Academic Program

Learn Thermal Analysis with

Altair OptiStruct

1
Released 2nd Edition 05/2019
Image on front page: Courtesy of Mr. Prajay Solanki (Altair UK)

2
Table of Contents

1 About This Book ................................................................................................ 5

Acknowledgement ................................................................................................... 9
Disclaimer............................................................................................................... 10
2 Introduction to Heat Transfer .......................................................................... 11
3 Thermal Materials used in OptiStruct............................................................... 19
4 Thermal Loads and Boundary Conditions ......................................................... 25
4.1 Volumetric Heat Generation ............................................................................ 27
4.2 Heat Flux .......................................................................................................... 29
4.3 Imposed Temperature ..................................................................................... 32
4.4 Free Convection ............................................................................................... 34
4.5. Time-dependent Thermal Loading (transient analysis) .................................. 38
4.5.1. Load history card TLOADi ............................................................................. 38
4.5.2. Initial Conditions .......................................................................................... 40
5 Thermal Results .............................................................................................. 41
6 Steady State Heat Transfer Analysis ................................................................. 45
6.1 Linear Steady State Heat Transfer Analysis ..................................................... 45
6.1.1 Tutorial: Linear Steady State Heat Transfer Analysis .................................... 46
6.2 Coupled Thermal Structural Analysis ............................................................... 55
6.2.1 Tutorial: Coupled Linear Heat Transfer/Structure Analysis .......................... 57
6.3 Nonlinear Steady State Heat Transfer Analysis ............................................... 67
6.3.1 Tutorial: Nonlinear Steady State Heat Transfer Analysis .............................. 69
7 Transient Heat Transfer Analysis...................................................................... 77
7.1 Linear Transient Heat Transfer Analysis .......................................................... 77
7.1.1 Tutorial: Linear Transient Heat Transfer Analysis ......................................... 80
7.2 One Step Transient Thermal Stress Analysis .................................................... 88
7.2.1 Tutorial: One-Step Transient Thermal Stress Analysis .................................. 91
7.3 Nonlinear Transient Heat Transfer Analysis .................................................. 100
8 Contact-Based Thermal Analysis .................................................................... 103
8.1 Iterative Solver ............................................................................................... 104

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 8.2 Thermal Contact Properties ........................................................................... 105
8.3 Thermal Contact without Static Analysis ....................................................... 110
8.4 Contact-Based Thermal-Structural Analysis Setup ........................................ 110
8.5 Tutorial: Setting up Thermal Contacts for the Bolted Pipe Flange Model ..... 111
9 Additional Industry Examples ........................................................................ 122
9.1 Heat Sink: Steady State Thermal Analysis ...................................................... 122
9.2 Engine Block: Heat Transfer Analysis ............................................................. 124
9.3 Brake Disc: Coupled Linear Heat Transfer and Structural Analysis................ 126
9.4 Extended Surface Fin: Linear Transient Heat Transfer Analysis .................... 128
9.5 Aluminium Bar: Nonlinear One-Step Transient Thermal Analysis ................. 131
9.6 Exhaust Manifold: One Step Thermal Transient Stress Analysis.................... 133
9.7 Manifold: Nonlinear Transient Heat Transfer ................................................ 135
9.8 Piston Ring: Heat Transfer Analysis with GAP Elements ................................ 137
10 Appendix .................................................................................................... 139
10.1 Card Images Summary Table........................................................................ 139
10.2 Thermal Expansion Coefficient Support for Rigid Elements ........................ 142
10.3 Tools Menu to set up Convection Load and Heat Transfer Analysis ........... 143
10.4 Clearance Based Conductance Table for HEAT Subcases ............................ 144
10.5 Thermal Stress Steady State Analysis .......................................................... 145
10.6 Debugging for Heat Transfer Analysis.......................................................... 146
10.7 OptiStruct Online Tutorials List .................................................................... 147

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1 About This Book
This study guide aims to provide a fundamental to advanced approach into the
exciting and challenging world of Structural Analysis. The focus will be on aspects of
Thermal Analysis. As with our other eBooks we have deliberately kept the
theoretical aspects as short as possible.
The Finite Element Program used in this book is Altair OptiStruct. OptiStruct® is an
industry proven, modern structural analysis solver for linear and nonlinear structural
problems under static, dynamic, and thermal loads. OptiStruct is used by thousands
of companies worldwide to analyse and optimize structures and mechanical systems
for strength, durability, noise and vibrations, heat transfer, as well as impact. In this
eBook, we will describe in some detail, how to perform a thermal analysis including:

• Linear steady state thermal analysis

• Nonlinear steady state thermal analysis
• Sequentially coupled thermal-structural analysis
• Linear transient thermal analysis
• Nonlinear transient thermal analysis
• One step transient thermal stress analysis
• Contact-based thermal analysis
Please note that a commercially released software is a living “thing” and so at every
release (major or point release) new methods, new functions are added along with
improvement to existing methods. This document is written using OptiStruct
2017.2.3. Any feedback helping to improve the quality of this book would be very
much appreciated.

Thank you very much.

Dr. Matthias Goelke
On behalf of the Altair University Team

5
Model Files
The models referenced in this book can be downloaded from here or from the
website. NOTE: The model files are based on HyperWorks Student Edition 2017.

Software
Obviously, to practice the “Thermal Analysis Tutorial and Industry Example” you
need to have access to the Student Edition (or the full version). As a student, you
are eligible to download and install the free Student Edition:

https://altairuniversity.com/free-altair-student-edition/

Support
In case you encounter issues (during installation
and also on how to utilize OptiStruct) post your
question in the moderated Support Forum
https://forum.altair.com It’s an active forum
with several thousands of posts – moderated by
Altair experts!

6
Free eBooks
In case you are interested in more details about the “things” happening in the
background we recommend our free eBooks https://altairuniversity.com/free-
ebooks-2

7
Moreover, many different eLearning courses are available for free in the Learning &
Certification Program

For OptiStruct Thermal Analysis, the prerequisite (or recommended) course is::

Learn Structural Analysis with OptiStruct

https://certification.altairuniversity.com/course/view.php?id=71

You may also find the following eLearning course helpful:

Learn Thermal Analysis with OptiStruct

https://certification.altairuniversity.com/course/view.php?id=101

8
Acknowledgement

A very special Thank You goes to all the many colleagues who contributed in
different ways:
• Gabriel Stankiewicz for creating and testing various chapters contained in this
eBook. Rahul Rajan for adding industry examples, appendix and organizing
eBook chapters.
• Rahul Ponginan and Premanand Suryavanshi for reviewing the book. For sure,
your feedback and suggestions had a significant impact on the “shape” and
content of this book.
• Junji Saiki, Xueyong Qu and Ujwal Patnaik from HyperWorks Core
Development.
• Aditya Jayanthi for using his brake example.
• Mike Heskitt, Sean Putman & Dev Anand for all the support.
• The entire OptiStruct Documentation team for putting together 1000’s of pages
of documentation and recently released OptiStruct verification and example
section.
• Lastly, the OptiStruct Development team deserves huge credit for their passion
& dedication! It is so exciting to see how OptiStruct has evolved throughout the
last couple of years.

Thank you very much.

Your Altair University Team

9
Disclaimer
Every effort has been made to keep the book free from technical as well as other mistakes.
However, publishers and authors will not be responsible for loss, damage in any form and
consequences arising directly or indirectly from the use of this book.
© 2019 Altair Engineering, Inc. All rights reserved. No part of this publication may be reproduced,
transmitted, transcribed, or translated to another language without the written permission of Altair
Engineering, Inc. To obtain this permission, write to the attention Altair Engineering legal
department at:

1820 E. Big Beaver, Troy, Michigan, USA, or call +1-248-614-2400.

10
2 Introduction to Heat Transfer
From a physical point of view, what is Heat Transfer?

Heat transfer is the exchange of thermal energy between physical systems,

depending on the temperature and pressure, by dissipating heat. The fundamental
modes of heat transfer are conduction or diffusion, convection and radiation.

Heat transfer always occurs from a region of high temperature to another region of
lower temperature. Heat transfer changes the internal energy of both systems
involved according to the First Law of Thermodynamics. The Second Law of
Thermodynamics defines the concept of thermodynamic entropy, by measurable
heat transfer.

Thermal equilibrium is reached when all involved bodies and the surroundings reach
the same temperature. Thermal expansion is the tendency of matter to change in
volume in response to a change in temperature.

The first law of thermodynamics is a version of the law of conservation of energy,

adapted for thermodynamic systems. The law of conservation of energy states that
the total energy of an isolated system is constant; energy can be transformed from
one form to another but cannot be created or destroyed.

The second law of thermodynamics states that every natural thermodynamic

process proceeds in the sense in which the sum of the entropies of all bodies taking
part in the process is increased. In the limiting case, for reversible processes this sum
remains unchanged.

Thermal analysis is a branch of materials science where the properties of materials

are studied as they change with temperature.

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 Modes of Heat Transfer

Conduction Convection Radiation

Natural Forced
Steady Unsteady Specular Diffuse
Convection Convection
State State
Conduction Conduction

Practical applications: Engine, Radiator, Exhaust Sy

stem, Heat exchangers, Power plants, Satellite design etc.

According to the types of FEA Methods, Thermal Analysis may be divided into
two categories:

1. Steady State Thermal Analysis

2. Transient Thermal Analysis

There are many heat transfer solutions supported in OptiStruct

• Linear steady state thermal analysis

Steady
• Nonlinear steady state thermal analysis State
• Sequentially coupled thermal-structural
analysis
• Linear transient thermal analysis Transient
• Nonlinear transient thermal analysis
• One step transient thermal Stress analysis
• Contact-based thermal analysis

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Conduction

Conduction is the transfer of heat between substances that are in direct contact with
each other. The better the conductor, the more rapidly heat will be transferred.
Metal is a good conductor of heat. Conduction occurs when a substance is heated,
particles will gain more energy, and vibrate more. These molecules then bump into
nearby particles and transfer some of their energy to them. This then continues, and
energy is hence passed from the hot end down to the colder end of the substance.

Key facts about conduction:

• Conduction takes place in solids due to lattice vibration, in liquids and gases due
to molecular collision.
• Particles do not change their position in structure.
• Heat is transferred due to direct molecular collisions (a physical contact).

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 • Particles with higher speeds collide with low speed particles, transferring some
part of the energy to them.

Fourier’s law governs conduction heat transfer. Fourier proved by experiments, that
heat transfer rate is proportional to area and temperature difference and inversely
proportional to thickness.

Q = -kA*[DT/DX]

Where
Q = Heat transfer rate (W)
A = Area (m2)
DT = Temperature differential (°C/°K/°R)
DX = thickness (m)

k = Thermal conductivity (W/m°K)

The bracketed term is called temperature gradient, it’s been assigned with negative
sign since the temperature gradient vector is in opposite direction of heat flow as
shown below.

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Convection

Thermal energy is transferred from hot places to cold places by convection.

Convection occurs when warmer areas of a liquid or gas rise to cooler areas in the
liquid or gas. Cooler liquid or gas then takes the place of the warmer areas which
have risen higher. This results in a continuous circulation pattern. Water boiling in a
pan is a good example of these convection currents. Another good example of
convection is in the atmosphere. The earth's surface is warmed by the sun, the warm
air rises, and cool air moves in.

Key facts about convection:

• Opposed to conduction, convection is a movement of particles with high

thermal energy.
• Convection takes place in fluids, as it allows particles displacement.
• Usually convection occurs in the vertical direction, towards higher altitudes.
This is because warmer areas of a fluid increase their volume (more space to
vibrate) and therefore are lighter, causing colder areas to fall below and push
them upwards.
• Convection can be either natural or forced (enforced by e.g. by a rotating fan)

Basic governing equation is Newton’s Law of Cooling:

𝑄𝑄 = ℎ𝐴𝐴(𝑇𝑇𝑠𝑠 − 𝑇𝑇𝑓𝑓 )

Where
Q – Heat transfer rate (W)
h – Heat transfer coefficient (convection coefficient) (W/m2°K)
A – Surface area (m2)

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 Ts – Surface temperature (°C,°K)
Tf – Fluid temperature (°C,°K)

Examples of convection:

• The hottest air is exactly above the bonfire

• Water evaporates in the vertical direction when boiling
• Air flow in intake system of the engine (forced convection)

Radiation

Radiation is a method of heat transfer that does not rely upon any contact between
the heat source and the heated object as is the case with conduction and convection.
Heat can be transmitted though empty space by thermal radiation often called
infrared radiation. This is a type electromagnetic radiation. No mass is exchanged,
and no medium is required in the process of radiation. Examples of radiation is the
heat from the sun, or heat released from the filament of a light bulb.

Key facts about radiation:

• Radiation is a phenomenon of electromagnetic waves emission

• The frequency of emitted waves is proportional to emissive body
temperature
• Radiation occurs through vacuum or transparent medium.
• Emitted electromagnetic waves are a direct result of particle vibrations
• All objects with temperature above 0°K radiate

Stefan-Boltzmann law is used for calculating radiation emitted by an object to

its temperature.

