC/DC enabled unless otherwise noted. All measurements are performed at the antenna input with a combined RX and TX
path. All measurements are performed conducted.

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

125 kbps (LE Coded)
Receiver sensitivity Differential mode. BER = 10–3 –105 dBm
Receiver saturation –3 >5 dBm
Differential mode. BER = 10
Difference between the incoming carrier frequency and
Frequency error tolerance > (–300 / 300) kHz
the internally generated carrier frequency
Difference between incoming data rate and the internally
Data rate error tolerance > (–320 / 240) ppm
generated data rate (37-byte packets)
Difference between incoming data rate and the internally
Data rate error tolerance > (–125 / 125) ppm
generated data rate (255-byte packets)
Wanted signal at –79 dBm, modulated interferer in
Co-channel rejection (1) –1.5 dB
channel, BER = 10–3
Wanted signal at –79 dBm, modulated interferer at ±1
Selectivity, ±1 MHz (1) 8 / 4.5 (2) dB
MHz, BER = 10–3
Wanted signal at –79 dBm, modulated interferer at ±2
Selectivity, ±2 MHz (1) 44 / 39 (2) dB
MHz, BER = 10–3
Wanted signal at –79 dBm, modulated interferer at ±3
Selectivity, ±3 MHz (1) 46 / 44 (2) dB
MHz, BER = 10–3
Wanted signal at –79 dBm, modulated interferer at ±4
Selectivity, ±4 MHz (1) 44 / 46 (2) dB
MHz, BER = 10–3
Wanted signal at –79 dBm, modulated interferer at ≥ ±6
Selectivity, ±6 MHz (1) 48 / 44 (2) dB
MHz, BER = 10–3
Wanted signal at –79 dBm, modulated interferer at ≥ ±7
Selectivity, ±7 MHz 51 / 45 (2) dB
MHz, BER = 10–3
Wanted signal at –79 dBm, modulated interferer at image
Selectivity, Image frequency (1) 39 dB
frequency, BER = 10–3
Note that Image frequency + 1 MHz is the Co- channel –1
Selectivity, Image frequency ±1 (2)
MHz. Wanted signal at –79 dBm, modulated interferer at 4.5 / 44 dB
MHz (1)
±1 MHz from image frequency, BER = 10–3
500 kbps (LE Coded)
Receiver sensitivity Differential mode. BER = 10–3 –100 dBm
Receiver saturation Differential mode. BER = 10–3 >5 dBm
Difference between the incoming carrier frequency and
Frequency error tolerance > (–300 / 300) kHz
the internally generated carrier frequency
Difference between incoming data rate and the internally
Data rate error tolerance > (–450 / 450) ppm
generated data rate (37-byte packets)
Difference between incoming data rate and the internally
Data rate error tolerance > (–175 / 175) ppm
generated data rate (255-byte packets)
Wanted signal at –72 dBm, modulated interferer in
Co-channel rejection (1) –3.5 dB
channel, BER = 10–3
Wanted signal at –72 dBm, modulated interferer at ±1
Selectivity, ±1 MHz (1) 8 / 4 (2) dB
MHz, BER = 10–3
Wanted signal at –72 dBm, modulated interferer at ±2
Selectivity, ±2 MHz (1) 44 / 37 (2) dB
MHz, BER = 10–3
Wanted signal at –72 dBm, modulated interferer at ±3
Selectivity, ±3 MHz (1) 46 / 46 (2) dB
MHz, BER = 10–3
Wanted signal at –72 dBm, modulated interferer at ±4
Selectivity, ±4 MHz (1) 45 / 47 (2) dB
MHz, BER = 10–3
Wanted signal at –72 dBm, modulated interferer at ≥ ±6
Selectivity, ±6 MHz (1) 46 / 45 (2) dB
MHz, BER = 10–3
Wanted signal at –72 dBm, modulated interferer at ≥ ±7
Selectivity, ±7 MHz 49 / 45 (2) dB
MHz, BER = 10–3

(1) Numbers given as I/C dB

(2) X / Y, where X is +N MHz and Y is –N MHz
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Bluetooth Low Energy - Receive (RX) (continued)

When measured on the CC26x2REM-7ID reference design with Tc = 25 °C, VDDS = 3.0 V, fRF = 2440 MHz with
DC/DC enabled unless otherwise noted. All measurements are performed at the antenna input with a combined RX and TX
path. All measurements are performed conducted.

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

(1) Wanted signal at –72 dBm, modulated interferer at image
Selectivity, Image frequency 37 dB
frequency, BER = 10–3
Note that Image frequency + 1 MHz is the Co- channel –1
Selectivity, Image frequency ±1 MHz. Wanted signal at –72 dBm, modulated interferer at 4 / 46 (2) dB
MHz (1)
±1 MHz from image frequency, BER = 10–3
1 Mbps (LE 1M)
Receiver sensitivity Differential mode. BER = 10–3 –97 dBm
Receiver saturation Differential mode. BER = 10–3 >5 dBm
Difference between the incoming carrier frequency and
Frequency error tolerance > (–350 / 350) kHz
the internally generated carrier frequency
Difference between incoming data rate and the internally
Data rate error tolerance > (–750 / 750) ppm
generated data rate (37-byte packets)
Wanted signal at –67 dBm, modulated interferer in
Co-channel rejection (1) –6 dB
channel, BER = 10–3
Wanted signal at –67 dBm, modulated interferer at ±1
Selectivity, ±1 MHz (1) 7 / 4 (2) dB
MHz, BER = 10–3
Wanted signal at –67 dBm, modulated interferer at ±2
Selectivity, ±2 MHz (1) 40 / 33 (2) dB
MHz,BER = 10–3
Wanted signal at –67 dBm, modulated interferer at ±3
Selectivity, ±3 MHz (1) 36 / 41 (2) dB
MHz, BER = 10–3
Wanted signal at –67 dBm, modulated interferer at ±4
Selectivity, ±4 MHz (1) 36 / 45 (2) dB
MHz, BER = 10–3
Wanted signal at –67 dBm, modulated interferer at ≥ ±5
Selectivity, ±5 MHz or more (1) 40 dB
MHz, BER = 10–3
Wanted signal at –67 dBm, modulated interferer at image
Selectivity, image frequency (1) 33 dB
frequency, BER = 10–3
Note that Image frequency + 1 MHz is the Co- channel –1
Selectivity, image frequency MHz. Wanted signal at –67 dBm, modulated interferer at 4 / 41 (2) dB
±1 MHz (1)
±1 MHz from image frequency, BER = 10–3
Out-of-band blocking (3) 30 MHz to 2000 MHz –10 dBm
Out-of-band blocking 2003 MHz to 2399 MHz –18 dBm
Out-of-band blocking 2484 MHz to 2997 MHz –12 dBm
Out-of-band blocking 3000 MHz to 12.75 GHz –2 dBm
Wanted signal at 2402 MHz, –64 dBm. Two interferers at
Intermodulation 2405 and 2408 MHz respectively, at the given power –42 dBm
level
Spurious emissions,
Measurement in a 50-Ω single-ended load. < –59 dBm
30 to 1000 MHz (4)
Spurious emissions,
Measurement in a 50 Ω single-ended load. < –47 dBm
1 to 12.75 GHz (4)
RSSI dynamic range 70 dB
RSSI accuracy ±4 dB
2 Mbps (LE 2M)
Differential mode. Measured at SMA connector, BER =
Receiver sensitivity –92 dBm
10–3
Differential mode. Measured at SMA connector, BER =
Receiver saturation >5 dBm
10–3
Difference between the incoming carrier frequency and
Frequency error tolerance > (–500 / 500) kHz
the internally generated carrier frequency
Difference between incoming data rate and the internally
Data rate error tolerance > (–700 / 750) ppm
generated data rate (37-byte packets)

(3) Excluding one exception at Fwanted / 2, per Bluetooth Specification

(4) Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2
(Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan)
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Bluetooth Low Energy - Receive (RX) (continued)

When measured on the CC26x2REM-7ID reference design with Tc = 25 °C, VDDS = 3.0 V, fRF = 2440 MHz with
DC/DC enabled unless otherwise noted. All measurements are performed at the antenna input with a combined RX and TX
path. All measurements are performed conducted.

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

(1) Wanted signal at –67 dBm, modulated interferer in
Co-channel rejection –7 dB
channel,BER = 10–3
Wanted signal at –67 dBm, modulated interferer at ±2
Selectivity, ±2 MHz (1) 8 / 4 (2) dB
MHz, Image frequency is at –2 MHz, BER = 10–3
Wanted signal at –67 dBm, modulated interferer at ±4
Selectivity, ±4 MHz (1) 36 / 36 (2) dB
MHz, BER = 10–3
Wanted signal at –67 dBm, modulated interferer at ±6
Selectivity, ±6 MHz (1) 37 / 36 (2) dB
MHz, BER = 10–3
Wanted signal at –67 dBm, modulated interferer at image
Selectivity, image frequency (1) 4 dB
frequency, BER = 10–3
Note that Image frequency + 2 MHz is the Co-channel.
Selectivity, image frequency Wanted signal at –67 dBm, modulated interferer at ±2 –7 / 36 (2) dB
±2 MHz (1)
MHz from image frequency, BER = 10–3
Out-of-band blocking (3) 30 MHz to 2000 MHz –16 dBm
Out-of-band blocking 2003 MHz to 2399 MHz –21 dBm
Out-of-band blocking 2484 MHz to 2997 MHz –15 dBm
Out-of-band blocking 3000 MHz to 12.75 GHz –12 dBm
Wanted signal at 2402 MHz, –64 dBm. Two interferers at
Intermodulation 2408 and 2414 MHz respectively, at the given power –38 dBm
level

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5.11 Bluetooth Low Energy - Transmit (TX)

When measured on the CC26x2REM-7ID reference design with Tc = 25 °C, VDDS = 3.0 V, fRF = 2440 MHz with
DC/DC enabled unless otherwise noted. All measurements are performed at the antenna input with a combined RX and TX
path. All measurements are performed conducted.

