QPA9501

®
3-Stage LTE-U/LAA Power Amplifier

General Description
The QPA9501 is high power amplifier module containing an
internally matched 3-stage PA, compensated DC biasing
circuit and output power detector. This PA module is
optimized for the WiFi bands from 5.1-5.9GHz and hence
well suited for LTE-U/LAA applications. It provides high
gain (32 dB) and -47dBc ACLR at Pout of 22dBm with a
20MHz LTE signal without any DPD. 4 x 4 mm 20-pin Leadless QFN Package

The QPA9501 features chipset logic compatible control

voltages and buffered PA enable pin (PAEN) all of which Product Features
draw very low current to facilitate ease of use and
compatibility with current and future transceiver • 4.9 GHz to 5.9 GHz Operational Bandwidth
generations. With its optimized power dissipation, this • Fully Integrated Power Amplifier Module With Power
amplifier module is well suited for implementation into next Detector
generation MIMO configurations and well designed to work • Internally Matched Input / Output
with or without digital pre-distortion (DPD). • -47dBc ACLR with Pout = 22dBm avg
The QPA9501 is assembled in a small footprint 4.0 x 4.0 x • Temperature Compensated Bias Network
0.85 mm 20-pin QFN package. • High Gain = 32 dB
• Integrated CMOS Compatible Logic and Shutdown
• Supply Voltage: +3.3 V to +5.0 V
• Leadless 4.0 x 4.0 x 0.85 mm Pb-Free QFN Package

Functional Block Diagram Applications

• 5G, Pre-5G Small Cell BTS
Pin 1 Reference Mark
•
Vcc1

Vcc2

Vcc3

GND

GND

LTE-U/LAA
20 19 18 17 16
• WiFi Access Points and Small Cells
1
• Telematics
NC 15 GND
DC Biasing/
Control Circuit
• Point-to-point and Backhaul
GND 2 14 GND
• ISM Band
RFIN 3 13 RFOUT

GND 4 12 GND

PA_EN 5 11 GND

6 7 8 9 10
NC

DET_ALT

NC

Vcc3

DET

Backside Paddle
RF/DC GND

Ordering Information
Top View
Part No. Description
QPA9501TR13 2,500 pieces on a 13” reel (standard)
QPA9501PCB401 Evaluation Board

Datasheet, Rev. J, June 26, 2020 | Subject to change without notice - 1 of 10 - www.qorvo.com
 QPA9501
®
3-Stage LTE-U/LAA Power Amplifier

Absolute Maximum Ratings Recommended Operating Conditions

Parameter Rating Parameter Min Typ Max Units
Storage Temperature −40 to 150 °C VCC1, VCC2, VCC3 +3.15 +5 +5.5 V
RF Input Power, CW, 50 Ω, T = 25 °C +5 dBm TAMB −40 25 +105 °C
Device Voltage +6.0 V Tj (for>106 hours MTTF) 170 °C
Exceeding any one or a combination of the Absolute Maximum Rating Electrical specifications are measured at specified test conditions.
conditions may cause permanent damage to the device. Extended Specifications are not guaranteed over all recommended operating
application of Absolute Maximum Rating conditions to the device may conditions.
reduce device reliability.

Electrical Specifications
Parameter Conditions(1) Min Typ Max Units
Operational Freq. Range 4900 5900 MHz
4900 MHz 33.6 dB
Small Signal Gain 5200 MHz 30 34 36 dB
5800 MHz 29.5 32 36 dB
Input Return Loss 5800 MHz 10 dB
Output Return Loss 8 dB
4900 MHz 6.0 %
Power Added Efficiency (2) 5200 MHz 5.5 6.2 %
5800 MHz 5.5 6.5 %
4900 MHz -46 dBc
ACLR (2) 5200 MHz -47 -45 dBc
5800 MHz -48 -45 dBc
4900 MHz +31.1 dBm
P1dB 5200 MHz +29.5 +31.8 dBm
5800 MHz +29.5 +33 dBm
Noise Figure 7 dB
Rise/Fall Time (3) 0.4 0.8 us
Input Voltage for High State +1.8 +3.0 VCC1
PA Enable Voltage V
Input Voltage for Low State 0 +0.45
PA Enable Current 100 μA
Icq Total current with no RF 250 350 450 mA
Icc Operating current with Pout = 22dBm 450 520 650 mA
TX Shut Down Current PA_EN= Low, No RF 8 μA
No RF +0.25 +0.35 +0.40
Detector Voltage V
Pout = +22 dBm +0.68
Pout = +28 dBm, All non-harmonically related
Stability -
VSWR = 6:1, all phases outputs < –50 dBc/100 kHz
Thermal Resistance, θjc Junction to backside paddle 17 °C/W
Notes:
1. Test conditions unless otherwise noted: VCC1 = VCC2 = VCC3 = +5.0 V, PA Enable High = 3.0 V. Temp. = +25 °C
2. Pout = 22dBm average, 20MHz LTE, PAR 9.5dB
3. Maximum specification listed is guaranteed be design. Not tested in production.