𝐸𝐸 = 𝜎𝜎𝜎𝜎𝜎𝜎(𝑇𝑇1 − 𝑇𝑇2 )4

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Where
E = total amount of radiation emitted by an object per square meter (W/m²)
σ = Stefan-Boltzmann constant = 5.67 * 10e-8 (W/(m²*°K4))
ε = Emissivity of the body
T1 & T2 are the temperatures of the objects in °K

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18
3 Thermal Materials used in
OptiStruct
Material for thermal analysis is defined through MAT4 or MAT5 card image, which
can be extended with MATT4 or MATT5 entries.

When to use which material model?

MAT4 Thermally isotropic material or isotropy can be assumed.

MAT4+MATT4 Additionally: conductivity scalar is temperature-dependent

Thermally anisotropic material & conductivity matrix entries are

MAT5
known.

MAT5+MATT5 Additionally: conductivity matrix is temperature-dependent.

Thermal-Structural coupled analysis. MAT4/5 here is an extension

MAT1+MAT4/5
to MAT1 card.

The MAT4 card defines constant thermal material properties for isotropic materials

(1) (2) (3) (4) (5) (6) (7) (8) (9) (10)

K H
MAT4 MID CP RHO HGEN
Where:
Material identification number. Can be shared with structural material
MID properties (MAT1, MAT2, MAT8, MAT9, and MGASK)

K Thermal conductivity

CP Heat capacity per unit mass (specific heat)

RHO Density

H Free convection heat transfer coefficient

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 Heat generation capability used with QVOL entries. HGEN is the scale
HGEN factor and QVOL is the power generated per unit volume, Pin = volume

* HGEN * QVOL

• K (Thermal conductivity)

Thermal conductivity is a material constant defining the ability to transfer heat by

conduction. SI units are (W/m°K) or (J/m*s*°K). Which means that when the
conductivity is equal to 1, it transfers 1J of thermal energy in 1 second through the
distance of 1m, if the temperature difference between its ends is 1°K.

• CP (Specific heat capacity)

In shortest words, this is the ability to heat the material. It tells us the amount of heat
that is needed to raise the temperature of 1 kg of this material by 1°K. SI units (J/kg°K)

• RHO (density of the material)

Must be defined when specific heat capacity is defined, as it refers to mass of the
component.

• H (Heat Transfer Coefficient or Free Convection Coefficient)

This material constant is used to describe ability of the material (fluid) to transfer heat
by means of convection. SI units are (W/m²°K) or (J/sm²°K), which tell us what amount
of heat flux (W/m²) is transferred when temperature difference is 1°K. Or
alternatively: how much energy (J) is transferred through 1 m² of area in 1 second,
when the temperature difference between both sides of the area is 1°K.

20
The MAT5 card defines constant thermal material properties for anisotropic
materials

(1) (2) (3) (4) (5) (6) (7) (8) (9) (10)
MAT5 MID KXX KXY KXZ KYY KYZ KZZ CP

RHO HGEN
Where,

Material identification number. Can be shared with structural material

MID
properties (MAT1, MAT2, MAT8, MAT9, and MGASK)

Kij Thermal conductivity matrix values

CP Heat capacity per unit mass (specific heat)

RHO Density

Heat generation capability used with QVOL entries. HGEN is the scale
HGEN factor and QVOL is the power generated per unit volume, Pin = volume *
HGEN * QVOL

The thermal conductivity matrix has the following form:

Heat capacity (CP) is defined per unit mass. It is multiplied by density (RHO) to
calculate heat capacity matrix in transient heat transfer analysis. If RHO is not
defined on MAT5, then positive density from a structural material entry with
matching MID is used. If MAT5 does not have a corresponding matching structural
material, then the default value of 1.0 is used.

21
The MATT4 card defines temperature-dependent material properties for the
corresponding MAT4 bulk data entry fields via TABLEMi entries

(1) (2) (3) (4) (5) (6) (7) (8) (9) (10)
MATT4 MID T(K)
Where:

Material identification number. Can be shared with structural material

MID
properties (MAT1, MAT2, MAT8, MAT9, and MGASK)

T(K) Temperature-dependent thermal conductivity TABLEMi ID number

Tip: Constant thermal conductivity defined in MAT4 is multiplied by this tabular

function to generate temperature dependent thermal conductivity. If T(K) field is
blank or zero, the constant thermal conductivity defined in MAT4 is used.

The MATHE card defines material properties for nonlinear hyperelastic materials

(1) (2) (3) (4) (5) (6) (7) (8) (9) (10)

MATHE MID Model NU RHO TEXP TREF

C10 C01 D1 TAB1 TAB2 TAB4 TABD

C20 C11 C02 D2 NA ND

C30 C21 C12 C03 D3

C40 C31 C22 C13 C04 D4

C50 C41 C32 C23 C14 C05 D5

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NOTE: One can also use nonlinear hyperelastic materials such as MATHE card, which
provides the option to define linear thermal expansion coefficient, to carry out
Thermal Analysis. MATHE card information covered in detail in OptiStruct Nonlinear
Analysis FEA guide.

MAT1+MAT4 extension or MAT1+MAT5 extension

Material for thermal-structural coupled analysis is defined through structural

material entry MAT1, with all the structural parameters and additional extension for

MAT4 checked, which contains the same parameters as MAT4 card described above.
RHO parameter is repeated and needs to be defined in both entries, since the one
from MAT1 is used for structural part of the analysis and the one in MAT4 extension
is used for thermal part of the analysis.

A – thermal expansion coefficient (see chapter: Coupled Thermal-Structural

Analysis)
TREF – reference temperature for density (thermal expansion causes density change)

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24
4 Thermal Loads and Boundary
Conditions
Generally, we can divide the loading possibilities in OptiStruct into four groups, basing
on the physical phenomenon:

• Volumetric Heat Generation (Loading)

• Heat Flux (Loading)
• Imposed temperature (BC or Loading - SPC or SPCD)
• Free Convection (defined as Group)

To better understand the meaning of each loading/boundary condition to the

simulation, a following table is made to show its similarity to structural analysis.

25
 LOADINGS

Mechanical Thermal Comments

Defines heat generation of elements per unit of

volume.
Volumetric This can be used to model heat generation by Joule
Inertial loads
heating effect for example.
[GRAV]
[QVOL] Units example: W/m3 or W/mm3 (depending on unit
used for distance)

A thermal loading applied to a 2D area, the external

face of a 3D part, or the edge of a 2D part. Unlike in
mechanical analysis, Flux is not directly applied to
Pressure Thermal flux
structural elements, but on dedicated entities, the
[PLOAD] [QBDY1]
thermal interface elements (CHBDYE) Units example:
W/m² or W/mm² (depending on unit used for
distance)
We use SPC(D) to set displacement boundary
conditions on nodes in a mechanical analysis (dof =1
Imposed Imposed to 6), the same principle is used to set temperature
displacements temperature boundary conditions on nodes (dof = 0).
[SPC / SPCD] [SPC / SPCD] MPC also works in thermal analysis with dof = 0.
Units example: K or °C

Both Contact and Convection are set up as a Group

and they describe relationship between adjacent
media, they are not referred in subcase entry. Since
contact is a structural interface between contact
surface and set of nodes, convection is a thermal
interface between thermal elements and a single
GRID or SPOINT, on which an SPC is applied to model
Contact Convection the external solid/fluid temperature away from the
[CONTACT] [CONV] structure.
Different convection rules can be used to determine
the resulting loading. Thermal flux is not directly set
by the user but depends on convection rules, part
temperature and fluid temperature.
Units example: W/m² or W/mm² (depending on unit
used for distance)

26
 4.1 Volumetric Heat Generation

Volumetric Heat Generation is a thermal loading, which is used to define 3D elements

as heat sources, to simulate physical phenomena of electrical/chemical/nuclear
energy conversion to thermal energy. In such a case, user needs to specify the
Volumetric Heat Generation Rate, through QVOL entry. The unit for this parameter
is (W/mm³). Then, if a certain volume is assigned with QVOL, it will generate a rate of
heat flow (thermal power) (W) calculated by a following formula:

∆𝑄𝑄
= 𝑉𝑉 ∗ 𝑄𝑄𝑄𝑄𝑄𝑄𝑄𝑄 ∗ 𝐻𝐻𝐻𝐻𝐻𝐻𝐻𝐻
∆𝑡𝑡

Where:
ΔQ/Δt – rate of heat flow (thermal power) (W)
V – volume (mm³)
QVOL – Volumetric Heat Generation Rate (W/mm³)
HGEN – scale factor for volumetric heat generation defined in material entry
MAT4/MAT5.

Or it can be expressed with the amount of thermal energy Q (J) that will be produced
in a certain amount of time t (s):
𝑄𝑄 = 𝑉𝑉 ∗ 𝑄𝑄𝑄𝑄𝑄𝑄𝑄𝑄 ∗ 𝐻𝐻𝐻𝐻𝐻𝐻𝐻𝐻 ∗ 𝑡𝑡

Examples of phenomena, where heat generation occurs:

• Exothermic chemical reactions

• Electrical energy conversion into thermal energy
• Nuclear reactions

Generally, an energy conversion into thermal energy is considered as volumetric

heat generation.

27
Volumetric Heat Generation Rate Setup

Since, this is a thermal load, it will be referenced in a thermal subcase entry as LOAD.
Therefore, user needs to follow these steps to set up Volumetric Heat Generation
Rate:

1) Create Load Collector with no card image (make sure it is a current collector,
otherwise, right click on it -> Make Current)

2) Go to analysis panel -> flux

3) In flux panel, generate volumetric flux loading on 2D/3D elements, with

loading type QVOL

• QVOL is directly applied on structural

elements
• Tip: heat generation is scaled by the
HGEN parameter in MAT4/5
• The value unit should be
{power_unit}/{distance_unit}3. For
example, (W/m3).
• Flux will be illustrated as arrows in the graphics area

28
4.2 Heat Flux

Heat Flux is also a thermal loading, which defines amount of thermal power (rate of
heat flow) that goes through a unit area. This is defined as power divided by area, for
example W/m² in SI units. In HyperMesh, Heat Flux can be applied to:

• any surface of a solid component

• surface of shell component
• edge of shell component (then the surface letting the flux in is A = edge length
* shell thickness)
• end of 1D element (inlet surface is a cross section of the element)
• along the 1D component

The equation showing the relationship between heat flux and rate of heat flow
(thermal power) is shown below:

∆𝑄𝑄
= 𝜙𝜙𝑞𝑞 ∗ 𝐴𝐴
∆𝑡𝑡

Where:

ΔQ/Δt – rate of heat flow (thermal power) (W)

A – surface area (m²)
Φq – heat flux (W/m²)

The equation can also be expressed as amount of thermal energy going through a unit
area in a unit time:

𝑄𝑄 = 𝜙𝜙𝑞𝑞 ∗ 𝐴𝐴 ∗ 𝑡𝑡

Additionally, heat flux is expressed by means of conduction and convection equations,

which were mentioned before. Just the left side of the equation, which contains rate

29
of heat flow, needs to be divided by flux area. We can then obtain the following
formulae:

𝜙𝜙𝑞𝑞 = −𝑘𝑘∇𝑇𝑇

Where:

𝛻𝛻𝛻𝛻 – temperature gradient (for 1 dimensional case: DT/DX)

k – thermal conductivity (W/m°K)

Negative sign in the equation means that heat goes (heat flux) in the negative
direction of the temperature gradient (from hot to cold). For convection, the equation
is as follows:
𝜙𝜙𝑞𝑞 = ℎ(𝑇𝑇𝑠𝑠 − 𝑇𝑇𝑓𝑓 )
Where:

h – heat transfer coefficient (convection coefficient, (W/m²*°K))

Ts – Surface temperature (°C,°K)
Tf – Fluid temperature (°C,°K)

Examples of phenomena, where heat flux is observed:

• Heat flux through window, due to temperature difference in the inside and
outside of the building
• Heat flux through spoon from hot soup to hand

Generally any kind of material with conductivity property, that is in contact with
environments of different temperature at the same time.

Define Heat Flux in HyperMesh

1. To create CHBDYE thermal interface elements:

a) Create a new group of card image CONDUCTION

30
 b) Add to this group the elements or elements faces that define the interface
used to apply the thermal loading.

This action will create new elements: the CHBDYE elements, displayed as hollow
rectangular or triangular shapes.

Notes about creating CHBDYE elements:

c) CHBDYE elements are specific to thermal analysis

d) They are used to apply flux and/or convection in thermal analysis

e) They are not used for mechanical analysis

f) CHBDYE element configuration in HyperMesh is slave3 or slave4

g) Due to their “non-physical” nature, they are not held in

components but in groups and can be selected using the “by group”
selection

2. To create a heat flux on CHBDYE thermal interface elements:

a) Create a load collector with no card image

31
 b) Create flux loading on CHBDYE thermal elements with loading type QBDY1

When creating heat flux loading:

• In order to select CHBDYE thermal elements, use the by group selection

option
• The value unit should be {power_unit}/{distance_unit} ². For example,
W/m².
• Flux will be shown as arrows in the graphics area

4.3 Imposed Temperature

By imposed temperature it is understood, that certain chosen grid points (GRID) will
be forced to have a predefined value of temperature throughout the analysis. This is
basically a thermal Boundary Condition, like in structural analysis we define fixed
DOFs, here we can treat imposed temperature as fixing just another “DOF”.

