GF10x/11x Design Ove Erview: Nvidia Conf Fidential
GF10x/11x Design Ove Erview: Nvidia Conf Fidential
erview
2011.2.21
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Agenda
Schematic Design Overview
PCI-Express
Memory Controller Interface
Display Interface
MIO(SLI)
I2C
GPIO
Straps
Power
Others
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Schematic Design
n Overview
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PCI-Expre
ess
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PCI-Express
Ensure PEX_RST* and PEX_RE EFCLK are connected.
PEX TSTCLK OUT should be tterminated with a 200 ohm resistor
PEX_TSTCLK_OUT
and made easily accessible forr probing, default can be unstuffed.
PEX_TEMP is used for internal calibration,, pull-down
p this signal
g
with a 2.49Kohm 1% resistor.
PEX_CLK_REQ* is an open-dra ain bi-directional signal, by default
it should have a 10Kohm pull-u
up to 3.3V, This signal is an active
low signal.
F default
For d f lt and
d production,
d ti DT
PD tM d tto G
TestMode Gndd with
ith 10K
10K.
PCI-Express
Interface Power Rails
PEX_IOVDD/Q – PEX_VDD
PEX_PLLVDD – PEX_VDD
PEX_SVDD_3V3 – 3.3V
PEX PLL HVDD - 3.3V
PEX_PLL_HVDD 3 3V
PCI-Express
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PCI-Express
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M
Memory Controller
C t ll Interface
I t f
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Memory Controller Interfa
ace
To improve performance, Fermi GPUs s divide the frame buffer interface into
Channels, These channels are 32bits slices made up of 4 bytes, each channel
can be
b implemented
i l t d with
ith a single
i l 32b
bit wide
id DRAM componentt or with ith two
t
16bit wide parts.
Every channel can issue different commaands
Every channel can read/write to independ
dent addresses.
Each channel contains a fully indepenndent memory controller.
All memories within a channel share tthe same command bus and the address
bus.
The different channels in a GPU are coompletely Asynchronous to each other
O l B
Only BL88 is
i supported.
d
Support both x32 and x16 GDDR5 and d DDR3 DRAM modes of operation.
Memory Controller Interfa
ace
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Memory Controller Interfa
ace
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Memory Controller Interfa
ace
Rail Maximum Switching Time
FBVREF X=20uS
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Memory Controller Interfa
ace
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Display Intterface
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Display Interface
Digital Displays
DVI-I
HDMI
DisplayPort
Analog Displays
DAC A
DAC B
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Display Interface
Digital Display
DVI is only supported on Links AA,B,E and F, Dual-Links DVI is supported
on links A/B and E/F.
For I2C/DDC lines, because the IFFPx_AUX_I2Cx lines are not 5V tolerance,
a Level Shifter must be used to s
support I2C.DDC.
For unused IFP Marco,, pull-down
p n IFPxyIOVDD
y and IFPxy
y_PLLVDD with a
10Kohm resistor, the other IO pin
ns can be left not connected (NC).
gital Display Link IFPA(LinkA) IFPB(LinkB) IFPC(L
LinkC) IFPD(LinkD) IFPE(LinkE) IFPF(LinkF)
DVI √ (Dual
(D l Link
Li k with
ith IFPB)√ (Dual Link
(D l Li k with
ith IFPA) x x √(Dual
√(D l Link ith IFPF) √ (Dual
Li k with (D l Link
Li k with
ith
HDMI √ x √ √ √ x
Mini-HDMI √ x √ √ √ x
Display Port x x √ √ √ x
Mini-DP x x √ √ √ x
Display Interface
DVI connection at IFPAB
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Display Interface
HDMI at IFPx
AC Coupling Caps
499 ohm PD
I2C 3V3 to 5V LevelShift
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Display Interface - Display
yPort
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Display Interface - Display
yPort
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Display Interface
Analog Displays
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Display Interface
Analog Display
The D12x GPUs feature two RGB DACss that support legacy connectors. The two
DACs are named DAC A and DAC B B. There is no Macrovision support in this
family GPUs
GPUs.
DAC VREF requires 0.1uF decoupling ccapacitor.
