Datasheet
Datasheet
Datasheet
DATA SHEET
handbook, 2 columns
M3D116
BYV27 series
Ultra fast low-loss
controlled avalanche rectifiers
Product specification 1997 Nov 24
Supersedes data of 1996 Oct 02
Philips Semiconductors Product specification
expansion of all used parts are
• High maximum operating a high temperature alloyed
matched.
temperature construction.
• Low leakage current
• Excellent stability
• Guaranteed avalanche energy 2/3 page k(Datasheet) a
absorption capability
MAM047
• Available in ammo-pack.
Fig.1 Simplified outline (SOD57) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VRRM repetitive peak reverse voltage
BYV27-50 − 50 V
BYV27-100 − 100 V
BYV27-150 − 150 V
BYV27-200 − 200 V
BYV27-300 − 300 V
BYV27-400 − 400 V
BYV27-500 − 500 V
BYV27-600 − 600 V
VR continuous reverse voltage
BYV27-50 − 50 V
BYV27-100 − 100 V
BYV27-150 − 150 V
BYV27-200 − 200 V
BYV27-300 − 300 V
BYV27-400 − 400 V
BYV27-500 − 500 V
BYV27-600 − 600 V
IF(AV) average forward current Ttp = 85 °C; lead length = 10 mm;
BYV27-50 to 200 see Figs 2, 3 and 4; − 2.0 A
averaged over any 20 ms period;
BYV27-300 and 400 − 1.9 A
see also Figs 14, 15 and 16
BYV27-500 and 600 − 1.6 A
IF(AV) average forward current Tamb = 60 °C; printed-circuit board
BYV27-50 to 200 mounting (see Fig. 25); − 1.30 A
see Figs 5, 6 and 7;
BYV27-300 and 400 − 1.25 A
averaged over any 20 ms period;
BYV27-500 and 600 see also Figs 14, 15 and 16 − 1.10 A
1997 Nov 24 2
Philips Semiconductors Product specification
ELECTRICAL CHARACTERISTICS
Tj = 25 °C unless otherwise specified.
1997 Nov 24 3
Philips Semiconductors Product specification
THERMAL CHARACTERISTICS
Note
1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer ≥40 µm, see Fig. 25.
For more information please refer to the “General Part of associated Handbook”.
1997 Nov 24 4
Philips Semiconductors Product specification
GRAPHICAL DATA
MGA849 MLC293
2.0 2.0
handbook, halfpage
handbook, halfpage
I F(AV) I F(AV)
(A) 20 15 10 lead length (mm) (A) lead length 10 mm
1.6 1.6
1.2 1.2
0.8 0.8
0.4 0.4
0 0
0 100 200 0 100 200
Ttp (o C) Ttp (o C)
Fig.2 Maximum permissible average forward Fig.3 Maximum permissible average forward
current as a function of tie-point temperature current as a function of tie-point temperature
(including losses due to reverse leakage). (including losses due to reverse leakage).
MGK648 MGA848
3 2.0
handbook, halfpage handbook, halfpage
IF(AV) I F(AV)
(A) (A)
1.6
lead length 10 mm
2
1.2
0.8
1
0.4
0 0
0 100 200 0 100 200
Ttp (°C) T amb ( o C)
Fig.4 Maximum permissible average forward Fig.5 Maximum permissible average forward
current as a function of tie-point temperature current as a function of ambient temperature
(including losses due to reverse leakage). (including losses due to reverse leakage).
1997 Nov 24 5
Philips Semiconductors Product specification
MLC294 MGK649
1.6 1.6
handbook, halfpage handbook, halfpage
I F(AV) IF(AV)
(A) (A)
1.2 1.2
0.8 0.8
0.4 0.4
0 0
0 100 200 0 100 200
Tamb ( o C) Tamb (°C)
Fig.6 Maximum permissible average forward Fig.7 Maximum permissible average forward
current as a function of ambient temperature current as a function of ambient temperature
(including losses due to reverse leakage). (including losses due to reverse leakage).
MLC297
20
handbook, full pagewidth
I FRM δ = 0.05
(A)
16
0.1
12
8 0.2
0.5
4
0
10 2 10 1 1 10 10 2 10 3 t p (ms) 10 4
BYV27-50 to 200
Ttp = 85 °C; Rth j-tp = 46 K/W.
VRRMmax during 1 − δ; curves include derating for Tj max at VRRM = 200 V.
Fig.8 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor.