• Temperature Constraints need to be applied to grid points of conduction

elements or ambient points (for convection, see: Free Convection) (GRID or
SPOINT)

32
 • Imposed Temperature can be created as SPC or SPC1 and referred as SPC entry
in thermal subcase definition or as SPCD and referred as LOAD entry in thermal
subcase definition.

When to use SPC and when SPCD?

SPC Imposed temperatures for steady-state analysis.

Imposed temperatures for transient analysis (can be used for steady-
SPCD
state, however it is then referred as LOAD subcase entry.

Imposed Temperature Setup

1) Create a Load Collector with no card image

2) Go to analysis panel -> constraints.
3) Select nodes, which need to be assigned with fixed temperature (usually
option by face is used to select whole faces)
4) Leave all DOFs unchecked.
5) Select load types as SPC, SPC1 or SPCD.

NOTE: If Heat Flux or Volumetric Heat Generation Rate is specified, it is more

convenient to create SPC or SPC1 type fixed temperatures and refer them in SPC
subcase entry. Of course, one collector can handle both SPCD and Heat Flux for
example, in that case only LOAD entry in thermal subcase definition will be
referred.

6) Click create/edit to enter the card edit panel. Set fixed temperature value in D
entry.

33
4.4 Free Convection

In free convection, fluid motion is not generated by any external source, like pump,
fan, etc. but only by density differences in the fluid due to temperature gradients.

In HyperWorks, free convection allows thermal energy transfers between a surface

and an ambient environment (SPC/SPCD) through heat transfer coefficient (H) and a
surface element (CHBDYE).

A setup of convection in HyperMesh is a bit different than the previously described

loadings. Convection is understood here as thermal interface. The best analogy to
structural analysis seems to be contact interface – both convection and contact are:

• not referred in subcase entry

• set up through interfaces panel, defined as Group in browser
• describing behaviour on the boundary of two media (solid surface and ambient
environment in convection) or two bodies (physical interaction between two
solid bodies)
• defined as interaction between a surface and a set of nodes (contact) or one
node (convection)
• a kind of boundary condition.

To remind you of a physical relation describing convection, the equation of heat flux
is once more presented:

𝜙𝜙𝑞𝑞 = ℎ(𝑇𝑇𝑠𝑠 − 𝑇𝑇𝑓𝑓 )

Where:

𝜙𝜙𝑞𝑞 – heat flux (W/m²)

h – heat transfer coefficient (convection coefficient, (W/m²*°K))
Ts – Surface temperature (°C,°K)
Tf – Fluid (ambient) temperature (°C,°K)

34
Free Convection Setup

1) Create convection interface (PCONV)

Go to analysis panel -> interfaces. Type in the name and set type = as CONVECTION.
Click create/edit to enter the card edit panel.

OR:

Right click in model browser -> Create -> Group. Type in the name and set Card Image
to CONVECTION.

2) Edit convection properties (PCONV)

(In card edit panel or Entity Editor) Choose the material of the convection surface
under MID entry. If H is not specified in MAT4 entry, choose FTYPE = 3 and type in H1
([power unit]/[area unit*temperature unit], example: W/m²*°K) value of convection
coefficient between solid surface and ambient environment.

3) Create CHBDYE elements for convection surface definition.

If still in interfaces panel:

Switch to add panel, which is available on the left side. Make sure you are editing your
newly created convection interface (click on name and choose it). Choose slave as
face. Define the convection surface in the same manner as faces for contact: choose
elements that will be included in the face and select three nodes within one element

35
on the chosen face. Click add. CHBDYE elements will be created and added to the
convection interface.

OR:

Define face through Entity Editor. Click on 0

Elements in the Slave Entity IDs option, and
define the face in the same manner as
described above. HINT: There is an additional
option to directly click on face and choose it:
add shell/solid faces -> faces -> click directly
on the chosen face, add and return.

4) Create ambient temperature.

Create a node somewhere in space (Geom panel: nodes -> type in the coordinates ->
create). Add imposed temperature boundary condition to that node (unchecked
DOFs, temperature added through D entry in card edit panel).

5) Assign ambient temperature node to convection surface (CONV).

Go to card edit panel. Choose config = as slave3 (for tria CHBDYE elements) or
slave4 (for quad CHBDYE elements). type = will be CHBDYE3 or CHBDYE4 respectively.
Now select which thermal elements need to be in relation with ambient temperature:
Select elems with by group advanced option. Choose proper convection interface.
Click edit.

36
Now you will see the CONV card additionally, which is responsible for matching
PCONV convection property ID with ambient temperature node ID. Select TA1 entry
for ambient temperature node – either click in the graphic window on ambient
temperature node or type in its ID. In PCONID entry, the ID of referred PCONV
property should already be there.

The setup is done. Below, a relationship between each card image is shown to help
you better understand the convection interface setup.

NOTE: The CONVECTION card image that is created through either interfaces panel
or as Group in model browser, is in fact PCONV card image entry. CONV card image
is just defining an assignment of ambient temperature node (TA) to PCONV property.

37
4.5. Time-dependent Thermal Loading (transient
analysis)

4.5.1. Load history card TLOADi

In Transient Thermal Analysis, user has the possibility to define time-dependent
thermal loads. Generally, the structure of time-dependent loads setup is analogous
to Structural Transient Analysis:

Time dependent thermal loading and boundary conditions:

• Time dependent heat flux (QBDY1)

• Time dependent heat generation (QVOL)
• Time dependent temperature boundary conditions (SPCD)
• Time dependent ambient temperatures for convection (SPCD)

Key notes on time-dependent load TLOADi:

1. Entries used to define loading values: SPCD, QVOL, QBDY1 should now be set up
with either unit values, so that tabular data will consist of real values in time or can
be set up with real value along with a tabular data containing appropriate scaling
factors.

2. Tabular data containing time dependent loading values (or scaling factors) is
defined within TABLED load collector. When SPCD,QVOL,QBDY1 entries contain
unit values (= 1), then Y-column in TABLED should contain real thermal loading
values in proper unit system. X-column is, of course, for time points.

38
3. TLOAD1/2 is used to associate TABLED data to proper thermal load values:
SPCD,QVOL,QBDY1. TID entry should refer to TABLED ID. EXCITEID entry should
refer to SPCD, QVOL or QBDY1 ID. Additionally, DELAY can be defined for time
delay.

𝐟𝐟(𝐭𝐭) = 𝐀𝐀 ∗ 𝐅𝐅(𝐭𝐭) + 𝛕𝛕

• f(t) is the time-dependent dynamic load or enforced motion

• A is the amplitude of the dynamic excitation in transient response analysis

and is referenced by the EXCITEID field.

• F(t) is a user-defined function that defines the time-variant nature or loading

scale factors for f(t). It is specified by referencing a predefined TABLEDi entry
in the TID field.

4. When there is only one TLOADi present in the model setup, it can be directly
referred by the DLOAD subcase entry in Heat Transfer (Transient) load step. In
case of multiple TLOADi definitions, user needs to create another load collector
with card image DLOAD, in which all TLOADi IDs must be referred with proper
scaling factors and global scale factor. The DLOAD load collector is then referred in
DLOAD subcase entry in load step definition

The TLOAD1 card defines a time-dependent dynamic load or enforced motion:

(1) (2) (3) (4) (5) (6) (7) (8) (9) (10)

TLOAD1 SID EXCITEID DELAY TYPE TID

Where:

SID Set identification number.

39
 Identification number of the DAREA, SPCD, FORCEx, MOMENTx,
PLOADx, RFORCE, QVOL, QBDY1, ACCEL, ACCEL1, ACCEL2, or GRAV
EXCITEID entry set that defines {A}

DELAY Defines time delay t

TYPE Defines the type of the dynamic excitation.

TID TABLEDi entry identification number that gives F(t)

4.5.2. Initial Conditions

When we are looking for a transient behaviour of a model, initial conditions play
crucial role in how the following transient response will look like. In the case of
thermal analysis, this is an initial temperature. We can set up initial temperature in
two ways:

• Using a load collector with card image TEMPD, where T1 must be filled with initial
temperature value.

• Creating a load collector with no card image and adding here a temperature load
(analysis panel -> temperatures -> load types = TEMP). With this option you can
apply initial temperature to certain grid points (faces, edges, whole components
etc…).

The difference between these two options is that TEMPD only allows setup of a
“general” initial temperature, whereas TEMP load can be assigned to “any” entity.

In the end, user should refer the load collector containing initial temperature to IC
subcase entry.

40
5 Thermal Results
By default, only Grid Temperatures are exported to .h3d file for results view.
Therefore, usually it is recommended to request for additional results through
GLOBAL OUTPUT REQUEST control card. Mostly two types of results are requested:

• THERMAL – this requests for Grid Temperatures, they are always exported to
h3d file by default (set the FORMAT(1) to H3D and OPTION(1) to ALL/YES. In
this card, threshold temperature output can also be defined: RTHRESH, which
provides a threshold for the temperature output.
• FLUX – additionally temperature gradients and thermal conductivity heat fluxes
can be requested. Set the FORMAT(1) to H3D and OPTION(1) to ALL/YES.

41
 • SPCFORCE Output for Heat Transfer - when SPCF/SPCFORCE is requested
for steady state heat transfer subcase, the power at SPC grids will be
calculated. SPC power is a measure of energy flowing in and out of the
structure.

Feature supported version: OptiStruct 2017.0 or above

42
Again, to better understand the relevance of each result type, their analogue in
structural analysis is presented:

RESULTS

Mechanical Thermal Comments

In both case, those are the first results to be

calculated, and those values will be used to
calculate all other results.
- In mechanical analysis: stress, strain, energy
are calculated based on nodal displacements.
Displacement Temperature - In thermal analysis: gradients, fluxes, thermal
energy are calculated based on nodal
temperatures.
This is a nodal scalar result. Units
example: K or °C

This is used to obtain temperature variation in

space along the different Axis (X, Y, and Z).
Temperature
Strain This is an elemental vector result.
Gradient
Units example: K/m or K/mm (depending on unit
used for distance)

Defines the thermal power passing through a

unitary section perpendicular to a particular
direction (X, Y, Z)
Stress Fluxes This is an elemental vector result.
Units example: W/m² or W/mm² (depending on
unit used for distance)

This result is not a library-based result, but is

calculated by OptiStruct to represent some kind of
energy absorbed by the part during the thermal
transfer (however, the unit is not consistent with an
Thermal energy).
Compliance
Compliance This response is mainly used for optimization, where
optimizing thermal compliance improves the part
conductivity.
This is a global scalar result.
Units example : W.K

43
44
6 Steady State Heat Transfer
Analysis
For a steady-state heat transfer analysis, the temperature distribution and heat flow
within the model are independent of time. No transient effect is considered.

Linear steady state heat transfer

• Material properties such as conductivity and convection coefficient are

independent of temperature (MAT4/MAT5)

• ANALYSIS=HEAT

Nonlinear steady state heat transfer

• Temperature dependent material properties defined in MATT4

• ANALYSIS=NLHEAT

Industry examples of application:

• Heat Sink – description and model download in chapter 9.1 – Linear Steady-
State Heat Transfer analysis
• Engine Block – description and model download in chapter 9.2 – Linear
Steady-State Heat Transfer analysis

6.1 Linear Steady State Heat Transfer Analysis

In linear steady state analysis, material properties such as conductivity and
convection coefficient are linear. Temperature and fluxes at the final thermal
equilibrium state are of interest. The basic finite element equation is:

([𝑲𝑲𝒄𝒄] + [𝑯𝑯]){𝑻𝑻} = {𝑷𝑷𝑩𝑩} + {𝑷𝑷𝑯𝑯} + {𝑷𝑷𝑸𝑸}

Where:
[Kc] – conductivity matrix

45
 [H] – boundary convection matrix due to free convection,
{T} – unknown nodal temperature,
{PB} is power due to heat flux at boundary specified by QBDY1 card
{PH} is boundary convection vector due to convection specified by CONV
card {PQ} is power vector due to internal heat generation specified by
QVOL card.
The matrix on the left-hand side of equation (1) is singular unless temperature
boundary conditions are specified. Once the unknown temperatures at the nodal
points of the elements are calculated, temperature gradient can be calculated
according to element shape functions. Element fluxes can be calculated by using:

{𝑸𝑸𝑭𝑭𝑭𝑭𝑭𝑭𝑭𝑭} = [𝑲𝑲𝒄𝒄]{𝛁𝛁𝛁𝛁}

{𝛁𝛁𝛁𝛁} – temperature gradient vector based on temperature vector {𝑻𝑻}

{𝑸𝑸𝑭𝑭𝑭𝑭𝑭𝑭𝑭𝑭} – heat flux vector

Linear Steady-State analysis is set up through Heat Transfer (Steady State) analysis
type in loadstep definition. Following entries are defined in this loadstep:

• SPC – load collector containing Imposed Temperature of type SPC or SPC1

• LOAD – load collector containing Volumetric Heat Generation Rate (QVOL), Heat
Flux (QBDY1) and Imposed Temperature as SPCD type.