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

General Parameters
Max output power Differential mode, delivered to a single-ended 50 Ω load through a balun 5 dBm
Output power
Differential mode, delivered to a single-ended 50 Ω load through a balun 26 dB
programmable range
Spurious emissions and harmonics
f < 1 GHz, outside restricted bands < –36 dBm
f < 1 GHz, restricted bands ETSI < –54 dBm
Spurious emissions (1)
f < 1 GHz, restricted bands FCC < –55 dBm
+5 dBm setting
f > 1 GHz, including harmonics < –42 dBm

(1)
Second harmonic < –42 dBm
Harmonics
Third harmonic < –42 dBm

(1) Suitable for systems targeting compliance with worldwide radio-frequency regulations ETSI EN 300 328 and EN 300 440 Class 2
(Europe), FCC CFR47 Part 15 (US), and ARIB STD-T66 (Japan).

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5.12 Timing and Switching Characteristics

Table 5-1. Reset Timing

PARAMETER MIN TYP MAX UNIT
RESET_N low duration 1 µs

Table 5-2. Wakeup Timing

Measured over operating free-air temperature with VDDS = 3.0 V (unless otherwise noted). The times listed here do not
include software overhead.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
MCU, Reset to Active (1) 850 - 3000 µs
MCU, Shutdown to Active (1) 850 - 3000 µs
MCU, Standby to Active 160 µs
MCU, Active to Standby 36 µs
MCU, Idle to Active 14 µs

(1) The wakeup time is dependent on remaining charge on VDDR capacitor when starting the device, and thus how long the device has
been in Reset or Shutdown before starting up again.

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5.12.1 Clock Specifications

Table 5-3. 48 MHz Crystal Oscillator (XOSC_HF)

Measured on a Texas Instruments reference design with Tc = 25 °C, VDDS = 3.0 V, unless otherwise noted. (1)
PARAMETER MIN TYP MAX UNIT
Crystal frequency 48 MHz
Equivalent series resistance
ESR 20 60 Ω
6 pF < CL ≤ 9 pF
Equivalent series resistance
ESR 80 Ω
5 pF < CL ≤ 6 pF
Motional inductance, relates to the load capacitance that is used for the crystal (CL
LM < 3 × 10–25 / CL2 H
in Farads) (2)
CL Crystal load capacitance (3) 5 7 (4) 9 pF
Start-up time (5) 200 µs

(1) Probing or otherwise stopping the crystal while the DC/DC converter is enabled may cause permanent damage to the device.
(2) The crystal manufacturer's specification must satisfy this requirement for proper operation.
(3) Adjustable load capacitance is integrated into the device.
(4) On-chip default connected capacitance including reference design parasitic capacitance. Connected internal capacitance is changed
through software in the Customer Configuration section (CCFG).
(5) Start-up time using the TI-provided power driver. Start-up time may increase if driver is not used.

Table 5-4. 48 MHz RC Oscillator (RCOSC_HF)

Measured on a Texas Instruments reference design with Tc = 25 °C, VDDS = 3.0 V, unless otherwise noted.
MIN TYP MAX UNIT
Frequency 48 MHz
Uncalibrated frequency accuracy ±1 %
(1)
Calibrated frequency accuracy ±0.25 %
Start-up time 5 µs

(1) Accuracy relative to the calibration source (XOSC_HF)

Table 5-5. 2 MHz RC Oscillator (RCOSC_MF)

Measured on a Texas Instruments reference design with Tc = 25 °C, VDDS = 3.0 V, unless otherwise noted.
MIN TYP MAX UNIT
Calibrated frequency 2 MHz
Start-up time 5 µs

Table 5-6. 32.768 kHz Crystal Oscillator (XOSC_LF)

Measured on a Texas Instruments reference design with Tc = 25 °C, VDDS = 3.0 V, unless otherwise noted.
MIN TYP MAX UNIT
Crystal frequency 32.768 kHz
ESR Equivalent series resistance 30 100 kΩ
CL Crystal load capacitance 6 7 (1) 12 pF

(1) Default load capacitance using TI reference designs including parasitic capacitance. Crystals with different load capacitance may be
used.

Table 5-7. 32 kHz RC Oscillator (RCOSC_LF)

Measured on a Texas Instruments reference design with Tc = 25 °C, VDDS = 3.0 V, unless otherwise noted.
MIN TYP MAX UNIT
(1)
Calibrated frequency 32.8 kHz
Temperature coefficient 50 ppm/°C

(1) When using RCOSC_LF as source for the low frequency system clock (SCLK_LF), the accuracy of the SCLK_LF-derived Real Time
Clock (RTC) can be improved by measuring RCOSC_LF relative to XOSC_HF and compensating for the RTC tick speed. This
functionality is available through the TI-provided Power driver.

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5.12.2 Synchronous Serial Interface (SSI) Characteristics

Table 5-8. Synchronous Serial Interface (SSI) Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER
PARAMETER MIN TYP MAX UNIT
NO.
(1)
S1 tclk_per SSIClk cycle time 12 65024 System Clocks
S2 (2) tclk_high SSIClk high time 0.5 tclk_per
S3 (2) tclk_low SSIClk low time 0.5 tclk_per

(1) When using the TI-provided Power driver, the SSI system clock is always 48 MHz.
(2) Refer to SSI timing diagrams Figure 5-1, Figure 5-2, and Figure 5-3.

S1
S2

SSIClk

S3

SSIFss

SSITx
MSB LSB
SSIRx
4 to 16 bits

Figure 5-1. SSI Timing for TI Frame Format (FRF = 01), Single Transfer Timing Measurement

S2 S1

SSIClk

S3

SSIFss

SSITx MSB LSB

8-bit control

SSIRx 0 MSB LSB

4 to 16 bits output data

Figure 5-2. SSI Timing for MICROWIRE Frame Format (FRF = 10), Single Transfer

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S1

S2

SSIClk
(SPO = 0)

S3

SSIClk
(SPO = 1)

SSITx
(Master) MSB LSB

SSIRx
(Slave) MSB LSB

SSIFss

Figure 5-3. SSI Timing for SPI Frame Format (FRF = 00), With SPH = 1

5.12.3 UART

Table 5-9. UART Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER MIN TYP MAX UNIT
UART rate 3 MBaud

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5.13 Peripheral Characteristics

5.13.1 ADC

Table 5-10. Analog-to-Digital Converter (ADC) Characteristics

Tc = 25 °C, VDDS = 3.0 V and voltage scaling enabled, unless otherwise noted. (1)
Performance numbers require use of offset and gain adjustements in software by TI-provided ADC drivers.

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

Input voltage range 0 VDDS V
Resolution 12 Bits
Sample Rate 200 ksps
Offset Internal 4.3 V equivalent reference (2) –0.24 LSB
Gain error Internal 4.3 V equivalent reference (2) 7.14 LSB
DNL (3) Differential nonlinearity >–1 LSB
INL Integral nonlinearity ±4 LSB
Internal 4.3 V equivalent reference (2), 200 kSamples/s,
9.8
9.6 kHz input tone
(2)
Internal 4.3 V equivalent reference , 200 kSamples/s,
9.8
9.6 kHz input tone, DC/DC enabled
VDDS as reference, 200 kSamples/s, 9.6 kHz input tone 10.1
ENOB Effective number of bits Internal reference, voltage scaling disabled, Bits
11.1
32 samples average, 200 kSamples/s, 300 Hz input tone
Internal reference, voltage scaling disabled,
(4) 11.3
14-bit mode, 200 kSamples/s, 300 Hz input tone
Internal reference, voltage scaling disabled,
(4) 11.6
15-bit mode, 200 kSamples/s, 300 Hz input tone
Internal 4.3 V equivalent reference (2), 200 kSamples/s,
–65
9.6 kHz input tone
THD Total harmonic distortion VDDS as reference, 200 kSamples/s, 9.6 kHz input tone –70 Bits
Internal reference, voltage scaling disabled,
–72
32 samples average, 200 kSamples/s, 300 Hz input tone
Internal 4.3 V equivalent reference (2), 200 kSamples/s,
60
9.6 kHz input tone
Signal-to-noise
SINAD,
and VDDS as reference, 200 kSamples/s, 9.6 kHz input tone 63 dB
SNDR
distortion ratio
Internal reference, voltage scaling disabled,
68
32 samples average, 200 kSamples/s, 300 Hz input tone
(2)
Internal 4.3 V equivalent reference , 200 kSamples/s,
70
9.6 kHz input tone
SFDR Spurious-free dynamic range VDDS as reference, 200 kSamples/s, 9.6 kHz input tone 73 dB
Internal reference, voltage scaling disabled,
75
32 samples average, 200 kSamples/s, 300 Hz input tone
Conversion time Serial conversion, time-to-output, 24 MHz clock 50 Clock Cycles
Current consumption Internal 4.3 V equivalent reference (2) 0.42 mA
Current consumption VDDS as reference 0.6 mA
Equivalent fixed internal reference (input voltage scaling
enabled). For best accuracy, the ADC conversion should be
Reference voltage 4.3 (2) (5) V
initiated through the TI-RTOS API in order to include the
gain/offset compensation factors stored in FCFG1
Fixed internal reference (input voltage scaling disabled). For
best accuracy, the ADC conversion should be initiated through
the TI-RTOS API in order to include the gain/offset
Reference voltage 1.48 V
compensation factors stored in FCFG1. This value is derived
from the scaled value (4.3 V) as follows:
Vref = 4.3 V × 1408 / 4095
Reference voltage VDDS as reference, input voltage scaling enabled VDDS V

(1) Using IEEE Std 1241-2010 for terminology and test methods
(2) Input signal scaled down internally before conversion, as if voltage range was 0 to 4.3 V
(3) No missing codes
(4) ADC_output = Σ(4n samples ) >> n, n = desired extra bits
(5) Applied voltage must be within Absolute Maximum Ratings (see Section 5.1 ) at all times
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Table 5-10. Analog-to-Digital Converter (ADC) Characteristics (continued)

Tc = 25 °C, VDDS = 3.0 V and voltage scaling enabled, unless otherwise noted.(1)
Performance numbers require use of offset and gain adjustements in software by TI-provided ADC drivers.

