Sii9233A Hdmi Receiver With Repeater, Multi-Channel Audio, and Deep Color
Sii9233A Hdmi Receiver With Repeater, Multi-Channel Audio, and Deep Color
Data Brief
Document # SiI-DB-1061-A07
August 2010
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Trademark Acknowledgment
Silicon Image™, VastLane™, SteelVine™, PinnaClear™, Simplay™, Simplay HD™, Satalink™, InstaPort™, and
TMDS™ are trademarks or registered trademarks of Silicon Image, Inc. in the United States and other countries.
HDMI®, the HDMI logo and High-Definition Multimedia Interface™ are trademarks or registered trademarks of, and are
used under license from, HDMI Licensing, LLC. x.v.Color™ is a trademark of Sony Corporation.
Further Information
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Introduction Inputs
The SiI9233A HDMI Receiver with Repeater, Multi- • Four HDMI/DVI-compatible ports
channel Audio, and Deep Color is a 4-port HDMI® • TMDS™ core runs at 25–225 MHz
receiver. AV receivers that connect to DTVs displaying
10/12-bit color depth can now provide the highest quality
protected digital audio and video, including common 3D Digital Video Output
formats up to 12-bit, 1080p at 24 Hz resolution. The • xvYCC to extended RGB
receiver supports Deep Color video up to 12-bit, 1080p • 36-bit RGB/YCbCr 4:4:4
at 60 Hz. Efficient color space conversion receives RGB • 16/20/24-bit YCbCr 4:2:2
or YCbCr video data and sends either standard-definition
• 8/10/12-bit YCbCr 4:2:2 (ITU BT.656)
or high-definition RGB or YCbCr formats.
• True 12-bit accurate output data using an
The SiI9233A receiver supports the extended gamut YCC internal14-bit wide processing path
or xvYCC color space, described in the IEC 61966-2-4
• Programmable drive strength from 2 mA to 14 mA
specification, that supports approximately 1.8 times the
number of colors as the RGB color space. The xvYCC
color space also makes full use of the range on the Digital Audio Interface
standard 8-bit resolution per pixel. • DTS-HD and Dolby TrueHD high bit rate audio
The SiI9233A receiver is pre-programmed with High- • I2S output with 4 data signals for multi-channel formats
bandwidth Digital Content Protection (HDCP) keys; and flexible, programmable channel mapping
this helps reduce programming overhead and lowers • S/PDIF output supports PCM, Dolby Digital, DTS
manufacturing costs. digital audio transmission with a 32–192 kHz Fs
An integrated Extended Display Identification Data sample rate
(EDID) block stored in non-volatile memory (NVM) • Intelligent audio mute capability avoids pops and
can be programmed at the time of manufacture using noise with automatic soft mute and unmute
the local I2C bus. On-board RAM can also be loaded • IEC60958 or IEC61937 compatible
with EDID data from the system microcontroller during
initialization if the NVM is not used. The EDID is
reflected on the four HDMI ports through the DDC bus. Control
Flexibility allows mixing different EDID formats in an • Consumer Electronics Control (CEC) interface
application. This feature can eliminate up to four EDID incorporates an HDMI CEC I/O and an integrated
ROMs while also saving board space. CEC Programming Interface (CPI)
Flexible power management provides extremely low • Automatic Feature Abort response for unsupported
standby power consumption; standby power can be supplied commands and automatic message retry on transmit
from an HDMI 5 V signal or from a separate standby power
pin. If the NVM stores the EDID, only the 5 V power from
the source device is needed to read the EDID. Package
• 20 mm x 20 mm 144-pin TQFP package with ePad™
System Applications
The SiI9233A receiver is designed for digital televisions that require support for HDMI Deep Color. The device allows
receipt of 10/12-bit color depth up to 1080p resolutions. A single receiver provides four HDMI input ports. The video
output interfaces to a video processor and the audio output can interface directly to an audio DAC or an audio DSP for
further processing as shown in Figure 1.
Pin Diagram
Figure 2 shows the pin assignments of theSiI9233A receiver. Pin names are generalized by type for this document. The
list below the diagram describes the purpose of each type. The package is 20 mm x 20 mm 144-pin TQFP package with
ePad™.
Package Information
ePad Requirements
The SiI9233A receiver is packaged in a 144-pin, 20 mm x 20 mm TQFP package with an ExposedPad™ (ePad™) that is
used for the electrical ground of the device and for improved thermal transfer characteristics. The ePad dimensions are
4.445 mm x 4.0604 mm ±0.15 mm. Soldering the ePad to the ground plane of the PCB is required to meet package
power dissipation requirements at full speed operation, and to correctly connect the chip circuitry to electrical ground. A
clearance of at least 0.25 mm should be designed on the PCB between the edge of the ePad and the inner edges of the
lead pads to avoid the possibility of electrical shorts.
The thermal land area on the PCB may use thermal vias to improve heat removal from the package. These thermal vias
also double as the ground connections of the chip and must attach internally in the PCB to the ground plane. An array of
vias should be designed into the PCB beneath the package. For optimum thermal performance, the via diameter should
be 12 mils to 13 mils (0.30 mm to 0.33 mm) and the via barrel should be plated with 1-ounce copper to plug the via. This
design helps to avoid any solder wicking inside the via during the soldering process, which may result in voids in solder
between the pad and the thermal land. If the copper plating does not plug the vias, the thermal vias can be tented with
solder mask on the top surface of the PCB to avoid solder wicking inside the via during assembly. The solder mask
diameter should be at least 4 mils (0.1 mm) larger than the via diameter.
Package stand-off when mounting the device also needs to be considered. For a nominal stand-off of approximately 0.1
mm the stencil thickness of 5 mils to 8 mils should provide a good solder joint between the ePad and the thermal land.
Figure 3 on the next page shows the package dimensions of the SiI9233A receiver.
CB Layout Guidelines
Refer to Silicon Image document PCB Layout Guidelines: Designing with Exposed Pads for basic PCB design
guidelines when designing with thermally enhanced packages using the exposed pad. This application note is intended
for use by PCB layout designers.
Package Dimensions
These drawings are not to scale.
Item Description Min Typ Max Item Description Min Typ Max
A Thickness 1.00 1.10 1.20 b Lead width 0.17 0.22 0.27
A1 Stand-off 0.05 0.10 0.15 C Lead thickness 0.09 — 0.20
A2 Body thickness 0.95 1.00 1.05 e Lead pitch 0.50 BSC
D Footprint 22.00 BSC L Lead foot length 0.45 0.60 0.75
E Footprint 22.00 BSC L1 Total lead length 1.00 REF
D1 Body size 20.00 BSC R1 Lead radius, inside 0.08 — —
E1 Body size 20.00 BSC R2 Lead radius, outside 0.08 — 0.20
D2 Lead Row Width 17.5 BSC S Lead horizontal run 0.20 — —
E2 Lead Row Width 17.5 BSC
Dimensions in millimeters.
Overall thickness A = A1 + A2.
Figure 3. 144-Pin TQFP Package Diagram
Marking Specification
Figure 4 shows the markings of the SiI9233A package. Refer to specifics in Figure 3 on page 5.
Ordering Information
Production Part Numbers: TMDS Input Clock Range Part Number
25–225 MHz SiI9233ACTU
The universal package may be used in lead-free and ordinary process lines.
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