Convection does not need to be referred in subcase entry.

6.1.1 Tutorial: Linear Steady State Heat Transfer

Analysis

This tutorial demonstrates how to import an existing FE model, apply boundary

conditions, and perform a Linear Steady State Heat Transfer Analysis on a thin
square plate. Post-processing of analysis is done using HyperView to view Grid
Temperature and element fluxes.

The unit system maintained in the model is N m kg

46
Open the plates.hm file (Download required model file from the folder)

Step 1: Create the Material

The imported model has four component collectors with no materials. A material
collector needs to be created and assigned to the shell component collectors.

1. In the Model Browser, right-click and select Create > Material from the context
menu.

A default material displays in the Entity Editor.

2. For Name, enter Mat.

3. Set the Card Image set to MAT4

4. Enter the material values next to the corresponding fields.

• K = 52.0 W/m°C.
• H = 750.0 W/m2 °CA

A new material, Mat, has been created. The material uses OptiStruct's linear
isotropic thermal material model, MAT4.

47
Step 2: Create the Property

1. In the Model Browser, right-click and select Create > Property from the context
menu.

A default property displays in the Entity Editor.

2. For Name, enter PSHELL.

3. For Card Image select PSHELL, as the component is made of shell elements

4. For thickness enter value of T = 0.1

5. Also select the material as Mat.

48
Step 3: Assign the Material and Property

Assign the material and property to plate component. This can be done by a right
click on the component and select Assign. From the pop-up menu select the PSHELL
property.

Step 4: Applying Thermal Loads and Boundary Conditions

In this exercise the thermal boundary conditions are applied on one edge of the plate
and saved in a load collector SPC_TEMP. A predefined node 101 specifies the
ambient temperature. A predefined node set node_temp contains the nodes on one
edge of the plate.

Creating Temperature on one edge of the plate

From version 2017 on we can directly apply temperature with SPC load type using
temperature panel

1. Create a load collector named SPC_TEMP

2. From the Analysis page, click temperature.

3. Go to the create subpanel.

4. Make sure the current selection field is set to nodes and load collector to
SPC_TEMP.

5. Click nodes >> by path.

6. Select the first and last node as indicated:

49
 7. Set value to 100.

8. Set load types to SPC.

9. Click create.

This applies the temperature 100 on one edge of plate.

Creating Ambient Temperature

1. Make sure SPC_TEMP is the current load collector.

2. From the Analysis page, select the Temperatures panel.

3. Go to the create subpanel.

4. Click nodes >> by id.

5. Input the ID of the predefined node 101.

Node 101 should be highlighted.

6. Set load types to SPC.

7. Set value as 1e-4

50
 8. Click create.

This applies the temperature 1e-4 on one edge of plate.

Creating CHBDYE Surface Elements

Surface elements are to be created to simulate the heat exchange between the plate
and the surrounding air.

1. Go to Analysis panel > Interfaces.

2. For Name, enter convection.

3. For Card Image, select CONVECTION from the drop-down menu.

4. Click Color and select a color from the palette.

5. Click create/edit

6. Click MID to activate it.

7. For Material, click MID > Mat.

51
8. Switch to the add panel now

9. For Slave Entity IDs, select elements as shown below

9. Click add.

This adds the CHBDYE surface elements to the solid elements on the outer surface
following the same side convention, as shown in the following figure.

52
Defining Convection Boundary Condition to Surface Elements

1. Click the Card Edit icon .

2. Select elems.

3. Click elems >> by group.

4. Check the box in front of CONVECTION and click select.

5. Click config= and select slave4.

6. Click type= and select CHBDYE4.

7. Click edit and go to the CHBDYE Card Image panel.

8. Check the box in front of CONV.

9. Click TA1 and input the ambient node ID 101, as shown below.

10. Click return two times to go back to the Analysis page.

Step 5: Creating Heat Transfer Load Step

An OptiStruct steady state heat convection loadstep is created, which references the
thermal boundary conditions in the load collector spc_temp. The gradient, flux, and
temperature output for the heat transfer analysis is also requested in the Loadsteps
panel.

1. In the Model Browser, right-click and select Create > Load Step.

2. A default loadstep displays in the Entity Editor.

53
 3. For Name, enter heat_transfer.

4. Click on the Analysis type field and select Heat transfer (steady state) from the
drop-down menu.

5. For SPC, click Unspecified > Loadcol.

6. In the Select Loadcol dialog, select SPC_TEMP and click OK.

7. Check the box next to Output.

8. Activate the options of FLUX and THERMAL on the sub-list.

9. Activate the FORMAT fields for both outputs and select H3D format.

10. Activate the OPTION fields for both outputs and select ALL.

The FORMAT and OUTPUT fields for THERMAL output may open up a new window.
Click on the first field in the window to select the corresponding values.

FLUX and THERMAL output can also be requested in the Control cards panel on the
Analysis page.

Step 6: Run the analysis

Step 7: Review the results in HyperView

54
6.2 Coupled Thermal Structural Analysis

While pure thermal analysis provides us with information about temperature and
heat flux distribution, in most cases it is also crucial to check whether thermal loading
will not lead to structural failure of the component. This is mostly about one
significant material property, which is the thermal expansion coefficient. It can even
be said to be a “linking” parameter between thermal and structural aspects of a
component or assembly.

Industry example of application:

• Brake disc – description and model download in chapter 9.3 – Coupled

Thermal-Structural Analysis.

A linear (1D) thermal expansion provides the following equation:

∆𝐿𝐿
= 𝛼𝛼𝐿𝐿 ∗ ∆𝑇𝑇
𝐿𝐿

Where:

αL – linear thermal expansion coefficient (1/°K)

L – initial length (m)
ΔL – change in length due to expansion (m)
ΔT – change in temperature along this length

While strains induce stresses, or stresses induce strains (it in fact happens
simultaneously), temperature induces a so-called expansion of the component, which
can be understood as a strain without any stresses (change of initial unstressed shape
due to greater particle vibrations).

What is then the influence of temperature on the strength of the part?

55
The answer lays in temperature gradients. Imagine that one component has different
temperatures across its length, then each fragment of this part needs to expand
proportionally to its temperature, which means adjacent fragments need to expand
to different extents to meet its unstrained state. This brings conflict between adjacent
fragments, since they are bounded by crystal structure and must come to compromise
regarding expansion, which in fact induce strains and stresses. Huge temperature
gradients induce proportionally huge stresses, which may be a crucial loading
condition for a component’s strength.

Coupled thermal structural analysis is done in the following fashion. Heat transfer
analysis is performed first to determine the temperature field of the structure. The
temperature field is used as part of the loading for structural analysis. A single finite
element mesh is usually used for both thermal and structural analysis. The finite
element governing equation for static structural analysis is:

[𝑲𝑲]{𝑫𝑫} = {𝒇𝒇} + {𝒇𝒇𝑻𝑻}

where,

[K] is the global stiffness matrix

{D} is the unknown displacement vector
{fT} is temperature loading
{f} is structural loading such as forces, pressures, etc.

The setup for such analysis involves creation of two load steps, linear steady-state
thermal and linear static structural. Which means loading & BCs for both subcases
are created simultaneously, sorted into appropriate load collectors and referred in

56
their subcases (thermal SPC and loading load collectors are referred by thermal
subcase and structural SPC and loading load collectors are referred by linear static
subcase).

The only difference is that structural (linear static) subcase needs reference to
thermal subcase by checking TEMP_LOAD subcase option and referring SUBCASEID
in the field TEMP.

Remember: Material setup for a coupled thermal-structural analysis is set via MAT1
card image with MAT4 extension checked and filled with thermal properties! For
more information please refer to Thermal Materials chapter.

6.2.1 Tutorial: Coupled Linear Heat

Transfer/Structure Analysis

A coupled heat transfer/structure analysis on a steel pipe is performed in this

tutorial. As shown in the figure below, the pipe is fixed on the ground at one end
and the heat flux is applied on the other end. A linear steady state heat conduction
solution is defined first. Then it is referred by a structure solution by TEMP to
perform the coupled thermal/structural analysis. The problem is defined in
HyperMesh and solved with OptiStruct implicit solver. The heat transfer and
structure results are post processed in HyperView.

57
Open the pipe.fem file (Download required model file from the folder)

Step 1: Create the Material

1. In the Model Browser, right-click and select Create > Material.

A default MAT1 material displays in the Entity Editor.

2. For Name, enter steel.

3. Click the box next to MAT4.

The MAT4 card image appears below MAT1 in the material information area. The
MAT1 card defines the isotropic structural material. MAT4 card is for the constant
thermal material. MAT4 uses the same material ID as MAT1.

4. Enter the following values for the material, steel, in the Entity Editor.

58
Step 2: Create the Property

1. In the Model Browser, right-click and select Create > Property.

A default PSHELL property displays in the Entity Editor.

2. For Name, enter solid.

3. For Material, click Unspecified > Material.

4. In the Select Material dialog, select steel and click OK.

5. For Card Image, select PSOLID from the drop-down menu and click Yes to confirm.

59
The property of the solid steel pipe has been created as 3D PSOLID. Material
information is linked to this property.

Step 3: Assign the Material and Property

Once the material and property are defined, they need to be linked to the structure.

1. In the Model Browser, click on the pipe component.

The component template displays in the Entity Editor.

2. For Property, click Unspecified > Property.

3. In the Select Property dialog, select solid and click OK.

60
Step 4: Applying Thermal Loads and Boundary Conditions

A structural constraint spc_struct is applied on the RBE2 element to fix the pipe on
the ground. Two empty load collectors, spc_heat and heat_flux have been
precreated. In this section, the thermal boundary conditions and heat flux are
applied on the model and saved in spc_heat and heat_flux, respectively

Creating Thermal Constraints

1. Click the Set Current Load Collector panel located at the right corner of the
footer bar, as shown below.

A list of load collectors appears.

2. Select spc_heat as the current load collector.

3. From the Analysis page, click constraints.

4. Go to the create subpanel.

5. Click the entity selection switch and select nodes from the pop-up menu.

6. Click nodes >> by sets.

7. Select the predefined entity set heat and click select.

The selected nodes on the fixed end should be highlighted.

8. Uncheck the boxes in front of dof1, dof2, dof3, dof4, dof5, and dof6 and enter
0.0 in the entry fields.

9. Click load types = and select SPC from the pop-up list.

10. Click create/edit, make sure D = 0.0. Click return

This applies these thermal constraints to the selected nodal set.

11. Click return to go to the Analysis page.

61
Creating CHBDYE Surface Elements

The heat flux will be applied on the surface of the free end of the pipe. Therefore,
the surface elements CHBDYE for defining heat transfer boundaries must be created
first.

1. Click BCs > Create > Interfaces.

2. For Name, enter heat_surf.

3. For Card Image, select CONDUCTION from the drop-down menu.

4. Select an appropriate color from the palette.

5. For Slave Entity IDs, click Elements.

The Slave Entity IDs panel is now displayed below the Graphics browser.

6. The upper option should be set to “add solid faces”.

7. Click the switch button for elems and select faces from the pop-up list.

8. Click the highlighted solid elems and select by sets from the pop-up selection
menu.

9. Select element set solid elems and click select.

10. Click nodes in the face nodes field.

11. Select four nodes on one face of a solid element where the heat flux is applied

62
12. Click add.

This adds the CHBDYE surface elements on all the solid elements following the same
side convention,

13. Click return to return to the Entity Editor.

14. Click Close.

Creating Heat Flux on Surface Elements

63
In this step, the uniform heat flux into CHBDYE elements is defined with QBDY1
entries.

1. Set your current load collector to heat_flux.

2. From the Analysis page, click flux to enter the Flux panel.

3. Go to the create subpanel.

4. Click elems >> by group.

5. Select heat_surf and click select.

The surface elements are highlighted.

6. Click load types= and select QBDY1.

7. In the value= field, enter 1.0.

8. Click create.

The uniform heat flux in the surface elements is defined.

9. Click return to go back to Analysis page.

Step 5: Creating Load Step and Output request

Creating Heat Transfer loadstep and request outputs

1. In the Model Browser, right-click and select Create > Load Step.

A default load step displays in the Entity Editor.

2. For Name, enter heat_transfer.

3. Verify that the Analysis type is set to Heat Transfer (Steady State), define
subcase definition as per below screenshot and click on create.

64
4. Enter the control cards panel on the Analysis page. Navigate to the second page
and enter the GLOBAL_OUTPUT_REQUEST.

5. Activate the check box for THERMAL, setting FORMAT (1) to H3D and OPTION (1)
to ALL.

6. Activate the check box for FLUX, setting FORMAT (1) to H3D and OPTION (1) to
ALL.

7. Exit the control cards panel.

Create a new loadcase for Thermal Structural Coupling and Request Outputs

1. Right-click in the Model Browser and select Create > Load step.

2. Set the Analysis type to Linear Static and set the other values as shown:

65
3. Enter the control cards panel on the Analysis page. Navigate to the second page
and enter the GLOBAL_OUTPUT_REQUEST.