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

VDDS /
Reference voltage VDDS as reference, input voltage scaling disabled V
2.82 (5)
200 kSamples/s, voltage scaling enabled. Capacitive input,
Input impedance Input impedance depends on sampling frequency and sampling >1 MΩ
time

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5.13.2 DAC

Table 5-11. Digital-to-Analog Converter (DAC) Characteristics

Tc = 25 °C, VDDS = 3.0 V, unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
General Parameters
Resolution 8 Bits
Any load, any VREF, pre-charge OFF, DAC charge-pump ON 1.8 3.8
External Load (1), any VREF, pre-charge OFF, DAC charge-
VDDS Supply voltage 2.0 3.8 V
pump OFF
Any load, VREF = DCOUPL, pre-charge ON 2.6 3.8
Buffer ON (recommended for external load) 16 250
FDAC Clock frequency kHz
Buffer OFF (internal load) 16 1000
VREF = VDDS, buffer OFF, internal load 13
Voltage output settling time 1 / FDAC
VREF = VDDS, buffer ON, external capacitive load = 20 pF (2) 13.8
External capacitive load 20 200 pF
External resistive load 10 MΩ
Short circuit current 400 µA
VDDS = 3.8 V, DAC charge-pump OFF 50.8
VDDS = 3.0 V, DAC charge-pump ON 51.7
VDDS = 3.0 V, DAC charge-pump OFF 53.2
Max output impedance Vref
ZMAX = VDDS, buffer ON, CLK VDDS = 2.0 V, DAC charge-pump ON 48.7 kΩ
250 kHz
VDDS = 2.0 V, DAC charge-pump OFF 70.2
VDDS = 1.8 V, DAC charge-pump ON 46.3
VDDS = 1.8 V, DAC charge-pump OFF 88.9
Internal Load - Continuous Time Comparator / Low Power Clocked Comparator
VREF = VDDS,
load = Continuous Time Comparator or Low Power Clocked
Differential nonlinearity ±1
Comparator
FDAC = 250 kHz
DNL LSB (3)
VREF = VDDS,
load = Continuous Time Comparator or Low Power Clocked
Differential nonlinearity ±1.2
Comparator
FDAC = 16 kHz
VREF = VDDS = 3.8 V ±0.64
VREF = VDDS = 3.0 V ±0.81
Offset error (4) VREF = VDDS = 1.8 V ±1.27
Load = Continuous Time LSB (3)
Comparator VREF = DCOUPL, pre-charge ON ±3.43
VREF = DCOUPL, pre-charge OFF ±2.88
VREF = ADCREF ±2.37
VREF = VDDS = 3.8 V ±0.78
VREF = VDDS = 3.0 V ±0.77
Offset error (4) VREF = VDDS = 1.8 V ±3.46
Load = Low Power Clocked LSB (3)
Comparator VREF = DCOUPL, pre-charge ON ±3.44
VREF = DCOUPL, pre-charge OFF ±4.70
VREF = ADCREF ±4.11
VREF = VDDS = 3.8 V ±1.53
VREF = VDDS = 3.0 V ±1.71
Max code output voltage
variation (4) VREF = VDDS = 1.8 V ±2.10
LSB (3)
Load = Continuous Time VREF = DCOUPL, pre-charge ON ±6.00
Comparator
VREF = DCOUPL, pre-charge OFF ±3.85
VREF = ADCREF ±5.84

(1) Keysight 34401A Multimeter

(2) A load > 20 pF will increases the settling time
(3) 1 LSB (VREF 3.8 V/3.0 V/1.8 V/DCOUPL/ADCREF) = 14.10 mV/11.13 mV/6.68 mV/4.67 mV/5.48 mV
(4) Includes comparator offset
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Table 5-11. Digital-to-Analog Converter (DAC) Characteristics (continued)

Tc = 25 °C, VDDS = 3.0 V, unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VREF = VDDS = 3.8 V ±2.92
VREF =VDDS = 3.0 V ±3.06
Max code output voltage
variation (4) VREF = VDDS = 1.8 V ±3.91
LSB (3)
Load = Low Power Clocked VREF = DCOUPL, pre-charge ON ±7.84
Comparator
VREF = DCOUPL, pre-charge OFF ±4.06
VREF = ADCREF ±6.94
VREF = VDDS = 3.8 V, code 1 0.03
VREF = VDDS = 3.8 V, code 255 3.62
VREF = VDDS = 3.0 V, code 1 0.02
VREF = VDDS = 3.0 V, code 255 2.86
VREF = VDDS = 1.8 V, code 1 0.01
Output voltage range (4) VREF = VDDS = 1.8 V, code 255 1.71
Load = Continuous Time V
Comparator VREF = DCOUPL, pre-charge OFF, code 1 0.01
VREF = DCOUPL, pre-charge OFF, code 255 1.21
VREF = DCOUPL, pre-charge ON, code 1 1.27
VREF = DCOUPL, pre-charge ON, code 255 2.46
VREF = ADCREF, code 1 0.01
VREF = ADCREF, code 255 1.41
VREF = VDDS = 3.8 V, code 1 0.03
VREF = VDDS = 3.8 V, code 255 3.61
VREF = VDDS = 3.0 V, code 1 0.02
VREF = VDDS = 3.0 V, code 255 2.85
VREF = VDDS = 1.8 V, code 1 0.01
Output voltage range (4) VREF = VDDS = 1.8 V, code 255 1.71
Load = Low Power Clocked V
Comparator VREF = DCOUPL, pre-charge OFF, code 1 0.01
VREF = DCOUPL, pre-charge OFF, code 255 1.21
VREF = DCOUPL, pre-charge ON, code 1 1.27
VREF = DCOUPL, pre-charge ON, code 255 2.46
VREF = ADCREF, code 1 0.01
VREF = ADCREF, code 255 1.41
External Load (Keysight 34401A Multimeter)
VREF = VDDS, FDAC = 250 kHz ±1
INL Integral nonlinearity VREF = DCOUPL, FDAC = 250 kHz ±1 LSB (3)
VREF = ADCREF, FDAC = 250 kHz ±1
DNL Differential nonlinearity VREF = VDDS, FDAC = 250 kHz ±1 LSB (3)
VREF = VDDS = 3.8 V ±0.20
VREF = VDDS = 3.0 V ±0.25
VREF = VDDS = 1.8 V ±0.45
Offset error LSB (3)
VREF = DCOUPL, pre-charge ON ±1.55
VREF = DCOUPL, pre-charge OFF ±1.30
VREF = ADCREF ±1.10
VREF = VDDS = 3.8 V ±0.60
VREF = VDDS = 3.0 V ±0.55

Max code output voltage VREF = VDDS = 1.8 V ±0.60

LSB (3)
variation VREF = DCOUPL, pre-charge ON ±3.45
VREF = DCOUPL, pre-charge OFF ±2.10
VREF = ADCREF ±1.90

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Table 5-11. Digital-to-Analog Converter (DAC) Characteristics (continued)

Tc = 25 °C, VDDS = 3.0 V, unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VREF = VDDS = 3.8 V, code 1 0.03
VREF = VDDS = 3.8 V, code 255 3.61
VREF = VDDS = 3.0 V, code 1 0.02
VREF = VDDS = 3.0 V, code 255 2.85
VREF = VDDS = 1.8 V, code 1 0.02
Output voltage range VREF = VDDS = 1.8 V, code 255 1.71
Load = Low Power Clocked V
Comparator VREF = DCOUPL, pre-charge OFF, code 1 0.02
VREF = DCOUPL, pre-charge OFF, code 255 1.20
VREF = DCOUPL, pre-charge ON, code 1 1.27
VREF = DCOUPL, pre-charge ON, code 255 2.46
VREF = ADCREF, code 1 0.02
VREF = ADCREF, code 255 1.42

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5.13.3 Temperature and Battery Monitor

Table 5-12. Temperature Sensor

Measured on a Texas Instruments reference design with Tc = 25 °C, VDDS = 3.0 V, unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Resolution 2 °C
Accuracy -40 °C to 0 °C ±4.0 °C
Accuracy 0 °C to 105 °C ±2.5 °C
Supply voltage coefficient (1) 3.6 °C/V

(1) The temperature sensor is automatically compensated for VDDS variation when using the TI-provided driver.

