S.B.

Roll No……………………………………………

BUILDING DRAWING
3rd Exam/Civil/0518/Feb'2021
Duration: 1.15Hrs. M.Marks:25
Note: Assume any missing data suitably.
SECTION-A
Q1. Attempt any one question. 1x15=15
a. Draw the detail of Simple Spread Footed Foundation for an external wall 300mm thick by thumb rule.
b. Draw the PLAN of two alternate courses of Corner Junction of one-and-half brick wall (1½ brick thick
wall) in English Bond.
c. Draw the detail of Vitrified Tiled Floor on the side of the 300 mm thick wall.
d. Draw the ELEVATION and SECTIONAL PLAN of Wire Gauze Door.

SECTION-B
Q2. Draw the PLAN, FRONT ELEVATION of Line Plan as shown; 5+5=10

Clear Height of Room, Verandah and Bathroom - 3 m.

Height of Plinth above G.L - 45 cm.
Wall Thickness - 300 mm.
RCC Slab - 100 mm thick.
Provide Doors and Windows at suitable places.
S.B. Roll No……………………………………………

BUILDING DRAWING
3rd Exam/Civil/5199/Feb'2021
(For 2018 batch onwards)
Duration: 1.15Hrs. M.Marks:25
SECTION-A
Q1. Attempt any one question. 1x15=15
a. Draw the bonded cement concrete floor finish over ground with toping laid in single layer.
b. Draw the section of a simple spread footing foundation for a load bearing wall of 300mm thick using
thumb rule. Also show position of Horizontal D.P.C.
c. Draw the sketches to illustrate the layout of brick in alternate courses of a right angled corner of a two
brick wall with another 1.5 brick wall in English Bond.
d. Draw the elevation and sectional side elevation of a casement window of size 1.2m x 2.1m ( 1200mm x
2100mm)
SECTION-B
Attempt the following.
Q2. The fig. below shows a line plan of a small residential building. Draw the following views:
a. Detailed Plan 5
b. Elevation 5
Given specifications:
a. Plinth height = 600mm
b. Height of bottom of slab from floor = 3000mm
c. Thickness of slab = 150mm
d. All walls are 300mm thick
Assume suitable data as per requirement.
S.B. Roll No……………………………………………

ELECTRONICS-I
3rd Exam/Elect/0525/Feb'2021
Duration: 1.15Hrs. M.Marks:25
SECTION-A
Q1. Attempt any three questions. 3x5=15
i. What are Intrinsic and Extrinsic Semiconductors?
ii. What are the differences between BJT and FET transistors?
iii. What is regulated power supply? Draw the block diagram for it.
iv. What are the various couplings used in multi stage amplifier.
v. Draw and Explain the V-I characteristics of Zener diode.
vi. Write short note on Avalanche Breakdown?
vii. What is the need of multistage amplifier?

SECTION-B
Q2. Attempt any one question. 1x10=10
a. Explain the construction, operation and characteristics of MOSFET.
b. Which are Transistor biasing circuits? Explain potential Divider Biasing circuit.
c. Draw the circuit diagram of a full wave bridge rectifier and explain its working.
d. Explain the circuit diagram of a single stage transistor amplifier.
S.B. Roll No……………………………………………

GENERIC SKILL AND ENTREPRENEURSHIP DEVELOPMENT

3rd Exam/Electrical/5285/Feb'2021
(For 2018 batch onwards)
Duration: 1.15Hrs. M.Marks:25
SECTION-A
Q1. Attempt any three questions. 3x5=15
i. Explain all the phases of task management.
ii. Explain LLL and its importance?
iii. Explain the general steps followed in problem solving?
iv. Explain Small Industries Development Bank of India (SIDBI) and its function?
v. Explain the various techniques of Reading?
vi. What are the various different leadership styles?
vii. What is the importance of generic skill development?

SECTION-B
Q2. Attempt any one question. 1x10=10
a. Explain the concept, functions and qualities of an entrepreneur?
b. Explain various types of multiple intelligence?
c. How an anxiety can be managed, briefly explain each of the techniques?
d. Explain the role of NABARD in agriculture and rural development?
S.B. Roll No……………………………………………

WORKSHOP TECHNOLOGY-I
3rd Exam/Mech./RAC/Prod/Auto/0533/0933/Feb'2021
Duration: 1.15Hrs. M.Marks:25
SECTION-A
Q1. Attempt any three questions. 3x5=15
a. What are the defects of extrusion process?
b. Differentiate between cold and hot forging.
c. What is press working? Explain various press operations.
d. Explain the process of tube and wire drawing.
e. Explain various types of gas welding flames with neat sketch.
f. What is destructive and non-destructive testing?
g. What is the principle of resistance welding?

