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Denton 18 Operation Procedure

This document provides an overview and operating procedure for the Denton Discovery 18 sputtering system. Key points: - Sputtering involves accelerating argon ions into a target material to knock off atoms that deposit on a substrate, offering better step coverage than evaporation. - The system has three cathodes for sputtering dielectrics and metals from 3" targets onto 6" wafers with good uniformity. It can provide substrate rotation, heating up to 300°C, and reactive sputtering. - A 24 hour advance reservation is required when depositing over 2um of metal or 1um of dielectric. Tin sputtering requires a one week advance notice. - The operating
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0% found this document useful (0 votes)
398 views23 pages

Denton 18 Operation Procedure

This document provides an overview and operating procedure for the Denton Discovery 18 sputtering system. Key points: - Sputtering involves accelerating argon ions into a target material to knock off atoms that deposit on a substrate, offering better step coverage than evaporation. - The system has three cathodes for sputtering dielectrics and metals from 3" targets onto 6" wafers with good uniformity. It can provide substrate rotation, heating up to 300°C, and reactive sputtering. - A 24 hour advance reservation is required when depositing over 2um of metal or 1um of dielectric. Tin sputtering requires a one week advance notice. - The operating
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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System Overview

Sputtering
Sputter coatings are performed by accelerating Ar ions in a plasma into the surface
of a sputter target. This causes the target materials to be knocked off and
deposited on the substrate. Sputter coating normally offers better step coverage
compared to evaporation. While this is desired for some processes, it may make
processes such as lift-off (where line-of-sight deposition is preferrable) more
difficult.

System Specifications
• Three cathodes: #1 for RF sputtering (dielectrics), #2 & #3
for DC sputtering (metals) which holds 3’’ targets
• Gas 1: Ar; Gas 2: N2
• Holds up to 6’’ wafers; good uniformity over 6’’ range
• Substrate rotation up to ~20 rpm
• Typical process temperature < 34 °C; sample plate heating
up to 300 °C
• Directional deposition / substrate heat / reactive
sputtering capabilities (talk to NANO3 staff)

Denton Discovery 18 Operation Procedure 2


Reservation Requirements

• Please make reservation and specify target(s) to be used at least 24


hours in advance

• For > 2 μm metal deposition, please email Sean Parks


([email protected]) at least 24 hours in advance, so that the staff can
make sure the target is thick enough for the process

• For > 1 μm dielectric deposition, please email Sean Parks


([email protected]) at least 24 hours in advance, so that the staff can
make sure the target is thick enough for the process

• For Tin (Sn) sputtering, please make reservation at least one week
ahead and email Sean Parks ([email protected]) the same time, so
that the staff can arrange chamber protection with Al foil

Denton Discovery 18 Operation Procedure 3


System Components

Cathode
#1
Touchscreen

Cathode Cathode
#3 #2

Materials Installed
Viewport Gas Available

Denton Discovery 18 Operation Procedure 4


DC Sputtering Workflow
Wait
Auto Vent N Turn on Auto Pump
Keep door closed All Rotation Stay till FR1 < E-4 Torr
Y
Interlocks Gas
Stage N Green?
Temp Power Check Sealing
< 50 °C? Visual Check Surface / O-ring
Y Set Power
Max 400W (Au: 300W)
Open Door Pre-sputter
Clean Plate 10 - 30 s Replace Glass
Select Cathode
Mount Sample Slides
DC 1 Sputter
Open Shutter
Check Glass Control Take Sample
Visual Check
Slides Out
Gas Control
Set Sputter Pressure Y
Check Sealing Stage
Rotation & Close Shutter N
Surface / O-ring Temp
Heat Control < 50 °C?
Keep door closed
Auto Pump Turn off Power
Manual Mode
Auto Vent
Y
Fill LN2 FR1 < E-4 N End of Y
Auto Mode
(refill every 45 min) Torr? Process?
Wait
N
Denton Discovery 18 Operation Procedure 5
RF Sputtering Workflow
Wait
N
Auto Vent All Auto Pump
Y Turn on Rotation Stay till FR1 < E-4 Torr
Keep door closed Interlocks
Green? Gas
Stage N Close Hi-Vac
Temp Check Sealing
< 50 °C? Power on @100W
Open Hi-Vac Surface / O-ring
Y Set Power
Open Door 100W
Ramp up (25W/30s)
Clean Plate Replace Glass
Mount Sample RF 1 Sputter Pre-sputter Slides
Control 5 - 15 min