Table 5-13. Battery Monitor

Measured on a Texas Instruments reference design with Tc = 25 °C, unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Resolution 25 mV
Range 1.8 3.8 V
Integral nonlinearity (max) 23 mV
Accuracy VDDS = 3.0 V 22.5 mV
Offset error -32 mV
Gain error -1 %

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5.13.4 Comparators

Table 5-14. Low-Power Clocked Comparator

Tc = 25 °C, VDDS = 3.0 V, unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Input voltage range 0 VDDS V
Clock frequency SCLK_LF
Using internal DAC with VDDS as reference voltage,
Internal reference voltage (1) 0.024 - 2.865 V
DAC code = 0 - 255
Offset Measured at VDDS / 2, includes error from internal DAC ±5 mV
Clock
Decision time Step from –50 mV to 50 mV 1
Cycle

(1) The comparator can use an internal 8 bits DAC as its reference. The DAC output voltage range depends on the reference voltage
selected. See Table 5-11

Table 5-15. Continuous Time Comparator

Tc = 25°C, VDDS = 3.0 V, unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Input voltage range (1) 0 VDDS V
Offset Measured at VDDS / 2 ±5 mV
Decision time Step from –10 mV to 10 mV 0.78 µs
Current consumption Internal reference 8.6 µA

(1) The input voltages can be generated externally and connected throughout I/Os or an internal reference voltage can be generated using
the DAC

5.13.5 Current Source

Table 5-16. Programmable Current Source

Tc = 25 °C, VDDS = 3.0 V, unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Current source programmable output range (logarithmic
0.25 - 20 µA
range)
Resolution 0.25 µA

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5.13.6 GPIO

Table 5-17. GPIO DC Characteristics

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TA = 25 °C, VDDS = 1.8 V
GPIO VOH at 8 mA load IOCURR = 2, high-drive GPIOs only 1.56 V
GPIO VOL at 8 mA load IOCURR = 2, high-drive GPIOs only 0.24 V
GPIO VOH at 4 mA load IOCURR = 1 1.59 V
GPIO VOL at 4 mA load IOCURR = 1 0.21 V
GPIO pullup current Input mode, pullup enabled, Vpad = 0 V 73 µA
GPIO pulldown current Input mode, pulldown enabled, Vpad = VDDS 19 µA
GPIO low-to-high input transition, with hysteresis IH = 1, transition voltage for input read as 0 → 1 1.08 V
GPIO high-to-low input transition, with hysteresis IH = 1, transition voltage for input read as 1 → 0 0.73 V
IH = 1, difference between 0 → 1
GPIO input hysteresis 0.35 V
and 1 → 0 points
TA = 25 °C, VDDS = 3.0 V
GPIO VOH at 8 mA load IOCURR = 2, high-drive GPIOs only 2.59 V
GPIO VOL at 8 mA load IOCURR = 2, high-drive GPIOs only 0.42 V
GPIO VOH at 4 mA load IOCURR = 1 2.63 V
GPIO VOL at 4 mA load IOCURR = 1 0.40 V
TA = 25 °C, VDDS = 3.8 V
GPIO pullup current Input mode, pullup enabled, Vpad = 0 V 282 µA
GPIO pulldown current Input mode, pulldown enabled, Vpad = VDDS 110 µA
GPIO low-to-high input transition, with hysteresis IH = 1, transition voltage for input read as 0 → 1 1.97 V
GPIO high-to-low input transition, with hysteresis IH = 1, transition voltage for input read as 1 → 0 1.55 V
IH = 1, difference between 0 → 1
GPIO input hysteresis 0.42 V
and 1 → 0 points
TA = 25 °C
Lowest GPIO input voltage reliably interpreted as a
VIH 0.8*VDDS V
High
Highest GPIO input voltage reliably interpreted as a
VIL 0.2*VDDS V
Low

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5.14 Typical Characteristics

All measurements in this section are done with Tc = 25 °C and VDDS = 3.0 V, unless otherwise noted. See
Recommended Operating Conditions, Section 5.3, for device limits. Values exceeding these limits are for
reference only.

5.14.1 MCU Current

Active Current vs. VDDS

Running CoreMark, SCLK_HF = 48 MHz RCOSC
6

5.5

5
Current [mA]

4.5

3.5

2.5
1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 3.8
Voltage [V] D001

Figure 5-4. Active Mode (MCU) Current vs.

Supply Voltage (VDDS)

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Standby Current vs. Temperature

80 kB RAM Retention, no Cache Retention, RTC On
SCLK_LF = 32 kHz XOSC
12

10

8
Current [µA]

0
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100
Temperature [°C] D006

Figure 5-5. Standby Mode (MCU) Current vs.

Temperature

5.14.2 RX Current

RX Current vs. Temperature

BLE 1 Mbps, 2.44 GHz
8.5
8.4
8.3
8.2
8.1
8
7.9
7.8
Current [mA]

7.7
7.6
7.5
7.4
7.3
7.2
7.1
7
6.9
6.8
6.7
6.6
6.5
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100
Temperature [°C] D010

Figure 5-6. RX Current vs.

Temperature (BLE 1 Mbps, 2.44 GHz)

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RX Current vs. VDDS

BLE 1 Mbps, 2.44 GHz
11.5
11
10.5
10
9.5
Current [mA]

9
8.5
8
7.5
7
6.5
6
5.5
1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 3.8
Voltage [V] D013

Figure 5-7. RX Current vs.

Supply Voltage (VDDS) (BLE 1 Mbps, 2.44 GHz)

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5.14.3 TX Current

TX Current vs. Temperature

BLE 1 Mbps, 2.44 GHz, 0 dBm
9
8.85
8.7
8.55
8.4
8.25
8.1
7.95
Current [mA]

7.8
7.65
7.5
7.35
7.2
7.05
6.9
6.75
6.6
6.45
6.3
6.15
6
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100
Temperature [°C] D018

Figure 5-8. TX Current vs.

Temperature (BLE 1 Mbps, 2.44 GHz)

TX Current vs. VDDS

BLE 1 Mbps, 2.44 GHz, 0 dBm
12
11.5
11
10.5
10
9.5
Current [mA]

9
8.5
8
7.5
7
6.5
6
5.5
5
1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 3.8
Voltage [V] D024

Figure 5-9. TX Current vs.

Supply Voltage (VDDS) (BLE 1 Mbps, 2.44 GHz)

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Table 5-18 shows typical TX current and output power for different output power settings.

Table 5-18. Typical TX Current and Output Power

CC2642R at 2.4 GHz, VDDS = 3.0 V (Measured on CC2652REM-7ID)
txPower TX Power Setting (SmartRF Studio) Typical Output Power [dBm] Typical Current Consumption [mA]
0x7217 5 4.9 9.5
0x4E63 4 3.9 9.0
0x385D 3 2.8 8.6
0x3259 2 1.8 8.0
0x2856 1 0.9 7.6
0x2853 0 -0.3 7.3
0x12D6 -5 -4.9 6.2
0x0ACF -10 -9.4 5.6
0x06CA -15 -14.5 5.2
0x04C6 -20 -20.3 4.8

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5.14.4 RX Performance

Sensitivity vs. Frequency

BLE 1 Mbps, 2.44 GHz
-92

-93

-94

-95
Sensitivity [dBm]

-96

-97

-98

-99

-100

-101

-102
2.4 2.408 2.416 2.424 2.432 2.44 2.448 2.456 2.464 2.472 2.48
Frequency [GHz] D028

Figure 5-10. Sensitivity vs.

Frequency (BLE 1 Mbps, 2.44 GHz)

Sensitivity vs. Temperature

BLE 1 Mbps, 2.44 GHz
-92

-93

-94

-95
Sensitivity [dBm]

-96

-97

-98

-99

-100

-101

-102
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100
Temperature [°C] D031

Figure 5-11. Sensitivity vs.

Temperature (BLE 1 Mbps, 2.44 GHz)

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Sensitivity vs. VDDS

BLE 1 Mbps, 2.44 GHz
-92

-93

-94

-95
Sensitivity [dBm]

-96

-97

-98

-99

-100

-101

-102
1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 3.8
Voltage [V] D034

Figure 5-12. Sensitivity vs.

Supply Voltage (VDDS) (BLE 1 Mbps, 2.44 GHz)

Sensitivity vs. VDDS

BLE 1 Mbps, 2.44 GHz, DCDC Off
-92

-93

-94

-95
Sensitivity [dBm]

-96

-97

-98

-99

-100

-101

-102
1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 3.8
Voltage [V] D035

Figure 5-13. Sensitivity vs.

Supply Voltage (VDDS) (BLE 1 Mbps, 2.44 GHz, DCDC Off)

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5.14.5 TX Performance

Output Power vs. Temperature

BLE 1 Mbps, 2.44 GHz, 0 dBm
2
1.8
1.6
1.4
1.2
1
Output Power [dBm]

0.8
0.6
0.4
0.2
0
-0.2
-0.4
-0.6
-0.8
-1
-1.2
-1.4
-1.6
-1.8
-2
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100
Temperature [°C] D041

Figure 5-14. Output Power vs.

Temperature (BLE 1 Mbps, 2.44 GHz)

Output Power vs. Temperature

BLE 1 Mbps, 2.44 GHz, +5 dBm
7
6.8
6.6
6.4
6.2
6
Output Power [dBm]

5.8
5.6
5.4
5.2
5
4.8
4.6
4.4
4.2
4
3.8
3.6
3.4
3.2
3
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100
Temperature [°C] D042

Figure 5-15. Output Power vs.

Temperature (BLE 1 Mbps, 2.44 GHz, +5 dBm)

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Output Power vs. VDDS

BLE 1 Mbps, 2.44 GHz, 0 dBm
2
1.8
1.6
1.4
1.2
Output Power [dBm] 1
0.8
0.6
0.4
0.2
0
-0.2
-0.4
-0.6
-0.8
-1
-1.2
-1.4
-1.6
-1.8
-2
1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 3.8
Voltage [V] D046

Figure 5-16. Output Power vs.

Supply Voltage (VDDS) (BLE 1 Mbps, 2.44 GHz)

Output power vs. VDDS

BLE 1 Mbps, 2.44 GHz, +5 dBm
7
6.8
6.6
6.4
6.2
6
Output Power [dBm]

5.8
5.6
5.4
5.2
5
4.8
4.6
4.4
4.2
4
3.8
3.6
3.4
3.2
3
1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 3.8
Voltage [V] D048

Figure 5-17. Output Power vs.

Supply Voltage (VDDS) (BLE 1 Mbps, 2.44 GHz, +5 dBm)

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Output Power vs. Frequency

BLE 1 Mbps, 2.44 GHz, 0 dBm
2
1.8
1.6
1.4
1.2
Output Power [dBm] 1
0.8
0.6
0.4
0.2
0
-0.2
-0.4
-0.6
-0.8
-1
-1.2
-1.4
-1.6
-1.8
-2
2.4 2.408 2.416 2.424 2.432 2.44 2.448 2.456 2.464 2.472 2.48
Frequency [GHz] D058

Figure 5-18. Output Power vs.