SECTION-B
Q2. Attempt any one question. 1x10=10
i. What are common allowances provided on provided on pattern and why?
ii. Discuss different types of casting defects. How they can be minimized?
iii. Explain the various types of moulding process.
iv. Explain briefly the following: a) MIG welding. b) TIG welding
S.B. Roll No……………………………………………

WORKSHOP TECHNOLOGY
3rd Exam/Mech./Auto/0593/Feb'2021
(For 2018 batch onwards)
Duration: 1.15Hrs. M.Marks:25
SECTION-A
Q1. Attempt any three questions. 3x5=15
i. Give the applications of different flames in welding.
ii. Define centrifugal casting and what their advantages are.
iii. What are the difference between open die forging and closed die forging?
iv. Explain any two pattern allowances.
v. What are the properties of moulding sand?
vi. What are the various forging defects?
vii. Discuss the safety precautions used in welding.

SECTION-B
Q2. Attempt any one question. 1x10=10
a. Describe the Electron beam welding with the help of diagram.
b. Explain the different types of casting defects.
c. Explain the safety precautions used in foundry.
d. What is the Injection moulding? Give advantages of injection moulding.
S.B. Roll No……………………………………………

DIGITAL ELECTRONICS
3RD Exam/ECE/ETV/ECE-II/EEE/0620/Feb'2021
Duration: 1.15Hrs. M.Marks:25
SECTION-A
Q1. Attempt any three questions. 3x5=15
a. Simplify Y=ABC+ABC+ABC using Boolean algebra.
b. Convert the following as:
i) (110110.101)շ into decimal number. ii) Convert gray code (11010)2 into binary.
c. Design a 4:1 multiplexer.
d. Draw and explain D-Flip flop with help of truth table.
e. Explain a parallel in serial out shift register with diagram.
f. Differentiate between synchronous and asynchronous counters.
g. What is the difference between a latch and a flip flop?

SECTION-B
Q2. Attempt any one question. 1x10=10
i. Draw and explain the operation of 3 bit asynchronous binary Counter.
ii. Explain the working principle of J-K Flip flop with diagram of each state of truth table.
iii. What do you mean by Universal gate? Explain universal property of NAND gate.
iv. Minimize the following expression using K-map: F=∑m(1,3,5,7,9,11,13,15).
S.B. Roll No……………………………………………

DIGITAL ELECTRONICS
3rd Exam/ECE/0195/Feb'2021
(For 2018 Batch onwards)
Duration: 1.15Hrs. M.Marks:25
SECTION-A
Q1. Attempt any three questions. 3x5=15
a. List difference between analog and digital system
b. Describe NAND gate as universal gate
c. Define SSI,MSI,LSI and VLSI
d. Explain Half Adder
e. Difference between multiplexer and demultiplexer
f. Explain operation of R-S Flip flop
g. Explain working of ring counter

SECTION-B
Q2. Attempt any one question. 1x10=10
i. Draw and explain full adder circuit
ii. Explain working of shift register
iii. Minimize the following using K-MAP
F(A,B,C,D) =EM ( 0,1,2,3,5,7,8,9,11,14)
iv. Explain De Morgan theorem
v. Write a short note on the following. a) Seven segment display b) Decoder
S.B. Roll No……………………………………………

COMPUTER PROGRAMMING USING C

3rd Exam/CSE/IT/0295/Feb'2021
(For 2018 Batch onwards)
Duration: 1.15Hrs. M.Marks:25
SECTION-A
Q1. Attempt any three questions. 3x5=15
a. Write a program in C language to find the area of a circle.
b. Explain prinf() &scanf() function in C language.
c. Explain the concept of pointers in C language.
d. Explain the various data types of C language.
e. Write a program in C to find if the given number is Even or Odd Number.
f. Explain the syntax of For loop with example.
g. Write a program in C to find the average of any three numbers.

SECTION-B
Q2. Attempt any one question. 1x10=10
i. Explain Structure. How can you access data from a structure?
ii. Write a program in C to find the greatest number from any given three numbers.
iii. Write a program in C to perform addition of two matrices.
iv. Explain the various control statements with their syntax.