4. Activate the check box for DISPLACEMENT, setting FORMAT (1) to H3D and
OPTION (1) to ALL.

5. Activate the check box for STRESS, setting FORMAT (1) to H3D and OPTION (1) to
ALL.

6. Exit the control cards panel.

Step 6: Run the analysis

Step 7: Review the results in HyperView

66
6.3 Nonlinear Steady State Heat Transfer Analysis
This type of analysis is used when the material nonlinearity is present, that means
temperature dependent conductivity or thermal loading and BCs vary with time. As
mentioned previously, temperature dependent conductivity is defined in MATT4/5
(extension to MAT4/5 material card). Tabular data is entered in TABLEMi load
collector. Equation of motion is in this case modified as follows:

([𝑲𝑲𝒄𝒄 (𝑻𝑻)] + [𝑯𝑯]){𝑻𝑻} = {𝑷𝑷𝑩𝑩 } + {𝑷𝑷𝑯𝑯 } + {𝑷𝑷𝑸𝑸 }

Where:

[Kc(T)] – temperature dependent conductivity matrix

[H] – boundary convection matrix due to free convection

{T} – unknown nodal temperature

{PB} is power due to heat flux at boundary specified by QBDY1 card

{PH} is boundary convection vector due to convection specified by CONV

card

{PQ} is power vector due to internal heat generation specified by QVOL card.

67
The following steps are a guide to setup a Nonlinear Steady-State Heat Transfer
Analysis.

1. Use the solution sequence identifier (ANALYSIS) in the Subcase Information

Entry section to select the nonlinear steady-state heat transfer analysis
using: ANALYSIS=NLHEAT.

2. The likely initial temperature distribution can be defined using the

TEMPERATURE Subcase Information Entry (type=INITIAL). A good initial
temperature estimate improves the convergence of the solver.

3. The MATT4 Bulk Data Entry can be used to define temperature dependent
thermal material properties.

4. To indicate that a nonlinear solution is required for any subcase, a NLPARM

Subcase Information Entry is required. This subcase entry points to a
NLPARM Bulk Data Entry that specifies convergence tolerances and other
nonlinear parameters.

5. Loads and boundary conditions are defined in the Bulk Data Entry section of
the input deck. These should be referenced in the Subcase Information
Entry section using SPC and LOAD entries in a subcase. Each Subcase defines
a load vector.

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6.3.1 Tutorial: Nonlinear Steady State Heat
Transfer Analysis

Consider a beam in the figure below, which is built from three different materials.
The first segment is 100 mm in length and it is made from steel (K = 60.5 W/m.°C).
The second one is made from copper (K = 401 W/m.°C) and it is 250 mm in length.
The last segment is made from aluminium and it is 50 mm in length. Aluminium
conductivity is nonlinear as presented in the following table:

Bar cross section is constant, with an area equal to 625 mm². On the steel side (left
free end), temperature is constant, and it is equal to 200 °C, while on the other side,
on the aluminium free end, a convection condition is introduced, with convection
coefficient equals to 100 W/m². The room temperature is assumed to be 20 °C. The
external faces are thermal isolated so that conduction occurs only in the longitudinal
direction.

Open NLHEAT_Model.hm file (Download required model file from the folder)

Step 1: Create the Material

Create Material Nonlinear Properties Table

1. Right click on the model browser to create a new Load Collector.

69
 2. Enter Aluminium as a name and TABLEM1 as a Card Image.

3. Enter the value 3 on TABLEM1_NUM field.

4. Click on Data x, y to enter the material data as the picture below.

5. Click Close.

Create Material card for Steel, Copper and Aluminium

1. Right click on the model browser to create a new Material.

2. Enter Steel as a name and MAT4 as a Card Image.

3. Click on [K] and insert 60.5 on this field.

This field is the thermal conductivity [W/m.°C] of the material.

4. Repeat the steps 1 to 3 with the name Copper and use [K] as 401.

5. Repeat the steps 1 to 3 with the name Aluminium and use [K] as 1.

6. Only for Aluminium, click on [H] and enter 100 as a value.

This field is the convection heat transfer coefficient [W/m²°C] of the material.

7. Check the check box to active the MATT4 field.

8. Under the T(K) select the Load Collector Aluminium to indicate the nonlinear
thermal conductivity properties of the material.
9. Click OK

70
Step 2: Creating the Properties

1. Right click on the model browser to create a new Property.

2. Enter Steel as a name and PSOLID as a Card Image.

3. Repeat steps 1 and 2 for the property Copper and Aluminium.

Step 3: Assign the material and property

1. Left click on the Steel Component.

2. Under Property enter the Steel Property created on the Step 2.

3. Under Material enter the Steel Material created on the Step 1.

4. Repeat the steps 1 to 3 for the component Copper and Aluminium.

Step 4: Applying Thermal Loads and Boundary Conditions

Room Temperature Constraints

1. Right click on the model browser to create a new Load Collector.

2. Name it as SPC_HEAT and leave Card Image as None.

Make sure the load collector SPC_HEAT is the current one.

3. From the Analysis page, click on the constraints panel.

4. Deselect all DOFs and click on the free node (id = 2917).

5. Select SPC as the load type.

6. Click Create and Return.

7. Click on (Card Edit), change to loads option and configuration const.

8. Select the Constraint created on the step 1-4.

9. Click edit.

10. Active D and enter 20 as room temperature constraint.

71
 11. Click Return twice.

Steel Side Temperature Constraints

1. From Analysis page, click on the constraints panel.

Make sure the load collector SPC_HEAT is the current one.

2. Deselect all DOFs and select all the nodes on the free side (left free end) of the
steel component.

3 . Select SPC as the load type.

4. Click Create and Return.

5. Click on (Card Edit), change to loads option and configuration const.

6. Select all the Constraints created on this step.

7. Click edit.

8. Active D and enter 200 as the steel side constraint temperature.

9. Click on Return twice.

Create Convection Condition

1. From Analysis page, click on the interfaces panel.

2. Enter Convec on the name field and select type CONVECTION.

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 3. Click on create/edit.

4. Click on MID to select Aluminium as the material properties.

5. Click return.

6. On the add page select face option for the slave surface.

7. To select the free Aluminium face, select all the elements on the component
Aluminium.

On the face nodes, select all the nodes on the Aluminium free end side.

8. Click on add and return.

Define the Convection Boundary Condition to Surface Elements

1. Click on (Card Edit) button.

2. Change to element entry.

3. Click elems and select by group.

4. Check the check box button near the CONVEC group and click select.

5. Select Config = Slave 4 and Type = CHBDYE4.

6. Click on edit.

7. Check the check box button CONV under the Card Image Panel.

73
 8. Select TA1 to select the room temperature constraint node (id = 2917) as show
below.

9. Click Return twice.

Create Nonlinear Parameter Load Collector

1. Right click on the model browser to create a new Load Collector.

2. Enter NLPARM as a name and Card Image NLPARM.

3. Let all the parameters as the default values.

Step 5: Creating Loadsteps and Output request 1.

From the Analysis page, click on the Loadsteps panel.

2. Give the name NLHEAT for this analysis.

3. Enter Type as NLHEAT.

4. Check the SPC check box button and enter the Load Collector SPC_HEAT.

5. Check the NLPARM check box button and enter the Load Collector NLPARM.

6. Click Create.

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Output Request

1. From the Analysis page, click on the control card panel.

2. Select GLOBAL_OUTPUT_REQUEST.

3. Check FLUX and THERMAL check boxes button to request these outputs in H3d
format.

4. Click Return twice.

Step 6: Run the analysis.

Step 7: Review the results in HyperView

75
76
 7 Transient Heat Transfer
Analysis
For a Transient heat transfer analysis, the temperature distribution and heat flow

within the model are dependent on time. Transient heat transfer analysis can

further be categorized in to two types named below:

Linear Transient Heat Transfer Analysis

Nonlinear Transient Heat Transfer Analysis

Industry examples of application:

• Extended Surface fin – description and model download link in chapter 9.4 –
Linear Transient Heat Transfer Analysis
• Manifold – description and model download link in chapter 9.7 – Nonlinear
Transient Heat Transfer Analysis

7.1 Linear Transient Heat Transfer Analysis

As in a steady-state thermal analysis we are looking for thermal equilibrium of a
system, that may be reached after a certain amount of time and the output is a time-
independent state of a system, in transient thermal analysis we are investigating the
response of a system to thermal loading within a specified period of time after this
thermal loading started acting on the system. This is a dynamic analysis which may be
loaded by time-dependent or -independent thermal loads. The equilibrium equation
looks as follows:

[𝑪𝑪]{𝑻𝑻̇} + ([𝑲𝑲𝒄𝒄 ] + [𝑯𝑯]){𝑻𝑻} = {𝑷𝑷𝑩𝑩 } + {𝑷𝑷𝑯𝑯 } + {𝑷𝑷𝑸𝑸 }

Where:

[C] is the heat capacity matrix which is defined in MAT4/MAT5

77
 [Kc] is the conductivity matrix
[H] is the boundary convection matrix due to free convection
{𝑇𝑇´} is the temperature derivative with respect to time. Term [C]{𝑇𝑇´} captures the
transient nature of the analysis
{T} is the unknown nodal temperature
{Px} are the thermal loading vectors

Please note that since this is a linear type of analysis, constant thermal conductivity is
used. The difference between steady-state analysis and transient analysis is the
presence of [C]{𝑇𝑇´} part in the equation, which indicates the transient nature of the
analysis.

Steady-State Vs Transient

Steady-State Transient
Calculates the effects of steady Calculates thermal quantities such as
thermal loads on a system temperature that vary over a period of
time

Input would be thermal loads that do Typically use temperatures from

not vary over a period of time transient thermal analysis as input to
structural analysis

Typically performed before doing a Applications include nozzles, pressure

transient analysis vessels, engine block

It is supported in OptiStruct It is supported in OptiStruct

Transient analysis setup

Linear Transient Thermal Analysis is set up using analysis type Heat Transfer
(Transient) in the load step definition. The parameters that need to be defined are
very similar to ones for structural transient analysis, except the loading and boundary

78
conditions are not of structural kind, but thermal. Following parameters need to be
defined:

• Time stepping (TSTEP)

Since time plays a role in the transient type of analysis, user must specify the time
stepping for increments and therefore overall time of simulation. This is done by
creating a load collector:

1) Create a load collector with card image TSTEP

2) Define TSTEP_NUM =, the number of lines in the TSTEP table.
3) Set N and DT, where DT is a time step size (in an appropriate time unit) and N is
a number of time steps with size DT.

NOTE: As you can see, if you need to define different time step sizes, you must enter
an appropriate number of lines, so that each line will contain different DT values.

NOTE: You can also specify the skip factor NO, to define which time steps should be
used in output file for results. It can be achieved via card edit panel (right click onto
load collector in model browser -> card edit). This might help decreasing the
computing time.

4) Refer the TSTEP load collector in TSTEP subcase entry in Heat Transfer
(Transient) load step.

79
 • Initial Conditions (IC)

Please take a look at chapter: 4.5 Time-dependent thermal loading.

• Loading (DLOAD)

As mentioned in previous chapters, DLOAD subcase entry is used to refer to TLOAD

or DLOAD load collector.

• Boundary Conditions (SPC or MPC)

Reference to thermal boundary conditions load collector.

7.1.1 Tutorial: Linear Transient Heat Transfer

Analysis
This is the NAFEMS test problem T3 for transient heat transfer analysis. OptiStruct
examines the material temperature at point C, 0.08m from point A and the total
simulation time is 40 seconds.

Quad4 elements are used to build the model with 10 elements. At time t=0, all
temperature = zero and at time t>0, at one end temperature is zero and at the other
end temperature is 100 sin(ϖt/40) °C. There is no heat flux perpendicular to the
length of the beam. Model: Beam linear transient.hm (Download required model
file from the folder)

80
Material properties

Conductivity = 35 W/m°C

Specific Heat = 440.5 J/kg °C

Density = 7200 kg/m3

Step 1: Create the Material

1. In the Model Browser, right-click and select Create > Material from the context
menu.

A default material displays in the Entity Editor.

2. For Name, enter Mat.

3. Set the Card Image set to MAT4

4. Enter the material values next to the corresponding fields.

K = 35.0 W/m°C

Rho = 7200 Kg/m3

Cp = 440.5 J/Kg °C

A new material, Mat, has been created. The material uses OptiStruct linear isotropic
thermal material model, MAT4.

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Step 2: Creating the Properties

1. In the Model Browser, right-click and select Create > Property from the context
menu.

A default property displays in the Entity Editor.

2. For Name, enter PSHELL.

3. For Card Image select PSHELL, as the component is made of shell elements

4. For thickness enter value of T = 0.01

5. Also select the material as Mat.

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Step 3: Assign the Material and Property

Assign the material and property to T3_Quad4_Fine component. This can be done
by a right click on the component and select Assign. From the pop-up menu select
the PSHELL property.