Check Glass Open Shutter Take Sample


Gas Control
Slides Set Sputter Pressure
Visual Check Out
Close Shutter Y
Check Sealing Rotation & Stage
Surface / O-ring Ramp down Temp
N
Heat Control
to 100W (50W/30s) < 50 °C?
Keep door closed
Auto Pump Manual Mode Turn off Power
Auto Vent
Y
Fill LN2 FR1 < E-4 N End of Y
Auto Mode
(refill every 45 min) Torr? Process?
Wait
N
Denton Discovery 18 Operation Procedure 6
1. Logging in & Venting
Make an entry into the log sheet (name, date, material to deposit).
Vent the chamber.
1) Press Auto A in System Overview screen to switch into auto mode. The Auto button will
turn from red to green.
2) Press Auto Control B.
3) Press Auto Vent C in the Auto Control screen to fill the chamber with N2. Do not vent the
chamber and walk away for a long period of time. Vent when ready to load sample. When
the chamber door opens slightly, the venting process is complete (~ 3 minutes)
4) Press Close D to switch back to the system Overview screen.

B D

Denton Discovery 18 Operation Procedure 7


2. Loading Sample
1) Check the stage temperature under Heat Temp. Deg C on the Overview screen. The
temperature is typically 22-34°C. If temperature is above 50°C, vent but do not open the
door. Wait for the stage to cool down.
2) Once temperature is less than 50°C, open the door and, using BOTH hands, remove the
sample plate (heavy) from the chamber. Take care not to hit the cathode or thermocouple.
Put the sample plate on polyester cleanroom cloth. NEVER place the sample plate on
polyester cloth when hot (> 50°C). Wipe down the sample plate with polyester cloth soaked
with IPA to clean the surface. Position your sample on the sample plate and put it back.

Sample Plate

Heat Temp.
Deg C

Denton Discovery 18 Operation Procedure 8


3. Pumping Down
1) Check if the glass slides inside the viewport on chamber door are clean. Replace if not.
2) Visually inspect the O-ring on the chamber door. Run through the metal sealing surface with
gloved hands. If there are particles, use a clean, dry polyester cloth to wipe down the O-ring
and the sealing surface. DO NOT use solvents! Close the chamber door and clamp it shut.
3) Press Auto Pump A in the Auto Control screen.
4) Make sure that the “FR1” pressure reading (main system pressure) is decreasing and wait
until the reading has dropped into the E-04 range or below. Press Close B to switch back to
the Overview screen.

O-ring
Thermocouple
A

Viewport
Sealing Surface B

Denton Discovery 18 Operation Procedure 9


4. Liquid Nitrogen Filling
Find the liquid nitrogen bucket behind the system. Place the bucket in the center of the white
plate to protect flooring. Put on the face shield. Put the nozzle into the bucket and open the
valve completely to fill the bucket with LN2, then close the valve and take off the face shield.
Keep the lid closed during transfer to prevent accidental spills. Rotate the lid to open position
and slowly pour the bucket of LN2 into the funnel at the back of the system.
Start your timer for LN2 refill and continue to pour a bucketful of LN2 every 45 minutes
(starting after you first begin to fill with LN2, NOT 45 minutes after you start your deposition).

Liquid Nitrogen
Valve & Nozzle Funnel
Properly
Closed Lid

Liquid Nitrogen
Bucket Open
Position

Denton Discovery 18 Operation Procedure 10


5. Switching to Manual Mode
Wait until FR1 pressure is in the E-04Torr range or below.
Press Manual A to switch into “Manual” mode.
NOTE: Do not switch to “Manual” mode while the chamber is in “Auto pump” mode.
Always wait until the system pressure has reached high vacuum. Look at the FR1 to
verify that the chamber pressure is in the E-04 Torr range or below before you switch to
“Manual” mode. Switching from “Auto” to “Manual” stops all auto processes, including
pumping down the chamber.

FR1

Denton Discovery 18 Operation Procedure 11


6. Setting Stage Rotation & Temperature
1) Press Rotation and Heat Control A to switch to the Rotation & Heat Control screen.
2) Press Rotation Speed B to change the rotation speed set point; enter the desired value (0-
100% of maximum; 65% is recommended).
3) (optional) Press Heat Setpoint C to change the heat set point to the desired value and
entering the value (adjust temperature gradually to reach the desired set point to avoid
excessive overshoot and slow recovery). Heat is only allowed in the system at night.
4) Press Close D to switch back to the system Overview screen. You can check the stage
Rotation Speed on the system Overview Screen.

