Scribd Logo
Upload

Welcome to Scribd!

  • 253 views

    Electronic Packaging

    Uploaded by

    Adelle Lyn Carlos
    1. The document provides an overview of electronic packaging, including defining electronic packaging, outlining the packaging technology and assembly flow process, and discussing materials used. 2. The assembly flow process involves wafer preparation, dicing, die attach, wire bonding, moulding/encapsulation, solder plating, marking, and lead trimming/forming. 3. Key materials used in electronic packaging include semiconductors, metals, ceramics, polymers, and glasses.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd

    Electronic Packaging

    Uploaded by

    Adelle Lyn Carlos
    253 views54 pages
    1. The document provides an overview of electronic packaging, including defining electronic packaging, outlining the packaging technology and assembly flow process, and discussing materials used. 2. The assembly flow process involves wafer preparation, dicing, die attach, wire bonding, moulding/encapsulation, solder plating, marking, and lead trimming/forming. 3. Key materials used in electronic packaging include semiconductors, metals, ceramics, polymers, and glasses.

    Original Description:

    Analog IC Design Subject

    Copyright

    © © All Rights Reserved

    Available Formats

    PDF, TXT or read online from Scribd

    Did you find this document useful?

    Is this content inappropriate?

    1. The document provides an overview of electronic packaging, including defining electronic packaging, outlining the packaging technology and assembly flow process, and discussing materials used. 2. The assembly flow process involves wafer preparation, dicing, die attach, wire bonding, moulding/encapsulation, solder plating, marking, and lead trimming/forming. 3. Key materials used in electronic packaging include semiconductors, metals, ceramics, polymers, and glasses.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    253 views54 pages

    Electronic Packaging

    Uploaded by

    Adelle Lyn Carlos
    1. The document provides an overview of electronic packaging, including defining electronic packaging, outlining the packaging technology and assembly flow process, and discussing materials used. 2. The assembly flow process involves wafer preparation, dicing, die attach, wire bonding, moulding/encapsulation, solder plating, marking, and lead trimming/forming. 3. Key materials used in electronic packaging include semiconductors, metals, ceramics, polymers, and glasses.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    of 54

    PDT 264

    ELECTRONIC MATERIALS

    Overview on IC Packaging
    Dr. Khor Chu Yee
    Office: S4-L2-64-30
    Email: [email protected]
    H/P: 019-5637283

    1
    Chapter Objectives
    •To define the electronic packaging.
    •To overview the packaging technology
    and assembly flow process.

    2
    What is electronic packaging?
    Electronic Packaging:
    Define as an electronic structure that serves to protect an
    electronic/electrical element from its environment and the environment
    from electronic/ electrical element.
    or
    Housing and interconnection of integrated circuits to
    form electronic systems. Method of closing, protecting or providing
    physical structure to either electronic components, assemblies of
    components or finished electronic devices

    3
    Functions of electronic packaging
    Electronic packaging must provide:
    - Signal distribution

    - Heat dissipation

    - Power distribution

    - Circuit protection

    4
    Signal distribution Power distribution

    Heat dissipation (cooling) Protection (mechanical,


    chemical, electromagnetic)

    5
    IC PACKAGING
    TECHNOLOGY

    6
    7
    Electronic Packaging Technology Trends

    8
    1. Through-hole Mounting

    Pins of the
    components go
    through the
    drilled printed
    circuit board
    (PCB) holes

    Note:
    DIP: dual in-line package

    9
    Printed circuit board

    10
    Application of Through-hole Mounting
    Blank PCB

    Calculator PCB

    Radio/Television

    11
    Application of Through-hole Mounting

    12
    2. Surface-Mount Technology (SMT)

    The pins of the


    devices are
    mounted directly
    onto the surface
    of the PCB

    Note:
    PLCC: Plastic leaded chip carrier
    BGA: Ball Grid Array
    SOIC: Small Outline Integrated Circuit

    13
    Surface Mount Capacitor
    Surface Mount Device

    Through-hole Resistor

    Surface Mount Resistor


    14
    Application of Surface Mount Technology

    USB Thumb drive/ Pen drive

    15
    LED Television PCB
    3. Chip Scale Packages (CSP)

    CSP is single-die, direct surface mountable package


    Is an evolution of surface mount device (SMD)
    CSP come in many forms –flip chip, wire-bonded, ball
    grid array, leaded, etc.
    16
    Wire-bonded

    Reduce in IC package size

    Flip chip

    17
    Note: 1 mil = 0.0254 mm
    Note:
    DIP: Dual-in-line package
    TSOP: Thin Small Outline Package
    WLP: Wafer level package

    18
    Recent IC Packaging Technology – 3D IC with TSV

    *Wire bonding *Through Silicon Via


    *Flip chip bump: *Micro bump:
    Diameter: ~100 μ meter Diameter: ~10 μ meter
    Pitch: ~100 μ meter Pitch: ~10 μ meter
    19
    Things you should know !