Step 4: Applying Transient Thermal Boundary Conditions

Creating Transient Heat Transfer Analysis Time Steps

A transient analysis captures the behavior of the system over a specific period of
time. Therefore, a time period of interest for your system is defined. A time period
of 40 seconds is defined with results output every 0.4 seconds. A load collector is
created for this purpose and the TSTEP entry is referenced, as shown below.

1. In the Model Browser, right-click and select Create > Load Collector.

2. For Name, enter Time Steps.

3. For Card Image, select TSTEP.

4. For TSTEP_NUM, enter a value of 1.

5. Click and enter the number of time steps (N) = 100 and set each time
increment (DT) to 0.4.

This encompasses a total time period of 40 seconds in which to capture the

behavior of the system. 6. Click Close.

Creating Transient Heat Transfer Analysis Initial Conditions

Since the temperature profile of the system varies over time, the initial grid point
temperature profile must be set to specify the starting point for the analysis. You
assume that the temperature of the entire system is equal to .0001°C, at T=0
seconds, the TEMPD bulk data entry sets the initial temperatures

83
1. In the Model Browser, right-click and select Create > Load Collector.

2. For Name, enter Initial Conditions.

3. For Card Image, select TEMPD.

4. For T1, enter a value of 0.0001

Creating a Time-variant Temperature

1. Create load collector named SPCD, and for Card Image, select None.

The newly created SPCD load collector is the current load collector (look at the right
bottom corner of the screen to verify that SPCD is displayed).

2. If the SPCD load collector is not specified, right-click SPCD in the Model Browser
and click Make Current.

3. Next, create the amplitude (constant part) of the time variant temperature using
an SPCD data entry. Click BCs > Create > Constraints.

4. The temperature is set by using the SPCD data entry to control an existing node
outside the actual structure. In the Constraints panel, click nodes > by id, enter
3,2 in the id= field and press Enter.

The ambient node is highlighted in the Entity Editor above the structure.

84
5. Enter 10.0 in the size= field and uncheck the boxes beside all the degrees of
freedom (dof1 through dof6) and enter 0.0 in all the fields next to the dof#.

6. For load types =, select SPCD.

Creating an SPCD entry to control the temperature.

7. Click create/edit and enter 1.0 in the D field on the SPCD data entry.

This creates an SPCD referencing the ambient node specifying a temperature of 1°C.

8. Click return twice to go back to the Analysis page.

The time variable nature of the temperature can be captured using a TABLED1
entry also referenced by the TLOAD1 data.

1. Create a new load collector named TABLED and set the Card Image as TABLED1.

2. For TABLED1_NUM, enter 6 and press Enter.

3. In the table, enter data as per below screenshot.

4. Click Close.

85
A time variable ambient temperature can be created by referencing an SPCD
entry via a TLOAD1 data entry.

1. In the Model Browser, right-click and select Create > Load Collector.

2. For Name, enter TLOAD.

3. For Card Image, select TLOAD1.

4. For EXCITEID, select the SPCD load collector from the menu.

5. For TYPE, select DISP, then click TID and select the Tabled load collector menu.

6. Create a new load collector named SPC TEMP and for Card Image, select None.

Create temperature with load type set as SPC on node id 2,3 and define value as 0.0
(BCs > Create > Temperature)

86
Step 5: Creating a Transient Heat Transfer Load Step

An OptiStruct transient heat transfer loadstep is created which references the time
steps in the load collector Time Steps, the initial conditions in the load collector
Initial Conditions, DLOAD in the TLOAD, and the SPC boundary condition in the load
collector SPC TEMP.

Output Request

1. From the Analysis page, click on the control card panel.

2. Select GLOBAL_OUTPUT_REQUEST.

3. Check FLUX and THERMAL check boxes button to request these outputs in H3d
format.

4. Click Return twice.

Step 6: Run the analysis

Step 7: Review the results in HyperView

87
7.2 One Step Transient Thermal Stress Analysis

Like in steady-state coupled thermal-structural analysis, we can “merge” a transient

thermal analysis with a static subcase. However, in this case it is called a “One-Step”
analysis, which is because transient analysis generates a temperature field for each
time step, which in fact makes it possible to apply temperature field at each time step
to the static subcase – as a result solution is presented as a simultaneous interaction
between thermal and structural states. But since the structural load step is not
transient, i.e. it can be either linear static or nonlinear static, OptiStruct splits the
static subcase into a number of small static subcases equal to the number of time
steps, during which temperature field was calculated. However, from a solver’s point
of view, the transient thermal analysis is done first and the entire temperature field
history is applied to static subcase.

One step transient thermal stress analysis can be performed with:

• Linear static subcases

• Nonlinear static subcases

88
Industry examples of application:

• Exhaust Manifold – description and model download link in chapter 9.6 –

Linear One-Step Transient Thermal Stress Analysis
• Aluminium Bar – description and model download link in chapter 9.5 –
Nonlinear One-Step Transient Thermal Stress Analysis

A setup for OSTTS analysis is analogous to the sequentially coupled thermal analysis
with one addition: while referring the thermal subcase in structural subcase entry

under TEMP_LOAD, user needs to additionally check HTIME keyword, to select time
steps from the transient thermal analysis.

OSTTS may take long computing time and generate large result files. It is
recommended to use skip factor in TSTEP to write temperature result at a limited
number of time steps, especially for nonlinear OSTTS.

EXAMPLE:

Problem description:

• Time dependent flux input QBDY1 referred by TLOAD1; imposed

temperatures; IC=0
• Stress analysis boundary conditions: fixed at both ends

89
 • TEMP(LOAD/BOTH, HTIME=ALL)

Temperature history and peak stress history from OSTTS are shown in the image. The
peak temperature is 43.27 degrees Celsius at 145 seconds, while the stress peak is
42.35 Mpa at 165 seconds. Note that the peak stress is not required to occur at the
same time as the peak temperature or at the initial or final time step. This illustrates
that OSTTS is useful in capturing the stress peak over the duration of the transient
analysis.

90
7.2.1 Tutorial: One-Step Transient Thermal Stress
Analysis

This exercise covers step by step process of One-Step Transient Thermal Stress
(OSTTS) Analysis. Heating of Pipe from free convection of variable ambient
temperature at external surface (373K*scale factor). Fixed boundary condition on
both ends. Model: Pipe linear one step transient.hm (Download required model file
from the folder)

Step 1: Create the Material

91
Step 2: Create the Properties

1. Right click on the model browser to create a new Property.

2. Enter psolids as a name and PSOLID as a Card Image.

Step 3: Assign the material and property to component

Once the material and property are defined, they need to be linked to the structure.

1. In the Model Browser, click on the pipe component.

The component template displays in the Entity Editor.

2. For Property, click Unspecified > Property.

3. In the Select Property dialog, select psolids and click OK.

Step 4: Applying Transient Thermal Boundary Conditions

1. Create a new load collector named TABLED1 and set the Card Image as TABLED1.

92
2. For TABLED1_NUM, enter 4 and press Enter.

3. In the table, enter data as per below screenshot.

4. Click Close.

Creating Transient Heat Transfer Analysis Initial Conditions

1. In the Model Browser, right-click and select Create > Load

Collector.

2. For Name, enter Initial Conditions.

3. For Card Image, select TEMPD.

4. For T1, enter a value of 373.0

Creating Transient Heat Transfer Analysis Time Steps

1. In the Model Browser, right-click and select Create > Load Collector.

2. For Name, enter Time Steps.

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3. For Card Image, select TSTEP.

4. For TSTEP_NUM, enter a value of 1.

5. Click and enter the number of time steps (N) = 100 and set each time increment
(DT) to 1

This encompasses a total time period of 100 seconds in which to capture the
behavior of the system.

6. Click Close.

Creating a Time-variant Temperature

1. Create load collector named SPCD, and for Card Image, select None.

2. Next, create the amplitude (constant part) of the time variant temperature using
an SPCD data entry. Click BCs > Create > Constraints.

3. The temperature is set by using the SPCD data entry to control an existing node
outside the actual structure. In the Constraints panel, click nodes > by id, enter
18472 in the id= field and press Enter.

The ambient node is highlighted in the Entity Editor above the structure.

4. Enter 10.0 in the size= field and uncheck the boxes beside all the degrees of
freedom (dof1 through dof6) and enter 0.0 in all the fields next to the dof#.

5. For load types =, select SPCD.

Creating an SPCD entry to control the temperature.

6. Click create/edit and enter 373 in the D field on the SPCD data entry.

This creates an SPCD referencing the ambient node specifying a temperature of

373K.

94
7. Click return twice to go back to the Analysis page.

A time variable temperature can be created by referencing an SPCD entry via a

TLOAD1 data entry.

1. In the Model Browser, right-click and select Create > Load Collector.

2. For Name, enter TLOAD.

3. For Card Image, select TLOAD1.

4. For EXCITEID, select the SPCD load collector from the menu.

5. For TYPE, select DISP, then click TID and select the TABLED1 load collector menu.

6. Create a new load collector named SPC TEMP and for Card Image, select None.

Create temperature load load type set as SPC on node id 18472 and define value as
0.0 (BCs > Create > Temperature)

Create a free convection interface

1. Go to BCs > Create > Interfaces

95
2. Create a Conv interface with card image CONVECTION and reference to Mat
material:

3. Choose Slave elements by clicking on “0 Elements”. A panel for element

selection will pop up. Use option “Add solid faces” to select the external
surface of the pipe. Click “Add”

4. Click “close”.

5. Now we need to edit Card image of the newly created CHBDYE4 elements. Click

“Card Edit” button . Switch the selector to “elems” and select “by group” >

96
 Conv. This will select all thermal interface elements. For “config=” choose
slave4 and for “type =” select CHBDYE4. Click “Edit”

6. Check option next to CONV on the bottom and edit TA1 field to choose a node
id 18472.

7. Click return two times.

Create constraints for structural case

1. Create a new load collector named SPC Struct and for Card Image, select None.

2. Make sure that the newly created load collector SPC Struct is current and click BCs
> Create > Constraints and click nodes in the Constraints panel.

3. Select corner nodes of the tube end

4. Enter 5.0 in the size= field and check the boxes beside all the degrees of freedom
(dof1 through dof6) and enter 0.0 in all the fields next to the dof#.

5. For load types =, select SPC.

6. Click return twice to go back to the Analysis page.

97
Step 5: Creating Load Step and Output request

Creating Heat Transfer loadstep and request outputs

1. In the Model Browser, right-click and select Create > Load Step.

A default load step displays in the Entity Editor.

2. For Name, enter heat.

3. Verify that the Analysis type is set to HEAT transfer (transient), define subcase
definition as per below screenshot and subcase options set for output as
Thermal/Flux> Option set to All> FORMAT set to H3d and click on create.

Create a new loadcase for One step transient thermal analysis and request
outputs

1. Right-click in the Model Browser and select Create > Load step.

98
2. Set the Analysis type to Linear Static and subcase option as shown below:

Output of displacement and stress for Structure subcase generated default.

Step 6: Run the analysis

Step 7: Review the results in HyperView

99
7.3 Nonlinear Transient Heat Transfer Analysis
Calculate the temperature distribution in a system with respect to time.

The applied thermal loads can either be time-dependent or time-invariant; transient

thermal analysis is used to capture the thermal behavior of a system over a specific
period of time.

The basic finite element equation for transient heat transfer analysis is given by:

C˙T+F(K)+[H]T=PCT˙+F(K)+[H]T=P

C is the heat capacity matrix,

F(K) is the internal power, due to temperature-dependent conductivity(K),

H is the boundary convection matrix, due to free convection,

T˙ is the derivative of the nodal temperature matrix with respect to time,

T is the unknown nodal temperature matrix, and

P is the thermal loading vector.

When the conductivity matrix becomes temperature dependent, then it is

nonlinear transient heat transfer analysis

100
101
102
8 Contact-Based Thermal
Analysis
In OptiStruct, structural models involving contact are solved by using Small
Displacement Nonlinear Analysis.

The analysis involves finding the contact status, such as contact clearance and
pressure. Contact clearance spans the distance between the master and slave, while
contact pressure is developed between two surfaces in contact.

Contact-Based Thermal Analysis may be required when heat transfer occurs on the
boundary of two solid parts. In reality, thermal behavior in the area of contact is not
that straight forward, therefore OptiStruct allows quite a comprehensive setup of
contact thermal properties.

The traditional thermal structural analysis is one-way coupling, in the sense that
thermal analysis influences structural analysis by providing temperature, but
structural problem does not affect the thermal problem.

Figure 1

When contact problems are involved, thermal structural analysis becomes fully
coupled since contact status changes thermal conductance.

103
 Figure 2

In Figure 1, you can see that a change in contact status does not affect the thermal
problem. This may lead to inaccurate solutions if thermal conductance depends on
the contact status. In Figure 2, the contact clearance and/or pressure changes during
the course of the quasi-static nonlinear analysis, the corresponding change in the
thermal conductance will affect the solution of the thermal problem.

