SN 74 HC 166
SN 74 HC 166
SN 74 HC 166
SCLS117D − DECEMBER 1982 − REVISED SEPTEMBER 2003
SH/LD
SER
VCC
NC
A
SER 1 16 VCC
A 2 15 SH/LD
3 2 1 20 19
B 3 14 H B 4 18 H
C 4 13 QH C 5 17 QH
D 5 12 G NC 6 16 NC
CLK INH 6 11 F D 7 15 G
CLK 7 10 E CLK INH 8 14 F
9 10 11 12 13
GND 8 9 CLR
CLK
GND
E
CLR
NC
NC − No internal connection
description/ordering information
ORDERING INFORMATION
ORDERABLE TOP-SIDE
TA PACKAGE†
PART NUMBER MARKING
PDIP − N Tube of 25 SN74HC166N SN74HC166N
Tube of 40 SN74HC166D
SOIC − D Reel of 2500 SN74HC166DR HC166
Reel of 250 SN74HC166DT
−40°C
−40 C to 85
85°C
C SOP − NS Reel of 2000 SN74HC166NSR HC166
SSOP − DB Reel of 2000 SN74HC166DBR HC166
Tube of 90 SN74HC166PW
TSSOP − PW Reel of 2000 SN74HC166PWR HC166
Reel of 250 SN74HC166PWT
CDIP − J Tube of 25 SNJ54HC166J SNJ54HC166J
−55°C
−55 C to 125
125°C
C CFP − W Tube of 150 SNJ54HC166W SNJ54HC166W
LCCC − FK Tube of 55 SNJ54HC166FK
SNJ54HC166FK
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
!" # $%&" !# '%()$!" *!"&+ Copyright 2003, Texas Instruments Incorporated
*%$"# $ " #'&$$!"# '& ",& "&# &-!# #"%&"# '*%$"# $')!" " 122 !)) '!!&"&# !& "&#"&*
#"!*!* .!!"/+ *%$" '$&##0 *&# " &$&##!)/ $)%*& %)&## ",&.#& "&*+ !)) ",& '*%$"# '*%$"
"&#"0 !)) '!!&"&#+ '$&##0 *&# " &$&##!)/ $)%*& "&#"0 !)) '!!&"&#+
FUNCTION TABLE
OUTPUTS
INPUTS
INTERNAL
PARALLEL QH
CLR SH/LD CLK INH CLK SER QA QB
A...H
L X X X X X L L L
H X L L X X QA0 QB0 QH0
H L L ↑ X a...h a b h
H H L ↑ H X H QAn QGn
H H L ↑ L X L QAn QGn
H X H ↑ X X QA0 QB0 QH0
1
SER
1D 1D 1D 1D 1D 1D 1D 1D
C1 C1 C1 C1 C1 C1 C1 C1
6 R R R R R R R R
CLK INH
7
CLK
9
CLR 13
QH
Pin numbers shown are for the D, DB, J, N, NS, PW, and W packages.
CLK INH
CLR
SER
SH/LD
A H
B L
C H
D L
Parallel
Inputs E H
F L
G H
H H
QH H H L H L H L H
Inhibit
Serial Shift Serial Shift
Clear Load
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Package thermal impedance, θJA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
timing requirements over recommended operating free-air temperature range (unless otherwise
noted)
TA = 25°C SN54HC166 SN74HC166
VCC UNIT
MIN MAX MIN MAX MIN MAX
2V 6 4.2 5
fclock Clock frequency 4.5 V 31 21 25 MHz
6V 36 25 29
2V 100 150 125
CLR low 4.5 V 20 30 25
6V 17 26 21
tw Pulse duration ns
2V 80 120 100
CLK high or low 4.5 V 16 24 20
6V 14 20 17
2V 145 220 180
SH/LD high before CLK↑ 4.5 V 29 44 36
6V 25 38 31
2V 80 120 100
SER before CLK↑ 4.5 V 16 24 20
6V 14 20 17
2V 100 150 125
tsu Setup time CLK INH low before CLK↑ 4.5 V 20 30 25 ns
6V 17 26 21
2V 80 120 100
Data before CLK↑ 4.5 V 16 24 20
6V 14 20 17
2V 40 60 50
CLR inactive before CLK↑ 4.5 V 8 12 10
6V 7 10 9
2V 0 0 0
SH/LD high after CLK↑ 4.5 V 0 0 0
6V 0 0 0
2V 5 5 5
SER after CLK
CLK↑ 4.5 V 5 5 5
6V 5 5 5
th Hold time ns
2V 0 0 0
CLK INH high after CLK↑ 4.5 V 0 0 0
6V 0 0 0
2V 5 5 5
Data after CLK
CLK↑ 4.5 V 5 5 5
6V 5 5 5
VCC
Input 50% 50%
0V
tPLH tPHL
VCC In-Phase VOH
Reference 50% 90% 90%
Output 50% 50%
Input 10% 10%
0V VOL
tr tf
tsu th
tPHL tPLH
Data VCC VOH
90% 90% Out-of-Phase 90% 90%
Input 50% 50% 50% 50%
10% 10% 0 V Output 10% 10%
VOL
tr tf tf tr
www.ti.com 15-Oct-2009
PACKAGING INFORMATION
Orderable Device Status (1) Package Package Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Type Drawing Qty
5962-9050101Q2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
5962-9050101QEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
5962-9050101VEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
SN54HC166J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
SN74HC166D ACTIVE SOIC D 16 40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HC166DBR ACTIVE SSOP DB 16 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HC166DBRE4 ACTIVE SSOP DB 16 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HC166DBRG4 ACTIVE SSOP DB 16 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HC166DE4 ACTIVE SOIC D 16 40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HC166DG4 ACTIVE SOIC D 16 40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HC166DR ACTIVE SOIC D 16 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HC166DRE4 ACTIVE SOIC D 16 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HC166DRG4 ACTIVE SOIC D 16 2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HC166DT ACTIVE SOIC D 16 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HC166DTE4 ACTIVE SOIC D 16 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HC166DTG4 ACTIVE SOIC D 16 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HC166N ACTIVE PDIP N 16 25 Pb-Free CU NIPDAU N / A for Pkg Type