DAC Analog RGB M
Microvision
DAC A
DAC A S
Supported
t d N t
Not supported
t d
DAC B Supported N
Not supported
Display Interface
Use a 37.5 Ω ± 2% trace impedance between the GPU and the first 150 Ω resistor (R1) if the trace length is
not short.
short The trace length should not exceed 6 600 mil
mil. Next,
Next use a 50Ω ± 2% trace impedance between the
resistor R1 and the resistor R2. The trace lengtth should not exceed 6000 mil.
Place the filter after the second termination res
sistor, R2. The trace length should not exceed120 mil and
have an impedance of 50 Ω.
The trace length (75 Ω trace) between the filter and the connector should not exceed 600 mil.
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Display Interface
Analog Display
If the DAC interface is not requ uired, it should be disabled by:
Adding a pull-down
pull down to the D
DACx VDD with a 10 kΩ resistor to
DACx_VDD
GND.
Unused DDC clock and data signals g should be connected to a
5 V pull-up.
All other I/O pins (including
g DACx_VREF and DACx_RSET)
can be left unconnected (N NC)
MULTI-USE I/O (M
MIO) AND SLI
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MULTI-USE I/O (MIO) AND
D SLI
MIO(SLI)
( )
Unconnected Signals(NC)
For unused MIOS interfaces
interfaces, MIOx
MIOx__VDDQ
VDDQ must be powered with 3.3V
3 3V for
compatible designs (For GF104, mu ust connect to 3V3 even it’s no use) or pulled
down to GND.
For each unused MIO interface thatt is powered by 3.3V, provide one 0.1uF
capacitor. For MIO interfaces that h
have MIOx_VDDQ that are pulled down to
p
GND that capacitor is not needed.
MIOxCLKIN signals should have 10K Kohm pull-down resistors.
I2C
C
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I2C
I2C Specification
Parameter Specificatioin Notes
A two‐write(SCL and SDA) I/OO BUS for
i ll hi chip
miscellaneous chip to c hi
Overview communication
Standard Mode: Up to 10 00KHz
p g q y
Operating Frequency Fast Mode: 400KHz
Single‐ended
Topology Bi‐directional
2.2Kohm pull‐up resistor onn I2C CLK
Termination and DATA
and DATA
Max Capacitive Load for Standard mode: 400p
pF
BUS Line(CL) Fast Mode: 100pF
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I2C
I2C Availability
BUS ID Signal Name Type Application Associated Display Link Voltage Tolerance
I2CA_SDA
A I2CA_SCL Bus Master DDC DAC A‐CRT 5V
I2CB SDA
I2CB_SDA
B I2CB_SCL Bus Master DDC DAC B‐CRT 5V
I2CC_SDA DDC and External
C I2CC_SCL Bus Master Devices IFPA, IFPB‐LVDS 5V
I2CS SDA
I2CS_SDA
S I2CS_SCL Slave Inteernal Thermal Sensor 5V
IFPC_AUX_I2CW_SDA_N,
W IFPC_AUX_I2CW_SCL Bus Master AUX/DDC IFPC 3.3V
IFPC_AUX_I2CX_SDA_N,
X IFPC_AUX_I2CX_SCL Bus Master AUX/DDC IFPD 3.3V
IFPC_AUX_I2CY_SDA_N,
Y IFPC AUX I2CY SCL
IFPC_AUX_I2CY_SCL Bus Master
Bus Master AUX/DDC IFPE 3.3V
IFPC_AUX_I2CZ_SDA_N,
Z IFPC_AUX_I2CZ_SCL Bus Master AUX/DDC IFPF 3.3V
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I2C
Please don’t
don t connect SMBus to
o I2C unless the PU in SMBus is
not from standby power.