1997 Nov 24 6
Philips Semiconductors Product specification
MLC299
20
handbook, full pagewidth
I FRM δ = 0.05
(A)
16
12 0.1
8 0.2
4 0.5
0
10 2 10 1 1 10 10 2 10 3 t p (ms) 10 4
Fig.9 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor.
MGK650
20
handbook, full pagewidth
IFRM
(A)
16
δ = 0.05
12
0.1
8
0.2
4 0.5
1
0
10−2 10−1 1 10 102 103 tp (ms) 104
Fig.10 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor.
1997 Nov 24 7
Philips Semiconductors Product specification
MLC298
16
handbook, full pagewidth
I FRM
(A)
δ = 0.05
12
0.1
8
0.2
4
0.5
1
0
10 2 10 1 1 10 10 2 10 3 t p (ms) 10 4
BYV27-50 to 200
Tamb = 60 °C; Rth j-a = 100 K/W.
VRRMmax during 1 − δ; curves include derating for Tj max at VRRM = 200 V.
Fig.11 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor.
MLC300
16
handbook, full pagewidth
I FRM
(A)
δ = 0.05
12
8 0.1
0.2
4
0.5
0
10 2 10 1 1 10 10 2 10 3 t p (ms) 10 4
Fig.12 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor.
1997 Nov 24 8
Philips Semiconductors Product specification
MGK651
20
handbook, full pagewidth
IFRM
(A)
16
12
δ = 0.05
8
0.1
4 0.2
0.5
1
0
10−2 10−1 1 10 102 103 tp (ms) 104
Fig.13 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor.
MGA870 MLC292
2.4 2.4
handbook, halfpage handbook, halfpage
P a=3 2.5 2 P
(W) 1.57 (W) a=3 2.5 2 1.57
2.0 2.0
1.42
1.6 1.6
1.42
1.2 1.2
0.8 0.8
0.4 0.4
0 0
0 1 I F(AV) (A) 2 0 1 I F(AV) (A) 2
Fig.14 Maximum steady state power dissipation Fig.15 Maximum steady state power dissipation
(forward plus leakage current losses, (forward plus leakage current losses,
excluding switching losses) as a function excluding switching losses) as a function
of average forward current. of average forward current.
1997 Nov 24 9
Philips Semiconductors Product specification
MGK652 MGK645
2.0 200
handbook, halfpage a=3 2 handbook, halfpage
P
(W) 2.5 Tj
1.57 (°C)
1.6
1.42
1.2
100
0.8
0.4
0 0
0 1 IF(AV)(A) 2 0 50 VR (%VRmax) 100
MGA864 MLC291
6 6
handbook, halfpage handbook, halfpage
IF IF
(A) (A)
4 4
2 2
0 0
0 1 V F (V) 2 0 1 V (V) 2
F
Fig.18 Forward current as a function of forward Fig.19 Forward current as a function of forward
voltage; maximum values. voltage; maximum values.
1997 Nov 24 10
Philips Semiconductors Product specification
MBH649 MGC550
6 103
handbook, halfpage handbook, halfpage
IF IR
(A) (µA)
4 102
2 10
0 1
0 1 V F (V) 2 0 100 200
Tj (°C)
Fig.20 Forward current as a function of forward Fig.21 Reverse current as a function of junction
voltage; maximum values. temperature; maximum values.
MLC295 MLC296
102
handbook, halfpage
2
10halfpage
handbook,
Cd Cd
(pF) (pF)
10 10
1 1
1 10 102 V R (V) 103 1 10 102 103
V R (V)
Fig.22 Diode capacitance as a function of reverse Fig.23 Diode capacitance as a function of reverse
voltage; typical values. voltage; typical values.
1997 Nov 24 11
Philips Semiconductors Product specification
MGK653
102
handbook, halfpage 50
handbook, halfpage
25
Cd
(pF)
7
50
10
3
1
1 10 102 VR (V) 103 MGA200
IF halfpage
ndbook,
dI F
dt
t rr
10% t
dI R
dt
100%
IR
MGC499
1997 Nov 24 12
Philips Semiconductors Product specification
1Ω
50 Ω 0
t
0.25
0.5
IR
(A)
MAM057
1.0
Fig.27 Test circuit and reverse recovery time waveform and definition.
1997 Nov 24 13
Philips Semiconductors Product specification
PACKAGE OUTLINE
(1)
k a
b
D L G L
Note
1. The marking band indicates the cathode.
SOD57 97-10-14
DEFINITIONS
1997 Nov 24 14
Philips Semiconductors Product specification
NOTES
1997 Nov 24 15
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Printed in The Netherlands 117027/1200/04/pp16 Date of release: 1997 Nov 24 Document order number: 9397 750 02663