MICROWAVE ENGINEERING

UNIT - I
Microwave Transmission Lines - I: Introduction, Microwave Spectrum and Bands, Applications of
Microwaves. Rectangular Waveguides – Solution of Wave Equations in Rectangular Coordinates,
TE/TM mode analysis, Expressions for Fields, Characteristic Equation and Cut-off Frequencies,
Filter Characteristics, Dominant and Degenerate Modes, Sketches of TE and TM mode fields in the cross-
section, Mode Characteristics – Phase and Group Velocities, Wavelengths and Impedance Relations, Power
Transmission, Impossibility of TEM Mode. Illustrative Problems, Micro strip Lines– Introduction,
Zo Relations, Effective Dielectric Constant.

UNIT - II
Cavity Resonators– Introduction, Rectangular Cavities, Dominant Modes and Resonant Frequencies,
Q Factor and Coupling Coefficients, Illustrative Problems
Waveguide Components and Applications: Coupling Mechanisms – Probe, Loop, Aperture types.
Waveguide Discontinuities – Waveguide Windows, Tuning Screws and Posts, Matched Loads.
Waveguide Attenuators – Different Types, Resistive Card and Rotary Vane Attenuators; Waveguide Phase
Shifters – Types, Dielectric and Rotary Vane Phase Shifters, Waveguide Multiport Junctions – E plane and H
plane Tees, Magic Tee. Directional Couplers – 2 Hole, Bethe Hole types, Illustrative Problems
Ferrites– Composition and Characteristics, Faraday Rotation, Ferrite Components – Gyrator, Isolator,
Circulator.

UNIT - III
Microwave Tubes: Limitations and Losses of conventional Tubes at Microwave Frequencies, Microwave
Tubes – O Type and M Type Classifications, O-type Tubes : 2 Cavity Klystrons – Structure, Reentrant
Cavities, Velocity Modulation Process and Applegate Diagram, Bunching Process and Small Signal
Theory – Expressions for O/P Power and Efficiency. Reflex Klystrons – Structure, Velocity
Modulation and Applegate Diagram,
Mathematical Theory of Bunching, Power Output, Efficiency, Oscillating Modes and O/P
Characteristics, Illustrative Problems.
Helix TWTs: Significance, Types and Characteristics of Slow Wave Structures; Structure of TWT and
Amplification Process (qualitative treatment), Suppression of Oscillations, Gain Considerations.

UNIT - IV
M-Type Tubes:
Introduction, Cross-field Effects, Magnetrons – Different Types, Cylindrical Traveling Wave Magnetron –
Hull Cut-off and Hartree Conditions, Modes of Resonance and PI-Mode Operation, Separation of PI-Mode,
o/p characteristics, Illustrative Problems
Microwave Solid State Devices: Introduction, Classification, Applications. TEDs – Introduction, Gunn
Diodes – Principle, RWH Theory, Characteristics, Modes of Operation - Gunn Oscillation Modes,
Introduction to Avalanche Transit Time Devices.

UNIT - V
Scattering Matrix– Significance, Formulation and Properties, S Matrix Calculations for – 2 port Junctions,
E plane and H plane Tees, Magic Tee, Circulator and Isolator, Illustrative Problems.
Microwave Measurements: Description of Microwave Bench – Different Blocks and their Features, Errors
and Precautions, Microwave Power Measurement, Bolometers. Measurement of Attenuation, Frequency.
Standing Wave Measurements – Measurement of Low and High VSWR, Cavity Q, Impedance
Measurements.
 VLSI DESIGN
UNIT – I
Introduction: Introduction to IC Technology – MOS, PMOS, NMOS, CMOS & BiCMOS
Basic Electrical Properties: Basic Electrical Properties of MOS and BiCMOS Circuits: Ids- Vds relationships,
MOS transistor threshold Voltage, gm, gds, Figure of merit ωo; Pass transistor, NMOS Inverter, Various pull
ups, CMOS Inverter analysis and design, Bi-CMOS Inverters.
UNIT - II
VLSI Circuit Design Processes: VLSI Design Flow, MOS Layers, Stick Diagrams, Design Rules and Layout,
2 μm CMOS Design rules for wires, Contacts and Transistors Layout Diagrams for NMOS and CMOS
Inverters and Gates, Scaling of MOS circuits.
UNIT – III
Gate Level Design: Logic Gates and Other complex gates, Switch logic, Alternate gate circuits, Time delays,
Driving large capacitive loads, Wiring capacitance, Fan – in, Fan – out, Choice of layers.
UNIT - IV
Data Path Subsystems: Subsystem Design, Shifters, Adders, ALUs, Multipliers, Parity generators,
Comparators, Zero/One Detectors, Counters.
Array Subsystems: SRAM, DRAM, ROM, Serial Access Memories.
UNIT - V
Programmable Logic Devices: PLAs, FPGAs, CPLDs, Standard Cells, Programmable Array Logic, Design
Approach, Parameters influencing low power design.
CMOS Testing: CMOS Testing, Need for testing, Test Principles, Design Strategies for test, Chip level
Test Techniques.

COMPUTER NETWORKS
UNIT - I
Introduction to Networks: Internet, Protocols and Standards, the OSI Model, Layers in OSI Model, TCP/IP
Suite, Addressing.
Physical Layer: Multiplexing, Transmission Media, Circuit Switched Networks, Datagram Networks, and
Virtual Circuit Networks.
UNIT - II
Data Link Layer: Introduction, Checksum, Framing, Flow and Error Control, Noiseless Channels, Noisy
Channels, Random Access Controlled Access, Channelization, IEEE Standards, Ethernet, Giga-Bit Ethernet,
Wireless LANs , SONET-SDH, Frame Relay and ATM.
UNIT - III
Network Layer: Logical Addressing, Internetworking, Tunneling, Address Mapping, ICMP, IGMP,
Forwarding, Routing-Flooding, Bellman & Ford, Disjkstra’s routing protocols, RIP, OSPF, BGP,- and
Multicast Routing Protocols. Connecting Devices-Passive Hubs, Repeaters,
Active Hubs, Bridges, Routers.
UNIT - IV
Transport Layer: Process to Process Delivery, UDP, TCP and SCTP Protocols, Congestion, Congestion
Control, Quality of Service.
Application Layer: Domain Name Space, DNS in Internet, Electronic Mail, File Transfer Protocol,
WWW, HTTP, SNMP, Multi-Media.
UNIT - V
Network Security: Security services, mechanisms and attacks, IPSec, SSL, VPN, Firewall.
Bluetooth, Zigbee, IPv4, IPv6.