Datasheet, Rev. J, June 26, 2020 | Subject to change without notice - 2 of 10 - www.qorvo.com
 QPA9501
®
3-Stage LTE-U/LAA Power Amplifier

Timing Diagram

Transmit Timing Diagram

RF/DC Power On/Off Sequence

V CC

PA-EN

RF On
TX RF Signal
RF OFF

Time

Td ≥ 1 us
Td Td Td Td

Notes: DC and RF signal levels per data sheet specification.

Observe the timing sequence shown in the diagram above and described below.
 Apply VCC prior to turning on or pulsing PA enable.
 Turn off PA enable prior to turning off VCC.

 Turn on PA enable prior to applying RF signal.

 Turn off RF signal prior to turning off PA enable.

Logic Truth Table

PA Mode PA_EN
Disabled Low
Enabled High

Datasheet, Rev. J, June 26, 2020 | Subject to change without notice - 3 of 10 - www.qorvo.com
 QPA9501
®
3-Stage LTE-U/LAA Power Amplifier

Evaluation Board

J3-10
J3-4

J3-7

J3-8

J3-9
J3-1

J3-2

J3-3

J3-5

J3-6
GND

GND

GND

Vcc3
Vcc1

GND

GND
PA_EN

Vcc2

VDET
R2 R3 C2 C11
0 0 220pF 10uF
R8 C8
0 10uF C10
R7
220pF
27 
Only for 5V operation. For lower C9
220pF R4
Vcc, R7 = 0  R5 R6
C7 27.4K
C6 0.1uF 2 2
0.1uF
R2
R8
R3
R7

20 19 18 17 16
C8

Vcc1

GND
Vcc2

Vcc3

GND
C7

C6 C9 R5
1 15
NC GND
J1 C1 U1 J2
2 14
GND GND

J1 J2
U1
C10

R4
C2

3
C11

13
RF_IN 4X4_20-pin RF_OUT
C1
RF 10pF RF
R6

Input 4 Output
GND 12
GND

5
PA_EN 11
GND

DET_ALT

Vcc3

DET
NC
NC
6 7 8 9 10

Bill of Material  –  QPA9501PCB401

Reference Des. Value Description Manuf. Part Number
n/a n/a Printed Circuit Board Qorvo 1099541
U1 n/a High Power 5GHz PA Qorvo QPA9501
R2, R8, R3 0Ω Resistor, Chip, 0402, 5% various
C1 10 pF Capacitor, Chip, 0402, 5% various
C6, C7 0.1 uF Capacitor, Chip, 0402, 10% various
C8, C11 10 uF Capacitor, Chip, 0402, 10% various
C9, C10, C2 220 pF Capacitor, Chip, 0402, 10% various
R7 (1) 0 to 27 Ω Resistor, Chip, 0402, 5%, 1/10W various
R5, R6 (2) 2Ω Resistor, Chip, 0402, 5%, 1/16W various
R4 27.4 KΩ Resistor, Chip, 0402, 5%, 1/16W various

Datasheet, Rev. J, June 26, 2020 | Subject to change without notice - 4 of 10 - www.qorvo.com
 QPA9501
®
3-Stage LTE-U/LAA Power Amplifier

Performance Plots
ise noted: VCC1 = VCC2 = VCC3 = +5.0 V, PA_EN = +3.0V, Temp. = +25 °C

Wideband Gain vs. Frequency Input Return Loss vs. Frequency Output Return Loss vs. Frequency
40 0 0

+85 °C
+25 °C
30 -4 +85°C -4
−40 °C +85 °C
+25°C +25 °C
−40°C −40 °C

|S11| (dB)
20 -8 -8

|S22| (dB)
Gain (dB)

10 -12 -12

0 -16 -16

-10 -20 -20

3.8 4.2 4.6 5 5.4 5.8 6.2 6.6 7 7.4 7.8 4.8 5 5.2 5.4 5.6 5.8 6 4.8 5 5.2 5.4 5.6 5.8 6
Frequency (GHz) Frequency (GHz) Frequency (GHz)

ACLR vs Pout PAE vs Pout Vdet vs. Output Power

-33 22 1.0
LTE 20MHz signal, PAR = 9.5dB LTE 20MHz signal, PAR = 9.5dB
-35 20 5855 MHz
0.9
-37 18 5500 MHz
5200 MHz
-39 16 0.8
-41 14
ACLR (dBc)

