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MME365 Glass and Ceramics Engineering: Bonding in Ceramic Materials

This document discusses the different types of bonds found in ceramic materials: metallic, ionic, covalent, and van der Waals. Metallic bonding occurs through the attraction of positively charged metal ions to delocalized electrons. Ionic bonding involves the complete transfer of electrons from one atom to another. Covalent bonding shares electrons between atoms of similar electronegativity. Van der Waals bonds are the weakest secondary bonds formed through molecular polarization, dispersion forces, or hydrogen bonding between molecules. The type of bonding determines many properties of ceramic materials like structure, strength, and conductivity.

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23 views

MME365 Glass and Ceramics Engineering: Bonding in Ceramic Materials

This document discusses the different types of bonds found in ceramic materials: metallic, ionic, covalent, and van der Waals. Metallic bonding occurs through the attraction of positively charged metal ions to delocalized electrons. Ionic bonding involves the complete transfer of electrons from one atom to another. Covalent bonding shares electrons between atoms of similar electronegativity. Van der Waals bonds are the weakest secondary bonds formed through molecular polarization, dispersion forces, or hydrogen bonding between molecules. The type of bonding determines many properties of ceramic materials like structure, strength, and conductivity.

Uploaded by

Zahir Rayhan Jhon
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© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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MME365 Glass and Ceramics

Engineering

Lecture 02
Bonding in Ceramic Materials
Introduction
• The outermost or valence electrons are responsible for most of the
energy relationships which produce atomic bonding in molecules,
liquids, or solids.
• The elements He, Ne, Ar, Kr, Xe, and Rn have full outer electron
shells and thus are very stable and do not easily form bonds with
other elements.
• Elements with unfilled electron shells are not as stable and interact
with other atoms to achieve stable full outer shells.
Four general categories of bonds are encountered:

1. Metallic
2. Ionic Primary bonds (Energy  100 kcal/mol)
3. Covalent
4 van der Waals Secondary bond (Energy < 10 kcal/mol)
Bond Categories

(a) Metallic. Positive ‘ions’ are held together by ‘free’ electrons.


(b) Ionic. Positive and negative ions are held together by coulombic
attraction.
(c) Covalent. Electrons are shared with electron pairs between two
positive ions.
(d) van der Waals. Centres of positive and negative charges are not
coincident. Therefore an apparent coulombic attraction exists.
Metallic Bonding
• The predominant bond mechanism for metals.
• The mutual attraction of the nuclei of the cloud of shared electrons
results in the metallic bond (also known as electronic bonding)
• Formation of close-packed structures with many slip planes, resulting high
ductility.
• The free movement of electrons through the structure produces high
electrical conductivity high thermal conductivity.
Metallic Bonding _ Cont.
• Elements to the left and in the interior of the periodic table have metallic
bonding.
- Alkali metals (Na, K)
– bonded by outer s-electrons and have low bond energy.
– have low strength and low melting temperatures and are not very stable.
- Transition metals (Cr, Fe, W)
– bonded by inner electrons and have much higher bond strengths.
– have higher strength and higher melting temperatures and are more
stable.
Ionic Bonding
• Ionic bonding occurs when one atom gives up one or more electrons and
another atom or atoms accept these electrons such that electrical
neutrality is maintained and each atom achieves a stable, filled electron
shell. This is best illustrated by a few examples.
Example 1. Sodium chloride (NaCl) is largely ionically bonded.
Ionic Bonding _ Cont.
Characteristic of ionic bonding
1. There is an electron donor plus an electron acceptor to achieve electrical
neutrality.
2. Structure is determined by atom (ion) size and charge with a tendency to
achieve as close packing as sizes will permit.
3. Bonding is non-directional.
4. Materials are transparent to visible wavelengths of light.
5. Absorb infrared wavelengths.
6. There is low electrical conductivity at low temperature.
7. There is ionic conductivity at high temperature.
8. Metal ions with group VII anions are strongly ionic (NaCl, LiF).
9. Compounds with higher-atomic-weight elements of group VI (S, Se, Te) are
increasingly less ionic.
10.Strength of ionic bonds increases as charge increases; many oxides
composed of multiple-charged ions are hard and melt at high tem-
peratures (Al2O3, ZrO2, Y2O3).
Covalent Bonding
When two elements forming a bond have similar electronegativities,
they will tend to share the electrons between them to achieve a
stable, filled electron shell and will form covalent bonds.

Methane
with
single-
molecule
structure.

Diamond
with
periodic
three-
dimensional
structure.
What is the ionic characteristics of MgO, SiO2 and SiC?
EMg -EO= Fraction ionic= Fraction Covalent=1- Fraction ionic=

ESi -EO= Fraction ionic= Fraction Covalent=1- Fraction ionic=

ESi -EC= Fraction ionic= Fraction Covalent=1- Fraction ionic=


Covalent Bonding _ Cont.
Characteristic of Covalent Bonding

1. Electrons are shared to fill outer electron shells and achieve


electrical neutrality.
2. Atoms having similar electronegativity from bonds.
3. Bonding is highly directional.
4. Structures are not close packed, but typically three-
dimensional frame-works contain cavities and channels.
5. Compounds typically have high strength, hardness, and
melting temperature.
6. Structures often have low thermal expansion.
van der Waals Bonds
Weaker secondary bond - major effects on the properties of
some ceramic materials.
•Dispersion. Interaction of these fluctuating dipoles between
molecules leads to very weak forces of attraction.
•Molecular polarization. An electrical dipole forms in
asymmetrical molecules.
•Hydrogen bridge or hydrogen bonding. Small hydrogen
nucleus is attracted to the unshared electrons in a
neighbouring molecule.
van der Waals Bonds _Cont.

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