Contact-Based Thermal-Structural Analysis is mostly about contact-dependent

conductance, which can change due to:

• Contact status change

• Contact pressure change
• Contact clearance change

This property of a contact interface is described in detail in this chapter.

8.1 Iterative Solver

Since the analysis is fully coupled, it needs constant exchange of information between
thermal and structural subcases. Therefore, OptiStruct needs to iterate the process of
sequentially performed thermal and structural subcases until a certain level of
convergence is achieved, i.e. thermal results of a certain iteration will not be too much
different than the ones from thermal analysis from previous iteration, before contact
status update. i.e. provided the contact status update is little enough.

104
The solver’s procedure is presented below:

Thermal analysis is performed first

using initial contact status.
Nonlinear structural analysis is
employed to find contact status.
Thermal conductance at the contact
interface is calculated based on
contact clearance or pressure or
based on user-defined values.
Coupling is essential because the contact status is used to determine thermal
conductance. Temperature results from thermal analysis are used as convergence
criteria.

8.2 Thermal Contact Properties

In OptiStruct, structural models involving contact are solved by using Small
Displacement Nonlinear Analysis. The analysis involves finding the contact status,
such as contact clearance and pressure. Contact clearance spans the distance
between the master and slave, while contact pressure is developed between two
surfaces in contact.

Thermal (Area-Based) Conductivity for contacts is defined in the following ways:

• For thermal contact problems with CGAP/CGAPG, PGAPHT is required. The

PGAPHT entry should have the same PID as PGAP. For problems with CONTACT
and PCONT, the PCONTHT entry should be used and it requires the same PID as
PCONT.

• For contacts without PCONT property, i.e. contacts of type SLIDE, STICK,
FREEZE the thermal conductivity is automatically evaluated based on
contacting elements thermal conductivity, that means 100% conductivity is
available when contact status is closed and 0% conductivity when the contact

105
 status is open. This will mean that FREEZE contact provides constantly full
conductivity and therefore iterative procedure will converge immediately.

• When PCONT property is used, activation of PCONTHT field must be done:

KC_opts checked sets it to AUTO mode. This option will behave exactly the same as
described in the previous point. Also, without KC_opts checked, a real value for
conductivity can be specified for closed status (KCHTC). KOHTC (conductivity for
open contact) is set by default to 10e-14 KCHTC.

Also, user can specify tabular data for both pressure- and clearance-dependent
thermal conductivity. They will be referred in TPID and TCID entries in PCONTHT
(see above).

Theoretically, while higher conductance values enforce a perfect conductor,

excessively high values may cause poor conditioning of the conductivity matrix. If
such effects are observed, it may be beneficial to reduce the value of conductance,
or use conductance based contact clearance and pressure.

NOTE ABOUT THE UNITS:

The units are not the same as for thermal conductivity in material properties! They
are actually the same as for Heat Transfer Coefficient (H) - exemplary units:
W/m²°K, generally: rate of heat transfer per unit area per unit degree of
temperature)

106
Pressure based thermal conductance

When parts are in contact, heat transfer efficiency can be influenced by the contact
pressure.

The pressure based conductance values can be specified one the TABLED# entries.
The typical conductivity values vary as follows:

Clearance based thermal conductance

When parts in contact are separating from each other, transfer efficiency is directly
related to the separation distance

• The clearance-based conductance per unit contact area can be specified through
the TABLEDi entries (which should start from zero clearance). Conductance is
linearly interpolated within the range on the TABLEDi entry. It is extrapolated to
zero outside the range (TCID in PCONTHT).

• KCHTC=AUTO determines the value of KCHTC for each contact element using
the contact HTC values of surrounding elements.

107
Clearance and pressure based thermal conductance

Both clearance- and pressure-dependent thermal conductances can be set and

referred in TCID and TPID entries.

Typical thermal conductance values increase as the clearance between the master
and slave decreases. In the case of contact pressure, the thermal conductance
increases with a corresponding increase in pressure.

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Thermal Bulk Data Cards: PCONTHT Parameters

The PCONTHT card defines heat conductance per unit area (also called heat transfer
coefficient) for CONTACT elements

(1) (2) (3) (4) (5) (6) (7) (8) (9) (10)

PCONTHT PID KCHTC KOHTC TPID TCID

Where:

Property identification number. Must match with a PID of

PID a PCONT bulk data entry.

KCHTC Contact Heat Transfer Coefficient (HTC) for the closed contact.

KOHTC Contact Heat Transfer Coefficient (HTC) for the open contact.

Identification number of a TABLEDi entry which specifies Contact

TPID HTC based on contact pressure

Identification number of a TABLEDi entry which specifies Contact

TCID HTC based on contact clearance

Tip: PCONTHT is not supported for surface-to-surface contact (DISCRET=S2S on

CONTACT/TIE)

Tip: For CONTACT interfaces without PCONT, PCONTHT is not required. Thermal
Contact HTC values based on KCHTC=AUTO will be utilized in such cases.

Thermal Bulk Data Cards: PGAPHT Parameters

The PGAPHT card defines heat transfer conduction properties for CGAP or CGAPG
elements for heat transfer analysis by linking to the existing PGAP card for those
elements.

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 (1) (2) (3) (4) (5) (6) (7) (8) (9) (10)

PGAPHT PID KAHT KBHT TCID

Where:

PID Property identification number of an existing PGAP bulk data entry.

KAHT Thermal conductance of the gap when closed

KBHT Thermal conductance of the gap when open

Identification number of a TABLEDi entry which specifies the gap

TCID conductance based upon gap clearance

8.3 Thermal Contact without Static Analysis

Pure heat transfer analysis with thermal contact is solved based on initial contact
status. Contact clearance and area are calculated based on geometry.

KAHT, KBHT and TCID on PGAPHT Bulk Data Entry and KCHTC, KOHTC and TCID on
PCONTHT Bulk Data Entry can be used. Contact pressure is not available without
static analysis. Therefore, TPID cannot be used in such a scenario.

8.4 Contact-Based Thermal-Structural Analysis

Setup

Like in Coupled Thermal-Structural Analysis a reference to thermal subcase in

structural subcase is done, in contact-based thermal analysis a thermal subcase must
also have a reference to a structural subcase:

110
• STATSUB(STRUCT) is used in thermal subcase entry to refer to structural
subcase

• TEMP_LOAD subcase option is used in structural subcase to refer to thermal

subcase

8.5 Tutorial: Setting up Thermal Contacts for the

Bolted Pipe Flange Model

This tutorial introduces the user to using HyperMesh Desktop to set up a fully-
coupled thermomechanical analysis on a pipe support loaded by a pair of pipes. The
model is a mixture of solid elements and 1-dimensional supports with a small
number of SPCs already defined. The pipes will be modeled as Polyamide and the
pipe support will be set up as nylon. Contact will be the primary mode of thermal
transfer.

111
(Download required model file from the folder)

Step 1: Open the model ThermoMechanical_Coupling.hm in HyperMesh Desktop

Step 2: Create a new TABLEM1 load collector to hold the thermal/modulus curve

112
Step 3: Create the materials for each of the components

NOTE: MATT1 extension has been used here to define temperature-dependent

stiffness for Nylon material, note that MATT1 entry is analogic to the MATT4
extension in MAT4 card image.

Step 4: Create PSOLID properties for the pipe support and the pipes

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Step 5: Assign the PSOLID properties to their respective components

Step 6: Create a PBUSH property, setup stiffness values as below and assign it to
Extremities_Block component:

Step 7: Create contact surfaces for the pipe support and the tube exteriors in the
vicinity of the pipe support

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Tip: Remember that the contact surfaces must point toward each other for the
contact to be set up correctly.

Step 8: Create two new TABLED1 load collectors to support the contact definition
for clearance and pressure-based analysis

115
Step 9: Create a new contact property which details the parameters for fully-coupled
heat transfer contact

Step 10: Create a new contact using the contact surfaces for pipes and support and
the contact property

116
Step 11: Create a new load collector named SPC_Thermal

Step 12: Create a new SPC on a free node at {-20,0,200} for cold convection and set
the SPC to 5 degrees

Step 13: Create a new SPC on a free node at {20,0,200} for hot convection and set
the SPC to 75 degrees

Step 14: Create a new set of CHBDYE convection elements the interior surface of the
Tube_Cold component and edit the elements in the group to reference the cold
convection node (card edit the elems of config= slave4 and type= CHBDYE4, you can
select them using “by group” selection, add the ambient node in TA1 field).

117
Step 15: Create a new set of CHBDYE convection elements the interior surface of the
Tube_Hot component and edit the elements in the group to reference the hot
convection node (card edit the elems of config= slave4 and type= CHBDYE4, you can
select them using “by group” selection, add the ambient node in TA1 field)

Step 16: Create a nonlinear parameter load collector to drive the structural
nonlinear simulation

118
Step 17: Create the load steps for thermal analysis with mechanical input,
mechanical analysis with thermal loading, and thermal only analysis

119
Tip: For Thermal analysis with mechanical STATSUB, enable all FLUX and THERMAL
outputs. Also, since the thermal analysis above references the mechanical analysis
load step and viceversa, both subcases have to be created before the mechanical
subcase is linked to the thermal load case.

Step 18: Run the simulation in OptiStruct

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Step 19: Post-process the von Mises stress, Temperature, and Displacement results
from the Mechanical analysis results in HyperView

121
9 Additional Industry Examples
These examples were developed in order to gain confidence by working on real life
examples. Of course, loads and boundary conditions chosen in these examples are
based on the assumption that one could get more accurate results while considering
actual material property and boundary conditions. We try to cover most commonly
used applications in these examples. This model can also be used for further design
optimization.

9.1 Heat Sink: Steady State Thermal Analysis

Heat sink with fins are commonly used in engineering applications to dissipate heat.
The 3D geometry of an aluminum heat sink designed for cooling. The cross-sectional
view of a furnace constructed from two materials.

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Model Description: The inner part is made of copper and the outer heat sink wall is
made of aluminum. The outer heat sink wall comes into contact with the ambient
air and heat convection takes place. (Download required file from the folder)

The Finite element model consists of three different materials.

Results:

Grid Temperature/Element Temperature & SPCF Power/Element Flux contour

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9.2 Engine Block: Heat Transfer Analysis

The temperature distribution in an engine block is an important factor when

designing a four-cylinder engine. The heat flux generated during ignition is 4
W/mm2 but the temperature inside the engine bay is 250°C.

The analysis of the engine block is focused on the differences between the
temperature gradient when the engine is working uncooled and when the engine is
liquid cooled at 225°C.The material used to manufacture the engine block is steel
and has a thermal conductivity value of 0.037 W/ mm°C.

Engine Block with Cooling Load (Download required file from the folder)

124
 Engine Block with without Cooling Load

Results

Grid Temperature and Element Temperature contour

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9.3 Brake Disc: Coupled Linear Heat Transfer and
Structural Analysis
Objective: To study the coupled thermal and structural linear analysis of a brake
disc.

Model information: The braking surface dissipate heat at a constant flux. The
performance requirement is that temperature on the braking surfaces should not
be more than 600°C.The model is symmetric in the azimuthal direction. The brake
disc is mounted to the hub in the axial directions.

126
(Download required file from the folder)

The solid element properties are:

Brake Disc: First order Solid elements

The material properties for the manifold are:

Youngs Modulus: 115000 MPa

Thermal Conductivity: 0.071 W/mmK,

Poisson Ratio: 0.26

Thermal expansion coefficient: 9e-006

Free convection heat transfer coefficient:0.0005

Results

NOTE: HyperView Symmetry option have been used to plot symmetric results

127
Grid Temperature and Flux output

Displacement and Stress contours

9.4 Extended Surface Fin: Linear Transient Heat

Transfer Analysis
This example presents a linear transient heat transfer analysis on a steel extended-
surface heat transfer fin attached to the outer surface of a system generating heat
flux (Example: IC engine). The extended-surface heat transfer fin analyzed in this
example is one of many from an array of such fins connected to the system. The fins
draw heat away from the outer surface of the system and dissipate it to the

128
surrounding air. The process of heat transfer out of the fin depends upon the flow
of air around the fin (Free or forced convection). In the current tutorial, the focus is
on transient heat transfer through heat flux loading and free convection dissipation.

An extended surface heat transfer fin made of steel. To meet certain structural
design requirements, the fin is bent at 90° at approximately a quarter of its length.

The extended surface heat transfer fin is meshed with CHEXA elements in
HyperMesh and a transient heat transfer analysis is performed in HyperMesh using
the Altair OptiStruct solver. A typical heat flux load of 100 KW/m2 is applied to the
face connected to the outer surface of the system. An ambient temperature of 25°C
is assumed and all material properties are assumed to remain constant with
temperature and time. Free (Natural) convection is assumed over the entire surface
of the material, wherein heat transfer between the surface of the fin and the
surrounding air occurs due to a complex mechanism of density differences as a
result of temperature gradients. (Download required file from the folder)

129
Results

Grid Temperature and Flux output at 500 seconds

Grid Temperature at 500 seconds with free convection and without free convection

130
9.5 Aluminium Bar: Nonlinear One-Step Transient
Thermal Analysis

This example introduces the user to use HyperMesh Desktop to set up one-step
transient thermal analysis. The aim of this example is to determine the residual
plastic strain in an aluminium bar submitted to volume heating for 6sec. Plastic
strains are calculated 4 seconds after the end of volume heating.