Vdet (V)
0.7
PAE (%)

-43 12
-45 10 0.6
-47 8
5200 MHz 5200 MHz 0.5
-49 6
5500 MHz 5500 MHz
-51 5800 MHz 4 5800 MHz
0.4
-53 2
-55 0 0.3
16 17 18 19 20 21 22 23 24 25 26 27 28 29 16 17 18 19 20 21 22 23 24 25 26 27 28 29 0 4 8 12 16 20 24 28
Pout (dBm) Pout (dBm) Output Power (dBm)

ACPR vs Pout ACPR vs Pout ACPR vs Pout

-30 -30 -30
Frequency = 5200 MHz Frequency = 5500 MHz Frequency = 5800 MHz
20MHz LTE signal, PAR=9.5dB 20MHz LTE signal, PAR=9.5dB +105°C 20MHz LTE signal, PAR=9.5dB +105°C
+85°C +85°C
-35 -35 +25°C -35 +25°C
−40°C −40°C
ACPR (dBc)

ACPR (dBc)

ACPR (dBc)

-40 -40 -40

-45 -45 -45

+105°C
+85°C
-50 +25°C -50 -50
−40°C

-55 -55 -55

16 17 18 19 20 21 22 23 24 25 26 27 28 16 17 18 19 20 21 22 23 24 25 26 27 28 16 17 18 19 20 21 22 23 24 25 26 27 28
Pout (dBm) Pout (dBm) Pout (dBm)

PAE vs Pout
18
Frequency = 5800 MHz
16 20MHz LTE signal, PAR=9.5dB

14

12
PAE (%)

10

6
-40degC
4 25degC
85degC
2 105degC

0
16 17 18 19 20 21 22 23 24 25 26 27 28
Pout (dBm)

Datasheet, Rev. J, June 26, 2020 | Subject to change without notice - 5 of 10 - www.qorvo.com
 QPA9501
®
3-Stage LTE-U/LAA Power Amplifier

Pin Configuration and Description

Pin 1 Reference Mark

Vcc1

Vcc2

Vcc3

GND

GND
20 19 18 17 16

NC 1 15 GND
DC Biasing/
Control Circuit
GND 2 14 GND

RFIN 3 13 RFOUT

GND 4 12 GND

PA_EN 5 11 GND

6
NC 7 8 9 10

DET_ALT

NC

Vcc3

DET
Backside Paddle
RF/DC GND

Pin No. Label Description

1 NC No internal connection. This pin can be grounded or N/C on PCB.
2 GND Ground
3 RF_IN RF Input
4 GND Ground
5 PA_EN PA Enable
6 NC No internal connection. This pin can be grounded or N/C on PCB.
7 DET_ALT Alternate Detector Output
8 NC No internal connection. This pin can be grounded or N/C on PCB.
9 VCC3 Supply voltage for third stage PA
10 DET Detector Output
11 GND Ground
12 GND Ground
13 RF_OUT RF Output
14 GND Ground
15 GND Ground
16 GND Ground
17 GND Ground
18 VCC3 Supply voltage for third stage PA
19 VCC2 Supply voltage for second stage PA
20 VCC1 Supply voltage for first stage PA
RF/DC ground. Use recommended via pattern to minimize inductance and
Backside Paddle RF/DC GND
thermal resistance. See PCB Mounting Pattern for suggested footprint.

Datasheet, Rev. J, June 26, 2020 | Subject to change without notice - 6 of 10 - www.qorvo.com
 QPA9501
®
3-Stage LTE-U/LAA Power Amplifier

Package Marking and Dimensions

0.85±0.05
4.00 A
(0.203)
B (0.250) 2.50
PIN 1 INDICATOR
(0.03) PIN # 1 I.D.
3x (R0.10) (0.30X45°)

9501 4.00
2.50

Trace Code
20x 0.25 R0.05

0.10 A B C
0.05 C 0.10 C

0.10 C A B
SEATING PLANE 20x 0.50 0.50

Notes:
1. All dimensions are in millimeters.

PCB Mounting Pattern

4.40
2.70
.500 .350 .500 .250
.25 .800 .700

.700

4.400 2.700 4.500 2.500 4.400

.200
.200 1.00
.508

.508
2.500 .200
.500
4.500 1.00

BOARD METAL & VIA PATTERN SOLDER MASK STENCIL APERATURE

TOP VIEW TOP VIEW TOP VIEW (NOTE 4)

Notes:
1. All dimensions are in millimeters. Angles are in degrees.
2. Use 1 oz. copper minimum for top and bottom layer metal.
3. Via holes are required under the backside paddle of this device for proper RF/DC grounding and thermal dissipation. We
recommend a 0.35mm (#80/.0135") diameter bit for drilling via holes and a final plated thru diameter of 0.25 mm (0.01”).
4. Ensure good package backside paddle solder attach for reliable operation and best electrical performance.