B C

Rotation
Speed D
Denton Discovery 18 Operation Procedure 12
7. Setting Gas Flow Rates (Sputter Pressure)
Adjust the gas flow rates to get the desired process pressure.
1) Press Gas Control A to switch to the Gas Control screen.
2) Turn the Gas #1 Power ON B for Ar. Change the gas flow rate set points to desired
levels by pressing Gas #1 Setpoint C and entering the value. Watch the Sputter
Pressure when changing values and increase the gas flow until you reach your desired
process pressure. Gas #2 power cannot be turned on in isolation. If you need Gas #2
only, you need to also turn on the power for Gas #1 (with a set point of 0).
3) Turn Gas #1 Power OFF B. Press Close D to switch back to the system Overview screen.
You can check the gas flow setpoint on Gas 1 or 2 SP on the system Overview Screen.

A Sputter
Pressure

Gas Flow
Setpoint D

Denton Discovery 18 Operation Procedure 13


8. Setting Sample Stage RF Bias (optional)
You can use the sample stage RF bias to clean the samples prior to deposition and/or during
sputter deposition to achieve a particular microstructure.
1) On the system Overview screen, press the RF Bias Control A to switch to the RF Bias/Etch
screen.
2) Press RF Supply Setpoint B; set the RF power to the desired value.
3) Turn Rotation Power ON C.
4) Turn Gas 1 ON D (Ar). Wait for Sputter Pressure to stabilize at your desired value, usually
same as your deposition pressure.

B C
A

Sputter
Pressure

Denton Discovery 18 Operation Procedure 14


8. Setting Sample Stage RF Bias (optional)
5) To turn on the plasma for RF Bias/Etch, turn the RF Supply Power ON F, start your timer,
and look through the viewport to see if the plasma has turned on.
6) If the plasma is not on, turn the RF Supply Power OFF F. Close Hi-Vac Valve E while
monitoring the Sputter Pressure, wait for it to rise above 10 mTorr, then quickly turn the
RF Supply Power ON F, and check through the viewport for plasma. After plasma lights,
immediately open Hi-Vac Valve E. The Sputter Pressure will decrease and settle at a value
determined by the gas flow rates. Verify that the plasma stays lit once the pressure has
stabilized. Do not let the Sputter Pressure reading go above 99 mTorr.
7) If the pressure approaches 99 mTorr and
there is still no plasma, open the Hi-Vac
Valve and repeat step 6). Contact NANO3
staff if the plasma does not light after
E repeated attempts.

F 8) After the pre-deposition sample cleaning


D is complete, turn the RF Supply Power
OFF F.
9) Turn Gas 1 OFF D.
Sputter 9) Press Close G to switch back to the
G Pressure system Overview screen.

Denton Discovery 18 Operation Procedure 15


9. DC Sputtering (Cathode #2 or #3)
1) Wait until all the interlock indicator lights on the Overview screen have turned green.
2) Press DC1 Sputter Control A to display the DC Sputter Control screen.
3) Press Cathode Select B to choose cathode (#2 or #3) for the desired metal.
4) Press DC Supply Setpoint C; set the DC power to the desired value. The maximum
permitted power setting is 400W for all targets, except for Au (300W).
5) Turn Rotation Power ON D to turn on the stage rotation.
6) Turn Gas 1 ON E (Ar). Check if Sputter Pressure is stabilized at desired value (2-2.5 mTorr).

A
C E

D
Interlock
Indicator Sputter
Lights Pressure

Denton Discovery 18 Operation Procedure 16


9. DC Sputtering (Cathode #2 or #3)
7) Press Power F to light the plasma. Look through the viewport to verify that the
plasma has lighted on your desired cathode. If the plasma does not light, rapidly open
and close the shutter to help plasma ignition, and check again.
8) Pre-sputter. Wait 10-30 seconds depending on the sputtering rate with the shutter
closed (this helps to clean possible surface contaminants from the target). The pre-
sputter time should be equivalent to time spent depositing 3-5 nm of material.
9) Press Shutter Cathode #2 G or Shutter Cathode #3 G (depending on which cathode
you use) to open the shutter. Start your deposition timer.
10) Use the viewport to verify that
the correct shutter is opened.
If not, close the shutter and try
again after 1-2 minutes. Also
verify that the plasma is still
on after opening the shutter,
and that the rotation is on. F
11) Continue to check the plasma
from time to time during the G
deposition.
G

Denton Discovery 18 Operation Procedure 17


9. DC Sputtering (Cathode #2 or #3)
12) Leave the shutter open for the desired time, then close the shutter by pressing
Shutter Cathode #2 G or Shutter Cathode #3 G.
13) Turn the DC Power F off.
14) If you want to deposit a second metal layer, leave the rotation and gas flow on.
Choose the other cathode using Cathode Select B, and set the desired power using
DC Supply Setpoint C, then repeat from step 7).
15) If it is the end of the process, turn Gas 1 OFF E, and turn Rotation Power D off.
16) Press Close H to return to the system Overview screen.