Frequency (BLE 1 Mbps, 2.44 GHz)

Output Power vs. Frequency

BLE 1 Mbps, 2.44 GHz, +5 dBm
7
6.8
6.6
6.4
6.2
6
Output Power [dBm]

5.8
5.6
5.4
5.2
5
4.8
4.6
4.4
4.2
4
3.8
3.6
3.4
3.2
3
2.4 2.408 2.416 2.424 2.432 2.44 2.448 2.456 2.464 2.472 2.48
Frequency [GHz] D059

Figure 5-19. Output Power vs.

Frequency (BLE 1 Mbps, 2.44 GHz, +5 dBm)

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5.14.6 ADC Performance

ENOB vs. Input Frequency

11.4
Internal Reference, No Averaging
Internal Unscaled Reference, 14-bit Mode

11.1

10.8
ENOB [Bit]

10.5

10.2

9.9

9.6
0.2 0.3 0.5 0.7 1 2 3 4 5 6 7 8 10 20 30 40 50 70 100
Frequency [kHz] D061

Figure 5-20. ENOB vs.

Input Frequency

ENOB vs. Sampling Frequency

Vin = 3.0 V Sine wave, Internal reference,
Fin = Fs / 10
10.2

10.15

10.1

10.05
ENOB [Bit]

10

9.95

9.9

9.85

9.8
1 2 3 4 5 6 7 8 10 20 30 40 50 70 100 200
Frequency [kHz] D062

Figure 5-21. ENOB vs.

Sampling Frequency

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INL vs. ADC Code

Vin = 3.0 V Sine wave, Internal reference,
200 kSamples/s
1.5

0.5
INL [LSB]

-0.5

-1

-1.5
0 400 800 1200 1600 2000 2400 2800 3200 3600 4000
ADC Code D064

Figure 5-22. INL vs.

ADC Code

DNL vs. ADC Code

Vin = 3.0 V Sine wave, Internal reference,
200 kSamples/s
2.5

1.5
DNL [LSB]

0.5

-0.5
0 400 800 1200 1600 2000 2400 2800 3200 3600 4000
ADC Code D065

Figure 5-23. DNL vs.

ADC Code

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ADC Accuracy vs. Temperature

Vin = 1 V, Internal reference,
200 kSamples/s
1.01

1.009

1.008

1.007
Voltage [V]

1.006

1.005

1.004

1.003

1.002

1.001

1
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100
Temperature [°C] D066

Figure 5-24. ADC Accuracy vs.

Temperature

ADC Accuracy vs. VDDS

Vin = 1 V, Internal reference,
200 kSamples/s
1.01

1.009

1.008

1.007
Voltage [V]

1.006

1.005

1.004

1.003

1.002

1.001

1
1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 3.8
Voltage [V] D067

Figure 5-25. ADC Accuracy vs.

Supply Voltage (VDDS)

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6 Detailed Description
6.1 Overview
Section 1.4 shows the core modules of the CC2642R device.

6.2 System CPU

The CC2642R SimpleLink™ Wireless MCU contains an Arm® Cortex®-M4F system CPU, which runs the
application and the higher layers of radio protocol stacks.
The system CPU is the foundation of a high-performance, low-cost platform that meets the system
requirements of minimal memory implementation, and low-power consumption, while delivering
outstanding computational performance and exceptional system response to interrupts.
Its features include the following:
• ARMv7-M architecture optimized for small-footprint embedded applications
• Arm Thumb®-2 mixed 16- and 32-bit instruction set delivers the high performance expected of a 32-bit
Arm core in a compact memory size
• Fast code execution permits increased sleep mode time
• Deterministic, high-performance interrupt handling for time-critical applications
• Single-cycle multiply instruction and hardware divide
• Hardware division and fast digital-signal-processing oriented multiply accumulate
• Saturating arithmetic for signal processing
• IEEE 754-compliant single-precision Floating Point Unit (FPU)
• Memory Protection Unit (MPU) for safety-critical applications
• Full debug with data matching for watchpoint generation
– Data Watchpoint and Trace Unit (DWT)
– JTAG Debug Access Port (DAP)
– Flash Patch and Breakpoint Unit (FPB)
• Trace support reduces the number of pins required for debugging and tracing
– Instrumentation Trace Macrocell Unit (ITM)
– Trace Port Interface Unit (TPIU) with asynchronous serial wire output (SWO)
• Optimized for single-cycle flash memory access
• Tightly connected to 8-KB 4-way random replacement cache for minimal active power consumption
and wait states
• Ultra-low-power consumption with integrated sleep modes
• 48 MHz operation
• 1.25 DMIPS per MHz

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6.3 Radio (RF Core)

The RF Core is a highly flexible and future proof radio module which contains an Arm Cortex-M0
processor that interfaces the analog RF and base-band circuitry, handles data to and from the system
CPU side, and assembles the information bits in a given packet structure. The RF core offers a high level,
command-based API to the main CPU that configurations and data are passed through. The Arm Cortex-
M0 processor is not programmable by customers and is interfaced through the TI-provided RF driver that
is included with the SimpleLink Software Development Kit (SDK).
The RF core can autonomously handle the time-critical aspects of the radio protocols, thus offloading the
main CPU, which reduces power and leaves more resources for the user application. Several signals are
also available to control external circuitry such as RF switches or range extenders autonomously.
The various physical layer radio formats are partly built as a software defined radio where the radio
behavior is either defined by radio ROM contents or by non-ROM radio formats delivered in form of
firmware patches with the SimpleLink SDKs. This allows the radio platform to be updated for support of
future versions of standards even with over-the-air (OTA) updates while still using the same silicon.

6.3.1 Bluetooth 5.1 Low Energy

The RF Core offers full support for Bluetooth 5.1 Low Energy, including the high-sped 2-Mbps physical
layer and the 500-kbps and 125-kbps long range PHYs (Coded PHY) through the TI provided Bluetooth
5.1 stack or through a high-level Bluetooth API. The Bluetooth 5.1 PHY and part of the controller are in
radio and system ROM, providing significant savings in memory usage and more space available for
applications.
The new high-speed mode allows data transfers up to 2 Mbps, twice the speed of Bluetooth 4.2 and five
times the speed of Bluetooth 4.0, without increasing power consumption. In addition to faster speeds, this
mode offers significant improvements for energy efficiency and wireless coexistence with reduced radio
communication time.
Bluetooth 5.1 also enables unparalleled flexibility for adjustment of speed and range based on application
needs, which capitalizes on the high-speed or long-range modes respectively. Data transfers are now
possible at 2 Mbps, enabling development of applications using voice, audio, imaging, and data logging
that were not previously an option using Bluetooth low energy. With high-speed mode, existing
applications deliver faster responses, richer engagement, and longer battery life. Bluetooth 5.1 enables
fast, reliable firmware updates.

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6.4 Memory
The up to 352-KB nonvolatile (Flash) memory provides storage for code and data. The flash memory is in-
system programmable and erasable. The last flash memory sector must contain a Customer Configuration
section (CCFG) that is used by boot ROM and TI provided drivers to configure the device. This
configuration is done through the ccfg.c source file that is included in all TI provided examples.
The ultra-low leakage system static RAM (SRAM) is split into up to five 16-KB blocks and can be used for
both storage of data and execution of code. Retention of SRAM contents in Standby power mode is
enabled by default and included in Standby mode power consumption numbers. Parity checking for
detection of bit errors in memory is built-in, which reduces chip-level soft errors and thereby increases
reliability. System SRAM is always initialized to zeroes upon code execution from boot.
To improve code execution speed and lower power when executing code from nonvolatile memory, a 4-
way nonassociative 8-KB cache is enabled by default to cache and prefetch instructions read by the
system CPU. The cache can be used as a general-purpose RAM by enabling this feature in the Customer
Configuration Area (CCFG).
There is a 4-KB ultra-low leakage SRAM available for use with the Sensor Controller Engine which is
typically used for storing Sensor Controller programs, data and configuration parameters. This RAM is
also accessible by the system CPU. The Sensor Controller RAM is not cleared to zeroes between system
resets.
The ROM includes a TI-RTOS kernel and low-level drivers, as well as significant parts of selected radio
stacks, which frees up flash memory for the application. The ROM also contains a serial (SPI and UART)
bootloader that can be used for initial programming of the device.

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6.5 Sensor Controller

The Sensor Controller contains circuitry that can be selectively enabled in both Standby and Active power
modes. The peripherals in this domain can be controlled by the Sensor Controller Engine, which is a
proprietary power-optimized CPU. This CPU can read and monitor sensors or perform other tasks
autonomously; thereby significantly reducing power consumption and offloading the system CPU.
The Sensor Controller Engine is user programmable with a simple programming language that has syntax
similar to C. This programmability allows for sensor polling and other tasks to be specified as sequential
algorithms rather than static configuration of complex peripheral modules, timers, DMA, register
programmable state machines, or event routing.
The main advantages are:
• Flexibility - data can be read and processed in unlimited manners while still ensuring ultra-low power
• 2 MHz low-power mode enables lowest possible handling of digital sensors
• Dynamic reuse of hardware resources
• 40-bit accumulator supporting multiplication, addition and shift
• Observability and debugging options

Sensor Controller Studio is used to write, test, and debug code for the Sensor Controller. The tool
produces C driver source code, which the System CPU application uses to control and exchange data
with the Sensor Controller. Typical use cases may be (but are not limited to) the following:
• Read analog sensors using integrated ADC or comparators
• Interface digital sensors using GPIOs, SPI, UART, or I2C (UART and I2C are bit-banged)
• Capacitive sensing
• Waveform generation
• Very low-power pulse counting (flow metering)
• Key scan

The peripherals in the Sensor Controller include the following:

• The low-power clocked comparator can be used to wake the system CPU from any state in which the
comparator is active. A configurable internal reference DAC can be used in conjunction with the
comparator. The output of the comparator can also be used to trigger an interrupt or the ADC.
• Capacitive sensing functionality is implemented through the use of a constant current source, a time-
to-digital converter, and a comparator. The continuous time comparator in this block can also be used
as a higher-accuracy alternative to the low-power clocked comparator. The Sensor Controller takes
care of baseline tracking, hysteresis, filtering, and other related functions when these modules are
used for capacitive sensing.
• The ADC is a 12-bit, 200-ksamples/s ADC with eight inputs and a built-in voltage reference. The ADC
can be triggered by many different sources including timers, I/O pins, software, and comparators.
• The analog modules can connect to up to eight different GPIOs
• Dedicated SPI master with up to 6 MHz clock speed
The peripherals in the Sensor Controller can also be controlled from the main application processor.