    PCB
    Solder Bump / Solder Ball

    20
    Wire Bonding VS Through Silicon Via

    Wire Bonding Through Silicon Via

    Samsung 16 Gb memory21
    ASSEMBLY PROCESS
    FLOW

    22
    23
    Wafer ?

    Silicon Wafer
    A wafer, also called a slice or
    substrate, is a thin slice of
    semiconductor material, such as a
    crystalline silicon, used in electronics
    for the fabrication of integrated
    circuits.
    24
    1. Wafer Preparation

    Silicon wafer are


    mounted on a
    laminating tape that
    adheres to the back of
    the wafer
    The laminating tape
    holds the wafer
    throughout the dicing
    and the die attaching
    process
    Silicon Wafer
    25
    26
    2. Dicing

    Die-sawing machine using a


    diamond saw blade cuts
    the wafer into individual
    die/pellet
    CO2 gas bubbles are
    dispensed on the wafer to
    remove silicon dust/debris
    & lubricating and cooling
    down the blade

    27
    28
    3. Die Attach
    The die attach
    machine will pick up
    the die and deposit it
    on the lead frame.
    It may utilize the
    wafer mapping
    method to pick up
    only good die.

    29
    30
    4. Wire Bonding
    Either Au or Al wires are
    used depending on
    application.
    Bonded one at a time, the
    wire is fed through a
    ceramic capillary.
    With a good combination
    of temperature and
    ultrasonic energy, a good
    metalized wire bond is
    formed

    31
    Wire-bonding

    Bonding
    pad

    Gold or
    aluminum
    or copper
    wire

    IC chip

    32
    33
    5. Moulding
    The moulding process
    aims to encapsulate
    the whole wire bonded
    die against exposure to
    contamination and
    other physical
    damages.
    The lead frames that
    hold the dies are
    placed in individual
    cavities which are filled
    with liquid resin.

    34
    35
    6. Solder Plating
    This step provides a
    layer of Tin Lead solder
    on the lead frame for
    making easier the PCB
    assembly process.
    Lead free finishing with
    Tin Bismuth plating or
    Tin Copper dipping can
    also be used.

    36
    7. Marking

    Marking is the coding process that writes customer's


    corporate and product identification code on a
    packaged device.
    It commonly uses a laser-based machine
    37
    38
    8. Lead Trim/ Form

    The final process is to


    trim away the leads of the
    packaged device from the
    frame strip.
    The leads are cut and
    formed mechanically to
    the specified shape

    39
    40
    MATERIALS USED IN
    ELECTRONIC
    PACKAGING

    41
    42
    43
    44
    45
    46
    Leaded VS Lead-Free Solder

    Leaded Solder: Lead-Free Solder:


    -Tin-lead (Sn63Pb37) -Tin-Silver-Copper
    -melting point ~183 °C (SnAgCu)
    -shiny & smooth surface -melting range of 217–
    220˚C
    -slightly grainy surface
    Others: SnCu

    47
    48
    49
    50
    Why do polymers is the main materials
    in IC packaging?

    wide range of material families


    many recipes inside same material family
    large processing choice
    wide range of end product properties
    possibilities of customization
    cheap materials for common applications

    51
    CHARACTERISTIC OF
    A PACKAGE

    52
    53
    Chapter Review
    • Electronic Packaging - an electronic structure that serves to protect
    an electronic/electrical element from hazardous environments, such
    as moisture, mechanical vibration, thermal loading, electrostatic
    discharge and chemical corrosion.
    • Overview the packaging technology and assembly flow process:
    (1) Wafer preparation
    (2) Dicing
    (3) Die Attach
    (4) Wire Bonding
    (5) Moulding / IC Encapsulation
    (6) Solder Plating
    (7) Marking, and
    (8) Lead trimming/forming
    • Materials used in Electronic Packaging (1) Semiconductors, (2)
    Metals, (3) Ceramics, (4) Polymers and (5) Glasses

    54

    You might also like