(RoHS)
SN74HC166NE4 ACTIVE PDIP N 16 25 Pb-Free CU NIPDAU N / A for Pkg Type
(RoHS)
SN74HC166NSR ACTIVE SO NS 16 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HC166NSRE4 ACTIVE SO NS 16 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HC166NSRG4 ACTIVE SO NS 16 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HC166PW ACTIVE TSSOP PW 16 90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HC166PWE4 ACTIVE TSSOP PW 16 90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HC166PWG4 ACTIVE TSSOP PW 16 90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HC166PWR ACTIVE TSSOP PW 16 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HC166PWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HC166PWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 15-Oct-2009
Orderable Device Status (1) Package Package Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Type Drawing Qty
no Sb/Br)
SN74HC166PWT ACTIVE TSSOP PW 16 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HC166PWTE4 ACTIVE TSSOP PW 16 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74HC166PWTG4 ACTIVE TSSOP PW 16 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SNJ54HC166FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54HC166J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 19-Mar-2008
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 19-Mar-2008
Pack Materials-Page 2
MECHANICAL DATA
0,38
0,65 0,15 M
0,22
28 15
0,25
0,09
5,60 8,20
5,00 7,40
Gage Plane
1 14 0,25
A 0°–ā8° 0,95
0,55
Seating Plane
PINS **
14 16 20 24 28 30 38
DIM
4040065 /E 12/01
NO. OF A B
18 17 16 15 14 13 12
TERMINALS
** MIN MAX MIN MAX
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
4040140 / D 10/96
0,30
0,65 0,10 M
0,19
14 8
0,15 NOM
4,50 6,60
4,30 6,20
Gage Plane
0,25
1 7
0°– 8°
A 0,75
0,50
Seating Plane
PINS **
8 14 16 20 24 28
DIM
4040064/F 01/97
www.ti.com 24-Aug-2018
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
5962-9050101Q2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
9050101Q2A
SNJ54HC
166FK
5962-9050101QEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9050101QE
A
SNJ54HC166J
5962-9050101VEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9050101VE
A
SNV54HC166J
SN54HC166J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54HC166J
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 24-Aug-2018
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
9050101Q2A
SNJ54HC
166FK
SNJ54HC166J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9050101QE
A
SNJ54HC166J
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com 24-Aug-2018
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com 20-Dec-2018
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 20-Dec-2018
Pack Materials-Page 2
PACKAGE OUTLINE
PW0016A SCALE 2.500
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
SEATING
PLANE
6.6 C
TYP
A 6.2
0.1 C
PIN 1 INDEX AREA
14X 0.65
16
1
2X
5.1 4.55
4.9
NOTE 3
8
9
0.30
4.5 16X 1.2 MAX
B 0.19
4.3
NOTE 4 0.1 C A B
(0.15) TYP
SEE DETAIL A
0.25
GAGE PLANE
0.15
0.05
0.75
0.50
0 -8
DETAIL A
A 20
TYPICAL
4220204/A 02/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.
www.ti.com
EXAMPLE BOARD LAYOUT
PW0016A TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
SYMM
14X (0.65)
8 9
(5.8)
4220204/A 02/2017
NOTES: (continued)
www.ti.com
EXAMPLE STENCIL DESIGN
PW0016A TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
SYMM
14X (0.65)
8 9
(5.8)
4220204/A 02/2017
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
MECHANICAL DATA
0,38
0,65 0,15 M
0,22
28 15
0,25
0,09
5,60 8,20
5,00 7,40
Gage Plane
1 14 0,25
A 0°–ā8° 0,95
0,55
Seating Plane
PINS **
14 16 20 24 28 30 38
DIM
4040065 /E 12/01
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IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
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