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GENERAL PURPO
OSE I/O (GPIO)
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GENERAL PURPOSE I/O (GPIO)
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GENERAL PURPOSE I/O (GPIO)
Pin description
GPIOx Pin Function I/O Type Description
GPIO[0] HPD‐AB Input Hot‐Plug Detect for Link A/B
GPIO[1] HPD‐C Input Hot‐Plug Detect for Link C
GPIO[2] GPU_VID[2] Output GPU Voltage Control
GPIO[3] RASTER SYNC A
RASTER_SYNC_A Input/Output
Input/Output SLI Control
SLI Control
GPIO[4] FAN_TACH Input Fan Tachometer
GPIO[5] GPU_VID[3] Output GPU Voltage Control
GPIO[6] GPU_VID[4] Output GPU Voltage Control
GPIO[7] GPU_VID[5] Output GPU Voltage Control
GPIO[8] THERM_OVERT Input Thermal Shutdown
GPIO[9] THERM ALERT
THERM_ALERT Inp t
Input Thermal Slo do n
Thermal Slowdown
GPIO[10] MEM_VREF Output Memory VREF Control Switch
GPIO[11] RASTER_SYNC _B Input/Output SLI Control
GPIO[12] NVVDD_PSI Output NVVDD Phase Shed Control
GPIO[13] NVRESERVED_0 Input/Output Reserved for NVIDIA Use
GPIO[14] NVRESERVED_1 Input/Output Reserved for NVIDIA Use
GPIO[15] HPD‐E Input Hot‐Plug Detect for Link E
GPIO[16] FAN_PWM Output Programmable Fan Control
GPIO[17] GPU_VID[1] Output GPU Voltage Control
GPIO[18] GENERAL_PURPOSE_0 Input/Output Reserved for Customer Use
GPIO[19] HPD‐D Input Hot‐Plug Detect for Link D
GPIO[20] GENERAL_PURPOSE_1 Input/Output Reserved for Customer Use
GPIO[21] HPD‐F Input Hot‐Plug Detect for Link F
GPIO[22] SWAP_READY Input/Output SLI Control
GPIO[23] MEM_VDD_CTL Output Memory Voltage Switch
GPIO[24] FAN_SELECT Output Fan Control Source Select
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GENERAL PURPOSE I/O (GPIO)
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GENERAL PURPOSE I/O (GPIO)
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Strap
ps
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Straps
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Straps
Multi-Level
Multi Level Straps
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Straps
Sub_Vendor, 0 : no VBIOS, 1 : VBIOS rom is present (default)
RAMCFG, memory strapping table
XCLK_417, Internal PCI-E Clock, 0 : 27 77MHz (default)
FB_0_BAR_Size, SysFB aperture size e used by GPU, 0 : 256MB (default)
PCI DEVID determine DID bit [4:0]
PCI_DEVID,
User Straps, It’s use for panel selectio
on
3GIO_PADCFG, determine the PCI-E s signal swing, 0 : default (high swing)
PEX_PLL_EN_Term, used to set PCI-E E PLL Term, 1 : Enable, 0 : Disable
(default)
SLOT CLK CFG 1 : GPU & MCH sharre a common PCI-E reference clock
SLOT_CLK_CFG, clock.
SMBus_ALT_Addr, 0 : 0x9E (default), 1 : 0x9C (Multi-GPU)
VGA_Device, 0 : 3D device , 1 : VGA d device (default)
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Powe
er
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Power
MVS ((Multi-Voltage
g Set Point))
Must be compatible with VRM11.
NVVDD Voltage Switching Requireme
ent
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Power
Power Sequencing
Power Up/Down States
This section discusses power se
equencing considerations. The following
power sequencing rules must bee satisfied at all times:
Cold boot
Resuming g from a suspend
p state
Entering a suspend state
Power off
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Power
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Power
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Power
Note
3V3 includes all rails that uses 3.3V (DAC
CVDD, IFPVDD, MIO, etc…)
PEXVDD includes all rails that share it (P
PLLs, etc.)
FBVDD and FBVDDQ can be combined
From IOSI perspective, the GPU has no s sequencing requirements. So these are only
recommendations for notebook GPU des signs Although deviations from this should be
signs.
documented and approved.
NVVDD -> FBVDD/Q: was historically required due to an issue with IO glitch during startup
that caused some memories to go into Te estMode. But should be Optional today
PEXVDD: There are concerns from GT21x x that PEXVDD must follow NVVDD due to issue
with state machine init in the PEX block oon GT21x. It's unknown if GF1xx will have this
issue.
IFP_IOVDD follows NVVDD for IFPABIOV VDD only in the cases of LVDS, we have seen in
notebook designs that IFPABIOVDD would glitch of it ramped before NVVDD, to avoid this
glitch we thus have to ramp IFPABIOVDD D after NVVDD.
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Otherrs
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Others
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Others
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Thanks & Qu
uestion
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