Datasheet, Rev. J, June 26, 2020 | Subject to change without notice - 7 of 10 - www.qorvo.com
 QPA9501
®
3-Stage LTE-U/LAA Power Amplifier

Tape and Reel Information – Carrier and Cover Tape Dimensions

Feature Measure Symbol Size (in) Size (mm)

Length A0 0.171 4.35
Width B0 0.171 4.35
Cavity
Depth K0 0.051 1.30
Pitch P1 0.315 8.00
Cavity to Perforation - Length Direction P2 0.079 2.00
Centerline Distance
Cavity to Perforation - Width Direction F 0.217 5.50
Cover Tape Width C 0.362 9.20
Carrier Tape Width W 0.472 12.0

Datasheet, Rev. J, June 26, 2020 | Subject to change without notice - 8 of 10 - www.qorvo.com
 QPA9501
®
3-Stage LTE-U/LAA Power Amplifier

Tape and Reel Information – Reel Dimensions

Standard T/R size = 2,500 pieces on a 13” reel.

Feature Measure Symbol Size (in) Size (mm)

Diameter A 12.992 330.00
Flange Thickness W2 0.717 18.20
Space Between Flange W1 0.504 12.80
Outer Diameter N 4.016 102.00
Arbor Hole Diameter C 0.512 13.00
Hub
Key Slit Width B 0.079 2.00
Key Slit Diameter D 0.787 20.00

Tape and Reel Information – Tape Length and Label Placement

Notes:
1. Empty part cavities at the trailing and leading ends are sealed with cover tape. See EIA 481-1-A.
2. Labels are placed on the flange opposite the sprockets in the carrier tape.

Datasheet, Rev. J, June 26, 2020 | Subject to change without notice - 9 of 10 - www.qorvo.com
 QPA9501
®
3-Stage LTE-U/LAA Power Amplifier

Handling Precautions
Parameter Rating Standard
ESD – Human Body Model (HBM) Class 1C ESDA / JEDEC JS-001-2012 Caution!
ESD – Charged Device Model (CDM) Class C3 JEDEC JESD22-C101F ESD-Sensitive Device
MSL – Moisture Sensitivity Level Level 1 IPC/JEDEC J-STD-020

Solderability
Compatible with both lead-free (260°C max. reflow temp.) and tin/lead (245°C max. reflow temp.) soldering processes.
Solder profiles available upon request.
Contact plating: NiPdAu

RoHS Compliance
This part is compliant with the 2011/65/EU RoHS directive (Restrictions on the Use of Certain Hazardous Substances in Electrical and
Electronic Equipment), as amended by Directive 2015/863/EU. This product also has the following attributes:
• Lead Free
• Halogen Free (Chlorine, Bromine)
• Antimony Free
• TBBP-A (C15H12Br402) Free
• PFOS Free
• SVHC Free
• Qorvo Green

Contact Information
For the latest specifications, additional product information, worldwide sales and distribution locations:
Web: www.qorvo.com
Tel: 1-844-890-8163
Email: [email protected]

Important Notice
The information contained herein is believed to be reliable; however, Qorvo makes no warranties regarding the information contained
herein and assumes no responsibility or liability whatsoever for the use of the information contained herein. All information contained
herein is subject to change without notice. Customers should obtain and verify the latest relevant information before placing orders for
Qorvo products. The information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any
patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything described by
such information. THIS INFORMATION DOES NOT CONSTITUTE A WARRANTY WITH RESPECT TO THE PRODUCTS DESCRIBED
HEREIN, AND QORVO HEREBY DISCLAIMS ANY AND ALL WARRANTIES WITH RESPECT TO SUCH PRODUCTS WHETHER
EXPRESS OR IMPLIED BY LAW, COURSE OF DEALING, COURSE OF PERFORMANCE, USAGE OF TRADE OR OTHERWISE,
INCLUDING THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE.
Without limiting the generality of the foregoing, Qorvo products are not warranted or authorized for use as critical components in medical,
life-saving, or life-sustaining applications, or other applications where a failure would reasonably be expected to cause severe personal
injury or death.
Copyright 2019 © Qorvo, Inc. | Qorvo is a registered trademark of Qorvo, Inc.

Datasheet, Rev. J, June 26, 2020 | Subject to change without notice - 10 of 10 - www.qorvo.com