C E

B
F
D
G

G
H

Denton Discovery 18 Operation Procedure 18


10. RF Sputtering (Cathode #1)
1) Wait until all the interlock indicator lights on the Overview screen have turned green.
2) Press RF1 Sputter Control A to display the RF1 Sputter Control screen.
3) Press RF Supply Setpoint B; set the RF power to 100 W. Do NOT set a value > 100 W.
4) Turn Gas 1 ON C (Ar). Check if Sputter Pressure is stabilized at desired value (4-5 mTorr).
5) Turn Rotation Power ON D to turn on the stage rotation.
6) Close the Hi-Vac Valve E, wait for the Sputter Pressure to increase above 10 mTorr, then
turn on the Cathode #1 Power F. Do NOT allow Sputter Pressure to rise above 99 mTorr.

A
F D E

C
B
Interlock
Indicator Sputter
Lights Pressure

Denton Discovery 18 Operation Procedure 19


10. RF Sputtering (Cathode #1)
7) Rapidly open and close Shutter G to help plasma ignition. Look through the viewport to
check if the plasma has lighted. After the plasma lights, immediately open the Hi-Vac
Valve E. The Sputter Pressure will decrease and settle at a value determined by the gas
flow rates. Verify that the plasma stays lit once the pressure has stabilized. Do NOT allow
Sputter Pressure to rise above 99 mTorr.
8) If the pressure approaches 99 mTorr and the plasma is not lit, turn off the RF Power F,
open the Hi-Vac valve E and start the plasma ignition sequence over beginning with step
6). Contact NANO3 staff if the plasma does not light after repeated attempts.
9) Using RF Supply Setpoint B, increase
the RF power by 25W every 30
seconds until you have reached the
desired power setting. All dielectric F
targets and any target sensitive to E
thermal shock require the RF power G
to be ramped up and down at a
controlled rate to avoid cracking. DO B
NOT INCREASE THE POWER FASTER,
YOU WILL DESTROY THE TARGET!
The maximum permitted power Sputter
setting for RF targets is 400W. Pressure

Denton Discovery 18 Operation Procedure 20


10. RF Sputtering (Cathode #1)
10) Pre-sputter. Wait 5-15 minutes depending on the sputtering rate with the shutter closed
(this helps to clean possible surface contaminants from the target). The pre-sputter time
should be equivalent to time spent depositing 3-5 nm of material.
11) Press Shutter G to open the shutter. Start your deposition timer.
12) Use the viewport to verify that the correct shutter is opened. If not, close the shutter and
try again after 1-2 minutes. Also verify that the plasma is still on after opening the shutter,
and that the rotation is on.
13) Continue to check the plasma from time to time during the deposition.
14) At the end of process, DO NOT DIRECTLY
TURN THE POWER OFF! Decrease the RF
Supply Setpoint B by 50W every 30 seconds
until you reach 100 Watts. DO NOT
DECREASE THE POWER FASTER, YOU WILL F
DESTROY THE TARGET! D

15) When you have reached 100W, turn off the G


Cathode #1 Power F. C
B
16) Turn Rotation Power D off, and turn Gas 1
OFF C.
17) Press Close H to return to the system
Overview screen. H
Denton Discovery 18 Operation Procedure 21
11. Venting the Chamber
1) Press Auto A in System Overview screen to switch into auto mode. The Auto button will
turn from red to green.
2) Press Auto Control B.
3) Press Auto Vent C in the Auto Control screen to fill the chamber with N2. When the
chamber door opens slightly, the venting process is complete (~ 3 minutes)
4) Check the stage temperature under Heat Temp. Deg C on the Overview screen. If
temperature is above 50°C, vent but do not open the door. Wait for the stage to cool down.

Heat Temp.
Deg C
B

Denton Discovery 18 Operation Procedure 22


12. Finishing Up
1) Remove the sample. Once temperature is less than 50°C, open the door and, using BOTH
hands, remove the sample plate (heavy) from the chamber. Put the sample plate on
polyester cleanroom cloth. Remove your sample from the sample plate and put it back.
2) Replace the glass slides inside the viewport on the chamber door. Place coated slides in
the red sharps container.
3) Clean the sealing surface; close the chamber door and clamp it shut.
4) Press Auto Pump A in the Auto Control screen.
5) The FR1 pressure reading MUST be in
the E-04 Torr range and dropping
before you leave. If high-vacuum is
not reached, vent the chamber, A
check the o-ring and sealing surface,
and then pump the chamber back
down again. If you are still unable to
pump the system to high-vacuum,
vent the chamber, then place a “DO FR1
NOT USE” sign by the system, and
contact NANO3 staff.
Finish your log book entry.

Denton Discovery 18 Operation Procedure 23

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