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6.6 Cryptography
The CC2642R device comes with a wide set of modern cryptography-related hardware accelerators,
drastically reducing code footprint and execution time for cryptographic operations. It also has the benefit
of being lower power and improves availability and responsiveness of the system because the
cryptography operations runs in a background hardware thread.
Together with a large selection of open-source cryptography libraries provided with the Software
Development Kit (SDK), this allows for secure and future proof IoT applications to be easily built on top of
the platform. The hardware accelerator modules are:
• True Random Number Generator (TRNG) module provides a true, nondeterministic noise source for
the purpose of generating keys, initialization vectors (IVs), and other random number requirements.
The TRNG is built on 24 ring oscillators that create unpredictable output to feed a complex nonlinear-
combinatorial circuit.
• Secure Hash Algorithm 2 (SHA-2) with support for SHA224, SHA256, SHA384, and SHA512
• Advanced Encryption Standard (AES) with 128 and 256 bit key lengths
• Public Key Accelerator - Hardware accelerator supporting mathematical operations needed for elliptic
curves up to 512 bits and RSA key pair generation up to 1024 bits.
Through use of these modules and the TI provided cryptography drivers, the following capabilities are
available for an application or stack:
• Key Agreement Schemes
– Elliptic curve Diffie–Hellman with static or ephemeral keys (ECDH and ECDHE)
– Elliptic curve Password Authenticated Key Exchange by Juggling (ECJ-PAKE)
• Signature Generation
– Elliptic curve Diffie-Hellman Digital Signature Algorithm (ECDSA)
• Curve Support
– Short Weierstrass form (full hardware support), such as:
• NIST-P224, NIST-P256, NIST-P384, NIST-P521
• Brainpool-256R1, Brainpool-384R1, Brainpool-512R1
• secp256r1
– Montgomery form (hardware support for multiplication), such as:
• Curve25519
• SHA2 based MACs
– HMAC with SHA224, SHA256, SHA384, or SHA512
• Block cipher mode of operation
– AESCCM
– AESGCM
– AESECB
– AESCBC
– AESCBC-MAC
• True random number generation
Other capabilities, such as RSA encryption and signatures as well as Edwards type of elliptic curves such
as Curve1174 or Ed25519, can also be implemented using the provided hardware accelerators but are not
part of the TI SimpleLink SDK for the CC2642R device.

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6.7 Timers
A large selection of timers are available as part of the CC2642R device. These timers are:
• Real-Time Clock (RTC)
A 70-bit 3-channel timer running on the 32 kHz low frequency system clock (SCLK_LF)
This timer is available in all power modes except Shutdown. The timer can be calibrated to
compensate for frequency drift when using the LF RCOSC as the low frequency system clock. If an
external LF clock with frequency different from 32.768 kHz is used, the RTC tick speed can be
adjusted to compensate for this. When using TI-RTOS, the RTC is used as the base timer in the
operating system and should thus only be accessed through the kernel APIs such as the Clock
module. The real time clock can also be read by the Sensor Controller Engine to timestamp sensor
data and also has dedicated capture channels. By default, the RTC halts when a debugger halts the
device.
• General Purpose Timers (GPTIMER)
The four flexible GPTIMERs can be used as either 4× 32 bit timers or 8× 16 bit timers, all running on
up to 48 MHz. Each of the 16- or 32-bit timers support a wide range of features such as one-shot or
periodic counting, pulse width modulation (PWM), time counting between edges and edge counting.
The inputs and outputs of the timer are connected to the device event fabric, which allows the timers to
interact with signals such as GPIO inputs, other timers, DMA and ADC. The GPTIMERs are available
in Active and Idle power modes.
• Sensor Controller Timers
The Sensor Controller contains 3 timers:
AUX Timer 0 and 1 are 16-bit timers with a 2N prescaler. Timers can either increment on a clock or on
each edge of a selected tick source. Both one-shot and periodical timer modes are available.
AUX Timer 2 is a 16-bit timer that can operate at 24 MHz, 2 MHz or 32 kHz independent of the Sensor
Controller functionality. There are 4 capture or compare channels, which can be operated in one-shot
or periodical modes. The timer can be used to generate events for the Sensor Controller Engine or the
ADC, as well as for PWM output or waveform generation.
• Radio Timer
A multichannel 32-bit timer running at 4 MHz is available as part of the device radio. The radio timer is
typically used as the timing base in wireless network communication using the 32-bit timing word as
the network time. The radio timer is synchronized with the RTC by using a dedicated radio API when
the device radio is turned on or off. This ensures that for a network stack, the radio timer seems to
always be running when the radio is enabled. The radio timer is in most cases used indirectly through
the trigger time fields in the radio APIs and should only be used when running the accurate 48 MHz
high frequency crystal is the source of SCLK_HF.
• Watchdog timer
The watchdog timer is used to regain control if the system operates incorrectly due to software errors.
It is typically used to generate an interrupt to and reset of the device for the case where periodic
monitoring of the system components and tasks fails to verify proper functionality. The watchdog timer
runs on a 1.5 MHz clock rate and cannot be stopped once enabled. The watchdog timer pauses to run
in Standby power mode and when a debugger halts the device.

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6.8 Serial Peripherals and I/O

The SSIs are synchronous serial interfaces that are compatible with SPI, MICROWIRE, and TI's
synchronous serial interfaces. The SSIs support both SPI master and slave up to 4 MHz. The SSI
modules support configurable phase and polarity.
The UARTs implement universal asynchronous receiver and transmitter functions. They support flexible
baud-rate generation up to a maximum of 3 Mbps.
The I2S interface is used to handle digital audio and can also be used to interface pulse-density
modulation microphones (PDM).
The I2C interface is also used to communicate with devices compatible with the I2C standard. The I2C
interface can handle 100 kHz and 400 kHz operation, and can serve as both master and slave.
The I/O controller (IOC) controls the digital I/O pins and contains multiplexer circuitry to allow a set of
peripherals to be assigned to I/O pins in a flexible manner. All digital I/Os are interrupt and wake-up
capable, have a programmable pullup and pulldown function, and can generate an interrupt on a negative
or positive edge (configurable). When configured as an output, pins can function as either push-pull or
open-drain. Five GPIOs have high-drive capabilities, which are marked in bold in Section 4. All digital
peripherals can be connected to any digital pin on the device.
For more information, see the CC13x2, CC26x2 SimpleLink™ Wireless MCU Technical Reference
Manual.

6.9 Battery and Temperature Monitor

A combined temperature and battery voltage monitor is available in the CC2642R device. The battery and
temperature monitor allows an application to continuously monitor on-chip temperature and supply voltage
and respond to changes in environmental conditions as needed. The module contains window
comparators to interrupt the system CPU when temperature or supply voltage go outside defined
windows. These events can also be used to wake up the device from Standby mode through the Always-
On (AON) event fabric.

6.10 µDMA
The device includes a direct memory access (µDMA) controller. The µDMA controller provides a way to
offload data-transfer tasks from the system CPU, thus allowing for more efficient use of the processor and
the available bus bandwidth. The µDMA controller can perform a transfer between memory and
peripherals. The µDMA controller has dedicated channels for each supported on-chip module and can be
programmed to automatically perform transfers between peripherals and memory when the peripheral is
ready to transfer more data.
Some features of the µDMA controller include the following (this is not an exhaustive list):
• Highly flexible and configurable channel operation of up to 32 channels
• Transfer modes: memory-to-memory, memory-to-peripheral, peripheral-to-memory, and
peripheral-to-peripheral
• Data sizes of 8, 16, and 32 bits
• Ping-pong mode for continuous streaming of data

6.11 Debug
The on-chip debug support is done through a dedicated cJTAG (IEEE 1149.7) or JTAG (IEEE 1149.1)
interface. The device boots by default into cJTAG mode and must be reconfigured to use 4-pin JTAG.

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6.12 Power Management

To minimize power consumption, the CC2642R supports a number of power modes and power
management features (see Table 6-1).