The solid element properties are:

Aluminium Bar: First order Hex elements

The material properties for the aluminium Bar are:

Youngs Modulus: 70000 MPa

Density: 2.4e-009 tonnes/mm3

Poisson Ratio: 0.3

Thermal expansion coefficient: 1e-005

Thermal Conductivity: 0.2

Heat Capacity per unit mass: 921 / Heat generation: 0.01

(Download required file from the folder)

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Nonlinear material parameter of MATS1 card

Type: Plastic

Work hardening slope:30000, Yield function criterion:1

Hardening Rule:1, Initial Yield Poin:200

Results

Element Flux and Grid Temperature output at 3 seconds

Element stress and Plastic strain contour

132
9.6 Exhaust Manifold: One Step Thermal Transient
Stress Analysis

Model Description: An engine exhaust manifold with conjugate heat transfer and
structural deformation, constructed of gray cast iron, initially at 300 K. The manifold
outer surface has a convective heat transfer coefficient of h = 6 W/m2 K at 300 K.
The four inlets to the manifold are held at 500 K with air as the fluid at 5 m/s.
Temperature history is available after linear transient heat transfer analysis. In order
to apply temperatures at multiple time steps to a structural analysis, one step
transient thermal stress analysis should be used. It provides displacement and stress
history for the duration of transient heat transfer. In order to perform one step
transient thermal stress analysis, you can define a linear transient heat transfer
subcase and a static subcase. TEMPERATURE case control cards with HTIME keyword
can be used in static subcase to choose selected or all-time steps to perform stress
analysis.

Tip: One step transient thermal stress analysis is to perform static analysis at all
output time steps of transient heat transfer analysis. Transient heat transfer analysis
outputs temperature results for every time step by default. This can result in a long
simulation time and create large result files. It is recommended to use the skip factor
on TSTEP card to write temperature results for a limited number of time steps, with
which one step transient thermal stress analysis can still capture the stress history
without added computational cost. When one step transient thermal stress analysis
is a nonlinear static subcase, the number of time steps should be further limited.
DLOAD is not supported.

(Download required file from the folder)

133
Results

Grid Temperature Contour

Element Stress and Plastic Strain Contour

134
 9.7 Manifold: Nonlinear Transient Heat Transfer

Nonlinear transient heat transfer analysis of a manifold is done using OptiStruct. The
thermal conductivity of the material is a function of temperature.

Model Description

Consists of a manifold, on which the inlet is maintained at 355°C and the outlet at
122°C. The inside of the manifold is maintained at a temperature of 816°C.
Temperature dependent material properties are defined using TABLEM1. Convective
heat transfer occurs through the inside surface of the manifold. Here you run a
nonlinear heat transfer analysis

(Download required file from the folder

The solid element properties of the Manifold: First order Solid elements

135
The material properties for the manifold are:

• Thermal Conductivity: 0.045 W/mm°K

• Poisson Ratio: 0.3
• Density: 7.9 x 10-9 ton/mm3

Results

Variation of Element flux & Grid Temperature at Time 0.05 Seconds

Variation of Element flux & Grid Temperature at Time 1 Seconds

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9.8 Piston Ring: Heat Transfer Analysis with GAP
Elements

Piston rings fit on the outer surface of a piston in an engine. They support heat
transfer from the piston to the cylinder wall. This tutorial demonstrates running a
heat transfer analysis on a set of piston rings. The inner ring takes the heat flux
(10.0W/m2) from the piston. The outer surface of the ring that contacts the cylinder
wall has zero degree temperatures. FREEZE gap elements are used to model the
contact between the two rings. Thermal conduction property PGAPHT is defined for
gap elements to simulate the heat transfer between the rings. The thermal
boundary condition, heat flux loading, and a linear steady state heat conduction
subcase have already been defined in the model. You will focus on how to define
PGAPHT for gap elements in this exercise.

Note that without PGAPHT, the heat cannot be transferred through the gap
elements. In this case, the outer ring remains zero degree and the inner ring takes
all heat, as shown in the temperature results. Run the completed model and
compare the results with PGAPHT to the results below. (Download required
file from the folder)

137
138
10 Appendix
This section discusses typical and frequently asked questions regarding OptiStruct
thermal analysis.

10.1 Card Images Summary Table

Short summary of used card images

Card
Entity group image Description Application Notes
Conductivity,
Materials with specific heat,
Constant
temperature- density, free
isotropic
Materials MAT4 independent and convection transfer
thermal
isotropic thermal coefficient and heat
material card.
properties. generation scaling
factor (for QVOL)
Extension to
MAT4 card: Materials with Tabular values act
temperature- temperature- as multipliers for
MATT4 dependent dependent and conductivity value
conductivity via isotropic thermal given in MAT4
TABLEMi or properties. entry.
TABLEG entry.
Materials with
temperature- Conductivity,
Constant
independent specific heat,
anisotropic
MAT5 thermal density and heat
thermal
properties and generation scaling
material card.
anisotropic factor (for QVOL).
conductivity.
Extension to
MAT5 card: Materials with Tabular values act
temperature- temperature- as multipliers for
MATT5 dependent dependent and conductivity values
conductivity via isotropic given in MAT5
TABLEMi or conductivity. entry.
TABLEG entry.

139
 This is not a
General
specifically thermal
hyperelastic
Nonlinear material model,
materials, where
MATHE hyperelastic however a
thermal effects
material card. coefficient of
need to be
thermal expansion
considered.
can be defined.
Recommended
for both zero and Can be either 0.0 or
Enforced
non-zero non-zero value.
displacement
BCs SPC enforced Referred in SPC
(temperature)
temperatures. In entry of subcase
condition.
steady-state card.
analyses.
Generally not
Must be a 0.0 value.
Enforced frequently used
If paired with SPCD
SPC1 displacement card image for
entry, other value
(temperature). enforced
might be used.
temperatures.
Enforced Can be used for The collector
displacement transient analyses containing SPCD is
SPCD (or as EXCITEID for referred in LOAD
temperature) time-dependent entry of subcase
condition. TLOADi card. card.
Referred by
TEMPERATURE or
TEMPERATURE(BOT
H) subcase entry for
Applicable when a
steady-state
Initial certain set of grid
analysis and by IC
Initial temperature points needs to
TEMP for transient
Condition for certain grid be assigned with
analysis. Defined
points (or sets). initial
through
temperature.
"temperatures"
panel. Load
collector does not
have card image.
Specified as a
Applicable when
combination of
Defines varying
reference plane
temperature temperature
TEMPP1 temperature and
field for shell across element
linear thermal
elements thicknesses plays
gradient through
crucial role.
thickness.

140
 Affects all grid
points, except those
defined by TEMP
Initial Applicable when a card. Reffered by
temperature general initial subcases in the
TEMPD for all grid temperature same manner as
points (ambient needs to be TEMP.Defined as a
temperature). defined. load collector card
image. Then a
global parameter T1
needs to be set.
Defined through
"flux" panel. Power
input per unit
Defines a rate Used when a volme (i.e.
of volumetric volumetric heat W/mm^3). The total
Loads QVOL heat addition source is present body power
in a conduction like i.e. chemical generated: P =
element. reactions. volume * HGEN *
QVOL, where HGEN
is MAT4/5 scaling
factor.
Defined through
Defines a Used when a
"flux" panel. Q0
uniform heat thermal flux
parameter: power
QBDY1 flux through a model
input per unit
for CHBDYE ele surface needs to
surface (i.e.
ments. be included.
W/mm^2)
Can be applied to
QVOL, QBDY1 or
Used for transient
Time- SPCD thermal
TLOAD1/ analyses, to
dependent loading, which are
2 specify a load
load. referenced as
history.
EXCITEID parameter
of TLOADi.
Thermal energy
transfer between
Free "SPC/SPCD"
convection Must be defined temperature BCs
parameters. whenever free and surface
Interactions PCONV
"Group" with convection is elements "CHBDYE"
card image needed. depending on "H"
CONVECTION. heat transfer
coefficient defined
in MAT4.

141
 Card activated in
card edit of
Must be defined slave3/4 - type
Defines a free
whenever free CHBDYE 3/4
CONV convection
convection is elements. PCONID
interaction.
needed. must refer PCONV
card. TA1 refer the
SPC/SPCD BCs.
Interaction An actual element is
elements slave3/4 and
Thermal flux
A special kind CHBDYE3/4 is a type
(QBDY1) or free
CHBDYE3 of element that of slave element.
convection
(slave3) is non- They are created
(CONV) surfaces
& structural and when a face for flux
can only be
CHBDYE4 is used to or free convection is
defined using
(slave4) define thermal chosen. CHBDYE3
CHBDYE
interactions. stays for tria and
elements.
CHBDYE4 for quad
face elements.

10.2 Thermal Expansion Coefficient Support for

Rigid Elements

Thermal expansion is the tendency of matter to change in shape, area and volume
in response to change in temperature. The degree of expansion divided by the
change in temperature is called the material ‘s coefficient of thermal expansion.

How to setup in OptiStruct?

Supported by ‘ALPHA’ field on RBE2, RBE3, RROD, RBAR

• Thermal load is requested by the TEMPERATURE(INITIAL) and

TEMPERATURE(LOAD) subcase information entries.

• The temperature of the element is taken to be the average of the

temperatures at all the nodes of the element.

142
10.3 Tools Menu to set up Convection Load and
Heat Transfer Analysis

Thermal boundary condition SPC with D value is now available in Temperature panel;
with this, you can map ambient temperature on structure from external file through
linear interpolation option in the Temperature panel.

Feature supported version: OptiStruct Interface 2017.1 or above

143
10.4 Clearance Based Conductance Table for HEAT
Subcases

Thermal contact analysis can be performed without performing static analysis.

TCID field can be input for only Heat Transfer subcases.

KCHTC (closed contact), KOHTC (open contact) are conductance per unit area –
W/(M2*K), Contact Heat Transfer Coefficients.

TPID specifies conductance per unit area vs. pressure table – W/(M2*K)

TCID specifies conductance per unit area vs. clearance table – W/(M2*K)

TPID overrides KCHTC for coupled thermal contact analysis.

TCID overrides KOHTC.

TCID overrides KCHTC for closed contact if TPID is not present.

Feature supported version: OptiStruct 14.0.210 or above.

144
 PCONTHT
(1) (2) (3) (4) (5) (6) (7) (8) (9) (10)

PCONTHT PID KCHTC KOHTC TPID TCID

Example:

• Two blocks connected by contact

• Heat transfer analysis and no static analysis
• SPC on the left
• Volumetric heat generation (QVOL) on right
• PCONTHT with TCID defined

(Download required file from the folder) tcid_contact_qvol.fem

10.5 Thermal Stress Steady State Analysis

Not only forces or moments, but also temperature changes cause bodies to expand
or contract. The total strain of a body is the sum of mechanical strain and heat strain:

ε=𝜀𝜀_𝜎𝜎+𝜀𝜀_𝑇𝑇= 𝜎𝜎/𝐸𝐸+𝛼𝛼_𝑇𝑇 Δ𝑇𝑇

145
with thermal expansion coefficient 𝛼𝛼_𝑇𝑇 and temperature change Δ𝑇𝑇

If a body cannot expand unrestricted, there are constraints which lead to (thermal)
stress:

𝜎𝜎=𝐸𝐸 (𝜀𝜀−𝛼𝛼_𝑇𝑇 Δ𝑇𝑇)

The thermal expansion coefficient A and a reference temperature TREF for thermal
loading can be defined on the material cards, e.g. MAT1:

10.6 Debugging for Heat Transfer Analysis

• Shell elements are considered to be membranes in Heat Transfer Analysis.

Composite properties are homogenized (1 degree of freedom per grid). The
temperature distribution through the thickness of shell elements is not
calculated. Only nodal temperature is determined.

• Non-zero SPC will be considered as zero SPC for transient thermal analysis,
except when non-zero SPC are used to specify ambient points for
convection. When an ambient point is controlled by TLOAD1/TLOAD2 via
SPCD, the corresponding SPC should be zero. Temperature dependent
conductivity only works with NLHEAT

• The units are not the same as for thermal conductivity in material
properties! They are actually the same as for Heat Transfer Coefficient (H) -
exemplary units: W/m²°K, generally: rate of heat transfer per unit area per
unit degree of temperature.

• TABLEM1 in MATT4 defines multipliers, not actual conductivity

146
10.7 OptiStruct Online Tutorials List

• OS-T: 1080 Coupled Linear Heat Transfer/Structure Analysis

• OS-T: 1085 Linear Steady-state Heat Convection Analysis
• OS-T: 1090 Linear Transient Heat Transfer Analysis of an Extended Surface
Heat Transfer Fin

• OS-T: 1100 Thermal Stress Analysis of a Printed Circuit Board with

Anisotropic Material Properties

• OS-T: 1385 Heat Transfer Analysis on Piston Rings with GAP Elements

147