Table 6-1. Power Modes

SOFTWARE CONFIGURABLE POWER MODES RESET PIN
MODE
ACTIVE IDLE STANDBY SHUTDOWN HELD
CPU Active Off Off Off Off
Flash On Available Off Off Off
SRAM On On Retention Off Off
Radio Available Available Off Off Off
Supply System On On Duty Cycled Off Off
Register and CPU retention Full Full Partial No No
SRAM retention Full Full Full No No
48 MHz high-speed clock XOSC_HF or XOSC_HF or
Off Off Off
(SCLK_HF) RCOSC_HF RCOSC_HF
2 MHz medium-speed clock
RCOSC_MF RCOSC_MF Available Off Off
(SCLK_MF)
32 kHz low-speed clock XOSC_LF or XOSC_LF or XOSC_LF or
Off Off
(SCLK_LF) RCOSC_LF RCOSC_LF RCOSC_LF
Peripherals Available Available Off Off Off
Sensor Controller Available Available Available Off Off
Wake-up on RTC Available Available Available Off Off
Wake-up on pin edge Available Available Available Available Off
Wake-up on reset pin On On On On On
Brownout detector (BOD) On On Duty Cycled Off Off
Power-on reset (POR) On On On Off Off
Watchdog timer (WDT) Available Available Paused Off Off

In Active mode, the application system CPU is actively executing code. Active mode provides normal
operation of the processor and all of the peripherals that are currently enabled. The system clock can be
any available clock source (see Table 6-1).
In Idle mode, all active peripherals can be clocked, but the Application CPU core and memory are not
clocked and no code is executed. Any interrupt event brings the processor back into active mode.
In Standby mode, only the always-on (AON) domain is active. An external wake-up event, RTC event, or
Sensor Controller event is required to bring the device back to active mode. MCU peripherals with
retention do not need to be reconfigured when waking up again, and the CPU continues execution from
where it went into standby mode. All GPIOs are latched in standby mode.
In Shutdown mode, the device is entirely turned off (including the AON domain and Sensor Controller),
and the I/Os are latched with the value they had before entering shutdown mode. A change of state on
any I/O pin defined as a wake from shutdown pin wakes up the device and functions as a reset trigger.
The CPU can differentiate between reset in this way and reset-by-reset pin or power-on reset by reading
the reset status register. The only state retained in this mode is the latched I/O state and the flash memory
contents.

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The Sensor Controller is an autonomous processor that can control the peripherals in the Sensor
Controller independently of the system CPU. This means that the system CPU does not have to wake up,
for example to perform an ADC sampling or poll a digital sensor over SPI, thus saving both current and
wake-up time that would otherwise be wasted. The Sensor Controller Studio tool enables the user to
program the Sensor Controller, control its peripherals, and wake up the system CPU as needed. All
Sensor Controller peripherals can also be controlled by the system CPU.

NOTE
The power, RF and clock management for the CC2642R device require specific configuration
and handling by software for optimized performance. This configuration and handling is
implemented in the TI-provided drivers that are part of the CC2642R software development
kit (SDK). Therefore, TI highly recommends using this software framework for all application
development on the device. The complete SDK with TI-RTOS (optional), device drivers, and
examples are offered free of charge in source code.

6.13 Clock Systems

The CC2642R device has several internal system clocks.
The 48 MHz SCLK_HF is used as the main system (MCU and peripherals) clock. This can be driven by
the internal 48 MHz RC Oscillator (RCOSC_HF) or an external 48 MHz crystal (XOSC_HF). Radio
operation requires an external 48 MHz crystal.
SCLK_MF is an internal 2 MHz clock that is used by the Sensor Controller in low-power mode and also for
internal power management circuitry. The SCLK_MF clock is always driven by the internal 2 MHz RC
Oscillator (RCOSC_MF).
SCLK_LF is the 32.768 kHz internal low-frequency system clock. It can be used by the Sensor Controller
for ultra-low-power operation and is also used for the RTC and to synchronize the radio timer before or
after Standby power mode. SCLK_LF can be driven by the internal 32.8 kHz RC Oscillator (RCOSC_LF),
a 32.768 kHz watch-type crystal, or a clock input on any digital IO.
When using a crystal or the internal RC oscillator, the device can output the 32 kHz SCLK_LF signal to
other devices, thereby reducing the overall system cost.

6.14 Network Processor

Depending on the product configuration, the CC2642R device can function as a wireless network
processor (WNP - a device running the wireless protocol stack with the application running on a separate
host MCU), or as a system-on-chip (SoC) with the application and protocol stack running on the system
CPU inside the device.
In the first case, the external host MCU communicates with the device using SPI or UART. In the second
case, the application must be written according to the application framework supplied with the wireless
protocol stack.

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7 Application, Implementation, and Layout

NOTE
Information in the following Applications section is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI's customers are responsible for
determining suitability of components for their purposes. Customers should validate and test
their design implementation to confirm system functionality.

For general design guidelines and hardware configuration guidelines, refer to CC13xx/CC26xx Hardware
Configuration and PCB Design Considerations Application Report.

7.1 Reference Designs

The following reference designs should be followed closely when implementing designs using the
CC2642R device.
Special attention must be paid to RF component placement, decoupling capacitors and DCDC regulator
components, as well as ground connections for all of these.
CC26x2REM-7ID Design Files SPACER
The CC26x2REM-7ID reference design provides schematic, layout and production files for
the characterization board used for deriving the performance number found in this document.
LAUNCHXL-CC26X2R1 Design Files SPACER
The CC26X2R LaunchPad Design Files contain detailed schematics and layouts to build
application specific boards using the CC2642R device. This design applies to both the
CC2642R and CC2652R devices.
Sub-1 GHz and 2.4 GHz Antenna Kit for LaunchPad™ Development Kit and SensorTag SPACER
The antenna kit allows real-life testing to identify the optimal antenna for your application.
The antenna kit includes 16 antennas for frequencies from 169 MHz to 2.4 GHz, including:
• PCB antennas
• Helical antennas
• Chip antennas
• Dual-band antennas for 868 MHz and 915 MHz combined with 2.4 GHz

The antenna kit includes a JSC cable to connect to the Wireless MCU LaunchPad
Development Kits and SensorTags.

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7.2 Junction Temperature Calculation

This section shows the different techniques for calculating the junction temperature under various
operating conditions. For more details, see Semiconductor and IC Package Thermal Metrics.
There are three recommended ways to derive the junction temperature from other measured
temperatures:
1. From package temperature:
(1)

2. From board temperature:

(2)

3. From ambient temperature:

(3)

P is the power dissipated from the device and can be calculated by multiplying current consumption with
supply voltage. Thermal resistance coefficients are found in Section 5.8.
Example:
Using Equation 3, the temperature difference between ambient temperature and junction temperature is
calculated. In this example, we assume a simple use case where the radio is transmitting continuously at
0 dBm output power. Let us assume the ambient temperature is 85 °C and the supply voltage is 3 V. To
calculate P, we need to look up the current consumption for Tx at 85 °C in Figure 5-8. From the plot, we
see that the current consumption is 7.8 mA. This means that P is 7.8 mA × 3 V = 23.4 mW.
The junction temperature is then calculated as:
(4)

As can be seen from the example, the junction temperature is 0.6 °C higher than the ambient temperature
when running continuous Tx at 85 °C and, thus, well within the recommended operating conditions.
For various application use cases current consumption for other modules may have to be added to
calculate the appropriate power dissipation. For example, the MCU may be running simultaneously as the
radio, peripheral modules may be enabled, etc. Typically, the easiest way to find the peak current
consumption, and thus the peak power dissipation in the device, is to measure as described in Measuring
CC13xx and CC26xx current consumption.

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8 Device and Documentation Support

TI offers an extensive line of development tools. Tools and software to evaluate the performance of the
device, generate code, and develop solutions are listed as follows.

8.1 Tools and Software

The CC2642R device is supported by a variety of software and hardware development tools.
Development Kit
CC26x2 LaunchPad™ Development Kit SPACER
The CC26x2R LaunchPad™ Development Kit enables development of high-performance
wireless applications that benefit from low-power operation. The kit features the CC2652R
SimpleLink Wireless MCU, which allows you to quickly evaluate and prototype 2.4-GHz
wireless applications such as Bluetooth 5 Low Energy, Zigbee and Thread, plus
combinations of these. The kit works with the LaunchPad ecosystem, easily enabling
additional functionality like sensors, display and more. The built-in EnergyTrace™ software is
an energy-based code analysis tool that measures and displays the application’s energy
profile and helps to optimize it for ultra-low-power consumption. See Table 3-1 for guidance
in selecting the correct device for single-protocol products.
Software
SimpleLink™ CC13X2-CC26X2 SDK SPACER
The SimpleLink CC13X2-CC26X2 Software Development Kit (SDK) provides a complete
package for the development of wireless applications on the CC13X2 / CC26X2 family of
devices. The SDK includes a comprehensive software package for the CC2642R device,
including the following protocol stacks:
• Bluetooth Low Energy 4 and 5.1
• Thread (based on OpenThread)
• Zigbee 3.0
• TI 15.4-Stack - an IEEE 802.15.4-based star networking solution for Sub-1 GHz and
2.4 GHz
• EasyLink - a large set of building blocks for building proprietary RF software stacks
• Multiprotocol support - concurrent operation between stacks using the Dynamic
Multiprotocol Manager (DMM)

The SimpleLink CC13X2-CC26X2 SDK is part of TI’s SimpleLink MCU platform, offering a
single development environment that delivers flexible hardware, software and tool options for
customers developing wired and wireless applications. For more information about the
SimpleLink MCU Platform, visit http://www.ti.com/simplelink.

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Development Tools
Code Composer Studio™ Integrated Development Environment (IDE) SPACER
Code Composer Studio is an integrated development environment (IDE) that supports TI's
Microcontroller and Embedded Processors portfolio. Code Composer Studio comprises a
suite of tools used to develop and debug embedded applications. It includes an optimizing
C/C++ compiler, source code editor, project build environment, debugger, profiler, and many
other features. The intuitive IDE provides a single user interface taking you through each
step of the application development flow. Familiar tools and interfaces allow users to get
started faster than ever before. Code Composer Studio combines the advantages of the
Eclipse® software framework with advanced embedded debug capabilities from TI resulting
in a compelling feature-rich development environment for embedded developers.
CCS has support for all SimpleLink Wireless MCUs and includes support for EnergyTrace™
software (application energy usage profiling). A real-time object viewer plugin is available for
TI-RTOS, part of the SimpleLink SDK.
Code Composer Studio is provided free of charge when used in conjunction with the XDS
debuggers included on a LaunchPad Development Kit.
Code Composer Studio™ Cloud IDE SPACER
Code Composer Studio (CCS) Cloud is a web-based IDE that allows you to create, edit and
build CCS and Energia™ projects. After you have successfully built your project, you can
download and run on your connected LaunchPad. Basic debugging, including features like
setting breakpoints and viewing variable values is now supported with CCS Cloud.
IAR Embedded Workbench® for Arm® SPACER
IAR Embedded Workbench® is a set of development tools for building and debugging
embedded system applications using assembler, C and C++. It provides a completely
integrated development environment that includes a project manager, editor, and build tools.
IAR has support for all SimpleLink Wireless MCUs. It offers broad debugger support,
including XDS110, IAR I-jet™ and Segger J-Link™. A real-time object viewer plugin is
available for TI-RTOS, part of the SimpleLink SDK. IAR is also supported out-of-the-box on
most software examples provided as part of the SimpleLink SDK.
A 30-day evaluation or a 32 KB size-limited version is available through iar.com.
SmartRF™ Studio SPACER
SmartRF™ Studio is a Windows® application that can be used to evaluate and configure
SimpleLink Wireless MCUs from Texas Instruments. The application will help designers of
RF systems to easily evaluate the radio at an early stage in the design process. It is
especially useful for generation of configuration register values and for practical testing and
debugging of the RF system. SmartRF Studio can be used either as a standalone application
or together with applicable evaluation boards or debug probes for the RF device. Features of
the SmartRF Studio include:
• Link tests - send and receive packets between nodes
• Antenna and radiation tests - set the radio in continuous wave TX and RX states
• Export radio configuration code for use with the TI SimpleLink SDK RF driver
• Custom GPIO configuration for signaling and control of external switches
Sensor Controller Studio SPACER
Sensor Controller Studio is used to write, test and debug code for the Sensor Controller
peripheral. The tool generates a Sensor Controller Interface driver, which is a set of C
source files that are compiled into the System CPU application. These source files also
contain the Sensor Controller binary image and allow the System CPU application to control
and exchange data with the Sensor Controller. Features of the Sensor Controller Studio
include:
• Ready-to-use examples for several common use cases
• Full toolchain with built-in compiler and assembler for programming in a C-like
programming language
• Provides rapid development by using the integrated sensor controller task testing and
debugging functionality, including visualization of sensor data and verification of
algorithms

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CCS UniFlash SPACER

CCS UniFlash is a standalone tool used to program on-chip flash memory on TI MCUs.
UniFlash has a GUI, command line, and scripting interface. CCS UniFlash is available free of
charge.

8.1.1 SimpleLink™ Microcontroller Platform

The SimpleLink microcontroller platform sets a new standard for developers with the broadest portfolio of
wired and wireless Arm® MCUs (System-on-Chip) in a single software development environment.
Delivering flexible hardware, software and tool options for your IoT applications. Invest once in the
SimpleLink software development kit and use throughout your entire portfolio. Learn more on
ti.com/simplelink.

8.2 Documentation Support

To receive notification of documentation updates on data sheets, errata, application notes and similar,
navigate to the device product folder on ti.com/product/CC2642R. In the upper right corner, click on Alert
me to register and receive a weekly digest of any product information that has changed. For change
details, review the revision history included in any revised document.
The current documentation that describes the MCU, related peripherals, and other technical collateral is
listed as follows.

TI Resource Explorer
TI Resource Explorer SPACER
Software examples, libraries, executables, and documentation are available for your device
and development board.
Errata
CC2642R Silicon Errata SPACER
The silicon errata describes the known exceptions to the functional specifications for each
silicon revision of the device and description on how to recognize a device revision.
Application Reports
All application reports for the CC2642R device are found on the device product folder at:
ti.com/product/CC2642R/technicaldocuments.
Technical Reference Manual (TRM)
CC13x2, CC26x2 SimpleLink™ Wireless MCU TRM SPACER
The TRM provides a detailed description of all modules and peripherals available in the
device family.

56 Device and Documentation Support Copyright © 2018–2020, Texas Instruments Incorporated

Submit Documentation Feedback
Product Folder Links: CC2642R
 CC2642R
www.ti.com SWRS194G – JANUARY 2018 – REVISED APRIL 2020

8.3 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help —
straight from the experts. Search existing answers or ask your own question to get the quick design help
you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications
and do not necessarily reflect TI's views; see TI's Terms of Use.

8.4 Trademarks
SmartRF, SimpleLink, LaunchPad, EnergyTrace, Code Composer Studio, E2E are trademarks of Texas
Instruments.
Arm, Cortex, Arm Thumb are registered trademarks of Arm Limited (or its subsidiaries).
Bluetooth is a registered trademark of Bluetooth SIG Inc.
Eclipse is a registered trademark of Eclipse Foundation.
CoreMark is a registered trademark of Embedded Microprocessor Benchmark Consortium.
I-jet is a trademark of IAR Systems AB.
IAR Embedded Workbench is a registered trademark of IAR Systems AB.
Windows is a registered trademark of Microsoft Corporation.
J-Link is a trademark of SEGGER Microcontroller Systeme GmbH.
Wi-Fi is a registered trademark of Wi-Fi Alliance.
All other trademarks are the property of their respective owners.

8.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

8.6 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.

9 Mechanical, Packaging, and Orderable Information

9.1 Packaging Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and
revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

Copyright © 2018–2020, Texas Instruments Incorporated Mechanical, Packaging, and Orderable Information 57
Submit Documentation Feedback
Product Folder Links: CC2642R
 PACKAGE OPTION ADDENDUM

www.ti.com 10-Dec-2020

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)

CC2642R1FRGZR ACTIVE VQFN RGZ 48 2500 RoHS & Green NIPDAU | NIPDAUAG Level-3-260C-168 HR -40 to 105 CC2642
R1F
CC2642R1FRGZT ACTIVE VQFN RGZ 48 250 RoHS & Green NIPDAU | NIPDAUAG Level-3-260C-168 HR -40 to 105 CC2642
R1F

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

www.ti.com 10-Dec-2020

OTHER QUALIFIED VERSIONS OF CC2642R :

• Automotive: CC2642R-Q1

NOTE: Qualified Version Definitions:

• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

Addendum-Page 2
 PACKAGE MATERIALS INFORMATION

www.ti.com 19-Feb-2021

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
CC2642R1FRGZR VQFN RGZ 48 2500 330.0 16.4 7.3 7.3 1.1 12.0 16.0 Q2
CC2642R1FRGZR VQFN RGZ 48 2500 330.0 16.4 7.3 7.3 1.1 12.0 16.0 Q2
CC2642R1FRGZT VQFN RGZ 48 250 180.0 16.4 7.3 7.3 1.1 12.0 16.0 Q2
CC2642R1FRGZT VQFN RGZ 48 250 180.0 16.4 7.3 7.3 1.1 12.0 16.0 Q2

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 19-Feb-2021

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CC2642R1FRGZR VQFN RGZ 48 2500 336.6 336.6 31.8
CC2642R1FRGZR VQFN RGZ 48 2500 367.0 367.0 35.0
CC2642R1FRGZT VQFN RGZ 48 250 210.0 185.0 35.0
CC2642R1FRGZT VQFN RGZ 48 250 210.0 185.0 35.0

Pack Materials-Page 2
 GENERIC PACKAGE VIEW
RGZ 48 VQFN - 1 mm max height
7 x 7, 0.5 mm pitch PLASTIC QUADFLAT PACK- NO LEAD

Images above are just a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.

4224671/A

www.ti.com
 PACKAGE OUTLINE
RGZ0048A VQFN - 1 mm max height
PLASTIC QUADFLAT PACK- NO LEAD

7.1 A
B 6.9

(0.1) TYP

7.1 SIDE WALL DETAIL

PIN 1 INDEX AREA 6.9 OPTIONAL METAL THICKNESS

(0.45) TYP

CHAMFERED LEAD
CORNER LEAD OPTION

1 MAX
C

SEATING PLANE
0.05 0.08 C
0.00
2X 5.5

5.15±0.1 (0.2) TYP

13 24
44X 0.5
12
25
SEE SIDE WALL
DETAIL

2X SYMM
5.5

1 36
PIN1 ID 48X 0.30
0.18
48 37
(OPTIONAL)
SYMM 0.1 C A B
48X 0.5
0.3 0.05 C
SEE LEAD OPTION

4219044/C 09/2020

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.

www.ti.com
 EXAMPLE BOARD LAYOUT
RGZ0048A VQFN - 1 mm max height
PLASTIC QUADFLAT PACK- NO LEAD

2X (6.8)
( 5.15)
SYMM
48X (0.6) 48 35

48X (0.24)

44X (0.5) 1
34

2X SYMM 2X
(5.5) (6.8)

2X
(1.26)

2X
(1.065)

(R0.05)
TYP
23
12

21X (Ø0.2) VIA

TYP
13 22
2X (1.26) 2X (1.065)
2X (5.5)
LAND PATTERN EXAMPLE
SCALE: 15X

0.07 MAX 0.07 MIN SOLDER MASK

ALL AROUND ALL AROUND OPENING

EXPOSED METAL EXPOSED METAL

METAL
SOLDER MASK METAL UNDER
OPENING NON SOLDER MASK SOLDER MASK
SOLDER MASK
DEFINED DEFINED
(PREFERRED)
SOLDER MASK DETAILS 4219044/C 09/2020

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271) .
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.

www.ti.com
 EXAMPLE STENCIL DESIGN
RGZ0048A VQFN - 1 mm max height
PLASTIC QUADFLAT PACK- NO LEAD

2X (6.8)
SYMM ( 1.06)
48X (0.6)

48X (0.24)

44X (0.5)

2X SYMM 2X
(5.5) (6.8)
2X
(0.63)

2X
(1.26)

(R0.05)
TYP

2X
2X (0.63)
(1.26)
2X (5.5)

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

EXPOSED PAD
67% PRINTED COVERAGE BY AREA
SCALE: 15X

4219044/C 09/2020

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.

www.ti.com
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